Special-shaped aluminum VC vapor chamber, efficient heating and cooling mechanism, device comprising special-shaped aluminum VC vapor chamber and preparation method of special-shaped aluminum VC vapor chamber

Abstract

The invention discloses a special-shaped aluminum VC uniform-temperature plate, an efficient heating and cooling mechanism, a device comprising the same and a preparation method of the special-shaped aluminum VC uniform-temperature plate. The efficient heating and cooling mechanism is used for heating or cooling a to-be-treated object with at least partial area having a columnar shape, and comprises a TEC semiconductor wafer and an aluminum VC uniform-temperature plate; the aluminum VC vapor chamber is provided with a first plate area in contact with the TEC semiconductor chip and further comprises a second plate area which is not coplanar with the first plate area and integrally connected with the first plate area, the first plate area can conduct heat on at least partial area of the first surface of the object to be processed, and the second plate area can conduct heat on at least partial area of the second surface of the object to be processed. The first plate area and the second plate area jointly form an accommodating space for accommodating an object to be treated, and at least partial area of the second plate area is parallel to the axis direction of the object to be treated. The aluminum VC vapor chamber capable of being in contact with the first surface and the second surface of the to-be-treated object at the same time is utilized, and the effect of efficient heat conduction of the to-be-treated object in the axial direction is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchange, and particularly relates to a special-shaped aluminum VC heat pipe, an efficient temperature raising and lowering mechanism, a device comprising the same, and a preparation method thereof. Background Art

[0002] For some products or devices that need to frequently switch between heating and cooling modes, a TEC semiconductor chip is usually used as a cold / heat source. Because it can achieve refrigeration or heating effects respectively only by simply adjusting the input direction of the current of the TEC semiconductor chip.

[0003] Currently, when using a TEC semiconductor chip to heat or cool an object to be processed (such as a columnar, barrel-shaped or bottle-shaped object) having a certain length in the axial direction, in order to ensure more efficient heat conduction efficiency, it is necessary to set up a more efficient heat conduction element to transfer the cold energy or heat energy of the TEC semiconductor chip to the object to be processed.

[0004] Aluminum VC heat pipes are widely used in working environments with high requirements for heat transfer efficiency due to their good thermal conductivity. Inside the aluminum VC heat pipe, a number of capillary cores are arranged in a staggered manner (or in a mesh shape) along the transverse and longitudinal directions of the plate body. A working liquid (such as pure water) that can undergo a phase change according to temperature is arranged in the capillary core. The working liquid changes between the vapor phase and the liquid phase according to the temperature difference between both sides of the aluminum VC heat pipe and circulates continuously in the capillary core, thereby achieving rapid heat transfer. Due to the complex capillary core structure inside the aluminum VC heat pipe, in practice, the aluminum VC heat pipe mostly has a flat plate-like outer shape when in use.

[0005] Therefore, when using an aluminum VC heat pipe as a heat conduction workpiece for a TEC semiconductor chip, since it needs to contact both the TEC semiconductor chip and the object to be processed. Therefore, the aluminum VC heat pipe is mostly arranged on the single-side surface of the object to be processed. However, when the object to be processed has a large size in the axial direction, if heat transfer can only be carried out on the single-side surface of the object to be processed, the heat transfer efficiency will be greatly reduced. Summary of the Invention

[0006] To solve the above technical problems, the present invention provides a special-shaped aluminum VC heat pipe, which has a first plate area and a second plate area that is non-coplanar with and integrally connected to the first plate area. The first plate area is used to conduct heat to at least part of the first surface of the object to be processed, and the second plate area is used to conduct heat to at least part of the second surface of the object to be processed. The first plate area and the second plate area together form a receiving space for accommodating the object to be processed, and at least part of the second plate area is parallel to the axis direction of the object to be processed. The aluminum VC heat pipe of the present invention breaks the structure form of the existing aluminum VC heat pipe being a flat plate, and conducts heat to the two surfaces of the object to be processed through an aluminum VC heat pipe with a coherent and complete structure, without the need to set up separate heat conduction elements, thus ensuring that the original heat conduction performance of the aluminum VC heat pipe is not affected, and having the effect of conducting heat to an object with a relatively large size in the height direction.

[0007] Further, the number of the second plate areas is two, and they are oppositely arranged at both ends of the first plate area. The two second plate areas and the first plate area are formed by bending a single aluminum VC heat pipe. Therefore, by setting two second plate areas that can conduct heat to the second surface of the object to be processed in part of the area, a better heat conduction effect can be formed in the length direction of the second surface of the object to be processed. Compared with the traditional method of only heating or cooling on one side surface of the object to be processed, the heat conduction efficiency is greatly improved. Moreover, the two oppositely arranged second plate areas can limit the position of the object to be processed, and thus can match different heat conduction application scenarios of the object to be processed.

[0008] Furthermore, a transition surface protruding outward in a direction away from the object to be processed is formed at the connection between the first plate area and the second plate area. Therefore, by setting the transition surface, the original internal structure of the aluminum VC heat pipe will not be damaged, and its heat conduction performance will not be negatively affected.

[0009] Furthermore, the aluminum VC heat pipe is in a U shape. The aluminum VC heat pipe with this structure is to ensure that the internal structure of the aluminum VC heat pipe is not damaged and its heat conduction efficiency is not affected; however, there is no need to additionally set other heat conduction elements, which maximally reduces the energy loss during the heat conduction process.

[0010] The present invention also provides an efficient temperature rising and falling mechanism for heating or cooling an object to be processed with a columnar outer shape in at least part of the area, including a TEC semiconductor chip and the aforementioned aluminum VC heat pipe, and the first plate area of the aluminum VC heat pipe is in contact with the TEC semiconductor chip.

[0011] The present invention has the following beneficial effects: ①Utilize the function of rapid temperature conduction of the aluminum VC heat pipe, and set it in a structural form with a non-coplanar first plate area and second plate area, breaking the structural form in existing similar products where only one aluminum VC heat conduction plate body is provided on one side of the bottom or top of the object to be processed, greatly improving the heat conduction efficiency when heating or cooling the object to be processed.

[0012] ②In this application, an aluminum VC heat pipe with a complete and coherent structure extends from the first surface to the second surface of the object to be processed, and at least part of the second plate area is parallel to the axis direction of the object to be processed. Therefore, without additionally setting an intermediate structure connecting the aluminum VC heat pipe and the TEC semiconductor chip, heat transfer can be achieved between the first surface and the second surface of the object to be processed, and the effect of efficient heat conduction along the axial direction of the object to be processed can be realized, minimizing energy loss during the transfer process to the greatest extent.

[0013] ③The aluminum VC heat pipe of this application has a shape for conducting heat between the first surface and the second surface of the object to be processed. Only by using the aluminum VC heat pipe that can conduct heat with both the first surface and the second surface of the object to be processed, the original complete structure of the aluminum VC heat pipe is not damaged, and its heat conduction performance is not affected.

[0014] Furthermore, the aluminum VC heat pipe and the object to be processed are separate parts, and the aluminum VC heat pipe and the object to be processed are detachably connected. Therefore, by setting the aluminum VC heat pipe as a separate part from the object to be processed in this application, the possibility of the aluminum VC heat pipe contaminating beverages, foods, etc. inside the object to be processed is avoided; nor will the aluminum VC heat pipe be corroded by beverages, foods, etc. (especially acidic ones) inside the object to be processed, increasing the durability of the efficient temperature raising and lowering mechanism of this application.

[0015] Even further, the width of the first plate area is the same as the width of the second plate area. Therefore, the processing difficulty of the aluminum VC heat pipe is reduced, and only a simple bending operation on a common (such as square or rectangular plate-shaped) aluminum VC heat pipe structure can meet the usage requirements.

[0016] Even further, a heat dissipation part is provided on the side of the TEC semiconductor chip away from the aluminum VC heat pipe.

[0017] Even further, it also includes a heat insulation sleeve sleeved outside the aluminum VC heat pipe. Therefore, energy loss during the heating or cooling process can be effectively reduced.

[0018] Even further, it also includes an outer sheath located outside, and the inner diameter of the outer sheath is larger than the outer diameter of the aluminum VC heat pipe.

[0019] Further, the aluminum VC heat pipe is an integral part with the object to be processed.

[0020] The present invention also provides a preparation method of a device with temperature rising and falling functions, which is prepared according to the following method: STEP 01: Set the aluminum VC heat pipe to include a first plate area and a second plate area that is non-coplanar with and integrally connected to the first plate area; STEP 02: Contact the TEC semiconductor chip with the first plate area of the aluminum VC heat pipe; STEP 03: Use the first plate area of the aluminum VC heat pipe to conduct heat to the first surface of the object to be processed; use the first plate area to conduct heat to the second surface of the object to be processed. Description of the Drawings

[0021] Figure 1 It is a three-dimensional structure schematic diagram of the high-efficiency temperature rising and falling mechanism in the first embodiment of the present invention when the outer sheath is not provided; Figure 2 It is a three-dimensional structure schematic diagram of the aluminum VC heat pipe in the first embodiment of the present invention; Figure 3 It is a cross-sectional structure schematic diagram when the object to be processed is placed in the accommodation space; Figure 4 It is a three-dimensional structure schematic diagram of the object to be processed; Figure 5 It is a three-dimensional structure schematic diagram when the object to be processed is placed in the accommodation space; Figure 6 It is a schematic diagram of the usage state when cooling the object to be processed.

[0022] In the figure: 1. Object to be processed; 11. First surface; 12. Second surface; 2. TEC semiconductor chip; 3. Aluminum VC heat pipe; 31. First plate area; 32. Second plate area; 33. Accommodation space; 34. Transition surface; 4. Heat dissipation part; 5. Heat insulation sleeve; 6. Outer sheath. Detailed Embodiments

[0023] The following elaborates on the preferred embodiments of the present invention in conjunction with the drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0024] Embodiment 1: See attached Figure 1-6As shown, this embodiment is an efficient temperature rising and falling mechanism for heating or cooling an object 1 to be processed with a columnar shape in at least part of the area. The "columnar shape" of the object 1 to be processed here does not mean that it is a standard cylindrical shape, a prismatic shape or other columnar shapes, but can also be an irregular shape, as long as it has a generally cylindrical appearance. The object 1 to be processed can also be bottle-shaped, as long as there is a columnar outer shape structure in part of the bottle body or the whole bottle body that can be placed in the accommodation space 33 for accommodating the object 1 to be processed. The object 1 to be processed has a cavity inside for accommodating liquid or other substances to be heated.

[0025] The efficient temperature rising and falling mechanism of the present invention includes a TEC semiconductor chip 2 and an aluminum VC heat sink 3. Referring to the attached Figure 2 As shown, the aluminum VC heat sink 3 has a first plate area 31 in contact with the working surface of the TEC semiconductor chip 2 and a second plate area 32 that is non-coplanar with and integrally connected to the first plate area 31. The first plate area 31 can be attached to at least part of the area of the first surface 11 of the object 1 to be processed, and the second plate area 32 is attached to at least part of the area of the second surface 12 of the object 1 to be processed. The first plate area 31 and the second plate area 32 together form an accommodation space 33 for accommodating the object 1 to be processed, and at least part of the area of the second plate area 32 is parallel to the axis direction of the object 1 to be processed.

[0026] Referring to the attached Figure 4 As shown, the first surface 11 and the second surface 12 are two different surfaces of the object 1 to be processed. For example, in some embodiments, the first surface 11 is the bottom surface or the top surface of the object 1 to be processed, then the second surface 12 can be the side surface accordingly.

[0027] Since when using the aluminum VC heat sink 3 to play the role of heat conduction in the temperature rising and falling mechanism, the aluminum VC heat sink 3 is mostly only arranged on one side surface of the object 1 to be processed. However, when the object 1 to be processed is an object with a relatively large size in the axial direction (such as a columnar, barrel-shaped or bottle-shaped object), if heat can only be transferred on one side surface, the efficiency of heat transfer will be greatly reduced. Note that the "one side surface" here can also refer to the side wall surface of a columnar object, because this structure can be prepared by winding a rectangular aluminum VC heat sink 3. However, when the aluminum VC heat sink is arranged on the columnar side wall of the object 1 to be processed, an additional heat conduction structure for connecting to the TEC semiconductor chip 2 must be set up. This will still reduce the heat conduction efficiency or increase the overall processing cost of the equipment.

[0028] In this application, by setting the aluminum VC heat pipe 3 to have a structural form with a non-coplanar first plate area 31 and second plate area 32, while maintaining the integrity and wholeness of the structure of the aluminum VC heat pipe 3, it breaks the structural form in existing similar products where only one aluminum VC heat pipe 3 is provided on the single-sided surface at the bottom or top of the object to be processed 1. Instead, the same aluminum VC heat pipe 3 structure is provided on two different surfaces of the object to be processed 1, greatly improving the heat conduction efficiency and ensuring that the heat conduction effect of the aluminum VC heat pipe 3 is not affected.

[0029] After testing by the inventor, the high-efficiency heating and cooling mechanism in the embodiment of the present invention is compared with similar products in the prior art for heating and cooling the water in a water cup with a volume of 500 ml.

[0030] The results show that by using the high-efficiency heating and cooling mechanism of this application, under the same heating power, the effect of raising the temperature by 40°C within 20 minutes and the effect of raising the temperature by 30°C within 10 minutes can be achieved. While the competing product only raises the temperature by 15°C within 10 minutes.

[0031] And by using the high-efficiency heating and cooling mechanism of this application, under the same cooling power, the effect of lowering the temperature by 6.2°C within 20 minutes can be achieved. While the competing product only lowers the temperature by 1°C within 20 minutes.

[0032] Table 1 Comparison effect of heating using the high-efficiency heating and cooling mechanism of the present invention and similar products

[0033] Table 2 Comparison effect of cooling using the high-efficiency heating and cooling mechanism of the present invention and similar products

[0034] In addition, in this application, by extending a complete and coherent aluminum VC heat pipe 3 from the first surface 11 of the object to be processed 1 to the second surface 12, there is no need to additionally set up an intermediate heat conduction structure connecting the aluminum VC heat pipe 3 and the TEC semiconductor chip 2, minimizing the loss of energy during the transmission process to the greatest extent; and by using a complete aluminum VC heat pipe 3 to achieve heat transfer between the first surface 11 and the second surface 12 of the object to be processed 1, since the capillary core structure inside the aluminum VC heat pipe 3 is not damaged, its high heat conduction efficiency is retained.

[0035] In some embodiments, the TEC semiconductor chip 2 and the aluminum VC heat pipe 3 can be connected by a glue liquid with good thermal conductivity, or other structures (such as the heat insulation sleeve 5 or the outer sheath 6) can be used to limit the positions of the TEC semiconductor chip 2 and the aluminum VC heat pipe 3.

[0036] In some embodiments, the aluminum VC heat pipe 3 and the object to be processed 1 are separate components, and the aluminum VC heat pipe 3 and the object to be processed 1 are detachably connected. For example, the object to be processed 1 can be a beverage bottle, a packaging bottle, a beverage carton, or an ordinary water cup (the wall of the water cup needs to have heat conduction function). Therefore, by setting the aluminum VC heat pipe 3 and the object to be processed 1 as separate components, the possibility of the aluminum VC heat pipe 3 contaminating the beverages, foods, etc. inside the object to be processed 1 is avoided; nor will the aluminum VC heat pipe 3 be corroded by the beverages, foods, etc. (especially acidic ones) inside the object to be processed 1, increasing the durability of the high-efficiency temperature rising and falling mechanism of the present application.

[0037] In some embodiments, the number of the second plate areas 32 is two, and they are oppositely arranged at both ends of the first plate area 31. The two second plate areas 32 and the first plate area 31 are formed by bending the aluminum VC heat pipe 3 with an integral structure. Therefore, by providing two second plate areas 32 that fit the second surface 12 of the object to be processed 1, a better heat conduction effect can be formed in the length direction of the second surface 12 of the object to be processed 1. Compared with the traditional form of only heating or cooling on one side surface of the object to be processed 1, the heat conduction efficiency is greatly improved. Moreover, the two oppositely arranged second plate areas 32 can limit the position of the object to be processed 1, and thus can match different heat conduction application scenarios of the object to be processed 1.

[0038] In some embodiments, a transition surface 34 protruding outward in a direction away from the object to be processed 1 is formed at the connection between the first plate area 31 and the second plate area 32. This is because a plurality of capillary core structures are provided inside the aluminum VC heat pipe 3, and the setting of this transition surface 34 will not damage the capillary core structures inside the aluminum VC heat pipe 3, nor will it have a negative impact on its heat conduction performance.

[0039] In some embodiments, the aluminum VC heat pipe 3 is U-shaped. The "U-shaped" here is not a strictly U-shaped, but a structure similar to U-shaped. The aluminum VC heat pipe 3 with this structure is used to not damage the internal structure of the aluminum VC heat pipe 3. However, there is no need to separately provide other aluminum VC heat pipes 3, and the processing cost is not significantly increased.

[0040] In some embodiments, the width of the first plate area 31 is the same as the width of the second plate area 32. Therefore, the processing difficulty of the aluminum VC heat pipe 3 is reduced, and only a simple bending operation on a common plate-shaped (such as square or rectangular) aluminum VC heat pipe 3 structure is required to meet the use requirements.

[0041] In some embodiments, a heat dissipation part 4 is provided on the side of the TEC semiconductor chip 2 away from the aluminum VC heat pipe plate 3. For example, the heat dissipation part 4 can be a heat dissipation fin group or other heat dissipation structures. The overall shape of the heat dissipation part 4 can be square, circular or any other shape. In some embodiments, the shape of the heat dissipation part 4 is a shape matching the outer shape of other structures on the side of the high-efficiency temperature rising and falling mechanism opposite to the TEC semiconductor chip 2. Thus, the overall high-efficiency temperature rising and falling mechanism has a high aesthetic appearance.

[0042] In some embodiments, referring to the attached Figure 6 As shown, the first surface 11 can be either the bottom or the top of the object to be processed 1. Therefore, when cooling the object to be processed 1, the heat dissipation part 4 is facing upwards, which is not easily blocked by the desktop or other objects, and will not affect its heat dissipation effect. At this time, the placement direction of the object to be processed 1 is to set its top side close to the TEC semiconductor chip 2, place the bottom of the object to be processed 1 on the side close to the desktop or other support surfaces, and correspondingly sleeve the high-efficiency temperature rising and falling mechanism outside the object to be processed 1, thereby achieving the effect of cooling the object to be processed 1. Conversely, when heating the object to be processed 1, its bottom can be set to be close to the TEC semiconductor chip 2. At this time, the side of the TEC semiconductor chip 2 close to the aluminum VC heat pipe plate 3 generates heat, and the side close to the heat dissipation part 4 cools. At this time, the heat dissipation part 4 does not play a role, and the heat dissipation part 4 can be directly supported on the desktop, and the object to be processed 1 can be placed in the accommodation space 33 of the high-efficiency temperature rising and falling mechanism to achieve the effect of heating it.

[0043] In some embodiments, it further includes a heat insulation sleeve 5 sleeved outside the aluminum VC heat pipe plate 3. Therefore, it can effectively reduce the energy loss during the heating or cooling process, and further improve the efficiency of heating or cooling the object to be processed 1.

[0044] In some embodiments, it further includes an outer sheath 6 located outside. The inner diameter of the outer sheath 6 is larger than the maximum outer diameter of the aluminum VC heat pipe plate 3. In other possible embodiments, the outer sheath 6 is located outside the heat insulation sleeve 5. The outer sheath 6 can support the bottom of the object to be processed 1 when the high-efficiency temperature rising and falling mechanism is turned over when the heat dissipation part 4 needs to be placed on the top during the cooling of the object to be processed 1.

[0045] In some embodiments, the opening at one end of the outer sheath 6 away from the TEC semiconductor chip 2 is closed. Therefore, it can support the entire high-efficiency temperature rising and falling mechanism with the object to be processed 1 inverted, which is convenient for users to pick up and place.

[0046] Embodiment 2: The difference between this embodiment and the first embodiment is that the aluminum VC heat spreader 3 and the object to be processed 1 are integrated components. In this case, the aluminum VC heat spreader 3 and the object to be processed 1 can be directly bonded or connected together in other ways (such as snap connection), but the aluminum VC heat spreader 3 does not form the structure of the wall of the object to be processed 1. For example, if the object to be processed 1 is a cup, the object to be processed 1 and the aluminum VC heat spreader 3 are directly bonded and connected, thereby forming the product shape of a cup with an integrated function of rapid temperature rise and fall. This method still retains the advantages of the first embodiment and will not cause mutual interference or corrosion between the liquid inside the object to be processed 1 and the aluminum VC heat spreader 3.

[0047] Embodiment Three: The difference between this embodiment and the second embodiment is that the aluminum VC heat spreader 3 is pre-placed in the mold during the formation of the wall of the object to be processed 1. Thus, after the object to be processed 1 is processed and formed, the aluminum VC heat spreader 3 has been injection-molded or integrated into the wall of the object to be processed 1. By using this method, not too many additional processing steps will be added, and after directly using the existing aluminum VC heat spreader and bending it into the shape of the first embodiment, it can be used. Compared with the processing method of directly setting capillary core structures at the bottom and wall of the object to be processed 1 and pre-filling the working liquid, directly using the existing aluminum VC heat spreader 3 as a part of the wall of the object to be processed makes the processing process more convenient. The difference between this embodiment and the second embodiment is that the way the aluminum VC heat spreader 3 conducts heat to the object to be processed 1 is no longer by fitting the two together, but by integrating the aluminum VC heat spreader 3 into the interior of the wall of the object to be processed 1.

[0048] Embodiment Four: This embodiment is a device with a temperature rise and fall function, which includes at least one high-efficiency temperature rise and fall mechanism of the first embodiment.

[0049] The above embodiments are only for explaining the technical concept and characteristics of the present invention, and their purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it. It should not be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A special-shaped aluminum VC temperature balancing plate (3), characterized in that: The invention comprises a first plate area (31), and a second plate area (32) which is non-coplanar with and integrally connected to the first plate area (31); the first plate area (31) is used to conduct heat to at least a part of a first surface (11) of an object to be processed (1); the second plate area (32) is used to conduct heat to at least a part of a second surface (12) of the object to be processed (1); the first plate area (31) and the second plate area (32) together form a containing space (33) for containing the object to be processed (1); and at least a part of the second plate area (32) is parallel to the axial direction of the object to be processed (1).

2. The aluminum VC temperature equalizing plate according to claim 1, characterized in that: The number of the second plate areas (32) is two, and they are arranged oppositely at the two ends of the first plate area (31); the two second plate areas (32) and the first plate area (31) are formed by bending the same aluminum VC temperature balancing plate (3).

3. The aluminum VC temperature equalizing plate according to claim 2, characterized in that: A transition surface is formed at the connection between the first plate area (31) and the second plate area (32), protruding outward in a direction away from the object to be processed (1).

4. A highly efficient heating and cooling mechanism, used for heating or cooling an object to be processed (1) having at least a partial area with a columnar shape, comprising a TEC semiconductor chip (2), characterized in that: It comprises the aluminum VC temperature averaging plate (3) as claimed in any one of claims 1 to 3, wherein the first plate area (31) of the aluminum VC temperature averaging plate (3) is in contact with the TEC semiconductor chip (2).

5. The high-efficiency temperature rise and fall mechanism according to claim 4, characterized in that: The aluminum VC temperature-averaging plate (3) and the object to be processed (1) are separate parts, and the aluminum VC temperature-averaging plate (3) and the object to be processed (1) are detachably connected.

6. The high-efficiency temperature rise and fall mechanism according to any one of claims 4 to 5, characterized in that: A heat dissipation portion (4) is provided on a side of the TEC semiconductor chip (2) away from the aluminum VC temperature equalizing plate (3).

7. The high-efficiency temperature rise and fall mechanism according to any one of claims 4 to 5, characterized in that: It also includes a heat insulation sleeve (5) sleeved on the outside of the aluminum VC temperature equalizing plate (3).

8. The high-efficiency temperature rise and fall mechanism according to any one of claims 4 to 5, characterized in that: The aluminum VC temperature-averaging plate (3) and the object to be processed (1) are an integral part.

9. A device with temperature rise and fall function, characterized in that: It includes at least one aluminum VC temperature equalizing plate as described in any one of claims 1-3 or at least one high-efficiency temperature increasing and decreasing mechanism as described in any one of claims 4-8.

10. A method for preparing a device with temperature raising and lowering functions, characterized in that: Prepared according to the following method: STEP 01: The aluminum VC temperature-averaging plate (3) is configured to include a first plate area (31) and a second plate area (32) that is non-coplanar and integrally connected to the first plate area (31); STEP 02: The TEC semiconductor sheet (2) is brought into contact with the first plate area (31) of the aluminum VC temperature balancing plate (3); STEP 03: Using the first plate area (31) of the aluminum VC temperature equalizing plate (3) to conduct heat to the first surface (11) of the object to be processed; using the first plate area (31) to conduct heat to the second surface (12) of the object to be processed.

Images