Production process of sampling resistor with welding legs shaped like Chinese character'ji 'and resistor thereof

Abstract

The invention provides an n-shaped weld leg sampling resistor production process and a resistor thereof, and the n-shaped weld leg sampling resistor production process comprises the following steps: dividing an alloy coiled material into a plurality of sections to obtain material belt monomers; the material belt monomers are bonded through glue; after the glue is cured, an insulating layer is formed between the adjacent material belt monomers; cutting the material belt single bodies and the insulating layers to obtain splicing assemblies, wherein each splicing assembly contains a plurality of resistor bodies; a positioning hole is formed in the resistor body; the bending and splicing assembly is shaped like a Chinese character'ji '; inserting the pins into the positioning holes, and welding the pins and the resistor body together; detecting the resistance value of the resistor body, and trimming the resistor body with the resistance value error; and the multiple splicing assemblies are stacked together and then packaged and delivered. The splicing assembly obtained through the n-shaped welding leg sampling resistor production process comprises a plurality of sampling resistors, the sampling resistors can be produced in batches, and the production efficiency of the sampling resistors is improved.

Description

Technical Field

[0001] The present invention relates to the production process of a sampling resistor with a "Ji" - shaped welding leg, and particularly to a production process of a sampling resistor with a "Ji" - shaped welding leg and its resistor. Background Art

[0002] Sampling resistors are mainly used in electronic devices such as the power supply parts of power products, electronics, digital, and electromechanical products, providing important references for accurately controlling current.

[0003] Figure 1 As a sampling resistor, it includes a resistor body 11 and two pins 12 welded to the resistor body 11. The cross - section of the resistor body 11 is in a "Ji" shape. When manufacturing the sampling resistor 10, the processed coil is fixed in a spring machine, and the spring machine performs bending and cutting operations on the coil to process the resistor body 11, and then the pins 12 are welded to the obtained resistor body 11. In this process, the bending and cutting of the resistor body 11 are both completed on the spring machine. However, the existing spring machine can only carry one coil, that is, each operation of the spring machine can only process one resistor body 11, resulting in low processing efficiency. When mass production is required, multiple spring machines need to run simultaneously, increasing the processing cost. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a production process of a sampling resistor with a "Ji" - shaped welding leg and its resistor, so as to improve the production efficiency of the sampling resistor.

[0005] The purpose of the present invention is achieved through the following technical solutions: A production process of a sampling resistor with a "Ji" - shaped welding leg includes the following steps: Step 1: Divide the alloy coil into several segments to obtain strip monomers; Step 2: Bond adjacent strip monomers together with glue; Step 3: After the glue is cured, an insulating layer is formed between adjacent strip monomers; Step 4: Cut the strip monomers and the insulating layer together to obtain a splicing component, and each splicing component contains multiple resistor bodies; Step 5: Open positioning holes at both ends of each resistor body; Step 6: Bend the splicing component so that the cross - section of the resistor body on it is in a "Ji" shape; Step 7: Insert the pins into the positioning holes and weld the pins to the resistor body; Step 8: Detect the resistance value of each resistor body and repair the resistor body with an error in resistance value; Step 9: Stack multiple splicing components together and then package and ship them.

[0006] In one embodiment, each of the splicing components contains 10 resistors.

[0007] In one embodiment, the positioning holes do not penetrate the resistor body, and the positioning holes are located on the same side of the resistor body.

[0008] In one embodiment, in step 8, a laser marking machine is used to open a resistance adjustment groove on the resistor to adjust the resistance value of the resistor.

[0009] In one embodiment, after the resistance is repaired, glue is filled into the resistance adjustment groove.

[0010] In one embodiment, after the splicing components are stacked, the resistor body of the lower splicing component is located between two pins of the upper splicing component.

[0011] A resistor is prepared by the above-mentioned production process of the sampling resistor with an X-shaped solder pin, comprising a resistor body and pins, wherein the cross section of the resistor body is in the shape of an "X".

[0012] The spliced ​​component obtained by the production process of the sampling resistor with the cross-shaped solder pin contains multiple sampling resistors, which can be used to mass-produce the sampling resistors, simplify the production process of the sampling resistors, and improve the production efficiency of the sampling resistors. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 It is a structural diagram of the sampling resistor; Figure 2 It is a structural diagram of a material strip monomer; Figure 3 Schematic diagram of the distribution of the strip monomer and the insulation layer; Figure 4 It is a schematic diagram of cutting a strip monomer; Figure 5 This is a schematic diagram of the assembly after drilling. Figure 6 This is a schematic diagram of the assembly after bending. Figure 7 for Figure 6 The outline of the resistor body in the state shown; Figure 8 This is a schematic diagram of the structure of the assembly after soldering the pins; Figure 9 for Figure 8 a side view of the illustrated splice assembly; Figure 10 It is a schematic diagram of the stacking of splicing components; Figure 11 for Figure 10 Side view of the spliced ​​assembly in the shown state. DETAILED DESCRIPTION

[0015] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0016] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0017] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0018] See also Figure 1 The present invention provides a resistor 10, which includes a resistor body 11 and a lead 12. The cross section of the resistor body 11 is in the shape of a Chinese character "J". The above-mentioned resistor 10 is prepared by a production process of a sampling resistor with a Chinese character "J" solder lead, which specifically includes the following steps: Step 1: Divide the alloy coil into several sections to obtain a strip monomer 20 (such as Figure 2 As shown); the lengths of the plurality of strip monomers 20 are equal, and the lengths of the strip monomers 20 can be increased or decreased according to processing requirements, so that the resulting strip monomers 20 are independent of each other and do not contact each other.

[0019] like Figure 2As shown, a blanking device is used to cut a complete alloy coil into a first portion 60 and a second portion 70. The first portion 60 includes a first connecting band 61 and multiple strip elements 20, with one end of each strip element 20 aligned and connected by the first connecting band 61. The second portion 70 includes a second connecting band 71 and multiple strip elements 20, with one end of each strip element 20 aligned and connected by the second connecting band 71. This blanking method offers the following advantages: Firstly, the width of the strip elements 20 in both the first and second portions 60 and 70 is the same, and the spacing between the strip elements 20 (for glue application) is the same, facilitating consistent product production. Secondly, the blanking process also forms the first and second connecting bands 61 and 71, temporarily connecting the multiple strip elements 20 together to facilitate subsequent glue application and temporarily secure the strip elements 20 before the glue cures, improving production efficiency and stability.

[0020] Step 2: Adjacent strip monomers 20 are bonded together using glue; Step 3: After the glue is cured, an insulating layer 30 is formed between adjacent strip monomers 20; See also Figure 3 The insulating layer 30 is used to separate adjacent strip monomers 20, fixing the strip monomers 20 together while also playing a separating role to prevent the direct contact between the strip monomers 20, so that adjacent strip monomers 20 are not conductive to each other, which is beneficial to subsequent resistance repair.

[0021] Step 4: Cut the material strip 20 and the insulating layer 30 together to obtain spliced ​​components 40. Each spliced ​​component 40 contains multiple resistors 11. It should be noted that when the material strip 20 and the insulating layer 30 are cut together to obtain the spliced ​​components 40, the first connecting strip 61 and the second connecting strip 71 are naturally separated at the end. See also Figure 4 The strip elements 20 are cut along cutting lines 50 , which are perpendicular to the direction in which the strip elements 20 extend. The strip elements 20 and the insulating layer 30 are severed together during the cutting process. The severed strip elements 20 are resistor elements 11. Each resulting spliced ​​assembly 40 contains multiple resistor elements 11, thus completing the pre-processing of the strip. Preferably, each spliced ​​assembly 40 contains ten resistor elements 11.

[0022] Step 5: Open positioning holes 1 at both ends of each resistor 11; See also Figure 5 The positioning hole 1 is used to provide positioning for the pin 12 and can be laser-opened in advance before punching to prepare for subsequent welding operations.

[0023] Step 6: Bend the splicing component 40 so that the cross-section of the resistor body 11 on it is in a "ji" shape; Please refer to Figure 6 and Figure 7 , and use a bending machine to perform a bending operation on the splicing component 40. Since the splicing component 40 contains multiple resistor bodies 11, each bending operation can process multiple resistor bodies 11 into a "ji" shape.

[0024] Step 7: Insert the pin 12 into the positioning hole 1 and weld the pin 12 to the resistor body 11, as Figure 8 shown; Step 8: Detect the resistance value of each resistor body 11 and trim the resistor body 11 with an error in resistance value;至此拼接组件40上的各个电阻体11被加工成电阻器10,此时拼接组件40上电阻体11的结构如 Figure 8 and Figure 9 shown. Here, it should be particularly noted that since the adjacent two resistor bodies 11 are separated by the insulating layer 30, the adjacent two resistor bodies 11 cannot be electrically connected, which ingeniously solves the technical problem of trimming the resistor body 11. The trimming machine can quickly trim multiple resistor bodies 11. In addition, it is worth mentioning that the insulating layer 30 exists between each step from beginning to end and plays an important role in threading.

[0025] Step 9: Stack multiple splicing components 40 together and then package and ship them.

[0026] The stacking method of the splicing components 40 is as Figure 10 and Figure 11 shown. After stacking the splicing components 40, the resistor body 11 of the lower splicing component 40 is located between the two pins 12 of the upper splicing component 40, preventing misalignment between the upper and lower splicing components 40 and avoiding the collapse of the stacked splicing components 40.

[0027] Among them, Steps 1 to 4 are the pretreatment process of the strip, which is used to pretreat the raw material to obtain the splicing component 40 as shown in Figure 4 for subsequent processing; Steps 5 to 8 are the forming process of the resistor body 11, which is used to process the sheet-shaped resistor body 11 into a "ji" shape; after Step 8, the resistor bodies 11 on the obtained splicing component 40 have been processed into resistors 10, and the adjacent resistors 10 are adhered by the insulating layer 30, as Figure 8 shown.

[0028] Each assembled assembly 40 obtained through the above process contains multiple resistors 10, which are bonded together by an insulating layer 30. Applying external force can break the insulating layer 30, thereby breaking the resistors 10 from the assembled assembly 40. In other words, the resistors 10 are bonded together when shipped. Since resistors 10 are small electronic components, bonding multiple resistors 10 together increases the target volume, making it easier to stack them in a box during packaging, facilitating bulk loading and unloading.

[0029] It should be noted that before the bending operation is carried out, steps 1 to 4 perform pre-processing operations on the material strip so that the splicing component 40 has multiple sheet-shaped resistors 11. When the splicing component 40 is bent, the multiple resistors 11 thereon can be processed into a "J" shape at the same time, thereby realizing batch processing of the resistors 11, which is beneficial to improving the processing efficiency of the resistors 10.

[0030] Furthermore, since the material strip is pre-processed in steps 1 to 4, there is an insulating layer 30 between adjacent resistor bodies 11 on the splicing component 40. The insulating layer 30 separates the two adjacent resistor bodies 11 so that they are not conductive to each other. Therefore, when adjusting the resistance, the pin 12 can be directly connected to the power supply to detect the resistance value of each resistor body 11 on the splicing component 40, without applying additional insulation measures to the resistor body 11 to be tested in advance, thereby improving the resistance repair efficiency and thereby improving the production efficiency of the resistor 10.

[0031] It should be emphasized that the insulating layer 30 located between adjacent resistors 11 acts as an adhesive to bond the adjacent resistors 11 together so that the bending machine can process them simultaneously, so that multiple resistors 11 can be formed at the same time; it also separates the adjacent resistors 11 so that the resistors 11 on the same splicing component 40 are not conductive to each other, which facilitates the resistance repair operation in step 8 and is conducive to improving the processing efficiency of the resistor 10.

[0032] In one embodiment, the positioning holes 1 do not penetrate the resistor body 11, and each positioning hole 1 is located on the same side of the resistor body 11, that is, the positioning holes 1 are blind holes, and the pins 12 are abutted against the bottom of the positioning holes 1. The positioning holes 1 provide a limit for the pins 12 so that the exposed lengths of the pins 12 are consistent.

[0033] In one embodiment, in step 8, a laser engraving machine is used to open a resistance adjustment groove on the resistor body 11 to adjust the resistance value of the resistor body 11, and the resistance value of the resistor body 11 is adjusted to the target value to ensure the uniform resistance value of the product. Preferably, after the resistance is repaired, the resistance adjustment groove is filled with glue.

[0034] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A production process for a sampling resistor with a cross-shaped solder foot, characterized in that: Including the following steps: Step 1: Divide the alloy coil into several segments to obtain strip monomers; Step 2: Bond adjacent strip monomers together with glue; Step 3: After the glue cures, an insulating layer is formed between adjacent strip monomers; Step 4: Cut the strip monomers and the insulating layer together to obtain a splicing component, and each splicing component contains multiple resistors; Step 5: Open positioning holes at both ends of each resistor; Step 6: Bend the splicing component so that the cross-section of the resistor on it is in a "ji" shape; Step 7: Insert the pins into the positioning holes and weld the pins to the resistors; Step 8: Detect the resistance value of each resistor and trim the resistors with resistance value errors; Step 9: Stack multiple splicing components together, then package and ship them.

2. The production process of the X-shaped solder foot sampling resistor according to claim 1, characterized in that: Each of the splicing components contains 10 of the resistors.

3. The production process of the X-shaped solder foot sampling resistor according to claim 1, characterized in that: The positioning holes do not penetrate the resistor, and the positioning holes are located on the same side of the resistor.

4. The production process of the X-shaped solder foot sampling resistor according to claim 1, characterized in that: In Step 8, a laser engraving machine is used to open a trimming groove on the resistor to adjust the resistance value of the resistor.

5. The production process of the X-shaped solder foot sampling resistor according to claim 4, characterized in that: After trimming, fill the trimming groove with glue.

6. The production process of the X-shaped solder foot sampling resistor according to claim 1, characterized in that: After stacking the splicing components, the resistors of the lower splicing component are located between the two pins of the upper splicing component.

7. A resistor, prepared by the production process of the X-shaped solder foot sampling resistor according to any one of claims 1 to 6, characterized in that: Including a resistor and pins, and the cross-section of the resistor is in a "ji" shape.

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