Chemical liquid discharge control system, discharge method, and semiconductor cleaning apparatus

Abstract

The application discloses a chemical liquid discharge control system, a discharge method and a semiconductor cleaning device. The discharge control system comprises a first sensor arranged in a process chamber and used for detecting whether the chemical liquid exists in the process chamber, wherein the chemical liquid at least comprises a first chemical liquid and a second chemical liquid; a discharge valve group arranged downstream of a temporary storage area used for receiving the chemical liquid flowing from the process chamber, at least comprising a first discharge valve and a second discharge valve, wherein the first discharge valve is turned on to discharge the first chemical liquid, and the second discharge valve is turned on to discharge the second chemical liquid; and a second sensor arranged in the temporary storage area, when the second sensor detects that there is no first chemical liquid in the temporary storage area, the first discharge valve is closed, and the second chemical liquid is introduced into the process chamber. Through the above discharge control system, different chemical liquids can be classified and discharged, waste liquid pollution can be reduced, the overall process efficiency can be improved, and the discharge time of the chemical liquid can be shortened.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor manufacturing, specifically to a chemical liquid discharge control system, a chemical liquid discharge method, a semiconductor cleaning apparatus, and a computer-readable storage medium. Background Technology

[0002] In semiconductor cleaning equipment, wafer cleaning often requires the use of different types of chemical solvents, and the discharge of different chemical solutions also has different requirements. If multiple different chemical solutions are mixed and discharged, it will lead to problems such as low resource utilization, difficulty in recycling, and increased pollution risks.

[0003] Existing technologies include devices capable of classifying and discharging multiple chemical liquids. However, these devices are bulky and complex, lacking real-time feedback on whether waste liquid discharge has been completed. If the second chemical liquid is discharged before the first is completely discharged, the goal of waste liquid classification and discharge cannot be achieved. Therefore, current discharge devices must wait until the first chemical liquid is discharged before discharging the second, which prolongs the discharge time and impacts the efficiency of upstream processes.

[0004] In order to solve the above-mentioned problems in the existing technology, there is an urgent need in the field for a chemical liquid discharge technology that can not only classify and discharge different chemical liquids to reduce waste liquid pollution, but also improve the overall process efficiency and shorten the discharge time of chemical liquids. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] In order to overcome the above-mentioned defects in the prior art, the present invention provides a chemical liquid discharge control system, a chemical liquid discharge method, a semiconductor cleaning device, and a computer-readable storage medium, which can not only classify and discharge different chemical liquids to reduce waste liquid pollution, but also improve the overall process efficiency and shorten the chemical liquid discharge time.

[0007] Specifically, the above-mentioned chemical liquid discharge control system according to the first aspect of the present invention includes: a first sensor disposed in a process chamber for detecting whether a chemical liquid exists in the process chamber, wherein the chemical liquid includes at least a first chemical liquid and a second chemical liquid; a discharge valve assembly disposed downstream of a temporary storage area for receiving chemical liquid flowing in from the process chamber, the temporary storage area including at least a first discharge valve and a second discharge valve, wherein the first discharge valve is open to discharge the first chemical liquid and the second discharge valve is open to discharge the second chemical liquid; and a second sensor disposed in the temporary storage area, wherein when the second sensor detects that there is no first chemical liquid in the temporary storage area, the first discharge valve is closed and the second chemical liquid is introduced into the process chamber.

[0008] Optionally, in some embodiments of the present invention, a liquid guiding valve assembly is included between the process chamber and the temporary storage area to control the flow of chemical liquid in the process chamber into the temporary storage area. When the first sensor detects the presence of the first chemical liquid in the process chamber, the liquid guiding valve assembly is opened to allow the first chemical liquid to flow into the temporary storage area. When the first sensor does not detect the first chemical liquid, the liquid guiding valve assembly is closed, and the second chemical liquid is introduced into the process chamber.

[0009] Optionally, in some embodiments of the present invention, the process cavity includes a wafer stage and a nozzle, the wafer stage being used to hold the wafer to be processed, and the nozzle being used to provide the corresponding chemical solution to the wafer in the process cavity according to process requirements.

[0010] Optionally, in some embodiments of the present invention, the end of the discharge valve assembly is connected to a discharge tank assembly to classify and discharge different chemical liquids, wherein the end of the first discharge valve is connected to a first discharge tank to receive the discharge of the first chemical liquid, and the end of the second discharge valve is connected to a second discharge tank to receive the discharge of the second chemical liquid.

[0011] Furthermore, according to the chemical liquid discharge method provided by the second aspect of the present invention, the chemical liquid discharge operation is performed using the chemical liquid discharge control system provided by the first aspect of the present invention. The chemical liquid discharge method includes the following steps: detecting whether there is a first chemical liquid flowing down from the process chamber in the temporary storage area; and in response to the absence of detection of the first chemical liquid in the temporary storage area, closing the first discharge valve and introducing the second chemical liquid into the process chamber.

[0012] Optionally, in some embodiments of the present invention, the step of detecting whether there is a first chemical liquid flowing down from the process chamber in the temporary storage area includes: introducing the first chemical liquid into the process chamber to perform a first process; opening a liquid guiding valve assembly in response to the first sensor detecting the presence of the first chemical liquid in the process chamber to allow the first chemical liquid to flow into the temporary storage area; and continuously detecting whether there is a first chemical liquid flowing down from the process chamber in the temporary storage area using the second sensor.

[0013] Optionally, in some embodiments of the present invention, after the step of continuously detecting whether the first chemical liquid flowing down from the process chamber exists in the temporary storage area by means of the second sensor, the method further includes: in response to the second sensor detecting the presence of the first chemical liquid in the temporary storage area, controlling the opening of the first discharge valve so that the first chemical liquid is discharged into the corresponding first discharge tank via the first discharge valve.

[0014] Optionally, in some embodiments of the present invention, the step of closing the first discharge valve and introducing the second chemical liquid into the process chamber in response to the absence of the first chemical liquid in the temporary storage area includes: closing the liquid guiding valve assembly in response to the second sensor detecting the absence of the first chemical liquid in the temporary storage area; introducing the second chemical liquid into the process chamber to perform a second process; detecting whether the first discharge valve is closed in response to the completion of the second process; and opening the liquid guiding valve assembly in response to the first discharge valve being in a closed state, so that the second chemical liquid in the process chamber flows into the temporary storage area.

[0015] Furthermore, the semiconductor cleaning apparatus provided according to the third aspect of the present invention includes: a process chamber for introducing various chemical liquids to perform various process treatments on the wafer inside; a temporary storage area disposed downstream of the process chamber for receiving the chemical liquids flowing out of the process chamber; a discharge valve assembly disposed downstream of the temporary storage area, including a first discharge valve and a second discharge valve, wherein the first discharge valve is open to discharge the first chemical liquid and the second discharge valve is open to discharge the second chemical liquid; a memory; and a processor connected to the memory and configured to implement the chemical liquid discharge method provided by the second aspect of the present invention.

[0016] Furthermore, according to a fourth aspect of the present invention, a computer-readable storage medium is provided having computer instructions stored thereon. When the computer instructions are executed by a processor, the above-described method for discharging the chemical liquid provided in the second aspect of the present invention is implemented. Attached Figure Description

[0017] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0018] Figure 1 A schematic diagram of a semiconductor cleaning apparatus provided according to some embodiments of the present invention is shown;

[0019] Figure 2 A structural block diagram of a semiconductor cleaning apparatus according to some embodiments of the present invention is shown; and

[0020] Figure 3 A flowchart of a method for discharging a chemical liquid according to some embodiments of the present invention is shown.

[0021] Figure label:

[0022] 10. Semiconductor cleaning equipment;

[0023] 100 process cavity;

[0024] 110 First sensor;

[0025] 120 wafer stage;

[0026] 130 nozzles;

[0027] 140 wafers;

[0028] 200 temporary storage area;

[0029] 210 Second sensor;

[0030] 220 Liquid transfer valve assembly;

[0031] 300 exhaust valve assembly;

[0032] 310 First discharge valve;

[0033] 311 First discharge tank;

[0034] 320 Second discharge valve;

[0035] 321 Second discharge chute;

[0036] 410 Memory;

[0037] 420 processor; and

[0038] Steps S310~S320 Detailed Implementation

[0039] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0042] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0043] As mentioned above, existing technologies also include devices capable of classifying and discharging multiple chemical liquids. However, these devices are bulky and complex, and lack real-time feedback on whether the waste liquid has been completely discharged. If the first chemical liquid has not been completely discharged before the second chemical liquid begins to be discharged, the goal of classifying and discharging waste liquids cannot be achieved. Therefore, current discharge devices must wait until the first chemical liquid has been discharged before discharging the second, which prolongs the discharge time and affects the efficiency of upstream processes.

[0044] To address the aforementioned problems in the prior art, this invention provides a chemical liquid discharge control system, a chemical liquid discharge method, a semiconductor cleaning device, and a computer-readable storage medium. These systems not only enable the classified discharge of different chemical liquids, reducing waste liquid pollution, but also improve overall process efficiency and shorten the chemical liquid discharge time.

[0045] In some non-limiting embodiments, the chemical liquid discharge control system provided in the first aspect of the present invention can be used to implement the chemical liquid discharge method provided in the second aspect of the present invention. Furthermore, the chemical liquid discharge control system provided in the first aspect of the present invention can also be configured in the semiconductor cleaning apparatus provided in the third aspect of the present invention.

[0046] Specifically, please refer to Figure 1 , Figure 1 A schematic diagram of a semiconductor cleaning apparatus provided according to some embodiments of the present invention is shown.

[0047] like Figure 1 As shown, in some embodiments of the present invention, the semiconductor cleaning apparatus 10 may include: a process chamber 100 for introducing various chemical liquids to perform various process treatments on the wafer 140 inside, for example, at least a first chemical liquid and a second chemical liquid may be introduced to perform corresponding first and second process treatments; a temporary storage area 200 may be located downstream of the process chamber 100 for receiving the chemical liquids flowing out of the process chamber 100; and a discharge valve assembly 300 may be located downstream of the temporary storage area 200. Optionally, the discharge valve assembly 300 may include at least a first discharge valve 310 and a second discharge valve 320 for discharging different chemical liquids, for example, discharging the first chemical liquid and the second chemical liquid respectively. When the first discharge valve 310 is open, the first chemical liquid can be discharged, and when the second discharge valve 320 is open, the second chemical liquid can be discharged.

[0048] Further, please see Figure 2 , Figure 2 A structural block diagram of a semiconductor cleaning apparatus provided according to some embodiments of the present invention is shown.

[0049] like Figure 2 As shown, the semiconductor cleaning apparatus 10 may also include a memory 410 and a processor 420. The memory 410 may include, but is not limited to, the computer-readable storage medium described in the fourth aspect of the present invention, on which computer instructions are stored. The processor 420 may be connected to the memory 410 and configured to execute the computer instructions stored in the memory 410 to implement the chemical liquid discharge method described in the second aspect of the present invention.

[0050] The working principle of the semiconductor cleaning apparatus 10 described above will be described below with reference to some embodiments of chemical liquid discharge methods, especially the working principle of the chemical liquid discharge control system included therein. Those skilled in the art will understand that these embodiments of chemical liquid discharge methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide some specific solutions convenient for public implementation, rather than limiting all operating methods or functions of the semiconductor cleaning apparatus 10. Similarly, the semiconductor cleaning apparatus 10 is also only one non-limiting implementation provided by the present invention and does not limit the entities implementing each step in these chemical liquid discharge methods.

[0051] Please continue reading. Figure 1 The semiconductor cleaning apparatus 10 may include a chemical liquid discharge control system. Specifically, the chemical liquid discharge control system may include a first sensor 110, a second sensor 210, and a discharge valve assembly 300. The first sensor 110 may be located within the process chamber 100 to detect the presence of chemical liquid within the process chamber 100. Optionally, the chemical liquid introduced into the process chamber 100 may include at least a first chemical liquid and a second chemical liquid. A temporary storage area 200 may be provided downstream of the process chamber 100 to receive the chemical liquid flowing in from the process chamber 100. The discharge valve assembly 300 may be located downstream of the temporary storage area 200 to facilitate the discharge of the chemical liquid temporarily stored in the temporary storage area 200.

[0052] like Figure 1 As shown, in some embodiments, when the chemical liquid introduced into the process chamber 100 includes at least a first chemical liquid and a second chemical liquid, the discharge valve assembly 300 may also include at least a first discharge valve 310 and a second discharge valve 320. The first discharge valve 310 can be opened to discharge the corresponding first chemical liquid, and the second discharge valve 320 can be opened to discharge the corresponding second chemical liquid.

[0053] Furthermore, a second sensor 210 may be included within the temporary storage area 200. The second sensor 210 can be used to detect whether a chemical liquid flowing from the process chamber 100 exists within the temporary storage area 200. Assume that a first chemical liquid is introduced into the upstream process chamber for a first process. After the first process is completed in the upstream process chamber 100, the first chemical liquid can flow into the downstream temporary storage area 200. When the second sensor 210 in the temporary storage area 200 detects the absence of the first chemical liquid, the chemical liquid discharge control system can close the first discharge valve 310 and introduce another different chemical liquid, such as the second chemical liquid, into the process chamber 100 for a second process.

[0054] Specifically, in some optional embodiments, the upstream process cavity 100 may include a wafer stage 120 and a nozzle 130. The wafer stage 120 is used to hold the wafer 140 to be processed. The nozzle 130 may be disposed above the wafer stage 120 to spray corresponding chemical liquids onto the wafer 140 on the wafer stage 120 below, according to different process requirements.

[0055] Furthermore, the wafer stage 120 can be a rotating stage to support the wafer 140 to be processed and rotate it, thereby allowing the chemical solution to be sprayed evenly onto the surface of the wafer 140. Optionally, the chemical solution can be a wafer cleaning solution. To ensure uniform cleaning of the surface of the wafer 140, the centrifugal force generated by the rotation of the wafer stage 120 can enhance the cleaning power of the cleaning solution on the surface of the wafer 140.

[0056] Continue as Figure 1 As shown, a liquid guiding valve assembly 220 may be included between the process chamber 100 and the temporary storage area 200 to control the flow of chemical liquid from the process chamber 100 into the temporary storage area. In this embodiment, by setting the valve assembly structure, the flow of chemical liquid from the upstream process chamber 100 to the downstream temporary storage area 200 can be accelerated. When the first sensor 110 detects the presence of the first chemical liquid in the process chamber 100, the chemical liquid discharge control system can control the opening of the liquid guiding valve assembly 220 to allow the first chemical liquid to flow downward into the temporary storage area 200. When the first sensor 110 does not detect the first chemical liquid in the process chamber 100, the chemical liquid discharge control system can control the closing of the liquid guiding valve assembly 220 and introduce a second chemical liquid into the process chamber 100 for the second process.

[0057] like Figure 1 As shown, in some optional embodiments, a discharge tank assembly can also be connected to the end of the discharge valve assembly 300 to classify and discharge different chemical liquids, which is beneficial for targeted recovery of different chemical liquids and reducing pollution risks. Specifically, the end of the first discharge valve 310 can be connected to the first discharge tank 311 to receive the discharge of the first chemical liquid. The end of the second discharge valve 320 can be connected to the second discharge tank 321 to receive the discharge of the second chemical liquid.

[0058] Next, please refer to Figure 3 , Figure 3 A flowchart of a method for discharging a chemical liquid according to some embodiments of the present invention is shown.

[0059] like Figure 3 As shown, in some embodiments of the present invention, the method for discharging chemical liquid may include the following step S310: detecting whether there is a first chemical liquid flowing down from the process chamber in the temporary storage area.

[0060] Please combine Figure 1 Specifically, in some embodiments, a first chemical solution can be used to perform a first process on the wafer 140, such as a cleaning process. The first chemical solution can be sprayed onto the wafer 140 below via nozzle 130. When the first sensor 110 in the process chamber 100 detects the presence of the first chemical solution in the process chamber 100, it transmits an electrical signal to the chemical solution discharge control system. The chemical solution discharge control system controls the opening of the liquid guide valve assembly 220, so that the first chemical solution in the upstream process chamber 100 flows rapidly into the downstream temporary storage area 200. The second sensor 210 in the temporary storage area 200 continuously detects whether the first chemical solution flowing down from the process chamber 100 exists in the temporary storage area 200. Once the second sensor 210 senses the inflow of liquid, it can feed back an electrical signal to the chemical solution discharge control system, so that it controls the opening of the first discharge valve 310 downstream of the temporary storage area 200 corresponding to the discharge of the first chemical solution. The first chemical solution flows into the first discharge tank 311 through the open first discharge valve 310.

[0061] like Figure 3 As shown, the above-mentioned chemical liquid discharge method provided by the present invention may further include step S320: in response to the absence of detection of the first chemical liquid in the temporary storage area, the first discharge valve is closed and the second chemical liquid is introduced into the process chamber.

[0062] Specifically, in some embodiments, during the discharge of the first chemical liquid, when the second sensor 210 in the temporary storage area 200 does not detect the first chemical liquid, it indicates that the discharge of the first chemical liquid in the process chamber 100 has been completed, and a signal can be sent to the chemical liquid discharge control system to control the closing of the first discharge valve 310.

[0063] At this time, the chemical liquid discharge control system can control the introduction of a second chemical liquid into the process chamber 100 to perform a second process, such as using nozzle 130 to spray the second chemical liquid to clean the wafer 140. Since the liquid guide valve assembly 220 is closed when using the second chemical liquid, even if the first chemical liquid remains in the temporary storage area 200, the second chemical liquid in the upstream process chamber 100 and the first chemical liquid in the downstream temporary storage area 200 will not mix. Therefore, even if the first chemical liquid in the temporary storage area 200 has not been completely discharged, the second process based on the second chemical liquid in the upstream process chamber 100 can proceed simultaneously without affecting the upstream process, thereby improving overall process efficiency and shortening the chemical liquid discharge time.

[0064] After the second process is completed in the upstream process chamber 100, the chemical liquid discharge control system can detect whether the first discharge valve 310 is closed. When it is determined that the first discharge valve 310 is closed, the liquid guide valve assembly 220 can be opened to allow the second chemical liquid in the process chamber 100 to flow into the temporary storage area 200. In this embodiment, the liquid guide valve assembly 220 will only be opened after the second sensor 210 in the temporary storage area 200 completely fails to detect the first chemical liquid, at which point the second chemical liquid can flow into the temporary storage area 200.

[0065] Those skilled in the art will understand that the above-described solutions for the first and second chemical liquids are merely non-limiting embodiments of the present invention, intended to clearly demonstrate the main concept of the invention and provide a specific solution that is easy for the public to implement, rather than being used to limit the scope of protection of the present invention. Optionally, in some other embodiments, those skilled in the art can also classify and discharge various types of chemical liquids based on the concept of the present invention to achieve the same technical effect.

[0066] In the above embodiments provided by the present invention, when using another chemical liquid for process processing, even if the first chemical liquid in the temporary storage area 200 has not been completely drained and the liquid guiding valve group 220 has not been opened, since the total drainage time of the multiple chemical liquids is much shorter than the process time, as soon as the first chemical liquid in the temporary storage area 200 is drained, the liquid guiding valve group 220 can be opened immediately. Once the liquid guiding valve group 220 is opened, the other chemical liquid can immediately flow into the temporary storage area 200. At this time, the second chemical liquid may actually be undergoing a second process, so it will not affect the overall process efficiency.

[0067] Those skilled in the art will understand that the position and number of the first sensor 110 in the process cavity 100 and the second sensor 210 in the temporary storage area 200 are not limited by… Figure 1 As shown in the image. Figure 1 The structure described herein is merely a non-limiting embodiment provided by the present invention, intended to clearly illustrate the main concept of the invention and provide a specific solution that is easy for the public to implement, rather than being used to limit the scope of protection of the invention. Optionally, in some other embodiments, those skilled in the art can also, based on the concept of the present invention, employ multiple first sensors 110 and multiple second sensors 210, respectively arranged at multiple locations in the detection area, i.e., the process chamber 100 and the temporary storage area 200, or at lower elevation locations, to provide real-time feedback on the presence of liquid within the detection area.

[0068] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0069] In summary, the present invention provides a chemical liquid discharge control system, a chemical liquid discharge method, a semiconductor cleaning device, and a computer-readable storage medium, which can not only classify and discharge different chemical liquids to reduce waste liquid pollution, but also improve overall process efficiency and shorten the chemical liquid discharge time.

[0070] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chemical liquid discharge control system, applied in semiconductor cleaning equipment, characterized in that, include: A first sensor is disposed inside the process chamber to detect whether a chemical liquid exists inside the process chamber, wherein the chemical liquid includes at least a first chemical liquid and a second chemical liquid; A discharge valve assembly is located downstream of a temporary storage area for receiving chemical liquid flowing in from the process chamber. The temporary storage area includes at least a first discharge valve and a second discharge valve, wherein the first discharge valve is opened to discharge the first type of chemical liquid, and the second discharge valve is opened to discharge the second type of chemical liquid. A liquid guiding valve assembly, disposed between the process chamber and the temporary storage area, is used to control the flow of chemical liquid from the process chamber into the temporary storage area. When the first sensor detects the presence of the first chemical liquid in the process chamber, the liquid guiding valve assembly is opened to allow the first chemical liquid to flow into the temporary storage area. When the first sensor does not detect the first chemical liquid, the liquid guiding valve assembly is closed, and the second chemical liquid is introduced into the process chamber. A second sensor is located in the temporary storage area. When the second sensor detects that there is no first chemical liquid in the temporary storage area, the first discharge valve is closed.

2. The emission control system as described in claim 1, characterized in that, The process chamber includes a wafer stage and a nozzle. The wafer stage is used to hold the wafer to be processed, and the nozzle is used to provide the corresponding chemical solution to the wafer in the process chamber according to the process requirements.

3. The emission control system as described in claim 1, characterized in that, The end of the discharge valve assembly is connected to the discharge tank assembly to classify and discharge different chemical liquids. The end of the first discharge valve is connected to the first discharge tank to receive the discharge of the first type of chemical liquid, and the end of the second discharge valve is connected to the second discharge tank to receive the discharge of the second type of chemical liquid.

4. A method for discharging a chemical liquid, characterized in that, The chemical liquid discharge operation is performed using the chemical liquid discharge control system as described in claim 3, wherein the chemical liquid discharge method includes the following steps: The first chemical liquid is introduced into the process chamber to carry out the first process; In response to the first sensor detecting the presence of the first chemical liquid in the process chamber, the liquid guiding valve assembly is opened to allow the first chemical liquid to flow into the temporary storage area; When the first sensor does not detect the first chemical liquid, the liquid guiding valve group is closed, and the second chemical liquid is introduced into the process chamber; The second sensor continuously detects whether the first type of chemical liquid flowing from the process chamber exists in the temporary storage area; and In response to the absence of the first chemical liquid in the temporary storage area, the first discharge valve is closed.

5. The emission method as described in claim 4, characterized in that, After the step of continuously detecting whether the first chemical liquid flowing down from the process chamber exists in the temporary storage area using the second sensor, the method further includes: In response to the second sensor detecting the presence of the first chemical liquid in the temporary storage area, the first discharge valve is opened to discharge the first chemical liquid into the corresponding first discharge tank via the first discharge valve.

6. The emission method as described in claim 4, characterized in that, The step of closing the first discharge valve in response to the absence of the first chemical liquid detected in the temporary storage area includes: In response to the second sensor detecting that there is no first chemical liquid in the temporary storage area, the first discharge valve is closed; The second chemical liquid is introduced into the process chamber to carry out the second process; In response to the completion of the second process, it is detected whether the first discharge valve is closed; and In response to the first discharge valve being closed, the liquid guiding valve assembly is opened to allow the second chemical liquid in the process chamber to flow into the temporary storage area.

7. A semiconductor cleaning apparatus, characterized in that, include: The process chamber is used to introduce various chemical liquids to perform various processing on the wafers inside. A temporary storage area, located downstream of the process chamber, is used to receive the chemical liquid flowing out of the process chamber; A discharge valve assembly, located downstream of the temporary storage area, includes at least a first discharge valve and a second discharge valve, wherein the first discharge valve is opened to discharge the first chemical liquid, and the second discharge valve is opened to discharge the second chemical liquid; Memory; and A processor, connected to the memory, and configured to implement the method for discharging the chemical liquid as described in any one of claims 4 to 6.

8. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the method for discharging the chemical liquid as described in any one of claims 4 to 6 is implemented.

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