Wafer rotating mechanism and wafer processing device

Abstract

The invention discloses a wafer rotating mechanism and a wafer processing device. The wafer rotating mechanism comprises a driving wheel assembly and a driven wheel assembly, the driving wheel assembly comprises a front gland, a rear gland and a driving wheel, the front gland and the rear gland are matched to clamp the driving wheel between the front gland and the rear gland, the side edge of the driving wheel is provided with an annular clamping groove, the annular clamping groove is used for abutting against a wafer and driving the wafer to rotate, and the annular clamping groove is made of elastic materials. The annular clamping groove comprises two opposite side walls used for limiting the wafer, and the inner sides of the side walls are provided with inclined guide surfaces.

Description

[0001] This application is a divisional application of the invention patent application filed on July 25, 2022 with application number 202210874101.6. Technical Field

[0002] The invention relates to the technical field of wafer cleaning, and in particular to a wafer rotating mechanism and a wafer processing device. Background Art

[0003] In the semiconductor field, the cleanliness of the wafer surface is one of the important factors affecting the reliability of semiconductor devices. In the wafer manufacturing process, such as deposition, plasma etching, photolithography, electroplating, etc., it is possible to introduce contamination and / or particles on the wafer surface, resulting in a decrease in the cleanliness of the wafer surface and a low yield of manufactured semiconductor devices. Chemical Mechanical Polishing (CMP) is a global flattening ultra-precision surface processing process. Due to the large amount of chemical reagents and abrasives used in chemical mechanical polishing, a large amount of abrasive particles and grinding by-products and other contaminants will remain on the wafer surface after polishing is completed. These contaminants will have an adverse effect on subsequent processes.

[0004] Therefore, during the wafer manufacturing process, multiple surface cleanings are required to remove pollutants such as metal ions, atoms, organic matter and particles attached to the wafer surface. In the scrubbing module used to clean the wafer, when the roller driving the wafer to rotate drives the wafer to rotate, the edge areas of the front and back sides of the wafer will collide and rub against the edge of the roller, causing the wear and tear on the wafer surface or the roller to spread with the liquid near the edge of the wafer and reach the internal area of ​​the front side of the wafer, causing the wafer to be contaminated again, affecting the final cleaning effect. Summary of the invention

[0005] The embodiments of the present invention provide a wafer rotating mechanism and a wafer processing device, aiming to solve at least one of the technical problems existing in the prior art.

[0006] A first aspect of an embodiment of the present invention provides a wafer rotation mechanism for supporting a wafer and driving the wafer to rotate, the mechanism comprising a driving wheel assembly and a driven wheel assembly;

[0007] The driving wheel assembly includes a front pressure cover, a rear pressure cover and a driving wheel. The front pressure cover and the rear pressure cover cooperate to clamp the driving wheel therebetween. The side edge of the driving wheel has an annular groove, which is used to abut the wafer and drive the wafer to rotate. The annular groove is made of elastic material. The annular groove includes two opposite side walls for limiting the wafer, and the inner side of the side wall has an inclined guide surface.

[0008] In one embodiment, the guide surfaces of the two opposite side walls are inclined from the edge of the annular groove toward the inner bottom surface with a tendency to approach each other.

[0009] In one embodiment, the side wall has a drainage groove extending from the edge to the center, and the length of the drainage groove is 0.5-5 mm.

[0010] In one embodiment, the drainage grooves of the two opposite side walls are arranged in a staggered manner.

[0011] In one embodiment, the bottom surface of the annular groove is provided with a plurality of concave-convex structures along the thickness direction.

[0012] In one embodiment, the concave-convex structure is communicated with the drainage groove.

[0013] In one embodiment, the depth of the annular groove is 0.5-5 mm, and the bottom width of the annular groove is 0.2-2 mm.

[0014] In one embodiment, the maximum diameter of the driving wheel is 30-90 mm, the maximum diameter of the front gland is 35-100 mm, and the maximum diameter of the rear gland is 35-100 mm.

[0015] In one embodiment, the front gland and the rear gland are provided with drainage openings corresponding to the positions of the drainage grooves.

[0016] In one embodiment, the front pressure cover and the rear pressure cover are provided with positioning structures for making the positions correspond during assembly.

[0017] A second aspect of an embodiment of the present invention provides a wafer processing device, comprising:

[0018] The wafer rotation mechanism as described above; and

[0019] A liquid supply component, used for supplying cleaning liquid to the surface of the wafer;

[0020] Two cleaning brushes are respectively arranged on both sides of the wafer and roll and brush the surface of the wafer;

[0021] The cleaning brush driving mechanism is used to support the cleaning brush and drive the cleaning brush to rotate and move.

[0022] The beneficial effects of the embodiments of the present invention include: enabling the wafer to contact with an elastic driving wheel, reducing wear under liquid lubrication, significantly reducing the amount of wear caused by collision and friction, and effectively reducing secondary pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings, but these drawings are only schematic and do not limit the scope of protection of the present invention, wherein:

[0024] Figure 1 A schematic structural diagram of a wafer processing device provided by an embodiment of the present invention;

[0025] Figure 2 A front view of a first driving wheel assembly provided in one embodiment of the present invention;

[0026] Figure 3 for Figure 2 A cross-sectional view of the first driving wheel assembly;

[0027] Figure 4 A three-dimensional diagram of a first driving wheel provided in one embodiment of the present invention;

[0028] Figure 5 for Figure 4 A side view of the first driving wheel;

[0029] Figure 6 for Figure 4 An exploded view of the first driving wheel;

[0030] Figure 7 A partial schematic diagram of a first active wheel clamping a wafer is shown;

[0031] Figure 8 A driving wheel provided by an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0032] The technical scheme of the present invention is described in detail below in conjunction with specific embodiments and their accompanying drawings. The embodiments recorded herein are specific embodiments of the present invention, which are used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be understood as limitations on the embodiments of the present invention and the scope of protection of the present invention. It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. In addition to the embodiments recorded herein, those skilled in the art can also adopt other obvious technical solutions based on the contents disclosed in the claims of this application and its specification, which include technical solutions that adopt any obvious replacements and modifications to the embodiments recorded herein. It should be understood that, unless otherwise specified, for ease of understanding, the following description of the specific embodiments of the present invention is based on the description of the relevant equipment, devices, components, etc. in the original static natural state without external control signals and driving forces.

[0033] In addition, it should be noted that the terms used in this application to indicate orientation, such as front, back, up, down, left, right, top, bottom, front, back, horizontal, vertical, etc., are merely for convenience of description to help understand relative positions or directions, and are not intended to limit the orientation of any device or structure.

[0034] In order to illustrate the technical solution of the present invention, the following description will be given with reference to the accompanying drawings and in combination with embodiments.

[0035] In this application, chemical mechanical polishing is also referred to as chemical mechanical planarization, and wafer is also referred to as chip, silicon wafer, base wafer or substrate, etc., and their meanings and actual functions are equivalent.

[0036] like Figure 1 As shown, the first embodiment of the present invention provides a wafer processing device 1 for cleaning a wafer w, including: a box 10, a wafer rotating mechanism 20, two cleaning brushes 40, a cleaning brush driving mechanism 30 and a liquid supply component 60, etc.

[0037] like Figure 1 As shown, a wafer processing chamber is formed inside the housing 10 to provide an environment for processing wafers w.

[0038] like Figure 1 As shown, the wafer rotating mechanism 20 is used to support the wafer w and drive the wafer w to rotate in a vertical plane. The wafer rotating mechanism 20 is fixed on the box 10 and extends into the wafer processing chamber. The wafer w to be cleaned is supported by the wafer rotating mechanism 20 and rotates in a vertical plane around a horizontal axis. The rotation speed of the wafer w is 1 to 200 rpm, preferably 5 to 50 rpm.

[0039] In one embodiment, the wafer rotation mechanism 20 includes two driving wheel assemblies 70 and a driven wheel assembly 80 for supporting the wafer w, and the two driving wheel assemblies 70 include a first driving wheel assembly 70a and a second driving wheel assembly 70b. The two driving wheel assemblies 70 play a driving role and use a motor to rotate the wafer w. Figure 1 As shown, the angle formed by the two driving wheel assemblies 70 relative to the center of the wafer w is less than 180°. The driven wheel assembly 80 is arranged between the two driving wheel assemblies 70 to play the role of auxiliary support and speed measurement.

[0040] like Figure 1 and Figure 2As shown, in one embodiment, the driving wheel assembly 70 and the driven wheel assembly 80 are fixed on the box 10 and extend into the wafer processing chamber. The driving wheel assembly 70 and the driven wheel assembly 80 are arranged along the outer edge contour of the wafer w, the driven wheel assembly 80 is located in the middle, and the driving wheel assembly 70 is symmetrically arranged on both sides of the driven wheel assembly 80. The driving wheel assembly 70 includes a driving motor 72 and a driving wheel for contacting the wafer. The driving wheel assembly 70 is configured with a driving motor 72, and the driving motor 72 drives the driving wheel to rotate, and the friction between the outer edge of the wafer w and the driving wheel drives the wafer w to rotate around its axis.

[0041] In one embodiment, a rotation speed sensor for detecting the rotation speed of the wafer w is disposed on the driven wheel assembly 80 , and the rotation speed sensor can be implemented by a Hall sensor or a photoelectric switch sensor.

[0042] like Figure 1 As shown, two cleaning brushes 40 are respectively arranged on the front and rear sides of the wafer w and roll to scrub the surface of the wafer w, wherein the two cleaning brushes 40 roll in opposite directions. The two cleaning brushes 40 are respectively a first cleaning brush and a second cleaning brush, which are respectively arranged on the front and rear sides of the wafer w to be cleaned and can roll around their own axes to contact the surface of the wafer w to be cleaned for scrubbing. The cleaning brush 40 is a cylindrical roller structure, which is made of a material with good water absorption, such as polyvinyl alcohol (PVA).

[0043] In one embodiment, a liquid inlet mechanism 50 is further included which is connected to one end of the cleaning brush 40. Liquid is continuously supplied to the cleaning brush 40 through the liquid inlet mechanism 50 so that the cleaning brush 40 is kept moist. The cleaning brush 40 is made of a porous material and can absorb a large amount of liquid. The liquid can be an acidic or alkaline solution or deionized water. The liquid inlet mechanism 50 is connected to the liquid inlet end of the cleaning brush 40 to fill the cleaning brush 40 with liquid. After the cleaning brush 40 is filled with liquid, it becomes soft and can be used to clean the wafer w. Therefore, the cleaning brush 40 needs to be kept filled with liquid at all times during the cleaning process.

[0044] The cleaning brushes 40 located on both sides of the wafer w can move in the horizontal direction to move away from or approach the wafer w. When the cleaning brush 40 moves away from the wafer w, a certain gap is reserved between the cleaning brush 40 and the wafer w, and the wafer handling robot can clamp the wafer w to take away the wafer w that has been cleaned; when the cleaning brush 40 moves close to the wafer w, the cleaning brush 40 abuts against the wafer w and cleans the surface of the wafer w in a contact manner.

[0045] like Figure 1 As shown, the cleaning brush driving mechanism 30 is used to drive two cleaning brushes 40 to move toward each other and clamp the wafer w at a certain angle for rolling brushing. The cleaning brush driving mechanism 30 includes a cleaning brush rotation driving module and a cleaning brush horizontal driving module.

[0046] The cleaning brush rotation driving module is used to support two cleaning brushes 40 located on both sides of the wafer w to be cleaned, and drive the cleaning brushes 40 to rotate.

[0047] The cleaning brush horizontal driving module is connected to the cleaning brush rotation driving module to drive the cleaning brush rotation driving module and the cleaning brush 40 thereon to move as a whole. The cleaning brush horizontal driving module may include a guide rail, a lead screw and a driving member, the guide rail and the lead screw are respectively connected to the cleaning brush rotation driving module to move the cleaning brush rotation driving module along the guide rail under the drive of the lead screw, the driving member is arranged at the end of the lead screw, and the driving member drives the lead screw to move, thereby driving the cleaning brush support assembly and the cleaning brush 40 to move as a whole, so that both ends of the cleaning brush 40 are in contact with or away from the wafer w at the same time. Furthermore, lead screws are respectively arranged at both ends of the cleaning brush 40, so that the moving distances of the two ends of the cleaning brush 40 can be adjusted respectively.

[0048] In one embodiment, a displacement sensor is provided on the cleaning brush rotation drive module for measuring the distance between the two cleaning brushes.

[0049] like Figure 1 As shown, the liquid supply assembly 60 is used to supply cleaning liquid to the upper area of ​​the surface of the wafer w above the cleaning brush 40. The supply angle of the cleaning liquid relative to the surface of the wafer w is 5° to 30°. The liquid supply assembly 60 is connected to the fluid source through a delivery pipeline.

[0050] Combine the following Figure 1 Briefly describe the wafer cleaning operation method.

[0051] First, the robot places the wafer w to be cleaned on the wafer rotating mechanism 20. At this time, a certain distance is reserved between the cleaning brush 40 and the side of the wafer w, so as to provide working space for the robot. Under the action of friction, the wafer rotating mechanism 20 drives the wafer w to rotate around its axis.

[0052] Next, the liquid supply assembly 60 sprays a cleaning liquid, such as an acidic or alkaline cleaning liquid, toward the rotating wafer w;

[0053] Next, the cleaning brush 40 rolls around its axis and moves toward the position of the wafer w, so that the cleaning brush 40 contacts the surface of the wafer w; the cleaning brush 40 rolls and scrubs the surface of the wafer w to remove pollutants on the surface of the wafer w, thereby scrubbing the surface of the wafer w;

[0054] After the wafer w is scrubbed, the cleaning brush 40 moves toward the outside of the wafer w, and the cleaning brush 40 is separated from the surface of the wafer w;

[0055] Next, the liquid supply assembly 60 continues to spray the cleaning liquid toward the rotating wafer w. After a period of time, the robot transfers the cleaned wafer w to the next process.

[0056] like Figure 2 and Figure 3 As shown, in one embodiment of the present invention, the first driving wheel assembly 70 a includes a first driving wheel 71 , a driving motor 72 , a first pulley 73 , a first rotating shaft 74 and a first fixed sleeve 75 .

[0057] The first driving wheel 71 is an example of a driving wheel.

[0058] like Figure 3 As shown, the shaft end of the driving motor 72 is fixed with a first pulley 73 and connected to the first rotating shaft 74, so that the driving motor 72 drives the first pulley 73 and the first rotating shaft 74 to rotate. The first rotating shaft 74 is fixedly connected to the first driving wheel 71, driving the first driving wheel 71 to rotate. A bearing is sleeved on the first rotating shaft 74. The first fixed sleeve 75 is sleeved on the outer peripheral side of the first rotating shaft 74, and the first fixed sleeve 75 and the first rotating shaft 74 are connected through a bearing.

[0059] It can be understood that the first pulley 73 of the first driving wheel assembly 70a is connected to the second driving wheel assembly 70b through a synchronous belt (not shown), so that the driving motor 72 drives the first driving wheel assembly 70a and the second driving wheel assembly 70b to rotate synchronously, which can improve the motor utilization rate.

[0060] like Figures 3 to 6 As shown, in one embodiment, the first driving wheel 71 includes a front pressure cover 76, a rear pressure cover 77 and a driving wheel 78, and the front pressure cover 76 and the rear pressure cover 77 cooperate to clamp the driving wheel 78 therebetween. The first rotating shaft 74 passes through the front pressure cover 76, the rear pressure cover 77 and the driving wheel 78 and is clamped.

[0061] like Figure 7 and Figure 8 As shown, in one embodiment, the side edge of the driving wheel 78 has an annular groove 781 for supporting the wafer w, and the annular groove 781 is arranged around the outer circumference of the driving wheel 78. The annular groove 781 is used to abut against the wafer and drive the wafer to rotate. The wafer w placed on the wafer rotating mechanism 20 is limited by the annular groove 781, and the outer edge of the wafer w is arranged tangent to the bottom surface of the annular groove 781.

[0062] The annular groove 781 is made of elastic material, specifically, polyurethane, rubber and other materials.

[0063] like Figure 7 and Figure 8 As shown, in one embodiment, the annular groove 781 includes two opposite side walls 782 for limiting the wafer w. Figure 7As shown, during operation, the robot places the wafer w in the annular slot 781, and the wafer w is placed between two side walls 782. The side walls 782 are made of elastic material, specifically, polyurethane, rubber and other materials. Wafer w may swing back and forth during rotation. When it comes into contact with the elastic side walls 782, the wear will be significantly reduced under the lubrication of the cleaning liquid, and the amount of wear caused by collision and friction will be significantly reduced, effectively reducing secondary pollution.

[0064] like Figure 7 As shown, in one embodiment, the inner side of the side wall 782 has an inclined guide surface 783. The guide surfaces 783 of the two opposite side walls 782 are inclined from the edge of the annular groove 781 toward the inner bottom surface with a tendency to approach each other. When the robot puts the wafer w into the annular groove 781, the guide surface 783 can guide the wafer w to enter the bottom of the groove between the two side walls 782 more easily.

[0065] The outer diameter d of the driving wheel 78 1 30~90mm.

[0066] The depth h of the annular groove 781 1 is 0.5 to 5 mm, and the bottom width of the annular groove 781 is l 1 0.2~2mm.

[0067] The vertical height h of the guide surface 783 2 / Depth h of the annular groove 781 1 =0.2~0.7, the inclination angle θ of the guide surface 783 relative to the vertical direction is 15°~45°.

[0068] like Figure 8 As shown, in one embodiment, the side wall 782 has a radial drainage groove 784 extending from the edge to the center. Specifically, the depth of the drainage groove 784 along the radial direction is 0.5-5 mm.

[0069] The drainage grooves 784 of the two opposite side walls 782 are arranged in a staggered manner, which is beneficial to retain more drainage grooves 784 while making the side walls 782 of the driving wheel 78 have better structural strength, making the side walls 782 less likely to deform, and also facilitating the timely discharge of pollutants at the position where the surface of the side wall 782 contacts the wafer w. It can be understood that the drawings only show an example of staggered arrangement of the drainage grooves 784, and the drainage grooves 784 can also be arranged in a mirror image, symmetrical on both sides.

[0070] like Figure 5As shown, in one embodiment, the bottom surface of the annular groove 781 is provided with a concave-convex structure 785. The concave parts of the concave-convex structure 785 are distributed along the axial direction and are perpendicular to the circumference of the annular groove 781. The concave-convex structure 785 can be used to guide water, which is conducive to discharging the liquid in the annular groove 781, and can also increase the friction between the bottom surface of the annular groove 781 and the wafer w, avoiding relative sliding between the bottom surface and the wafer w, thereby driving the wafer w to rotate more stably.

[0071] like Figure 8 As shown, the concavo-convex structure 785 on the bottom surface of the annular groove 781 is connected to the drainage groove 784 provided on the side wall 782 of the annular groove 781, so that the liquid accumulated in the annular groove 781 can flow to both sides along the concavo-convex structure 785 and then flow out from the drainage groove 784. Furthermore, since the drainage grooves 784 on both sides are arranged in a staggered manner, and the concavo-convex structures 785 correspond to the drainage grooves 784 one by one, the number of concavo-convex structures 785 is twice the number of drainage grooves 784 on one side. This staggered arrangement increases the number of concavo-convex structures 785, which is more conducive to liquid drainage and increases the friction between the wafer w. If the drainage grooves 784 on both sides are arranged in a mirror image, the number of concavo-convex structures 785 can only be equal to the number of drainage grooves 784 on one side, and the number becomes less, which is not conducive to liquid drainage and may cause slippage.

[0072] The concave cross section of the concave-convex structure 785 is semicircular, or may be rectangular, inverted trapezoidal, inverted triangle, or other shapes that are wide at the top and narrow at the bottom, or have equal widths at the top and bottom, preferably semicircular. Figure 5 As shown, the semicircular diameter d of the concave-convex structure 785 is 2 (or the widest part of other cross-sections) is in the range of 0.5 to 5 mm. In addition, the radial depth of the concave-convex structure 785 is 0.5 to 5 mm. The bottom shape of the cross-section of the drainage groove 784 is consistent with the cross-section shape of the concave-convex structure 785. The shape above the bottom of the drainage groove 784 is formed by stretching and cutting in the direction of increasing the wheel diameter according to the widest part of the bottom shape.

[0073] like Figure 6 and Figure 7 As shown, the front pressure cover 76 and the rear pressure cover 77 are provided with drainage ports 761 and 771 corresponding to the positions of the drainage grooves 784 of the driving wheels 78, so as to facilitate smooth drainage and timely discharge of waste liquid.

[0074] The front pressure cover 76 and the rear pressure cover 77 can be formed / made of plastic materials such as PPS, PEEK, PVDF, etc., with an outer diameter of 35 to 100 mm and a height of 1 to 5 mm above the driving wheel 78.

[0075] The circumferential width of the drain ports 761 and 771 is 0.5 to 8 mm, and the radial depth of the drain ports 761 and 771 is 2 to 12 mm.

[0076] Further, if Figure 6 As shown, the front gland 76 and the rear gland 77 are provided with a positioning structure 772, and the positioning structure 772 includes a positioning hole 772 of the rear gland 77 and a positioning pin (not shown) on the front gland 76, which is used to make the positions correspond during assembly. After installation according to the positioning structure 772, the drain outlet 761 of the front gland 76 and the drain outlet 771 of the rear gland 77 can respectively face the drain groove 784 of the two side walls 782 of the driving wheel 78. In other words, the drain outlet 761 of the front gland 76 and the drain outlet 771 of the rear gland 77 are staggered and arranged one by one according to the arrangement mode, spacing and width of the drain groove 784. Specifically, as Figure 6 As shown, the positioning structure 772 includes at least one pair of positioning pins (not shown) and positioning holes 772, which are respectively arranged on the opposite surfaces of the front pressure cover 76 and the rear pressure cover 77. During assembly, the positioning pins are inserted into the positioning holes 772 to achieve positioning.

[0077] Accordingly, in one embodiment of the present invention, the second driving wheel assembly 70b includes a second driving wheel, a second pulley, a second rotating shaft and a second fixed sleeve. The second driving wheel is another example of a driving wheel.

[0078] The structure of the second driving wheel may be the same as that of the first driving wheel 71 .

[0079] The second pulley is connected to the first pulley 73 through a conveyor belt, so that the first pulley 73 drives the second pulley to rotate. The second pulley is fixedly connected to the second rotating shaft, and the second rotating shaft is fixedly connected to the second driving wheel, driving the second driving wheel to rotate. The second fixed sleeve is sleeved on the outer peripheral side of the second rotating shaft, and the second fixed sleeve and the second rotating shaft are connected through a bearing.

[0080] In one embodiment, the second driving wheel also includes a front gland, a rear gland and a driving wheel, and the front gland and the rear gland cooperate to clamp the driving wheel therebetween. The second rotating shaft passes through the front gland, the rear gland and the driving wheel and clamps them. The structure and size of the front gland, the rear gland and the driving wheel of the second driving wheel are exactly the same as those of the front gland 76, the rear gland 77 and the driving wheel 78 of the first driving wheel 71, and are not repeated here.

[0081] In summary, the wafer rotation mechanism provided in the embodiment of the present invention can realize the contact between the wafer and the elastic driving wheel, reduce wear under the lubrication of liquid, significantly reduce the amount of wear caused by collision and friction, effectively reduce secondary pollution, enhance the waste liquid discharge capacity of the front and rear pressure covers, significantly reduce the number of surface particles after wafer cleaning, and significantly improve the wafer cleaning effect.

[0082] The drawings of this specification are schematic diagrams, which assist in explaining the concept of the present invention and schematically show the shapes of various parts and their mutual relationships. It should be understood that in order to clearly show the structures of various components of the embodiments of the present invention, the drawings are not drawn according to the same scale, and the same reference numerals are used to represent the same parts in the drawings.

[0083] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0084] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer rotation mechanism, characterized in that, it is used to support the wafer and drive the wafer to rotate, and the mechanism includes a driving wheel assembly and a driven wheel assembly; The driving wheel assembly includes a front gland, a rear gland and a driving wheel. The front gland and the rear gland cooperate to clamp the driving wheel between them. The side edge of the driving wheel has an annular groove, and the annular groove is used to abut against the wafer and drive the wafer to rotate. The annular groove is made of an elastic material. The annular groove includes two opposite side walls for limiting the wafer. The inner side of the side wall has an inclined guiding surface, so that the wafer reduces wear during the contact with the driving wheel assembly; The side wall has a drainage groove extending from the edge to the center, and the drainage groove communicates with the bottom surface of the annular groove. The drainage grooves of the two opposite side walls are arranged staggeredly, so that the pollutants on the side wall in contact with the wafer are discharged.

2. The wafer rotation mechanism according to claim 1, characterized in that, the guiding surfaces of the two opposite side walls are inclined from the edge of the annular groove towards the inner bottom surface in a trend of approaching each other.

3. The wafer rotation mechanism according to claim 2, characterized in that, the bottom surface of the annular groove is provided with a plurality of concave-convex structures in the thickness direction.

4. The wafer rotation mechanism according to claim 3, characterized in that, the concave-convex structures correspond to the drainage grooves one by one.

5. The wafer rotation mechanism according to claim 4, characterized in that, the concave-convex cross-section of the concave-convex structure is wider at the top and narrower at the bottom or has the same width at the top and bottom.

6. The wafer rotation mechanism according to claim 5, characterized in that, the shape of the bottom of the cross-section of the drainage groove is the same as the shape of the cross-section of the concave-convex structure, and the shape above the bottom of the cross-section of the drainage groove is formed by stretching and cutting from the widest part of the bottom shape in the direction of increasing wheel diameter.

7. The wafer rotation mechanism according to claim 1, characterized in that, the depth of the annular groove is 0.5 - 5 mm, the bottom width of the annular groove is 0.2 - 2 mm, and the length of the drainage groove in the extending direction is 0.5 - 5 mm.

8. The wafer rotation mechanism according to any one of claims 1 - 7, characterized in that, the front gland and the rear gland are provided with drainage ports.

9. The wafer rotation mechanism according to claim 8, characterized in that, the front gland and the rear gland are provided with positioning structures for making the drainage ports of the front gland and the rear gland respectively face the drainage grooves of the side walls during assembly.

10. A wafer processing device, characterized in that, it includes: the wafer rotation mechanism according to any one of claims 1 to 9; and, a liquid supply assembly for supplying a cleaning liquid to the surface of the wafer; two cleaning brushes respectively arranged on both sides of the wafer and performing rolling brushing on the surface of the wafer; a cleaning brush driving mechanism for supporting the cleaning brush and driving the cleaning brush to rotate and move.

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