A chip gripping device and chip gripping method

Abstract

This application discloses a chip gripping device and a chip gripping method. The chip gripping device includes a support component, multiple gripper assemblies, multiple first pushing components, a sliding component, and a driving component. Each first pushing component is connected to a corresponding gripper assembly. When the driving component moves to any first pushing component, it drives the first pushing component to cause the gripper assembly corresponding to the first pushing component to grip the chip. By using multiple gripper assemblies and corresponding first pushing components, precise control of a single chip is achieved, improving the accuracy of gripping a single chip and enhancing the overall reliability and flexibility of the chip gripping device.

Description

Technical Field

[0001] This application relates to the field of chips, and in particular to a chip clamping device and a chip clamping method. Background Technology

[0002] In the field of semiconductor chip manufacturing and testing, a bare die refers to a chip that has been tested and diced after being produced in a wafer fab but has not yet been packaged. Bare dies are susceptible to damage from external environmental factors such as temperature, impurities, and physical forces. Therefore, bare dies need to be handled and manipulated carefully to avoid damage and failure.

[0003] Existing chip gripping devices typically operate by moving multiple grippers simultaneously, but this design has some limitations. When multiple grippers move at the same time, the accuracy of gripping a single chip is low, and the overall reliability and flexibility of the chip gripping device are also low. Summary of the Invention

[0004] This application mainly provides a chip gripping device and chip gripping method to solve the problem of low accuracy in gripping a single chip when multiple grippers move simultaneously.

[0005] This application provides a chip gripping device, comprising:

[0006] Support components;

[0007] Multiple gripper assemblies are spaced apart on the support assembly along a first direction;

[0008] Multiple first pushing components, each first pushing component being connected to a corresponding gripper component, are used to push the corresponding gripper component to move in a second direction of the support component, the second direction being perpendicular to the first direction;

[0009] A sliding component is fixed to the support component and located on the side of the first pushing component away from the gripper component;

[0010] A driving component is disposed on the sliding component, and the sliding component is used to drive the driving component to move relative to the plurality of first pushing components along the first direction;

[0011] When the driving component moves to any of the first pushing components, the driving component drives the first pushing component to move away from the sliding component, so that the gripper component corresponding to the first pushing component can perform chip gripping.

[0012] The support component has a first surface and a second surface disposed opposite to each other. The plurality of gripper components are respectively disposed on the first surface and the second surface. The drive component includes a drive member and a first pressing member. The drive member is disposed on the sliding component. The first pressing member is connected to the drive member, located on one side of the first surface, and located between the drive member and the plurality of first pushing components disposed on the first surface. The drive member is used to drive the first pressing member to move toward the first pushing components.

[0013] The driving component further includes a second pressing member, which is connected to the driving component, located on one side of the second surface, and between the driving component and a plurality of first pushing components disposed on the second surface. The first pressing member and the second pressing member are arranged in parallel, and the driving component is used to drive the first pressing member and the second pressing member to move toward the first pushing component.

[0014] When the first pressing member moves above any of the first pushing components, the driving member drives the first pressing member and the second pressing member to move closer to the first pushing component. The first pressing member presses the corresponding first pushing component, so as to control the corresponding gripper component to pick up the chip through the first pushing component.

[0015] When the second pressing member moves above any of the first pushing components, the driving member drives the first pressing member and the second pressing member to move closer to the first pushing component. The first pressing member presses the corresponding first pushing component, and the second pressing member presses the corresponding first pushing component, so as to control the corresponding gripper component to clamp the chip through the first pushing component.

[0016] The chip gripping device further includes a second pushing component and a third pushing component. The second pushing component is disposed on the first surface and connected to a plurality of first pushing components on the first surface. The third pushing component is disposed on the second surface and connected to a plurality of first pushing components on the second surface. The second pushing component and the third pushing component are arranged in parallel. When the first pressing member and the second pressing member move to the second pushing component and the third pushing component respectively, the driving member drives the first pressing member and the second pressing member. The first pressing member presses the second pushing component, and the second pressing member presses the third pushing component, so as to control the corresponding gripper component to grip the chip through the second pushing component and the third pushing component.

[0017] The chip gripping device includes multiple limiting parts, and each of the first pushing components is correspondingly provided with a limiting part, the limiting part being located at one end of the first pushing component near the gripper component;

[0018] The second pushing component includes a first pushing member and a first limiting member. The first limiting member is disposed on the first surface. The first pushing member is fixed to the first limiting member. One end of a plurality of first pushing components on the first surface away from the gripper component passes through the first limiting member. The limiting portion of the plurality of first pushing components is connected to the first limiting member.

[0019] The third pushing component includes a second pushing member and a second limiting member. The second limiting member is disposed on the second surface, and the second pushing member is fixed on the second limiting member. One end of a plurality of first pushing components on the second surface away from the gripper component passes through the second limiting member, and the limiting portion of the plurality of first pushing components is connected to the second limiting member.

[0020] When the first pressing member and the second pressing member move to the first pushing member and the second pushing member respectively, the driving member drives the first pressing member and the second pressing member to press the first pushing member and the second pushing member respectively. The first pushing member simultaneously pushes a plurality of first pushing components located on the first surface, and the second pushing member simultaneously pushes a plurality of first pushing components located on the second surface, so that the plurality of gripper components perform chip gripping.

[0021] The chip gripping device further includes a carrier component, which is disposed below the support component and is used to support the chip gripped by the gripper component.

[0022] This application also provides a chip gripping method, which is applied to the above-mentioned chip gripping device, comprising:

[0023] Obtain the chip's position information, and control the gripper assembly to move above the chip's position based on the chip's position information;

[0024] The driving component is moved to the first pushing component corresponding to the gripper component by the sliding component;

[0025] The first pushing component is driven by the driving component, and the gripper component corresponding to the first pushing component grips the chip.

[0026] The beneficial effects of this application are as follows: The chip gripping device of this application includes a support component, multiple gripper assemblies, multiple first pushing components, a sliding component, and a driving component. Each first pushing component is connected to a corresponding gripper assembly. When the driving component moves to any first pushing component, it drives the first pushing component to cause the gripper assembly corresponding to the first pushing component to grip the chip. By using multiple gripper assemblies and corresponding first pushing components, precise control of a single chip is achieved, improving the accuracy of gripping a single chip and enhancing the overall reliability and flexibility of the chip gripping device. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0028] Figure 1 This is a front view of an embodiment of a chip gripping device provided in this application;

[0029] Figure 2 This is a rear view of an embodiment of a chip gripping device provided in this application;

[0030] Figure 3 This is a left view of an embodiment of a chip gripping device provided in this application;

[0031] Figure 4 yes Figure 1 Enlarged view of region A in the middle;

[0032] Figure 5 yes Figure 1 Enlarged view of region B in the middle;

[0033] Figure 6 yes Figure 2 Enlarged view of region C in the middle;

[0034] Figure 7 This is a top view of an embodiment of the carrier component provided in this application. Detailed Implementation

[0035] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0037] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.

[0038] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0039] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0040] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0041] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0042] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a connection between two components or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0043] Existing chip gripping devices typically operate by moving multiple grippers simultaneously, but this design has some limitations. When multiple grippers move at the same time, the accuracy of gripping a single chip is low, and the overall reliability and flexibility of the chip gripping device are also low.

[0044] This application provides a chip gripping device; please refer to [link / reference]. Figures 1-3 As shown, Figure 1 This is a front view of an embodiment of a chip gripping device provided in this application; Figure 2 This is a rear view of an embodiment of a chip gripping device provided in this application; Figure 3 This is a left view of an embodiment of a chip gripping device provided in this application; the chip gripping device 1 of this embodiment includes a support component 10, a plurality of gripper components 20, a plurality of first pushing components 30, a sliding component 40 and a driving component 50.

[0045] Support component 10 refers to the part or device in chip clamping device 1 used to support or fix the object.

[0046] Optionally, the support component 10 is a support plate for supporting multiple gripper components 20, multiple first push components 30, sliding components 40 and drive components 50.

[0047] The gripper assembly 20 is an important end effector in the field of industrial automation, mainly used in robots or other automated equipment to achieve precise gripping and handling of objects. Optionally, the gripper assembly 20 is used in the chip gripping device 1 to achieve precise gripping of chips.

[0048] Multiple gripper assemblies 20 are spaced apart on the support assembly 10 along a first direction.

[0049] Optionally, the first direction is the d1 direction, meaning that the plurality of gripper assemblies 20 are spaced apart on the support assembly 10 along the d1 direction. In other embodiments, the first direction is the d2 direction.

[0050] The first pushing component 30 refers to a part used to push or move an object.

[0051] Optionally, the first pushing component 30 is a push rod, one end of which is connected to the gripper assembly 20, and the connection method includes, but is not limited to, bolts, pins, and keyways; the other end of the push rod is the driven end, and when the driven end is driven, the first pushing component 30 pushes the connected gripper assembly 20 to move. In other embodiments, the first pushing component 30 is a push block or push plate, etc.

[0052] In this embodiment, the first pushing component 30 is connected to the gripper component 20 and is used to push the gripper component 20 to move in a second direction of the support component 10. The second direction is perpendicular to the first direction.

[0053] Optionally, the first direction is direction d1, and the second direction is direction d2. In other embodiments, the first direction is direction d2, and the second direction is direction d1.

[0054] Specifically, multiple gripper assemblies 20 are correspondingly connected to multiple first push assemblies 30, that is, each first push assembly 30 is connected to a corresponding gripper assembly 20. Each first push assembly 30 is used to push the corresponding gripper assembly 20 to move in the second direction of the support assembly 10.

[0055] The sliding component 40 refers to a part or structure that allows or enables relative sliding motion. The sliding component 40 is fixed to the support component 10 and is located on the side of the first push component 30 away from the gripper component 20.

[0056] Optionally, the sliding component 40 is a slide rail, fixedly connected to the support component 10, and located on the side of the plurality of first pushing components 30 away from the gripper component 20. The connection method between the sliding component 40 and the support component 10 includes, but is not limited to, bolts, welding, and pins. In other embodiments, the sliding component 40 is a slide table or a sliding bearing, etc.

[0057] The drive component 50 refers to the component or system that provides power and movement to the chip clamping device 1.

[0058] Optionally, the drive component 50 is an electric motor. In other embodiments, the drive component 50 is a cylinder, a pneumatic motor, or a pneumatic valve, etc.

[0059] The drive component 50 is disposed on the sliding component 40, and the sliding component 40 is used to drive the drive component 50 to move relative to the plurality of first push components 30 in a first direction.

[0060] Optionally, the sliding component 40 can be a slide rail and is located on the side of the plurality of first pushing components 30 away from the gripper component 20. The driving component 50 is disposed on the sliding component 40, that is, the driving component 50 is located on the side of the plurality of first pushing components 30 away from the gripper component 20, and the driving component 50 can move relative to the plurality of first pushing components 30 in a first direction via the sliding component 40.

[0061] Optionally, the sliding assembly 40 is provided with a slider (not shown in the figure), which can move on the sliding assembly 40 relative to the plurality of first pushing assemblies 30 in a first direction. The driving assembly 50 can be connected to the slider by means of bolts, pins or keyways, etc. The slider drives the driving assembly 50 to move on the sliding assembly 40 relative to the plurality of first pushing assemblies 30 in a first direction.

[0062] When the drive component 50 moves to any of the first push components 30, the drive component 50 drives the first push component 30 to move away from the sliding component 40, so that the gripper component 20 corresponding to the first push component 30 can perform chip gripping.

[0063] Specifically, the driving component 50 moves relative to the plurality of first pushing components 30 along a first direction via the sliding component 40. When it moves to any of the first pushing components 30, the driving component 50 drives the first pushing component 30 to move away from the sliding component 40. At this time, the gripper component 20 corresponding to the first pushing component 30 moves synchronously with the first pushing component 30 and performs chip gripping.

[0064] In this embodiment, the chip gripping device 1 includes a support component 10, multiple gripper components 20, multiple first pushing components 30, a sliding component 40, and a drive component 50. Each first pushing component 30 is connected to a corresponding gripper component 20. When the drive component 50 moves to any first pushing component 30 via the sliding component 40, the drive component 50 drives the first pushing component 30, causing the gripper component 20 corresponding to the first pushing component 30 to grip the chip. By using multiple gripper components 20 and corresponding first pushing components 30, precise control of a single chip is achieved, improving the accuracy of gripping a single chip and enhancing the overall reliability and flexibility of the chip gripping device.

[0065] According to some embodiments of this application, the support component 10 has a first surface 101 and a second surface 102 disposed opposite to each other, and a plurality of gripper components 20 are respectively disposed on the first surface 101 and the second surface 102.

[0066] Optionally, the first surface 101 is one side of the support component 10, and the second surface 102 is the other side of the support component 10, with the first surface 101 and the second surface 102 arranged opposite to each other.

[0067] Multiple gripper assemblies 20 are respectively disposed on the first surface 101 and the second surface 102 of the support assembly 10, for example Figures 1-3 As shown, eight gripper assemblies 20 are respectively disposed on the first surface 101 and the second surface 102 of the support assembly 10, with four gripper assemblies 20 on each of the first surface 101 and the second surface 102.

[0068] Correspondingly, multiple first pushing components 30 connected to multiple gripper components 20 are respectively disposed on the first surface 101 and the second surface 102 of the support component 10.

[0069] Please see Figure 4 As shown, Figure 4 yes Figure 1 An enlarged schematic diagram of region A in the middle. The driving component 50 includes a driving member 51 and a first pressing member 52. The driving member 51 is disposed on the sliding component 40, and the first pressing member 52 is connected to the driving member 51.

[0070] Optionally, the driving component 51 is a motor, and the first pressing component 52 is a pressing rod. One end of the first pressing component 52 is connected to the driving component 51, and the connection method includes, but is not limited to, screw drive or coupling. The other end of the first pressing component 52 acts on the first pushing assembly 30. In other embodiments, the driving component 51 is a cylinder, a pneumatic motor, or a pneumatic valve, and the first pressing component 52 is a pressing block or pressing plate.

[0071] Specifically, the first pressing member 52 is located on one side of the first surface 101 of the support assembly 10 and between the driving member 51 and a plurality of first pushing assemblies 30 disposed on the first surface 101. The driving member 51 is used to drive the first pressing member 52 to move toward the first pushing assembly 30 closer to the first surface 101.

[0072] According to some embodiments of this application, the drive assembly 50 further includes a second pressing member 53, which is connected to the drive member 51, located on one side of the second surface 102, and between the drive member 51 and a plurality of first pushing assemblies 30 disposed on the second surface 102. The first pressing member 52 and the second pressing member 53 are arranged in parallel, and the drive member 51 is used to drive the first pressing member 52 and the second pressing member 53 to move toward the first pushing assembly 30.

[0073] Optionally, the second pressing member 53 is a pressing rod. In other embodiments, the second pressing member 53 is a pressing block or a pressing plate.

[0074] Specifically, the first pressing member 52 is located on one side of the first surface 101 of the support assembly 10, and the second pressing member 53 is located on one side of the second surface 102 of the support assembly 10. The first pressing member 52 and the second pressing member 53 are arranged parallel to each other. Both the first pressing member 52 and the second pressing member 53 are connected to the driving member 51. The connection method between the second pressing member 53 and the driving member 51 is the same as that between the first pressing member 52 and will not be described again here.

[0075] The driving member 51 drives the first pressing member 52 and the second pressing member 53. The first pressing member 52 moves toward the first pushing component 30 closer to the first surface 101, and the second pressing member 53 moves toward the first pushing component 30 closer to the second surface 102.

[0076] In this embodiment, multiple gripper assemblies 20 are respectively disposed on the first surface 101 and the second surface 102 of the support assembly 10, and a first pressing member 52 and a second pressing member 53 are provided, respectively located on the first surface 101 and the second surface 102. The driving member 51 drives the first pressing member 52 and the second pressing member 53 to move towards the first pushing assembly 30. By disposing of multiple gripper assemblies 20 on the first surface 101 and the second surface 102, the operating range of the gripper assemblies 20 is increased, thereby improving the flexibility of the gripper assemblies 20 and increasing the efficiency of chip gripping.

[0077] According to some embodiments of this application, when the first pressing member 52 moves above any of the first pushing components 30, the driving member 51 drives the first pressing member 52 and the second pressing member 53 to move closer to the first pushing component 30. The first pressing member 52 presses the corresponding first pushing component 30 so as to control the corresponding gripper component 20 to perform chip gripping through the first pushing component 30.

[0078] Multiple gripper assemblies 20 are respectively disposed on the first surface 101 and the second surface 102, and multiple first pushing assemblies 30 are respectively disposed on the first surface 101 and the second surface 102. Optionally, the first pushing assemblies 30 on the first surface 101 and the first pushing assemblies 30 on the second surface 102 are alternately disposed. In other embodiments, the first pushing assemblies 30 on the first surface 101 and the first pushing assemblies 30 on the second surface 102 are correspondingly disposed.

[0079] Specifically, the first pressing member 52 is located on one side of the first surface 101. When the first pressing member 52 moves to any of the first pushing components 30 on the first surface 101, the driving member 51 simultaneously drives the first pressing member 52 and the second pressing member 53 to move closer to the first pushing component 30. At this time, the first pressing member 52 presses the corresponding first pushing component 30 on the first surface 101, and the first pushing component 30 pushes the corresponding gripper component 20 to clamp the chip. When the first pushing component 30 on the first surface 101 and the first pushing component 30 on the second surface 102 are staggered, the second pressing member 53 does not press the first pushing component 30 on the second surface 102, and the gripper component 20 on the second surface 102 does not clamp the chip.

[0080] According to some embodiments of this application, when the second pressing member 53 moves above any of the first pushing components 30, the driving member 51 drives the first pressing member 52 and the second pressing member 53 to move closer to the first pushing component 30. The first pressing member 52 presses the corresponding first pushing component 30, and the second pressing member 53 presses the corresponding first pushing component 30, so as to control the corresponding gripper component 20 to perform chip gripping through the first pushing component 30.

[0081] Specifically, when the second pressing member 53 moves to any of the first pushing components 30 on the second surface 102, the driving member 51 simultaneously drives the first pressing member 52 and the second pressing member 53 to move closer to the first pushing component 30. At this time, the second pressing member 53 presses the corresponding first pushing component 30 on the second surface 102, and the first pushing component 30 pushes the corresponding gripper component 20 to clamp the chip. When the first pushing component 30 on the first surface 101 and the first pushing component 30 on the second surface 102 are staggered, the first pressing member 52 does not press the corresponding first pushing component 30 on the first surface 101, and the first pushing component 30 on the first surface 101 does not clamp the chip; when the first pushing component 30 on the first surface 101 and the first pushing component 30 on the second surface 102 are correspondingly set, the first pressing member 52 presses the corresponding first pushing component 30 on the first surface 101, and the first pushing component 30 pushes the corresponding gripper component 20 to clamp the chip.

[0082] In this embodiment, the coordinated operation of the first pressing member 52 and the second pressing member 53 ensures that the gripper assembly 20 can accurately position and grip the chip, improving the accuracy of the operation. The first pressing member 52 and the second pressing member 53 operate on the first surface 101 and the second surface 102 of the support assembly 10, respectively, and can quickly and alternately grip the chip, thereby improving production efficiency.

[0083] According to some embodiments of this application, please refer to Figures 5-6 As shown, Figure 5 yes Figure 1 Enlarged view of region B in the middle; Figure 6 yes Figure 2 An enlarged schematic diagram of region C. The chip gripping device 1 of this embodiment further includes a second pushing component 60 and a third pushing component 70. The second pushing component 60 is disposed on the first surface 101 and connected to a plurality of first pushing components 30 on the first surface 101. The third pushing component 70 is disposed on the second surface 102 and connected to a plurality of first pushing components 30 on the second surface 102. The second pushing component 60 and the third pushing component 70 are arranged in parallel. When the first pressing member 52 and the second pressing member 53 move to the second pushing component 60 and the third pushing component 70 respectively, the driving member 51 drives the first pressing member 52 and the second pressing member 53. The first pressing member 52 presses the second pushing component 60, and the second pressing member 53 presses the third pushing component 70, thereby controlling the corresponding gripper component 20 to grip the chip through the second pushing component 60 and the third pushing component 70.

[0084] The second pushing component 60 is used to push the plurality of first pushing components 30 on the first surface 101; the third pushing component 70 is used to push the plurality of first pushing components 30 on the second surface 102.

[0085] Specifically, the second pushing component 60 is connected to a plurality of first pushing components 30 on the first surface 101, and the third pushing component 70 is connected to a plurality of first pushing components 30 on the second surface 102, and the second pushing component 60 and the third pushing component 70 are arranged in parallel.

[0086] Since the first pressing member 52 and the second pressing member 53 are arranged in parallel, when the first pressing member 52 moves to the second pushing component 60 on the first surface 101, the second pressing member 53 simultaneously moves to the third pushing component 70 on the second surface 102, and the driving member 51 drives the first pressing member 52 and the second pressing member 53. At this time, the first pressing member 52 presses the second pushing component 60, and the second pressing member 53 presses the third pushing component 70. The second pushing component 60 controls a plurality of first pushing components 30 connected to the second pushing component 60 on the first surface 101, and the third pushing component 70 controls a plurality of first pushing components 30 connected to the third pushing component 70 on the second surface 102. The plurality of first pushing components 30 on the first surface 101 and the second surface 102 push a plurality of gripper components 20 to grip the chip.

[0087] In this embodiment, a second pushing component 60 connected to a plurality of first pushing components 30 on the first surface 101 is provided, and a third pushing component 70 connected to a plurality of first pushing components 30 on the second surface 102 is provided. The second pushing component 60 and the third pushing component 70 are arranged in parallel. When the first pressing member 52 and the second pressing member 53 move to the second pushing component 60 and the third pushing component 70 respectively, the driving member 51 drives the first pressing member 52 and the second pressing member 53, and the plurality of gripper components 20 perform chip gripping. By setting the second pushing component 60 and the third pushing component 70, the plurality of gripper components 20 can perform chip gripping simultaneously, improving the overall working efficiency.

[0088] According to some embodiments of this application, the chip gripping device 1 includes a plurality of limiting parts 31, and each first pushing component 30 is provided with a corresponding limiting part 31. The limiting part 31 is located at one end of the first pushing component 30 near the gripper component 20.

[0089] Optionally, the limiting part 31 is a protruding structure.

[0090] The limiting part 31 refers to the structure used to limit the position of the second pushing component 60 and the third pushing component 70.

[0091] The second pushing component 60 includes a first pushing member 61 and a first limiting member 62. The first limiting member 62 is disposed on the first surface 101. The first pushing member 61 is fixed on the first limiting member 62. One end of a plurality of first pushing components 30 on the first surface 101 away from the gripper component 20 passes through the first limiting member 62. The limiting portion 31 of the plurality of first pushing components 30 is connected to the first limiting member 62.

[0092] Optionally, the first pushing member 61 is a push rod, and the first limiting member 62 is a limiting block. The first pushing member 61 is connected to the first limiting member 62 by means of bolts or pins, so that the first pushing member 61 is fixed on the first limiting member 62.

[0093] Optionally, the first limiting member 62 is provided with multiple through holes (not shown in the figure), the diameter of which is larger than the diameter of the first pushing assembly 30 but smaller than the diameter of the limiting portion 31 of the first pushing assembly 30. The ends of the multiple first pushing assemblies 30 on the first surface 101 that are away from the gripper assembly 20 pass through the multiple through holes into the first limiting member 62. Because the diameter of the through holes is smaller than the diameter of the limiting portion 31, the limiting portion 31 cannot pass through the through holes of the first limiting member 62. At this time, the first limiting member 62 contacts the limiting portions 31 of the multiple first pushing assemblies 30, and the limiting portions 31 restrict the position of the second pushing assembly 60.

[0094] Since the diameter of the through hole on the first limiting member 62 is larger than the diameter of the first pushing component 30, when the first pressing member 52 presses on any one of the first pushing components 30, the first pushing component 30 can move in the through hole to achieve the gripping of a single chip.

[0095] The third pushing component 70 includes a second pushing member 71 and a second limiting member 72. The second limiting member 72 is disposed on the second surface 102. The second pushing member 71 is fixed on the second limiting member 72. One end of a plurality of first pushing components 30 on the second surface 102 away from the gripper component 20 passes through the second limiting member 72. The limiting portion 31 of the plurality of first pushing components 30 is connected to the second limiting member 72.

[0096] Optionally, the second pushing member 71 is a push rod, and the second limiting member 72 is a limiting block. The second pushing member 71 is connected to the second limiting member 72 by means of bolts or pins, so that the second pushing member 71 is fixed on the second limiting member 72.

[0097] Optionally, the second limiting member 72 is provided with multiple through holes (not shown in the figure), the diameter of which is larger than the diameter of the first pushing assembly 30 but smaller than the diameter of the limiting portion 31 of the first pushing assembly 30. The ends of the multiple first pushing assemblies 30 on the second surface 102 that are away from the gripper assembly 20 pass through the multiple through holes into the second limiting member 72. Because the diameter of the through holes is smaller than the diameter of the limiting portion 31, the limiting portion 31 cannot pass through the through holes of the second limiting member 72. At this time, the second limiting member 72 contacts the limiting portions 31 of the multiple first pushing assemblies 30, and the limiting portions 31 restrict the position of the third pushing assembly 70.

[0098] Since the diameter of the through hole on the second limiting member 72 is larger than the diameter of the first pushing component 30, when the second pressing member 53 presses on any one of the first pushing components 30, the first pushing component 30 can move in the through hole to achieve the gripping of a single chip.

[0099] According to some embodiments of this application, when the first pressing member 52 and the second pressing member 53 move to the first pushing member 61 and the second pushing member 71 respectively, the driving member 51 drives the first pressing member 52 and the second pressing member 53 to press the first pushing member 61 and the second pushing member 71 respectively. The first pushing member 61 simultaneously pushes a plurality of first pushing components 30 located on the first surface 101, and the second pushing member 71 simultaneously pushes a plurality of first pushing components 30 located on the second surface 102, so that the plurality of gripper components 20 perform chip gripping.

[0100] Optionally, the second pushing component 60 and the third pushing component 70 are arranged in parallel, and the first pushing member 61 and the second pushing member 71 are arranged in parallel.

[0101] Specifically, when the first pressing member 52 moves to the first pushing member 61 and the second pressing member 53 moves to the second pushing member 71, the driving member 51 drives the first pressing member 52 and the second pressing member 53. The first pressing member 52 presses the first pushing member 61, and through the first limiting member 62 and the limiting portions 31 of the plurality of first pushing components 30 on the first surface 101, the first pushing member 61 simultaneously pushes the plurality of first pushing components 30 on the first surface 101; the second pressing member 53 presses the second pushing member 71, and through the second limiting member 72 and the limiting portions 31 of the plurality of first pushing components 30 on the second surface 102, the second pushing member 71 simultaneously pushes the plurality of first pushing components 30 on the second surface 102; the plurality of gripper assemblies 20 on the first surface 101 and the second surface 102 perform chip gripping.

[0102] Since the first pusher 61 and the second pusher 71 can be driven simultaneously, this design allows the chip gripping device 1 to complete more chip gripping tasks in a shorter time, thus improving operational efficiency.

[0103] According to some embodiments of this application, please refer to Figure 7 As shown, Figure 7 This is a top view of an embodiment of the carrier component provided in this application. The chip gripping device 1 of this embodiment also includes a carrier component 80, which is disposed below the support component 10 and is used to carry the chip (not shown) gripped by the gripper component 20.

[0104] The carrier component 80 refers to the component in the chip clamping device 1 used to support, carry, or fix the chip.

[0105] This application also provides a chip gripping method applied to the chip gripping device 1 described above, comprising: obtaining chip position information; controlling a gripper assembly to move above the chip position based on the chip position information; moving a driving assembly to a first pushing assembly corresponding to the gripper assembly via a sliding assembly; driving the first pushing assembly via the driving assembly, and gripping the chip via the gripper assembly corresponding to the first pushing assembly.

[0106] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A chip gripping device, characterized in that, include: Support components; Multiple gripper assemblies are spaced apart on the support assembly along a first direction; Multiple first pushing components, each first pushing component being connected to a corresponding gripper component, are used to push the corresponding gripper component to move in a second direction of the support component, the second direction being perpendicular to the first direction; A sliding component is fixed to the support component and located on the side of the first pushing component away from the gripper component; A driving component is disposed on the sliding component, and the sliding component is used to drive the driving component to move relative to the plurality of first pushing components along the first direction; When the driving component moves to any of the first pushing components, the driving component drives the first pushing component to move away from the sliding component, so that the gripper component corresponding to the first pushing component can perform chip gripping.

2. The chip clamping device according to claim 1, characterized in that, The support component has a first surface and a second surface disposed opposite to each other. The plurality of gripper components are respectively disposed on the first surface and the second surface. The drive component includes a drive member and a first pressing member. The drive member is disposed on the sliding component. The first pressing member is connected to the drive member, located on one side of the first surface, and located between the drive member and the plurality of first pushing components disposed on the first surface. The drive member is used to drive the first pressing member to move toward the first pushing components.

3. The chip clamping device according to claim 2, characterized in that, The driving assembly further includes a second pressing member connected to the driving member, located on one side of the second surface and between the driving member and a plurality of first pushing components disposed on the second surface. The first pressing member and the second pressing member are arranged in parallel. The driving member is used to drive the first pressing member and the second pressing member to move toward the first pushing component.

4. The chip clamping device according to claim 3, characterized in that, When the first pressing member moves above any of the first pushing components, the driving member drives the first pressing member and the second pressing member to move closer to the first pushing component. The first pressing member presses the corresponding first pushing component, so as to control the corresponding gripper component to pick up the chip through the first pushing component.

5. The chip clamping device according to claim 3, characterized in that, When the second pressing member moves above any of the first pushing components, the driving member drives the first pressing member and the second pressing member to move closer to the first pushing component. The first pressing member presses the corresponding first pushing component, and the second pressing member presses the corresponding first pushing component, so as to control the corresponding gripper component to grip the chip through the first pushing component.

6. The chip clamping device according to claim 3, characterized in that, The chip gripping device further includes a second pushing component and a third pushing component. The second pushing component is disposed on the first surface and connected to a plurality of first pushing components on the first surface. The third pushing component is disposed on the second surface and connected to a plurality of first pushing components on the second surface. The second pushing component and the third pushing component are arranged in parallel. When the first pressing member and the second pressing member move to the second pushing component and the third pushing component respectively, the driving member drives the first pressing member and the second pressing member. The first pressing member presses the second pushing component, and the second pressing member presses the third pushing component, so as to control the corresponding gripper component to grip the chip through the second pushing component and the third pushing component.

7. The chip gripping device according to claim 6, characterized in that, The chip gripping device includes a plurality of limiting parts, and each of the first pushing components is correspondingly provided with the limiting part, the limiting part being located at one end of the first pushing component near the gripper component; The second pushing component includes a first pushing member and a first limiting member. The first limiting member is disposed on the first surface. The first pushing member is fixed to the first limiting member. One end of a plurality of first pushing components on the first surface away from the gripper component passes through the first limiting member. The limiting portion of the plurality of first pushing components is connected to the first limiting member. The third pushing component includes a second pushing member and a second limiting member. The second limiting member is disposed on the second surface, and the second pushing member is fixed on the second limiting member. One end of a plurality of first pushing components on the second surface away from the gripper component passes through the second limiting member, and the limiting portion of the plurality of first pushing components is connected to the second limiting member.

8. The chip clamping device according to claim 7, characterized in that, When the first pressing member and the second pressing member move to the first pushing member and the second pushing member respectively, the driving member drives the first pressing member and the second pressing member to press the first pushing member and the second pushing member respectively. The first pushing member simultaneously pushes a plurality of first pushing components located on the first surface, and the second pushing member simultaneously pushes a plurality of first pushing components located on the second surface, so that the plurality of gripper components perform chip gripping.

9. The chip gripping device according to any one of claims 1-8, characterized in that, The chip gripping device further includes a support component, which is disposed below the support component and is used to support the chip gripped by the gripper component.

10. A chip clamping method, characterized in that, The method is applied to the chip gripping device as described in any one of claims 1-9, comprising: Obtain the chip's position information, and control the gripper assembly to move above the chip's position based on the chip's position information; The driving component is moved to the first pushing component corresponding to the gripper component by the sliding component; The first pushing component is driven by the driving component, and the gripper component corresponding to the first pushing component grips the chip.

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