High-frequency module and communication device

Abstract

The invention provides a high-frequency module and a communication device. The low height of the high-frequency module and the strength of a mounting substrate are both considered. The high-frequency module includes a mounting substrate, a first electronic component, and a second electronic component. The mounting substrate has a first main surface and a second main surface. The mounting substrate has a first recess and a second recess. The first bump of the first electronic component is disposed in the first recess of the mounting substrate. The second bump of the second electronic component is disposed in the second recess of the mounting substrate. The mounting substrate has a first region and a second region. The first region is a region in which a plurality of recesses including a first recess and a second recess are formed. The second region is a region in which a plurality of recesses are not formed. The second region of the mounting substrate is located between the first bump of the first electronic component and the second bump of the second electronic component in a plan view from the thickness direction of the mounting substrate.

Description

Technical Field

[0001] The present invention generally relates to a high-frequency module and a communication device, and more particularly to a high-frequency module including a plurality of electronic components and a communication device including the high-frequency module. Background Art

[0002] Patent Document 1 describes a passive package including a substrate having a recessed portion. In the passive package described in Patent Document 1, a bump is arranged in the recessed portion of the substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application No. 2017-515295 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] However, in the conventional passive package described in Patent Document 1, in a high-frequency module in which electronic components are arranged on a mounting substrate like the passive package, it is difficult to achieve both low profile of the high-frequency module and strength of the mounting substrate.

[0008] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a high-frequency module and a communication device capable of achieving both low profile and strength of a mounting substrate.

[0009] Solutions for solving problems

[0010] A high-frequency module according to one embodiment of the present invention includes a mounting substrate, a first electronic component, and a second electronic component. The mounting substrate has a first main surface and a second main surface. The first main surface and the second main surface face each other. The first electronic component is arranged on the first main surface of the mounting substrate and has a first bump. The second electronic component is arranged on the first main surface of the mounting substrate and has a second bump. The mounting substrate has a first recess and a second recess. The first recess is formed on the first main surface. The second recess is formed on the first main surface and is different from the first recess. The first bump is arranged in the first recess of the mounting substrate. The second bump is arranged in the second recess of the mounting substrate. The mounting substrate has a first region and a second region. The first region is a region where a plurality of recesses including the first recess and the second recess are formed. The second region is a region where the plurality of recesses are not formed. When viewed from above in the thickness direction of the mounting substrate, the second region of the mounting substrate is located between the first bump of the first electronic component and the second bump of the second electronic component.

[0011] A communication device according to one aspect of the present invention includes the high frequency module and a signal processing circuit. The signal processing circuit is connected to the high frequency module.

[0012] Effects of the Invention

[0013] According to the high-frequency module and the communication device according to the above-described aspect of the present invention, it is possible to achieve both low profile of the high-frequency module and strength of the mounting substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a cross-sectional view of the high-frequency module according to the first embodiment.

[0015] Figure 2 This is a top view of the high-frequency module as above.

[0016] Figure 3 This is a block diagram of the communication device involved in Implementation Example 1.

[0017] Figure 4 It is a plan view of a main part of a mounting substrate of a high-frequency module according to the second embodiment.

[0018] Figure 5 A is a cross-sectional view of a main part of a mounting substrate of a high-frequency module according to the third embodiment. Figure 5 B is a cross-sectional view of a main portion of a mounting substrate of a high-frequency module according to Modification 1 of Embodiment 3. Figure 5 C is a cross-sectional view of a main portion of a mounting substrate of a high-frequency module according to a second modification of the third embodiment.

[0019] Figure 6 It is a plan view of a main part of a mounting substrate of a high-frequency module according to a fourth embodiment.

[0020] Figure 7 This is a plan view of a main part of a mounting substrate of a high-frequency module according to the fifth embodiment.

[0021] Figure 8 This is a cross-sectional view of a high-frequency module according to the sixth embodiment. DETAILED DESCRIPTION

[0022] Hereinafter, a high-frequency module 1 and a communication device 9 according to Embodiments 1 to 6 will be described with reference to the drawings. Figure 1 , Figure 2 , Figures 4 to 8 The drawings are schematic, and the size ratios and thickness ratios of the components in the drawings do not necessarily reflect the actual size ratios. Figure 1 yes Figure 2 Cross-sectional view along line X1-X1.

[0023] (Implementation Method 1)

[0024] (1) High frequency module

[0025] The structure of the high-frequency module 1 according to the first embodiment will be described with reference to the drawings.

[0026] like Figure 1 As shown, the high-frequency module 1 according to the first embodiment includes a mounting substrate 2, a first electronic component 3, a second electronic component 4, and a resin layer 51. The mounting substrate 2 has a first main surface 21 and a second main surface 22. The first main surface 21 and the second main surface 22 face each other. The first electronic component 3 is arranged on the first main surface 21 of the mounting substrate 2, and has a plurality of first bumps 33. The second electronic component 4 is arranged on the first main surface 21 of the mounting substrate 2, and has a plurality of second bumps 43. The mounting substrate 2 has a plurality of first recesses 61 and a plurality of second recesses 62. The plurality of first recesses 61 are formed on the first main surface 21. The plurality of second recesses 62 are formed on the first main surface 21 and are different from the plurality of first recesses 61. The first bump 33 is arranged on the first recess 61 of the mounting substrate 2. The second bump 43 is arranged on the second recess 62 of the mounting substrate 2. The mounting substrate 2 has a first region and a second region. The first region is a region where a plurality of recesses including the first recess 61 and the second recess 62 are formed. The second region is a region where a plurality of recesses are not formed. When viewed in plan from the thickness direction D1 of the mounting substrate 2 , the second region of the mounting substrate 2 is located between the first bumps 33 of the first electronic component 3 and the second bumps 43 of the second electronic component 4 .

[0027] In this specification, “the second area of ​​the mounting substrate 2 is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4 when viewed from the thickness direction D1 of the mounting substrate 2” means that the second area of ​​the mounting substrate 2 is arranged in an area surrounded by a straight line connecting an arbitrary point of the first electronic component 3 with an arbitrary point of the second electronic component 4. In this case, it is sufficient that at least a portion of the second area of ​​the mounting substrate 2 is included in the area surrounded by a straight line connecting an arbitrary point of the first electronic component 3 with an arbitrary point of the second electronic component 4.

[0028] According to the high-frequency module 1 according to the first embodiment, it is possible to achieve both low profile of the high-frequency module 1 and strength of the mounting substrate 2 .

[0029] (2) Structural elements of high-frequency modules

[0030] Hereinafter, each component of the high-frequency module 1 according to the first embodiment will be described with reference to the drawings.

[0031] like Figure 1As shown, the high-frequency module 1 according to the first embodiment includes a mounting substrate 2 , a first electronic component 3 , a second electronic component 4 , a resin layer 51 , and a plurality of external connection terminals (not shown).

[0032] (2.1) Mounting substrate

[0033] like Figure 1 As shown, the mounting substrate 2 has a first main surface 21 and a second main surface 22. The first main surface 21 and the second main surface 22 face each other. More specifically, the first main surface 21 and the second main surface 22 face each other in the thickness direction D1 of the mounting substrate 2. The mounting substrate 2 is a substrate for arranging a plurality of electronic components, for example, in the shape of a rectangular plate. The first main surface 21 and the second main surface 22 are, for example, rectangular. When the high-frequency module 1 is set on an external substrate (not shown), the second main surface 22 faces the external substrate.

[0034] The mounting substrate 2 includes a plurality of dielectric layers 23 and a plurality of conductive layers. The mounting substrate 2 is, for example, a multilayer substrate including a plurality of dielectric layers 23 and a plurality of conductive layers. The plurality of dielectric layers 23 and the plurality of conductive layers are stacked in the thickness direction D1 of the mounting substrate 2 .

[0035] Each of the plurality of conductive layers includes one or more conductor portions in a plane perpendicular to the thickness direction D1 of the mounting substrate 2. The plurality of conductive layers are formed into a predetermined pattern determined for each layer. The material of each conductive layer is, for example, copper.

[0036] The plurality of conductive layers include a ground layer (not shown). The ground layer is a layer set to a ground potential (reference potential) and is provided inside the mounting substrate 2. When the high-frequency module 1 is disposed on an external substrate (e.g., a motherboard), the ground layer is connected to the ground of the external substrate via a via conductor or the like included in the mounting substrate 2 and is maintained at a ground potential (reference potential).

[0037] The mounting substrate 2 is, for example, a LTCC (Low Temperature Co-fired Ceramics) substrate. In addition, the mounting substrate 2 is not limited to a LTCC substrate, and may be, for example, a printed circuit board, a HTCC (High Temperature Co-fired Ceramics) substrate, or a resin multilayer substrate.

[0038] (2.2) First electronic component

[0039] like Figure 1 and Figure 2As shown, the first electronic component 3 is arranged on the first main surface 21 of the mounting substrate 2. More specifically, the first electronic component 3 is mounted on the first main surface 21 of the mounting substrate 2. The first electronic component 3 is, for example, an amplifier or a filter. The first electronic component 3 is, for example, a power amplifier, a transmission filter, a reception filter, or a low noise amplifier.

[0040] The first electronic component 3 has a main body 31, a plurality of electrodes 32, and a plurality of first bumps 33. The plurality of electrodes 32 of the first electronic component 3 are connected to a plurality of first electrodes 71 provided on the first main surface 21 of the mounting substrate 2 via the plurality of first bumps 33, whereby the first electronic component 3 is arranged on the first main surface 21 of the mounting substrate 2.

[0041] The main body 31 has a functional part. The main body 31 is arranged on the mounting substrate 2 in a manner that a main surface 311 of the main body 31 faces the mounting substrate 2 in the thickness direction D1 of the mounting substrate 2. More specifically, when the first electronic component 3 is arranged on the mounting substrate 2, a main surface 311 of the main body 31 faces the first main surface 21 of the mounting substrate 2.

[0042] The plurality of electrodes 32 are formed on one main surface 311 of the main body 31. The plurality of electrodes 32 are provided on one main surface 311 of the main body 31 so as to be separated from each other, for example.

[0043] The plurality of first bumps 33 are bumps for connecting the plurality of electrodes 32 to the conductive layer of the mounting substrate 2. The plurality of first bumps 33 are arranged on the plurality of electrodes 32. Each first bump 33 is formed in a circular shape, for example. Each first bump 33 is formed of, for example, solder.

[0044] (2.3) Second electronic component

[0045] like Figure 1 and Figure 2 As shown, the second electronic component 4 is arranged on the first main surface 21 of the mounting substrate 2. In more detail, the second electronic component 4 is mounted on the first main surface 21 of the mounting substrate 2. The second electronic component 4 is, for example, an amplifier or a filter. The second electronic component 4 is, for example, a power amplifier, a transmission filter, a reception filter, or a low noise amplifier. The second electronic component 4 is arranged adjacent to the first electronic component 3 in the first direction D21. The first direction D21 is a direction orthogonal to both the thickness direction D1 of the mounting substrate 2 and the second direction D22.

[0046] The second electronic component 4 has a main body 41, a plurality of electrodes 42, and a plurality of second bumps 43. The plurality of electrodes 42 of the second electronic component 4 are connected to a plurality of second electrodes 72 provided on the first main surface 21 of the mounting substrate 2 via the plurality of second bumps 43, whereby the second electronic component 4 is arranged on the first main surface 21 of the mounting substrate 2.

[0047] The main body 41 has a functional part. The main body 41 is arranged on the mounting substrate 2 in a manner that a main surface 411 of the main body 41 faces the mounting substrate 2 in the thickness direction D1 of the mounting substrate 2. More specifically, when the second electronic component 4 is arranged on the mounting substrate 2, a main surface 411 of the main body 41 faces the first main surface 21 of the mounting substrate 2.

[0048] The plurality of electrodes 42 are formed on one main surface 411 of the main body 41. The plurality of electrodes 42 are provided on one main surface 411 of the main body 41 so as to be separated from each other, for example.

[0049] The plurality of second bumps 43 are bumps for connecting the plurality of electrodes 42 to the conductive layer of the mounting substrate 2. The plurality of second bumps 43 are arranged on the plurality of electrodes 42. Each second bump 43 is formed in a circular shape, for example. Each second bump 43 is formed of, for example, solder.

[0050] (2.4) Arrangement relationship between mounting substrate and first and second electronic components

[0051] like Figure 1 As shown, the mounting substrate 2 has a plurality of first recesses 61 and a plurality of second recesses 62. The plurality of first recesses 61 are formed on the first main surface 21 of the mounting substrate 2. The plurality of first recesses 61 each have a bottom surface 611 and a side surface 612. The plurality of second recesses 62 are formed on the first main surface 21 of the mounting substrate 2. The plurality of second recesses 62 are recesses different from the plurality of first recesses 61. The plurality of second recesses 62 each have a bottom surface 621 and a side surface 622.

[0052] The mounting substrate 2 has a plurality of first electrodes 71 and a plurality of second electrodes 72. The plurality of first electrodes 71 are arranged on the plurality of first recesses 61. More specifically, the plurality of first electrodes 71 are arranged on the bottom surfaces 611 of the plurality of first recesses 61. The plurality of second electrodes 72 are arranged on the plurality of second recesses 62. More specifically, the plurality of second electrodes 72 are arranged on the bottom surfaces 621 of the plurality of second recesses 62.

[0053] The plurality of first bumps 33 of the first electronic component 3 are arranged in the plurality of first recesses 61 of the mounting substrate 2. More specifically, each of the plurality of first bumps 33 is arranged in the first recess 61 so that at least a portion of the first bump 33 is received in the first recess 61. Figure 1 In the example of FIG. 1 , the two central first recesses 61 are integrated to form a first recess 61 a .

[0054] By configuring the first bump 33 of the first electronic component 3 in the first recess 61 of the mounting substrate 2, the height of the first electronic component 3 from the surface of the first main surface 21 of the mounting substrate 2 where no recess (including the first recess 61 and the second recess 62) is formed can be reduced, thereby achieving a lower profile of the high-frequency module 1.

[0055] The second bumps 43 of the second electronic component 4 are arranged in the second recesses 62 of the mounting substrate 2. More specifically, each of the second bumps 43 is arranged in the second recess 62 so that at least a portion of the second bump 43 is received in the second recess 62.

[0056] By configuring the second protrusion 43 of the second electronic component 4 in the second recess 62 of the mounting substrate 2, the height of the second electronic component 4 from the surface of the first main surface 21 of the mounting substrate 2 where no recess (including the first recess 61 and the second recess 62) is formed can be reduced, thereby achieving a lower profile of the high-frequency module 1.

[0057] The mounting substrate 2 has a first region and a second region. The first region is a region where a plurality of recesses including a plurality of first recesses 61 and a plurality of second recesses 62 are formed. The second region is a region where a plurality of recesses are not formed. When viewed from the thickness direction D1 of the mounting substrate 2, the second region of the mounting substrate 2 is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4. Thus, the thickness between the first recess 61 and the second recess 62 of the mounting substrate 2 can be made thick, so that the strength of the mounting substrate 2 can be improved compared to the case where a recess is formed between the first recess 61 and the second recess 62.

[0058] The first bump 33 of the first electronic component 3 is, for example, an RF bump, and the second bump 43 of the second electronic component 4 is, for example, a ground bump. Thus, the RF bump of the first electronic component 3 and the ground bump of the second electronic component 4 are separated by the second region. As a result, the short circuit between adjacent RF bumps and ground bumps can be reduced, thereby suppressing poor mounting of the high-frequency module 1.

[0059] The first electronic component 3 has a main body 31 including a functional part, and the second electronic component 4 has a main body 41 including a functional part. The main body 31 of the first electronic component 3 and the main body 41 of the second electronic component 4 are located outside the mounting substrate 2. Thus, compared with a case where a recessed portion for accommodating the main body 31 of the first electronic component 3 and the main body 41 of the second electronic component 4 is formed in the mounting substrate 2, the strength of the mounting substrate 2 can be improved.

[0060] (2.5) Resin layer

[0061] like Figure 1As shown, the resin layer 51 is disposed on the first main surface 21 of the mounting substrate 2. The resin layer 51 is in contact with the first main surface 21 of the mounting substrate 2 and covers at least a portion of the first electronic component 3 and the second electronic component 4. Thus, the mounting substrate 2, the first electronic component 3, and the second electronic component 4 can be protected.

[0062] The resin layer 51 includes a resin and a filler (not shown). The resin is, for example, an epoxy resin. In the high-frequency module 1, the distance L1 between the main body 31 of the first electronic component 3 and the mounting substrate 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 enters around the first bump 33 of the first electronic component 3, so that when the high-frequency module 1 is mounted on the motherboard, solder splashing can be prevented. As a result, the connection reliability of the first electronic component 3 can be improved. In addition, the distance L2 between the main body 41 of the second electronic component 4 and the mounting substrate 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 enters around the second bump 43 of the second electronic component 4, so when the high-frequency module 1 is mounted on the motherboard, solder splashing can be prevented. As a result, the connection reliability of the second electronic component 4 can be improved.

[0063] (2.6) External connection terminals

[0064] Multiple external connection terminals (not shown) are arranged on the second main surface 22 of the mounting substrate 2. The multiple external connection terminals are used to electrically connect the mounting substrate 2 to an external substrate (not shown). The multiple external connection terminals are arranged on the second main surface 22 of the mounting substrate 2 with a gap between them.

[0065] The plurality of external connection terminals are respectively flat conductive members and are made of, for example, metal (eg, copper, copper alloy, etc.).

[0066] Each external connection terminal is connected to an external connection electrode of an external substrate. In this specification, "A (e.g., an external connection terminal) is connected to B (e.g., an external connection electrode of an external substrate)" not only means that A and B are in contact, but also includes the case where A and B are electrically connected via a conductor electrode, a conductor terminal, wiring, or other circuit components. Multiple external connection terminals are connected to external connection electrodes of an external substrate, for example, via a connection member formed by a conductor (e.g., a solder bump).

[0067] The plurality of external connection terminals include an antenna terminal, a signal input terminal, a signal output terminal, a control terminal, and a ground terminal. The antenna terminal is for the antenna 91 (refer to Figure 3 The signal input terminal is used to receive the signal from the signal processing circuit 92 (refer to Figure 3) is input to the terminal of the high frequency module 1. The signal output terminal is a terminal for outputting the reception signal (high frequency signal) from the high frequency module 1 to the signal processing circuit 92. The control terminal is a terminal for inputting the control signal from the signal processing circuit 92 to the controller (not shown).

[0068] (3) Communication device

[0069] like Figure 3 As shown, the communication device 9 includes a high frequency module 1, an antenna 91, and a signal processing circuit 92. The communication device 9 is, for example, a portable terminal (such as a smartphone). In addition, the communication device 9 is not limited to a portable terminal, and may be, for example, a wearable terminal (such as a smart watch).

[0070] The high frequency module 1 is configured to amplify a transmission signal (high frequency signal) from a signal processing circuit 92 and output it to an antenna 91. In addition, the high frequency module 1 is configured to amplify a reception signal (high frequency signal) received by the antenna 91 and output it to the signal processing circuit 92. The high frequency module 1 is controlled by the signal processing circuit 92, for example.

[0071] The high-frequency module 1 is, for example, a module that can support the 4G (fourth generation mobile communication) standard and the 5G (fifth generation mobile communication) standard. The 4G standard is, for example, the 3GPP (registered trademark, Third Generation Partnership Project) LTE (registered trademark, Long Term Evolution) standard. The 5G standard is, for example, the 5G NR (New Radio). The high-frequency module 1 is a module that can support carrier aggregation and dual connectivity.

[0072] In the communication device 9, the high-frequency module 1 can be electrically connected to an external substrate (not shown). The external substrate is, for example, a motherboard of a portable terminal or a communication device. In addition, the high-frequency module 1 can be electrically connected to the external substrate not only in the case where the high-frequency module 1 is directly mounted on the external substrate, but also in the case where the high-frequency module 1 is indirectly mounted on the external substrate. In addition, the case where the high-frequency module 1 is indirectly mounted on the external substrate is the case where the high-frequency module 1 is mounted on another high-frequency module mounted on the external substrate.

[0073] (3.1) Antenna

[0074] Antenna 91 is connected to an antenna terminal (not shown) of high frequency module 1. Antenna 91 has a transmission function of radiating a transmission signal output from high frequency module 1 as a radio wave, and a reception function of receiving a reception signal as a radio wave from the outside and outputting it to high frequency module 1.

[0075] (3.2) Signal processing circuit

[0076] The signal processing circuit 92 is connected to the high frequency module 1. The signal processing circuit 92 processes the high frequency signal passing through the high frequency module 1. More specifically, the signal processing circuit 92 is configured to perform signal processing on the transmission signal output to the high frequency module 1. In addition, the signal processing circuit 92 is configured to perform signal processing on the reception signal received from the high frequency module 1.

[0077] The signal processing circuit 92 includes a baseband signal processing circuit 93 and an RF signal processing circuit 94 .

[0078] The baseband signal processing circuit 93 is, for example, a BBIC (Baseband Integrated Circuit).

[0079] The baseband signal processing circuit 93 performs predetermined signal processing on the signal from the outside of the signal processing circuit 92. More specifically, the baseband signal processing circuit 93 generates a transmission signal based on the baseband signal (such as a sound signal and an image signal) from the outside of the signal processing circuit 92, and outputs the generated transmission signal to the RF signal processing circuit 94.

[0080] The baseband signal processing circuit 93 performs predetermined signal processing on the signal from the RF signal processing circuit 94. More specifically, the baseband signal processing circuit 93 outputs the reception signal received from the RF signal processing circuit 94 to the outside. The reception signal processed by the baseband signal processing circuit 93 is used as an image signal for image display or as an audio signal for communication, for example.

[0081] The RF signal processing circuit 94 is, for example, a RFIC (Radio Frequency Integrated Circuit), and performs signal processing on high-frequency signals (transmission signals and reception signals).

[0082] The RF signal processing circuit 94 performs signal processing on the transmission signal output from the baseband signal processing circuit 93, and outputs the processed transmission signal to the high-frequency module 1. Specifically, the RF signal processing circuit 94 performs signal processing such as up-conversion on the transmission signal output from the baseband signal processing circuit 93, and outputs the processed transmission signal to the transmission path of the high-frequency module 1.

[0083] The RF signal processing circuit 94 performs signal processing on the received signal output from the high frequency module 1, and outputs the received signal after the signal processing to the baseband signal processing circuit 93. Specifically, the RF signal processing circuit 94 performs signal processing such as down-conversion on the received signal output from the receiving path of the high frequency module 1, and outputs the received signal after the signal processing to the baseband signal processing circuit 93.

[0084] (4) Effect

[0085] In the high-frequency module 1 according to the first embodiment, the first bump 33 of the first electronic component 3 is arranged in the first recess 61 of the mounting substrate 2, the second bump 43 of the second electronic component 4 is arranged in the second recess 62 of the mounting substrate 2, and the second region where the first recess 61 and the second recess 62 are not formed is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4. By arranging the first bump 33 of the first electronic component 3 in the first recess 61 of the mounting substrate 2, the height of the first electronic component 3 from the surface of the first principal surface 21 of the mounting substrate 2 where no recess (including the first recess 61 and the second recess 62) is formed can be reduced. In addition, by arranging the second bump 43 of the second electronic component 4 in the second recess 62 of the mounting substrate 2, the height of the second electronic component 4 from the surface of the first principal surface 21 of the mounting substrate 2 where no recess (including the first recess 61 and the second recess 62) is formed can be reduced. Thus, the high-frequency module 1 can be made low. Furthermore, when viewed from the thickness direction D1 of the mounting substrate 2, the second region of the mounting substrate 2 is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4. As a result, the thickness between the first recess 61 and the second recess 62 of the mounting substrate 2 can be made thicker, so that the strength of the mounting substrate 2 can be improved compared to the case where a recess is formed between the first recess 61 and the second recess 62. As a result, both the low profile of the high-frequency module 1 and the strength of the mounting substrate 2 can be achieved.

[0086] In high frequency module 1 according to Embodiment 1, first recess 61 is formed in mounting substrate 2. Thus, the distance between first electronic component 3 and wiring conductors or wiring elements built into mounting substrate 2 can be shortened compared to a case where first recess 61 is not formed.

[0087] In high frequency module 1 according to Embodiment 1, second recess 62 is formed in mounting substrate 2. Thus, the distance between second electronic component 4 and wiring conductors or wiring elements built into mounting substrate 2 can be shortened compared to a case where second recess 62 is not formed.

[0088] In the high-frequency module 1 according to the first embodiment, the first bump 33 of the first electronic component 3 is an RF bump, and the second bump 43 of the second electronic component 4 is a ground bump. Thus, the RF bump of the first electronic component 3 and the ground bump of the second electronic component 4 are separated by the second region. As a result, the short circuit between the adjacent RF bumps and the ground bumps can be reduced, so that poor mounting of the high-frequency module 1 can be suppressed.

[0089] In the high frequency module 1 according to the first embodiment, the resin layer 51 is provided in contact with the first main surface 21 of the mounting substrate 2 and covers at least a part of the first electronic component 3 and the second electronic component 4. Thus, the mounting substrate 2, the first electronic component 3, and the second electronic component 4 can be protected.

[0090] In the high-frequency module 1 involved in the first embodiment, the distance L1 between the main body 31 of the first electronic component 3 and the mounting substrate 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 enters the periphery of the first bump 33 of the first electronic component 3, so that when the high-frequency module 1 is mounted on the motherboard, solder splashing can be prevented. As a result, the connection reliability of the first electronic component 3 can be improved. In addition, the distance L2 between the main body 41 of the second electronic component 4 and the mounting substrate 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 enters the periphery of the second bump 43 of the second electronic component 4, so when the high-frequency module 1 is mounted on the motherboard, solder splashing can be prevented. As a result, the connection reliability of the second electronic component 4 can be improved.

[0091] In the high-frequency module 1 according to the first embodiment, the main body 31 of the first electronic component 3 and the main body 41 of the second electronic component 4 are located outside the mounting substrate 2. Thus, compared with a case where a recessed portion for accommodating the main body 31 of the first electronic component 3 and the main body 41 of the second electronic component 4 is formed in the mounting substrate 2, the strength of the mounting substrate 2 can be improved.

[0092] According to the high-frequency module 1 according to the first embodiment, even when the first electronic component 3 and the second electronic component 4 having different sizes are arranged on the mounting substrate 2, the high-frequency module 1 can be made low-profile simply by performing a process on the mounting substrate 2. In other words, the high-frequency module 1 can be made low-profile simply by performing a process of forming the first recess 61 and the second recess 62 on the mounting substrate 2.

[0093] In the high-frequency module 1 according to the first embodiment, the first bump 33 is arranged in the first recess 61, and at least a part of the solder of the first bump 33 fills the first recess 61. Thus, compared with the case where the first bump 33 is not arranged in the first recess 61, the sum of the thickness of the mounting substrate 2 and the thickness of the first bump 33 can be increased, so that the strength of the mounting substrate 2 can be improved.

[0094] In the high-frequency module 1 according to the first embodiment, the second bump 43 is disposed in the second recess 62, and at least a portion of the solder of the second bump 43 fills the second recess 62. Thus, compared with a case where the second bump 43 is not disposed in the second recess 62, the sum of the thickness of the mounting substrate 2 and the thickness of the second bump 43 can be increased, and thus the strength of the mounting substrate 2 can be improved.

[0095] In the high frequency module 1 according to the first embodiment, a plurality of first recesses 61 are formed on the mounting substrate 2, and a plurality of first bumps 33 protruding from one main surface 311 of the main body 31 are provided on the first electronic component 3. Thus, it is possible to reduce unevenness of the first main surface 21 of the mounting substrate 2 on which the first electronic component 3 is arranged.

[0096] In the high frequency module 1 according to the first embodiment, a plurality of second recesses 62 are formed in the mounting substrate 2, and a plurality of second bumps 43 protruding from one main surface 411 of the body 41 are provided in the second electronic component 4. Thus, the unevenness of the first main surface 21 of the mounting substrate 2 on which the second electronic component 4 is arranged can be reduced.

[0097] In the high frequency module 1 according to the first embodiment, the first recess 61 is provided on the mounting substrate 2 , so that the amount of self-alignment generated when the solder of the first bump 33 melts can be limited within the first recess 61 , thereby improving the mountability of the first electronic component 3 on the mounting substrate 2 .

[0098] In the high frequency module 1 according to the first embodiment, the second recess 62 is provided in the mounting substrate 2 , so that the amount of self-positioning movement generated when the solder of the second bump 43 melts can be limited within the second recess 62 , thereby improving the mountability of the second electronic component 4 on the mounting substrate 2 .

[0099] In the high frequency module 1 according to the first embodiment, the first recess 61 and the second recess 62 are formed in the mounting substrate 2. Thus, compared with the case where the first recess 61 and the second recess 62 are not formed, the thickness of the mounting substrate 2 can be increased while maintaining the height of the high frequency module 1, so that the strength of the mounting substrate 2 can be improved.

[0100] In the communication device 9 according to the first embodiment, in the high-frequency module 1, the first bump 33 of the first electronic component 3 is arranged in the first recess 61 of the mounting substrate 2, the second bump 43 of the second electronic component 4 is arranged in the second recess 62 of the mounting substrate 2, and the second region where the first recess 61 and the second recess 62 are not formed is provided between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4. Thus, both the low profile of the high-frequency module 1 and the strength of the mounting substrate can be achieved.

[0101] (5) Modification

[0102] Next, a modification of the first embodiment will be described.

[0103] (5.1) Modification 1

[0104] A high-frequency module 1 according to Modification 1 of Embodiment 1 includes a mounting substrate 2 , a first electronic component 3 , a second electronic component 4 , a resin layer 51 , a plurality of external connection terminals (not shown), and a shield layer (not shown).

[0105] The shielding layer covers the resin layer 51 and at least a portion of the mounting substrate 2. More specifically, the shielding layer covers one main surface and the outer peripheral surface of the resin layer 51 and the outer peripheral surface of the mounting substrate 2. One main surface of the resin layer 51 is the main surface of the resin layer 51 on the side opposite to the mounting substrate 2 side.

[0106] The shielding layer has conductivity. More specifically, the shielding layer has a multilayer structure formed by stacking a plurality of metal layers. The metal layer includes one or more metals. In addition, the shielding layer is not limited to the above-mentioned multilayer structure, and can also be a single metal layer.

[0107] The shielding layer is provided, for example, for electromagnetic shielding inside and outside the high-frequency module 1. The shielding layer contacts at least a portion of the ground layer of the mounting substrate 2. Thus, the potential of the shielding layer can be made equal to the potential of the ground layer.

[0108] The shielding layer covers at least a part of the principal surface of the first electronic component 3 and the principal surface of the second electronic component 4. The shielding layer may be connected to the principal surface of the first electronic component 3 and the principal surface of the second electronic component 4 by contact, for example.

[0109] (5.2) Modification 2

[0110] In the high-frequency module 1 according to the second modification of the first embodiment, the distance L1 between the main body 31 of the first electronic component 3 and the mounting substrate 2 (see Figure 1 ) is smaller than the diameter of the filler contained in the resin layer 51. In addition, the distance L2 between the main body 41 of the second electronic component 4 and the mounting substrate 2 (see Figure 1 ) is smaller than the diameter of the filler contained in the resin layer 51.

[0111] According to the high-frequency module 1 according to the second modification of the first embodiment, the high-frequency module 1 can be further reduced in height.

[0112] (5.3) Modification 3

[0113] In the high frequency module 1 according to the third modification of the first embodiment, the resin layer 51 does not contain a filler. For example, the resin layer 51 does not contain a filler but contains only a resin.

[0114] The high-frequency modules 1 according to the above-described modifications also have the same effects as those of the high-frequency module 1 according to the first embodiment.

[0115] (Implementation Method 2)

[0116] The high-frequency module 1 according to the second embodiment is different from the high-frequency module 1 according to the first embodiment (see Figure 1 ) differ in the following respects: Figure 4 As shown, the side surface 612 of the first recess 61 and the side surface 622 of the second recess 62 of the mounting substrate 2 are curved surfaces. In the high-frequency module 1 according to the second embodiment, the same components as those of the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals and their description is omitted.

[0117] (1) Structure

[0118] In the mounting substrate 2 of the second embodiment, as Figure 4 As shown, the side surface 612 of the first recessed portion 61 is a curved surface when viewed from above in the thickness direction D1 of the mounting substrate 2 .

[0119] In the mounting substrate 2 according to the second embodiment, the side surface 622 of the second recess 62 is a curved surface when viewed in plan from the thickness direction D1 of the mounting substrate 2 .

[0120] In addition, regarding the mounting substrate 2 of the second embodiment, the mounting substrate 2 of the first embodiment (see Figure 1 ) The same structure and function are omitted.

[0121] (2) Effect

[0122] In the high-frequency module 1 according to the second embodiment, the side surface 612 of the first recess 61 is a curved surface when viewed from the thickness direction D1 of the mounting substrate 2. As a result, the shape of the first recess 61 can be close to the shape of the first bump 33, so that when the first electronic component 3 is arranged on the mounting substrate 2, the self-positioning amount of the solder can be suppressed within the range of the first recess 61. As a result, the mountability of the first electronic component 3 on the mounting substrate 2 can be improved. In other words, the mounting deviation of the first electronic component 3 can be reduced.

[0123] In the high-frequency module 1 according to the second embodiment, the side surface 622 of the second recess 62 is a curved surface when viewed from the thickness direction D1 of the mounting substrate 2. As a result, the shape of the second recess 62 can be close to the shape of the second bump 43, so when the second electronic component 4 is arranged on the mounting substrate 2, the self-positioning amount of the solder can be suppressed within the range of the second recess 62. As a result, the mountability of the second electronic component 4 on the mounting substrate 2 can be improved. In other words, the mounting deviation of the second electronic component 4 can be reduced.

[0124] (3) Modification

[0125] Next, a modification example of the second embodiment will be described.

[0126] (3.1) Modification 1

[0127] In the high-frequency module 1 according to the first modification of the second embodiment, only the side faces 612 of the plurality of first recesses 61 and the side faces 622 of the plurality of second recesses 62 of the mounting substrate 2 are curved surfaces. In addition, the side faces 612 of the first recesses 61 may be curved surfaces in part of the plurality of first recesses 61 rather than all of the plurality of first recesses 61.

[0128] In the high-frequency module 1 according to the first modification of the second embodiment, it is also possible to improve the mounting performance of the first electronic component 3 on the mounting substrate 2 .

[0129] (3.2) Modification 2

[0130] In the high-frequency module 1 according to the second variation of the second embodiment, only the side faces 622 of the plurality of second recesses 62 are curved surfaces among the side faces 612 of the plurality of first recesses 61 and the side faces 622 of the plurality of second recesses 62 of the mounting substrate 2. In addition, the side faces 622 of not all of the plurality of second recesses 62 but only a portion of the plurality of second recesses 62 may be curved surfaces.

[0131] In the high-frequency module 1 according to the second modification of the second embodiment, it is also possible to improve the mountability of the second electronic component 4 on the mounting substrate 2 .

[0132] In short, the side surface 612 or 622 of at least one of the plurality of first recesses 61 and the plurality of second recesses 62 of the mounting substrate 2 may be a curved surface when viewed in plan from the thickness direction D1 of the mounting substrate 2 .

[0133] The high-frequency modules 1 according to the above-described modifications also have the same effects as those of the high-frequency module 1 according to the second embodiment.

[0134] (Implementation method 3)

[0135] The high-frequency module 1 according to the third embodiment is different from the high-frequency module 1 according to the first embodiment (see Figure 1 ) differ in the following respects: Figure 5 As shown in FIG. 1A , side electrodes 73 are formed on the side surfaces 612 of the plurality of first recesses 61 and the side surfaces 622 of the plurality of second recesses 62. In addition, regarding the high-frequency module 1 according to the third embodiment, the same components as those of the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals and their description is omitted.

[0136] (1) Structure

[0137] like Figure 5 As shown in A, the mounting substrate 2 of the third embodiment further includes a side electrode 73. The side electrode 73 is formed on the side 612 of the first recess 61. In addition, the side electrode 73 is formed on the side 622 of the second recess 62. In addition, regarding the mounting substrate 2 of the third embodiment, for the mounting substrate 2 of the first embodiment (refer to Figure 1 ) The same structure and function are omitted.

[0138] (2) Effect

[0139] In the high-frequency module 1 according to the third embodiment, the first electrode 71 is formed on the bottom surface 611 of the first recess 61, and the side electrode 73 is formed on the side surface 612 of the first recess 61. As a result, the contact area between the first bump 33 of the first electronic component 3 and the electrode (the first electrode 71 and the side electrode 73) in the first recess 61 can be increased, so that the bonding strength between the first bump 33 of the first electronic component 3 and the electrode in the first recess 61 can be improved. As a result, the mountability of the first electronic component 3 on the mounting substrate 2 can be improved.

[0140] In the high-frequency module 1 according to the third embodiment, the second electrode 72 is formed on the bottom surface 621 of the second recess 62, and the side electrode 73 is formed on the side surface 622 of the second recess 62. As a result, the contact area between the second bump 43 of the second electronic component 4 and the electrode (the second electrode 72 and the side electrode 73) in the second recess 62 can be increased, so that the bonding strength between the second bump 43 of the second electronic component 4 and the electrode in the second recess 62 can be improved. As a result, the mountability of the second electronic component 4 on the mounting substrate 2 can be improved.

[0141] (3) Modification

[0142] Next, a modification example of the third embodiment will be described.

[0143] (3.1) Modification 1

[0144] In the high frequency module 1 according to the first variation of the third embodiment, Figure 5As shown in FIG. 1B , the mounting substrate 2 includes a wiring pattern conductor 75 . The wiring pattern conductor 75 is provided on the first main surface 21 of the mounting substrate 2 so as to be continuous with the side electrodes 73 .

[0145] In the high-frequency module 1 according to the first modification of the third embodiment, the side surface electrode 73 is formed on the side surface 612, 622 of at least one of the first recess 61 and the second recess 62. Thus, wiring can be extended from the side surfaces 612, 622 of the recesses (the first recess 61 and the second recess 62), thereby improving the degree of freedom of wiring.

[0146] (3.2) Modification 2

[0147] In the high frequency module 1 according to the second variation of the third embodiment, Figure 5 As shown in FIG. 3C , the mounting substrate 2 includes a via conductor 76 and a plurality of wiring pattern conductors 771 and 772 .

[0148] The via conductor 76 connects the first electrode 71 to the wiring pattern conductor 771. The wiring pattern conductor 772 is connected to the side electrode 73. The wiring pattern conductor 772 extends from the side electrode 73 in a direction perpendicular to the thickness direction D1 of the mounting substrate 2. In addition, the via conductor 76 may be a conductor that connects the second electrode 72 to the wiring pattern conductor 771.

[0149] In the high-frequency module 1 according to the second variation of the third embodiment, the side surface electrode 73 is formed on the side surface 612, 622 of at least one of the plurality of first recesses 61 and the plurality of second recesses 62. Thus, wiring can be extended from the side surfaces 612, 622 of the recesses (the first recesses 61 and the second recesses 62), thereby improving the degree of freedom of wiring.

[0150] (3.3) Modification 3

[0151] In the high-frequency module 1 according to the third variation of the third embodiment, the side surface electrodes 73 are formed only on the side surfaces 612 of the plurality of first recesses 61 and the side surfaces 622 of the plurality of second recesses 62 of the mounting substrate 2. Alternatively, the side surface electrodes 73 may be formed on the side surfaces 612 of a portion of the plurality of first recesses 61 rather than on all of the plurality of first recesses 61.

[0152] In the high-frequency module 1 according to the third modification of the third embodiment, the degree of freedom of wiring can also be improved.

[0153] (3.4) Modification 4

[0154] In the high-frequency module 1 according to the fourth variation of the third embodiment, the side surface electrodes 73 are formed on only the side surfaces 622 of the plurality of second recesses 62 among the side surfaces 612 of the plurality of first recesses 61 and the side surfaces 622 of the plurality of second recesses 62 of the mounting substrate 2. Alternatively, the side surface electrodes 73 may be formed on the side surfaces 622 of a portion of the plurality of second recesses 62 rather than on all of the plurality of second recesses 62.

[0155] In the high-frequency module 1 according to the fourth modification of the third embodiment, the degree of freedom of wiring can also be improved.

[0156] In short, the mounting substrate 2 only needs to include the side surface electrode 73 formed on the side surface 612 , 622 of at least one of the first recess 61 and the second recess 62 .

[0157] The high-frequency modules 1 according to the above-described modifications also have the same effects as those of the high-frequency module 1 according to the third embodiment.

[0158] (Implementation 4)

[0159] The high-frequency module 1 according to the fourth embodiment is different from the high-frequency module 1 according to the first embodiment (see Figure 1 ) differ in the following respects: Figure 6 As shown, wiring pattern conductors 78 are formed in the plurality of first recesses 61 and the plurality of second recesses 62 of the mounting substrate 2. In the high-frequency module 1 according to the fourth embodiment, the same components as those of the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals and their description is omitted.

[0160] (1) Structure

[0161] like Figure 6 As shown, the mounting substrate 2 of the fourth embodiment has a plurality of wiring pattern conductors 78. The wiring pattern conductors 78 are formed in each of the first recesses 61. More specifically, the wiring pattern conductors 78 are formed in the bottom surfaces 611 of the first recesses 61. In addition, the wiring pattern conductors 78 are formed in each of the second recesses 62. More specifically, the wiring pattern conductors 78 are formed in the bottom surfaces 621 of the second recesses 62. In addition, regarding the mounting substrate 2 of the fourth embodiment, for the mounting substrate 2 of the first embodiment (see Figure 1 ) The same structure and function are omitted.

[0162] (2) Effect

[0163] In the high-frequency module 1 according to the fourth embodiment, the wiring pattern conductor 78 is formed in at least one of the plurality of first recesses 61. This can improve the degree of freedom of wiring.

[0164] In the high-frequency module 1 according to the fourth embodiment, the wiring pattern conductor 78 is formed in at least one second recess 62 among the plurality of second recesses 62. This can improve the degree of freedom of wiring.

[0165] (3) Modification

[0166] Next, a modification example of the fourth embodiment is described.

[0167] (3.1) Modification 1

[0168] In the high-frequency module 1 according to the first variation of the fourth embodiment, the wiring pattern conductor 78 is formed in only the first recesses 61 of the plurality of first recesses 61 and the plurality of second recesses 62 of the mounting substrate 2. Alternatively, the wiring pattern conductor 78 may be formed in not all of the first recesses 61 but only in a portion of the first recesses 61.

[0169] In the high-frequency module 1 according to the first modification of the fourth embodiment, the degree of freedom of wiring can also be improved.

[0170] (3.2) Modification 2

[0171] In the high-frequency module 1 according to the second variation of the fourth embodiment, the wiring pattern conductors 78 are formed in only the second recesses 62 among the plurality of first recesses 61 and the plurality of second recesses 62 of the mounting substrate 2. Alternatively, the wiring pattern conductors 78 may be formed in not all of the second recesses 62 but only in a portion of the second recesses 62.

[0172] In the high-frequency module 1 according to the second modification of the fourth embodiment, the degree of freedom of wiring can also be improved.

[0173] In short, the mounting substrate 2 only needs to have the wiring pattern conductor 78 in at least one of the first recess 61 and the second recess 62 .

[0174] (3.3) Modification 3

[0175] In the high-frequency module 1 according to the third variation of the fourth embodiment, the number of wiring pattern conductors 78 provided in the plurality of first recesses 61 is not limited to two, but may be one, or may be three or more. The number of wiring pattern conductors 78 provided in the plurality of second recesses 62 is not limited to two, but may be one, or may be three or more.

[0176] The high-frequency module 1 according to the above-described modification also has the same effects as those of the high-frequency module 1 according to the fourth embodiment.

[0177] (Implementation method 5)

[0178] The high-frequency module 1 according to the fifth embodiment is different from the high-frequency module 1 according to the first embodiment (see Figure 1 ) differ in the following respects: Figure 7 As shown, a wire-wound inductor 11 is provided. In the high-frequency module 1 according to the fifth embodiment, the same components as those of the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0179] (1) Structure

[0180] like Figure 7 As shown, the high frequency module 1 according to the fifth embodiment further includes a wire-wound inductor 11. The wire-wound inductor 11 is disposed in at least one of the plurality of first recesses 61. The wire-wound inductor 11 is disposed in at least one of the plurality of second recesses 62.

[0181] (2) Effect

[0182] In the high frequency module 1 according to the fifth embodiment, the wire-wound inductor 11 is provided in at least one of the plurality of first recesses 61 and the plurality of second recesses 62. This can reduce the height of the relatively tall wire-wound inductor 11, thereby further reducing the height of the high frequency module 1.

[0183] (Implementation 6)

[0184] The high-frequency module 1 according to the sixth embodiment is different from the high-frequency module 1 according to the first embodiment (see Figure 1 ) differ in the following respects: Figure 8 In the high-frequency module 1 according to the sixth embodiment, the same components as those of the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals and their description is omitted.

[0185] (1) Structure

[0186] like Figure 8 As shown, the high-frequency module 1 according to the sixth embodiment includes a mounting substrate 2, a first electronic component 3, a second electronic component 4, a plurality of third electronic components 8, a plurality of resin layers 51 and 52, and a plurality of external connection terminals (not shown).

[0187] (1.1) Mounting substrate

[0188] like Figure 8 As shown, the mounting substrate 2 of the sixth embodiment includes a first principal surface 21 and a second principal surface 22. The mounting substrate 2 is a double-sided mounting substrate in which electronic components are mounted on the first principal surface 21 and the second principal surface 22, respectively.

[0189] (1.2) Third electronic component

[0190] like Figure 8 As shown, a plurality of third electronic components 8 are arranged on the second main surface 22 of the mounting substrate 2. The plurality of third electronic components 8 are, for example, IC (Integrated Circuit) components. In addition, it is also possible that a portion of each of the plurality of third electronic components 8 is arranged on the second main surface 22 of the mounting substrate 2, and the remaining portion of each of the plurality of third electronic components 8 is mounted inside the mounting substrate 2. In short, the plurality of third electronic components 8 are located on the side of the mounting substrate 2 that is closer to the second main surface 22 than to the first main surface 21, and have at least a portion mounted on the second main surface 22.

[0191] The plurality of third electronic components 8 each have a main body 81, a plurality of electrodes 82, and a plurality of third bumps 83. The plurality of electrodes 82 of the third electronic component 8 are connected to the plurality of third electrodes 79 provided on the second main surface 22 of the mounting substrate 2 via the plurality of third bumps 83, whereby the third electronic component 8 is arranged on the second main surface 22 of the mounting substrate 2.

[0192] The main body 81 has a functional part. The main body 81 is arranged on the mounting substrate 2 in a manner that a main surface 811 of the main body 81 faces the mounting substrate 2 in the thickness direction D1 of the mounting substrate 2. More specifically, when the third electronic component 8 is arranged on the mounting substrate 2, a main surface 811 of the main body 81 faces the second main surface 22 of the mounting substrate 2.

[0193] The plurality of electrodes 82 are formed on one main surface 811 of the main body 81. The plurality of electrodes 82 are provided on one main surface 811 of the main body 81 so as to be separated from each other, for example.

[0194] The third bumps 83 are bumps for connecting the electrodes 82 to the conductive layer of the mounting substrate 2. The third bumps 83 are arranged on the electrodes 82. Each of the third bumps 83 is formed in a circular shape, for example. Each of the third bumps 83 is formed of solder, for example.

[0195] In the case where the third electronic component 8 is an IC component, the third electronic component 8 includes, for example, a low noise amplifier and a switch.

[0196] The low noise amplifier has an input terminal and an output terminal. The low noise amplifier amplifies the received signal input to the input terminal and outputs it from the output terminal. The input terminal of the low noise amplifier is connected to the common terminal of the switch via an input matching circuit. The output terminal of the low noise amplifier is connected to the signal output terminal. Therefore, the output terminal of the low noise amplifier is connected to the signal processing circuit 92 via the signal output terminal.

[0197] The switch has a common terminal and a plurality of selection terminals. The switch is controlled by a controller (not shown). The switch switches the connection state between the common terminal and the plurality of selection terminals according to a control signal from the controller.

[0198] As examples of the switch included in the IC component, there are a first switch, a second switch, and a third switch.

[0199] The first switch is an antenna switch connected to an antenna terminal (not shown). The common terminal is connected to the antenna terminal. The antenna (not shown) is connected to the antenna terminal. The selection terminal is connected to, for example, a transmission filter (not shown) or a reception filter (not shown). The first switch is a switch capable of connecting at least one or more selection terminals among a plurality of selection terminals to the common terminal. The first switch is, for example, a switch capable of performing a one-to-one connection and a one-to-many connection.

[0200] The second switch is, for example, a frequency band selection switch for switching a signal path for multiple transmission signals with different communication frequency bands. The second switch has a common terminal and a plurality of selection terminals. The common terminal is connected to a power amplifier. The selection terminal is connected to a transmission filter. The second switch is a switch capable of connecting at least one or more selection terminals of the plurality of selection terminals to the common terminal. The second switch is, for example, a switch capable of performing a one-to-one connection and a one-to-many connection.

[0201] The third switch has a common terminal and a plurality of selection terminals. The common terminal is connected to the low noise amplifier via an input matching circuit. The selection terminal is connected to a receiving filter. The third switch is a switch capable of connecting at least one of the plurality of selection terminals to the common terminal. The third switch is, for example, a switch capable of one-to-one connection and one-to-many connection.

[0202] (1.3) Arrangement relationship between mounting substrate, first electronic component, second electronic component, and third electronic component

[0203] like Figure 8 As shown, the mounting substrate 2 has a plurality of first recesses 61, a plurality of second recesses 62, and a plurality of third recesses 63. The plurality of third recesses 63 are formed on the second main surface 22 of the mounting substrate 2. The plurality of third recesses 63 each have a bottom surface 631 and a side surface 632. Figure 1 ) Similarly, a first recess 61 and a plurality of second recesses 62 are formed on the first main surface 21 of the mounting substrate 2.

[0204] The mounting substrate 2 includes a plurality of first electrodes 71, a plurality of second electrodes 72, and a plurality of third electrodes 79. The plurality of third electrodes 79 are arranged on the bottom surfaces 631 of the plurality of third recesses 63. Figure 1 ) Similarly, multiple first electrodes 71 are arranged on the bottom surface 611 of the first recess 61, and multiple second electrodes 72 are arranged on the bottom surface 621 of the multiple second recesses 62.

[0205] The third bumps 83 of the third electronic components 8 are arranged in the third recesses 63 of the mounting substrate 2. More specifically, each of the third bumps 83 is arranged in the third recess 63 so that at least a portion of the third bump 83 is accommodated in the third recess 63.

[0206] By arranging the third bumps 83 of the third electronic component 8 in the third recesses 63 of the mounting substrate 2, the height of the third electronic component 8 from the surface of the second main surface 22 of the mounting substrate 2 where the third recesses 63 are not formed can be reduced, thereby achieving a lower profile of the high-frequency module 1.

[0207] In the mounting substrate 2 of the sixth embodiment, when viewed from above in the thickness direction D1 of the mounting substrate 2 , at least one of the plurality of third recesses 63 overlaps with the first recess 61 . Figure 8 In the example of FIG. 1 , when viewed from above in the thickness direction D1 of the mounting substrate 2, the third recess 63 on the rightmost side of the three third recesses 63 in which the third bump 83 of the third electronic component 8A is arranged overlaps with the first recess 61 on the leftmost side of the four first recesses 61 in which the first bump 33 of the first electronic component 3 is arranged. In addition, when viewed from above in the thickness direction D1 of the mounting substrate 2, the third recess 63 on the left side of the two third recesses 63 in which the third bump 83 of the third electronic component 8B is arranged overlaps with the first recess 61 on the rightmost side of the four first recesses 61 in which the first bump 33 of the first electronic component 3 is arranged.

[0208] In the mounting substrate 2 of the sixth embodiment, at least one of the plurality of third recesses 63 overlaps with the second recess 62 when viewed from above in the thickness direction D1 of the mounting substrate 2. Figure 8 In the example of FIG. 1 , when viewed from the thickness direction D1 of the mounting substrate 2, the leftmost third recess 63 of the three third recesses 63 of the third bump 83 of the third electronic component 8A is overlapped with the right second recess 62 of the two second recesses 62 of the second bump 43 of the second electronic component 4. The second recess 62 and the third recess 63 are electrically connected, for example, by a plurality of via conductors 76 and a wiring pattern conductor 773.

[0209] (1.4) Resin layer

[0210] like Figure 8As shown, the resin layer 51 is disposed on the first main surface 21 of the mounting substrate 2. The resin layer 51 is in contact with the first main surface 21 of the mounting substrate 2 and covers at least a portion of the first electronic component 3 and the second electronic component 4. Thus, the mounting substrate 2, the first electronic component 3, and the second electronic component 4 can be protected.

[0211] The resin layer 51 includes a resin and a filler (not shown). The resin is, for example, an epoxy resin. In the high-frequency module 1, the distance L1 between the main body 31 of the first electronic component 3 and the mounting substrate 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 enters around the first bump 33 of the first electronic component 3, so that when the high-frequency module 1 is mounted on the motherboard, solder splashing can be prevented. As a result, the connection reliability of the first electronic component 3 can be improved. In addition, the distance L2 between the main body 41 of the second electronic component 4 and the mounting substrate 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 enters around the second bump 43 of the second electronic component 4, so when the high-frequency module 1 is mounted on the motherboard, solder splashing can be prevented. As a result, the connection reliability of the second electronic component 4 can be improved.

[0212] like Figure 8 As shown, the resin layer 52 is disposed on the second main surface 22 of the mounting substrate 2. The resin layer 52 is in contact with the second main surface 22 of the mounting substrate 2 and covers at least a portion of the plurality of third electronic components 8. Thus, the mounting substrate 2 and the plurality of third electronic components 8 can be protected.

[0213] The resin layer 52 includes a resin and a filler (not shown). The resin is, for example, an epoxy resin. In the high-frequency module 1, the distance L3 between the main body 81 of the third electronic component 8 and the mounting substrate 2 is larger than the diameter of the filler included in the resin layer 52. As a result, the resin layer 52 enters the periphery of the third bump 83 of the third electronic component 8, so that solder splashing can be prevented when the high-frequency module 1 is mounted on the motherboard. As a result, the connection reliability of the third electronic component 8 can be improved.

[0214] (1.5) External connection terminals

[0215] A plurality of external connection terminals (not shown) are arranged, for example, on the second principal surface 22 of the mounting substrate 2. The plurality of external connection terminals are arranged on the second principal surface 22 of the mounting substrate 2 at intervals from each other.

[0216] The plurality of external connection terminals are columnar (eg, cylindrical) conductive members. The material of the plurality of external connection terminals is, for example, metal (eg, copper, copper alloy, etc.). The front end of each of the plurality of external connection terminals may include, for example, a gold-plated layer.

[0217] (2) Effect

[0218] In the high-frequency module 1 according to the sixth embodiment, the third electronic components 8A and 8B are arranged on the second main surface 22 of the mounting substrate 2. This can improve the mounting efficiency of the high-frequency module 1.

[0219] In the high-frequency module 1 according to the sixth embodiment, the third bump 83 of the third electronic component 8 is arranged in the third recess 63 of the mounting substrate 2. Thus, recesses (the first recess 61, the second recess 62, and the third recess 63) are formed on both surfaces of the mounting substrate 2 on the first principal surface 21 side and the second principal surface 22 side, and bumps (the first bump 33, the second bump 43, and the third bump 83) are arranged in the recesses, so that the high-frequency module 1 can be further reduced in height.

[0220] In the high-frequency module 1 according to the sixth embodiment, the first recess 61, the second recess 62, and the third recess 63 are formed in the mounting substrate 2. As a result, the distance between the bumps (first bump 33, second bump 43) of the electronic components (first electronic component 3, second electronic component 4) and the third bump 83 of the third electronic component 8 can be shortened compared to the case where the first recess 61, the second recess 62, and the third recess 63 are not formed, so the wiring length can be shortened. As a result, the wiring loss can be reduced.

[0221] In the high-frequency module 1 according to the sixth embodiment, the third recess 63 overlaps with at least one of the first recess 61 and the second recess 62 in the thickness direction D1 of the mounting substrate 2. Thus, the distance between the bumps (first bump 33, second bump 43) of the electronic components (first electronic component 3, second electronic component 4) and the third bump 83 of the third electronic component 8 can be shortened. Thus, the loss of wiring can be further reduced.

[0222] In the high-frequency module 1 according to the sixth embodiment, the first recess 61, the second recess 62, and the third recess 63 are formed on the mounting substrate 2. Thus, compared with a case where the first recess 61, the second recess 62, and the third recess 63 are not formed on the mounting substrate 2, the thickness of the mounting substrate 2 can be increased while maintaining the height of the high-frequency module 1, so that the strength of the mounting substrate 2 can be improved.

[0223] (3) Modification

[0224] Next, a modification example of Implementation 6 is described.

[0225] (3.1) Modification 1

[0226] A high-frequency module 1 according to the first variation of the sixth embodiment includes a mounting substrate 2 , a first electronic component 3 , a second electronic component 4 , a plurality of third electronic components 8 , a plurality of resin layers 51 , 52 , a plurality of external connection terminals (not shown), and a shield layer (not shown).

[0227] The shielding layer covers the resin layers 51, 52 and at least a portion of the mounting substrate 2. More specifically, the shielding layer covers one main surface and the peripheral surface of the resin layer 51, the peripheral surface of the mounting substrate 2, and the peripheral surface of the resin layer 52. One main surface of the resin layer 51 is the main surface of the resin layer 51 on the side opposite to the mounting substrate 2 side. In addition, regarding the shielding layer of the modification example 1 of the sixth embodiment, the description of the same structure and function as the shielding layer of the modification example 1 of the first embodiment is omitted.

[0228] (3.2) Modification 2

[0229] In high frequency module 1 according to variation 2 of embodiment 6, third electronic component 8 is not an IC component including a low noise amplifier and a switch, but a component other than an IC component. Third electronic component 8 may be, for example, only a low noise amplifier or only a switch.

[0230] The high-frequency modules 1 according to the above-described modifications also have the same effects as those of the high-frequency module 1 according to the sixth embodiment.

[0231] The embodiments and modifications described above are only a part of various embodiments and modifications of the present invention. In addition, the embodiments and modifications may be variously modified according to design and the like as long as the object of the present invention can be achieved.

[0232] (Way)

[0233] This specification discloses the following aspects.

[0234] The high-frequency module (1) according to the first mode includes a mounting substrate (2), a first electronic component (3), and a second electronic component (4). The mounting substrate (2) has a first main surface (21) and a second main surface (22). The first main surface (21) and the second main surface (22) face each other. The first electronic component (3) is disposed on the first main surface (21) of the mounting substrate (2) and has a first bump (33). The second electronic component (4) is disposed on the first main surface (21) of the mounting substrate (2) and has a second bump (43). The mounting substrate (2) has a first recess (61) and a second recess (62). The first recess (61) is formed in the first main surface (21). The second recess (62) is formed in the first main surface (21) and is different from the first recess (61). The first bump (33) is disposed in the first recess (61) of the mounting substrate (2). The second bump (43) is disposed in the second recess (62) of the mounting substrate (2). The mounting substrate (2) has a first region and a second region. The first region is a region where a plurality of recesses including the first recess (61) and the second recess (62) are formed. The second region is a region where no plurality of recesses are formed. When viewed from above in the thickness direction (D1) of the mounting substrate (2), the second region of the mounting substrate (2) is located between the first bump (33) of the first electronic component (3) and the second bump (43) of the second electronic component (4).

[0235] According to the high-frequency module (1) according to the first mode, it is possible to achieve both the low-profile of the high-frequency module (1) and the strength of the mounting substrate (2).

[0236] According to the high-frequency module (1) according to the first mode, compared with the case where the first recess (61) is not formed, the distance between the first electronic component (3) and the wiring conductor or wiring element built in the mounting substrate (2) can be shortened.

[0237] In the high-frequency module (1) according to the second mode, according to the first mode, the first bump (33) is an RF bump. The second bump (43) is a ground bump.

[0238] According to the high-frequency module (1) according to the second mode, the RF bump of the first electronic component (3) and the ground bump of the second electronic component (4) are separated by the second region. As a result, the short circuit between adjacent RF bumps and ground bumps can be reduced, and thus the mounting failure of the high-frequency module (1) can be suppressed.

[0239] In the high-frequency module (1) according to the third mode, according to the first mode or the second mode, the side surface (612; 622) of at least one of the first recess (61) and the second recess (62) of the mounting substrate (2) is a curved surface when viewed from above in the thickness direction (D1) of the mounting substrate (2).

[0240] According to the high-frequency module (1) involved in the third embodiment, the shape of at least one of the first recess (61) and the second recess (62) can be made close to the shape of the bump (the first bump 33, the second bump 43), so when the electronic component (the first electronic component 3, the second electronic component 4) is arranged on the mounting substrate (2), the self-positioning amount of the solder can be suppressed within the range of the recess (the first recess 61, the second recess 62). As a result, the mountability of the electronic component on the mounting substrate (2) can be improved. In other words, the mounting deviation of the electronic component can be reduced.

[0241] In the high-frequency module (1) according to a fourth aspect, according to any one of the first to third aspects, the mounting substrate (2) has a side electrode (73). The side electrode (73) is formed on a side surface (612; 622) of at least one of the first recess (61) and the second recess (62).

[0242] According to the high-frequency module (1) involved in the fourth embodiment, the contact area between the bumps (first bump 33, second bump 43) of the electronic component (first electronic component 3, second electronic component 4) and the electrodes in the recesses (first recess 61, second recess 62) can be increased, thereby improving the bonding strength between the bumps of the electronic component and the electrodes in the recesses. As a result, the mountability of the electronic component on the mounting substrate (2) can be improved.

[0243] According to the high-frequency module (1) of the fourth aspect, wiring can be extended from the side surfaces (612; 622) of the recesses (the first recess 61 and the second recess 62), so the degree of freedom of wiring can be improved.

[0244] In the high-frequency module (1) according to the fifth aspect, according to any one of the first to fourth aspects, the mounting substrate (2) has a wiring pattern conductor (78) formed in at least one of the first recess (61) and the second recess (62).

[0245] According to the high-frequency module (1) according to the fifth aspect, the degree of freedom of wiring can be improved.

[0246] According to any one of the first to fifth aspects, a high frequency module (1) according to a sixth aspect further comprises a wire-wound inductor (11). The wire-wound inductor (11) is disposed in at least one of the first recess (61) and the second recess (62).

[0247] According to the high-frequency module (1) of the sixth aspect, the height of the relatively tall wound inductor (11) can be reduced, thereby further reducing the height of the high-frequency module (1).

[0248] According to any one of the first to sixth aspects, the high frequency module (1) of the seventh aspect further comprises a third electronic component (8). The third electronic component (8) is arranged on the second main surface (22) of the mounting substrate (2) and has a third bump (83).

[0249] According to the high-frequency module (1) according to the seventh aspect, it is possible to improve the mounting efficiency of the high-frequency module (1).

[0250] In the high-frequency module (1) involved in the eighth aspect, according to the seventh aspect, the mounting substrate (2) further has a third recess (63). The third recess (63) is formed on the second main surface (22). The third bump (83) of the third electronic component (8) is arranged in the third recess (63) of the mounting substrate (2).

[0251] According to the high-frequency module (1) involved in the eighth embodiment, recesses (first recess 61, second recess 62, third recess 63) are formed on both sides of the first main surface (21) side and the second main surface (22) side of the mounting substrate (2), and bumps (first bump 33, second bump 43, third bump 83) are arranged in the recesses, so that the high-frequency module (1) can be further reduced in height.

[0252] According to the high-frequency module (1) involved in the eighth aspect, compared with a case where the first recess (61), the second recess (62) and the third recess (63) are not formed, the distance between the bumps (first bump 33, second bump 43) of the electronic component (first electronic component 3, second electronic component 4) and the third bump (83) of the third electronic component (8) can be shortened, thereby shortening the wiring length. As a result, the wiring loss can be reduced.

[0253] In the high-frequency module (1) involved in the ninth aspect, according to the eighth aspect, when viewed from above in the thickness direction (D1) of the mounting substrate (2), the third recess (63) of the mounting substrate (2) overlaps with at least one of the first recess (61) and the second recess (62) of the mounting substrate (2).

[0254] According to the high-frequency module (1) of the ninth aspect, the distance between the bumps (first bump 33, second bump 43) of the electronic components (first electronic component 3, second electronic component 4) and the third bump (83) of the third electronic component (8) can be shortened, thereby further reducing wiring loss.

[0255] According to any one of the first to ninth aspects, the high-frequency module (1) of the tenth aspect further comprises a resin layer (51). The resin layer (51) is in contact with the first main surface (21) of the mounting substrate (2) and covers at least a portion of the first electronic component (3) and the second electronic component (4).

[0256] According to the high-frequency module (1) involved in the tenth aspect, it is possible to protect the mounting substrate (2), the first electronic component (3), and the second electronic component (4).

[0257] In the high-frequency module (1) according to the tenth aspect, the resin layer (51) contains filler, and the distance (L1) between the first electronic component (3) and the mounting substrate (2) is larger than the diameter of the filler contained in the resin layer (51).

[0258] According to the high-frequency module (1) involved in the eleventh aspect, the resin layer (51) enters the periphery of the first bump (33) of the first electronic component (3), so that solder splashing can be prevented when the high-frequency module (1) is mounted on a motherboard. As a result, the connection reliability of the first electronic component (3) can be improved.

[0259] In the high-frequency module (1) according to the twelfth aspect, according to the tenth aspect, the resin layer (51) contains filler, and the distance (L1) between the first electronic component (3) and the mounting substrate (2) is smaller than the diameter of the filler contained in the resin layer (51).

[0260] According to the high-frequency module (1) according to the twelfth aspect, it is possible to further reduce the height of the high-frequency module (1).

[0261] In the high-frequency module (1) involved in the thirteenth aspect, according to any one of the first to twelfth aspects, the first electronic component (3) and the second electronic component (4) further include a main body (31, 41) including a functional part. The main bodies (31, 41) of the first electronic component (3) and the second electronic component (4) are located outside the mounting substrate (2).

[0262] According to the high-frequency module (1) involved in the thirteenth embodiment, the strength of the mounting substrate (2) can be improved compared to a case where a recessed portion of a main body portion (31, 41) for accommodating a first electronic component (3) and a second electronic component (4) is formed on the mounting substrate (2).

[0263] A communication device (9) according to a fourteenth aspect comprises the high frequency module (1) according to any one of the first to thirteenth aspects and a signal processing circuit (92). The signal processing circuit (92) is connected to the high frequency module (1).

[0264] According to the communication device (9) involved in the fourteenth aspect, in the high-frequency module (1), it is possible to achieve both a reduction in height of the high-frequency module (1) and the strength of the mounting substrate (2).

[0265] Description of Reference Numerals

[0266] 1: high frequency module; 11: wound inductor; 2: mounting substrate; 21: first main surface; 22: second main surface; 23: dielectric layer; 3: first electronic component; 31: main body; 311: one main surface; 32: electrode; 33: first bump; 4: second electronic component; 41: main body; 411: one main surface; 42: electrode; 43: second bump; 51, 52: resin layer; 61: first recess; 611: bottom surface; 612: side surface; 62: second recess; 621: bottom surface; 622: side surface; 63: third recess; 631: bottom surface; 6 32: side surface; 71: first electrode; 72: second electrode; 73: side surface electrode; 75, 771, 772, 78: wiring pattern conductor; 76: via conductor; 79: third electrode; 8, 8A, 8B: third electronic component; 81: main body; 811: one main surface; 82: electrode; 83: third bump; 9: communication device; 91: antenna; 92: signal processing circuit; 93: baseband signal processing circuit; 94: RF signal processing circuit; L1, L2, L3: distance; D1: thickness direction; D21: first direction; D22: second direction.

Claims

1. A high frequency module, comprising: A mounting substrate having a first main surface and a second main surface facing each other; A first electronic component, which is arranged on the first main surface of the mounting substrate and has a first bump; as well as a second electronic component disposed on the first main surface of the mounting substrate and having a second bump; in, The mounting substrate comprises: a first recess formed on the first main surface; as well as a second recessed portion formed on the first main surface and different from the first recessed portion, The first bump is arranged in the first recess of the mounting substrate. The second bump is arranged in the second recess of the mounting substrate, The mounting substrate comprises: a first region having a plurality of recesses formed therein including the first recess and the second recess; and a second region in which the plurality of recesses are not formed, The second region of the mounting substrate is located between the first bump of the first electronic component and the second bump of the second electronic component when viewed in plan from the thickness direction of the mounting substrate.

2. The high frequency module according to claim 1, wherein: The first bump is a radio frequency bump, i.e., an RF bump. The second bump is a ground bump.

3. The high frequency module according to claim 1 or 2, wherein: A side surface of at least one of the first recess and the second recess of the mounting substrate is a curved surface when viewed in plan from the thickness direction of the mounting substrate.

4. The high frequency module according to any one of claims 1 to 3, wherein: The mounting substrate has a side surface electrode formed on a side surface of at least one of the first recess and the second recess.

5. The high frequency module according to any one of claims 1 to 4, wherein: The mounting substrate includes a wiring pattern conductor formed in at least one of the first recess and the second recess.

6. The high frequency module according to any one of claims 1 to 5, wherein: The invention further includes a wire-wound inductor disposed in at least one of the first recessed portion and the second recessed portion.

7. The high frequency module according to any one of claims 1 to 6, wherein: A third electronic component is further provided. The third electronic component is arranged on the second main surface of the mounting substrate and has a third bump.

8. The high frequency module according to claim 7, wherein: The mounting substrate further includes a third recess formed on the second main surface. The third bump of the third electronic component is arranged in the third recess of the mounting substrate.

9. The high frequency module according to claim 8, wherein: The third recessed portion of the mounting substrate overlaps with at least one of the first recessed portion and the second recessed portion of the mounting substrate when viewed in plan from the thickness direction of the mounting substrate.

10. The high frequency module according to any one of claims 1 to 9, wherein: A resin layer is further provided, the resin layer being in contact with the first main surface of the mounting substrate and covering at least a portion of the first electronic component and the second electronic component.

11. The high frequency module according to claim 10, wherein: The resin layer contains a filler, A distance between the first electronic component and the mounting substrate is larger than a diameter of the filler contained in the resin layer.

12. The high frequency module according to claim 10, wherein: The resin layer contains a filler, A distance between the first electronic component and the mounting substrate is smaller than a diameter of the filler included in the resin layer.

13. The high frequency module according to any one of claims 1 to 12, wherein: The first electronic component and the second electronic component further include a main body portion including a functional portion, The main bodies of the first electronic component and the second electronic component are located outside the mounting substrate.

14. A communication device comprising: The high frequency module according to any one of claims 1 to 13; and The signal processing circuit is connected to the high frequency module.

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