Imaging driving device, camera module and assembling method of camera module

Abstract

The invention discloses an imaging driving device, a camera module and an assembling method of the camera module, and the imaging driving device comprises a base which is used for bearing a movable assembly; the imaging module comprises an imaging circuit board, and the imaging circuit board is used for being electrically connected with the photosensitive chip; the driving module comprises a shell and a driving circuit assembly, the driving circuit assembly is fixed to the inner wall of the shell and comprises a driving circuit board and a driving coil, the driving circuit board is fixed to the inner wall of the shell, and the driving coil is arranged on the driving circuit board; the driving coil and the movable assembly are oppositely arranged along a second direction and / or oppositely arranged along a third direction, the driving module is provided with an accommodating space, the accommodating space is suitable for the driving module to cover the light incident side of the imaging module along the first direction, and the driving circuit board conducts the imaging circuit board and the driving coil so as to drive the movable assembly to move.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular, to an imaging driving device, a camera module, and an assembling method for a camera module. Background Art

[0002] In the field of consumer electronics, especially in the field of smart devices, a miniaturized and lightweight camera module is an essential component. Currently, at least one or more camera modules are configured on a portable terminal body. A driving device is an indispensable element for a high-pixel camera module. During the operation of the camera module, the driving device can move the optical lens in multiple directions to achieve the AF function (Auto Focus) and OIS function (Optical Image Stabilization) during the shooting process.

[0003] To meet market demands, the requirements for the imaging quality and imaging functions of camera modules are getting higher and higher. The number of lenses in the optical lens is gradually increasing, resulting in an increasing volume and weight of the optical lens. Correspondingly, the driving device needs to have a greater driving force to ensure the rapid and stable movement of the optical lens.

[0004] Moreover, with the continuous thinning of electronic devices, the demand for miniaturization of camera modules is becoming more and more stringent, especially for the shoulder height of camera modules. The shoulder height of a camera module refers to the vertical height from the mounting substrate of the camera module (such as the imaging circuit board, the bottom surface of the camera module) to the highest point (such as the top surface of the camera module housing, the top surface of the optical lens). The shoulder height of the camera module will directly affect the thickness of the electronic device and the overall appearance design of the whole machine. It is necessary to strictly limit the shoulder height of the camera module to meet the requirements of the overall design of the electronic device.

[0005] However, in the related art, the structures of the driving device and the imaging module are usually designed independently and installed in a split manner. For example, the base of the driving device, the base of the imaging module, and the housing of the imaging module are three different components. The base of the driving device is mainly used to carry many functional components such as the driving circuit board and the movable component; while the base of the imaging module is mainly used to carry components such as the driving device and the optical lens, and the base of the imaging module is also used to attach the filter. The housing of the imaging module is covered on the base of the imaging module, so that the movable component, the base of the driving device, etc. are accommodated between the housing of the imaging module and the base of the imaging module. Moreover, when installing the driving device on the base of the imaging module, it is also necessary to consider avoiding capacitor components; when installing the housing of the imaging module on the base of the imaging module, it is also necessary to consider avoiding the base of the driving device and the driving circuit board. That is to say, for the two components of the base of the driving device and the base of the imaging module, factors such as their structural strength, the minimum wall thickness for injection molding, and the flatness of the finished product need to be considered separately. The housing of the imaging module also needs to independently consider factors such as its structural strength, the minimum wall thickness for injection molding, and the structure adapting to the base of the imaging module. Eventually, the overall height of the imaging module is increased by the bases of the driving device and the imaging module, and the overall size of the imaging module is enlarged. Summary of the Invention

[0006] An object of the present invention is to provide an imaging driving device, which integrates the driving circuit components of the imaging module into the housing of the imaging driving device, making the structure of the imaging module more compact and reducing the size of the imaging module; it can also form a modular semi-finished product, which is convenient for assembly and production.

[0007] An object of the present invention is to provide an imaging driving device, in which the driving module sinks or its orientation moves downward relative to the base of the imaging module, thereby reducing the shoulder height of the imaging module.

[0008] An object of the present invention is to provide an imaging driving device, which sets the driving control chip of the driving circuit components on the imaging circuit board, effectively reducing the damage to the driving control chip during the assembly process and reducing the loss of the driving control chip.

[0009] Another object of the present invention is to provide an imaging module, in which the movable component directly abuts against the base of the imaging driving device, realizing the sinking or orientation movement downward of the movable component, and further reducing the shoulder height of the imaging module.

[0010] Another object of the present invention is to provide an imaging module, which can reduce the components abutting against the base, thereby reducing the burden on the abutting area of the base.

[0011] Another object of the present invention is to provide an assembly method for assembling the above-mentioned imaging module.

[0012] To achieve at least one of the above objects, the technical solution adopted by the present invention is as follows: An imaging driving device includes: a base suitable for a movable component to lean on; an imaging module including an imaging circuit board for electrically connecting to a photosensitive chip; and a driving module including a housing and a driving circuit assembly. The driving circuit assembly is fixed to the inner wall of the housing. The driving circuit assembly includes a driving circuit board and a driving coil. The driving circuit board is fixed to the inner wall of the housing, and the driving coil is disposed on the driving circuit board. The driving coil is disposed opposite to the movable component along a second direction and / or along a third direction. The driving module is provided with a receiving space, and the receiving space enables the driving module to cover the light incident side of the imaging module along a first direction. The driving circuit board conducts the imaging circuit board and the driving coil to drive the movable component to move. Wherein, the first direction is parallel to the height direction of the imaging driving device, the second direction is parallel to the length direction of the imaging driving device, the third direction is parallel to the width direction of the imaging driving device, and the first direction, the second direction, and the third direction are orthogonal to each other in pairs.

[0013] As a preference, the base includes an inner base and an outer base surrounding the inner base. The driving module leans on the outer base, and the inner base is suitable for a filter to lean on. Wherein, the lower end surface of the driving module is lower than the inner top surface of the inner base to sink relative to the inner base.

[0014] As a preference, the driving circuit board includes at least two board bodies, and each board body is attached to the inner wall of the housing. The driving circuit board further includes a conducting portion disposed at the edge of at least one board body facing the imaging circuit board. The conducting portion is suitable for conducting with the imaging circuit board to conduct the driving circuit board and the imaging circuit board.

[0015] As a preference, the driving circuit assembly further includes a driving control chip disposed on the imaging circuit board and directly conducting with the imaging circuit board. Wherein, the base covers the driving control chip.

[0016] As a preference, the outer base includes a base portion formed on the imaging circuit board. The base portion is disposed along the edge of the imaging circuit board and is suitable for a movable component to lean on. The outer base further includes a side corner portion extending along the first direction located at the corner of the imaging circuit board. A coil groove is defined between two adjacent side corner portions, and the coil groove is suitable for accommodating the driving coil. Wherein, the side corner portion and the base portion are integrally formed, or the side corner portion is formed in the housing.

[0017] Preferably, the side corner portion is formed in the shell, and at least a portion of the side corner portion is spaced apart from the inner wall of the shell along the second direction and / or spaced apart along the third direction to form a limiting groove between the side corner portion and the inner wall of the shell, and the limiting groove is suitable for accommodating the driving circuit board so that the driving circuit board is clamped between the side corner portion and the inner wall of the shell.

[0018] As a preference, the inner base and the outer base are spaced apart to form an escape space between the inner base and the outer base, and the escape space is suitable for accommodating at least a part of the movable component.

[0019] As a preference, the driving circuit board further comprises a connecting portion, and the connecting portion can be bent to connect and conduct two adjacent plate bodies, so that each plate body of the driving circuit board and the connecting portion are integrally formed.

[0020] Preferably, at least two of the plates include a first plate, a second plate and a third plate, and when the driving circuit board is respectively attached to the inner wall of the outer shell, surfaces of the first plate, the second plate and the third plate are parallel to the first direction, wherein the first plate and the third plate are relatively arranged along the third direction, and the second plate is located between the first plate and the third plate; when the driving module is covered on the light incident side of the imaging module along the first direction, the first plate, the second plate and the third plate surround the outside of the movable component.

[0021] Preferably, the driving coil includes a focusing coil, a first anti-shake coil and a second anti-shake coil, wherein the focusing coil is arranged on the first plate body, the first anti-shake coil is arranged on the second plate body, and the second anti-shake coil is arranged on the third plate body.

[0022] Preferably, the driving circuit assembly further comprises a sensing device for sensing the position of the optical lens. The sensing device is electrically connected to the driving circuit board. When the driving module cover is disposed on the light incident side of the imaging module, the sensing device is located on the side of the driving circuit board facing the movable assembly.

[0023] Preferably, the imaging drive device further comprises a reinforcing plate, and the reinforcing plate is arranged on a surface of each of the plate bodies which is away from the driving coil, so as to support each of the plate bodies.

[0024] To achieve at least one of the above objects, the technical solution adopted by the present invention is as follows: An imaging module, comprising: the imaging driving device as described above; a photosensitive component, including a photosensitive chip, the photosensitive chip being electrically connected and disposed on the imaging circuit board of the imaging driving device for imaging; a movable component, movably disposed on the base of the imaging driving device; and an optical lens, carried by the movable component and being movably held on the photosensitive path of the photosensitive component.

[0025] As a preference, the movable component includes a focusing carrier, the focusing carrier including a main body portion and a guiding portion, the main body portion being used for carrying the optical lens; the guiding portion is located at at least two corners of the main body portion, the guiding portion extends along a first direction, and is used for supporting the focusing carrier to move relative to the base along the first direction, the guiding portion protrudes from the main body portion towards the imaging circuit board, so that at least a part of the guiding portion is received in the avoidance space of the base.

[0026] As a preference, the movable component includes a focusing guiding member, an inner guiding groove is formed on one side of the guiding portion facing the side corner portion of the base, and an outer guiding groove is formed on one side of the side corner portion facing the guiding portion, the openings of the inner guiding groove and the outer guiding groove are oppositely arranged along a second direction or along a third direction, so that the focusing guiding member is clamped between the groove walls of the inner guiding groove and the outer guiding groove.

[0027] As a preference, the imaging module further includes a driving magnet, the driving magnet is disposed on the movable component, and the driving magnet and the driving coil of the imaging driving device are oppositely arranged along the second direction and / or along the third direction to drive the movable component to move relative to the base.

[0028] As a preference, the driving magnet includes a focusing magnet, a first anti-shake magnet and a second anti-shake magnet. Among them, the focusing magnet and the focusing coil of the imaging driving device are oppositely arranged along the third direction to drive the movable component to move relative to the base along the first direction, the first anti-shake magnet and the first anti-shake coil of the imaging driving device are oppositely arranged along the second direction to drive the movable component to move relative to the base along the second direction, and the second anti-shake magnet and the second anti-shake coil of the imaging driving device are oppositely arranged along the third direction to drive the movable component to move relative to the base along the third direction.

[0029] To achieve at least one of the above objects, the technical solution adopted by the present invention is as follows: An assembling method for assembling the imaging module as described above, including the steps of: S1. Provide an imaging module and a movable component, and install the movable component on the base of the imaging module; S2. Provide an optical lens and install the optical lens on the movable component. Among them, the external coil semi-finished product jig and the photosensitive component of the imaging module are energized to assist in calibrating and installing the optical lens. S3. Provide a driving module. The driving module includes a housing and a driving circuit component fixed to the housing. Cover the driving module on the light incident side of the imaging module, and conduct the driving circuit board of the driving circuit component with the imaging circuit board of the imaging module.

[0030] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) Integrate the driving circuit component of the camera module into the housing of the imaging driving device, and integrate the base of the camera module on the imaging circuit board of the imaging module or on the housing of the driving module, so that the arrangement of functional devices and structural devices is more concentrated, and the structure of the camera module is more compact, thereby reducing the shoulder height of the camera module and facilitating the realization of the thin and light of the camera module.

[0031] (2) Set the driving control chip of the driving circuit component on the imaging circuit board, and the driving control chip is covered by the base, which is beneficial to avoiding damage to the driving control chip caused by the welding and disassembly of the imaging circuit board and the driving circuit board, and further reducing the loss of the driving control chip. Description of the Drawings

[0032] Figure 1 is a three-dimensional structure diagram of a camera module according to some embodiments of the present application.

[0033] Figure 2A is an exploded view of an imaging driving device according to some embodiments of the present application.

[0034] Figure 2B is an exploded view of an imaging driving device according to some other embodiments of the present application.

[0035] Figure 3A is a three-dimensional structure diagram of a driving module according to some embodiments of the present application.

[0036] Figure 3B is a three-dimensional structure diagram of a driving module according to some other embodiments of the present application.

[0037] Figure 4A is an exploded view of a driving module according to some embodiments of the present application.

[0038] Figure 4B is an exploded view of a driving module according to some other embodiments of the present application.

[0039] Figure 5 is a three-dimensional structure diagram of a housing according to some embodiments of the present application.

[0040] Figure 6A It is a three-dimensional structure diagram of an imaging module according to some embodiments of the present application.

[0041] Figure 6B It is a three-dimensional structure diagram of an imaging module according to some other embodiments of the present application.

[0042] Figure 7A-1 It is a cross-sectional view of an imaging module according to some embodiments of the present application.

[0043] Figure 7A-2 It is Figure 7A-1 an enlarged view of part A in

[0044] Figure 7B-1 It is a cross-sectional view of an imaging module according to some other embodiments of the present application.

[0045] Figure 7B-2 It is Figure 7B-1 an enlarged view of part B in

[0046] Figure 8A-1 It is another cross-sectional view of an imaging module according to some embodiments of the present application.

[0047] Figure 8A-2 It is Figure 8A-1 an enlarged view of part C in

[0048] Figure 8B-1 It is another cross-sectional view of an imaging module according to some other embodiments of the present application.

[0049] Figure 8B-2 It is Figure 8B-1 an enlarged view of part D in

[0050] Figure 9A It is a three-dimensional schematic diagram of a movable component placed in an imaging module according to some embodiments of the present application.

[0051] Figure 9B It is a three-dimensional schematic diagram of a movable component placed in an imaging module according to some other embodiments of the present application.

[0052] Figure 10 It is a three-dimensional structure diagram of a focusing carrier according to some embodiments of the present application.

[0053] Figure 11 It is a three-dimensional structure diagram of an anti-shake carrier according to some embodiments of the present application.

[0054] Figure 12 It is a three-dimensional structure diagram of a stop component according to some embodiments of the present application.

[0055] In the figure: 1. Imaging driving device; 10. Base; 11. Outer base; 111. Base portion; 1111. Outer top surface; 112. Side corner portion; 1121. Outer guiding groove; 113. Coil groove; 114. Lower buffer member; 12. Inner base; 121. Mounting portion; 1211. Through hole; 122. Step portion; 1221. Inner top surface; 13. Avoidance space; 2. Imaging module; 20. Photosensitive component; 21. Imaging circuit board; 22. Photosensitive chip; 23. Electronic component; 24. Filter; 25. Support plate; 3. Driving module; 30. Housing; 31. Limiting groove; 32. Accommodating space; 40. Driving circuit assembly; 41. Driving circuit board; 411. First plate body; 412. Second plate body; 413. Third plate body; 414. Connecting portion; 415. Conductive portion; 42. Driving coil; 421. Focusing coil; 422. First anti-shake coil; 423. Second anti-shake coil; 43. Sensing device; 44. Reinforcing plate; 4. Camera module; 50. Movable component; 51. Focusing carrier; 511. Main body portion; 5111. Resting surface; 5112. Focusing accommodating groove; 5113. Open area; 512. Guiding portion; 5121. Inner guiding groove; 5122. Lower end surface; 52. Anti-shake carrier; 521. First anti-shake accommodating groove; 522. Second anti-shake accommodating groove; 523. Anti-shake guiding groove; 60. Driving magnet; 61. Focusing magnet; 62. First anti-shake magnet; 63. Second anti-shake magnet; 71. Focusing guiding member; 72. Anti-shake guiding member; 81. Focusing insert panel; 82. Focusing magnetic guiding member; 83. Anti-shake magnetic guiding member; 90. Stopping component; 91. Bracket; 92. Upper buffer member; 100. Optical lens; 101. Lens barrel; 102. Lens. Detailed implementation manners

[0056] Next, in combination with the detailed implementation manners, the present invention will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined with each other to form new embodiments.

[0057] In the description of the present invention, it should be noted that for the orientation terms, such as the terms "center", "transverse", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the indicated orientation and position relationships are based on the orientation or position relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present invention.

[0058] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects and do not necessarily describe a specific order or sequence.

[0059] The terms "comprising", "having" and any variations thereof in the description and claims of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0060] This application provides an imaging module 4, as Figures 1 to 2B shown. The imaging module 4 includes an imaging driving device 1, a photosensitive component 20, a movable component 50, and an optical lens 100. The imaging driving device 1 is adapted to drive the movable component 50 to carry the optical lens 100 to move relative to the photosensitive component 20 to achieve the adjustment of optical performance, such as AF function and OIS function. Further, the functional devices with electrical performance in the imaging module 4 are integrated into the imaging driving device 1, so as to realize the sinking or downward movement of the functional devices, thereby reducing the shoulder height of the imaging module 4. Furthermore, the movable component 50 directly abuts against the base 10 of the imaging driving device 1, so as to realize the sinking or downward movement of the movable component 50, further reducing the shoulder height of the imaging module 4. In addition, through the imaging driving device 1, the devices for imaging and driving can be modularly integrated with the structural devices of the imaging module 4, making the structure of the imaging module 4 more compact.

[0061] Specifically, this application provides an imaging driving device 1, as Figure 2A and Figure 2B shown. The imaging driving device 1 integrates the functional devices with electrical performance of the imaging module 4 and the photosensitive component 20 of the imaging module 4. Specifically, the imaging driving device 1 includes a base 10, an imaging module 2, and a driving module 3. The base 10 is adapted for the movable component 50 to abut against. The imaging module 2 includes an imaging circuit board 21, and the imaging circuit board 21 is used for electrically connecting with a photosensitive chip 22, converting the optical signal captured by the photosensitive chip 22 into an electrical signal, and processing it.

[0062] The driving module 3 includes a housing 30 and a driving circuit assembly 40, as Figures 3A to 4BAs shown, the driving circuit assembly 40 is fixed to the inner wall of the housing 30. The driving circuit assembly 40 includes a driving circuit board 41 and a driving coil 42. The driving coil 42 is disposed on the driving circuit board 41. The driving circuit board 41 is fixed to the inner wall of the housing 30. The driving coil 42 and the movable assembly 50 are oppositely disposed along the second direction and / or along the third direction. Further, the driving circuit board 41 conducts the imaging circuit board 21 and the driving coil 42 to drive the movable assembly 50 to move relative to the base 10, thereby realizing the AF function and the OIS function. Further still, as Figure 2A and Figure 2B shown, the driving module 3 is provided with an accommodation space 32. The accommodation space 32 enables the driving module 3 to cover the light incident side of the imaging module 2 along the first direction. That is to say, at least part of the movable assembly 50, the photosensitive chip 22, and the base 10 can be accommodated in the accommodation space 32 of the driving module 3. Therefore, the housing 30 can protect at least part of the driving circuit assembly 40, the movable assembly 50, the photosensitive chip 22, and the base 10. As Figures 3A to 4B shown, the driving circuit assembly 40 is integrated into the housing 30 of the imaging driving device 1. This design makes the arrangement of the functional devices and structural devices of the camera module 4 more concentrated, which is beneficial to reducing the size of the camera module 4; and can form a modular semi-finished product, which is convenient for assembly and production.

[0063] Wherein, the first direction is parallel to the height direction of the imaging driving device 1, the second direction is parallel to the length direction of the imaging driving device 1, the third direction is parallel to the width direction of the imaging driving device 1, and the first direction, the second direction, and the third direction are orthogonal to each other in pairs.

[0064] It should be understood that in the related art, it is necessary to separately assemble the base of the camera module and the base of the driving device, then assemble the driving device to the base of the camera module, and finally cover the housing to complete the assembly of the camera module. Not only is the assembly process complicated, but also the adaptation between the base of the camera module, the driving device, and the housing needs to be considered during design. Moreover, the driving coil, the driving circuit board, etc. are exposed on the base of the driving device, which is difficult to store and is prone to aging and damage during storage.

[0065] In this embodiment, the driving circuit component 40 is integrated into the housing 30 to form a driving module 3. Moreover, the driving module 3 and the imaging module 2 can be assembled separately. Finally, the driving module 3 is covered on the imaging module 2, and the driving circuit board 41 and the imaging circuit board 21 are electrically connected, which is not only convenient for assembly, but also conducive to the independent design, development, iteration and update of the driving module 3 and the imaging module 2, and is beneficial to improving the scalability of the camera module 4. In addition, the driving coil 42, the driving circuit board 41, etc. are covered by the housing 30, which is convenient for storage and can effectively prevent aging. It is worth mentioning that in the related art, the movable component is supported on the base of the driving device. Further, the driving device is supported on the base of the camera module. The base of the camera module not only needs to carry the movable component, but also needs to carry the base of the driving device. In this embodiment, the movable component 50 directly abuts against the base 10, so as to reduce the components abutting against the base 10, thereby reducing the burden on the abutting area of the base 10.

[0066] In addition, as Figures 1 to 2B shown, in this embodiment, the driving circuit board 41 electrically connects the imaging circuit board 21 and the driving coil 42. That is to say, the driving circuit board 41 is directly electrically connected to the imaging circuit board 21, so as to supply power to the driving circuit board 41 and the driving coil 42 through the imaging circuit board 21. It should be understood that compared with the process of electrically connecting the driving coil 42 and the imaging circuit board 21 by using the insert molding process, in this embodiment, the process of electrically connecting the imaging circuit board 21 and the driving coil 42 through the driving circuit board 41 is more mature, which is beneficial to improving the yield of the imaging driving device 1 and can also reduce the production cost of the imaging driving device 1.

[0067] In some embodiments, as Figure 6A and Figure 6B shown, the base 10 includes an inner base 12, and the inner base 12 is suitable for the filter 24 to abut against, so that the filter 24 is located on the light sensing path of the photosensitive chip 22. The base 10 further includes an outer base 11 surrounding the inner base 12, and the driving module 3 abuts against the outer base 11. That is to say, the outer base 11 can support and assist in positioning the driving module 3, and the movable component 50 is accommodated in the driving module 3 and the outer base 11. Among them, as Figures 7A-1 to 7B-1 shown, the surface of the inner base 12 facing the light incident side forms an inner top surface 1221, and the lower end surface of the driving module 3 is lower than the inner top surface 1221 of the inner base 12, so as to sink relative to the inner base 12, thereby reducing the size of the imaging driving device 1 in the first direction, which is beneficial to reducing the shoulder height of the camera module 4.

[0068] In at least one embodiment, as Figure 7A-2 and Figure 7B-2As shown in the figure, the lower end surface of the driving module 3 refers to the side of the driving circuit board 41 facing the imaging circuit board 21. That is to say, the driving circuit board 41 fixed to the inner wall of the housing 30 extends out of the housing 30 along the first direction, so that along the first direction, the distance between the driving circuit board 41 and the imaging circuit board 21 is less than the distance between the housing 30 and the imaging circuit board 21. Further, the side of the driving circuit board 41 facing the imaging circuit board 21 is lower than the inner top surface 1221 of the inner base 12, so that the driving circuit assembly 40 sinks relative to the base 10, which is conducive to reducing the size of the imaging driving device 1 along the first direction. Furthermore, the housing 30 covers the outer periphery of the outer base 11, so that the side of the housing 30 facing the imaging circuit board 21 is also lower than the inner top surface 1221 of the inner base 12, further reducing the size of the imaging driving device 1 along the first direction, thereby reducing the shoulder height of the camera module 4.

[0069] It should be understood that in the related art, the driving circuit board is supported on the base of the driving device, and further the base of the driving device is supported on the base of the camera module, so it is difficult to realize the sinking of the driving circuit board and the driving coil relative to the base of the camera module. In this embodiment, the base 10 integrates the functions of the base of the camera module and the base of the driving device in the related art, which is conducive to realizing the sinking of the driving circuit assembly 40 relative to the inner base 12, and further reducing the shoulder height of the camera module 4.

[0070] In some embodiments, as Figures 3A to 4B shown, the driving circuit board 41 includes at least two board bodies, and each board body is attached to the inner wall of the housing 30. Specifically, each board body is respectively attached to different side inner walls of the housing 30, so that each circuit board surrounds the outside of the movable component 50. A driving coil 42 is provided on the side of the board body facing the movable component 50, which can make the movable component 50 move along the first direction and / or move along the second direction and / or move along the third direction. It is worth noting that each board body and the driving coil 42 on the board body are attached to different side inner walls of the housing 30, which is conducive to the reasonable distribution of the driving coil 42, thereby reducing the size of the imaging driving device 1; it is also conducive to balancing the overall weight of the driving module 3, so that when the driving module 3 covers the light incident side of the imaging module 2, it can effectively prevent the driving module 3 from tilting due to the eccentricity of its own weight.

[0071] Further, as Figure 2A and Figure 2BAs shown, the driving circuit board 41 further includes a conduction part 415. The conduction part 415 is arranged at the edge of at least one board body facing the imaging circuit board 21. The conduction part 415 is adapted to conduct with the imaging circuit board 21, so as to conduct the driving circuit board 41 and the imaging circuit board 21. It should be understood that directly welding and conducting the driving circuit board 41 and the imaging circuit board 21 is beneficial to avoiding additionally arranging a flexible printed circuit board for connecting the driving circuit board 41 and the imaging circuit board 21, reducing the space required for additionally arranging the flexible printed circuit board, and being beneficial to realizing miniaturization of the camera module 4. Moreover, during the design process of the camera module 4, there is no need to consider the installation position and installation method of the flexible printed circuit board, thereby reducing the design difficulty and complexity of the camera module 4.

[0072] In at least one embodiment, the respective board bodies are conducted with each other, including but not limited to being conducted through a connecting band or by welding between adjacent board bodies. Further, a conduction part 415 is arranged at the edge of one of the board bodies facing the imaging circuit board 21 to conduct with the imaging circuit board 21, so as to further conduct the driving circuit board 41 and the imaging circuit board 21, thereby simplifying the welding operation between the driving module 3 and the imaging module 2.

[0073] In at least one embodiment, conduction parts 415 are arranged at the edges of all the board bodies facing the imaging circuit board 21, so that each board body is independently conducted with the imaging circuit board 21. It should be understood that each board body is located on a different side of the imaging circuit board 21 and is conducted with a different side of the imaging circuit board 21. This is beneficial to making the wiring on the imaging circuit board 21 more uniform, reducing the risk of defects such as short circuits and open circuits during the manufacturing process of the imaging circuit board 21; and is also beneficial to reducing the stress concentration points on the imaging circuit board 21, thereby improving the reliability of the imaging circuit board 21.

[0074] In some embodiments, as Figure 4A and Figure 4B shown, the driving circuit board 41 further includes a connecting part 414. The connecting part 414 is bendably connected and conducts adjacent two board bodies. That is to say, the connecting part 414 functions as a connecting strip, enabling mechanical connection and electrical connection between the board bodies, so that each board body of the driving circuit board 41 and the connecting part 414 are integrally formed.

[0075] It should be understood that the connecting portion 414 is flexible and can be bent. Therefore, when the driving coil 42 is installed on the driving circuit board 41, the respective plate bodies can be arranged coplanarly, facilitating the installation and conduction operation of the driving coil 42, thereby improving the assembly accuracy and assembly efficiency of the driving coil 42. Further, when the driving circuit board 41 is installed on the inner wall of the housing 30, by bending the connecting portion 414, the respective plate bodies can be fixedly arranged non-coplanarly on the inner wall of the housing 30, such that the driving circuit board 41 surrounds the outside of the movable component 50. In this way, the driving coil 42 can be located on the side of the plate body facing the movable component 50, so as to be oppositely arranged relative to the movable component 50 along the second direction and / or along the third direction.

[0076] In some embodiments, such as Figure 4A and Figure 4B shown, at least two plate bodies include a first plate body 411, a second plate body 412, and a third plate body 413. When the driving circuit board 41 is respectively attached to the inner wall of the housing 30, the surfaces of the first plate body 411, the second plate body 412, and the third plate body 413 are all parallel to the first direction. Among them, the first plate body 411 and the third plate body 413 are oppositely arranged along the third direction, and the second plate body 412 is located between the first plate body 411 and the third plate body 413; when the driving module 3 covers the light incident side of the imaging module 2 along the first direction, the first plate body 411, the second plate body 412, and the third plate body 413 can surround the outside of the movable component 50. Further, the driving coil 42 includes a focusing coil 421, a first anti-shake coil 422, and a second anti-shake coil 423. Among them, the focusing coil 421 is disposed on the surface of the first plate body 411 facing the movable component 50, and is used to drive the movable component 50 of the imaging module 4 to move relative to the base 10 along the first direction; the first anti-shake coil 422 is disposed on the surface of the second plate body 412 facing the movable component 50, and is used to drive the movable component 50 of the imaging module 4 to move relative to the base 10 along the second direction; the second anti-shake coil 423 is disposed on the surface of the third plate body 413 facing the movable component 50, and the second anti-shake coil 423 is used to drive the movable component 50 of the imaging module 4 to move relative to the base 10 along the third direction.

[0077] In some embodiments, the drive circuit assembly 40 further includes a drive control chip, which is disposed on the imaging circuit board 21 and is directly conductively connected to the imaging circuit board 21. That is to say, the drive control chip, the photosensitive chip 22, and the electronic component 23 are all disposed on the imaging circuit board 21, thereby improving the integration of electronic devices, making the signal transmission path more concentrated, and also being beneficial to reducing the influence of external electromagnetic interference on the drive control chip, thereby improving the reliability of the AF function and the OIS function.

[0078] It is worth mentioning that by disposing the drive control chip on the imaging circuit board 21, during the process of welding the drive circuit board 41 to the imaging circuit board 21 or detaching the drive circuit board 41 from the imaging circuit board 21, the influence of welding mistakes or detachment damage on the drive control chip can be reduced. That is to say, it is possible to protect the drive control chip, the photosensitive chip 22, and the electronic components 23 integrated on the imaging circuit board 21 to reduce losses. It should be understood that in the drive circuit assembly 40, the cost of the drive control chip is relatively high. Reducing the loss of the drive control chip can reduce the production cost of the imaging drive device 1. In addition, when it is necessary to upgrade the AF function and OIS function of the imaging drive device 1, only the imaging circuit board 21 needs to be adjusted and updated, without the need to adjust the drive circuit board 41, which can improve the scalability of the imaging drive device 1 and reduce the iteration cost of the imaging drive device 1.

[0079] Furthermore, the base 10 covers the drive control chip, which can protect the drive control chip, is conducive to avoiding collisions between the drive control chip and the movable component 50, or damage to the drive control chip during the assembly process or under the action of external impacts, thereby prolonging the service life of the drive control chip.

[0080] It is worth noting that the drive control chip can also be disposed on the drive circuit board 41 and directly conduct with the drive circuit board 41 to shorten the signal transmission path between the drive control chip and the drive coil 42, which can reduce signal interference and signal delay, thereby improving the speed, stability, and accuracy of drive control. In addition, the drive circuit board 41 is fixed to the inner wall of the housing 30. When the drive control chip is disposed on the drive circuit board 41, it is conducive to the drive control chip to dissipate heat through the housing 30, improve the heat dissipation efficiency of the drive control chip, and prolong the service life of the drive control chip.

[0081] In some embodiments, as Figures 5 to 6B shown, the outer base 11 includes a base portion 111 formed on the imaging circuit board 21. The base portion 111 is disposed along the edge of the imaging circuit board 21 and is adapted to be leaned on by the movable component 50, thereby assisting in positioning and supporting the movable component 50, which is conducive to avoiding collisions between the movable component 50 and the imaging circuit board 21. Further, the outer base 11 further includes side corner portions 112 extending in the first direction. The side corner portions 112 are located at the corners of the imaging circuit board 21. The movable component 50 is placed in the area surrounded by each side corner portion 112 so as to be able to move within the area to implement the AF function and the OIS function. Further still, a coil groove 113 is defined between two adjacent side corner portions 112. The coil groove 113 is adapted to accommodate the drive coil 42, thereby making the structure between the drive circuit assembly 40 and the base 10 more compact, which is conducive to reducing the dimensions of the imaging drive device 1 along the second direction and the third direction.

[0082] Among them, as Figure 6A shown, the side corner portion 112 and the base portion 111 are integrally formed, thereby improving the connection strength and structural strength between the side corner portion 112 and the base portion 111. In addition, it can also make the movable component 50 more conveniently positioned and installed on the base 10. Or, as Figure 5 shown, the side corner portion 112 is formed within the housing 30, thereby making the structure between the side corner portion 112 and the housing 30 more compact, which is beneficial to avoiding the generation of additional installation gaps between the housing 30 and the base 10, and further reducing the dimensions of the imaging driving device 1 in the second direction and the third direction. That is to say, the side corner portion 112 of the base 10 of the camera module 4 is integrated on the imaging circuit board 21 of the imaging module 2 or integrated on the housing 30 of the driving module 3, so that the arrangement of the structural components is more concentrated, making the structure of the camera module 4 more compact, thereby reducing the shoulder height of the camera module 4, which is beneficial to realizing the thin and light of the camera module 4.

[0083] In some embodiments, as Figure 5 shown, the side corner portion 112 is formed within the housing 30, and at least a part of the side corner portion 112 is spaced from the inner wall of the housing 30 in the second direction and / or in the third direction, so as to form a limiting groove 31 between the side corner portion 112 and the inner wall of the housing 30. The limiting groove 31 is adapted to accommodate the driving circuit board 41, so that the driving circuit board 41 is clamped between the side corner portion 112 and the inner wall of the housing 30.

[0084] Specifically, when the respective plates of the driving circuit board 41 are separately arranged, the limiting groove 31 is adapted to accommodate the end portion of the plate, so that the end portion of the plate is clamped between the side corner portion 112 and the inner wall of the housing 30, and the driving coil 42 provided in the middle section of the plate can be accommodated in the coil groove 113 between the side corner portions 112. When the respective plates of the driving circuit board 41 are connected and conducted through the connecting portion 414, that is, when the driving circuit board 41 is integrally formed, the limiting groove 31 is adapted to accommodate the connecting portion 414, or is adapted to accommodate the connecting portion 414 and the end portion of the plate, so that the imaging circuit board 21 is clamped between the side corner portion 112 and the inner wall of the housing 30, and the driving coil 42 provided in the middle section of the plate can be accommodated in the coil groove 113 between the side corner portions 112, as Figure 3B shown.

[0085] It should be understood that the side corner portion 112 is formed within the housing 30, making the structure between the side corner portion 112 of the base 10 and the housing 30 more compact, which is conducive to avoiding the generation of additional installation gaps between the side corner portion 112 and the housing 30, thereby reducing the overall size of the imaging driving device 1. In addition, through the limiting groove 31 formed between the side corner portion 112 and the housing 30, it is possible to assist in limiting the driving circuit board 41, improve the position accuracy of the installation of the driving circuit board 41, and improve the installation efficiency of the driving circuit board 41. Further, the driving circuit board 41 is clamped between the side corner portion 112 and the inner wall of the housing 30, which can improve the reliability of the connection between the driving circuit board 41 and the housing 30 and is conducive to preventing the driving circuit board 41 from falling off the housing 30. It is worth noting that the driving circuit board 41 can also be attached to the inner wall of the housing 30 to further improve the reliability of the connection between the driving circuit board 41 and the housing 30.

[0086] In some embodiments, as Figures 8A-1 to 8B-2 shown, the inner base 12 and the outer base 11 are spaced apart to form a relief space 13 therebetween, and the relief space 13 is adapted to accommodate at least a part of the movable component 50. That is to say, during the movement of the movable component 50 in the first direction, especially when the movable component 50 moves to the lowermost end of the focusing stroke in the first direction, at least a part of the movable component 50 extends into the relief space 13 in the first direction to be located between the base portions 111 of the inner base 12 and the outer base 11, so that the structure of the imaging module 4 is more compact, which is conducive to reducing the shoulder height of the imaging module 4 and can also increase the focusing stroke of the movable component 50 while maintaining a lower shoulder height of the imaging module 4, thereby enhancing the AF function of the imaging module 4.

[0087] In some embodiments, as Figure 8A-2 and Figure 8B-2As shown in the figure, the inner base 12 includes a mounting portion 121 and a stepped portion 122. The mounting portion 121 is formed on the imaging circuit board 21 and is used to carry the filter 24. Further, a through hole 1211 is formed in the mounting portion 121, and the through hole 1211 is adapted to expose the photosensitive area of the photosensitive chip 22, so that the filter 24 and the photosensitive area of the photosensitive chip 22 are arranged opposite to each other in the first direction. It is worth noting that the mounting portion 121 covers and mounts the electronic components 23, the drive control chip, and the edge of the photosensitive chip 22 on the imaging circuit board 21, thereby protecting the electronic components 23 and the drive control chip, and also being able to assist in limiting the position of the photosensitive chip 22. The stepped portion 122 is convexly provided on the light incident side surface of the mounting portion 121 in the first direction. The stepped portion 122 surrounds the outer periphery of the filter 24, and, in the first direction, the upper surface of the stepped portion 122 is higher than the upper surface of the filter 24. Furthermore, the stepped portion 122 can protect the filter 24, which is beneficial to avoiding the collision between the movable component 50 and the filter 24 during the movement of the movable component 50 in the first direction.

[0088] In some embodiments, as Figures 6A to 7B-2 shown, the light incident side surface of the inner base 12 forms an inner top surface 1221, that is, the upper surface of the stepped portion 122 forms the inner top surface 1221; the light incident side surface of the base portion 111 forms an outer top surface 1111, and the outer top surface 1111 abuts against the movable component 50. That is to say, when the movable component 50 moves to the lowermost end of the focusing stroke in the first direction, the outer top surface 1111 abuts against the movable component 50, and then the outer top surface 1111 assists in positioning and supporting the movable component 50, which is beneficial to avoiding the collision between the movable component 50 and the imaging circuit board 21 or the inner base 12; at the same time, at least a part of the movable component 50 is located in the avoidance space 13, so that the structure between the movable component 50 and the imaging module 2 is more compact. In at least one embodiment, in the first direction, the outer top surface 1111 is lower than the inner top surface 1221, which is beneficial to further realize the sinking or downward displacement of the movable component 50 and reduce the shoulder height of the camera module 4.

[0089] In some embodiments, as Figures 3A to 4B shown, the drive circuit assembly 40 further includes a sensing device 43. The sensing device 43 is used to sense the position of the optical lens 100 in order to realize the closed-loop control of the movable component 50, thereby improving the reliability of the AF function and the OIS function of the camera module 4. Specifically, the sensing device 43 is electrically connected and arranged on the drive circuit board 41. When the drive module 3 covers the light incident side of the imaging module 2, the sensing device 43 is located on the side of the drive circuit board 41 facing the movable component 50, so that the sensing device 43 and the movable component 50 are arranged opposite to each other in the second direction and / or in the third direction.

[0090] In at least one embodiment, the sensing device 43 is located inside the driving coil 42, so that the driving coil 42 and the sensing device 43 on the driving circuit board 41 are arranged more compactly, thereby reducing the area of the driving circuit board 41, which is beneficial to further reducing the size of the imaging module 4. In at least one other embodiment, the sensing device 43 is located outside the driving coil 42, thereby reducing the magnetic interference phenomenon of the driving coil 42 on the sensing device 43, making the detection result of the sensing device 43 more accurate, and improving the accuracy of the position control of the imaging module 4 for the optical lens 100.

[0091] In some embodiments, as Figures 3A to 4B shown, the imaging driving device 1 further includes a reinforcing plate 44, and the reinforcing plate 44 is disposed on the surface of each plate body on the side facing away from the driving coil 42 to support each plate body, improve the structural strength of the plate body and improve the flatness of the plate body. It should be understood that the reinforcing plate 44 is located on the side of the plate body facing away from the driving coil 42, which is also beneficial to resist external impacts and protect the plate body, the driving coil 42, and even the base 10 and the movable component 50. It is worth mentioning that when the reinforcing plate 44 is fixed to the inner wall of the housing 30, the structural strength of the housing 30 can also be improved, and the risk of damage to the housing 30 under external impact can be reduced. Among them, the reinforcing plate 44 includes but is not limited to metal plates such as steel plates and copper plates, and plastic plates, and the present application does not make specific limitations on this.

[0092] In at least one embodiment, the reinforcing plate 44 is implemented as a metal plate, and further the reinforcing plate 44 can also act as a yoke. Specifically, the reinforcing plate 44 is located on the side of the driving coil 42 facing away from the driving magnet 60 of the imaging module 4, and can constrain the magnetic field of the driving magnet 60, reduce the diffusion of the magnetic field of the driving magnet 60 outside the imaging module 4, thereby improving the utilization efficiency of the magnetic field, enhancing the driving force of the imaging driving device 1 and improving the driving stability. In addition, it can reduce the electromagnetic interference of the magnetic field of the driving magnet 60 on the external circuit and improve the stability of the electronic device installing the imaging module 4.

[0093] An imaging module 4, such as Figures 1 to 2B , and Figures 7A-1 to 12As shown in the figure, it includes: the above-mentioned imaging driving device 1, photosensitive component 20, movable component 50, and optical lens 100. The photosensitive component 20 includes a photosensitive chip 22, and the photosensitive chip 22 is electrically connected and arranged on the imaging circuit board 21 of the imaging driving device 1 for imaging. The movable component 50 is movably arranged on the base 10 of the imaging driving device 1. The optical lens 100 is carried by the movable component 50 and is movably held on the photosensitive path of the photosensitive component 20 to collect external imaging light, and the optical lens 100 defines an optical axis O. Specifically, the movable component 50 is adapted to carry the optical lens 100 and drive the optical lens 100 to move in the first direction to achieve the AF function, and move in the second direction and / or the third direction to achieve the OIS function.

[0094] In some embodiments, as Figure 1 shown in the figure, the optical lens 100 includes a lens barrel 101 and at least one lens 102 installed in the lens barrel 101. In at least one embodiment, the lens barrel 101 is integrally formed with the anti-shake carrier 52 of the imaging driving device 1, thereby improving the structural strength of the lens barrel 101, as well as the connection strength and connection reliability between the lens barrel 101 and the anti-shake carrier 52.

[0095] In some embodiments, as Figure 2A and Figure 2B shown in the figure, the camera module 4 further includes a driving magnet 60. The driving magnet 60 is arranged on the movable component 50, and the driving magnet 60 and the driving coil 42 of the imaging driving device 1 are arranged opposite to each other in the second direction and / or in the third direction, and then drive the movable component 50 to move relative to the base 10 through the Lorentz force between the driving coil 42 and the driving magnet 60.

[0096] It should be understood that compared with the driving magnet 60 and the driving coil 42 being arranged opposite to each other in the first direction, in this embodiment, the driving magnet 60 and the driving coil 42 are arranged opposite to each other in the second direction and / or in the third direction, which is beneficial to avoiding the stacking of the driving magnet 60 and the driving coil 42 in the first direction, thereby reducing the shoulder height of the camera module 4 and being beneficial to meeting the development trend of the thinning of electronic devices. In addition, compared with the driving coil 42 being arranged on the movable component 50 and the driving magnet 60 being arranged on the base 10 or the housing 30, in this embodiment, the driving magnet 60 is arranged on the movable component 50 and the driving coil 42 is arranged on the housing 30, which can reduce the electromagnetic interference of the camera module 4 on the external circuit and is beneficial to improving the stability of the electronic device installed with the camera module 4.

[0097] In some embodiments, as Figure 2A and Figure 2BAs shown, the movable component 50 includes an anti-shake carrier 52 and a focusing carrier 51. The anti-shake carrier 52 is used to carry the optical lens 100, and the focusing carrier 51 is stacked on the anti-shake carrier 52 and the base 10 in the first direction. Specifically, the anti-shake carrier 52 and the optical lens 100 move relative to the focusing carrier 51 in the second direction and / or in the third direction together to achieve the OIS function; the focusing carrier 51, the anti-shake carrier 52, and the optical lens 100 move relative to the base 10 in the first direction together to achieve the AF function. It is worth mentioning that the focusing carrier 51 is stacked between the anti-shake carrier 52 and the base 10 in the first direction, which can enable the camera module 4 to have both a lower shoulder height and better focusing performance.

[0098] In some embodiments, as Figure 10 shown, the focusing carrier 51 includes a main body portion 511. The main body portion 511 is used to carry the anti-shake carrier 52 and the optical lens 100, so that the anti-shake carrier 52, the optical lens 100, and the focusing carrier 51 move relative to the base 10 in the first direction together. An abutting surface 5111 is formed on one side of the main body portion 511 facing the photosensitive chip 22. When the focusing carrier 51 moves to the lowermost end of the focusing stroke in the first direction, the abutting surface 5111 abuts against the outer top surface 1111 of the base portion 111 of the outer base 11, so as to assist in positioning and supporting the focusing carrier 51 through the base portion 111, which is beneficial to avoiding collision between the focusing carrier 51 and the imaging circuit board 21 or the inner base 12.

[0099] Furthermore, as Figure 10 shown, the focusing carrier 51 further includes a guiding portion 512. The guiding portion 512 is located at at least two corners of the main body portion 511. The guiding portion 512 extends in the first direction and is used to support the focusing carrier 51 to move relative to the base 10 in the first direction. The guiding portion 512 protrudes from the main body portion 511 towards the imaging circuit board 21, so that at least a part of the guiding portion 512 is accommodated in the avoidance space 13 between the base portion 111 of the outer base 11 and the inner base 12. It should be understood that a lower end surface 5122 is formed on one side of the guiding portion 512 facing the imaging circuit board 21. During the movement of the movable component 50 in the first direction, especially when the abutting surface 5111 of the main body portion 511 abuts against the outer top surface 1111 of the base portion 111, in the first direction, the lower end surface 5122 is lower than the outer top surface 1111 and the inner top surface 1221 of the inner base 12, so that the structure between the movable component 50 and the imaging module 2 is more compact, realizing the sinking or downward displacement of the movable component 50 and reducing the shoulder height of the camera module 4, as Figure 8A-2 and Figure 8B-2 shown.

[0100] In some embodiments, as Figures 8A-1 to 8B-2 , and Figure 10As shown, the movable assembly 50 includes a focus guide 71, an inner guide groove 5121 is provided on the side of the guide portion 512 facing the side corner portion 112 of the base 10, an outer guide groove 1121 is provided on the side corner portion 112 facing the guide portion 512, and the opening of the inner guide groove 5121 and the opening of the outer guide groove 1121 are arranged relative to each other along the second direction or along the third direction, so that the focus guide 71 is clamped between the groove wall of the inner guide groove 5121 and the groove wall of the outer guide groove 1121, and then the focus guide 71 can support the focus carrier 51 to move relative to the base 10 along the first direction to realize the AF function. It should be understood that the focus guide 71 can reduce the friction force when the focus carrier 51 and the base 10 move relative to each other, thereby reducing the driving force required to drive the focus carrier 51, which is conducive to improving the flexibility and stability of the movement of the focus carrier 51. Among them, the focus guide 71 includes but is not limited to balls, rollers, guide rods, etc., and this application does not make specific restrictions on this.

[0101] It should be understood that the guide portion 512 protrudes from the main body 511 toward the imaging circuit board 21, which can increase the size of the guide portion 512 along the first direction. In the process of the focusing carrier 51 moving relative to the base 10 along the first direction, it is beneficial to prevent the focusing guide 71, such as a ball, from detaching from the inner guide groove 5121 and the outer guide groove 1121, thereby improving the reliability of the camera module 4.

[0102] In at least one embodiment, Figure 10 As shown, the focus carrier 51 includes two guide parts 512, and the two guide parts 512 are located at two adjacent corners of the main body 511, that is, the two guide parts 512 are located on the same side of the main body 511. Specifically, the two guide parts 512 are respectively provided with inner guide grooves 5121 on the same side facing the base 10, that is, the opening directions of the inner guide grooves 5121 on the two guide parts 512 are the same. Further, outer guide grooves 1121 are respectively provided on two side corners 112 of the base 10, so that the inner guide grooves 5121 and the outer guide grooves 1121 are arranged one by one, and focus guides 71 are respectively arranged between the two groups of inner guide grooves 5121 and the outer guide grooves 1121 to support the focus carrier 51 to move relative to the base 10 along the first direction. It should be understood that the two guide portions 512 are located at two adjacent corners of the main body 511, and the two groups of focus guide members 71 are clamped between the focus carrier 51 and the base 10 along the second direction or along the third direction, which can reduce the rotation or tilt of the focus carrier 51 that may occur during the movement, thereby improving the stability of the focus drive; and, it can also reduce the friction resistance and improve the speed and sensitivity of the focus drive; in addition, it can also make the structure of the camera module 4 more compact, thereby realizing the miniaturization of the camera module 4.

[0103] In at least one embodiment, the focusing carrier 51 includes two guiding portions 512, and the two guiding portions 512 are located at two diagonal corners of the main body portion 511, that is to say, the two guiding portions 512 are located at the diagonal corners of the main body portion 511. Specifically, inner guiding grooves 5121 are respectively formed on the opposite sides of the two guiding portions 512 facing the base 10, that is to say, the opening directions of the inner guiding grooves 5121 on the two guiding portions 512 are opposite. Further, outer guiding grooves 1121 are respectively formed on two side corner portions 112 of the base 10, so that the inner guiding grooves 5121 and the outer guiding grooves 1121 are arranged in one-to-one correspondence, and focusing guiding members 71 are respectively arranged between the two groups of inner guiding grooves 5121 and outer guiding grooves 1121 to support the focusing carrier 51 to move relative to the base 10 in the first direction. It should be understood that the two guiding portions 512 are located at two diagonal corners of the main body portion 511, and the two groups of focusing guiding members 71 are clamped between the diagonal carrier and the base 10 along the second direction or the third direction, which can improve the symmetry of the distribution of the focusing guiding members 71, so that the focusing carrier 51 maintains balance during the movement, thereby improving the stability and reliability of the focusing drive.

[0104] In some embodiments, as Figures 8A-1 to 8B-2 shown, the movable assembly 50 further includes a plurality of anti-shake guiding members 72. The anti-shake guiding members 72 are pressed between the anti-shake carrier 52 and the focusing carrier 51 along the first direction, so as to support the anti-shake carrier 52 to move relative to the focusing carrier 51 along the second direction and / or the third direction to achieve the OIS function. It should be understood that the anti-shake guiding members 72 can reduce the friction force when the anti-shake carrier 52 and the focusing carrier 51 move relative to each other, thereby reducing the driving force required to drive the anti-shake carrier 52, which is beneficial to improving the flexibility and stability of the movement of the anti-shake carrier 52.

[0105] Further, as Figures 8A-1 to 8B-2 shown, an anti-shake guiding groove 523 is formed on the bottom surface of the anti-shake carrier 52. The anti-shake guiding groove 523 is used to accommodate the anti-shake guiding members 72 to limit the anti-shake guiding members 72, which is beneficial to preventing the anti-shake guiding members 72 from detaching from the anti-shake carrier 52. In addition, by forming the anti-shake guiding groove 523, the structure among the anti-shake carrier 52, the anti-shake guiding members 72 and the focusing carrier 51 can be made more compact, thereby reducing the shoulder height of the imaging module 4. Among them, the anti-shake guiding members 72 include but are not limited to balls, rollers, etc., and the present application does not make specific limitations on this.

[0106] In some embodiments, as Figure 2A 、 Figure 2B and Figure 10As shown, the driving magnet 60 includes a focusing magnet 61. Specifically, a focusing receiving groove 5112 is formed on one side of the main body portion 511 of the focusing carrier 51 opposite to the base 10 along the third direction. The focusing receiving groove 5112 is adapted to receive the focusing magnet 61, so that the focusing magnet 61 and the focusing coil 421 received in the coil groove 113 are oppositely arranged along the third direction, thereby driving the movable assembly 50 to move relative to the base 10 along the first direction.

[0107] Furthermore, as Figure 2A , Figure 2B and Figure 11 shown, the driving magnet 60 further includes a first anti-shake magnet 62 and a second anti-shake magnet 63. Specifically, a first anti-shake receiving groove 521 is formed on one side of the anti-shake carrier 52 opposite to the base 10 along the second direction. The first anti-shake receiving groove 521 is adapted to receive the first anti-shake magnet 62, so that the first anti-shake magnet 62 and the first anti-shake coil 422 received in the coil groove 113 are oppositely arranged along the second direction, thereby driving the anti-shake carrier 52 to move relative to the focusing carrier 51 and the base 10 along the second direction. A second anti-shake receiving groove 522 is formed on one side of the anti-shake carrier 52 opposite to the base 10 along the third direction. The second anti-shake receiving groove 522 is adapted to receive the second anti-shake magnet 63, so that the second anti-shake magnet 63 and the second anti-shake coil 423 received in the coil groove 113 are oppositely arranged along the third direction, thereby driving the anti-shake carrier 52 to move relative to the focusing carrier 51 and the base 10 along the third direction. It should be understood that the second anti-shake receiving groove 522 and the focusing receiving groove 5112 are respectively located on opposite sides of the movable assembly 50 along the third direction, which is beneficial to avoiding interference between the second anti-shake magnet 63 and the focusing magnet 61.

[0108] In some embodiments, as Figure 10 shown, on one side of the main body portion 511 of the focusing carrier 51 opposite to the first anti-shake magnet 62 and on one side opposite to the second anti-shake magnet, an open area 5113 is respectively provided. The open area 5113 enables the first anti-shake magnet 62 and the second anti-shake magnet 63 on the anti-shake carrier 52 to be exposed from the focusing carrier 51, which is beneficial to avoiding the focusing carrier 51 blocking between the first anti-shake coil 422 and the first anti-shake magnet 62, and is beneficial to avoiding the focusing carrier 51 blocking between the second anti-shake coil 423 and the second anti-shake magnet 63. Furthermore, it is beneficial to enhance the Lorentz force between the first anti-shake coil 422 and the first anti-shake magnet 62, and between the second anti-shake coil 423 and the second anti-shake magnet 63, so as to improve the driving force and stability of the anti-shake drive of the camera module 4.

[0109] In some embodiments, as Figure 10As shown, the imaging module 4 further includes a focusing magnetic conductor 82, which is disposed on the groove wall of the focusing receiving groove 5112 so as to be on the side of the focusing magnet 61 away from the focusing coil 421. It should be understood that the focusing magnetic conductor 82 can constrain the magnetic field of the focusing magnet 61, reduce the diffusion of the magnetic field of the focusing magnet 61 in the direction of the optical lens 100, thereby improving the utilization efficiency of the magnetic field and further improving the driving force and stability of the focusing drive of the imaging module 4. In at least one embodiment, the focusing magnetic conductor 82 is embedded in the focusing carrier 51 to improve the connection strength and reliability between the focusing magnetic conductor 82 and the focusing carrier 51.

[0110] Further, as Figure 10 shown, the imaging module 4 further includes a focusing embedded panel 81, which is disposed on the bottom surface of the main body portion 511 of the focusing carrier 51, and can improve the structural strength and flatness of the bottom surface of the main body portion 511, so that the focusing carrier 51 can more stably and reliably support the anti-shake carrier 52 and the optical lens 100. In at least one embodiment, the focusing embedded panel 81 is embedded in the bottom surface of the main body portion 511, which is beneficial to improving the connection strength and reliability between the focusing embedded panel 81 and the main body portion 511.

[0111] In some embodiments, as Figure 11 shown, the imaging module 4 further includes an anti-shake magnetic conductor 83, which is disposed on the groove walls of the first anti-shake receiving groove 521 and the second anti-shake receiving groove 522 so as to be on the side of the first anti-shake magnet 62 away from the first anti-shake coil 422 and on the side of the second anti-shake magnet 63 away from the second anti-shake coil 423. It should be understood that the anti-shake magnetic conductor 83 can constrain the magnetic fields of the first anti-shake magnet 62 and the second anti-shake magnet 63, reduce the diffusion of the magnetic fields in the direction of the optical lens 100, thereby improving the utilization efficiency of the magnetic fields and further improving the driving force and stability of the anti-shake drive of the imaging module 4. In at least one embodiment, the anti-shake magnetic conductor 83 is embedded in the anti-shake carrier 52 to improve the connection strength and reliability between the anti-shake magnetic conductor 83 and the anti-shake carrier 52.

[0112] In some embodiments, as Figure 8A-2 and Figure 8B-2 shown, the photosensitive component 20 further includes a support plate 25, which is fixed to the side of the imaging circuit board 21 away from the base 10 to support the imaging circuit board 21 and improve the structural strength of the bottom of the imaging driving device 1. It is worth mentioning that the support plate 25 includes, but is not limited to, metal plates such as steel plates and copper plates, as well as plastic plates, and the present application does not make specific limitations thereon.

[0113] In some embodiments, as Figures 8A-1 to 8B-2As shown, the photosensitive component 20 further includes a filter 24. The filter 24 is mounted on the mounting portion 121 of the inner base 12, so as to be kept on the photosensitive path of the photosensitive chip 22. The filter 24 is used to filter the incident light entering the photosensitive chip 22, so as to filter out the unwanted stray light such as infrared light in the incident light.

[0114] In some embodiments, as Figure 8A-2 and Figure 8B-2 shown, the photosensitive component 20 further includes a plurality of electronic components 23 electrically connected to the imaging circuit board 21. It should be understood that the plurality of electronic components 23 include but are not limited to passive electronic devices such as resistors and capacitors and / or driving chips, storage chips, etc., and the present application does not make specific limitations thereto.

[0115] In some embodiments, as Figure 9A and Figure 9B shown, the imaging module 4 further includes a stop component 90. The stop component 90 is disposed on the focusing carrier 51. At least part of the stop component 90 is disposed opposite to the anti-shake carrier 52 in the first direction. The anti-shake carrier 52 is held between the stop component 90 and the focusing member in the first direction, which is beneficial to avoid the anti-shake carrier 52 being separated from the focusing carrier 51 due to mechanical vibration, external force impact or inertial action of moving in the first direction, thereby improving the reliability of the anti-shake guiding member 72 being crimped between the anti-shake carrier 52 and the focusing carrier 51.

[0116] In some embodiments, as Figure 12 shown, the stop component 90 includes a bracket 91 and a plurality of upper buffer members 92. The bracket 91 is mounted on the focusing carrier 51. At least part of the bracket 91 is located on the top surface of the focusing carrier 51 and bends and extends in a plane perpendicular to the first direction, so that the anti-shake carrier 52 is held between the bracket 91 and the focusing carrier 51. The plurality of upper buffer members 92 are spaced apart on the bracket 91. At least part of the upper buffer member 92 protrudes from the bracket 91 towards the anti-shake carrier 52 in the first direction, so as to be located between the bracket 91 and the anti-shake carrier 52, which is beneficial to avoid hard collision between the anti-shake carrier 52 and the bracket 91, thereby protecting the anti-shake carrier 52, reducing the risk of damage to the anti-shake carrier 52, and reducing the noise generated by the collision. At least another part of the upper buffer member 92 protrudes from the bracket 91 towards the housing 30 in the first direction, so as to be located between the bracket 91 and the housing 30, which is beneficial to avoid hard collision between the focusing carrier 51 and the housing 30, thereby protecting the focusing carrier 51 and the housing 30, reducing the risk of loss of the focusing carrier 51, and reducing the noise generated by the collision, and can also extend the service life of the imaging module 4.

[0117] In some embodiments, as Figure 7A-2 and Figure 7B-2As shown, the camera module 4 further includes a lower buffer member 114. The lower buffer member 114 is disposed at the base portion 111 of the outer base 11, and at least a part of the lower buffer member 114 protrudes from the outer top surface 1111 of the base portion 111 to be located between the base portion 111 and the abutting surface 5111 of the focusing carrier 51, which helps to avoid hard collision between the focusing carrier 51 and the outer base 11, thereby protecting the focusing carrier 51, reducing the risk of damage to the focusing carrier 51, and reducing the noise generated by the collision.

[0118] An assembly method for assembling the above-mentioned camera module 4 includes the steps of: S1. Provide an imaging module 2 and a movable component 50, and install the movable component 50 on the base 10 of the imaging module 2; S2. Provide an optical lens 100, and install the optical lens 100 on the movable component 50. Among them, the external coil semi-finished product jig and the photosensitive component 20 of the imaging module 2 are energized to assist in calibrating and installing the optical lens 100; S3. Provide a driving module 3. The driving module 3 includes a housing 30 and a driving circuit component 40 fixed to the housing 30. Cover the driving module 3 on the light incident side of the imaging module 2, and conduct the driving circuit board 41 of the driving circuit component 40 with the imaging circuit board 21 of the imaging module 2.

[0119] Specifically, in step S2, by energizing the external coil semi-finished product jig, the coil on the coil semi-finished product jig and the driving magnet 60 on the movable component 50 interact with each other. That is to say, the external coil semi-finished product jig is used to replace the driving module 3, and then the movable component 50 is driven to move relative to the base 10. Further, by energizing the photosensitive component 20, the imaging quality of the photosensitive chip 22 can be intuitively reflected, and thus, according to the imaging quality of the photosensitive chip 22, the position of the optical lens 100 is assisted to be calibrated to improve the yield of the camera module 4.

[0120] It should be understood that using the external coil semi-finished product jig to replace the driving module 3 helps to avoid damage to the driving circuit component 40 of the driving module 3 during the installation of the optical lens 100, thereby reducing the loss of the driving circuit component 40 or the driving module 3 and reducing the production cost of the camera module 4. In addition, using the external coil semi-finished product jig to replace the driving module 3 also helps to avoid interference of the housing 30 of the driving module 3 with the installation operation of the optical lens 100, thereby improving the convenience of installation and adjustment of the optical lens 100, reducing the operation difficulty, and improving the assembly efficiency.

[0121] It is worth mentioning that the imaging module 2 and the driving module 3 can be assembled independently to form a modular semi-finished product. After the movable component 50 and the optical lens 100 are installed on the imaging module 2, finally, the driving module 3 is covered on the imaging module 2, and the driving circuit board 41 and the imaging circuit board 21 are connected to complete the assembly of the camera module 4, which is beneficial to improving the assembly efficiency of the camera module 4.

[0122] In some embodiments, the coil semi-finished product jig in step S2 contains a control chip, and the control chip is used to record the driving information during the calibration process in step S2. Further, after the calibration and installation of the optical lens 100 are completed, the information in the control chip is recorded into the driving control chip of the camera module 4, so that the driving information in the driving control chip is adapted to the corresponding camera module 4, thereby improving the accuracy of the AF function and the OIS function of the camera module 4.

[0123] The foregoing has described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. An imaging driving device, characterized in that: include: A base, suitable for the movable component to bear against; An imaging module, comprising an imaging circuit board, wherein the imaging circuit board is used to be electrically connected to the photosensitive chip; as well as, A driving module, comprising a housing and a driving circuit assembly, wherein the driving circuit assembly is fixed to the inner wall of the housing, the driving circuit assembly comprises a driving circuit board and a driving coil, the driving circuit board is fixed to the inner wall of the housing, the driving coil is arranged on the driving circuit board, the driving coil and the movable component are arranged relative to each other along the second direction and / or relative to each other along the third direction, the driving module is provided with an accommodating space, the accommodating space enables the driving module to be arranged along the first direction on the light incident side of the imaging module, and the driving circuit board conducts the imaging circuit board and the driving coil to drive the movable component to move; The first direction is parallel to the height direction of the imaging drive device, the second direction is parallel to the length direction of the imaging drive device, and the third direction is parallel to the width direction of the imaging drive device. The first direction, the second direction and the third direction are orthogonal to each other.

2. The imaging driving device according to claim 1, characterized in that: The base includes an inner base and an outer base surrounding the inner base, the driving module is supported by the outer base, and the inner base is suitable for supporting the filter, wherein the lower end surface of the driving module is lower than the inner top surface of the inner base so as to sink relative to the inner base.

3. The imaging driving device according to claim 1, characterized in that: The driving circuit board includes at least two board bodies, each of which is attached to the inner wall of the shell. The driving circuit board also includes a conducting portion, which is arranged on an edge of at least one of the board bodies facing the imaging circuit board. The conducting portion is suitable for conducting with the imaging circuit board to conduct electricity between the driving circuit board and the imaging circuit board.

4. The imaging driving device according to claim 1, characterized in that: The driving circuit assembly further includes a driving control chip, which is disposed on the imaging circuit board and is directly connected to the imaging circuit board, wherein the base covers the driving control chip.

5. The imaging driving device according to claim 2, characterized in that: The external base includes a base portion formed on the imaging circuit board, the base portion is arranged along the edge of the imaging circuit board, and is suitable for the movable component to bear against; the external base also includes a side corner portion extending along a first direction, the side corner portion is located at the corner of the imaging circuit board, and a coil groove is defined between two adjacent side corner portions, and the coil groove is suitable for accommodating the drive coil; wherein the side corner portion is integrally formed with the base portion, or the side corner portion is formed in the outer shell.

6. The imaging driving device according to claim 5, characterized in that: The side corner portion is formed in the shell, and at least a part of the side corner portion is spaced apart from the inner wall of the shell along the second direction and / or spaced apart along the third direction to form a limiting groove between the side corner portion and the inner wall of the shell, and the limiting groove is suitable for accommodating the driving circuit board so that the driving circuit board is clamped between the side corner portion and the inner wall of the shell.

7. The imaging driving device according to claim 2, characterized in that: The inner base and the outer base are spaced apart to form an escape space between the inner base and the outer base, and the escape space is suitable for accommodating at least a part of the movable component.

8. The imaging driving device according to claim 3, characterized in that: The driving circuit board further includes a connecting portion, which can be bent to connect and conduct two adjacent plate bodies, so that each plate body of the driving circuit board and the connecting portion are integrally formed.

9. The imaging driving device according to claim 3, characterized in that: At least two of the plates include a first plate, a second plate and a third plate. When the driving circuit board is respectively attached to the inner wall of the shell, the surfaces of the first plate, the second plate and the third plate are parallel to the first direction, wherein the first plate and the third plate are relatively arranged along the third direction, and the second plate is located between the first plate and the third plate. When the driving module is covered on the light incident side of the imaging module along the first direction, the first plate, the second plate and the third plate surround the outside of the movable component.

10. The imaging driving device according to claim 9, characterized in that: The driving coil includes a focus coil, a first anti-shake coil and a second anti-shake coil, wherein the focus coil is arranged on the first plate body, the first anti-shake coil is arranged on the second plate body, and the second anti-shake coil is arranged on the third plate body.

11. The imaging driving device according to any one of claims 1 to 10, characterized in that: The driving circuit component also includes a sensing device, which is used to sense the position of the optical lens. The sensing device is electrically connected to the driving circuit board. When the driving module cover is arranged on the light incident side of the imaging module, the sensing device is located on the side of the driving circuit board facing the movable component.

12. The imaging driving device according to any one of claims 3, 8, 9 and 10, characterized in that: The imaging driving device further includes a reinforcing plate, which is disposed on a surface of each of the plate bodies that is away from the driving coil to support each of the plate bodies.

13. A camera module, characterized in that: include: The imaging driving device as claimed in any one of claims 1 to 12; A photosensitive component, comprising a photosensitive chip, wherein the photosensitive chip is electrically connected to an imaging circuit board of the imaging driving device for imaging; A movable component is movably disposed on a base of the imaging drive device; The optical lens is carried by the movable component and can be movably held on the light-sensitive path of the photosensitive component.

14. The camera module according to claim 13, characterized in that: The movable component comprises a focus carrier, the focus carrier comprises a main body and a guide part, the main body is used to carry the optical lens; The guide portion is located at at least two corners of the main body, and the guide portion extends along a first direction to support the focusing carrier to move relative to the base along the first direction. The guide portion protrudes from the main body toward the imaging circuit board, so that at least part of the guide portion is accommodated in the avoidance space of the base.

15. The camera module according to claim 14, characterized in that: The movable component includes a focus guide, an inner guide groove is opened on the side of the guide portion facing the side corner portion of the base, an outer guide groove is opened on the side corner portion facing the guide portion, an opening of the inner guide groove and an opening of the outer guide groove are arranged relative to each other along the second direction or along the third direction, so that the focus guide is clamped between the groove wall of the inner guide groove and the groove wall of the outer guide groove.

16. The camera module according to claim 13, characterized in that: The camera module also includes a driving magnet, which is arranged on the movable component. The driving magnet and the driving coil of the imaging drive device are arranged relative to each other along the second direction and / or along the third direction to drive the movable component to move relative to the base.

17. The camera module according to claim 16, characterized in that: The driving magnet includes a focusing magnet, a first anti-shake magnet and a second anti-shake magnet, wherein the focusing magnet and the focusing coil of the imaging driving device are relatively arranged along a third direction to drive the movable component to move relative to the base along the first direction, the first anti-shake magnet and the first anti-shake coil of the imaging driving device are relatively arranged along the second direction to drive the movable component to move relative to the base along the second direction, and the second anti-shake magnet and the second anti-shake coil of the imaging driving device are relatively arranged along the third direction to drive the movable component to move relative to the base along the third direction.

18. An assembly method for assembling a camera module as claimed in any one of claims 13 to 17, characterized in that: Includes steps: S1. providing an imaging module and a movable component, and installing the movable component on a base of the imaging module; S2, providing an optical lens, and installing the optical lens on the movable component, wherein an external coil semi-finished product jig and a photosensitive component of the imaging module are energized to assist in calibrating and installing the optical lens; S3. Provide a driving module, which includes a housing and a driving circuit assembly fixed to the housing, cover the driving module on the light incident side of the imaging module, and connect the driving circuit board of the driving circuit assembly to the imaging circuit board of the imaging module.

Images