Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a main body structure, a shielding structure and a connecting wire. The shielding structure is assembled on the main body structure, the shielding structure comprises at least two shielding sub-parts, an assembling concave part is arranged between the at least two adjacent shielding sub-parts, and at least one part of the connecting wire is installed in the assembling concave part in a limited mode. The shielding structure of the circuit board assembly comprises at least two shielding sub-parts, an assembling concave part is arranged between the at least two adjacent shielding sub-parts, and at least one part of the connecting wire is installed in the assembling concave part in a limited mode. Limiting installation of the connecting line is achieved through the assembling concave parts between the adjacent shielding subsections, structural and functional interference with other devices on the structural body is reduced, and meanwhile space occupation and the fixing cost of the connecting line can be reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technologies, and particularly to a circuit board assembly and an electronic device. Background Art

[0002] In electronic products, signal transmission between two devices needs to be achieved through connection lines. Among them, the above two devices can be located at different positions on the main board, or can be located on the main board and the daughter board respectively. When routing from the edge of the housing, routing grooves are usually processed on the side wall of the housing to guide and fix the connection lines.

[0003] When routing on the main board, it is difficult to fix the connection lines due to interference from other components on the housing or the main board. Currently, the method of fixing the connection lines by adhesive tape is often used, but there are problems such as high cost and poor stability. Summary of the Invention

[0004] The present disclosure provides a circuit board assembly and an electronic device to solve related technical problems.

[0005] In a first aspect of the present disclosure, a circuit board assembly is provided, including:

[0006] A main body structure;

[0007] A shielding structure assembled to the main body structure; the shielding structure includes at least two shielding sub - parts; an assembly recess is provided between at least two adjacent shielding sub - parts;

[0008] A connection line, at least a part of the connection line is limited and installed in the assembly recess.

[0009] Optionally, at least two adjacent shielding sub - parts are separated from each other; the assembly recess includes a gap structure formed between the adjacent shielding sub - parts that are separated from each other.

[0010] Optionally, at least two shielding sub - parts are connected; the assembly recess includes a routing groove connecting the adjacent shielding sub - parts.

[0011] Optionally, the assembly recess includes at least one bending section.

[0012] Optionally, the shielding sub - part includes a first side located on one side of the assembly recess, and at least one end of the first side includes an arc structure matching the bending radian of the connection line.

[0013] Optionally, the shielding sub - part includes a first side and a second side; the first side is located on one side of the assembly recess, the second side is adjacent to the first side; at least one limiting structure is provided on the second side, and at least a part of the connection line is assembled in the limiting structure.

[0014] Optionally, the limiting structure includes a wire clamp disposed on the shielding section.

[0015] Optionally, the circuit board assembly further includes a heat dissipation structure assembled to the shielding structure; the heat dissipation structure covers at least a part of the assembly recess.

[0016] Optionally, the heat dissipation structure includes at least two heat dissipation sections and at least one movable connection portion; at least two of the heat dissipation sections are connected by at least one of the movable connection portions, and each heat dissipation section is assembled to a different shielding section.

[0017] Optionally, at least two heat dissipation sections include a first heat dissipation portion and a second heat dissipation portion; an adhesive is provided on one side of the first heat dissipation portion; an adhesive and a release paper covering the adhesive are provided on one side of the second heat dissipation portion.

[0018] Optionally, the material of the heat dissipation structure includes graphite.

[0019] Optionally, the main body structure is provided with at least one wiring terminal; at least one end of the connecting wire is electrically connected to the wiring terminal.

[0020] According to a second aspect of the present disclosure, there is provided an electronic device, including: any one of the circuit board assemblies described in the first aspect.

[0021] The technical solutions provided by the present disclosure can at least achieve the following beneficial effects:

[0022] The shielding structure of the circuit board assembly of the present disclosure includes at least two shielding sections, and an assembly recess is provided between at least two adjacent shielding sections, and at least a part of the connecting wire is limitedly installed in the assembly recess. The limited installation of the connecting wire is realized through the assembly recess between adjacent shielding sections, which reduces the structural and functional interference with other devices on the main body structure, and at the same time can reduce the space occupation and the fixing cost of the connecting wire.

[0023] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings here are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present specification, and are used together with the specification to explain the principles of the present specification.

[0025] Figure 1 is a schematic structural diagram of a circuit board assembly in an exemplary embodiment of the present disclosure;

[0026] Figure 2 is a schematic structural diagram of a circuit board assembly in another exemplary embodiment of the present disclosure;

[0027] Figure 3 This is a schematic structural diagram of a circuit board assembly in another exemplary embodiment of the present disclosure. Detailed implementation manners

[0028] Here, the exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with this specification. On the contrary, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0029] The terms used in this disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used in this specification should have the ordinary meanings understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second", and similar terms used in this specification and the appended claims do not denote any order, quantity, or importance, but are only used to distinguish different components. Similarly, the terms "a" or "an" and the like do not denote a quantity limitation, but rather indicate the presence of one. "Multiple" or "several" means two or more. Unless otherwise specified, terms such as "front", "rear", "lower", and / or "upper" are only for convenience of description and are not limited to a position or a spatial orientation. The terms "comprising" or "including" and the like are intended to cover the elements or items listed after the word "comprising" or "including" and their equivalents, and do not exclude other elements or items. The terms "connected" or "coupled" and the like are not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect.

[0030] The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The singular forms "a", "the", and "said" used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0031] In electronic products, signal transmission between two devices needs to be achieved through connecting wires. Among them, the above two devices can be located at different positions on the main board, or can be located on the main board and the daughter board respectively. When routing from the edge of the housing, a routing groove is usually processed on the side wall of the housing to guide and fix the connecting wire. When routing on the main board, it is difficult to fix the connecting wire due to interference from other components on the housing or the main board. Currently, the method of fixing the connecting wire by adhesive tape is often used, but there are problems such as high cost and poor stability.

[0032] The present disclosure provides a circuit board assembly. Figure 1 It is a schematic structural diagram of a circuit board assembly in an exemplary embodiment of the present disclosure. As Figure 1 shown, the circuit board assembly 1 includes a main body structure 11, a shielding structure 13, and a connecting wire 12. The shielding structure 13 is assembled on the main body structure 11. The shielding structure 13 includes at least two shielding parts 131. An assembly recess 14 is provided between at least two adjacent shielding parts 131. At least a part of the connecting wire 12 is limitedly installed in the assembly recess 14.

[0033] The shielding structure 13 of the above circuit board assembly 1 includes at least two shielding parts 131, and an assembly recess 14 is provided between at least two adjacent shielding parts 131. At least a part of the connecting wire 12 is limitedly installed in the assembly recess 14. The limited installation of the connecting wire 12 is achieved through the assembly recess 14 between adjacent shielding parts 131, which reduces the structural and functional interference with other devices on the main body structure, and at the same time can reduce space occupation and improve space utilization rate, and at the same time reduce the fixing cost of the connecting wire 12. The installation method of the above connecting wire 12 can also facilitate assembly and disassembly, and improve the convenience of installation and maintenance.

[0034] It should be noted that the above circuit board assembly 1 can be the main board or the daughter board of an electronic device, or can be the control board of a functional module of an electronic device. The present disclosure does not limit the type of the circuit board assembly 1.

[0035] In some embodiments, at least two adjacent shielding parts 131 are separated from each other, and the assembly recess 14 includes a gap structure formed between the separated adjacent shielding parts 131. The flexibility of the setting of the shielding structure 13 is improved by the separated shielding parts 131, and the formation position of the assembly recess 14 is also flexible, which can be compatible with various routing paths of the connecting wire 12.

[0036] In other embodiments, at least two shielding parts 131 are connected, and the assembly recess 14 includes a routing groove connecting the adjacent shielding parts 131. By forming a routing groove between the connected shielding parts 131, not only the shielding effect is ensured, but also the forming and assembling convenience of the shielding structure 13 can be improved.

[0037] It should be noted that each shielding part 131 can be a mutually separated structure. Or, each shielding part 131 is a connected structure. Or, some shielding parts 131 are separated from each other, and some shielding parts 131 are connected, which can be adjusted according to the component distribution on the main body structure 11 or other user requirements. The present disclosure does not limit this.

[0038] For example, an assembly recess 14 can be formed between two shielding parts 131. After the middle section of the connection line 12 is installed in the assembly recess 14, it is fixed, and both ends of the connection line 12 are respectively connected to the connection terminals to achieve line connection. Or, the assembly recess 14 can include two sections formed by three shielding parts 131: a first section and a second section. The three shielding parts 131 can be a first part, a second part, and a third part. The second part is located on the first side 1312 of the first part to form the first section of the assembly recess 14, and the third part is located on the second side 1313 of the first part to form the second section of the assembly recess 14. Among them, the first side 1312 and the second side 1313 can be adjacent or spaced apart from the first part. The present disclosure does not limit this.

[0039] In the above embodiment, the assembly recess 14 can include at least one bent section 141. The bent section 141 can be used to avoid electronic components on the main body structure 11, and can also clamp the connection line 12 by the bending of the bent section 141 to improve the installation stability of the connection line 12.

[0040] Among them, the above-mentioned bent section 141 can include an arc-shaped corner to avoid the abutment damage of the right-angle corner to the connection line 12, and at the same time make the connection line 12 have a smooth routing.

[0041] In addition, when the assembly recess 14 includes a plurality of bent sections 141, the bent sections 141 are spaced at a relatively long distance to separately form an effect of guiding the connection line 12. Or, at least two bent sections 141 can adopt a scheme of being spaced at a short distance, so that two adjacent bent sections 141 cooperate together to obtain a clamping effect when the connection line 12 is bent and routed.

[0042] In some embodiments, the shielding part 131 includes a first side 1312 located on one side of the assembly recess 14. At least one end of the first side 1312 includes an arc-shaped structure 1311 that matches the bending radian of the connection line 12 to avoid the abutment damage of the right-angle corner to the connection line 12, and at the same time make the connection line 12 have a smooth routing.

[0043] For example, after the connection line 12 extends from the first end of the first side 1312, it bends at a 45° angle toward the right side. The first end of the first side 1312 can be set as an arc-shaped structure 1311 that matches the radian of the extending section of the connection line 12, so as to improve the smoothness of wire routing and the safety of the circuit.

[0044] In some embodiments, the shielding section 131 includes a first side 1312 and a second side 1313. The first side 1312 is located on one side of the assembly recess 14, and the second side 1313 is adjacent to the first side 1312. At least one limiting structure 15 is provided on the second side 1313, and at least a part of the connection line 12 is assembled in the limiting structure 15. By forming a fixation of the connection line 12 at the position of other sides connected to the assembly recess 14 through the limiting structure 15, the connection line 12 is fixed in the area where there is no shielding section 131 on one side, improving the installation stability of the connection.

[0045] Among them, the limiting structure 15 includes a wire clip provided on the shielding section 131. Clamping and fixing the connection line 12 by the wire clip helps to increase the installation reliability of the connection line 12. One limiting structure 15 can be provided on the second side, or multiple limiting structures 15 can be provided, which are set according to the position of the corresponding connection end of the connection line 12 and other fixing requirements. The present disclosure does not limit the number of the limiting structures 15. When multiple limiting structures 15 are provided on the second side, the limiting structures 15 can be arranged at intervals on the second side. The above-mentioned wire clip can be an outstretched wire clip or a welded wire clip.

[0046] It should be noted that the above shielding structure 13 can be a shielding cover, or other forms of structures such as a shielding plate or a shielding block.

[0047] In some embodiments, as Figure 2 shown, the circuit board assembly 1 further includes a heat dissipation structure 16 assembled on the shielding structure 13, and the heat dissipation structure 16 covers at least a part of the assembly recess 14. The heat dissipation structure 16 can not only achieve the heat dissipation effect for the circuit board assembly 1, but also press and fix the connection line 12 through the area covering the assembly recess 14, further improving the installation reliability of the connection line 12. Among them, the heat dissipation structure 16 can cover all areas of the assembly recess 14, or can cover part of the areas of the assembly recess 14, based on being able to achieve the fixing effect on the connection line 12.

[0048] In the above embodiments, the heat dissipation structure 16 can include at least two heat dissipation sections 161 and at least one movable connection part. The at least two heat dissipation sections 161 are connected by the at least one movable connection part, and each heat dissipation section 161 is assembled on a different shielding section 131. The two heat dissipation sections 161 are movably connected through the movable connection part, so as to facilitate the installation of the connection line 12 and the heat dissipation structure 16 during the assembly process of the circuit board assembly 1.

[0049] In some embodiments, the main body structure 11 is provided with at least one terminal, and at least one end of the connecting wire 12 is electrically connected to the terminal, so as to realize the connection with the connecting wire 12 through the terminal. Among them, the main body structure 11 may be provided with one terminal, and other circuit boards of the circuit board assembly 1 are provided with terminals. One end of the connecting wire 12 is connected to the terminal of the main body structure 11, and the other end is connected to the terminal of the other circuit board. Or, the main body structure 11 may be provided with two terminals. After the connecting wire 12 is fixed by the assembling recess 14, both ends of the connecting wire 12 are respectively connected to the terminals on the main body structure 11.

[0050] For example, as Figure 2 , Figure 3 shown, at least two heat dissipation parts 161 may include a first heat dissipation part and a second heat dissipation part. One side of the first heat dissipation part is provided with an adhesive, and one side of the second heat dissipation part is provided with an adhesive and a release paper 17 covering the adhesive. During the assembling process, the first heat dissipation part may be first bonded to a shielding part 131 through the adhesive, and then the two ends of the connecting wire 12 are buckled. Use a wire arranging pen to arrange the wires and correct the wire routing path to ensure that the connecting wire 12 smoothly passes through the assembling recess 14 and the external wire clamp. Finally, tear off the release paper 17 and bond the second heat dissipation part to another shielding part 131 to ensure that the connecting wire 12 does not jump out when routing between the shielding parts 131.

[0051] It should be noted that the material of the heat dissipation structure 16 may be graphite or other materials with heat dissipation functions. The above heat dissipation structure 16 may be in a sheet structure to ensure the heat dissipation effect and the abutting and fixing effect on the connecting wire 12, while reducing the space occupation.

[0052] In addition, the above connecting wire 12 may be a coaxial cable or may be used to connect other circuits of electronic components. The present disclosure does not limit this.

[0053] The present disclosure further provides an electronic device, and the electronic device includes the above circuit board assembly 1.

[0054] Since the shielding structure 13 of the circuit board assembly 1 includes at least two shielding parts 131, and an assembling recess 14 is provided between at least two adjacent shielding parts 131, at least a part of the connecting wire 12 is installed in the assembling recess 14 in a limited manner. The limited installation of the connecting wire 12 is realized through the assembling recess 14 between adjacent shielding parts 131, which reduces the structural and functional interference with other devices on the main body structure, and at the same time can reduce the space occupation and the fixing cost of the connecting wire 12.

[0055] It should be noted that the above electronic device may be a mobile phone, a tablet computer, a wearable device, a vehicle-mounted terminal, a medical terminal, etc. The present disclosure does not limit this.

[0056] The above are only the preferred embodiments of the present disclosure, and do not impose any formal restrictions on the present disclosure. Although the present disclosure has been disclosed above in the preferred embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the above-disclosed technical content without departing from the technical solution of the present disclosure. However, as long as it does not depart from the technical solution of the present disclosure, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present disclosure still fall within the scope of the technical solution of the present disclosure.

Claims

1. A circuit board assembly, characterized in that, comprising: a main structure; a shielding structure assembled to the main structure; the shielding structure includes at least two shielding sub - parts; an assembly recess is provided between at least two adjacent shielding sub - parts; a connecting wire, at least a part of the connecting wire is installed in the assembly recess in a limited manner.

2. The circuit board assembly according to claim 1, characterized in that, at least two adjacent shielding sub - parts are separated from each other; the assembly recess includes a gap structure formed between the adjacent and separated shielding sub - parts.

3. The circuit board assembly according to claim 1, characterized in that, at least two shielding sub - parts are connected; the assembly recess includes a wiring groove connecting the adjacent shielding sub - parts.

4. The circuit board assembly according to claim 1, characterized in that, the assembly recess includes at least one bent section.

5. The circuit board assembly according to claim 1, characterized in that, the shielding sub - part includes a first side located on one side of the assembly recess, and at least one end of the first side includes an arc structure matching the bending radian of the connecting wire.

6. The circuit board assembly according to claim 1, characterized in that, the shielding sub - part includes a first side and a second side; the first side is located on one side of the assembly recess, the second side is adjacent to the first side; at least one limiting structure is provided on the second side, and at least a part of the connecting wire is assembled to the limiting structure.

7. The circuit board assembly according to claim 6, characterized in that, the limiting structure includes a wire clip provided on the shielding sub - part.

8. The circuit board assembly according to claim 1, characterized in that, further comprising a heat dissipation structure assembled to the shielding structure; the heat dissipation structure covers at least a part of the assembly recess.

9. The circuit board assembly according to claim 8, characterized in that, the heat dissipation structure includes at least two heat dissipation sub - parts and at least one movable connection part; at least two heat dissipation sub - parts are connected by at least one movable connection part, and each heat dissipation sub - part is assembled to a different shielding sub - part.

10. The circuit board assembly according to claim 9, characterized in that, at least two heat dissipation sub - parts include a first heat dissipation part and a second heat dissipation part; one side of the first heat dissipation part is provided with an adhesive; one side of the second heat dissipation part is provided with an adhesive and a release paper covering the adhesive.

11. The circuit board assembly according to claim 8, characterized in that, the material of the heat dissipation structure includes graphite.

12. The circuit board assembly according to claim 1, characterized in that, the main structure is provided with at least one wiring terminal; at least one end of the connecting wire is electrically connected to the wiring terminal.

13. An electronic device, characterized in that, comprising: the circuit board assembly according to any one of claims 1 - 12.

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