Nine-in-one integrated encapsulation module

Abstract

The invention relates to the technical field of power modules, in particular to a nine-in-one integrated encapsulation module. The nine-in-one integrated potting module comprises a shell assembly, a chip assembly and a potting body. The chip assembly comprises a substrate, a frequency converter single tube, a PTC single tube and a terminal. The upper copper layer is divided into a first frequency converter unit area, a second frequency converter unit area and a PTC unit area. An inner chip on the first frequency converter unit area is provided with three frequency converter single tubes, a chip in each second frequency converter unit area is provided with one frequency converter single tube, the first frequency converter unit area and the second frequency converter unit area form a six-unit inversion part, and a chip in each PTC unit area is provided with one PTC single tube. Six frequency converter single tubes and three PTC (Positive Temperature Coefficient) single tubes are integrated into a single module, and a complete three-phase full-bridge inverter circuit and a PTC heating function unit are constructed in the single module, so that the integration of electric driving and heating functions is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and in particular to a nine-in-one integrated potting module. Background Art

[0002] New energy vehicles are different from traditional fuel vehicles. New energy vehicles do not have engines, which makes heating in the car a problem. PTC, as a positive temperature coefficient semiconductor material, can generate heat by itself when powered on. It has the advantages of high heating efficiency, high power, no open flame, and safety. It is an ideal material for automotive heating devices. In the existing technology, inverters and PTCs mostly adopt a split layout. The traditional solution arranges the 6 power units of the inverter part and the 3 units of the PTC heater independently, resulting in the need to reserve multiple installation areas on the substrate, occupying a large area and difficult to adapt to the trend of equipment miniaturization. Summary of the invention

[0003] In view of this, the present invention provides a nine-in-one integrated potting module to solve the above technical problems.

[0004] A nine-in-one integrated potting module, comprising a shell component, a chip component arranged on the shell component, and a potting body arranged on the shell component. The shell component comprises a shell. The chip component comprises a substrate, six inverter single tubes arranged on the substrate, three PTC single tubes arranged on the substrate, and a terminal component arranged on the substrate. The substrate has three layers, the middle is a ceramic layer, and the upper and lower layers are an upper copper layer and a lower copper layer, and the upper copper layer is provided with a plurality of channels. The upper copper layer is divided into a first inverter unit area, three second inverter unit areas, three PTC unit areas, a plurality of input terminal areas, a plurality of output terminal areas, and a plurality of signal terminal areas. Three inverter single tubes are arranged in the first inverter unit area, and a single inverter tube is separately arranged in each of the second inverter unit areas. The three inverter single tubes in the first inverter unit area are electrically connected to the three second inverter unit areas respectively. The inverter single tubes in the three second inverter unit areas are electrically connected to the output terminal area respectively, and the first inverter unit area and the three second inverter unit areas are respectively provided with the terminal components. Each inverter unit is electrically connected to the signal terminal area, and a PTC single tube is respectively provided in each PTC unit area. The three PTC single tubes are electrically connected to the three output terminal areas respectively, and the terminal components are provided on each PTC unit area, and each PTC single tube is electrically connected to the signal terminal area.

[0005] Furthermore, the housing assembly also includes four support columns arranged on the housing, and a plurality of creepage bosses arranged on the housing.

[0006] Furthermore, a circle of limiting steps is provided on the support column, and the height of the limiting steps is the same as the height of the welding surface of the terminal.

[0007] Furthermore, the creepage boss is arranged on the top surface of the housing and is located between a plurality of terminals.

[0008] Furthermore, the terminal assembly is arranged on the shell, one end of the terminal assembly is connected to the substrate, and the other end is bent toward the center of the shell and the tail is wavy.

[0009] Furthermore, the terminal assembly includes a plurality of terminals, and one terminal is respectively provided on the first inverter unit area, the second inverter unit area, the PTC unit area, the output terminal area, and the signal terminal area.

[0010] Furthermore, the terminal assembly connected to the first inverter unit area is a DC+ input terminal of the inverter unit area, and the terminal assembly connected to the second inverter unit area is an AC output terminal of the inverter unit area.

[0011] Furthermore, the terminal connected to the PTC unit area is a DC+ input terminal of the PTC unit.

[0012] Furthermore, the potting body is formed by potting liquid epoxy in the shell.

[0013] Compared with the prior art, the upper copper layer of the nine-in-one integrated potting module provided by the present invention is provided with a plurality of channels by chemical etching, and the upper copper layer is divided into a first inverter unit area, three second inverter unit areas, three PTC unit areas, multiple input terminal areas, multiple output terminal areas, and multiple signal terminal areas. Three inverter single tubes are arranged in the first inverter unit area, and a single inverter tube is separately arranged in each of the second inverter unit areas, and a single PTC tube is respectively arranged in each of the PTC unit areas. The air-conditioning compressor electric drive in the prior art is separately installed with six inverter units and three PTC units, and a complete three-phase full-bridge inverter circuit is constructed in a single module through the multi-layer circuit topology reconstruction of the upper copper layer, and the PTC heating function unit is integrated into a single module to realize the nine-in-one integration of electric drive and heating functions. During reproduction, it can be directly reflowed and formed in one step without the need for a complicated assembly process, saving costs and improving the degree of integration. In addition, the height of the limiting step is the same as the height of the welding surface of the terminal assembly. One end of the terminal assembly is connected to the substrate, and the other end is bent toward the center of the shell and the tail is wavy to reduce the stress generated during installation and module vibration. The inner folding structure of the terminal assembly cooperates with the limiting step design to realize automatic alignment welding of the PCB board, while significantly reducing the space occupied by the terminal horizontally, freeing up layout area for other components on the PCB board and achieving high-density integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic structural diagram of a nine-in-one integrated potting module provided by the present invention.

[0015] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the nine-in-one integrated potting module.

[0016] Figure 3 for Figure 1 A side view of the substrate of the nine-in-one integrated potting module.

[0017] Figure 4 for Figure 1 A top view of the nine-in-one integrated potting module when the circuit is connected.

[0018] Figure 5 for Figure 1 Terminal connection numbering diagram of the nine-in-one integrated potting module.

[0019] Figure 6 for Figure 1 Circuit connection diagram of the PTC single tube of the nine-in-one integrated potting module.

[0020] Figure 7 for Figure 1The circuit connection diagram of the inverter single tube of the nine-in-one integrated potting module. DETAILED DESCRIPTION

[0021] The specific embodiments of the present invention are further described in detail below. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the protection scope of the present invention.

[0022] like Figures 1 to 7 As shown, it is a schematic diagram of the structure of the nine-in-one integrated potting module provided by the present invention. The nine-in-one integrated potting module includes a housing assembly 100, a chip assembly 200 disposed on the housing assembly 100, and a potting body 300 disposed on the housing assembly 100. It can be imagined that the nine-in-one integrated potting module also includes some other functional modules, such as a connection assembly, and a mounting assembly, etc., which are well known to those skilled in the art and will not be repeated here.

[0023] The housing assembly 100 includes a housing 110 , four support columns 120 disposed on the housing 110 , and a plurality of creepage bosses 130 disposed on the housing 110 .

[0024] The housing 110 is a rectangular frame structure with a hollow center. The housing 110 is used to accommodate the chip assembly 200 and to pot the potting body 300. The housing 110 is arranged to cooperate with a heat dissipation substrate (not shown) provided with heat dissipation fins. The heat generated by the chip assembly 200 during operation is conducted to the heat dissipation substrate. The heat dissipation fins are immersed in the coolant in the water channel, thereby exchanging heat with the flowing coolant to take away the heat of the chip. This should be a prior art and will not be described in detail here.

[0025] The support column 120 is provided with a circle of limiting steps 121, and the limiting steps 121 are used to support the external PCB board (not shown). The height of the limiting steps 121 is the same as the height of the welding surface of the terminal described below, so as to ensure automatic alignment during module welding and reduce manual adjustment steps. At the same time, the height is limited. After the module is welded to the PCB board, there is space between the PCB board and the chip assembly 200, and small components such as capacitors and resistors can be placed in the space to optimize the internal layout to the greatest extent.

[0026] The creepage boss 130 is arranged on the top surface of the shell 110 and is located between the multiple terminals described below. The creepage boss 130 is used to increase the surface path length between two conductive components, i.e., two adjacent terminals, and directly extend the creepage distance. In high-voltage equipment, sufficient creepage distance can prevent problems such as leakage, arc discharge or short circuit, thereby increasing the creepage distance without increasing the shell size.

[0027] The chip assembly 200 includes a substrate 210 , six inverter single tubes 220 arranged on the substrate 210 , three PTC single tubes 230 arranged on the substrate 210 , and a terminal assembly 240 arranged on the substrate 210 .

[0028] The substrate 210 has three layers, a ceramic layer 211 in the middle provides excellent insulation and thermal conductivity, and an upper copper layer 212 and a lower copper layer 213 are used to achieve circuit connection and heat dissipation.

[0029] The upper copper layer 212 is provided with a plurality of channels 214 by chemical etching, and the upper copper layer 212 is divided into a first inverter unit area 215 , three second inverter unit areas 216 , three PTC unit areas 217 , a plurality of output terminal areas 218 , and a plurality of signal terminal areas 219 .

[0030] Three inverter single tubes 220 are arranged in the first inverter unit area 215, which serve as the upper bridge arm of the three-phase circuit. Each of the second inverter unit areas 216 is independently provided with a inverter single tube 220, which serves as the lower bridge arm of the three-phase circuit.

[0031] The three inverter single tubes 220 in the first inverter unit area 215 are electrically connected to the three second inverter unit areas 216 respectively, so that the emitter of the inverter single tube 220 of the upper bridge arm is connected to the collector of the inverter single tube 220 of the lower bridge arm.

[0032] The three inverter single tubes 220 in the second inverter unit area 216 are electrically connected to the output terminal area 218 respectively, and the terminal assembly 240 on the output terminal area 218 is used as the DC-output terminal of the inverter unit area, so that the emission set of the inverter single tube 220 of the lower bridge arm is connected to the DC-output terminal.

[0033] The terminal assemblies 240 are respectively arranged on the first inverter unit area 215 and the three second inverter unit areas 216. The terminal assembly 240 connected to the first inverter unit area 215 is the DC+ input terminal of the inverter unit area, and the terminal assembly 240 connected to the second inverter unit area 216 is the AC output terminal of the inverter unit area, which outputs three-phase alternating current to the motor load.

[0034] Each of the inverter single tubes 220 is electrically connected to the signal terminal area 218, and the terminal assembly 240 on the signal terminal area 218 is used as the drive signal terminal of the inverter unit area to control conduction and shutdown. Through the above connection, the C pole of the inverter single tube 220 of the upper bridge arm is connected to the DC+ input terminal, the E pole is connected to the C pole of the inverter single tube 220 of the lower bridge arm and output to the AC output terminal, and the G pole is connected to the drive signal terminal, and the drive circuit provides a control signal to control conduction or shutdown. The C pole of the inverter single tube 220 of the lower bridge arm is connected to the E pole of the inverter single tube 220 of the upper bridge arm, the E pole is connected to the DC- output terminal, and the G pole is connected to the drive signal terminal, and another drive circuit provides a control signal to complement the upper bridge arm. Then a three-phase full-bridge inverter circuit is formed to convert direct current into three-phase alternating current and output it to the motor load.

[0035] Each of the PTC unit areas 217 is provided with a PTC single tube 230, which is a switch for controlling whether the PTC heater in the vehicle is working. The three PTC single tubes 230 are electrically connected to the three output terminal areas 218 respectively, and the terminal assembly 240 on the output terminal area 218 is used as a DC-output terminal, that is, the emitter of the PTC single tube 230 is connected to the output terminal area 218.

[0036] Each of the PTC unit areas 217 is provided with a terminal assembly 240 , which serves as a DC+ input terminal, that is, the collector of the PTC single tube 230 is connected to the terminal assembly 240 serving as a DC+ input.

[0037] Each of the PTC single tubes 230 is electrically connected to the signal terminal area 218, that is, the gate of the PTC single tube 230 is connected to the signal terminal area 218, and the terminal assembly 240 on the signal terminal area 218 is used as a GE signal terminal to control on and off. When there is voltage between the DC+ input terminal and the DC- output terminal, and there is voltage at the GE signal terminal, the independent PTC single tube 230 will be turned on, and current will flow to the vehicle-mounted PTC.

[0038] The terminal assembly 240 includes a plurality of terminals (1 to 33). The first inverter unit area 215, the second inverter unit area 216, the PTC unit area 217, the output terminal area 218, and the signal terminal area 219 are respectively provided with a terminal, and the terminals connected to different areas are connected to different external electronic devices, so that the module is connected to the external electronic device through the terminal assembly 240. The connection is as follows: Figure 5 , Figure 6 , Figure 7 shown.

[0039] The six inverter units and three PTC units that are installed separately and do not need to be connected in the prior art are integrated into a single module, which saves costs and improves the degree of integration. During reproduction, they can be directly reflow-soldered in one step without the need for a complicated assembly process, eliminating multiple installation steps and connecting cables. It should be noted that the chip assembly 200 is also provided with a thermistor, and the two ends of the thermistor are respectively connected to the external temperature detection circuit through terminals 20 and 21, so as to monitor the module temperature in real time and prevent overheating damage. This should be a prior art and will not be repeated here.

[0040] The terminal assembly 240 is arranged on the housing 110, and one end of the terminal assembly 240 is connected to the substrate 210, and the other end is bent toward the center of the housing 110 and the tail is wavy. The end of the terminal assembly 240 bent toward the center of the housing 110 is connected to the PCB board reflow soldering through tin plating, so that by folding the terminal assembly 240 inward, the space occupied by the terminal laterally is significantly reduced, and the layout area is freed up for other components on the PCB board to achieve high-density integration. The tail of the terminal is designed as an elastic structure, which can release mechanical stress through elastic deformation when the module is installed or externally vibrated, avoiding the breakage of the solder joint or the tail of the terminal due to long-term stress. It is suitable for high-vibration scenarios such as automotive air-conditioning compressors, and significantly improves the environmental adaptability of the module.

[0041] The potting body 300 is formed by potting liquid epoxy in the housing 110. The liquid epoxy has high mechanical strength, excellent insulation and chemical corrosion resistance, and has a higher glass transition temperature (TG). Therefore, using the liquid epoxy as an internal seal to pot the chip assembly 200 has higher reliability.

[0042] Compared with the prior art, the upper copper layer 212 of the nine-in-one integrated potting module provided by the present invention is provided with a plurality of channels 214 by chemical etching, and the upper copper layer 212 is divided into a first inverter unit area 215, three second inverter unit areas 216, three PTC unit areas 217, multiple input terminal areas 217, multiple output terminal areas 218, and multiple signal terminal areas 219. Three inverter single tubes 220 are arranged in the first inverter unit area 215, and one inverter single tube 220 is separately arranged in each of the second inverter unit areas 216, and one PTC single tube 230 is respectively arranged in each of the PTC unit areas 217. The air-conditioning compressor electric drive in the prior art is separately installed with six inverter units and three PTC units, and a complete three-phase full-bridge inverter circuit is constructed in a single module through the multi-layer circuit topology reconstruction of the upper copper layer, and the PTC heating function unit is integrated into a single module, so as to realize the nine-in-one integration of electric drive and heating functions. During reproduction, it can be directly reflow-soldered in one step without complicated assembly process, thus saving cost and improving integration. In addition, the height of the limiting step 121 is the same as the height of the welding surface of the terminal assembly 240. One end of the terminal assembly 240 is connected to the substrate 210, and the other end is bent toward the center of the housing 110 and the tail is wavy to reduce the stress generated during installation and module vibration. The inner folding structure of the terminal assembly 240 cooperates with the design of the limiting step 121 to realize automatic alignment welding of the PCB board, while significantly reducing the space occupied by the terminal horizontally, freeing up layout area for other components on the PCB board and realizing high-density integration.

[0043] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent substitution or improvement within the spirit of the present invention is included in the scope of the claims of the present invention.

Claims

1. A nine-in-one integrated potting module, characterized in that: The nine-in-one integrated potting module includes a shell component, a chip component arranged on the shell component, and a potting body arranged on the shell component. The shell component includes a shell, the chip component includes a substrate, six inverter single tubes arranged on the substrate, three PTC single tubes arranged on the substrate, and a terminal component arranged on the substrate. The substrate has three layers, the middle is a ceramic layer, and the upper and lower layers are an upper copper layer and a lower copper layer. The upper copper layer is provided with a plurality of channels, and the upper copper layer is divided into a first inverter unit area, three second inverter unit areas, three PTC unit areas, a plurality of input terminal areas, a plurality of output terminal areas, and a plurality of signal terminal areas. The first inverter unit area is provided with three inverters. A single inverter tube, a single inverter tube is separately arranged in each of the second inverter unit areas, the three single inverter tubes in the first inverter unit area are electrically connected to the three second inverter unit areas respectively, the single inverter tubes in the three second inverter unit areas are electrically connected to the output terminal area respectively, the first inverter unit area and the three second inverter unit areas are respectively provided with the terminal assemblies, each of the inverter units is electrically connected to the signal terminal area, a single PTC tube is respectively arranged in each of the PTC unit areas, the three single PTC tubes are electrically connected to the three output terminal areas respectively, the terminal assembly is arranged on each of the PTC unit areas, and each of the PTC single tubes is electrically connected to the signal terminal area.

2. The nine-in-one integrated potting module according to claim 1, characterized in that: The housing assembly further comprises four support columns arranged on the housing, and a plurality of creepage bosses arranged on the housing.

3. The nine-in-one integrated potting module according to claim 2, characterized in that: The support column is provided with a circle of limiting steps, and the height of the limiting steps is the same as the height of the welding surface of the terminal.

4. The nine-in-one integrated potting module according to claim 2, characterized in that: The creepage boss is arranged on the top surface of the housing and is located between a plurality of terminals.

5. The nine-in-one integrated potting module according to claim 1, characterized in that: The terminal assembly is arranged on the shell, one end of the terminal assembly is connected to the substrate, and the other end is bent toward the center of the shell and the tail is wavy.

6. The nine-in-one integrated potting module according to claim 1, characterized in that: The terminal assembly includes a plurality of terminals, and one terminal is respectively provided on the first inverter unit area, the second inverter unit area, the PTC unit area, the output terminal area, and the signal terminal area.

7. The nine-in-one integrated potting module according to claim 6, characterized in that: The terminal assembly connected to the first inverter unit area is a DC+ input terminal of the inverter unit area, and the terminal assembly connected to the second inverter unit area is an AC output terminal of the inverter unit area.

8. The nine-in-one integrated potting module according to claim 6, characterized in that: The terminal connected to the PTC unit area is a DC+ input terminal of the PTC unit.

9. The nine-in-one integrated potting module according to claim 1, characterized in that: The potting body is formed by potting liquid epoxy in the shell.

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