Printed circuit board ink flattening device

Abstract

The present invention relates to the field of circuit board processing technology, and specifically to a printed circuit board ink flattening device, comprising a processing table and a flattening roller, and also comprising a sealing chamber, wherein the sealing chamber is arranged on the processing table; a placement plate, wherein the placement plate is slidably arranged in the sealing chamber, and the placement plate is used to place the circuit board; a fixing component, wherein the fixing component is arranged on the processing table, and the circuit board placed on the placement plate is fixed by the fixing component. When in use, this printed circuit board ink flattening device is designed to automatically adjust the flattening force so that the flattening device can adapt to circuit boards of different thicknesses, ensuring that each circuit board can receive appropriate flattening treatment. By precisely controlling the flattening force, problems such as poor flattening effect or damage to the circuit board caused by excessive or insufficient force can be avoided, ensuring that the ink on the surface of the circuit board after flattening is uniform and flat.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, in particular to a printed circuit board ink flattening device. Background Art

[0002] Printed circuit board ink flattening is a key process in the manufacture of electronic products. It aims to ensure that the ink on the circuit board can be evenly and evenly covered to improve the aesthetics and electrical performance of the circuit board. This process uses a specific flattening device to flatten the ink coated on the surface of the circuit board. During the flattening process, the circuit board is first cleaned and pre-treated to ensure that the ink can adhere smoothly. Then, the ink is evenly coated on the circuit board to form the required circuit pattern. Then, the flattening device adjusts the pressure and position of the flattening component to flatten the ink on the upper and lower surfaces of the circuit board at the same time to reduce ink protrusions, unevenness, etc. For printed circuit boards, the adjustment of the flattening pressure is crucial. Thinner circuit boards may be damaged due to excessive pressure, resulting in a decrease in the performance and reliability of the circuit boards. If the pressure is insufficient for thicker circuit boards, the ink may not be completely flattened, leaving protrusions or unevenness, which will also affect the quality and performance of the circuit boards. Therefore, when performing the flattening operation, the operator needs to accurately adjust the flattening pressure according to the actual thickness of the circuit board, which requires the staff to spend a lot of time and energy to make detailed adjustments, which not only increases the complexity of the operation, but also leads to a decrease in production efficiency and an increase in cost. For this reason, we propose a printed circuit board ink flattening device. Summary of the Invention

[0003] One of the technical problems to be solved by this application is that when performing the flattening operation, the operator needs to accurately adjust the flattening pressure according to the actual thickness of the circuit board, which requires the staff to spend a lot of time and energy to make detailed adjustments, which not only increases the complexity of the operation, but also leads to a decrease in production efficiency and an increase in cost.

[0004] In order to solve the above technical problems, an embodiment of the present application provides an ink flattening device for a printed circuit board, comprising a processing table and a flattening roller, and also comprising a sealing chamber, which is arranged on the processing table; a placing plate, which is slidably arranged in the sealing chamber, and the circuit board is placed on the placing plate; a fixing component, which is arranged on the processing table, and the circuit board placed on the placing plate is fixed by the fixing component; and a driving unit, which is arranged in the sealing chamber, and the placing plate is driven to move up and down in the sealing chamber by the driving unit, thereby changing the distance between the placing plate and the flattening roller, and thereby changing the extrusion pressure between the two.

[0005] In some embodiments, the fixing component includes a placing piece arranged on a placing plate, the placing piece is used to support a circuit board, the placing piece is provided with an adsorption piece, the circuit board on the placing plate is adsorbed and fixed by the adsorption piece, the adsorption piece is provided with an opening and closing piece, the opening and closing piece is used to control the opening and closing of the adsorption piece, and the sealing chamber is provided with an exhaust piece, the exhaust piece is used to discharge the gas in the sealing chamber.

[0006] In some embodiments, the placement member includes a mounting groove arranged on the processing table, the mounting groove is connected to the sealing chamber, a plurality of power chambers are arranged in the sealing chamber, a plurality of connecting rods are slidingly arranged on the power chamber, a telescopic rod 1 is arranged on the connecting rod, one end of the telescopic rod 1 is connected to the placement plate, and an extrusion spring is sleeved on the telescopic rod 1.

[0007] In some embodiments, the adsorption component includes a plurality of air holes opened on the placement plate, the air holes are connected to the sealing chamber, a fixed plate is provided in the air hole, an extension rod is rotatably provided on the fixed plate, a sealing plate 1 is provided at one end of the extension rod, the sealing plate 1 is fitted with the placement plate, a sealing plate 2 is provided on the fixed plate for use with the sealing plate 1, the sealing plate 2 is rotatably connected to the extension rod, and through holes are provided on both the sealing plate 1 and the sealing plate 2.

[0008] In some embodiments, the opening and closing part includes a positioning plate arranged in the air hole, a connecting groove is provided on the extension rod, a sliding rod is slidably arranged in the connecting groove, the sliding rod passes through positioning plate 1, a limiting plate 1 is provided on the sliding rod, a limiting plate 2 is provided on the extension rod, a buffer spring is provided on the sliding rod between limiting plate 1 and limiting plate 2, a pressure plate is provided on the sliding rod, and the pressure plate is higher than the placement plate in the horizontal direction, a spiral groove is provided on the sliding rod, a push rod used in conjunction with the spiral groove is provided in the connecting groove, and the push rod is slidably connected to the spiral groove.

[0009] In some embodiments, the exhaust component includes an exhaust pipe arranged on the sealing chamber, one end of the exhaust pipe is connected to the mounting groove, a mounting plate 1 is provided in the exhaust pipe, a moving rod is slidably provided on the mounting plate 1, a closing plate is provided at one end of the moving rod located in the mounting pipe, a mounting plate 2 is provided in the exhaust pipe, the closing plate is fitted with the mounting plate 2, the moving rod is located between the closing plate and the mounting plate 1 and is sleeved with a closing spring, a connecting rod is provided at one end of the moving rod away from the closing plate, a sliding groove is provided in the mounting groove, and the connecting rod is slidably connected to the sliding groove.

[0010] In some embodiments, the driving unit includes a rotating member disposed in the sealed chamber, which is used to drive the placement plate to move up and down. A power member is disposed in the sealed chamber, which is used to provide power for the rotating member.

[0011] In some embodiments, the rotating part includes a vertical plate arranged in the power bin, a rotating shaft is rotatably arranged on the vertical plate, a plurality of rotating screws are rotatably arranged in the power bin, the rotating screws are threadedly connected to the connecting rods, a worm gear is arranged on the rotating screw, and worms engaged with the worm gear are arranged at both ends of the rotating shaft.

[0012] In some embodiments, the power part includes a power gear arranged on a rotating shaft, a plurality of power racks engaged with the power gear are slidingly arranged in the sealed chamber, a plurality of positioning plates are arranged in the sealed chamber, a telescopic rod 2 is arranged on the positioning plate, one end of the telescopic rod 2 is connected to the power rack, a return spring is provided on the telescopic rod 2, a triangular plate is provided at one end of the power rack away from the telescopic rod 2, a mounting bracket is provided on the placement plate, an extrusion rod is provided on the mounting bracket, and an extrusion plate is provided at one end of the extrusion rod for use with the triangular plate.

[0013] In some embodiments, the pressure plate is made of rubber.

[0014] The present invention has at least the following beneficial effects:

[0015] 1. Improve flattening accuracy: The design of automatically adjusting the flattening force enables the flattening device to adapt to circuit boards of different thicknesses, ensuring that each circuit board can receive appropriate flattening treatment. By precisely controlling the flattening force, problems such as poor flattening effect or circuit board damage caused by excessive or insufficient force can be avoided, ensuring that the ink on the surface of the circuit board after flattening is even and flat.

[0016] 2. Improve production efficiency: The design of automatic adjustment of flattening force reduces the steps of manual adjustment of flattening force, reduces the complexity and labor intensity of manual operation. Since the manual adjustment time is reduced, the entire flattening process can be carried out more quickly and efficiently, thereby improving production efficiency.

[0017] 3. Ensure product quality: Automatic adjustment of the flattening force can prevent quality problems such as circuit board deformation and cracking caused by excessive flattening force. Accurate flattening force control can ensure the uniform distribution of ink on the surface of the circuit board, improving the aesthetics and reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 For the present invention Figure 1 Schematic diagram of explosion structure;

[0020] Figure 3 For the present invention Figure 1 Schematic diagram of the cutaway flattening roller structure;

[0021] Figure 4 This is a schematic diagram of the explosion structure of the sealed chamber of the present invention;

[0022] Figure 5 Schematic diagram of the drive unit structure of the present invention;

[0023] Figure 6 For the present invention Figure 5 Schematic diagram of the enlarged structure of area A in the middle;

[0024] Figure 7 This is a schematic diagram of the explosion structure of the exhaust component of the present invention;

[0025] Figure 8 This is a schematic diagram of the opening and closing member structure of the present invention;

[0026] Figure 9 For the present invention Figure 8 Schematic diagram of explosion structure;

[0027] Figure 10 This is a structural diagram of embodiment 2 of the present invention.

[0028] In the figure: 1. Processing table; 2. Flattening roller; 3. Placement plate; 4. Fixing assembly; 5. Placement member; 51. Mounting slot; 52. Sealing chamber; 53. Power chamber; 54. Connecting rod; 55. Telescopic rod 1; 56. Extrusion spring; 6. Adsorption member; 61. Air hole; 62. Fixing plate; 63. Extension rod; 64. Sealing plate 1; 65. Sealing plate 2; 66. Through hole; 7. Opening and closing member; 71. Positioning plate; 72. Connecting slot; 73. Sliding rod; 74. Limiting plate 1; 75. Limiting plate 2; 76. Buffer spring; 77. Pressure plate; 78. Spiral groove; 79. Push rod; 8 , exhaust parts; 81, exhaust pipe; 82, mounting plate one; 83, moving rod; 84, closing plate; 85, mounting plate two; 86, closing spring; 87, connecting rod; 88, sliding groove; 9, driving unit; 10, rotating part; 101, vertical plate; 102, rotating shaft; 103, rotating screw; 104, worm gear; 105, worm; 11, power part; 111, power gear; 112, power rack; 113, positioning plate; 114, telescopic rod two; 115, reset spring; 116, triangle plate; 117, mounting frame; 118, extrusion rod; 119, extrusion plate. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Example 1: Please refer to Figure 1-9 The present invention provides a technical solution: a printed circuit board ink flattening device, comprising a processing table 1 and a flattening roller 2, and also comprising a sealing chamber 52, wherein the sealing chamber 52 is arranged on the processing table 1; a placement plate 3, wherein the placement plate 3 is slidably arranged in the sealing chamber 52, and the placement plate 3 is used to place the circuit board; and a fixing component 4, wherein the fixing component 4 is arranged on the processing table 1, and the circuit board placed on the placement plate 3 is fixed by the fixing component 4.

[0031] The driving unit 9 is arranged in the sealing chamber 52, and the driving unit 9 drives the placement plate 3 to move up and down in the sealing chamber 52, thereby changing the distance between the placement plate 3 and the flattening roller 2, and then changing the extrusion pressure between the two.

[0032] The advantage of the setting of the drive unit 9 is that it can automatically adjust the flattening force of the flattening roller 2 according to the thickness of the circuit board when flattening the ink of the printed circuit board. The design of automatically adjusting the flattening force enables the flattening device to adapt to circuit boards of different thicknesses, ensuring that each circuit board can receive appropriate flattening treatment. By precisely controlling the flattening force, problems such as poor flattening effect or damage to the circuit board caused by excessive or insufficient force can be avoided, ensuring that the ink on the surface of the circuit board after flattening is uniform and flat. At the same time, the design of automatically adjusting the flattening force reduces the steps of manually adjusting the flattening force, reduces the complexity and labor intensity of manual operation, and due to the reduction of manual adjustment time, the entire flattening process can be carried out more quickly and efficiently, thereby improving production efficiency. Not only that, the automatic adjustment of the flattening force can prevent quality problems such as deformation and cracking of the circuit board caused by excessive flattening force. Accurate flattening force control can ensure the uniform distribution of ink on the surface of the circuit board, improving the aesthetics and reliability of the product.

[0033] The fixing component 4 includes a placement piece 5 arranged on the placement plate 3, and the placement piece 5 is used to support the circuit board. The placement piece 5 is provided with an adsorption piece 6, and the circuit board on the placement plate 3 is adsorbed and fixed by the adsorption piece 6. The adsorption piece 6 is provided with an opening and closing piece 7, and the opening and closing piece 7 is used to control the opening and closing of the adsorption piece 6. The sealing chamber 52 is provided with an exhaust piece 8, and the exhaust piece 8 is used to discharge the gas in the sealing chamber 52.

[0034] The advantage of setting up the fixing component 4 is that when flattening the ink of the printed circuit board, the circuit board is fixed by negative pressure adsorption instead of the conventional clamping method. The fixing method of negative pressure adsorption can quickly fix the circuit board on the workbench without the need for additional clamping or fixing devices, thereby saving operation time. At the same time, the fixing method of negative pressure adsorption will not cause any physical damage to the circuit board, such as scratches, indentations, etc. Compared with the traditional clamping method, negative pressure adsorption is gentler and safer, and can ensure the integrity of the circuit board during the flattening process. Moreover, the fixing method of negative pressure adsorption is suitable for circuit boards of different sizes and shapes, and has high flexibility. This fixing method can adapt to various complex circuit board shapes to ensure that they are evenly processed during the flattening process.

[0035] The placement piece 5 includes a mounting groove 51 arranged on the processing table 1, and the mounting groove 51 is connected to the sealing chamber 52. A plurality of power chambers 53 are arranged in the sealing chamber 52. A plurality of connecting rods 54 are slidingly arranged on the power chamber 53. A telescopic rod 55 is arranged on the connecting rod 54. One end of the telescopic rod 55 is connected to the placement plate 3, and an extrusion spring 56 is sleeved on the telescopic rod 55.

[0036] The adsorption part 6 includes a plurality of air holes 61 provided on the placement plate 3, and the air holes 61 are connected to the sealing chamber 52. A fixing plate 62 is provided in the air hole 61, and an extension rod 63 is rotatably provided on the fixing plate 62. A sealing plate 1 64 is provided at one end of the extension rod 63, and the sealing plate 1 64 is fitted with the placement plate 3. A sealing plate 2 65 used in conjunction with the sealing plate 1 64 is provided on the fixing plate 62, and the sealing plate 2 65 is rotatably connected to the extension rod 63. Both the sealing plate 1 64 and the sealing plate 2 65 are provided with through holes 66.

[0037] The advantage of setting up the adsorption part 6 is that the negative pressure adsorption fixing method will not cause any physical damage to the circuit board, such as scratches, indentations, etc. Compared with the traditional clamping method, negative pressure adsorption is gentler and safer, and can ensure the integrity of the circuit board during the flattening process.

[0038] The opening and closing member 7 includes a positioning plate 71 arranged in the air hole 61, a connecting groove 72 is provided on the extension rod 63, a sliding rod 73 is slidably arranged in the connecting groove 72, the sliding rod 73 passes through the positioning plate 71 one, a limiting plate 1 74 is provided on the sliding rod 73, a limiting plate 2 75 is provided on the extension rod 63, a buffer spring 76 is sleeved between the limiting plate 1 74 and the limiting plate 2 75 on the sliding rod 73, a pressure plate 77 is provided on the sliding rod 73, and the pressure plate 77 is higher than the placement plate 3 in the horizontal direction, a spiral groove 78 is provided on the sliding rod 73, and a push rod 79 used in conjunction with the spiral groove 78 is provided in the connecting groove 72, and the push rod 79 is slidably connected to the spiral groove 78.

[0039] The exhaust component 8 includes an exhaust pipe 81 arranged on the sealing chamber 52, one end of the exhaust pipe 81 is connected to the mounting groove 51, a mounting plate 1 82 is arranged in the exhaust pipe 81, a moving rod 83 is slidably arranged on the mounting plate 1 82, the moving rod 83 is located in the mounting pipe and a closing plate 84 is arranged at one end, a mounting plate 2 85 is provided in the exhaust pipe 81, the closing plate 84 is fitted with the mounting plate 2 85, the moving rod 83 is located between the closing plate 84 and the mounting plate 1 82 and is sleeved with a closing spring 86, a connecting rod 87 is provided at the end of the moving rod 83 away from the closing plate 84, the mounting groove 51 is provided with a sliding groove 88, and the connecting rod 87 is slidably connected to the sliding groove 88.

[0040] When the flattening roller 2 contacts the circuit board and squeezes the circuit board, the circuit board descends and drives the placement plate 3 to descend synchronously, squeezing the gas in the sealing chamber 52. When the circuit board descends, it first squeezes the pressure plate 77, driving the sliding rod 73 to overcome the elastic force of the buffer spring 76 and descend. When the sliding rod 73 descends, it drives the spiral groove 78 opened on it to descend synchronously, and then drives the push rod 79 slidingly connected to the spiral groove 78 to rotate. The rotation of the push rod 79 drives the extension rod 63 to rotate. The rotation of the extension rod 63 drives the sealing plate 1 64 to rotate so that the through hole 66 opened on the sealing plate 1 64 is connected with the through hole 66 on the sealing plate 2 65; at the same time, after high pressure is formed in the sealing chamber 52, the gas pushes the closing plate 84 and the mounting plate 2 85 out of contact, so that the gas is discharged, and the circuit board is fixed on the placement plate 3 under the adsorption of the air hole 61.

[0041] The driving unit 9 includes a rotating member 10 disposed in the sealed chamber 52 , which is used to drive the placement plate 3 to move up and down. A power member 11 is disposed in the sealed chamber 52 , which is used to provide power for the rotating member 10 to work.

[0042] The rotating part 10 includes a vertical plate 101 arranged in the power compartment 53, a rotating shaft 102 is rotatably arranged on the vertical plate 101, a plurality of rotating screws 103 are rotatably arranged in the power compartment 53, the rotating screws 103 are threadedly connected to the connecting rod 54, a worm gear 104 is arranged on the rotating screw 103, and worms 105 engaged with the worm gear 104 are arranged at both ends of the rotating shaft 102.

[0043] The advantage of setting up the rotating part 10 is that it can automatically adjust the flattening force of the flattening roller 2 according to the thickness of the circuit board. The design of automatically adjusting the flattening force enables the flattening device to adapt to circuit boards of different thicknesses, ensuring that each circuit board can receive appropriate flattening treatment. By precisely controlling the flattening force, problems such as poor flattening effect or damage to the circuit board due to excessive or insufficient force can be avoided.

[0044] The power part 11 includes a power gear 111 arranged on the rotating shaft 102, and a plurality of power racks 112 engaged with the power gear 111 are slidably arranged in the sealed chamber 52, and a plurality of positioning plates 113 are arranged in the sealed chamber 52, and a telescopic rod 2 114 is provided on the positioning plate 113, and one end of the telescopic rod 2 114 is connected to the power rack 112, and a return spring 115 is sleeved on the telescopic rod 2 114, and a triangular plate 116 is provided at one end of the power rack 112 away from the telescopic rod 2 114, and a mounting bracket 117 is provided on the placement plate 3, and an extrusion rod 118 is provided on the mounting bracket 117, and an extrusion plate 119 is provided at one end of the extrusion rod 118 for use with the triangular plate 116.

[0045] When the placing plate 3 descends, the extrusion rod 118 and the extrusion plate 119 on the extrusion rod 118 will be driven down synchronously. The extrusion plate 119 descends to push the triangular plate 116 and the power rack 112 connected to the triangular plate 116 to move. When the power rack 112 moves, it pushes the power gear 111 engaged with it to rotate. The rotation of the power gear 111 drives the rotating shaft 102 connected to it to rotate. When the rotating shaft 102 rotates, it drives the worm 105 arranged on both sides thereof to rotate. The rotation of the worm 105 drives the worm wheel 104 to rotate, and the worm wheel 104 rotates. The rotation of the screw rod 103 drives the rotating screw rod 103 to rotate, and the rotation of the screw rod 103 drives the connecting rod 54 threadedly connected to it to rotate, and the rotation of the connecting rod 87 drives the telescopic rod 55 to rise. The rise of the telescopic rod 55 compresses the extrusion spring 56, thereby making the pushing force on the placement plate 3 stronger, so that a greater pressure is generated between it and the flattening roller 2. When the flattening roller 2 is reset, it drives the push rod 79 to drive the closing plate 84 to contact the seal in the sealing chamber 52, so that the gas can be discharged. At this time, the power rack 112 will be reset under the elastic force of the reset spring 115.

[0046] When in use, when the flattening roller 2 contacts and squeezes the circuit board, the circuit board descends and drives the placement plate 3 to descend synchronously, squeezing the gas in the sealing chamber 52. When the circuit board descends, it first squeezes the pressure plate 77, driving the sliding rod 73 to overcome the elastic force of the buffer spring 76 and descend. When the sliding rod 73 descends, it drives the spiral groove 78 opened on it to descend synchronously, and then drives the push rod 79 slidingly connected to the spiral groove 78 to rotate. The rotation of the push rod 79 drives the extension rod 63 to rotate. The rotation of the extension rod 63 drives the sealing plate 1 64 to rotate so that the through hole 66 opened on the sealing plate 1 64 is connected with the through hole 66 on the sealing plate 2 65; at the same time, after high pressure is formed in the sealing chamber 52, the gas pushes the closing plate 84 and the mounting plate 2 85 out of contact, so that the gas is discharged, and the circuit board is fixed on the placement plate 3 under the adsorption of the air hole 61.

[0047] When the placement plate 3 descends, it will synchronously drive the extrusion rod 118 and the extrusion plate 119 on the extrusion rod 118 to descend. The extrusion plate 119 descends to push the triangular plate 116 and the power rack 112 connected to the triangular plate 116 to move. When the power rack 112 moves, it drives the power gear 111 engaged with it to rotate. The rotation of the power gear 111 drives the rotating shaft 102 connected to it to rotate. When the rotating shaft 102 rotates, it drives the worm 105 set on both sides thereof to rotate. The rotation of the worm 105 drives the worm wheel 104 to rotate, and the worm wheel 104 rotates. The rotation of the screw rod 103 drives the rotating screw rod 103 to rotate, and the rotation of the screw rod 103 drives the connecting rod 54 threadedly connected to it to rotate, and the rotation of the connecting rod 87 drives the telescopic rod 55 to rise. The rise of the telescopic rod 55 compresses the extrusion spring 56, thereby making the pushing force on the placement plate 3 stronger, so that a greater pressure is generated between it and the flattening roller 2. When the flattening roller 2 is reset, it drives the push rod 79 to drive the closing plate 84 to contact the seal in the sealing chamber 52, so that the gas can be discharged. At this time, the power rack 112 will be reset under the elastic force of the reset spring 115.

[0048] Example 2: Please refer to Figure 10 The present invention provides a technical solution: the pressure plate 77 is made of rubber material, and the pressure plate 77 made of rubber material can avoid damaging the circuit board when in contact with the circuit board.

[0049] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0050] While the embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that various changes, modifications, substitutions, and alterations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A printed circuit board ink flattening device, comprising a processing table (1) and a flattening roller (2), characterized in that: Also includes: A sealed chamber (52), wherein the sealed chamber (52) is arranged on the processing table (1); A placement plate (3), the placement plate (3) being slidably disposed in the sealed chamber (52), and the circuit board being placed on the placement plate (3); A fixing component (4), the fixing component (4) being arranged on the processing table (1), and utilizing the fixing component (4) to fix a circuit board placed on the placement plate (3); A driving unit (9), the driving unit (9) being arranged in the sealing chamber (52), and driving the placement plate (3) to move up and down in the sealing chamber (52) via the driving unit (9), thereby changing the distance between the placement plate (3) and the flattening roller (2), and thereby changing the extrusion pressure between the two; The fixing assembly (4) includes a placement member (5) arranged on the placement plate (3), the placement member (5) is used to support the circuit board, the placement member (5) is provided with an adsorption member (6), the circuit board on the placement plate (3) is adsorbed and fixed by the adsorption member (6), the adsorption member (6) is provided with an opening and closing member (7), the opening and closing member (7) is used to control the opening and closing of the adsorption member (6), the sealing chamber (52) is provided with an exhaust member (8), the exhaust member (8) is used to exhaust the gas in the sealing chamber (52); The placement member (5) includes a mounting groove (51) provided on the processing table (1), the mounting groove (51) is connected to the sealing chamber (52), a plurality of power chambers (53) are provided in the sealing chamber (52), a plurality of connecting rods (54) are slidably provided on the power chamber (53), a telescopic rod (55) is provided on the connecting rod (54), one end of the telescopic rod (55) is connected to the placement plate (3), and a compression spring (56) is sleeved on the telescopic rod (55); The adsorption member (6) includes a plurality of air holes (61) provided on the placement plate (3), the air holes (61) are communicated with the sealing chamber (52), a fixed plate (62) is provided in the air hole (61), an extension rod (63) is rotatably provided on the fixed plate (62), a sealing plate 1 (64) is provided at one end of the extension rod (63), the sealing plate 1 (64) is fitted with the placement plate (3), a sealing plate 2 (65) used in conjunction with the sealing plate 1 (64) is provided on the fixed plate (62), the sealing plate 2 (65) is rotatably connected to the extension rod (63), and a through hole (66) is provided on both the sealing plate 1 (64) and the sealing plate 2 (65).

2. The printed circuit board ink flattening device according to claim 1, characterized in that: The opening and closing member (7) includes a positioning plate (71) arranged in the air hole (61), a connecting groove (72) is provided on the extension rod (63), a sliding rod (73) is slidably provided in the connecting groove (72), the sliding rod (73) passes through the positioning plate (71) one, a limiting plate (74) is provided on the sliding rod (73), a limiting plate (75) is provided on the extension rod (63), a buffer spring (76) is sleeved between the limiting plate (74) and the limiting plate (75) on the sliding rod (73), a pressure plate (77) is provided on the sliding rod (73), and the pressure plate (77) is higher than the placement plate (3) in the horizontal direction, a spiral groove (78) is provided on the sliding rod (73), a push rod (79) used in conjunction with the spiral groove (78) is provided in the connecting groove (72), and the push rod (79) is slidably connected to the spiral groove (78).

3. The printed circuit board ink flattening device according to claim 2, characterized in that: The exhaust member (8) includes an exhaust pipe (81) arranged on the sealing chamber (52), one end of the exhaust pipe (81) is communicated with the mounting groove (51), a mounting plate 1 (82) is arranged in the exhaust pipe (81), a moving rod (83) is slidably arranged on the mounting plate 1 (82), one end of the moving rod (83) is provided in the mounting pipe and a closing plate (84) is provided, a mounting plate 2 (85) is arranged in the exhaust pipe (81), the closing plate (84) is fitted with the mounting plate 2 (85), the moving rod (83) is located between the closing plate (84) and the mounting plate 1 (82) and is sleeved with a closing spring (86), a connecting rod (87) is provided at one end of the moving rod (83) away from the closing plate (84), the mounting groove (51) is provided with a sliding groove (88), and the connecting rod (87) is slidably connected to the sliding groove (88).

4. The printed circuit board ink flattening device according to claim 3, characterized in that: The driving unit (9) includes a rotating member (10) disposed in the sealed chamber (52), and the rotating member (10) is used to drive the placement plate (3) to move up and down. A power member (11) is disposed in the sealed chamber (52), and the power member (11) is used to provide power for the rotating member (10) to operate.

5. The printed circuit board ink flattening device according to claim 4, characterized in that: The rotating member (10) includes a vertical plate (101) arranged in a power bin (53), a rotating shaft (102) is rotatably arranged on the vertical plate (101), a plurality of rotating screw rods (103) are rotatably arranged in the power bin (53), the rotating screw rods (103) are threadedly connected to the connecting rod (54), a worm gear (104) is arranged on the rotating screw rod (103), and worm gears (105) engaged with the worm gear (104) are arranged at both ends of the rotating shaft (102).

6. The printed circuit board ink flattening device according to claim 5, characterized in that: The power member (11) includes a power gear (111) arranged on a rotating shaft (102), a plurality of power racks (112) engaged with the power gear (111) are slidably arranged in the sealing chamber (52), a plurality of positioning plates (113) are arranged in the sealing chamber (52), a second telescopic rod (114) is arranged on the positioning plate (113), one end of the second telescopic rod (114) is connected to the power rack (112), a return spring (115) is sleeved on the second telescopic rod (114), a triangular plate (116) is arranged at one end of the power rack (112) away from the second telescopic rod (114), a mounting frame (117) is arranged on the placement plate (3), an extrusion rod (118) is arranged on the mounting frame (117), and an extrusion plate (119) used in conjunction with the triangular plate (116) is arranged at one end of the extrusion rod (118).

7. The printed circuit board ink flattening device according to claim 6, characterized in that: The pressure plate (77) is made of rubber.

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