Assembly method of radio frequency power amplifier

Abstract

The invention discloses an assembling method of a radio frequency power amplifier, the radio frequency power amplifier comprises a printed circuit board and a radio frequency circuit module which are electrically connected, and the assembling method comprises the following steps: performing routing debugging on the printed circuit board and the radio frequency circuit module to determine target routing process parameters; according to the target routing process parameters, the printed circuit board and the radio frequency circuit module are electrically connected through a routing process; wherein the routing debugging step comprises the following steps of: welding a metal protection gasket on a first bonding pad of the printed circuit board; and at least one time of routing is carried out between the metal protection gasket and the radio frequency circuit module. According to the scheme, the problem that the bonding pad of the printed circuit board is damaged in the routing debugging process can be solved, the time cost and the assembly cost are reduced, and the debugging efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and particularly to an assembly method for a radio frequency power amplifier. Background Art

[0002] A radio frequency power amplifier (PA) is an important part of contemporary electronic technology and is widely used in many fields such as communication, radar, and microwave energy. With the development of market demand, higher and higher requirements are put forward for the performance of radio frequency PAs, such as power, efficiency, gain, and integration.

[0003] A radio frequency power amplifier usually includes a printed circuit board (PCB) and a radio frequency circuit module electrically connected to the PCB. Assembling each part structure can obtain a radio frequency power amplifier. During the assembly process, it is necessary to electrically connect the PCB and the radio frequency circuit module. The common method is to use a wire bonding process to electrically connect the PCB and the radio frequency circuit module through gold wire bonding. For a radio frequency power amplifier, during the assembly process, it is necessary to debug the wire bonding process, that is, frequently adjust the parameters of the gold wire bonding, such as arc height, wire length, number of wires, etc., to ensure that the performance of the device meets the standards.

[0004] However, since the pads on the PCB are composed of metal coatings, and during debugging, it is necessary to repeatedly remove the original gold wire bonding and then bond new gold wire bonding, resulting in damage to the metal coatings at the pads of the PCB, and problems such as oxidation and contamination are likely to occur, leading to difficulties in bonding, frequent occurrence of virtual soldering, desoldering, and gold wire detachment, and even inability to bond. The current solution is only to re-fabricate and assemble the board, which not only takes a long time and is costly, but also may cause abnormal performance drift after the new PCB is assembled, greatly slowing down the debugging progress and bringing trouble to product development. Summary of the Invention

[0005] The present invention provides an assembly method for a radio frequency power amplifier to solve the problem of damage to the pads of the printed circuit board during the wire bonding debugging process, reduce the time cost and assembly cost, and improve the debugging efficiency.

[0006] The present invention provides an assembly method for a radio frequency power amplifier. The radio frequency power amplifier includes a printed circuit board and a radio frequency circuit module, and the printed circuit board is electrically connected to the radio frequency circuit module; the assembly method includes:

[0007] Performing wire bonding debugging on the printed circuit board and the radio frequency circuit module to determine the target wire bonding process parameters;

[0008] According to the target wire bonding process parameters, electrically connecting the printed circuit board and the radio frequency circuit module by using a wire bonding process;

[0009] Among them, the steps of wire bonding debugging include:

[0010] Weld a metal protection gasket on the first pad of the printed circuit board;

[0011] Perform at least one wire bonding between the metal protection gasket and the radio frequency circuit module.

[0012] Optionally, after determining the target wire bonding process parameters, the assembly method further includes:

[0013] Remove the metal protection gasket.

[0014] Optionally, the first pad and the metal protection gasket are soldered by solder.

[0015] Optionally, during the process of wire bonding debugging, the assembly method further includes:

[0016] Remove the existing metal protection gasket on the first pad and replace it with a new one.

[0017] Optionally, one side of the metal protection gasket away from the first pad has a gold plating layer.

[0018] Optionally, the material of the metal protection gasket includes molybdenum copper alloy.

[0019] Optionally, the orthographic projection of the metal protection gasket on the printed circuit board does not exceed the area where the first pad is located.

[0020] Optionally, along the direction perpendicular to the plane where the printed circuit board is located, the thickness of the metal protection gasket is less than or equal to 1 mm.

[0021] Optionally, before wire bonding debugging the printed circuit board and the radio frequency circuit module, the assembly method further includes:

[0022] Provide a heat sink;

[0023] Fix the printed circuit board and the radio frequency circuit module on the heat sink.

[0024] Optionally, the radio frequency circuit module includes a radio frequency chip and a thin film circuit, and the radio frequency chip is electrically connected to the printed circuit board through the thin film circuit;

[0025] After fixing the printed circuit board and the radio frequency circuit module on the heat sink, the assembly method further includes:

[0026] Electrically connect the radio frequency chip and the thin film circuit by wire bonding process;

[0027] Wire bonding debugging of the printed circuit board and the radio frequency circuit module includes:

[0028] Wire bonding debugging of the printed circuit board and the thin film circuit.

[0029] In the technical solution of the embodiment of the present invention, during the wire bonding debugging of the printed circuit board and the radio frequency circuit module, first, a metal protection gasket is welded on the first pad of the printed circuit board, and then at least one wire bonding is performed between the metal protection gasket and the radio frequency circuit module to determine the target wire bonding process parameters through wire bonding debugging. Then, according to the target wire bonding process parameters, the printed circuit board and the radio frequency circuit module are electrically connected by using the wire bonding process. Thus, the first pad of the printed circuit board can be protected by the metal protection gasket during the wire bonding debugging process, avoiding the direct contact between the bonding wire and the first pad, and further avoiding the problem that the first pad is damaged due to repeated wire bonding for parameter adjustment during the wire bonding debugging process. There is no need to remake the printed circuit board, which can reduce the time cost and assembly cost and improve the debugging efficiency.

[0030] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0032] Figure 1 is a schematic flow chart of an assembly method of a radio frequency power amplifier provided by an embodiment of the present invention;

[0033] Figure 2 is Figure 1 a schematic flow chart of wire bonding debugging in the shown assembly method;

[0034] Figure 3 is a schematic top view structure diagram of a radio frequency power amplifier provided by an embodiment of the present invention;

[0035] Figure 4 is along Figure 3 a schematic cross-sectional structure diagram of the radio frequency power amplifier taken along AA' in;

[0036] Figure 5 is Figure 3 a schematic flow chart of the assembly method of the shown radio frequency power amplifier. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0038] Without departing from the spirit or scope of the present application, various modifications and changes can be made in the present application, which are obvious to those skilled in the art. Therefore, the present application is intended to cover the modifications and changes of the present application that fall within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in the embodiments of the present application can be combined with each other without conflict.

[0039] First of all, it should be noted that unless otherwise defined, the technical terms or scientific terms used in the present invention should have the ordinary meaning understood by those of ordinary skill in the art to which the present invention belongs. The "first" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Including" and similar words mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. "Connection" or "connected" and other similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper" or "lower" and other similar terms are only used to indicate the relative position relationship. When the absolute position of the object being described changes, the relative position relationship may also change accordingly. In addition, the shapes and sizes of the components in the drawings do not reflect the actual proportions, and the purpose is only to schematically illustrate the content of the present invention.

[0040] Figure 1 is a schematic flow chart of an assembly method of a radio frequency power amplifier provided by an embodiment of the present invention. The radio frequency power amplifier includes a printed circuit board and a radio frequency circuit module, and the printed circuit board is electrically connected to the radio frequency circuit module, as Figure 1 shown, and its assembly method may include the following steps:

[0041] S110. Provide a heat sink.

[0042] S120. Fix the printed circuit board and the radio frequency circuit module on the heat sink.

[0043] Among them, the heat sink is used for heat dissipation, conducting the heat generated during the operation of the RF circuit module and the printed circuit board to ensure the performance stability of the device. Exemplarily, the heat sink can be, for example, a copper sheet / copper block.

[0044] Among them, the RF circuit module at least includes an RF chip. In the embodiments of the present invention, the components included in the RF circuit module are not limited, and can be specifically designed according to the actual product adaptability. As described above, the RF circuit module in the RF power amplifier is electrically connected to the printed circuit board. In this way, the RF signal can be transmitted to the output end of the RF power amplifier through the printed circuit board, and then transmitted to the external circuit electrically connected to the output end of the RF power amplifier.

[0045] Optionally, the specific method of fixing the printed circuit board and the RF circuit module on the heat sink can be, for example, welding the printed circuit board to the heat sink through solder, and welding the RF circuit module to the heat sink through solder to ensure the heat conduction effect. Optionally, when the RF circuit module includes multiple components, the multiple components can be first bonded to the metal sheet by means such as conductive film or silver paste, and then the metal sheet is welded to the heat sink through solder. It should be noted that the above fixing methods are only illustrative and not limiting, as long as the RF circuit module and the printed circuit board can be fixed on the heat sink while ensuring the heat conduction effect.

[0046] S130. Perform wire bonding debugging on the printed circuit board and the RF circuit module to determine the target wire bonding process parameters.

[0047] Specifically, the printed circuit board and the RF circuit module can be electrically connected through bonding wires. The wire bonding process refers to the process of forming bonding wires between the corresponding pads of the printed circuit board and the RF circuit module to electrically connect the two. Exemplarily, the bonding wires can be gold wires.

[0048] Furthermore, as described above, for the RF power amplifier, the optimal wire bonding process parameters (target wire bonding process parameters) can be determined through wire bonding debugging to ensure the performance of the device meets the standards. To solve the problem of damage to the pads of the printed circuit board during the wire bonding debugging process, the embodiments of the present invention adopt the following solutions.

[0049] Figure 2 Yes Figure 1 The flow chart of wire bonding debugging in the shown assembly method is as Figure 2 shown. The steps of wire bonding debugging include:

[0050] S1301. Weld a metal protection gasket on the first pad of the printed circuit board.

[0051] S1302. Perform at least one wire bonding between the metal protection gasket and the RF circuit module.

[0052] Among them, the first pad generally refers to all the pads on the printed circuit board that are used for electrical connection with the radio frequency circuit module. In addition to the first pad, the printed circuit board may also include other pads.

[0053] Specifically, the process of wire bonding once between the metal protection gasket and the radio frequency circuit module can be understood as the process of forming bonding wires respectively between each metal protection gasket on the printed circuit board and the corresponding pads of the radio frequency circuit module. In short, each time wire bonding is performed, an electrical connection between the printed circuit board and the radio frequency circuit module can be completed.

[0054] Furthermore, the purpose of wire bonding debugging is to determine the target wire bonding process parameters and ensure that the device performance meets the standards. Therefore, the specific number of wire bondings during the wire bonding debugging process needs to be determined according to the test results after each wire bonding. If the test results do not meet the standards, the wire bonding process parameters need to be adjusted, and bonding wires are re-formed (i.e., wire bonding is re-performed) between the metal protection gasket and the radio frequency circuit module according to the adjusted wire bonding process parameters until the test results meet the standards. After the test results meet the standards, the wire bonding debugging can be stopped, and the wire bonding process parameters corresponding to when the test results meet the standards are determined as the above-mentioned target process parameters.

[0055] In this embodiment, during the wire bonding debugging process, first, a metal protection gasket is welded on the first pad of the printed circuit board, and then bonding wires are repeatedly formed between the metal protection gasket and the radio frequency circuit module to test the device performance and perform wire bonding debugging, so that the bonding wires are directly bonded to the metal protection gasket. Thus, the first pad of the printed circuit board can be protected by the metal protection gasket during the wire bonding debugging process, avoiding the direct contact between the bonding wires and the first pad. Furthermore, the problem that the first pad is damaged due to repeated wire bondings for parameter adjustment during the wire bonding debugging process can be avoided. There is no need to re-fabricate the printed circuit board, which can reduce the time cost and assembly cost and improve the debugging efficiency.

[0056] It should be noted that in the embodiment of the present invention, specific limitations are not imposed on parameters such as the material and shape of the metal protection gasket, as long as it is ensured that the metal protection gasket is correspondingly arranged with the first pad and can play a role in protecting the first pad.

[0057] Optionally, the first pad and the metal protection gasket are welded by solder.

[0058] Optionally, during the wire bonding debugging process, the metal protection gasket can be replaced, that is, the existing metal protection gasket on the first pad is removed and a new metal protection gasket is replaced. Specifically, after several repeated wire bondings or when it is found that the performance of the metal protection gasket has deteriorated, the existing metal protection gasket on the first pad can be removed by means of hot melt solder, and a new metal protection gasket can be replaced. In this way, the accuracy of the test results can be ensured. In addition, replacing the metal protection gasket is more convenient than replacing a new printed circuit board, and can reduce the time cost and assembly cost.

[0059] It should be noted that since the outermost surface of the metal plating layer forming the pads / circuits on the printed circuit board is usually a gold plating layer, and the melting point of tin is lower than that of gold, generally, the first pad will not be damaged when replacing the metal protection gasket.

[0060] Exemplarily, the wire bonding process parameters include but are not limited to parameters such as the arc height, wire length, and number of wires of the bonding wire. After wire bonding debugging, when the wire bonding process parameters corresponding to the qualified test results are determined as the target wire bonding process parameters, the printed circuit board and the radio frequency circuit module can be electrically connected by using the wire bonding process according to the target wire bonding process parameters. For details, see S140.

[0061] S140. Electrically connect the printed circuit board and the radio frequency circuit module by using the wire bonding process according to the target wire bonding process parameters.

[0062] It should be noted that when electrically connecting the printed circuit board and the radio frequency circuit module by using the wire bonding process according to the target wire bonding process parameters, whether to retain the metal protection gasket on the first pad can be selected according to actual needs.

[0063] Specifically, as a feasible implementation method, it is possible to choose to retain the metal protection gasket so that the bonding wire is directly bonded to the metal protection gasket, which can reduce the process and improve the assembly efficiency. As another feasible implementation method, optionally, after determining the target wire bonding process parameters, first remove the metal protection gasket to expose the first pad, and then electrically connect the printed circuit board and the radio frequency circuit module by using the bonding wire according to the target wire bonding process parameters (in this method, the bonding wire is directly bonded to the first pad). In this way, it is beneficial to reduce the influence of the inductance introduced by the metal protection gasket on the radio frequency performance, further improve the radio frequency performance, and the pads of the printed circuit board will not be damaged due to the removal of the metal protection gasket.

[0064] Furthermore, after electrically connecting the printed circuit board and the radio frequency circuit module, subsequent processes such as airtight capping can be carried out to obtain a finished radio frequency power amplifier.

[0065] In summary, when assembling the RF power amplifier in the embodiments of the present invention, during the wire bonding debugging process of the printed circuit board and the RF circuit module, first, a metal protection gasket is welded on the first pad of the printed circuit board, and then at least one wire bonding is performed between the metal protection gasket and the RF circuit module to determine the target wire bonding process parameters through wire bonding debugging. Then, according to the target wire bonding process parameters, the printed circuit board and the RF circuit module are electrically connected by using the wire bonding process. Thus, the first pad of the printed circuit board can be protected by the metal protection gasket during the wire bonding debugging process, avoiding the direct contact between the bonding wire and the first pad, and further avoiding the problem that the first pad is damaged due to repeated wire bonding for parameter adjustment during the wire bonding debugging process. There is no need to remake the printed circuit board, which can reduce the time cost and assembly cost and improve the debugging efficiency.

[0066] Based on the above embodiments, optionally, the side of the metal protection gasket away from the first pad has a gold plating layer. By plating gold on the side of the metal protection gasket away from the first pad, it is beneficial to the bonding of the gold wire and the metal protection gasket.

[0067] Optionally, the material of the metal protection gasket includes molybdenum copper alloy. The molybdenum copper alloy has a relatively hard texture, is not easily deformed, and has excellent electrical conductivity. Using the molybdenum copper alloy to make the metal protection gasket can well protect the first pad on the printed circuit board and reduce the replacement times of the metal protection gasket during the wire bonding debugging process, improving the debugging efficiency.

[0068] Optionally, the orthographic projection of the metal protection gasket on the printed circuit board does not exceed the area where the first pad is located. In other words, the orthographic projection of the metal protection gasket on the printed circuit board can completely overlap with the area where the first pad is located, or it can also be located inside the area where the first pad is located. Such a setting can avoid the short circuit between the first pads caused by the mutual contact between adjacent metal protection gaskets, ensuring the stable operation of the device and the accuracy of the test results.

[0069] Exemplarily, the shape of the metal protection gasket can be the same as the shape of its corresponding first pad, and the dimensions in all directions can be exactly the same as or slightly smaller than the first pad. The embodiments of the present invention do not limit this. Of course, in other embodiments, the shape of the metal protection gasket can also be different from the shape of its corresponding first pad, as long as it is ensured that the orthographic projection of the metal protection gasket on the printed circuit board does not exceed the area where the first pad is located.

[0070] Optionally, in a direction perpendicular to the plane of the printed circuit board, the thickness of the metal protection gasket is less than or equal to 1 mm. By controlling the thickness of the metal protection gasket below 1 mm, it is possible to avoid excessive bonding height differences caused by an overly thick metal protection gasket, which may affect wire bonding, and also reduce the impact of the inductance introduced by the metal protection gasket on the radio frequency performance. Of course, to reduce the risk of solder climbing, the thickness of the metal protection gasket should not be too thin. Specifically, the thickness of the metal protection gasket can be designed in combination with the actual product. The embodiments of the present invention do not limit this.

[0071] Exemplarily, Figure 3 is a top view structural schematic diagram of a radio frequency power amplifier provided by an embodiment of the present invention, Figure 4 is along Figure 3 the cross-sectional structural schematic diagram of the radio frequency power amplifier intercepted along AA' in Figure 3 and Figure 4 As shown, the radio frequency circuit module 2 and the printed circuit board 3 are located on the same side of the heat sink 1. Optionally, the radio frequency circuit module 2 includes a radio frequency chip 21 and a thin film circuit 22. The radio frequency chip 21 is electrically connected to the printed circuit board 3 through the thin film circuit 22. Figure 3 In Figure 3 the radio frequency power amplifier shown, the thin film circuit 22 acts as a part of the output matching network. The signal of the radio frequency chip 21 is transmitted to the printed circuit board 3 after passing through the thin film circuit 22. Adopting this structural design can simplify the wiring of the printed circuit board, reduce the area of the radio frequency power amplifier, improve the integration degree, and is also beneficial for block-by-block debugging.

[0072] It can be understood that for Figure 3 the radio frequency power amplifier shown, the above wire bonding debugging of the printed circuit board and the radio frequency circuit module specifically refers to wire bonding debugging of the printed circuit board and the thin film circuit.

[0073] Correspondingly, Figure 5 is Figure 3 the flow schematic diagram of the assembly method of the radio frequency power amplifier shown. Below, in combination with Figures 3 - 5 an exemplary description of the assembly method of the radio frequency power amplifier will be given. As Figure 5 shown, Figure 3 the radio frequency power amplifier in

[0074] S210, provide a heat sink.

[0075] Exemplarily, the material of the heat sink can be copper, and the specific dimensions can be designed according to the internal components of the radio frequency power amplifier.

[0076] S220. Fix the printed circuit board, radio frequency chip and thin film circuit on the heat sink.

[0077] Exemplarily, for the radio frequency chip and the thin film circuit, the radio frequency chip and the thin film circuit can be bonded to a metal sheet (such as a copper sheet / molybdenum copper sheet) with silver glue first, and then the metal sheet carrying the radio frequency chip and the thin film circuit can be soldered to the heat sink. For the printed circuit board, its back usually has a copper plating layer, and the printed circuit board can be soldered to the heat sink with solder.

[0078] S230. Electrically connect the radio frequency chip and the thin film circuit by using a wire bonding process.

[0079] Specifically, the electrical connection between the two is achieved by forming a gold wire between the corresponding pads of the radio frequency chip and the thin film circuit. Then, the thin film circuit and the printed circuit board can be electrically connected by using a wire bonding process. However, before that, wire bonding debugging needs to be carried out to determine the target wire bonding process parameters when the device performance test results meet the standards. For details, see S240 - S260.

[0080] S240. Solder a metal protection gasket on the first pad of the printed circuit board.

[0081] Exemplarily, the metal protection gasket can be a molybdenum copper sheet with a gold-plated surface. The metal protection gasket can be soldered to the first pad with solder. Its size can be the same as or slightly smaller than the corresponding first pad, and the thickness can be controlled below 1 mm.

[0082] S250. Form a bonding wire between the metal protection gasket and the thin film circuit and conduct device performance testing.

[0083] Specifically, a gold wire is formed between the corresponding pads on the metal protection gasket and the thin film circuit to electrically connect the printed circuit board and the thin film circuit. At this time, the gold wire is directly bonded to the metal protection gasket.

[0084] S260. When the test results do not meet the standards, adjust the wire bonding process parameters, and re-form the bonding wire between the metal protection gasket and the thin film circuit according to the adjusted wire bonding process parameters until the test results meet the standards to determine the target wire bonding process parameters.

[0085] Specifically, after each wire bonding process, device performance testing needs to be carried out. As long as the test results do not meet the standards, the wire bonding process parameters need to be adjusted, and the next wire bonding is carried out according to the adjusted wire bonding process parameters until the test results meet the standards. The wire bonding process parameters corresponding to when the test results meet the standards are determined as the target wire bonding process parameters.

[0086] It should be noted that during the wire bonding debugging process, the metal protection gasket can be replaced after several repeated wire bondings or when it is found that the performance of the metal protection gasket has deteriorated.

[0087] Further, after completing the wire bonding debugging and determining the target wire bonding process parameters, the metal protection gasket on the printed circuit board can be removed first, and then the printed circuit board and the thin film circuit can be electrically connected by using the wire bonding process according to the target wire bonding process parameters. For details, refer to S270 - S280.

[0088] S270. Remove the metal protection gasket.

[0089] S280. Electrically connect the printed circuit board and the thin film circuit by using the wire bonding process according to the target wire bonding process parameters.

[0090] Specifically, after removing the metal protection gasket, the first pad is exposed. According to the target wire bonding process parameters, a gold wire can be formed between the first pad of the printed circuit board and the corresponding pad of the thin film circuit (at this time, the gold wire is directly bonded to the first pad). Since the metal protection gasket well protects the first pad during the wire bonding debugging process, the bonding yield can be guaranteed, and the device performance can be ensured.

[0091] Finally, after completing all the electrical connection processes, hermetic capping can be performed to obtain the finished product of the radio frequency power amplifier.

[0092] The above - mentioned specific implementation manners do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub - combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An assembly method for a radio frequency power amplifier, the radio frequency power amplifier comprising a printed circuit board and a radio frequency circuit module, the printed circuit board being electrically connected to the radio frequency circuit module; Characterized in that, The assembly method includes: Performing wire bonding debugging on the printed circuit board and the radio frequency circuit module to determine target wire bonding process parameters; According to the target wire bonding process parameters, electrically connecting the printed circuit board and the radio frequency circuit module by wire bonding; Wherein, the steps of the wire bonding debugging include: Welding a metal protection gasket on the first pad of the printed circuit board; Performing at least one wire bonding between the metal protection gasket and the radio frequency circuit module.

2. The assembly method according to claim 1, Characterized in that, After determining the target wire bonding process parameters, the assembly method further includes: Removing the metal protection gasket.

3. The assembly method according to claim 1, Characterized in that, The first pad and the metal protection gasket are welded by solder.

4. The assembly method according to claim 1, Characterized in that, During the wire bonding debugging process, the assembly method further includes: Removing the existing metal protection gasket on the first pad and replacing it with a new metal protection gasket.

5. The assembly method according to claim 1, Characterized in that, One side of the metal protection gasket away from the first pad has a gold plating layer.

6. The assembly method according to claim 1, Characterized in that, The material of the metal protection gasket includes molybdenum copper alloy.

7. The assembly method according to claim 1, Characterized in that, The orthographic projection of the metal protection gasket on the printed circuit board does not exceed the area where the first pad is located.

8. The assembly method according to claim 1, Characterized in that, Along the direction perpendicular to the plane of the printed circuit board, the thickness of the metal protection gasket is less than or equal to 1 mm.

9. The assembly method according to claim 1, Characterized in that, Before performing wire bonding debugging on the printed circuit board and the radio frequency circuit module, the assembly method further includes: Providing a heat sink; Fixing the printed circuit board and the radio frequency circuit module on the heat sink.

10. The assembly method according to claim 9, Characterized in that, The radio frequency circuit module includes a radio frequency chip and a thin film circuit, the radio frequency chip is electrically connected to the printed circuit board through the thin film circuit; After fixing the printed circuit board and the radio frequency circuit module on the heat sink, the assembly method further includes: Electrically connecting the radio frequency chip and the thin film circuit by wire bonding; The wire bonding debugging of the printed circuit board and the radio frequency circuit module includes: Performing wire bonding debugging on the printed circuit board and the thin film circuit.

Images