Wave soldering equipment for integrated circuit board and process thereof

Abstract

The invention relates to the field of wave soldering, and discloses wave soldering equipment for an integrated circuit board and a process thereof, the wave soldering equipment for the integrated circuit board comprises a plurality of placing plates, the placing plates are slidably arranged in a mounting frame, a wave soldering machine is fixed on the mounting frame, and the placing plates are arranged on the mounting frame. Positioning plates are fixed to the two sides of the interior of the mounting frame correspondingly, stabilizing plates are fixed to the two sides of the interior of the mounting frame correspondingly, the placement plates are arranged between the positioning plates and the stabilizing plates in a sliding mode, a shielding plate is arranged above the placement plates in a sliding mode, and a plurality of fixing blocks are fixed to the bottom faces of the interiors of the placement plates; a fixing hole is formed in the top face of the fixing block, and a plurality of fixing columns are fixed to the bottom face of the shielding plate. According to the device, the fixing columns are inserted into the fixing holes, the baffle plate can be rapidly fixed to the upper portion of the containing plate through the iron fixing columns and the strong magnetic fixing blocks, and the convenience of fixing the position between the containing plate and the baffle plate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wave soldering, and specifically to a wave soldering device and process for integrated circuit boards. Background Art

[0002] Wave soldering is a soft soldering process in which molten soft solder (lead-tin alloy) is sprayed into a solder wave crest of a designed requirement by an electric pump or an electromagnetic pump, and a printed circuit board pre-loaded with components is passed through the solder wave crest to achieve mechanical and electrical connections between the solder ends or pins of the components and the pads of the printed circuit board.

[0003] According to the Chinese patent with the publication number CN216313536U, a wave soldering tinning auxiliary tooling for an integrated circuit board includes two feeding plates and two positioning rods. The bottom of each of the two feeding plates is fixedly connected with a placing plate. Rotating grooves are respectively formed inside the two feeding plates. Positioning shafts are respectively arranged inside the two rotating grooves. Rotating plates are movably sleeved on the side surfaces of the two positioning shafts. Side plates are respectively fixedly connected to one side of the two feeding plates away from the placing plates. Jacks are fixedly connected inside the two side plates. Threaded holes are respectively formed inside the two rotating plates. Adjusting bolts are respectively threadedly connected inside the two threaded holes. The adjusting bolts are connected with bottom rods through positioning rings. The jacks are connected with the bottom rods through springs. A pressing plate is fixedly connected to one end of the rotating plate away from the bottom rod.

[0004] In the above solution, by the mutual cooperation among the feeding plates, rotating grooves, rotating plates, side plates, jacks, adjusting bolts, positioning rings, bottom rods and springs, the integrated circuit board is fixed on the feeding plate, but it still has the following disadvantages: when fixing the integrated circuit board on the feeding plate, multiple structures and multiple steps need to be operated, increasing the complexity of fixing the integrated circuit board. Summary of the Invention

[0005] The purpose of the present invention is to provide a wave soldering device and process for integrated circuit boards to solve the problem that when fixing the integrated circuit board on the feeding plate, multiple structures and multiple steps need to be operated, increasing the complexity of fixing the integrated circuit board.

[0006] To achieve the above-mentioned invention purpose, the present invention adopts the following technical solutions: A wave soldering device for an integrated circuit board includes a plurality of placing plates. The plurality of placing plates are slidably arranged inside an installation frame. A wave soldering machine is fixed on the installation frame. Positioning plates are respectively fixed on both sides inside the installation frame. Stabilizing plates are respectively fixed on both sides inside the installation frame. The placing plates are slidably arranged between the positioning plates and the stabilizing plates. A shielding plate is slidably arranged above the placing plates. A plurality of fixing blocks are fixedly connected to the inner bottom surface of the placing plates. Fixing holes are formed on the top surfaces of the fixing blocks. A plurality of fixing columns are fixedly connected to the bottom surface of the shielding plate. The fixing columns are slidably inserted into the fixing holes.

[0007] Preferably, a plurality of rotating plates are rotatably arranged on the inner bottom surface of the placing plate, a plurality of threaded holes are formed in the inner bottom surface of the placing plate, a fixing bolt is rotatably inserted on the rotating plate, and the bottom end of the fixing bolt passes through the rotating plate and is in threaded connection with the threaded hole.

[0008] Preferably, a plurality of sliding holes are formed in the top surface of the shielding plate, a sliding rod is slidably inserted in the sliding holes, a pressing column is fixed at the bottom end of the sliding rod, a spring is wound around the surface of the sliding rod, one end of the spring is fixed on the bottom surface of the shielding plate, the other end of the spring is fixed to the top end of the pressing column, and a blocking plate is fixed at the top end of the sliding rod.

[0009] Preferably, a plurality of mounting openings are formed in the top surface of the positioning plate, a lower roller is rotatably arranged in the mounting openings, a plurality of fixing openings are formed in the top surface of the positioning plate, a motor is fixed on one side inside the fixing openings, a rotating hole is formed on one side inside the fixing openings, an output shaft of the motor passes through the rotating hole and is fixed to one side of the lower roller, and a plurality of rotating openings are formed in the top surface of the stabilizing plate, and an upper roller is rotatably arranged in the rotating openings.

[0010] Preferably, a storage groove is formed on one side of the mounting frame, a drawer is slidably arranged in the storage groove, bending grooves are respectively formed on both sides inside the storage groove, sliding columns are respectively fixed on both sides of the drawer, and the bending grooves and the sliding columns are slidably arranged.

[0011] Preferably, a support plate is fixed on the top surface of the mounting frame, two fixing grooves are formed on one side of the support plate, a positioning strip is fixed inside the fixing grooves, and a plurality of adsorption blocks are arranged on one side of the positioning strip.

[0012] Preferably, an anti-slip groove is formed on the top surface of the mounting frame.

[0013] Preferably, a mounting folding plate is fixed on the mounting frame, a ventilation opening is formed on the top surface of the mounting folding plate, a cold air blower is fixed on the top surface of the mounting folding plate, and an air outlet of the cold air blower is fixedly inserted into the ventilation opening.

[0014] The present invention also provides a wave soldering process for an integrated circuit board, and the specific steps are as follows:

[0015] Step 1: The staff takes out the tools from the drawer, then pastes the drawing on the positioning strip on the support plate by using the adsorption blocks, and then the staff compares the information on the drawing and inserts the electronic components on the integrated circuit board.

[0016] Step 2: The integrated circuit board with the electronic components inserted is placed on the placing plate, and then the rotating plate is rotated to press on the integrated circuit board.

[0017] Step 3: The staff installs the baffle on the placement plate, fixes the fixed column in the fixed block. At the same time, the sliding rod moving downward will drive the pressing column to press on the integrated circuit board. Finally, the placement plate with the integrated circuit board is placed between the positioning plate and the stabilizing plate.

[0018] Step 4: After the placement plate is placed between the positioning plate and the stabilizing plate, the output shaft of the rotating motor will drive the lower roller to rotate. The rotating lower roller drives the placement plate to slide into the inside of the wave soldering machine for wave soldering.

[0019] Step 5: The integrated circuit board that has completed wave soldering will continue to move to the lower part of the installation folding plate, and the cold air blower is used to blow cold air on the integrated circuit board to quickly reduce the temperature of the integrated circuit board.

[0020] Step 6: The staff takes out the cooled integrated circuit board for quality inspection.

[0021] Compared with the prior art, the wave soldering equipment and process for integrated circuit boards adopting the above technical solutions have the following beneficial effects:

[0022] 1. The staff places the integrated circuit board with inserted electronic components in the placement plate. Then, the staff rotates the fixing bolt upward, so that the rotating plate can slide upward and rotate on the surface of the fixing bolt, and then the rotating plate can be pressed on the top surface of the integrated circuit board. Then, the staff screws the fixing bolt downward, and a downward acting force can be applied to the rotating plate, so that the rotating plate presses on the top surface of the integrated circuit board, and the integrated circuit board can be fixed on the placement plate. Subsequently, the staff fixes the baffle above the placement plate and inserts the fixed column into the internal fixing hole. The iron fixed column and the strong magnetic fixed block can quickly fix the baffle above the placement plate, increasing the convenience of fixing the position between the placement plate and the baffle;

[0023] 2. When the baffle is pressed downward above the placement plate, the bottom end of the pressing column will contact the top surface of the integrated circuit board. As the baffle moves downward above the placement plate, it will drive the sliding rod to slide upward in the sliding hole and compress the spring. The compressed spring will apply a downward acting force to the pressing column, and then a downward pressing force can be applied to the integrated circuit board by the pressing column, thereby increasing the firmness of the position of the integrated circuit board on the placement plate;

[0024] 3. When the placement plate slides between the positioning plate and the stabilizing plate, the bottom surface of the placement plate will contact the surface of the lower roller. When the output shaft of the motor rotates, it will drive the lower roller to rotate synchronously inside the installation opening. When the lower roller rotates, it will push the placement plate to slide between the positioning plate and the stabilizing plate, and the sliding friction during the movement of the placement plate can be changed into rolling friction, reducing the friction force when the placement plate slides;

[0025] IV. When the staff inserts electronic components onto the integrated circuit board, they will first apply a force on the drawer towards the outside of the storage slot to take out the internal tools of the drawer. Before inserting the electronic components, the staff will paste the drawing on the positioning strip using the adsorption block, and the staff can compare the drawing for the installation of the electronic components. During the installation of the electronic components, when the sliding electronic components slide on the top surface of the installation frame, they will slide into the inside of the anti-slip groove, reducing the probability of loss of the electronic components;

[0026] V. After the placement board passing through the wave soldering machine undergoes wave soldering, the temperature of the integrated circuit board will increase rapidly. As the placement board continues to slide, it will drive the integrated circuit board to slide over the installation folding plate. At this time, the working cold air blower will blow cold air on the surface of the integrated circuit board, increasing the cooling speed of the integrated circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional schematic diagram of the embodiment.

[0028] Figure 2 It is an exploded three-dimensional schematic diagram of the embodiment.

[0029] Figure 3 It is an exploded schematic diagram of the positioning board and the placement board in the embodiment.

[0030] Figure 4 It is an exploded schematic diagram of the fixed column and the sliding rod in the embodiment.

[0031] Figure 5 It is an exploded schematic diagram of the installation folding plate and the ventilation opening in the embodiment.

[0032] Figure 6 For Figure 3 The enlarged schematic diagram of the partial structure at A in

[0033] Figure 7 For Figure 4 The enlarged schematic diagram of the partial structure at B in

[0034] In the figure: 1. Installation frame; 2. Wave soldering machine; 3. Positioning board; 4. Stabilizing board; 5. Placement board; 6. Baffle plate; 7. Fixed block; 8. Fixed hole; 9. Fixed column; 10. Pressing column; 11. Sliding hole; 12. Sliding rod; 13. Spring; 14. Blocking board; 15. Rotating plate; 16. Threaded hole; 17. Fixed bolt; 18. Installation opening; 19. Fixed opening; 20. Lower roller; 21. Motor; 22. Rotating hole; 23. Rotating opening; 24. Upper roller; 25. Storage slot; 26. Drawer; 27. Bending groove; 28. Sliding column; 29. Support plate; 30. Fixed groove; 31. Positioning strip; 32. Adsorption block; 33. Anti-slip groove; 34. Installation folding plate; 35. Ventilation opening; 36. Cold air blower. Detailed implementation mode

[0035] The following will combine with the attached drawings to make a detailed description of the preferred embodiments of the present invention.

[0036] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 7 shown, a wave soldering device for an integrated circuit board includes a plurality of placement plates 5. The plurality of placement plates 5 are slidably arranged inside an installation frame 1. A wave soldering machine 2 is fixed on the installation frame 1. Positioning plates 3 are respectively fixed on both sides inside the installation frame 1, and stabilizing plates 4 are respectively fixed on both sides inside the installation frame 1. The placement plates 5 are slidably arranged between the positioning plates 3 and the stabilizing plates 4. A shielding plate 6 is slidably arranged above the placement plates 5. A plurality of fixing blocks 7 are fixed on the inner bottom surface of the placement plates 5. The fixing blocks 7 are made of strong magnetic magnets. Fixing holes 8 are opened on the top surfaces of the fixing blocks 7. A plurality of fixing columns 9 are fixed on the bottom surface of the shielding plate 6. The fixing columns 9 are made of iron. The fixing columns 9 are slidably inserted into the fixing holes 8. A plurality of rotating plates 15 are rotatably arranged on the inner bottom surface of the placement plates 5. A plurality of threaded holes 16 are opened on the inner bottom surface of the placement plates 5. Fixing bolts 17 are rotatably inserted into the rotating plates 15. The bottom ends of the fixing bolts 17 pass through the rotating plates 15 and are threadedly connected with the threaded holes 16.

[0037] In use, the staff will place the integrated circuit board inserted with electronic components in the placement plate 5. Then, the staff rotates the fixing bolt 17 upward, so that the rotating plate 15 can slide upward and rotate on the surface of the fixing bolt 17, and the rotating plate 15 can be pressed against the top surface of the integrated circuit board. Then, the staff screws the fixing bolt 17 downward, and a downward acting force can be applied to the rotating plate 15, so that the rotating plate 15 presses against the top surface of the integrated circuit board, and the integrated circuit board can be fixed on the placement plate 5. Subsequently, the staff fixes the shielding plate 6 above the placement plate 5 and inserts the fixing column 9 into the fixing hole 8. By using the iron fixing column 9 and the strong magnetic fixing block 7, the shielding plate 6 can be quickly fixed above the placement plate 5, increasing the convenience of fixing the position between the placement plate 5 and the shielding plate 6.

[0038] As Figure 4 shown, a plurality of sliding holes 11 are opened on the top surface of the shielding plate 6. A sliding rod 12 is slidably inserted into the sliding holes 11. A pressing column 10 is fixed at the bottom end of the sliding rod 12. A spring 13 is wound around the surface of the sliding rod 12. One end of the spring 13 is fixed on the bottom surface of the shielding plate 6, and the other end of the spring 13 is fixed to the top end of the pressing column 10. A blocking plate 14 is fixed at the top end of the sliding rod 12.

[0039] In use, when the baffle 6 is pressed downward above the placement plate 5, the bottom end of the pressing column 10 will be driven into contact with the top surface of the integrated circuit board. As the baffle 6 moves downward above the placement plate 5, the sliding rod 12 will be driven to slide upward inside the sliding hole 11, compressing the spring 13. The compressed spring 13 will exert a downward force on the pressing column 10, and thus the pressing column 10 can be used to exert a downward extrusion force on the integrated circuit board, thereby increasing the firmness of the position of the integrated circuit board on the placement plate 5.

[0040] As Figure 6 shown, a plurality of mounting openings 18 are formed in the top surface of the positioning plate 3. Lower rollers 20 are rotatably arranged inside the mounting openings 18. A plurality of fixing openings 19 are formed in the top surface of the positioning plate 3. A motor 21 is fixed to one side inside the fixing openings 19. A rotating hole 22 is formed in one side inside the fixing openings 19. The output shaft of the motor 21 passes through the rotating hole 22 and is fixed to one side of the lower roller 20. A plurality of rotating openings 23 are formed in the top surface of the stabilizing plate 4. Upper rollers 24 are rotatably arranged inside the rotating openings 23.

[0041] In use, when the placement plate 5 slides between the positioning plate 3 and the stabilizing plate 4, the bottom surface of the placement plate 5 will come into contact with the surface of the lower roller 20. When the output shaft of the motor 21 rotates, the lower roller 20 will be driven to rotate synchronously inside the mounting opening 18. When the lower roller 20 rotates, it will push the placement plate 5 to slide between the positioning plate 3 and the stabilizing plate 4, and thus the sliding friction during the movement of the placement plate 5 can be changed into rolling friction, reducing the frictional force when the placement plate 5 slides.

[0042] As Figure 2 shown, a storage groove 25 is formed in one side of the mounting frame 1. A drawer 26 is slidably arranged inside the storage groove 25. Bent grooves 27 are respectively formed in both sides inside the storage groove 25. Sliding columns 28 are respectively fixed to both sides of the drawer 26. The bent grooves 27 and the sliding columns 28 are slidably arranged. A support plate 29 is fixed to the top surface of the mounting frame 1. Two fixing grooves 30 are formed in one side of the support plate 29. Positioning strips 31 are fixed inside the fixing grooves 30. A plurality of adsorption blocks 32 are arranged on one side of the positioning strips 31. Among them, the positioning strips 31 are made of iron, and the adsorption blocks 32 are magnet blocks. An anti-slip groove 33 is formed in the top surface of the mounting frame 1.

[0043] In use, when the staff inserts electronic components onto the integrated circuit board, the staff will first apply a force on the drawer 26 towards the outside of the storage groove 25, and thus the tools inside the drawer 26 can be taken out. Before inserting the electronic components, the staff will paste the drawing on the positioning strip 31 using the adsorption blocks 32. The staff can compare the drawing for the installation of the electronic components. During the installation of the electronic components, when the slipped electronic components slide on the top surface of the mounting frame 1, they will slide into the inside of the anti-slip groove 33, reducing the probability of loss of the electronic components.

[0044] As Figure 2 and Figure 5 shown, an installation folding plate 34 is fixed on the installation frame 1. A ventilation opening 35 is formed on the top surface of the installation folding plate 34. A cold air blower 36 is fixed on the top surface of the installation folding plate 34. The air outlet of the cold air blower 36 is fixedly inserted with the ventilation opening 35.

[0045] During use, after passing through the placement plate 5 in the wave soldering machine 2 and undergoing wave soldering, the temperature of the integrated circuit board will increase rapidly. As the placement plate 5 continues to slide, it will drive the integrated circuit board to slide past the installation folding plate 34. At this time, the working cold air blower 36 will blow cold air on the surface of the integrated circuit board, increasing the cooling speed of the integrated circuit board.

[0046] The present invention also provides a wave soldering process for integrated circuit boards, and the specific steps are as follows:

[0047] Step 1: The staff takes out the tool from the drawer 26, then attaches the drawing to the positioning strip 31 on the support plate 29 using the adsorption block 32, and then the staff inserts the electronic components into the integrated circuit board by comparing the information on the drawing.

[0048] Step 2: The integrated circuit board with the inserted electronic components is placed on the placement plate 5, and then the rotating plate 15 is rotated and pressed on the integrated circuit board.

[0049] Step 3: The staff installs the shielding plate 6 on the placement plate 5, fixes the fixed column 9 in the fixed block 7. At the same time, the downward moving sliding rod 12 will drive the pressing column 10 to press on the integrated circuit board. Finally, the placement plate 5 with the integrated circuit board is placed between the positioning plate 3 and the stabilizing plate 4.

[0050] Step 4: After the placement plate 5 is placed between the positioning plate 3 and the stabilizing plate 4, the output shaft of the rotating motor 21 will drive the lower roller 20 to rotate. The rotating lower roller 20 drives the placement plate 5 to slide into the interior of the wave soldering machine 2 for wave soldering.

[0051] Step 5: The integrated circuit board that has completed wave soldering will continue to move to the lower part of the installation folding plate 34, and the cold air blower 36 is used to blow cold air on the integrated circuit board to quickly reduce the temperature of the integrated circuit board.

[0052] Step 6: The staff takes out the cooled integrated circuit board for quality inspection.

[0053] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present invention.

Claims

1. A wave soldering device for integrated circuit boards, comprising a plurality of placement plates (5), wherein the plurality of placement plates (5) are slidably arranged inside a mounting frame (1), characterized in that: A wave soldering machine (2) is fixed on the installation frame (1), positioning plates (3) are fixed on both sides of the interior of the installation frame (1), stabilizing plates (4) are fixed on both sides of the interior of the installation frame (1), the placement plate (5) is slidably arranged between the positioning plate (3) and the stabilizing plate (4), a shielding plate (6) is slidably arranged above the placement plate (5), a plurality of fixing blocks (7) are fixed on the inner bottom surface of the placement plate (5), a fixing hole (8) is provided on the top surface of the fixing block (7), a plurality of fixing columns (9) are fixed on the bottom surface of the shielding plate (6), and the fixing columns (9) are slidably inserted into the fixing holes (8).

2. The wave soldering equipment for integrated circuit boards according to claim 1, characterized in that: A plurality of rotating plates (15) are rotatably arranged on the inner bottom surface of the placement plate (5), a plurality of threaded holes (16) are opened on the inner bottom surface of the placement plate (5), and fixing bolts (17) are rotatably inserted on the rotating plates (15), and the bottom ends of the fixing bolts (17) pass through the rotating plates (15) and are threadedly connected to the threaded holes (16).

3. The wave soldering equipment for integrated circuit boards according to claim 1, characterized in that: The top surface of the shielding plate (6) is provided with a plurality of sliding holes (11), a sliding rod (12) is slidably inserted inside the sliding hole (11), a pressing column (10) is fixed to the bottom end of the sliding rod (12), a spring (13) is wound on the surface of the sliding rod (12), one end of the spring (13) is fixed to the bottom surface of the shielding plate (6), and the other end of the spring (13) is fixed to the top end of the pressing column (10), and a blocking plate (14) is fixed to the top end of the sliding rod (12).

4. The wave soldering equipment for integrated circuit boards according to claim 1, characterized in that: The top surface of the positioning plate (3) is provided with a plurality of mounting openings (18), a lower roller (20) is rotatably arranged inside the mounting openings (18), the top surface of the positioning plate (3) is provided with a plurality of fixing openings (19), a motor (21) is fixed to one side of the inside of the fixing openings (19), a rotating hole (22) is provided on one side of the inside of the fixing openings (19), an output shaft of the motor (21) passes through the rotating hole (22) and is fixed to one side of the lower roller (20), and the top surface of the stabilizing plate (4) is provided with a plurality of rotating openings (23), an upper roller (24) is rotatably arranged inside the rotating openings (23).

5. The wave soldering equipment for integrated circuit boards according to claim 1, characterized in that: A storage groove (25) is provided on one side of the installation frame (1), a drawer (26) is slidably arranged inside the storage groove (25), bending grooves (27) are respectively provided on both sides of the storage groove (25), sliding columns (28) are respectively fixed on both sides of the drawer (26), and the bending groove (27) and the sliding column (28) are slidably arranged.

6. The wave soldering equipment for integrated circuit boards according to claim 1, characterized in that: A support plate (29) is fixed on the top surface of the installation frame (1), two fixing grooves (30) are provided on one side of the support plate (29), a positioning strip (31) is fixed inside the fixing groove (30), and a plurality of adsorption blocks (32) are provided on one side of the positioning strip (31).

7. The wave soldering equipment for integrated circuit boards according to claim 1, characterized in that: The top surface of the installation frame (1) is provided with an anti-slip groove (33).

8. The wave soldering equipment for integrated circuit boards according to claim 1, characterized in that: A mounting folding plate (34) is fixed on the mounting frame (1), a vent (35) is provided on the top surface of the mounting folding plate (34), a cooling fan (36) is fixed on the top surface of the mounting folding plate (34), and an air outlet of the cooling fan (36) is fixedly inserted into the vent (35).

9. The specific steps of wave soldering process for integrated circuit boards are as follows: Step 1: The staff takes out the tool from the drawer (26), and then uses the adsorption block (32) to stick the drawing on the positioning strip (31) on the support plate (29). Then the staff compares the information on the drawing and inserts the electronic component on the integrated circuit board. Step 2: The integrated circuit board with the electronic components inserted is placed on the placement board (5), and then the rotating board (15) is rotated to press on the integrated circuit board. Step 3: The staff installs the shielding plate (6) on the placement plate (5), fixes the fixing column (9) in the fixing block (7), and at the same time, the downward sliding rod (12) drives the pressing column (10) to press on the integrated circuit board, and finally puts the placement plate (5) with the integrated circuit board between the positioning plate (3) and the stabilizing plate (4). Step 4: After the placement plate (5) is placed between the positioning plate (3) and the stabilizing plate (4), the rotating output shaft of the motor (21) drives the lower roller (20) to rotate, and the rotating lower roller (20) drives the placement plate (5) to slide into the interior of the wave soldering machine (2) for wave soldering. Step 5: The integrated circuit board that has completed wave soldering will continue to move to the bottom of the mounting folding plate (34), and the cold air blower (36) will blow cold air on the integrated circuit board to quickly reduce the temperature of the integrated circuit board. Step 6: The staff takes out the cooled integrated circuit board for quality inspection.

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