Immersed radiator

Abstract

The invention discloses an immersed radiator, which is used for being thermally coupled to at least one heat source and comprises a heat conduction block and a boiling promoting layer. The heat conduction block comprises a base part and a plurality of fin parts. The base part is provided with a heating surface and a radiating surface which are opposite to each other; the heating surface is thermally coupled to at least one heat source. The fin parts protrude out of the radiating surface of the base part. The boiling promoting layer is arranged on at least part of the heat dissipation surface of the base part and at least part of the fin parts. And after the boiling promoting layer receives heat conducted by the heat dissipation surface and the fin part, the working fluid is heated and evaporated through the boiling promoting layer, and a bubble generation position is provided, so that the working fluid is nucleated according to the bubble generation position during vaporization.

Description

Technical Field

[0001] The invention relates to an immersion radiator, in particular to an immersion radiator with a boiling promotion layer. Background Art

[0002] With the rapid development of technology, the computing performance of various electronic components has also increased significantly, and a large amount of heat is also generated. In order to ensure that electronic components are not damaged by high heat, heat dissipation devices need to be installed on electronic components to dissipate excess heat.

[0003] Generally speaking, electronic components are often cooled through a two-phase immersion cooling system to maintain the performance and service life of the electronic components. The so-called two-phase immersion cooling system refers to a cooling system in which a heat sink thermally coupled to the electronic components is immersed in a liquid working fluid, and the liquid working fluid contacts the heat sink and undergoes a phase change due to heat, so that the liquid working fluid evaporates into a gaseous working fluid to generate bubbles and take away the heat generated by the electronic components. However, the efficiency of the working fluid in generating bubbles in the current immersion cooling system is still insufficient. In other words, the current immersion cooling system's cooling efficiency for electronic components cannot meet the needs of users. Therefore, how to improve the cooling efficiency of the immersion cooling system for electronic components is one of the problems that researchers should solve. Summary of the invention

[0004] The present invention provides an immersion heat sink to improve the heat dissipation efficiency of an immersion heat dissipation system for electronic components.

[0005] An immersion heat sink disclosed in an embodiment of the present invention is used for thermally coupling to at least one heat source, and the immersion heat sink comprises:

[0006] A heat conducting block, comprising a base and a plurality of fin portions, wherein the base has a heat receiving surface and a heat dissipation surface opposite to each other, the heat receiving surface is used for thermally coupling to the at least one heat source, and the fin portions protrude from the heat dissipation surface of the base; and

[0007] A boiling promotion layer is arranged on at least a portion of the heat dissipation surface of the base and at least a portion of the fin portions. After the boiling promotion layer receives the heat conducted by the heat dissipation surface and the fin portions, the working fluid is heated and evaporated through the boiling promotion layer and a bubble generation position is provided, so that the working fluid is nucleated according to the bubble generation position when it is vaporized.

[0008] In the above-mentioned immersed radiator, the boiling promotion layer comprises at least one first metal segment and at least one second metal segment, and the specific surface area of ​​the at least one first metal segment is greater than the specific surface area of ​​the at least one second metal segment.

[0009] The above-mentioned immersion heat sink, wherein the heat-receiving surface of the base is divided into at least one main heat zone and at least one secondary heat zone, the at least one main heat zone of the at least one heat-receiving surface is used for thermally coupling to the heat source, and the at least one first metal segment and the at least one second metal segment respectively correspond to the at least one main heat zone and the at least one secondary heat zone.

[0010] The above-mentioned immersion heat sink, wherein the numbers of the at least one main heat zone, the at least one secondary heat zone, the at least one first metal segment and the at least one second metal segment are all plural, the main heat zones and the secondary heat zones are arranged alternately, and the first metal segments and the second metal segments respectively correspond to the main heat zones and the secondary heat zones.

[0011] The above-mentioned immersion heat sink, wherein the base of the heat conduction block is a metal plate, a heat pipe, a vapor chamber or a combination thereof.

[0012] The above-mentioned immersion heat sink, wherein the combination manner of the base of the heat conduction block and the fin portions is integral molding, sintering, welding or a combination thereof.

[0013] The above-mentioned immersion heat sink, wherein the boiling promotion layer is a powder sintered structure, a polygonal deposition structure, an etched microstructure or a combination thereof.

[0014] The above-mentioned immersion heat sink, wherein the manufacturing methods of the at least one first metal segment and the at least one second metal segment are sintering, etching, vapor deposition, electrochemcial deposition or a combination thereof.

[0015] The above-mentioned immersion heat sink, wherein the materials of the at least one first metal segment and the at least one second metal segment are selected from the group consisting of pure copper, copper alloy, pure nickel, nickel alloy and combinations thereof.

[0016] The above-mentioned immersion heat sink, wherein the at least one first metal segment includes at least one side portion extending from the bottom of the fin portion to the top of the fin portion, and the thickness of the at least one side portion increases from the bottom to the top.

[0017] The above-mentioned immersion heat sink, wherein the widths of the fin portions decrease from the bottom to the top.

[0018] The above-mentioned immersion heat sink, wherein the boiling promotion layer is disposed on the entire heat dissipation surface of the base and the entire fin portions.

[0019] An immersion heat sink disclosed in another embodiment of the present invention is used for thermally coupling to at least one heat source. The immersion heat sink includes:

[0020] A heat conduction block including a base having an opposite heat-receiving surface and a heat dissipation surface, the heat-receiving surface being used for thermally coupling to the at least one heat source; and

[0021] A boiling promotion layer is disposed on at least a part of the heat dissipation surface of the base. After the boiling promotion layer receives the heat conducted by the heat dissipation surface, when the working fluid is heated and evaporated through the boiling promotion layer, a bubble generation position is provided, so that when the working fluid vaporizes, nucleation occurs according to the bubble generation position.

[0022] The above-mentioned immersion type radiator, wherein the boiling promotion layer includes at least one first metal segment and at least one second metal segment, and the specific surface area of the at least one first metal segment is larger than the specific surface area of the at least one second metal segment.

[0023] According to the immersion type radiator of the above embodiment, since the immersion type radiator is provided with a boiling promotion layer, when the immersion type radiator is immersed in the working fluid and thermally coupled to the heat source, the contact area between these fin portions of the heat conduction block and the working fluid can be increased through the boiling promotion layer, and a position for bubble generation is provided, so that the working fluid can more efficiently generate a phase change to take away heat, so that the liquid working fluid is heated and evaporated into a gaseous working fluid, and bubbles are more efficiently generated and heat is taken away, thereby improving the heat dissipation efficiency.

[0024] In addition, since the specific surface area of the first metal segment corresponding to the main heat area in the boiling promotion layer is larger than the specific surface area of the second metal segment corresponding to the secondary heat area, the contact area between these fin portions located in the main heat area and the working fluid is further increased, and the bubble generation density per unit area of the main heat area is increased, so the heat dissipation efficiency can be further improved.

[0025] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention. Description of the Drawings

[0026] Figure 1 It is a three-dimensional schematic diagram of the immersion type radiator according to the first embodiment of the present invention.

[0027] Figure 2 It is Figure 1 The cross-sectional schematic diagram of the immersion type radiator.

[0028] Figure 3 It is Figure 1 The microscopic structure diagram of the boiling promotion layer.

[0029] Figure 4 It is Figure 1 Another microscopic structure diagram of the boiling promotion layer.

[0030] Figure 5 It is Figure 1 Another microscopic structure diagram of the boiling promotion layer.

[0031] Figure 6Schematic cross-sectional view of the immersion heat sink according to the second embodiment of the present invention.

[0032] Figure 7 Schematic perspective view of the immersion heat sink according to the third embodiment of the present invention.

[0033] Among them, reference numerals:

[0034] 10, 10A, 10B: Immersion heat sink

[0035] 20, 20B: Heat conducting block

[0036] 21, 21B: Base

[0037] 211, 211A: Heat receiving surface

[0038] 2111: Main heat area

[0039] 2112: Secondary heat area

[0040] 212, 212B: Heat dissipation surface

[0041] 22: Fin portion

[0042] 30, 30A, 30B: Boiling promotion layer

[0043] 31, 31B: First metal segment

[0044] 311: Side portion

[0045] 32, 32B: Second metal segment

[0046] H: Heat source

[0047] L: Working fluid Detailed implementation manners

[0048] Please refer to Figure 1 and Figure 2 . Figure 1 Schematic perspective view of the immersion heat sink according to the first embodiment of the present invention. Figure 2 is Figure 1 Schematic cross-sectional view of the immersion heat sink of

[0049] The immersion heat sink 10 of the present embodiment is used to be thermally coupled to a heat source H, and is immersed in a working fluid L, for example. The working fluid L is, for example, a non-conductive fluorinated liquid or other electronic engineering fluid. The immersion heat sink 10 includes a heat conductive block 20 and a boiling promotion layer 30. The heat conductive block 20 includes a base 21 and a plurality of fin portions 22. The base 21 is, for example, a metal plate, a temperature equalizing plate, a heat pipe or a combination thereof, and has a heating surface 211 and a heat dissipation surface 212 opposite to each other. The heating surface 211 is divided into a main heat zone 2111 and a plurality of secondary heat zones 2112. The main heat zone 2111 and these secondary heat zones 2112 are arranged alternately, and the main heat zone 2111 is used to be thermally coupled to the heat source H. The so-called thermal coupling refers to thermal contact or connection through other heat-conducting media.

[0050] The fins 22 and the base 21 are combined by, for example, integral molding, sintering, welding or a combination thereof, and the fins 22 protrude from the heat dissipation surface 212 of the base 21. In other words, the heat conducting block 20 is, for example, a temperature averaging plate, a three-dimensional temperature averaging plate or a combination of a temperature averaging plate and fins. The width of the fins 22 decreases from the bottom to the top.

[0051] The boiling promoting layer 30 is, for example, a powder sintering structure, a polygonal deposition structure, an etched microstructure or a combination thereof, and is disposed on a portion of the heat dissipation surface 212 and all of the fins 22. The boiling promoting layer 30 is used for the working fluid L to receive heat conducted by the heat dissipation surface 212 and the fins 22, so that the working fluid undergoes a phase change, so that the liquid working fluid evaporates into a gaseous working fluid under the heat to generate bubbles and take away the heat. The boiling promoting layer 30 includes a first metal segment 31 and a plurality of second metal segments 32. The material of the first metal segment 31 and the second metal segments 32 is, for example, selected from the group consisting of pure copper, copper alloy, pure nickel, nickel alloy and a combination thereof, and the manufacturing method of the first metal segment 31 and the second metal segments 32 is, for example, sintering, etching, vapor deposition, electrochemical deposition or a combination thereof.

[0052] For example, please refer to Figure 3 . Figure 3 for Figure 1 Figure 3 is a microstructure diagram of the boiling promotion layer. In the present embodiment, the first metal segment 31 and the second metal segments 32 of the boiling promotion layer 30 are formed, for example, by sintering powder. Multiple pores are formed by powder accumulation. Sintering can close some of the pores in the powder to form a continuous structure, thereby increasing the surface area of ​​the first metal segment 31 and the second metal segments 32 in contact with the working fluid L to improve the heat dissipation efficiency. In addition, the pores on the surface of the first metal segment 31 and the second metal segments 32 are conducive to providing a location for bubble nucleation, that is, a bubble generation location P1, to further improve the heat dissipation efficiency.

[0053] Please refer to Figure 4 .Figure 4 Another microstructural diagram of the boiling promotion layer for Figure 1 In this embodiment, the first metal segments 31 and the second metal segments 32 of the boiling promotion layer 30 can also be formed, for example, by electrochemical deposition. By adjusting the solution and controlling the deposition conditions, polygonal deposits are formed on the metal surface. In this way, the protruding structures of the polygonal deposits can increase the surface area of contact between the first metal segments 31 and the second metal segments 32 and the working fluid L, so as to improve the heat dissipation efficiency. In addition, the gaps between the polygonal deposits in the first metal segments 31 and the second metal segments 32 are conducive to providing positions for bubble nucleation, that is, the bubble generation position P2, to further improve the heat dissipation efficiency.

[0054] Please refer temporarily to Figure 5 . Figure 5 Another microstructural diagram of the boiling promotion layer for Figure 1 In this embodiment, the first metal segments 31 and the second metal segments 32 of the boiling promotion layer 30 can also be formed, for example, by etching. By etching, wrinkles and etch holes can be formed on the metal surface to increase the surface area of contact between the first metal segments 31 and the second metal segments 32 and the working fluid L, so as to improve the heat dissipation efficiency. In addition, the etch holes in the first metal segments 31 and the second metal segments 32 are conducive to providing positions for bubble nucleation, that is, the bubble generation position P3, to further improve the heat dissipation efficiency.

[0055] Please refer again to Figure 1 and Figure 2 . The first metal segments 31 and the second metal segments 32 respectively correspond to the main heat zone 2111 and the secondary heat zones 2112. The specific surface area of the first metal segments 31 is greater than the specific surface area of each of the second metal segments 32. The so-called specific surface area refers to the total surface area per unit mass of a solid. For example, the specific surface area of the first metal segments 31 can be made greater than the specific surface area of each of the second metal segments 32 by the number of holes in the first metal segments 31 being greater than the number of holes in each of the second metal segments 32, but this is not limited thereto. In other embodiments, the specific surface area of the first metal segments can also be made greater than the specific surface area of each of the second metal segments 32 by other means. The first metal segments 31 include a plurality of side portions 311 extending from the bottom of the fin portion 22 to the top of the fin portion 22. The thickness of these side portions 311 increases from the bottom to the top.

[0056] It should be noted that the specific surface area is not the same as the porosity. The so-called porosity refers to the ratio of the volume of pores in a material to the total volume of the material. The importance of porosity for bubble generation is lower than the importance of specific surface area for bubble generation.

[0057] In this embodiment, the advantage of providing the boiling promotion layer 30 on the immersion heat sink 10 is that when the immersion heat sink 10 is immersed in the working fluid L and thermally coupled to the heat source H, the contact area between these fin portions 22 of the heat conduction block 20 and the working fluid L can be increased through the boiling promotion layer 30, enabling the working fluid to more efficiently undergo a phase change, so that the liquid working fluid is heated and evaporated into a gaseous working fluid to more efficiently generate bubbles and carry away heat, thereby improving the heat dissipation efficiency.

[0058] In addition, since the specific surface area of the first metal segment 31 corresponding to the main heat region 2111 in the boiling promotion layer 30 is larger than the specific surface area of the second metal segment 32 corresponding to the secondary heat region 2112, to further increase the contact area between these fin portions 22 located in the main heat region 2111 and the working fluid L, and increase the bubble generation density per unit area in the main heat region 2111, the heat dissipation efficiency can be further improved.

[0059] In this embodiment, the boiling promotion layer 30 is provided on a part of the heat dissipation surface 212 and all of these fin portions 22, but is not limited thereto. In other embodiments, the boiling promotion layer may also be provided on the entire heat dissipation surface and a part of these fin portions.

[0060] In the first embodiment, the number of the main heat regions 2111 and the number of the first metal segments 31 are single, but are not limited thereto. In other embodiments, please refer to Figure 6 。 Figure 6 FIG. is a cross-sectional schematic view of an immersion heat sink according to the second embodiment of the present invention. The immersion heat sink 10A of this embodiment is similar to the immersion heat sink 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the same parts will not be repeated.

[0061] The heat receiving surface 211A of the substrate of the immersion heat sink 10A of this embodiment can also be divided into a plurality of main heat regions 2111 and a plurality of secondary heat regions 2112. These main heat regions 2111 and these secondary heat regions 2112 are arranged alternately, and these main heat regions 2111 are used to thermally couple to a plurality of heat sources H. The sizes of these heat sources H are, for example, the same, but are not limited thereto. In other embodiments, the sizes of these heat sources may also be different. The boiling promotion layer 30A may also include a plurality of first metal segments 31 with a larger specific surface area and a plurality of second metal segments 32 with a smaller specific surface area, and these first metal segments 31 and these second metal segments 32 respectively correspond to these main heat regions 2111 and these secondary heat regions 2112.

[0062] In the first embodiment, the heat conduction block 20 of the immersion heat sink 10 includes fin portions 22, but is not limited thereto. In other embodiments, please refer to Figure 7 。 Figure 7The immersion radiator 10B of this embodiment is similar to the immersion radiator 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated.

[0063] In the immersion heat sink 10B of the present embodiment, the heat conducting block 20B does not include a fin portion. The porous metal layer 30B is disposed on the heat dissipation surface 212B of the base 21B of the heat conducting block 20B. The porous metal layer 30B includes a first metal segment 31B and a plurality of second metal segments 32B. The first metal segment 31B and the second metal segments 32B correspond to the primary heat zone 2111 and the secondary heat zones 2112, respectively, and the specific surface area of ​​the first metal segment 31B is greater than the specific surface area of ​​each second metal segment 32B.

[0064] In this embodiment, the boiling promotion layer 30B is disposed on a portion of the heat dissipation surface 212B, but the present invention is not limited thereto. In other embodiments, the boiling promotion layer may also be disposed on the entire heat dissipation surface.

[0065] According to the immersion radiator of the above embodiment, since the immersion radiator is provided with a boiling promotion layer, when the immersion radiator is immersed in the working fluid and thermally coupled to the heat source, the contact area between the fin portions of the heat conductive block and the working fluid can be increased through the boiling promotion layer, so that the working fluid can more efficiently produce a phase change to remove heat, so that the liquid working fluid is heated and evaporated into a gaseous working fluid to more efficiently generate bubbles and remove heat, thereby improving the heat dissipation efficiency.

[0066] In addition, since the specific surface area of ​​the first metal segment corresponding to the main hot zone in the boiling promotion layer is greater than the specific surface area of ​​the second metal segment corresponding to the secondary hot zone, the contact area between the fin portions located in the main hot zone and the working fluid is further increased, thereby increasing the bubble generation density per unit area of ​​the main hot zone, thereby further improving the heat dissipation efficiency.

[0067] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any relevant technician familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be based on the scope of the patent application attached to this specification.

Claims

1. An immersion heat sink for thermally coupling to at least one heat source, characterized in that: The immersion heat sink contains: A heat conducting block, comprising a base and a plurality of fin portions, wherein the base has a heat receiving surface and a heat dissipation surface opposite to each other, the heat receiving surface is used for thermally coupling to the at least one heat source, and the fin portions protrude from the heat dissipation surface of the base; and A boiling promotion layer is arranged on at least a portion of the heat dissipation surface of the base and at least a portion of the fin portions. After the boiling promotion layer receives the heat conducted by the heat dissipation surface and the fin portions, the working fluid is heated and evaporated through the boiling promotion layer and a bubble generation position is provided, so that the working fluid is nucleated according to the bubble generation position when it is vaporized.

2. The immersion radiator according to claim 1, characterized in that: The boiling promotion layer comprises at least one first metal segment and at least one second metal segment, and the specific surface area of ​​the at least one first metal segment is greater than the specific surface area of ​​the at least one second metal segment.

3. The immersion radiator according to claim 2, characterized in that: The heating surface of the base is divided into at least one main heating zone and at least one secondary heating zone. The at least one main heating zone of the at least one heating surface is used for thermal coupling to the heat source. The at least one first metal segment and the at least one second metal segment correspond to the at least one main heating zone and the at least one secondary heating zone respectively.

4. The immersion radiator according to claim 3, characterized in that: The at least one main hot zone, the at least one secondary hot zone, the at least one first metal segment and the at least one second metal segment are all multiple in number. The main hot zones and the secondary hot zones are alternately arranged. The first metal segments and the second metal segments correspond to the main hot zones and the secondary hot zones respectively.

5. The immersion radiator according to claim 1, characterized in that: The base of the heat conducting block is a metal plate, a temperature averaging plate, a heat pipe or a combination thereof.

6. The immersion radiator according to claim 1, characterized in that: The base of the heat conducting block and the fins are combined by integral molding, sintering, welding or a combination thereof.

7. The immersion radiator according to claim 1, characterized in that: The boiling promotion layer is a powder sintering structure, a polygonal deposition structure, an etched microstructure or a combination thereof.

8. The immersion radiator according to claim 2, characterized in that: The at least one first metal segment and the at least one second metal segment are manufactured by sintering, etching, vapor deposition, electrochemical deposition or a combination thereof.

9. The immersion radiator according to claim 2, characterized in that: The material of the at least one first metal segment and the at least one second metal segment is selected from the group consisting of pure copper, copper alloy, pure nickel, nickel alloy and combinations thereof.

10. The immersion radiator according to claim 2, characterized in that: The at least one first metal segment includes at least one side portion extending from the bottom of the fin portion to the top of the fin portion, and the thickness of the at least one side portion increases from the bottom toward the top.

11. The immersion radiator according to claim 1, characterized in that: The widths of the fin portions decrease from the bottom to the top.

12. The immersion radiator according to claim 1, characterized in that: The boiling promotion layer is arranged on the entire heat dissipation surface of the base and the entire fin parts.

13. An immersion heat sink for thermally coupling to at least one heat source, characterized in that: The immersion heat sink contains: A heat-conducting block, comprising a base, the base having a heat receiving surface and a heat dissipation surface opposite to each other, the heat receiving surface being used for thermally coupling to the at least one heat source; and A boiling promotion layer is arranged on at least a portion of the heat dissipation surface of the base. After the boiling promotion layer receives the heat conducted by the heat dissipation surface, the working fluid is heated and evaporated through the boiling promotion layer and a bubble generation position is provided, so that the working fluid is nucleated according to the bubble generation position when it vaporizes.

14. The immersion radiator according to claim 13, characterized in that The boiling promotion layer comprises at least one first metal segment and at least one second metal segment, and the specific surface area of ​​the at least one first metal segment is greater than the specific surface area of ​​the at least one second metal segment.

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