Automatic chip mounter for device
By setting up support plates, cylinders, buffer components and heating wires in the patch machine, the problem of deformation of thin PCB pads during mounting is solved, and better contact state and solder joint quality are achieved.
Patent Information
- Application Number
- CN202510371181.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2045-03-27
AI Technical Summary
When existing chip machines attach devices to thinner PCB pads, they lack sufficient support, resulting in deformation of the pads, affecting the contact state between the device and the pads, and thus reducing the mechanical strength and electrical connection stability of the dummy solder and solder joints.
An automatic device patch machine is designed. By setting up a support plate and cylinder on the frame, the solder pad is lifted to an appropriate height, and the buffer components and dampers consume the down pressure of the suction nozzle to avoid deformation of the solder pad. At the same time, the solder paste is preheated by the electric heating wire to improve the reliability of the solder joint.
It effectively avoids the deformation of the pad due to excessive downward pressure of the suction nozzle during the mounting process, ensures the contact state between the device and the pad, reduces the occurrence of dummy welding, and improves the mechanical strength of the solder joints and the stability of the electrical connection.
Smart Images

Figure CN120050924A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of device chip mounting, and particularly to an automatic device mounter. Background Art
[0002] With the development of electronic products towards miniaturization and light weight, the traditional through-hole insertion technology can no longer meet the assembly requirements of high density and high precision. Therefore, the surface mount technology (SMT) has emerged. The SMT technology realizes soldering by directly mounting components on the surface of PCB pads through processes such as reflow soldering, which greatly simplifies the production process, improves production efficiency, and reduces production costs. The mounter is the core equipment of the SMT production line;
[0003] The development of SMT technology is inseparable from the progress of soldering technology. The research and development of new soldering materials such as lead-free solder paste and the continuous improvement of soldering processes such as reflow soldering and wave soldering provide guarantees for the reliable connection between components and PCBs in SMT technology, ensuring the quality and stability of products;
[0004] When the existing mounter mounts a device on a PCB pad with a relatively thin thickness, due to the lack of sufficient support at the bottom of the PCB pad and the poor rigidity of the relatively thin PCB pad, the PCB pad is prone to concentrated local stress during the mounting process, resulting in deformation of the PCB pad. The deformation of the PCB pad will change the contact state between the device and the pad, making the gap between the two uneven. As a result, during the reflow soldering process, the solder paste cannot fully fill the gap after melting, forming a virtual solder joint, reducing the mechanical strength of the solder joint and the electrical connection stability;
[0005] In addition, during the long-term use of the mounter, the accuracy of the Z-axis (vertical direction) movement mechanism of the mounter will decline, resulting in excessive downward pressure of the suction nozzle when mounting the device, causing deformation of the PCB pad. At this time, the problem of insufficient support at the bottom of the PCB pad on the mounter is more prominent. Summary of the Invention
[0006] The purpose of the present invention is to provide an automatic device mounter to solve the problems mentioned in the above process.
[0007] To achieve the above object, the present invention provides the following technical solution: An automatic device mounter, comprising a frame, on the upper end of the frame is provided a mounting module, on the frame is provided a horizontal plate, on the upper surface of the horizontal plate are symmetrically provided side plates, at the ends of the side plates away from the horizontal plate are symmetrically provided limiting tracks, at the ends of the limiting tracks away from the side plates are provided baffles, on one of the baffles is provided a lifting component, above the lifting component is provided a drying component, between the two side plates is provided a positioning component, the positioning component includes a support plate, at the four corners of the support plate are provided pulleys, the pulleys are slidably arranged on the limiting tracks, and the positioning component is used to carry and position the pad position;
[0008] At the lower end of the positioning component is provided a buffer component, the buffer component is arranged at the regional position between the positioning component and the horizontal plate, and the buffer component is used to buffer the rigid stress received by the pad. At the lower end of the frame is provided a cylinder, and the end of the cylinder away from the frame penetrates the horizontal plate and is connected to the buffer component;
[0009] The buffer component includes an air cylinder and a piston plate slidably arranged in the air cylinder. At the end of the piston plate away from the horizontal plate is provided a piston rod, at the end of the piston rod away from the piston plate is provided a guide plate, outside the guide plate is sleeved a rotating cylinder, and symmetrically arranged on the inner side of the rotating cylinder are guide grooves. The end of the rotating cylinder away from the air cylinder is connected to the positioning component;
[0010] Arrayed on the outer side of the piston rod are support rods, arrayed on the end face of the air cylinder away from the horizontal plate are sliding grooves, the support rods can slide in the sliding grooves, at the end of the sliding groove away from the support rod is provided a damper, at the end of the damper close to the support rod is provided a slider, and rotatably arranged on the slider is a sliding roller.
[0011] As a preferred scheme of the automatic device mounter of the present invention, wherein: longitudinally laid in the support plate is a heating wire, in the support plate is provided an air cavity, rotatably arranged on the lower surface of the support plate is a driving plate, hinged at both ends of the driving plate are connecting rods, and hinged at the ends of the connecting rods away from the driving plate are positioning plates.
[0012] As a preferred scheme of the automatic device mounter of the present invention, wherein: symmetrically arranged on the upper surface of the positioning plate are mounting blocks, and rotatably arranged on the mounting blocks are right-angle frames.
[0013] As a preferred scheme of the automatic device mounter of the present invention, wherein: the lifting component includes a lifting box, and slidably arranged in the lifting box is a lifting plate.
[0014] As a preferred scheme of the automatic device mounter of the present invention, wherein: in the lifting box is provided a lifting groove, in the lifting groove is provided an air outlet groove, symmetrically arranged in the lifting groove are magnetic blocks one, and slidably arranged in the lifting groove is a horn-shaped plate one.
[0015] As a preferred solution of the automatic component mounter of the device described in the present invention, wherein: a water tank is provided on the lifting box, a water baffle is provided in the water tank, an exhaust box is provided on the water tank, and exhaust grooves are arranged in an array on the exhaust box.
[0016] As a preferred solution of the automatic component mounter of the device described in the present invention, wherein: the drying component includes a drying box, and a drying plate is slidably arranged in the drying box.
[0017] As a preferred solution of the automatic component mounter of the device described in the present invention, wherein: one end of the drying box away from the support plate is provided with a first drying groove, a second horn-shaped plate is slidably arranged in the first drying groove, and a first opening and closing groove is provided on the second horn-shaped plate.
[0018] As a preferred solution of the automatic component mounter of the device described in the present invention, wherein: one end of the drying box close to the support plate is provided with a second drying groove, an emptying groove is provided in the second drying groove, a third horn-shaped plate is slidably arranged in the second drying groove, and a second opening and closing groove is provided on the third horn-shaped plate.
[0019] As a preferred solution of the automatic component mounter of the device described in the present invention, wherein: the drying component further includes a first drying rod and a second drying rod, the first drying rod is slidably inserted into the second drying rod, one end of the first drying rod away from the second drying rod is connected to the lifting plate, one end of the second drying rod away from the first drying rod is provided with a connecting plate, the connecting plate is arranged in the drying box, and pull rods are symmetrically hinged at both ends of the connecting plate, one end of the pull rod away from the connecting plate is hinged with a push rod, and clamping grooves are provided on the side walls of both sides of the drying box.
[0020] Compared with the prior art, the beneficial effects of the present invention are:
[0021] 1. By providing a support plate and placing the solder pad on the upper surface of the support plate, and then using a cylinder to lift the solder pad to an appropriate height for component mounting, relying on the support plate to support the lower end of the solder pad, when the component is mounted on the solder pad, the solder pad will not undergo overall deformation due to excessive downward pressure of the suction nozzle, thereby ensuring a good contact state between the component and the solder pad. As a result, when the solder pad with the component is subjected to reflow soldering, the melted solder paste can fully fill the gap between the component and the solder pad, avoiding the generation of false soldering and ensuring the structural strength of the solder joint and the stability of electrical connection;
[0022] 2. By arranging a heating wire in the support plate, the heat generated by the heating wire can preheat the solder pad and the solder paste, thereby improving the activity of the solder resist in the solder paste, and further improving the reliability and conductivity of the solder joint;
[0023] 3. By setting the positioning components, when the pad is lifted by the cylinder, the two positioning plates approach each other, and at the same time, the pads on the support plate are positioned by using four right-angle brackets, thereby improving the mounting accuracy of the device.
[0024] 4. By setting the buffer components, when the nozzle mounts the device on the pad and the downward pressure is too large, the strut is used to push the slider, and the slider pushes the damper. The damper is used to consume the downward pressure of the nozzle, so that the pad can properly avoid the nozzle, thereby preventing the pad from being locally deformed or cracked due to rigid stress and improving the mounting quality of the pad.
[0025] 5. By setting the air cylinder, after the pad is pushed to an appropriate height, the humid gas can be discharged to the upper surface of the pad. The moisture is used to wet the solder paste on the pad, preventing the solder paste from being too dry and affecting the mounting quality of the device. At the same time, by shifting the drying plate, after the moisture is discharged, the nitrogen gas in the drying box will be discharged to the upper surface of the pad, using the nitrogen gas to isolate the air from the pad and the solder paste, reducing the contact between the moisture in the air and the solder paste, thereby preventing the solder paste from being overly hygroscopic. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a schematic structural diagram of the overall device automatic mounter of the present invention.
[0027] Figure 2 It is a schematic exploded structural diagram of the buffer components of the device automatic mounter of the present invention.
[0028] Figure 3 It is a schematic structural diagram of the damper and the slider of the device automatic mounter of the present invention.
[0029] Figure 4 It is a schematic top view structural diagram of the positioning components of the device automatic mounter of the present invention.
[0030] Figure 5 It is the device automatic mounter of the present invention Figure 4 The enlarged schematic structural diagram at position A in it.
[0031] Figure 6 It is a schematic structural diagram of the heating wire and the air cavity of the device automatic mounter of the present invention.
[0032] Figure 7 It is a schematic bottom view structural diagram of the positioning components of the device automatic mounter of the present invention.
[0033] Figure 8 It is a schematic exploded structural diagram of the lifting components of the device automatic mounter of the present invention.
[0034] Figure 9 It is a schematic sectional view structural diagram of the water tank and the exhaust box of the device automatic mounter of the present invention.
[0035] Figure 10 This is a schematic structural diagram of the drying tank 1 and the horn plate 2 of the automatic placement machine for the device of the present invention.
[0036] Figure 11 This is a schematic structural diagram of the drying tank 2 and the horn plate 3 of the automatic placement machine for the device of the present invention.
[0037] In the figure:
[0038] 1. Frame; 11. Mounting and placement module; 12. Horizontal plate; 13. Side plate; 14. Limit track; 15. Baffle; 16. Cylinder;
[0039] 2. Lifting component; 21. Lifting box; 22. Lifting plate; 23. Lifting groove; 24. Air outlet groove; 25. Magnet 1; 26. Horn plate 1; 27. Water tank; 28. Water baffle; 29. Exhaust box; 291. Exhaust groove;
[0040] 3. Drying component; 31. Drying box; 32. Drying plate; 33. Drying tank 1; 34. Horn plate 2; 341. Opening and closing groove 1; 35. Drying tank 2; 351. Emptying groove; 36. Horn plate 3; 361. Opening and closing groove 2; 37. Drying rod 1; 371. Drying rod 2; 38. Connecting plate; 381. Pull rod; 382. Thrust rod; 39. Card slot;
[0041] 4. Positioning component; 41. Support plate; 42. Pulley; 43. Electric heating wire; 44. Air cavity; 45. Driving plate; 46. Connecting rod; 47. Positioning plate; 48. Mounting block; 49. Right-angle frame;
[0042] 5. Buffering component; 51. Air cylinder; 52. Piston plate; 53. Piston rod; 54. Guide plate; 55. Rotating cylinder; 56. Support rod; 57. Chute; 58. Damper; 59. Slide block; 591. Sliding roller. Specific embodiments
[0043] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, many specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by showing examples of the present invention. The present invention is in no way limited to any specific configuration and algorithm set forth below, but covers any modification, replacement, and improvement of elements, components, and algorithms without departing from the spirit of the present invention. Well-known structures and technologies are not shown in the drawings and the following description in order to avoid unnecessarily obscuring the present invention.
[0044] Embodiment 1
[0045] Referring to Figure 1-8 , for the first embodiment of the present invention, an automatic device mounter is provided. The automatic device mounter includes a frame 1. A mounting module 11 is provided at the upper end of the frame 1. The mounting module 11 includes a transmission mechanism and a mounting head provided thereon. The transmission mechanism includes X, Y, and Z-axis rotation mechanisms for realizing the movement of the mounting head in a plane and the movement in the vertical direction. A vacuum suction nozzle is provided on the mounting head, and the device is picked up by means of vacuum adsorption. A cross plate 12 is provided on the frame 1. Side plates 13 are symmetrically provided on the upper surface of the cross plate 12. Limiting tracks 14 are symmetrically provided at one end of the side plates 13 away from the cross plate 12. A baffle 15 is provided at one end of the limiting tracks 14 away from the side plates 13. A buffer cotton is provided on one side of the baffle 15 away from the limiting tracks 14 and close to the cross plate 12. A lifting member 2 is provided on one baffle 15. A drying member 3 is provided above the lifting member 2. A positioning member 4 is provided between the two side plates 13. The positioning member 4 includes a support plate 41. Pulley 42 are provided at the four corners of the support plate 41. The pulley 42 are slidably provided on the limiting tracks 14. The positioning member 4 is used to carry and position the pad position. A limiting rod is provided between the side plate 13 and the baffle 15, and the limiting rod penetrates through the support plate 41;
[0046] A buffer member 5 is provided at the lower end of the positioning member 4. The buffer member 5 is provided at the area position between the positioning member 4 and the cross plate 12. The buffer member 5 is used to buffer the rigid stress received by the pad. A cylinder 16 is provided at the lower end of the frame 1. One end of the cylinder 16 away from the frame 1 penetrates through the cross plate 12 and is connected to the buffer member 5;
[0047] The buffer member 5 includes an air cylinder 51 and a piston plate 52 slidably provided in the air cylinder 51. Limiting plates are symmetrically provided on the upper surface of the cross plate 12. The air cylinder 51 is snap-fitted and slidably provided between the two limiting plates. A check valve 1 is provided on the air cylinder 51 for allowing the gas in the external environment of the air cylinder 51 to enter the air cylinder 51. The telescopic end of the cylinder 16 penetrates through the cross plate 12 and is connected to the bottom of the air cylinder 51. A piston rod 53 is provided at one end of the piston plate 52 away from the cross plate 12. One end of the piston rod 53 away from the piston plate 52 penetrates through the air cylinder 51. A guide plate 54 is provided at one end of the piston rod 53 away from the piston plate 52. A rotating cylinder 55 is sleeved outside the guide plate 54. Guide grooves are symmetrically provided inside the rotating cylinder 55. Guide shafts are symmetrically provided outside the guide plate 54. The guide shafts are slidably provided in the guide grooves. One end of the rotating cylinder 55 away from the air cylinder 51 is connected to the positioning member 4;
[0048] On the outer side of the piston rod 53, struts 56 are arranged in an array. On the end face of the air cylinder 51 away from the cross plate 12, chutes 57 are arranged in an array. The struts 56 can slide in the chutes 57. On the outer side of the piston rod 53, piston grooves are arranged in an array. The struts 56 are hinged in the piston grooves. The piston grooves communicate with the chutes 57. At the end of the strut 56 away from its connection with the piston groove, a guide wheel is rotatably arranged. The guide wheel is in snap-fit sliding connection with the piston groove and the chute 57. At the end of the chute 57 away from the strut 56, a damper 58 is arranged. The damper 58 is preferably a pneumatic damper 58, which consists of a cylinder body and a piston. It uses the compressibility and viscosity of the gas to provide damping. The compression and expansion processes of the gas will absorb and release energy. At the same time, the viscous friction between the gas and the cylinder wall and the piston during the flow process will also consume energy, thereby playing a damping role. At the end of the damper 58 close to the strut 56, a slider 59 is arranged. On the slider 59, a sliding roller 591 is rotatably arranged. The slider 59 is in snap-fit sliding connection in the chute 57. The sliding roller 591 is arranged on the side of the slider 59 away from the damper 58. The guide wheel can contact the sliding roller 591. The sliding roller 591 is used to reduce the frictional resistance when the guide wheel contacts and displaces the sliding roller 591.
[0049] In the support plate 41, heating wires 43 are longitudinally laid. In the support plate 41, an air cavity 44 is formed. On the lower surface of the support plate 41, a driving plate 45 is rotatably arranged. At both ends of the driving plate 45, connecting rods 46 are hinged. At the end of the connecting rod 46 away from the driving plate 45, a positioning plate 47 is hinged. The heating wire 43 is electrically connected to a power source. When an electric current flows through the heating wire 43, electrical energy is converted into heat energy. One air pipe is connected to the air cylinder 51. The end of the air pipe away from the air cylinder 51 is connected to the support plate 41, and the air cavity 44 communicates with the inside of the air cylinder 51. The side of the driving plate 45 away from the support plate 41 is fixedly connected to the rotating cylinder 55. The connecting rod 46 is composed of a first movable rod, a second movable rod, and a first spring. The first movable rod is inserted into the second movable rod, and the first spring is respectively connected to the first movable rod and the second movable rod. The positioning plate 47 is slidably arranged on the lower surface of the support plate 41.
[0050] On the upper surface of the positioning plate 47, mounting blocks 48 are symmetrically arranged. On the mounting blocks 48, right-angle frames 49 are rotatably arranged. On the upper surface of the positioning plate 47, a limiting shaft is arranged. The limiting shaft contacts the right-angle frame 49, and the limiting shaft can limit the right-angle frame 49. On the upper surface of the positioning plate 47, a major arc groove is formed. In the major arc groove, a second spring is arranged. A sliding shaft is connected to the second spring. The sliding shaft can contact the right-angle frame 49 under the elastic force of the second spring. The middle area of the right-angle frame 49 is connected to the positioning plate 47. At both ends of the right-angle frame 49, rubber wheels are rotatably arranged.
[0051] During use, first place the solder paste-printed pad on the support plate 41, then start the cylinder 16. The movable end of the cylinder 16 will push against the air cylinder 51, and then the air cylinder 51 will move towards the piston plate 52. At this time, the air in the air cylinder 51 will enter the air chamber 44 through the first air pipe under the action of the piston plate 52;
[0052] At the same time, turn on the power supply so that the current flows through the heating wire 43. At this time, the electrical energy flowing through the heating wire 43 will be converted into heat energy, and then the heat generated by the heating wire 43 will be transferred to the pad, solder paste, and the gas in the air chamber 44 through the support plate 41;
[0053] At the same time, the guide shaft on the guide plate 54 will slide along the guide groove, and then the rotating cylinder 55 will rotate. The driving plate 45 will rotate synchronously with the rotating cylinder 55 at this time. Then the driving plate 45 will pull the two positioning plates 47 closer to each other through the connecting rod 46. Then the mounting plates on the two positioning plates 47 will approach each other. When one end of the right-angle frame 49 on the mounting plate contacts the pad, as the two positioning plates 47 continue to shift, the right-angle frame 49 will gradually rotate until both ends of the right-angle frame 49 contact the side of the pad, and the right-angle frame 49 exerts an appropriate pushing force on the pad. By arranging the right-angle frames 49 at the four corners of the pad, the pad on the support plate 41 is positioned and clamped under the interaction of the four right-angle frames 49. During the rotation of the right-angle frame 49, the right-angle frame 49 will push the sliding shaft to slide in the major arc groove, and at this time the second spring will deform;
[0054] When the driving plate 45 pulls the positioning plate 47 through the connecting rod 46, when the right-angle frame 49 has positioned and clamped the pad, as the guide shaft on the guide plate 54 continues to drive the rotating cylinder 55 to rotate, the first spring will deform, and the first movable rod will gradually extend from the second movable rod until the rotating cylinder 55 rotates to the extreme position;
[0055] As the movable end of the cylinder 16 pushes against the air cylinder 51, piston plate 52, piston rod 53, guide plate 54, rotating cylinder 55, driving plate 45, and support plate 41, the pulley 42 will linearly slide along the limit track 14, and then the support plate 41 will push against the pad, so that the edge position on the upper surface of the pad is closely attached to the buffer cotton on the lower surface of the baffle 15;
[0056] At the same time, during the movement of the air cylinder 51 towards the piston plate 52, the support rod 56 will slide from the piston groove to the sliding groove 57. Then the guide wheel at the end of the support rod 56 away from the piston rod 53 will contact the sliding roller 591 on the slider 59. And as the piston rod 53 continues to retract into the air cylinder 51, the support rod 56 will further push against the slider 59. At this time, the damper 58 will block the slider 59;
[0057] When the drive mechanism drives the vacuum nozzle on the placement head to pick up and place components, the support plate 41 will support the pads. At the same time, when the downward pressure of the vacuum nozzle is too large, the pads, the support plate 41, the drive plate 45, the rotating cylinder 55, and the piston rod 53 will shift towards the direction of the air cylinder 51. At this time, the support rod 56 will further push the slider 59, and then the damper 58 will consume the pushing force of the support rod 56, so as to realize that when the downward pressure of the vacuum nozzle is too large, the pads can shift downward appropriately.
[0058] Embodiment 2
[0059] Refer to Figure 1-9 , which is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is:
[0060] The lifting component 2 includes a lifting box 21. A lifting plate 22 is slidably arranged in the lifting box 21. The lifting box 21 is arranged on the upper surface of the baffle 15. Fixing rods one are symmetrically arranged in the lifting box 21. Both ends of the fixing rods one are respectively connected to the upper and lower ends of the lifting box 21, and the fixing rods one penetrate through the lifting plate 22. A third spring is sleeved on the outer side of the fixing rods one. The third spring is arranged at the upper end of the lifting plate 22. An air pipe two is arranged on the support plate 41. One end of the air pipe two far away from the support plate 41 is connected to the lifting box 21, and the air cavity 44 is communicated with the inside of the lifting box 21.
[0061] A lifting groove 23 is arranged in the lifting box 21. An air outlet groove 24 is arranged in the lifting groove 23. Magnetic blocks one 25 are symmetrically arranged in the lifting groove 23. A sheep's horn plate one 26 is slidably arranged in the lifting groove 23. The air outlet groove 24 penetrates through the lifting box 21. The magnetic blocks one 25 are embedded in the groove walls at the upper and lower ends of the lifting groove 23. Both ends of the sheep's horn plate one 26 have magnetism, and the sheep's horn plate one 26 can be attracted to the magnetic blocks one 25, and the sheep's horn plate one 26 can block the air outlet groove 24.
[0062] A water tank 27 is arranged on the lifting box 21. A water baffle 28 is arranged in the water tank 27. An exhaust box 29 is arranged on the water tank 27. Exhaust grooves 291 are arranged in an array on the exhaust box 29. The water tank 27 is arranged at one end of the lifting box 21 close to the air outlet groove 24. Water is poured into the water tank 27. The water baffle 28 is arranged above the water surface of the water body. Air holes are arranged in an array on the water baffle 28. One end of an air pipe three is connected to the air outlet groove 24 of the lifting box 21. The other end of the air pipe three far away from the lifting box 21 is connected to the lower end of the water tank 27. A check valve two is arranged at the connection part of the air pipe three and the water tank 27. The gas in the lifting box 21 can enter the water tank 27 through the air pipe three;
[0063] The exhaust box 29 is arranged at one end of the water tank 27 away from the lifting box 21. A fourth air pipe is arranged at the upper end of the water tank 27. The end of the fourth air pipe away from the water tank 27 is connected to the exhaust box 29. The gas in the water tank 27 can enter the exhaust box 29 through the fourth air pipe, and then the gas entering the exhaust box 29 can be discharged through the exhaust groove 291 and towards the direction of the support plate 41.
[0064] During the use process, when the support plate 41 rises, the gas in the air cylinder 51 will enter the air cavity 44 through the first air pipe, and then the gas entering the air cavity 44 will be heated. The gas in the air cavity 44 will enter the lifting box 21 through the second air pipe after being heated. At this time, the air outlet groove 24 is in a state blocked by the first sheep's horn plate 26.
[0065] When the gas in the lifting box 21 gradually increases, the lifting plate 22 will move towards the drying component 3 under the action of the gas pressure. At this time, the third spring deforms. When the lifting plate 22 moves to a certain position, the lifting plate 22 will push the first sheep's horn plate 26, causing the first sheep's horn plate 26 to be lifted by the pushing of the lifting plate 22, and then the first sheep's horn plate 26 will no longer block the air outlet groove 24.
[0066] At this time, the gas in the lifting box 21 enters the water tank 27 through the air outlet groove 24, the third air pipe, and the second one-way valve. At the same time, the lifting plate 22 will gradually reset under the elastic force of the third spring. The gas entering the water tank 27 from the third air pipe will first contact the water body, and then the gas will be discharged from the water surface of the water body and enter the exhaust box 29 through the fourth air pipe. The gas in the exhaust box 29 is then discharged through a plurality of exhaust grooves 291. At this time, the humidity of the gas discharged from the exhaust grooves 291 is relatively high.
[0067] Before the gas is discharged from the exhaust grooves 291, the support plate 41 has lifted the solder pad to contact the buffer plate on the baffle 15. When the gas containing humidity is discharged towards the solder pad from the exhaust grooves 291, the moisture will wet the solder paste on the solder pad, preventing the solder paste from drying out excessively before the device is mounted, thereby affecting the mounting quality of the device.
[0068] The remaining structure is the same as that of Embodiment 1.
[0069] Embodiment 3
[0070] Refer to Figure 1-11 , which is the third embodiment of the present invention. The difference between this embodiment and the second embodiment is:
[0071] The drying component 3 includes a drying box 31. A drying plate 32 is slidably arranged in the drying box 31. The drying box 31 is arranged at the upper end of the lifting box 21. At the upper end of the drying plate 32, second fixing rods are symmetrically arranged. The end of the second fixing rod far away from the drying plate 32 penetrates through the upper end of the drying box 31. A fourth spring is sleeved outside the second fixing rod. The fourth spring is arranged at the upper end of the drying plate 32. A nitrogen storage tank is arranged on the frame 1. The nitrogen storage tank is connected with the drying box 31 through a pipe. A nitrogen groove is opened on the drying box 31. The nitrogen storage tank is internally communicated with the drying box 31. Nitrogen is filled in the nitrogen storage tank. Nitrogen is an inert and dry gas. An air pump is arranged in the nitrogen storage tank. The nitrogen in the nitrogen storage tank can enter the drying box 31 through the nitrogen groove.
[0072] At one end of the drying box 31 far away from the support plate 41, a first drying groove 33 is opened. A second horn-shaped plate 34 is slidably arranged in the first drying groove 33. An opening and closing groove 341 is arranged on the second horn-shaped plate 34. The nitrogen groove is communicated with the first drying groove 33. Both the second horn-shaped plate 34 and the drying plate 32 can block the nitrogen groove. Second magnets are embedded in the upper and lower groove walls of the second drying groove 35. Both the upper and lower ends of the second horn-shaped plate 34 have magnetism. The second horn-shaped plate 34 can be attracted to the second magnets.
[0073] At one end of the drying box 31 close to the support plate 41, a second drying groove 35 is arranged. An emptying groove 351 is arranged in the second drying groove 35. A third horn-shaped plate 36 is slidably arranged in the second drying groove 35. An opening and closing groove 361 is opened on the third horn-shaped plate 36. The emptying groove 351 penetrates through the drying box 31. Third magnets are embedded in the upper and lower ends of the second drying groove 35. Both ends of the third horn-shaped plate 36 have magnetism. The third horn-shaped plate 36 can be attracted to the third magnets, and the third horn-shaped plate 36 can block the opening and closing groove 361. An air pipe five is arranged at the emptying groove 351. The end of the air pipe five far away from the drying box 31 is connected with the exhaust box 29, and the drying box 31 is internally communicated with the exhaust box 29.
[0074] The drying component 3 further includes a first drying rod 37 and a second drying rod 371. The first drying rod 37 is slidably inserted into the second drying rod 371. One end of the first drying rod 37 away from the second drying rod 371 is connected to the lifting plate 22. One end of the second drying rod 371 away from the first drying rod 37 is provided with a connecting plate 38. The connecting plate 38 is arranged in the drying box 31. At both ends of the connecting plate 38, pull rods 381 are symmetrically hinged. One end of the pull rod 381 away from the connecting plate 38 is hinged with a push rod 382. Card slots 39 are formed on both side walls of the drying box 31. At the end surface of the drying plate 32 away from the second fixing rod, limit blocks are symmetrically arranged. The push rod 382 is slidably arranged in the limit blocks and can be clamped in the card slots 39. In the middle area of the end surface of the drying plate 32 where the limit blocks are arranged, a guiding rod is further provided. One end of the guiding rod away from the drying plate 32 penetrates through the connecting plate 38 and is clamped and slidably inserted into the second drying rod 371. A fifth spring is sleeved outside the guiding rod. The fifth spring is arranged between the connecting plate 38 and the drying plate 32.
[0075] During the use process, when the lifting plate 22 ascends, the first drying rod 37 will gradually extend into the second drying rod 371. When the first drying rod 37 extends to the extreme limit inside the second drying rod 371, at this time the first drying rod 37 will push the second drying rod 371 to ascend synchronously. At this time, the connecting plate 38 will push the push rod 382 through the pull rod 381. Since the push rod 382 contacts the inner wall of the drying box 31, the drying plate 32 will move in the direction away from the lifting plate 22.
[0076] Initially, the second horn plate 34 does not block the nitrogen gas groove, but the drying plate 32 blocks the nitrogen gas groove. When the drying plate 32 is displaced to contact the second horn plate 34, at this time nitrogen gas can enter the drying box 31 through the nitrogen gas groove. When the drying plate 32 ascends to the extreme limit, at this time the push rod 382 is displaced to the card slot 39, and then the push rod 382 will extend into the card slot 39. At the same time, the drying plate 32 will push the second horn plate 34, causing the second horn plate 34 to block the nitrogen gas groove, so that nitrogen gas no longer enters the drying box 31. At the same time, initially the third horn plate 36 blocks the emptying groove 351. When the drying plate 32 moves to the extreme limit, the drying plate 32 will push the third horn plate 36. At this time, the third horn plate 36 will no longer block the emptying groove 351.
[0077] When the lifting plate 22 descends, the first drying rod 37 gradually extends out of the second drying rod 371. When the lifting plate 22 resets to the initial position, at this time the second drying rod 371 will pull the push rod 382 through the connecting plate 38 and the pull rod 381, so that the push rod 382 is separated from the card slot 39. Then the drying plate 32 will reset under the elastic force of the fourth spring. At this time, the nitrogen gas in the drying box 31 will be introduced into the exhaust box 29 through the fifth air pipe, and then discharged to the welding pad through the exhaust groove 291.
[0078] When the drying plate 32 descends to the initial position, the drying plate 32 will push against the second horn plate 34 at this time, so that the second horn plate 34 no longer blocks the nitrogen gas tank, but the drying plate 32 will block the nitrogen gas tank, resulting in nitrogen gas being unable to enter the drying box 31. At the same time, the drying plate 32 will push against the third horn plate 36, so that the third horn plate 36 resets and blocks the evacuation groove 351.
[0079] The remaining structures are the same as those in Embodiment 2.
[0080] In different embodiments, different technical features that appear can be combined to achieve beneficial effects. Those skilled in the art should be able to understand and implement other variations of the disclosed embodiments based on the study of the drawings, the description, and the claims. In the claims, the term "comprising" does not exclude other devices or steps; the indefinite article "a" does not exclude a plurality; the terms "first" and "second" are used to label names rather than to indicate any particular order. Any reference signs in the claims should not be construed as limiting the scope of protection. The functions of multiple parts in the claims can be implemented by a single hardware or software module. The fact that certain technical features appear in different dependent claims does not mean that these technical features cannot be combined to achieve beneficial effects.
Claims
1. A device automatic placement machine, comprising a frame, wherein a placement module is arranged at the upper end of the frame, characterized in that: The frame is provided with a horizontal plate, the upper surface of the horizontal plate is symmetrically provided with side plates, the end of the side plate away from the horizontal plate is symmetrically provided with a limiting track, the end of the limiting track away from the side plate is provided with a baffle, a lifting component is provided on one of the baffles, a drying component is provided above the lifting component, a positioning component is provided between the two side plates, the positioning component includes a support plate, pulleys are provided at the four corners of the support plate, the pulleys are slidably provided on the limiting track, and the positioning component is used to carry and locate the position of the welding pad; A buffer component is provided at the lower end of the positioning component, and the buffer component is provided at the area between the positioning component and the horizontal plate, and the buffer component is used to buffer the rigid stress of the pad. A cylinder is provided at the lower end of the frame, and one end of the cylinder away from the frame penetrates the horizontal plate and is connected to the buffer component; The buffer component includes an air cylinder and a piston plate slidably arranged in the air cylinder, a piston rod is arranged at one end of the piston plate away from the horizontal plate, the piston rod is away from the guide plate of the piston plate, a rotating cylinder is sleeved on the outer side of the guide plate, guide grooves are symmetrically arranged on the inner side of the rotating cylinder, and the end of the rotating cylinder away from the air cylinder is connected to the positioning component; The outer side of the piston rod is arrayed with a strut, the end face of the air cylinder away from the cross plate is arrayed with a slide groove, the strut can slide in the slide groove, the end of the slide groove away from the strut is provided with a damper, the end of the damper close to the strut is provided with a slider, and a sliding roller is rotatably provided on the slider.
2. The automatic device placement machine according to claim 1, characterized in that: A heating wire is longitudinally laid in the support plate, an air cavity is opened in the support plate, a driving plate is rotatably arranged on the lower surface of the support plate, connecting rods are hingedly arranged at both ends of the driving plate, and a positioning plate is hingedly arranged at one end of the connecting rod away from the driving plate.
3. The automatic device placement machine according to claim 2, characterized in that: The upper surface of the positioning plate is symmetrically provided with mounting blocks, and a right-angle bracket is rotatably provided on the mounting blocks.
4. The automatic device placement machine according to claim 1, characterized in that: The lifting component comprises a lifting box, and a lifting plate is slidably arranged in the lifting box.
5. The automatic device placement machine according to claim 4, characterized in that: The lifting box is provided with a lifting groove, the lifting groove is provided with an air outlet groove, the lifting groove is symmetrically provided with a magnetic block, and the lifting groove is slidably provided with a horn plate.
6. The automatic device placement machine according to claim 4, characterized in that: The lifting box is provided with a water tank, a water baffle is provided in the water tank, an exhaust box is provided on the water tank, and exhaust grooves are provided in an array on the exhaust box.
7. The automatic device placement machine according to claim 1, characterized in that: The drying component comprises a drying box, in which a drying plate is slidably arranged.
8. The automatic device placement machine according to claim 7, characterized in that: A drying groove is provided at one end of the drying box away from the supporting plate, a horn plate is slidably arranged in the drying groove, and an opening and closing groove is provided on the horn plate.
9. The automatic device placement machine according to claim 7, characterized in that: The drying box is provided with a second drying slot at one end close to the support plate, an emptying slot is provided in the second drying slot, a third horn plate is slidably provided in the second drying slot, and an opening and closing slot second is provided on the third horn plate.
10. The automatic device placement machine according to claim 1, characterized in that: The drying component also includes a drying rod 1 and a drying rod 2. The drying rod 1 is slidably inserted into the drying rod 2. The end of the drying rod 1 away from the drying rod 2 is connected to the lifting plate. The end of the drying rod 2 away from the drying rod 1 is provided with a connecting plate. The connecting plate is arranged in a drying box, and the two ends of the connecting plate are symmetrically hinged with pull rods. The end of the pull rod away from the connecting plate is hinged with a push rod. Card slots are opened on the side walls of both sides of the drying box.
Citation Information
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