Lightweight high-rigidity photovoltaic module and preparation method and application thereof
By using a combination of thermosetting glue and thermoplastic glue in photovoltaic modules, combined with the mesh thermoplastic film layer and the epoxy resin prepreg layer, the problem of easy bending of photovoltaic modules at high temperatures and easy separation of honeycomb core layer and glue layer is solved, achieving higher bonding strength and resistance to high temperature deformation, and extending the life of the module.
Patent Information
- Application Number
- CN202510236179.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2025-05-27
AI Technical Summary
Current lightweight, high rigid photovoltaic modules are easy to bend at high temperatures, and the honeycomb core layer and the glue layer are easily separated, resulting in a reduced component life.
Using a technology of combining thermosetting glue and thermoplastic glue, a mesh thermoplastic film layer and an epoxy resin prepreg layer are arranged on both sides of the honeycomb core layer to form a structure in which the epoxy resin and the thermoplastic film alternately bond with the honeycomb core layer, enhancing the bonding strength and high-temperature deformation resistance.
The bonding strength and stiffness between the honeycomb core layer and other glue layers is improved, and the component bending caused by the softening of thermoplastic rubber at high temperature is avoided, and the problem of separation of thermosetting rubber and honeycomb core layer is solved, which extends the life of photovoltaic modules.
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Figure CN120051009A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of photovoltaic modules, and in particular, to a lightweight and high-rigidity photovoltaic module, a preparation method thereof, and an application thereof. Background Art
[0002] Photovoltaic modules, also called solar panels, generate electricity through the "photovoltaic effect" and are the core part of a solar power generation system. Conventional modules cannot be used in some distributed projects due to their weight-bearing capacity, such as some color steel tile roof projects. To reduce the weight of the module, the weight of the glass is often reduced, the weight of the metal aluminum frame is reduced, or a transparent material is used to replace the front plate of the solar module. However, to improve the strength of the module, a metal aluminum frame is still used or the back substrate is strengthened with ribs to improve the overall strength of the module.
[0003] Currently, honeycomb cores are often used as the base material for lightweight and high-rigidity photovoltaic modules, which can meet the high-rigidity usage requirements at room temperature. For example, CN109390422A discloses a lightweight photovoltaic module, including a transparent front plate, a first encapsulation layer, a solar cell, a second encapsulation layer, and a back plate stacked in sequence. The back plate includes a first substrate layer, a honeycomb core layer, and a second substrate layer stacked in sequence. The first substrate layer and the honeycomb core layer, and the second substrate layer and the honeycomb core layer are respectively bonded by an adhesive. The first substrate layer is located between the second encapsulation layer and the honeycomb core layer. The first substrate layer is a resin insulation layer or a metal layer. When the first substrate layer is a metal layer, the lightweight photovoltaic module further includes a first insulation layer disposed between the second encapsulation layer and the first substrate layer. However, this lightweight photovoltaic module uses an adhesive to bond the epoxy resin insulation layer to the honeycomb core layer, or uses an adhesive to bond the metal layer to the honeycomb core layer, resulting in problems such as poor bonding and easy delamination from the honeycomb core layer at high temperatures.
[0004] CN117021689A discloses a honeycomb board, a method for manufacturing the honeycomb board, and a lightweight photovoltaic module, including: the front support plate and the honeycomb core layer, and the honeycomb core layer and the rear support plate are both connected by a hot press bonding and curing method; both the front support plate and the rear support plate are made of a composite of resin and fiber, and the weight ratio of resin to fiber is 3:7 to 6:4; the honeycomb core layer is made of a mixed material prepared by mixing a thermosetting resin and glass fiber, and the mixed material is made by an extrusion casting process using a honeycomb mold. However, this lightweight photovoltaic module has the defect that the front support plate and the rear support plate are easily separated from the honeycomb core layer.
[0005] CN110400853A discloses a lightweight backsheet for a photovoltaic module, a photovoltaic module using the same, and a preparation method thereof. The lightweight backsheet at least includes a thermoplastic core layer and a first thermoplastic substrate layer that are integrally formed by hot melt pressing; wherein, the matrix material of the thermoplastic core layer is a core layer thermoplastic polymer, the matrix material of the first thermoplastic substrate layer is a substrate layer thermoplastic polymer, and the core layer thermoplastic polymer and the substrate layer thermoplastic polymer are of the same material; and the thermoplastic core layer is in a honeycomb shape or a porous foamed shape; the lightweight backsheet can simultaneously replace the metal frame as the lining structure of the photovoltaic module. However, this lightweight photovoltaic module has the defect of being easily deformed at high temperatures.
[0006] To sum up, the current lightweight and high-rigidity photovoltaic modules use honeycomb core layers, but there are problems such as easy separation between the honeycomb core layer and the adhesive layer, and the thermoplastic adhesive will soften at high temperatures, causing the module to bend, resulting in a reduced lifespan of the photovoltaic module. Summary of the Invention
[0007] Aiming at the deficiencies of the existing technology, the purpose of the present invention is to provide a lightweight and high-rigidity photovoltaic module, a preparation method thereof, and an application thereof. The lightweight and high-rigidity photovoltaic module combines a thermosetting adhesive and a thermoplastic adhesive, thereby improving the bonding strength and stiffness between the honeycomb core layer and other adhesive layers, avoiding the bending problem of the module caused by the softening of the thermoplastic adhesive under high-temperature conditions in summer, and at the same time solving the problem of separation between the thermosetting adhesive and the honeycomb core layer.
[0008] To achieve this purpose, the present invention adopts the following technical solutions:
[0009] In the first aspect, the present invention provides a lightweight and high-rigidity photovoltaic module. The lightweight and high-rigidity photovoltaic module includes a honeycomb composite layer; the honeycomb composite layer includes a honeycomb core layer, and a network thermoplastic adhesive film layer and an epoxy resin prepreg layer that are sequentially laminated on both sides of the honeycomb core layer; the network holes of the network thermoplastic adhesive film layer are filled with epoxy resin prepreg, and the epoxy resin prepreg penetrates through the network holes of the network thermoplastic adhesive film layer and contacts the honeycomb core layer.
[0010] The lightweight and high-rigidity photovoltaic module provided by the present invention first adopts a honeycomb core layer. Its honeycomb structure can reduce the mass per unit area of the photovoltaic module, achieving the effect of light weight, so that the photovoltaic module can be widely applied to environments such as vehicle-mounted or color steel tiles. Secondly, in order to improve the bonding effect between the honeycomb core layer and other layers, the present invention first sets a mesh thermoplastic adhesive film layer on the surface side of the honeycomb core layer, which is bonded to the honeycomb core layer through the mesh thermoplastic adhesive film layer. At the same time, an epoxy resin prepreg layer is set on the outer side of the mesh thermoplastic adhesive film layer. During the pressing process, the epoxy resin in the epoxy resin prepreg layer will penetrate the hole structure in the mesh thermoplastic adhesive film layer, so as to be bonded to the honeycomb core layer, and finally form a structure in which epoxy resin and thermoplastic adhesive are alternately bonded to the honeycomb core layer, having the advantage of strong bonding with the honeycomb core layer. And even if the thermoplastic adhesive film softens under high temperature conditions in summer, due to its high elastic modulus fiber skin, it is still directly bonded to the honeycomb core through the thermosetting epoxy adhesive, and the composite honeycomb core layer has strong anti-deformation ability.
[0011] Specifically, the epoxy resin is a thermosetting adhesive with a relatively high glass transition temperature and a relatively high elastic modulus before the glass transition. Generally, fibers are used as the reinforcement of the prepreg, and the selected fibers are high-temperature and high-elastic modulus materials. Due to these advantages, after the epoxy resin prepreg penetrates the holes of the already hollowed-out mesh thermoplastic adhesive film layer and is compounded with the honeycomb core layer under high temperature and high pressure, the composite body has a relatively high stiffness at both normal temperature and high temperature. In addition, the epoxy resin prepreg is partially bonded to the mesh thermoplastic adhesive film layer, and the mesh thermoplastic adhesive film layer is then bonded to the honeycomb core layer. After lamination and curing, the epoxy resin prepreg layer, the mesh thermoplastic adhesive film layer and the honeycomb core layer are compounded into one body, solving the problem that the thermosetting adhesive is easy to delaminate from the honeycomb core.
[0012] In the present invention, the mesh thermoplastic adhesive film layer and the epoxy resin prepreg layer can adopt opaque materials after molding, which can further play a role in blocking the exposure of the honeycomb core pattern below.
[0013] Preferably, at the junction of the honeycomb core layer and the mesh thermoplastic adhesive film layer, the honeycomb composite layer further includes a bonding strip arranged around the surface between the junctions, and the bonding strip covers the four sides of the honeycomb core layer.
[0014] The present invention further preferably sets a bonding strip around the surface between the junctions of the honeycomb core layer and the mesh thermoplastic adhesive film layer, and the bonding strip covers the four sides of the honeycomb core layer. The bonding strip is selected as a thermoplastic adhesive, so as to improve the firmness of the edge bonding. Especially when the component edge is stressed, the delamination resistance can be further improved, and the service life of the photovoltaic module can be extended.
[0015] Preferably, the width of the cementing strip is 15 - 25 mm, for example, it can be 15 mm, 17 mm, 18 mm, 19 mm, 20 mm, 21 mm, 22 mm, 23 mm, 24 mm or 25 mm, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0016] Preferably, the material of the cementing strip includes any one or a combination of at least two of EVA (ethylene - vinyl acetate copolymer), POE (polyolefin) or EPE film, etc. Typical but non - restrictive combinations are combinations of EVA and POE, EPE and POE, EVA and EPE, etc.
[0017] Preferably, the honeycomb core in the honeycomb core layer includes an aluminum honeycomb core or an aramid honeycomb core.
[0018] Preferably, the height of the honeycomb core is 2 - 10 mm, for example, it can be 2 mm, 3 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 4.6 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm or 10 mm, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0019] Preferably, the side length of the honeycomb core is 1 - 5 mm, for example, it can be 1 mm, 1.5 mm, 1.9 mm, 2.4 mm, 2.8 mm, 3.3 mm, 3.7 mm, 4.2 mm, 4.6 mm or 5 mm, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0020] Preferably, the wall thickness of the honeycomb core is 0.02 - 0.1 mm, for example, it can be 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm or 0.1 mm, etc.
[0021] Preferably, the material of the mesh thermoplastic film layer includes any one or a combination of at least two of ethylene - vinyl acetate copolymer, ethylene - octene copolymer, thermoplastic polyurethane or polyolefin. Typical but non - restrictive combinations are combinations of ethylene - vinyl acetate copolymer and ethylene - octene copolymer, thermoplastic polyurethane and ethylene - octene copolymer, ethylene - vinyl acetate copolymer and thermoplastic polyurethane, polyolefin and ethylene - octene copolymer.
[0022] Preferably, the thickness of the net-shaped thermoplastic adhesive film layer is 0.2 to 0.6 mm, for example, it can be 0.2 mm, 0.3 mm, 0.4 mm, 0.43 mm, 0.45 mm, 0.47 mm, 0.49 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm or 0.6 mm, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0023] Preferably, the weight per unit area of the net-shaped thermoplastic adhesive film layer is 200 g / m 2 ~600 g / m 2 For example, it can be 200 g / m 2 、245 g / m 2 、289 g / m 2 、334 g / m 2 、378 g / m 2 、423 g / m 2 、467 g / m 2 、512 g / m 2 、556 g / m 2 or 600 g / m 2 etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0024] Preferably, the area ratio of the holes in the net-shaped thermoplastic adhesive film layer is 30% to 70%, for example, it can be 30%, 35%, 38%, 40%, 42%, 43%, 45%, 48%, 50%, 52%, 55%, 58%, 60%, 62%, 65% or 70%, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0025] Preferably, the area of a single hole in the net-shaped thermoplastic adhesive film layer is 10 to 1000 mm 2 For example, it can be 10 mm 2 、20 mm 2 、30 mm 2 、100 mm 2 、150 mm 2 、200 mm 2 、300 mm 2 、400 mm 2 、500 mm 2 、600 mm 2 、700 mm 2 、890 mm 2 or 1000 mm 2 etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0026] The present invention preferably controls the single-hole area of the holes in the mesh thermoplastic film layer within the above range, which can better balance the bonding areas of the thermoplastic resin and the thermosetting resin with the honeycomb core, thereby significantly improving the service life of the photovoltaic module at high temperatures.
[0027] Preferably, the shape of the holes in the mesh thermoplastic film layer includes any one or a combination of at least two of square, circular or triangular. Among them, typical but non-limiting combinations are the combination of square and circular, the combination of triangular and circular, and the combination of square and triangular.
[0028] Preferably, the epoxy resin prepreg in the epoxy resin prepreg layer includes glass fiber epoxy resin prepreg and / or carbon fiber epoxy resin prepreg.
[0029] Preferably, the thickness of the epoxy resin prepreg layer is 0.2 - 0.5 mm. For example, it can be 0.2 mm, 0.24 mm, 0.27 mm, 0.3 mm, 0.34 mm, 0.37 mm, 0.4 mm, 0.44 mm, 0.47 mm or 0.5 mm, etc., but not limited to the listed values. Other unlisted values within this range are equally applicable.
[0030] Preferably, the unit area weight of the epoxy resin prepreg layer is 100 - 500 g / m 2 , for example, it can be 100 g / m 2 , 145 g / m 2 , 189 g / m 2 , 234 g / m 2 , 278 g / m 2 , 323 g / m 2 , 367 g / m 2 , 412 g / m 2 , 456 g / m 2 or 500 g / m 2 , etc., but not limited to the listed values. Other unlisted values within this range are equally applicable.
[0031] Preferably, the content of the epoxy resin in the epoxy resin prepreg layer is 20 - 50 wt%. For example, it can be 20 wt%, 24 wt%, 27 wt%, 30 wt%, 35 wt%, 37 wt%, 40 wt%, 44 wt%, 47 wt% or 50 wt%, etc., but not limited to the listed values. Other unlisted values within this range are equally applicable.
[0032] Preferably, the lightweight and high-rigidity photovoltaic module includes a solar cell, a front assembly disposed in front of the solar cell, and a rear assembly disposed behind the solar cell. The rear assembly includes the honeycomb composite layer.
[0033] Preferably, in a direction away from the solar cell, the front assembly includes a first transparent adhesive layer, a transparent epoxy prepreg layer, a second transparent adhesive layer, and a transparent panel layer that are sequentially stacked.
[0034] In the present invention, the transparent panel layer is disposed on the outermost layer and can provide further protection for the solar cell; the second transparent adhesive layer bonds the transparent panel layer and the transparent epoxy prepreg layer, and also has the function of preventing ultraviolet rays, which can ensure that the transparent epoxy prepreg layer does not turn yellow under certain light conditions. Preferably, by using the first transparent adhesive layer, the transparent epoxy prepreg layer, the second transparent adhesive layer, and the transparent panel layer to further protect the solar cell, damage to the cell caused by certain external force impacts can be prevented.
[0035] Preferably, the thickness of the transparent epoxy prepreg layer is 0.2 - 0.5 mm, for example, it can be 0.2 mm, 0.24 mm, 0.27 mm, 0.3 mm, 0.34 mm, 0.37 mm, 0.4 mm, 0.44 mm, 0.47 mm, or 0.5 mm, etc., but is not limited to the listed values, and other unlisted values within this range are equally applicable.
[0036] Preferably, the unit area weight of the transparent epoxy prepreg layer is 100 - 500 g / m 2 , for example, it can be 100 g / m 2 , 145 g / m 2 , 189 g / m 2 , 234 g / m 2 , 278 g / m 2 , 323 g / m 2 , 367 g / m 2 , 412 g / m 2 , 456 g / m 2 or 500 g / m 2 , etc., but is not limited to the listed values, and other unlisted values within this range are equally applicable.
[0037] Preferably, the mass content of epoxy resin in the transparent epoxy prepreg layer is 20 - 50 wt%, for example, it can be 20 wt%, 24 wt%, 27 wt%, 30 wt%, 35 wt%, 37 wt%, 40 wt%, 44 wt%, 47 wt%, or 50 wt%, etc., but is not limited to the listed values, and other unlisted values within this range are equally applicable.
[0038] Preferably, the material of the transparent panel layer includes any one of transparent PET, transparent ETFE or transparent PVDF, or a combination of at least two of them. Taking transparent PET as an example, the thickness is 0.1 to 0.5 mm, such as 0.1 mm, 0.12 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm or 0.5 mm, etc., but is not limited to the listed values, and other values not listed within the range are also applicable.
[0039] Preferably, the rear assembly further comprises a third adhesive layer, a fourth adhesive layer and a backplane layer; the honeycomb composite material layer is arranged between the third adhesive layer and the fourth adhesive layer, and is bonded to the solar cell sheet and the backplane layer respectively through the third adhesive layer and the fourth adhesive layer.
[0040] In the present invention, the third adhesive layer and the fourth adhesive layer may be made of opaque material.
[0041] Preferably, the thickness of the first transparent adhesive layer, the second transparent adhesive layer, the third adhesive layer and the fourth adhesive layer are each independently 0.2 to 0.6 m, for example, 0.2 mm, 0.4 mm, 0.43 mm, 0.45 mm, 0.47 mm, 0.49 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm or 0.6 mm, but are not limited to the listed values, and other values not listed within the range are also applicable.
[0042] Preferably, the unit area weight of the first transparent adhesive layer, the second transparent adhesive layer, the third adhesive layer and the fourth adhesive layer is independently 200-600 g / m 2 , for example, it can be 200g / m 2 , 245g / m 2 , 289g / m 2 , 334g / m 2 , 378g / m 2 , 423g / m 2 , 467g / m 2 , 512g / m 2 , 556g / m 2 or 600g / m 2 The above values are not limited to the above values, and other values not listed in the above values are also applicable.
[0043] Preferably, the material of the backplane layer includes any one or a combination of at least two of TPT (a back film composed of a PVF polyvinyl fluoride film - a PET polyester film - a PVF three - layer film), FFC (a fluororesin coating - a PET substrate - a fluororesin coating), or PET (polyethylene terephthalate). Typical but non - limiting combinations are the combination of TPT and FFC, the combination of PET and FFC, and the combination of TPT and PET.
[0044] Preferably, the thickness of the backplane layer is 0.2 - 0.4 mm. For example, it can be 0.2 mm, 0.23 mm, 0.25 mm, 0.27 mm, 0.29 mm, 0.32 mm, 0.34 mm, 0.36 mm, 0.38 mm, or 0.4 mm, etc., but is not limited to the listed values, and other unlisted values within this range are equally applicable.
[0045] The function of the backplane layer of the present invention is to protect the photovoltaic module, preventing water and scratches.
[0046] The present invention has no special requirements for the matrix containing epoxy resin liquid phase in the epoxy resin prepreg layer and the transparent epoxy resin prepreg layer, and the epoxy resin liquid phase composition well - known to those skilled in the art can be used.
[0047] In a second aspect, the present invention provides a method for preparing the lightweight and high - rigidity photovoltaic module described in the first aspect. The preparation method includes: laying up in sequence according to each layer, and successively performing pressing and cooling to prepare a lightweight and high - rigidity photovoltaic module.
[0048] The preparation method of the lightweight and high - rigidity photovoltaic module provided in the second aspect of the present invention only needs simple laying up, pressing, and cooling to obtain a lightweight and high - rigidity photovoltaic module, and has broad application prospects.
[0049] Preferably, the pressing includes pressing by a laminator or pressing by an autoclave.
[0050] Preferably, the temperature of the laminator pressing is 130 - 180 °C. For example, it can be 130 °C, 136 °C, 142 °C, 147 °C, 153 °C, 158 °C, 164 °C, 169 °C, 175 °C, or 180 °C, etc., but is not limited to the listed values, and other unlisted values within this range are equally applicable.
[0051] It should be noted that in the present invention, the temperature of the laminator pressing not only plays the role of lamination but also plays the role of epoxy resin curing. Preferably, controlling the temperature of the laminator pressing within the above range can better improve the lamination and epoxy resin curing effects, and ultimately improve the high - temperature deformation resistance and delamination resistance of the photovoltaic module.
[0052] Preferably, the pressing time of the laminator is 10 - 50 min, for example, it can be 10 min, 15 min, 19 min, 24 min, 28 min, 33 min, 37 min, 42 min, 46 min or 50 min, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0053] Preferably, the pressing pressure of the laminator is 20 - 50 kPa, for example, it can be 20 kPa, 24 kPa, 27 kPa, 30 kPa, 34 kPa, 37 kPa, 40 kPa, 44 kPa, 47 kPa or 50 kPa, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.
[0054] Preferably, the preparation method further includes: sealing the edges of the cooled component with a sealant to obtain the lightweight high - rigidity photovoltaic component.
[0055] In the present invention, it is preferred to seal the edges of the finished product with a sealant to prevent water vapor from entering the interior of the component and damaging the adhesive layer.
[0056] The present invention has no special restrictions on the sealant in the above process, and any material well - known to those skilled in the art that can be used as a sealant can be adopted, and it can also be adjusted according to the actual process. For example, it can be silicone, etc.
[0057] Preferably, the preparation method further includes: first, arranging bonding strips on the four - week edges of the upper and lower surfaces of the honeycomb core layer, and then laminating and laying the honeycomb core layer and the reticulated thermoplastic adhesive film.
[0058] Since the reticulated thermoplastic adhesive film layer of the present invention has a reticulated structure, in order to avoid poor bonding effect with the periphery of the honeycomb core layer, it is preferred to arrange bonding strips on the four - week surface between the interfaces of the honeycomb core layer and the reticulated thermoplastic adhesive film layer to improve the bonding effect and enhance the edge delamination resistance.
[0059] In a third aspect, the present invention provides an application of the lightweight high - rigidity photovoltaic component described in the first aspect in the field of automobiles or new energy.
[0060] The lightweight high - rigidity photovoltaic component provided by the present invention, due to its light weight, high rigidity, difficulty in delamination and excellent high - temperature deformation resistance, can be preferably applied in the fields of automobiles, color - coated steel tiles or new energy.
[0061] Compared with the prior art, the present invention has at least the following beneficial effects:
[0062] (1) By combining the technology of thermosetting and thermoplastic adhesives, the lightweight high - rigidity photovoltaic component provided by the present invention can improve the high - temperature deformation resistance and delamination resistance of the photovoltaic component on the basis of using a honeycomb core layer, and improve the durability of the lightweight rigid photovoltaic component;
[0063] (2) The lightweight and high-rigidity photovoltaic module provided by the present invention has a weight per unit area of 3.6 kg / m 2 or less. On this basis, the sinking distance under a 3 kg weight block at 70 °C for 30 min is within 20 mm, and the honeycomb core layer and its adjacent layers can resist a tensile force of more than 80 N;
[0064] (3) The lightweight and high-rigidity photovoltaic module provided by the present invention can be widely applied in new energy application fields such as vehicle-mounted photovoltaic modules and color steel tile roofs, and has broad application prospects. Description of the Drawings
[0065] Figure 1 is a schematic diagram of the lightweight and high-rigidity photovoltaic module provided in Embodiment 1 of the present invention.
[0066] Figure 2 is a schematic diagram of the honeycomb composite layer in the lightweight and high-rigidity photovoltaic module provided in Embodiment 1 of the present invention.
[0067] Figure 3 is a distribution diagram of the surface of the honeycomb core layer in the honeycomb composite layer of the lightweight and high-rigidity photovoltaic module provided in Embodiment 1 of the present invention in contact with the mesh thermoplastic adhesive film layer and the epoxy resin prepreg layer.
[0068] Figure 4 is a top view of the bonding strip in contact with the honeycomb core layer in the honeycomb composite layer of the lightweight and high-rigidity photovoltaic module provided in Embodiment 1 of the present invention.
[0069] Figure 5 is a side view of the bonding strip in contact with the honeycomb core layer in the honeycomb composite layer of the lightweight and high-rigidity photovoltaic module provided in Embodiment 1 of the present invention.
[0070] In the figure, 1 - solar cell; 2 - front assembly; 21 - first transparent adhesive layer; 22 - transparent epoxy resin prepreg layer; 23 - second transparent adhesive layer; 24 - transparent panel layer; 3 - rear assembly; 31 - third adhesive layer; 32 - first epoxy resin prepreg layer; 33 - first mesh thermoplastic adhesive film layer; 34 - honeycomb core layer; 35 - second mesh thermoplastic adhesive film layer; 36 - second epoxy resin prepreg layer; 37 - fourth adhesive layer; 38 - back panel layer; 39 - bonding strip. Detailed Embodiments
[0071] To facilitate the understanding of the present invention, the following embodiments are listed. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be regarded as specific limitations on the present invention.
[0072] It should be understood that in the description of the present invention, the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.
[0073] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "set", "connected", "connected to" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific circumstances.
[0074] Embodiment 1
[0075] This embodiment provides a lightweight and high-rigidity photovoltaic module. Refer to Figure 1 , the manufacturing size of the lightweight and high-rigidity photovoltaic module is 600mm×300mm, and specifically includes a solar cell 1, a front assembly 2 provided in front of the solar cell 1, and a rear assembly 3 provided behind the solar cell 1.
[0076] In the direction away from the solar cell 1 from the solar cell 1, the front assembly 2 includes a first transparent adhesive layer 21 (EVA layer, 400g / m 2 , 0.4mm, grade F406PS, manufacturer Hangzhou Foster), a transparent epoxy resin prepreg layer 22 (200g / m 2 , the reinforcing body is glass fiber, and the content of epoxy resin is 30%, epoxy resin grade Shenzhen Kangda Electronic Materials WD3182), a second transparent adhesive layer 23 (EVA layer, 400g / m 2 , 0.4mm, grade F406PS, manufacturer Hangzhou Foster) and a transparent panel layer 24 (transparent PET, thickness 0.2mm).
[0077] The rear assembly 3 includes the honeycomb composite layer. The rear assembly 3 further includes a third adhesive layer 31 (EVA layer, 400 g / m 2 , 0.4 mm, grade F406PS, manufacturer is Hangzhou Foster), a fourth adhesive layer 37 (EVA layer, 400 g / m 2 , 0.4 mm, grade F406PS, manufacturer is Hangzhou Foster) and a backsheet layer 38 (FFC fluorine-containing coating backsheet, grade FFC-JW310, manufacturer is Suzhou Zhonglai Co., Ltd., thickness is 0.3 mm); the honeycomb composite layer is disposed between the third adhesive layer 31 and the fourth adhesive layer 37, and is adhesively bonded to the solar cell 1 and the backsheet layer 38 through the third adhesive layer 31 and the fourth adhesive layer 37 respectively.
[0078] See Figure 2 , the honeycomb composite layer includes a honeycomb core layer 34 (manufacturer is Foshan Shunde Huiyu Honeycomb Materials Co., Ltd.) and a net-shaped thermoplastic adhesive film layer (EVA, 400 g / m 2 , 0.4 mm, grade F406PS, manufacturer is Hangzhou Foster) and an epoxy resin prepreg layer (i.e., the honeycomb composite layer includes, in sequence, a first epoxy resin prepreg layer 32, a first net-shaped thermoplastic adhesive film layer 33, a honeycomb core layer 34, a second net-shaped thermoplastic adhesive film layer 35 and a second epoxy resin prepreg layer 36) stacked on both sides of the honeycomb core layer 34; See Figure 3 , the net-shaped holes of the net-shaped thermoplastic adhesive film layer are filled with epoxy resin prepreg, and the epoxy resin prepreg penetrates through the net-shaped holes of the net-shaped thermoplastic adhesive film layer and contacts the honeycomb core layer 34. Wherein the honeycomb core is an aluminum honeycomb, the thickness of the honeycomb core layer 34 is 3 mm, the side length is 3 mm, and the wall thickness is 0.05 mm; the thickness of the net-shaped thermoplastic adhesive film layer is 0.4 mm, the unit area weight is 400 g / m 2 , the single-hole area is 100 mm 2 , the hole area ratio is 50%, the thickness of the epoxy resin prepreg layer is 0.2 mm, the unit area weight is 200 g / m 2 , the content of epoxy resin is 35 wt%, the reinforcing body is glass fiber, and the epoxy resin grade is Shenzhen Kangda Electronic Materials WD3182.
[0079] At the junction of the honeycomb core layer 34 and the net-shaped thermoplastic adhesive film layer, the honeycomb composite layer further includes an adhesive strip 39 disposed around the surface between the junctions, and the adhesive strip 39 covers the four sides of the honeycomb core layer 34. The width of the adhesive strip 39 is 18 mm, and the material is ethylene-vinyl acetate copolymer (400 g / m 2 , 0.4 mm, grade F406PS, manufacturer is Hangzhou Foster).
[0080] This embodiment also provides a method for preparing a lightweight and high-rigidity photovoltaic module. The preparation method includes: laminating in the above-mentioned order of each layer, and before laminating the honeycomb core layer and the mesh thermoplastic film layer, using EVA (400 g / m 2 , with the brand number F406PS and the manufacturer being Hangzhou Foster) to set a bonding strip around the upper and lower surfaces of the honeycomb core layer, and pressing it for 40 minutes at 130 °C and 30 kPa by a laminator, then cooling, and sealing the edges of the cooled module with a sealant (silicone, with the brand number TT600W and the manufacturer being Suzhou Datong New Materials) to obtain the lightweight and high-rigidity photovoltaic module.
[0081] In the test of the ability of the photovoltaic module obtained by the present invention to resist high-temperature deformation, the sinking distance is only 18.5 mm. In the test of the delamination resistance ability, the tensile force is tolerated. Due to the setting of the bonding strip, the tolerated tensile force is above 90 N, and the grammage per unit area is 3.5642 kg / m 2 .
[0082] On the basis of the same method in Example 1, the solar cell is replaced by two wires with a distance of 10 mm and a length of 200 mm. Among them, 150 mm is placed inside the module and 50 mm is placed outside the module, and the other material structures remain unchanged, and it is made according to the preparation method of Example 1. Then the periphery of the manufactured module is sealed with silicone, and the two wires are exposed. Use a 1000V insulation megohmmeter to test the resistance between the two wires of the product made by the above method, and the displayed resistance is between 1000 MΩ and ∞. Then immerse the above product in water, after soaking for 48 h, take out the product, use a hot air gun to dry the moisture of the wires and the surrounding area, and use a 1000V insulation megohmmeter to measure the resistance between the two wires again. The result shows that the resistance is still between 1000 MΩ and ∞. This experimental result shows that after sealing the edge with silicone, water vapor can be effectively blocked from entering the inside of the module.
[0083] Example 2
[0084] This embodiment provides a lightweight and high-rigidity photovoltaic module. The production size of the lightweight and high-rigidity photovoltaic module is 1195 mm × 540 mm, and it specifically includes a solar cell, a front assembly arranged in front of the solar cell, and a rear assembly arranged behind the solar cell.
[0085] In the direction away from the solar cell from the solar cell, the front assembly includes a first transparent adhesive layer (EVA layer, 600 g / m 2 , 0.6 mm, with the brand number F406PS and the manufacturer being Hangzhou Foster), a transparent epoxy resin prepreg layer (200 g / m 2, the reinforcing body is glass fiber, wherein the content of epoxy resin is 35%, and the epoxy resin grade is Shenzhen Kangda Electronic Materials WD3182), the second transparent adhesive layer (EVA layer, 200 g / m 2 , 0.2 mm, the grade is F406PS, and the manufacturer is Hangzhou Foster) and the transparent panel layer (transparent PET, 0.3 mm).
[0086] The honeycomb composite layer is included in the rear assembly. The rear assembly further includes a third adhesive layer (EVA layer, 600 g / m 2 , 0.6 mm, the grade is F406PS, and the manufacturer is Hangzhou Foster), a fourth adhesive layer (EVA layer, 200 g / m 2 , 0.2 mm, the grade is F406PS, and the manufacturer is Hangzhou Foster) and the back plate layer (TPT, with a thickness of 0.35 mm); the honeycomb composite layer is disposed between the third adhesive layer and the fourth adhesive layer, and is bonded to the solar cell and the back plate layer through the third adhesive layer and the fourth adhesive layer respectively.
[0087] The honeycomb composite layer includes a honeycomb core layer (the manufacturer is Foshan Shunde Huiyu Honeycomb Materials Co., Ltd.) and a reticulated thermoplastic adhesive film layer (TPU polyurethane, the grade is TBK115, the manufacturer is Shanghai Hengning, 400 g / m 2 , 0.4 mm) and an epoxy resin prepreg layer; the reticulated holes of the reticulated thermoplastic adhesive film layer are filled with epoxy resin prepreg, and the epoxy resin prepreg penetrates through the reticulated holes of the reticulated thermoplastic adhesive film layer and contacts the honeycomb core layer. Wherein the honeycomb core is an aramid honeycomb, the height of the honeycomb core layer is 5 mm, the side length is 5 mm, and the wall thickness is 0.1 mm; the thickness of the reticulated thermoplastic adhesive film layer is 0.6 mm, and the unit area weight is 600 g / m 2 , the single-hole area is 1000 mm 2 , the proportion of the hole area is 60%; the thickness of the epoxy resin prepreg layer is 0.5 mm, and the unit area weight is 500 g / m 2 , the content of epoxy resin is 20 wt%, the reinforcing body is carbon fiber, and the epoxy resin grade is Shenzhen Kangda Electronic Materials WD3182.
[0088] At the junction of the honeycomb core layer and the reticulated thermoplastic adhesive film layer, the honeycomb composite layer further includes a bonding strip disposed around the surface between the junctions, and the bonding strip covers the four sides of the honeycomb core layer. The width of the bonding strip is 15 mm, and the material is ethylene-vinyl acetate copolymer (400 g / m 2 , 0.5 mm, the grade is F406PS, and the manufacturer is Hangzhou Foster).
[0089] This embodiment also provides a method for preparing a lightweight and high-rigidity photovoltaic module. The preparation method includes: laying in the above-mentioned layer sequence, and before laying the honeycomb core layer and the mesh thermoplastic film layer, using EVA (400 g / m 2 , with the brand number F406PS and the manufacturer being Hangzhou Foster) to set a bonding strip around the upper and lower surfaces of the honeycomb core layer, and pressing it for 15 minutes at 150 °C and 40 kPa by a laminator, then cooling, and sealing the edges of the cooled module with a sealant (silicone, with the brand number TT600W and the manufacturer being Suzhou Datong New Materials) to obtain the lightweight and high-rigidity photovoltaic module.
[0090] In the test of the high-temperature deformation resistance of the photovoltaic module obtained by the present invention, the sinking distance is only 18.9 mm. In the delamination resistance test, the tensile strength is tolerated. Due to the setting of the bonding strip, the tolerated tensile strength is above 90 N, and the grammage per unit area is 3.5803 kg / m 2 .
[0091] Example 3
[0092] This embodiment provides a lightweight and high-rigidity photovoltaic module. Except that the photovoltaic module does not have a bonding strip around it, the rest are the same as in Example 1 and will not be elaborated here.
[0093] In the test of the high-temperature deformation resistance of the photovoltaic module obtained by the present invention, the sinking distance is only 18.5 mm. In the delamination resistance test, the tolerated tensile strength is greater than 85 N but less than 90 N.
[0094] Example 4
[0095] This embodiment provides a lightweight and high-rigidity photovoltaic module. Except that the single-hole area of the holes in the mesh thermoplastic film layer is 100 mm 2 , but adjusting the center distance of the holes to make the hole area ratio 28%, the rest are the same as in Example 1 and will not be elaborated here.
[0096] In the high-temperature deformation resistance test of this embodiment, during the high-temperature deformation resistance test, the sinking distance is 53.1 mm, and the high-temperature resistance ability is significantly decreased compared with Example 1.
[0097] Example 5
[0098] This embodiment provides a lightweight and high-rigidity photovoltaic module. Except that the single-hole area of the holes in the mesh thermoplastic film layer is 100 mm 2 , but adjusting the center distance of the holes to make the hole area ratio 75%, the rest are the same as in Example 1 and will not be elaborated here.
[0099] In this embodiment, the test result of the delamination resistance shows that the tensile tolerance is only 20 N, and the delamination resistance is significantly decreased compared with that in Embodiment 1.
[0100] Embodiment 6
[0101] This embodiment provides a lightweight and high-rigidity photovoltaic module. Except that the lamination temperature in the preparation method is 110 °C, the rest are the same as those in Embodiment 1 and will not be described in detail here.
[0102] In this embodiment, due to the relatively low lamination temperature, the lamination effect is relatively poor compared with that in Embodiment 1, and it is easier to obtain qualified photovoltaic module products in Embodiment 1.
[0103] Embodiment 7
[0104] This embodiment provides a lightweight and high-rigidity photovoltaic module. Except that the lamination temperature in the preparation method is 190 °C, the rest are the same as those in Embodiment 1 and will not be described in detail here.
[0105] In this embodiment, due to the relatively high lamination temperature, although the lamination effect is acceptable, it exceeds the curing temperature range of the epoxy resin, and it is easier to obtain qualified photovoltaic module products in Embodiment 1.
[0106] Embodiment 8
[0107] This embodiment provides a lightweight and high-rigidity photovoltaic module. Except that the front module does not have a transparent epoxy resin prepreg layer and a second transparent adhesive layer, the rest are the same as those in Embodiment 1 and will not be described in detail here.
[0108] Compared with Embodiment 8, in Embodiment 1, the protection of the battery cells is enhanced, and the high-temperature anti-deformation ability is higher. Thus, it is shown that the present invention preferably adds a transparent epoxy resin prepreg layer in the front module, which can better protect the battery cells and improve the stiffness and high-temperature anti-deformation ability of the photovoltaic module.
[0109] Comparative Example 1
[0110] This comparative example provides a lightweight and high-rigidity photovoltaic module. Except that the honeycomb composite layer includes a honeycomb core layer and a net-shaped epoxy resin prepreg layer and a thermoplastic adhesive film layer that are sequentially laminated on both sides of the honeycomb core layer, the other specific materials are the same as those in Embodiment 1 and will not be described in detail here.
[0111] Specifically, the honeycomb composite layer includes a honeycomb core layer (manufacturer: Foshan Shunde Huiyu Honeycomb Materials Co., Ltd.) and a net-shaped epoxy resin prepreg layer (200 g / ㎡, 0.4 mm) and a thermoplastic adhesive film layer (EVA layer, 400 g / m2 (0.4 mm, grade F406PS, manufacturer: Hangzhou Foster); the mesh epoxy resin prepreg layer is filled with a thermoplastic film, and the thermoplastic film layer is in contact with the honeycomb core layer through the mesh epoxy resin prepreg. The honeycomb core is an aluminum honeycomb with a thickness of 3 mm, a side length of 3 mm, and a wall thickness of 0.05 mm; the thickness of the thermoplastic film layer is 0.4 mm, and the unit area weight is 400 g / m 2 ; the thickness of the mesh epoxy resin prepreg is 0.4 mm, and the unit area weight is 200 g / m 2 , and the content of epoxy resin is 35 wt%.
[0112] The mesh epoxy resin prepreg layer (200 g / m 2 , with a thickness of 0.4 mm, a hole size of 4 mm × 4 mm, and a hole center spacing of 5.7 mm, so that the contact area between the epoxy resin prepreg layer, the thermoplastic film layer and the honeycomb core layer is the same as that in Example 1.
[0113] In the preparation process of the mesh epoxy resin prepreg layer in this comparative example, due to the use of a mesh structure, it is difficult to fully coat the material during coating. The sinking distance in the high-temperature deformation resistance test of the obtained photovoltaic module is 35.2 mm, and the tensile resistance in the delamination resistance test is 60 N. That is, compared with the photovoltaic module in Example 1, its high-temperature deformation resistance and delamination resistance both decrease.
[0114] Comparative Example 2
[0115] This comparative example provides a lightweight and high-rigidity photovoltaic module. Except that the mesh thermoplastic film layer is replaced with a thermoplastic film layer without a mesh hole structure, the rest are the same as in Example 1 and will not be elaborated here.
[0116] The obtained photovoltaic module in this comparative example has poor high-temperature resistance, and the sinking distance in the high-temperature deformation resistance test is 85 mm.
[0117] Comparative Example 3
[0118] This comparative example provides a lightweight and high-rigidity photovoltaic module. Except that the epoxy resin prepreg layer is not provided, the rest are the same as in Example 1 and will not be elaborated here.
[0119] The lightweight and high-rigidity photovoltaic module provided in this comparative example has poor stiffness and is prone to deformation at room temperature. The result of the high-temperature deformation resistance test is collapse.
[0120] Comparative Example 4
[0121] This comparative example provides a lightweight and highly rigid photovoltaic module. Except for not providing a mesh thermoplastic film layer, the rest are the same as those in Example 1 and will not be elaborated here.
[0122] The delamination resistance test result of this comparative example is only 10 N, indicating poor delamination resistance ability.
[0123] Comparative Example 5
[0124] This comparative example provides a photovoltaic module. The lightweight and highly rigid photovoltaic module uses a common glass encapsulated module. Specifically, it is made of a 3.2 mm thick photovoltaic glass, a 0.4 mm thick transparent EVA layer (400 g / m 2 , with the brand number F406PS and the manufacturer being Hangzhou Foster), solar cells, a 0.4 mm thick transparent EVA layer (400 g / m 2 , with the brand number F406PS and the manufacturer being Hangzhou Foster), and a 0.3 mm thick backsheet (FFC fluorine-containing coating backsheet, with the brand number FFC-JW310 and the manufacturer being Suzhou Zhonglai Co., Ltd.) with the same size as that in Example 1.
[0125] The gram weight per unit area in Example 1 of the present invention is 3.5642 kg / m 2 , while the gram weight per unit area in Comparative Example 5 is as high as 9.3755 kg / m 2 , indicating that the photovoltaic module obtained by the present invention is lighter and can be applied to scenarios with lightweight requirements.
[0126] Test method:
[0127] Quality test: Conduct weight tests on the photovoltaic modules obtained in the above examples and comparative examples, and calculate the gram weight per unit area according to the size and area. Five specimens are tested for each example and comparative example, and the average value of the measured values is used as the gram weight per unit area of the photovoltaic module.
[0128] High-temperature deformation resistance ability: Place the photovoltaic modules obtained in the above examples and comparative examples in a 70 °C high-temperature oven. Set brackets at the two 300 mm short sides and a 3 kg weight pressing block at the center position, and let it stand for 30 minutes. Measure the sinking distance to characterize the high-temperature deformation resistance ability of the photovoltaic module. Five specimens are tested for each example and comparative example, and the average value of the measured values is recorded as the high-temperature deformation resistance ability.
[0129] Delamination resistance ability: Clamp the combined layer made of the first layer to the backsheet layer on the back of the honeycomb core (taking Example 1 as an example: including a mesh thermoplastic film layer, an epoxy resin prepreg layer, a fourth adhesive layer, and a backsheet layer). The width of the combined layer is 20 mm, apply a tensile force perpendicular to the panel upward, and measure the tensile force when the combined layer starts to peel and delaminate from the honeycomb core. The unit is N. Five specimens are tested for each example and comparative example, and the average value of the measured values is recorded as the delamination resistance ability.
[0130] As can be seen from the above examples and comparative examples:
[0131] (1) From Examples 1 to 2, it can be seen that the lightweight and high-rigidity photovoltaic module provided by the present invention has the advantage of low grammage per unit area, only within 3.6 kg / m 2 or less, and has strong resistance to high-temperature deformation. The sinking distance under a 3 kg weight block at 70 °C for 30 min is within 20 mm, and the honeycomb core layer and its adjacent layer can resist a tensile force of more than 90 N, solving the problems of poor high-temperature deformation resistance and easy delamination of the honeycomb core layer in existing lightweight and high-rigidity photovoltaic modules.
[0132] (2) The delamination resistance in Examples 1 to 2 of the present invention is more than 90 N, and the delamination resistance in Example 3 is 85 N but less than 90 N. It can be seen that setting a bonding strip around the junction of the honeycomb core layer and the mesh thermoplastic film layer can further improve the delamination resistance of the photovoltaic module.
[0133] (3) The pore area ratio of the pores in the mesh thermoplastic film layer in Example 1 is 50%. Compared with the pore area ratios in Examples 4 to 5 being relatively smaller or larger respectively, the high-temperature deformation resistance in Example 1 is less than 20 mm, and the delamination resistance is 90 N. In Example 4, the high-temperature deformation resistance is as high as 53.1 mm, and in Example 5, the delamination resistance is only 20 N. This shows that the present invention preferably controls the pore area ratio of the pores in the mesh thermoplastic film layer within a reasonable range, which can better realize the synergistic effect between the mesh thermoplastic film layer and the epoxy resin prepreg, and improve the high-temperature deformation resistance and delamination resistance of the lightweight and high-rigidity photovoltaic module.
[0134] (4) From Examples 1 and 6 to 7, it can be seen that the lamination temperature in Example 1 is 130 °C. Compared with the lamination temperatures in Examples 6 to 7 being 110 °C and 190 °C respectively, the high-temperature deformation resistance in Example 1 is less than 20 mm, while the lamination in Examples 6 to 7 is unqualified. This shows that the lamination temperature in the present invention not only plays the role of lamination, but also has the effect of further curing the epoxy resin. By preferably adopting a suitable lamination temperature, the high-temperature deformation resistance and delamination resistance of the photovoltaic module can be further improved.
[0135] (5) It can be seen from the comprehensive Example 1 and Comparative Examples 1-5 that in Comparative Example 1, the combination of a mesh epoxy resin prepreg layer and a thermoplastic film layer is adopted. Although it is also a concept of combining thermosetting and thermoplastic, the researchers found in this study that there are problems such as incomplete impregnation of the open-hole glass fiber or carbon fiber cloth during the impregnation of epoxy resin and high cost in the photovoltaic module with this structure. Moreover, there is also a defect that the thermoplastic glue will penetrate through the gaps of fibers such as glass fiber or carbon fiber and directly contact the honeycomb core, resulting in easy deformation of the module at high temperature; in Comparative Example 2, a thermoplastic film layer without a mesh hole structure is provided, resulting in that only the thermoplastic film contacts the honeycomb core layer. Since the thermoplastic film is extremely easy to deform at high temperature, the photovoltaic module has a large deformation and the high-temperature deformation resistance is significantly reduced; in Comparative Example 3, the epoxy resin prepreg layer is not provided, which is similar to Comparative Example 2, and the high-temperature deformation resistance is significantly reduced; in Comparative Example 4, the mesh thermoplastic film layer is not provided, and the epoxy resin prepreg layer is directly connected to the honeycomb core layer. Epoxy resin is a thermosetting glue, and its bonding strength with the honeycomb core layer is low, resulting in a significant reduction in delamination resistance; in Comparative Example 5, traditional glass encapsulation is adopted, and the gram weight is significantly increased compared with Example 1 under the same size, and the lightweight effect cannot be achieved. The photovoltaic module provided by the present invention is 62% lighter than the traditional glass-encapsulated photovoltaic module.
[0136] The present invention illustrates the detailed features of the present invention through the above-mentioned embodiments, but the present invention is not limited to the above-mentioned detailed features, that is, it does not mean that the present invention must rely on the above-mentioned detailed features to be implemented. Those skilled in the art should understand that any improvement of the present invention, the equivalent replacement of the technical features selected by the present invention, the addition of auxiliary technical features, the selection of specific methods, etc. all fall within the protection scope and the disclosure scope of the present invention.
Claims
1. A lightweight and high-rigidity photovoltaic module, characterized in that: The lightweight and high-rigidity photovoltaic assembly includes a honeycomb composite material layer; The honeycomb composite material layer comprises a honeycomb core layer and a mesh thermoplastic film layer and an epoxy resin prepreg layer sequentially stacked on both sides of the honeycomb core layer; The mesh holes of the mesh thermoplastic film layer are filled with epoxy resin prepreg, and the epoxy resin prepreg penetrates through the mesh holes of the mesh thermoplastic film layer and connects with the honeycomb core layer.
2. The lightweight and high-rigidity photovoltaic module according to claim 1, characterized in that: At the junction of the honeycomb core layer and the mesh thermoplastic film layer, the honeycomb composite material layer further includes adhesive strips arranged around the surface between the junctions, and the adhesive strips cover the four sides of the honeycomb core layer; Preferably, the width of the adhesive strip is 15 to 25 mm.
3. The lightweight and high-rigidity photovoltaic module according to claim 1 or 2, characterized in that: The height of the honeycomb core is 2 to 10 mm; Preferably, the side length of the honeycomb core is 1 to 5 mm; Preferably, the wall thickness of the honeycomb core is 0.02-0.1 mm.
4. The lightweight and high-rigidity photovoltaic module according to any one of claims 1 to 3, characterized in that: The thickness of the mesh thermoplastic film layer is 0.2 to 0.6 mm; Preferably, the weight per unit area of the mesh thermoplastic film layer is 200 g / m 2 ~600g / m 2 ; Preferably, the area of the holes in the mesh thermoplastic film layer accounts for 30% to 70%; Preferably, the single hole area of the holes in the mesh thermoplastic film layer is 10 to 1000 mm 2 .
5. The lightweight and high-rigidity photovoltaic module according to any one of claims 1 to 4, characterized in that: The epoxy resin prepreg in the epoxy resin prepreg layer includes glass fiber epoxy resin prepreg and / or carbon fiber epoxy resin prepreg; Preferably, the thickness of the epoxy resin prepreg layer is 0.2 to 0.5 mm; Preferably, the epoxy resin prepreg layer has a unit area weight of 100 to 500 g / m 2 ; Preferably, the content of epoxy resin in the epoxy resin prepreg layer is 20-50 wt %.
6. The lightweight and high-rigidity photovoltaic module according to any one of claims 1 to 5, characterized in that: The light-weight and high-rigidity photovoltaic assembly comprises a solar cell, a front assembly arranged in front of the solar cell, and a rear assembly arranged in rear of the solar cell; the rear assembly comprises the honeycomb composite material layer.
7. The lightweight and high-rigidity photovoltaic module according to claim 6, characterized in that: From the solar cell sheet to the direction away from the solar cell sheet, the front assembly comprises a first transparent adhesive layer, a transparent epoxy resin prepreg layer, a second transparent adhesive layer and a transparent panel layer stacked in sequence; The rear assembly also includes a third adhesive layer, a fourth adhesive layer and a backplane layer; the honeycomb composite material layer is arranged between the third adhesive layer and the fourth adhesive layer, and is bonded to the solar cell sheet and the backplane layer respectively through the third adhesive layer and the fourth adhesive layer.
8. A method for preparing a lightweight and high-rigidity photovoltaic module according to any one of claims 1 to 7, the method comprising: The layers are stacked in sequence and pressed and cooled in turn to produce lightweight and high-rigidity photovoltaic modules.
9. The preparation method according to claim 9, characterized in that: The pressing comprises laminator pressing or autoclave pressing; Preferably, the pressing temperature of the laminator is 130-180°C; Preferably, the laminating machine presses for 10 to 50 minutes; Preferably, the pressing pressure of the laminator is 20 to 50 kPa; Preferably, the preparation method further comprises: sealing the cooled component with a sealant to obtain the lightweight and high-rigidity photovoltaic component.
10. Use of the lightweight and high-rigidity photovoltaic module according to any one of claims 1 to 7 in the field of automobiles or new energy.
Citation Information
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