BC battery string and string forming method and equipment thereof

Abstract

The invention relates to the technical field of photovoltaic module manufacturing, and particularly discloses a BC battery string and a string forming method and equipment thereof. The BC battery string forming method comprises the following steps: laying an adhesive film on a string forming platform; a plurality of adsorption holes used for adsorbing and fixing adhesive films are formed in the bunching platform; n + 2 solder strip groups are laid on the adhesive film in the length direction, and solder strips in every two adjacent solder strip groups are alternately staggered in the width direction of the adhesive film; wherein N is an integer greater than or equal to 1; n + 1 battery pieces are laid in the length direction of the adhesive film, and every two adjacent battery pieces are connected in series through a welding strip set. According to the BC battery string and the string forming method and equipment thereof, the structure and the string forming process of the battery string can be simplified, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic module manufacturing, and particularly to a BC battery string, a method and equipment for stringing the same. Background Art

[0002] In the current BC battery string connection process, in order to prevent adjacent two battery wafers from colliding and breaking with each other, a relatively large gap is often reserved between adjacent two battery wafers, and this relatively large gap can be utilized to facilitate the cutting scissors to pass through the gap to cut the entire solder ribbon; in order to prevent white leakage at the gap position, it is necessary to lay a light-shielding strip for shielding; after stringing, it is also necessary to connect the solder ribbon and the corresponding battery wafer through welding to form an ohmic contact. However, when preparing a BC battery string in this way, not only is the battery string layout longer, which increases the area of the photovoltaic panel in vain and results in a low actual application area rate of the entire panel, but also the preparation process is cumbersome, resulting in low production efficiency. Summary of the Invention

[0003] The purpose of the present invention is to provide a BC battery string, a method and equipment for stringing the same, which can simplify the battery string structure and the stringing process and improve the production efficiency.

[0004] To achieve the above object, the present invention adopts the following technical solutions: A method for stringing a BC battery string includes the following steps: Lay a glue film on a stringing platform; a plurality of adsorption holes for adsorbing and fixing the glue film are opened on the stringing platform; Lay N + 2 solder ribbon groups along the length direction on the glue film, and the solder ribbons in adjacent two solder ribbon groups are alternately staggered along the width direction of the glue film; wherein, N is an integer greater than or equal to 1; Lay N + 1 battery wafers along the length direction of the glue film, and adjacent two battery wafers are connected in series through one solder ribbon group; wherein, the gap between adjacent two battery wafers tends to zero, or adjacent two battery wafers are partially stacked.

[0005] Preferably, the laying of the glue film on the stringing platform in the present invention includes: Provide a glue film placement fixture capable of moving up and down and rotating, and vacuum adsorption holes for adsorbing and fixing the glue film are opened on the placement surface of the glue film placement fixture; Pull the glue film released from the glue film roll to the placement surface of the glue film placement fixture, and adsorb and fix the glue film; Cut the glue film; Transfer the glue film to the stringing platform by moving the glue film placement fixture up and down and rotating.

[0006] Preferably, the fixture for placing the adhesive film is provided with at least two placing surfaces; both sides of the fixture for placing the adhesive film are provided with adhesive film rolls, and the adhesive films released by the two adhesive film rolls are alternately drawn onto the fixture for placing the adhesive film.

[0007] Preferably, laying N + 2 solder ribbon groups along the length direction on the adhesive film includes: Providing a solder ribbon placing fixture capable of moving up and down and rotating, the solder ribbon placing fixture having a plurality of splicing modules arranged side by side along the length direction of the solder ribbon, and the distance between two adjacent splicing modules being adjustable; vacuum suction grooves for adsorbing and fixing the solder ribbon are formed on the placing surfaces of the splicing modules. Drawing the solder ribbon onto the solder ribbon placing fixture and adsorbing and fixing the solder ribbon; Cutting the solder ribbon to obtain N + 2 solder ribbon groups; Adjusting the distance between the splicing modules to obtain N + 2 separated solder ribbon groups; By moving the solder ribbon placing fixture up and down and rotating, transporting the N + 2 separated solder ribbon groups to the adhesive film located on the series connection platform.

[0008] Preferably, before adjusting the distance between the splicing modules, disconnecting the adsorption and fixing of the odd - numbered or even - numbered splicing modules to each solder ribbon; After adjusting the distance between the splicing modules, restoring the adsorption and fixing of each splicing module to each solder ribbon.

[0009] Preferably, laying N + 2 solder ribbon groups along the length direction on the adhesive film includes: Providing a solder ribbon placing fixture capable of moving up and down and rotating, vacuum suction grooves for adsorbing and fixing the solder ribbon and a plurality of blanking ports being formed on the placing surface of the solder ribbon placing fixture; Drawing the solder ribbon onto the solder ribbon placing fixture and adsorbing and fixing the solder ribbon; Cutting the solder ribbon to obtain N + 2 solder ribbon groups, and the cut - off solder ribbon segments are discharged through the corresponding blanking ports; By moving the solder ribbon placing fixture up and down and rotating, transporting the N + 2 solder ribbon groups to the adhesive film located on the series connection platform.

[0010] Preferably, laying N + 1 solar cells along the length direction of the adhesive film includes: Arranging N + 1 solar cells so that the gap between two adjacent solar cells tends to zero or part of two adjacent solar cells are stacked; Transporting the arranged N + 1 solar cells to the series connection platform, and heating each solar cell before and / or during the transportation.

[0011] A BC cell string of the present invention includes N + 1 cell wafers, N + 2 solder ribbon groups and a glue film. The solder ribbons in each of the adjacent two solder ribbon groups are alternately staggered along the width direction of the glue film, and the same sides of the adjacent two cell wafers are connected in series through one solder ribbon group; wherein, N is an integer greater than or equal to 1; the gap between the adjacent two cell wafers tends to zero, or the adjacent two cell wafers are partially stacked.

[0012] Preferably, a protective film is filled in the gap of the stacking area between the adjacent two cell wafers.

[0013] A BC cell string forming device of the present invention is used to implement the above-mentioned forming method, and includes a forming platform, a conveying line for conveying the forming platform, and a film covering device, a solder ribbon laying device and a cell wafer laying device arranged in sequence along the conveying direction of the conveying line; a plurality of adsorption holes for adsorbing and fixing the glue film are formed on the forming platform; the film covering station can lay the glue film on the forming platform; the solder ribbon laying device can lay N + 2 solder ribbon groups on the forming platform; the cell wafer laying device can lay N + 1 cell wafers on the forming platform; wherein, N is an integer greater than or equal to 1.

[0014] Preferably, the film covering device includes a glue film placing fixture, a film pulling mechanism, a glue film cutting mechanism and a first driving mechanism; vacuum adsorption holes for adsorbing and fixing the glue film are formed on the placing surface of the glue film placing fixture; the film pulling mechanism can pull the glue film released from the glue film roll to the placing surface of the glue film placing fixture; the glue film cutting mechanism is used for cutting the glue film; the first driving mechanism drives the glue film placing fixture to move up and down and rotate, so as to transfer the glue film to the forming platform.

[0015] Preferably, the solder ribbon laying device includes a solder ribbon placing fixture, a ribbon pulling mechanism, a solder ribbon cutting mechanism, a distance adjusting mechanism and a second driving mechanism; The solder ribbon placing fixture has a plurality of splicing modules arranged side by side along the length direction of the solder ribbon, and the distance between the adjacent two splicing modules is adjustable; vacuum adsorption grooves for adsorbing and fixing the solder ribbon are formed on the placing surfaces of the splicing modules; The ribbon pulling mechanism can pull the solder ribbon released from the solder ribbon roll to the solder ribbon placing fixture; The solder ribbon cutting mechanism can cut the solder ribbon to obtain N + 2 solder ribbon groups; The distance adjusting mechanism can adjust the distance between the adjacent two splicing modules to obtain N + 2 separated solder ribbon groups; The second driving mechanism can drive the solder ribbon placing fixture to move up and down and rotate, so as to transfer the N + 2 separated solder ribbon groups to the forming platform.

[0016] Preferably, the solder tape laying device of the present invention includes a solder tape placement fixture, a tape pulling mechanism, a solder tape cutting mechanism, and a second driving mechanism; a vacuum adsorption groove for adsorbing and fixing the solder tape and a plurality of blanking ports are formed on the placement surface of the solder tape placement fixture; the tape pulling mechanism can pull the solder tape released from the solder tape roll to the placement surface of the solder tape placement fixture; the solder tape cutting mechanism can cut the solder tape to obtain N + 2 solder tape groups, and the cut solder tape segments are discharged through the corresponding blanking ports; the second driving mechanism can drive the solder tape placement fixture to move up and down and rotate to transfer the N + 2 solder tape groups to the stringing platform.

[0017] Preferably, the cell laying device of the present invention includes a cell placement platform and a handling mechanism, and the handling mechanism can transport N + 1 cells arranged on the cell placement platform to the stringing platform; a heating component for heating each cell is provided on the cell placement platform and / or the handling mechanism.

[0018] The beneficial effects of the present invention are as follows: 1. In the present invention, the gap between adjacent two cells tends to zero, or there is partial stacking between adjacent two cells, so there is no need to lay a light-shielding strip, saving the light-shielding strip laying process and improving the stringing efficiency.

[0019] 2. In the present invention, the welding process is omitted, improving the stringing efficiency.

[0020] 3. The length of the battery string of the present invention is reduced, which is beneficial to making the structure of the photovoltaic module compact and small, and the effective power generation area of the photovoltaic panel accounts for a large proportion. Description of the Drawings

[0021] Figure 1 is a flowchart of a method for stringing BC battery strings provided by the present invention.

[0022] Figure 2 is Figure 1 a flowchart of step S1 in

[0023] Figure 3 is Figure 1 a flowchart of an embodiment of step S2 in

[0024] Figure 4 is Figure 1 a flowchart of another embodiment of step S2 in

[0025] Figure 5 is Figure 1 a flowchart of step S3 in

[0026] Figure 6 is an exploded structural schematic diagram of an embodiment of a BC battery string provided by the present invention.

[0027] Figure 7 It is a schematic structural diagram of another embodiment of a BC battery string provided by the present invention.

[0028] Figure 8 It is Figure 7 an enlarged schematic diagram of part I in

[0029] Figure 9 It is a schematic structural diagram of a BC battery string series-making device provided by the present invention.

[0030] Figure 10 It is a partial schematic structural diagram of a BC battery string series-making device provided by the present invention. Specific Embodiments

[0031] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0032] Embodiment 1 As Figure 1 shown, this embodiment provides a method for forming a BC battery string, including the following steps S1 to S3.

[0033] S1: Lay a glue film on the series-making platform; wherein, a plurality of adsorption holes for adsorbing and fixing the glue film are provided on the series-making platform.

[0034] Specifically, in this step S1, laying the glue film on the series-making platform includes the following steps S11 to S14.

[0035] S11: Provide a glue film placement jig that can move up and down and rotate, and vacuum adsorption holes for adsorbing and fixing the glue film are provided on the placement surface of the glue film placement jig.

[0036] S12: Pull the glue film released from the glue film roll to the placement surface of the glue film placement jig, and adsorb and fix the glue film.

[0037] S13: Cut the glue film. Wherein, the glue film has viscosity in a molten state, and a film piece made of thermo-bonding or hot-melt material can be used; in this embodiment, the glue film can be a whole glue film or several glue strips.

[0038] S14: Rotate the glue film placement jig and transfer the glue film to the series-making platform.

[0039] As a preference of the present invention, the glue film placement jig can be provided with at least two placement surfaces; glue film rolls are provided on both sides of the glue film placement jig, and the glue films released from the two glue film rolls are alternately pulled onto the glue film placement jig, which speeds up the action rhythm and improves the film covering efficiency.

[0040] S2: Lay N + 2 solder ribbon groups along the length direction on the glue film, and the solder ribbons in adjacent two solder ribbon groups are alternately staggered along the width direction of the glue film; where N is an integer greater than or equal to 1. In one embodiment of step S2 of the present invention, laying N + 2 solder ribbon groups along the length direction on the glue film includes the following steps S21 to S25.

[0041] S21: Provide a solder ribbon placement jig that can move up and down and rotate. The solder ribbon placement jig has a plurality of splicing modules arranged side by side along the length direction of the solder ribbon, and the distance between adjacent two splicing modules is adjustable; vacuum adsorption grooves for adsorbing and fixing the solder ribbon are formed on the placement surfaces of the splicing modules.

[0042] S22: Pull the solder ribbon onto the solder ribbon placement jig and adsorb and fix the solder ribbon.

[0043] S23: Cut the solder ribbon to obtain N + 2 solder ribbon groups.

[0044] S24: Adjust the distance between the splicing modules to obtain N + 2 solder ribbon groups with separated distances.

[0045] S25: Through moving the solder ribbon placement jig up and down and rotating it, transfer the N + 2 solder ribbon groups with separated distances onto the glue film located on the stringing platform.

[0046] It should be noted that in the above step S23, each solder ribbon in the cut solder ribbon group is adsorbed and fixed on adjacent two splicing modules. Therefore, in the above step S24, before adjusting the distance between the splicing modules, disconnect the adsorption and fixation of each solder ribbon by the odd-numbered splicing module or the even-numbered splicing module to facilitate pulling the corresponding solder ribbon to move; after adjusting the distance between the splicing modules, restore the adsorption and fixation of each splicing module on each solder ribbon to prevent the solder ribbon from falling off during the process of rotating the solder ribbon placement jig.

[0047] In another embodiment of step S2 of the present invention, laying N + 2 solder ribbon groups along the length direction on the glue film includes the following steps S26 to S29.

[0048] S26: Provide a solder ribbon placement jig that can move up and down and rotate. Vacuum adsorption grooves for adsorbing and fixing the solder ribbon and a plurality of blanking ports are formed on the placement surface of the solder ribbon placement jig.

[0049] S27: Pull the solder ribbon onto the solder ribbon placement jig and adsorb and fix the solder ribbon.

[0050] S28: Cut the solder ribbon to obtain N + 2 solder ribbon groups, and the cut solder ribbon segments are discharged through the corresponding blanking ports.

[0051] S29: Transfer the N + 2 solder ribbon groups to the glue film on the series connection platform by moving the solder ribbon placement fixture up and down and rotating it.

[0052] This embodiment can eliminate the distance adjustment operation, thus avoiding the cumbersome action process that may be caused by distance separation. The waste rate of the solder ribbon is about 1%.

[0053] S3: Lay N + 1 solar cells along the length direction of the glue film, and connect adjacent two solar cells in series through a solder ribbon group; wherein, the gap between adjacent two solar cells tends to zero, or adjacent two solar cells partially overlap.

[0054] Specifically, in this step S3, laying N + 1 solar cells along the length direction of the glue film includes the following steps S31 - S32.

[0055] S31: Arrange the N + 1 solar cells so that the gap between adjacent two solar cells tends to zero, or adjacent two solar cells partially overlap.

[0056] S31: Carry the arranged N + 1 solar cells to the series connection platform, and heat each solar cell before and / or during the carrying. Since each solar cell is pre - heated, after the solar cell contacts the glue film, the glue film melts and has adhesiveness, thus bonding and fixing the solder ribbon on the surface of the solar cell.

[0057] A method for stringing BC solar cells in this embodiment does not require laying a light - shielding strip, eliminating the light - shielding strip laying process and the welding process, and improving the stringing efficiency.

[0058] Embodiment Two As Figures 6 to 8 shown, this embodiment provides a BC solar cell string, including N + 1 solar cells 30, N + 2 solder ribbon groups 20 and a glue film 10. Among them, the solder ribbons in each of the adjacent two solder ribbon groups 20 are alternately staggered along the width direction of the glue film 10, and adjacent two solar cells 30 are connected in series through a solder ribbon group 20 on the same side; wherein, N is an integer greater than or equal to 1; the gap between adjacent two solar cells 30 tends to zero.

[0059] In this embodiment, the glue film 10 can be a whole glue film or several glue strips.

[0060] In the BC solar cell string of this embodiment, since the gap between adjacent two solar cells 30 tends to zero, there is no need to set a light - shielding strip to fill the gap between adjacent solar cells 30. The string pitch is stable, the length of the solar cell string is reduced, and the proportion of the effective power - generating area in the photovoltaic module is relatively large.

[0061] Embodiment Three This embodiment provides a BC cell string, which is different from the BC cell string in Embodiment 2 in that adjacent two cell pieces 30 are partially stacked.

[0062] In this embodiment, the encapsulant film 10 can be a whole encapsulant film or several encapsulant strips.

[0063] Further, due to the height difference after stacking, the soldering ribbon is likely to generate a large pressure in the stacking area, which may cause damage to the end face of the cell piece 30. A protective layer film can be filled in the gap of the stacking area between adjacent two cell pieces 30 to protect the adjacent positions of the cell pieces 30.

[0064] In the BC cell string of this embodiment, since adjacent two cell pieces 30 are partially stacked, there is no need to set light-shielding strips to fill the gap between adjacent cell pieces 30. The string pitch is stable, the length of the cell string is reduced, and the proportion of the effective power generation area in the photovoltaic module is relatively large.

[0065] Embodiment 4 As Figure 9 and 10 shown, this embodiment provides a BC cell string forming device for implementing the BC cell string forming method in Embodiment 1 above. The forming device includes a forming platform 1, a conveying line 2 for conveying the forming platform 1, and a film covering device 3, a soldering ribbon laying device 4, and a cell piece laying device 5 arranged in sequence along the conveying direction of the conveying line 2. A plurality of adsorption holes for adsorbing and fixing the encapsulant film are formed on the forming platform 1. The film covering device 3 is used for laying the encapsulant film on the forming platform 1. The soldering ribbon laying device 4 is used for laying N + 2 soldering ribbon groups on the forming platform 1. The cell piece laying device 5 is used for laying N + 1 cell pieces on the forming platform 1. Wherein, N is an integer greater than or equal to 1.

[0066] Specifically, in this embodiment, the conveying line 2 can circulate and convey the forming platform 1 in a horizontal plane or a vertical plane. Among them, the conveying line 2 can adopt a drag chain type or a mode of combining a conveyor belt with a lifting platform for movement, etc.

[0067] Among them, the film covering device 3 includes a film placing fixture 31, a film pulling mechanism 32, a film cutting mechanism (not shown in the figure), and a first driving mechanism (not shown in the figure). Vacuum adsorption holes for adsorbing and fixing the encapsulant film are formed on the placing surface of the film placing fixture 31. The film pulling mechanism 32 is used for pulling the encapsulant film released from the film roll 33 to the placing surface of the film placing fixture 31. The film cutting mechanism is used for cutting the encapsulant film. The first driving mechanism drives the film placing fixture 31 to move up and down and rotate to transfer the encapsulant film to the forming platform 1.

[0068] In this embodiment, the film placing fixture 31 is located above the conveyor line; the first driving mechanism includes a lifting seat, a rotary driving member and two lifting driving members. Among them, the film placing fixture 31 is rotatably connected to the lifting seat, the rotary driving member drives the film placing fixture 31 to rotate relative to the lifting seat, and the two lifting driving members drive the lifting seat to move up and down. The rotary driving member is preferably a rotary cylinder; the lifting driving member can be a lifting cylinder or an electric linear slide, etc. The film pulling mechanism 32 includes a film puller slidably arranged above the film placing fixture 31 and a puller driving assembly for driving the film puller to reciprocate. The puller driving assembly can be an electric linear slide or a lead screw assembly driven by a motor, etc. The film cutting mechanism can adopt the way of vertical cutting up and down or the way of rolling cutting with a circular blade.

[0069] As a preference of the present invention, the film placing fixture 31 can be provided with at least two placing surfaces; film reels 33 are arranged on both sides of the film placing fixture 31. By reciprocating the film puller, the film can be alternately pulled out, so as to speed up the film covering rhythm and improve the film covering efficiency.

[0070] It should be noted that each placing surface of the film placing fixture 31 should be separately corresponding to a negative pressure chamber to avoid air leakage from the non-adsorbing surface caused by multiple placing surfaces sharing the negative pressure chamber and the problem that adsorption cannot be controlled simultaneously.

[0071] In an embodiment of the present invention, the solder tape laying device 4 includes a solder tape placing fixture 41, a tape pulling mechanism 42, a solder tape cutting mechanism 43, a distance adjusting mechanism and a second driving mechanism; among them, the solder tape placing fixture 41 has a plurality of splicing modules 411 arranged side by side along the length direction of the solder tape, and the distance between adjacent two splicing modules 411 is adjustable; vacuum suction grooves for adsorbing and fixing the solder tape are formed on the placing surfaces of each splicing module 411; the tape pulling mechanism 42 is used for pulling the solder tape released from the solder tape reel to the solder tape placing fixture 41; the solder tape cutting mechanism 43 is used for cutting the solder tape to obtain N + 2 solder tape groups; the distance adjusting mechanism is used for adjusting the distance between adjacent two splicing modules 411 to obtain N + 2 solder tape groups after distance separation; the second driving mechanism is used for driving the solder tape placing fixture 41 to move up and down and rotate to transfer the N + 2 solder tape groups after distance separation to the series platform 1.

[0072] Among them, the solder ribbon placement fixture 41 is located above the conveyor line 2; the structure of the second driving mechanism can refer to the above-mentioned first driving mechanism; the structure of the ribbon pulling mechanism 42 can refer to the above-mentioned film pulling mechanism 32; the solder ribbon cutting mechanism 43 includes a tool holder, a plurality of cutting blades distributed on the tool holder, and a tool holder driving member for driving the tool holder to move up and down, and the tool holder driving member can be a cylinder. A solder ribbon roll 44 is arranged on one side of the solder ribbon placement fixture 41. Of course, the solder ribbon rolls 44 can also be arranged on both sides of the solder ribbon placement fixture 41 respectively. By reciprocating the solder ribbon puller, the solder ribbon can be alternately pulled out, so as to speed up the solder ribbon laying rhythm and improve the solder ribbon laying efficiency.

[0073] In another embodiment of the present invention, the solder ribbon laying device 4 includes a solder ribbon placement fixture 41, a ribbon pulling mechanism 42, a solder ribbon cutting mechanism 43 and a second driving mechanism; among them, a vacuum adsorption groove for adsorbing and fixing the solder ribbon and a plurality of blanking ports are formed on the placement surface of the solder ribbon placement fixture 41; the ribbon pulling mechanism 42 is used to pull the solder ribbon released from the solder ribbon roll to the placement surface of the solder ribbon placement fixture 41; the solder ribbon cutting mechanism 43 is used to cut the solder ribbon to obtain N + 2 solder ribbon groups, and the cut solder ribbon segments are discharged through the corresponding blanking ports; the second driving mechanism is used to drive the solder ribbon placement fixture 41 to move up and down and rotate, so as to transfer the N + 2 solder ribbon groups to the stringing platform.

[0074] This embodiment can eliminate the distance adjustment action compared with the previous embodiment, thus avoiding the complexity of the action process that may be caused by distance separation, and the solder ribbon waste rate is about 1%.

[0075] The cell placement device 5 includes a cell placement platform 51 and a handling mechanism 52. Among them, the cell placement platform 51 is located on one side of the conveyor line 2, and the handling mechanism 52 is used to transport the N + 1 cells arranged on the cell placement platform 51 to the stringing platform 1; a heating component for heating each cell is provided on the cell placement platform 51 and / or the handling mechanism 52.

[0076] Further, the cell placement platform 51 can be provided with a rectifying mechanism for rectifying each cell. The handling mechanism 52 can use a suction cup to adsorb and fix the cells for handling and moving.

[0077] It should be noted that an anti-sticking layer can be provided on the stringing platform 1 to prevent the molten adhesive film from adhering to the stringing platform 1 in the reverse direction.

[0078] In addition, a string discharging platform 53 can be arranged on the other side of the conveyor line 2; the handling mechanism 52 can transport the preliminarily formed cell string on the stringing platform 1 to the string discharging platform 53; the string discharging platform 53 can be a conveyor belt.

[0079] A BC battery stringing device of the present invention moves a stringing platform 1 through a conveyor line 2, and sequentially lays a rubber film, N+2 welding ribbon groups and N+1 battery cells on the stringing platform 1, thereby realizing continuous preparation of BC battery strings, fast operation cycle and high production efficiency.

[0080] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A method for stringing BC batteries, characterized in that: The following steps are involved: Laying the adhesive film on the string platform; a plurality of adsorption holes for adsorbing and fixing the adhesive film are opened on the string platform; Laying N+2 welding tape groups on the adhesive film along the length direction, and the welding tapes in two adjacent welding tape groups are alternately staggered along the width direction of the adhesive film; wherein N is an integer greater than or equal to 1; N+1 battery cells are laid along the length direction of the adhesive film, and two adjacent battery cells are connected in series through a welding ribbon group; wherein the gap between two adjacent battery cells approaches zero, or two adjacent battery cells are partially stacked.

2. A BC battery stringing method according to claim 1, characterized in that: The step of laying the adhesive film on the string platform comprises: A film placement jig capable of moving up and down and rotating is provided, wherein a vacuum adsorption hole for adsorbing and fixing the film is provided on a placement surface of the film placement jig; Pulling the film released from the film roll onto the placement surface of the film placement jig, and adsorbing and fixing the film; Cutting film; The film is transferred to the stringing platform by moving the film placement jig up and down and rotating it.

3. A BC battery stringing method according to claim 2, characterized in that: The adhesive film placement jig is provided with at least two placement surfaces; adhesive film rolls are provided on both sides of the adhesive film placement jig, and the adhesive films released from the two adhesive film rolls are alternately pulled onto the adhesive film placement jig.

4. A BC battery stringing method according to claim 1, characterized in that: The step of laying N+2 welding tape groups on the adhesive film along the length direction comprises: A solder strip placement jig capable of moving up and down and rotating is provided, wherein the solder strip placement jig has a plurality of splicing modules arranged side by side along the length direction of the solder strip, and the spacing between two adjacent splicing modules is adjustable; a vacuum adsorption groove for adsorbing and fixing the solder strip is provided on the placement surface of each splicing module; Pulling the soldering ribbon onto the soldering ribbon placement jig, and adsorbing and fixing the soldering ribbon; Cut the solder strips to obtain N+2 solder strip groups; Adjust the spacing between the splicing modules to obtain N+2 welding ribbon groups after spacing; By moving up and down and rotating the solder ribbon placement jig, the N+2 solder ribbon groups after separation are transferred to the adhesive film located on the stringing platform.

5. A BC battery stringing method according to claim 4, characterized in that: Before adjusting the spacing between the splicing modules, disconnecting the odd-numbered splicing modules or the even-numbered splicing modules from adsorbing and fixing the welding strips; After adjusting the intervals between the splicing modules, the adsorption and fixation of the welding strips by the splicing modules are restored.

6. A BC battery stringing method according to claim 1, characterized in that: The step of laying N+2 welding tape groups on the adhesive film along the length direction comprises: A solder strip placement jig capable of moving up and down and rotating is provided, wherein a vacuum adsorption groove and a plurality of blanking openings for adsorbing and fixing the solder strip are provided on a placement surface of the solder strip placement jig; Pulling the soldering ribbon onto the soldering ribbon placement jig, and adsorbing and fixing the soldering ribbon; Cut the solder strips to obtain N+2 solder strip groups, and the cut solder strip segments are discharged through corresponding blanking ports; By moving up and down and rotating the solder ribbon placement jig, N+2 solder ribbon groups are transferred to the adhesive film located on the stringing platform.

7. A BC battery stringing method according to claim 1, characterized in that: The laying of N+1 battery cells along the length direction of the adhesive film comprises: Arrange N+1 battery cells so that the gap between two adjacent battery cells approaches zero, or so that two adjacent battery cells are partially overlapped; The arranged N+1 battery cells are transported to the stringing platform, and each battery cell is heated before and / or during the transportation.

8. A BC battery string, characterized in that: It includes N+1 battery cells, N+2 welding ribbon groups and adhesive film, wherein the welding ribbons in two adjacent welding ribbon groups are alternately staggered along the width direction of the adhesive film, and the same sides of two adjacent battery cells are connected in series through a welding ribbon group; wherein N is an integer greater than or equal to 1; the gap between two adjacent battery cells tends to zero, or the gap between two adjacent battery cells is partially stacked.

9. A BC battery stringing device, characterized in that: Used to implement the stringing method described in any one of claims 1 to 7, comprising a stringing platform, a conveyor line for conveying the stringing platform, and a coating device, a solder tape laying device and a battery cell laying device arranged in sequence along the conveying direction of the conveyor line; the stringing platform is provided with a plurality of adsorption holes for adsorbing and fixing the adhesive film; the coating station can lay the adhesive film on the stringing platform; the solder tape laying device can lay N+2 solder tape groups on the stringing platform; the battery cell laying device can lay N+1 battery cells on the stringing platform; wherein N is an integer greater than or equal to 1.

10. A BC battery stringing device according to claim 10, characterized in that: The film coating device includes a film placing jig, a film pulling mechanism, a film cutting mechanism and a first driving mechanism; a placing surface of the film placing jig is provided with vacuum adsorption holes for adsorbing and fixing the film; the film pulling mechanism can pull the film released from the film roll to the placing surface of the film placing jig; the film cutting mechanism is used to cut the film; the first driving mechanism drives the film placing jig to move up and down and rotate to transfer the film to the stringing platform.

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