Electronic component and method for manufacturing an electronic component

Abstract

According to an embodiment, an electronic device (100) comprises: a sensor element (1) for measuring a physical quantity in the electronic device; and a contact element (2) configured to be mechanically biased. Furthermore, the electronic component comprises a measuring surface (30, 60, 90), on which a physical quantity is measured by means of a sensor element. A sensor element is placed on the measurement surface. The contact element is electrically connected to the sensor element. At least one of the connection between the sensor element and the contact element and the connection between the sensor element and the measurement surface is a dry connection. The contact element is mechanically biased in order to prevent loosening of the at least one dry connection.

Description

Technical Field

[0001] The present disclosure relates to an electronic device and a method for manufacturing an electronic device. Summary of the Invention

[0002] The aim is to provide an improved electronic device, for example, an electronic device that can be easily manufactured and / or designed to be compact. Another aim is to provide an improved method for manufacturing such an electronic device.

[0003] Embodiments of the present disclosure relate to an improved electronic device and an improved method for manufacturing an electronic device.

[0004] First, the electronic device will be described in detail. The electronic device described herein can be, for example, a power semiconductor module or a component including a power semiconductor module.

[0005] According to one embodiment, the electronic device includes: a sensor element configured to measure a physical quantity in the electronic device; and a contact element configured to be mechanically biased. In addition, the electronic device includes a measurement surface at which the physical quantity is measured by means of the sensor element. The sensor element is placed on the measurement surface. The contact element is electrically connected to the sensor element. At least one of the connection between the sensor element and the contact element and the connection between the sensor element and the measurement surface is a dry connection. The contact element is mechanically biased to prevent loosening of at least one dry connection.

[0006] The described electronic device can, on the one hand, improve the quality of determining the physical quantity during the operation of the electronic device. On the other hand, even in an electronic device for which a sensor element was not initially planned, the implementation of the sensor element can be achieved with relatively minor modifications to the electronic device. This is due to the use of a biasing contact element. For example, the biased contact element presses two elements of the electronic device (forming a dry contact between the two elements) against each other, thereby reliably maintaining the dry contact. Thus, at least one connection can be achieved without soldering, gluing, sintering, welding, or other joining methods.

[0007] The sensor element is, for example, a transducer (a measured variable transducer) and is thus part of the measuring device that directly responds to the measured variable. Therefore, the sensor element can be the first element of the measurement chain. The sensor element is, for example, configured to detect physical quantities such as temperature, humidity, pressure, acceleration, etc., and in response thereto, generate or manipulate an electrical signal that can be read via the contact element.

[0008] The contact element is at least partially conductive. The contact element includes a contact area which is an area remote from (in particular opposite to) the sensor element, and at which the contact element can be electrically connected. The contact element provides an electrical conduction path from the sensor element to the contact area. In this way, it is possible to read the sensor element by means of the contact element, in particular to receive an electrical signal from the sensor element via the contact element and / or to supply an electrical signal to the sensor element via the contact element. Thus, the contact element can also be used to supply voltage and / or current to the sensor element.

[0009] The contact element can be integrally formed or can consist of several parts. For example, the contact element is made of metal or includes metal. The contact element being configured to be mechanically biased means that at least a part / section of the contact element is elastic and deformable so that the contact element moves from a relaxed state of the contact element into a biased state of the contact element. In the biased state, the contact element tends to automatically return to the relaxed state. At least one elastic part of the contact element is, for example, reversibly deformable. The contact element can include one or more deformable elastic parts / sections, such as a spring. For example, when the contact element is moved from the relaxed state into the biased state, at least one elastic or deformable part is compressed and / or bent and / or deflected. Being mechanically biased and being mechanically stressed are used as synonyms.

[0010] The sensor element is arranged, for example, between the measurement surface and the contact element or at least a part of the contact element, in particular in the vertical direction. The vertical direction herein means the direction perpendicular to the main extension plane of the electronic device or the measurement surface. The lateral direction is the direction parallel to the electronic device or the measurement surface.

[0011] The sensor element and the contact element can be adjacent to each other. Moreover, the sensor element and the measurement surface can be adjacent to each other.

[0012] The sensor element is mechanically connected to the measurement surface and the contact element. Moreover, a thermal contact can be established between the sensor element and the measurement surface. At least one of the (mechanical) connections of the sensor element to the contact element and to the measurement surface is a dry connection. A dry connection is a non-material locking connection, i.e., no material locking connection (bonding) is formed between the two elements / fitting parts being connected. A dry connection is, for example, a pure force fit and / or a form fit connection. A dry connection can be loosened without damage.

[0013] The connection between the sensor element and the contact element is also an electrical connection. Similarly, the connection between the sensor element and the measurement surface can be an electrical connection. An electrical contact established between two elements without a material locking connection (i.e., by a dry connection) is referred to herein as a "dry electrical contact".

[0014] The contact element is mechanically biased, i.e., in a biased state. In particular, the contact element is fixed in the electronic device so as to prevent the contact element from transitioning to its relaxed state. However, since the biased contact element tends to automatically switch to the relaxed state, it generates a force in the electronic device. This force can be transferred to other components of the electronic device, for example, to a sensor element.

[0015] The mechanically biased contact element is arranged to prevent the loosening of at least one dry connection. This may mean that the force generated by the biased contact element presses two elements / fittings against each other, forming a dry connection between the two elements / fittings. In this way, the dry connection is maintained.

[0016] For example, the force generated by the biased contact element in the electronic device is at least 0.01 N or at least 0.1 N.

[0017] According to another embodiment, the sensor element is a temperature sensor. For example, the sensor element is a temperature-sensitive resistor, also known as a "thermistor". The sensor element can be an NTC, PTC, platinum resistor (such as PT100 or PT1000), or a thermocouple. Alternatively, the sensor element can be a humidity sensor, an acceleration sensor, or a pressure sensor.

[0018] In fact, customers have a strong interest in temperature monitoring of, for example, power semiconductor devices (also referred to herein as "power semiconductor chips" or simply "chips") or power semiconductor modules during operation. Temperature monitoring is typically used to prevent chip overheating (e.g., in the case of excessive current) or to monitor the degradation state of a power semiconductor module with respect to, for example, aging of joining connections, which in turn affects the thermal resistance and thus the chip temperature.

[0019] According to at least one embodiment, the contact element comprises or is one of the following: a spring contact element or a push pin. The spring contact element has, for example, a zigzag region and / or a V-shaped region and / or a U-shaped region and / or a spring washer region and / or a spring region, which can be compressed to bring the contact element into the biased state. Additionally or alternatively, the spring contact element can have a cantilever-shaped portion, which can be bent to bring the spring contact element into the biased state. The spring contact element can be integrally formed or can be formed from several parts.

[0020] The push-type stylet includes, for example, a body (e.g., a cylinder or tubular body / sleeve), a tip element (e.g., a plunger), and one or more springs (such as (multiple) helical springs), and the one or more springs can be compressed to bring the contact element into a biased state. The tip element is movably mounted relative to the body and can move toward the body or further into the body by compressing the spring. The push-type stylet is, for example, an elongate element. The tip element of the push-type stylet can be connected to or in contact with the sensor element.

[0021] According to another embodiment, one of the connection between the sensor element and the contact element and the connection between the sensor element and the measurement surface is implemented as a material-locking connection. The material-locking connection can be a soldering, sintering, gluing, or welding connection, or can be achieved by any other suitable joining method.

[0022] According to another embodiment, the sensor element is connected to the measurement surface by means of a material-locking connection. The material-locking connection can have the same nature as detailed in the previous paragraph. Moreover, the electrical connection between the sensor element and the contact element can be provided by a material-locking connection, for example, only by a material-locking connection. Thus, the connection between the sensor element and the contact element is a dry connection, and the electrical contact between them can be a dry contact.

[0023] According to another embodiment, the sensor element can be externally electrically connected via the contact element. For example, the electronic device includes a terminal region that is exposed and / or freely accessible and electrically connected to the contact element and thus also electrically connected to the sensor element. The terminal region can be a region of the contact element, such as the contact region mentioned above. Alternatively, the terminal region can be a region of an auxiliary terminal structure that is electrically connected to the contact element.

[0024] According to another embodiment, the terminal region for externally electrically connecting the sensor element via the contact element overlaps the sensor element in at least one lateral direction. The terminal region and the sensor element can overlap in two perpendicular lateral directions. In other words, in a top view of the electronic device, i.e., when viewed along the vertical direction, the terminal region at least partially covers the sensor element. In this case, the terminal region is, for example, a part of the contact element. In this case, the terminal region forms an offset with the sensor element in the vertical direction. "Offset" herein means that there is no overlap but a gap between two corresponding elements.

[0025] According to another embodiment, the terminal region for externally electrically connecting the sensor element via the contact element is offset from the sensor element in at least one lateral direction (e.g., in at least two perpendicular lateral directions). In a top view of the electronic device, the terminal region is offset from the sensor element. In the vertical direction, the terminal region may also be offset from the sensor element or may overlap with the sensor element.

[0026] According to another embodiment, the sensor element includes a top electrode located at the top side of the sensor element. Additionally, the sensor element may include a bottom electrode located at the bottom side of the sensor element, where the bottom side is opposite to the top side.

[0027] The top electrode and the bottom electrode are, for example, metal regions of the sensor element. They may be configured to electrically connect the sensor element for reading the sensor element and / or supplying current and / or voltage to the sensor element.

[0028] According to another embodiment, the contact element is connected to the top electrode of the sensor element. The contact element and the top electrode may be in direct contact, i.e., adjacent to each other. Electrical contact may be achieved through the connection between the top electrode and the contact element. For example, a dry connection is formed between the contact element and the top electrode. Thus, the electrical contact between the sensor element and the contact element can be a dry electrical contact. Alternatively, a material-locking connection may be formed between the sensor element and the contact element.

[0029] According to another embodiment, the measurement surface is connected to the bottom electrode of the sensor element. The measurement surface and the bottom electrode may be in direct contact, i.e., adjacent to each other. Electrical contact may be established between the bottom electrode and the measurement surface. A material-locking connection may be formed between the measurement surface and the bottom electrode. Alternatively, a dry connection may be formed between them.

[0030] According to another embodiment, the electronic device includes a power semiconductor device. For example, the power semiconductor device is a switching device. The power semiconductor device may be an IGBT or a MOSFET or a HEMT or a diode or a thyristor. In this case, the electronic device is or includes, for example, a power semiconductor module having one or more power semiconductor devices.

[0031] The power semiconductor module may include a substrate having a top metallization and optionally a bottom metallization. At least one power semiconductor device may be mounted on the top side of the substrate where the top metallization is located. For example, it may be mounted on the top metallization. For example, the substrate may be a DBC (Direct Bonded Copper) substrate or a DBA (Direct Bonded Aluminum) substrate or an AMB (Active Metal Brazing) substrate with an insulating ceramic layer or an IMS (Insulated Metal Substrate) with an insulating resin layer.

[0032] In addition, the power semiconductor module may include terminals for external electrical connection (main terminals and optionally auxiliary terminals). These terminals may be implemented by a terminal structure, which is for example sheet-shaped and / or made of metal and / or integrally formed. Other shapes of these terminals are possible, such as a hollow cylinder with threads (such as a nut). The terminal regions of the terminal structure are exposed to enable external electrical contact. The terminal structure may be bonded to the top metallization or may be implemented by the top metallization. The terminals may be directly connected to the chips and also control the electronic devices.

[0033] The power semiconductor module may further include a housing body. The housing body may be formed of an electrically insulating material, such as resin and / or gel. The (multiple) power semiconductor devices may be embedded in the housing body. The terminal structure may be at least partially embedded in the housing body. The terminal regions of the terminal structure may protrude from the housing body, for example at the lateral sides of the housing body. The housing body may include a housing frame surrounding a cavity. The cavity may be filled with gel.

[0034] In addition, the power semiconductor module may include a bottom plate. The bottom plate is for example intended for cooling. A substrate may be mounted on the bottom plate, for example with the bottom metallization facing the bottom plate. The bottom plate may be made of metal, such as Cu or Al or their alloys, or made of a composite material, such as aluminum silicon carbide or magnesium silicon carbide. The bottom plate may include a cooling structure on the side facing away from the substrate, such as pin fins or ribs.

[0035] Herein, the lateral direction is for example the direction parallel to the main extension plane of the substrate. The vertical direction is the direction perpendicular to the main extension plane of the substrate.

[0036] According to another embodiment, a sensor element is placed on the power semiconductor device.

[0037] According to another embodiment, the sensor element is placed in a region adjacent to the power semiconductor device. For example, the sensor element is placed on the top metallization of the substrate adjacent to the power semiconductor device and / or between two adjacent power semiconductor devices. Then, the top metallization may form a measurement surface.

[0038] Placing the sensor element on the power semiconductor device has some advantages compared to placing the sensor element on the substrate adjacent to the power semiconductor device or even on a separate substrate on which the power semiconductor device is mounted adjacent thereto. For example, as the distance between the chip and the temperature sensor decreases, the quality of the chip temperature determination improves. In fact, in this case, a thermal model can be used to more accurately derive the true temperature of the chip from the sensor readings. In addition, when the sensor element is directly placed on the chip, the temperature variations caused by the long distance and the time delay of the corresponding measurement can be significantly reduced.

[0039] Another advantage of placing the sensor element on the power semiconductor device is that if more than one heating chip is mounted on the substrate, the sensor reading mainly refers to one chip rather than the average value of the chips. When the sensor element is placed between the chips on the substrate, the measured temperature may not refer to the temperature of the chip with the most unfavorable thermal performance or the most serious performance degradation. In the worst case, a bonded connection under a chip or a serious degradation of the chip itself is not detected.

[0040] Furthermore, when the sensor element is placed on the chip, it is possible to avoid failure to detect an excessive temperature of the chip due to a deteriorated diebond that does not conduct heat.

[0041] Moreover, placing the sensor element on the top metallization of the power semiconductor device adjacent consumes space on the substrate surface, thus reducing the available space for the chips. This may also have a negative impact on the thermal resistance and thus on the cost per ampere rating.

[0042] In addition, many products were initially developed without an integrated sensor element. Thus, there may be no area on the substrate available for placing the sensor element. However, at the same time, there is a strong trend of customer requests for implementing thermal sensors.

[0043] The electronic device may include multiple pairs of sensor elements and contact elements as detailed above. For example, each of the multiple power semiconductor devices is assigned such a pair, and its sensor element is mounted on the corresponding power semiconductor device. It is also possible that one or more sensor elements in one or more such pairs are mounted on the top metallization adjacent to the (multiple) power semiconductor devices on one or more substrates or between the (multiple) power semiconductor devices, and one or more sensor elements in one or more such pairs are mounted on one or more power semiconductor devices. For example, there may be one such pair per substrate.

[0044] According to another embodiment, the measurement surface is formed by the top electrode of the power semiconductor device. The top electrode of the power semiconductor device can be, for example, a source / emitter electrode or a drain / collector electrode. The top electrode can be made of a metal such as Cu or Al or a corresponding alloy.

[0045] The sensor reading of the sensor element is, for example, between the contact element and the output terminal (e.g., AC terminal) of the electronic device. Alternatively, the sensor reading can be between the contact element and the input terminal (e.g., DC+ terminal or DC- terminal) of the electronic device.

[0046] According to another embodiment, the contact element is electrically and mechanically connected (in particular fixed) to an auxiliary terminal of the electronic device. The auxiliary terminal is formed, for example, by an auxiliary terminal structure of the electronic device. The auxiliary terminal structure is, for example, a sheet-like metal element or a nut or a hollow (metal) cylinder. The (multiple) auxiliary terminals are different from the main terminals or power supply terminals of the electronic device. The main terminals can be AC, DC-, and DC+ terminals. In particular, the auxiliary terminal is configured to carry less current than the main terminal. The auxiliary terminal can be partially embedded in the housing body of the electronic device. The auxiliary terminal can be a terminal for controlling a power semiconductor device, such as for measurement / detection. They can be an auxiliary emitter or an auxiliary collector terminal or a gate terminal or a terminal for connecting a sensor.

[0047] According to another embodiment, the contact element is electrically and mechanically connected to the auxiliary terminal by means of a threaded connection. Alternatively, other connections are possible, such as soldering, welding, crimping, or gluing. It is also possible that the contact element is integrally formed with the auxiliary terminal.

[0048] The auxiliary terminal is, for example, an externally electrically connectable terminal of the electronic device. That is, the terminal area of the auxiliary terminal is exposed and freely accessible. For example, the terminal area of the auxiliary terminal is exposed and / or protrudes from the housing body at the lateral side of the housing body. Alternatively, the auxiliary terminal can be exposed and / or protrude vertically from the housing body at the top side of the housing body, for example when the auxiliary terminal is a nut, a vertical pin, or a hollow sleeve.

[0049] In addition to connecting the contact element to the auxiliary terminal, other ways of fixing the contact element in the electronic device can be envisaged.

[0050] According to another embodiment, the contact element is fixed to an electrically insulating element of the electronic device, such as the housing body and / or the resin body. This particularly means that there is a direct connection between the contact element and the electrically insulating element. Fixing to the electrically insulating element can keep the contact element in a mechanically biased state. For example, the contact element can be assembled into the housing body and surrounded by it in a form-fitting manner. Alternatively, a nut (for example, a metal nut) can be embedded in the housing, and the contact element can be screwed into the nut.

[0051] According to another embodiment, a part of the contact element is exposed, for example, at the top side of the electronic device. The exposed part can constitute the terminal area of the contact element for external electrical connection of the contact element. The sensor element can be powered and / or read via the exposed part.

[0052] According to another embodiment, a thermally conductive material is arranged between the measurement surface and the sensor element. The thermally conductive material can be a paste filled with microparticles (e.g., conductive particles). The thermally conductive material can be conductive or electrically insulating. The paste is liquid and / or viscous. Alternatively, the thermally conductive material can be a thermally conductive sheet (e.g., an elastic sheet).

[0053] According to another embodiment, the electronic device includes at least one (i.e., one or more) power semiconductor module and a cooler for the power semiconductor module. The cooler can be a carrier for the power semiconductor module. The cooler is configured, for example, to guide a coolant to flow therethrough. The cooler can include cooling channels for the coolant. The cooler can be made of metal, such as copper or aluminum or corresponding alloys. The power semiconductor module can be mounted on the cooler, wherein the bottom metallization and / or the base plate face the cooler.

[0054] According to another embodiment, the measurement surface is formed by the cooler, for example, by its top surface. Then, the sensor element can be used to measure the temperature of the cooler.

[0055] According to another embodiment, the measurement surface is formed by the surface of the base plate. Then, the sensor element can be placed adjacent to the substrate or between two adjacent substrates that are mounted on the base plate.

[0056] According to another embodiment, at least one of the surfaces of the two elements that form a dry contact therebetween is roughened, particularly in order to increase the contact surface. The roughened surface can be imprinted into the adjacent surface, thereby increasing the contact surface. Additionally, in this way, a form-fit connection can be established. Furthermore, in this way, an unwanted oxide layer can be broken or impurities / contaminants on the adjacent surface can be infiltrated.

[0057] According to another embodiment, the roughened surface has an average roughness of at least 1 μm or at least 1.6 μm or at least 2 μm.

[0058] Next, a method for manufacturing an electronic device will be described in detail. The electronic device according to any one of the embodiments described herein can be manufactured by means of this method. Therefore, all features disclosed for the electronic device are also disclosed for this method, and vice versa.

[0059] According to an embodiment, a method for manufacturing an electronic device includes the steps of providing a sensor element, providing a contact element configured to be mechanically biased, and providing a component for the electronic device, the component having a measurement surface at which a physical quantity of the electronic device is measured by means of the sensor element. In a further step, the sensor element is placed on the measurement surface, and the contact element is electrically connected to the sensor element. At least one of the connection between the contact element and the sensor element and the connection between the sensor element and the measurement surface is a dry connection. In a further step, the contact element is mechanically biased, and at least a part of the mechanically biased contact element is fixed relative to the component such that the contact element remains in the mechanically biased state in order to prevent loosening of at least one dry connection.

[0060] These method steps can be performed in the order described in detail. That is, after providing the different elements, the sensor element can first be placed on the measurement surface. Then, the contact element can be electrically connected to the sensor element. The connection between the sensor element and the measurement surface is, for example, a dry connection. Then, the contact element can be biased and then fixed in the biased state. The contact element can also be fixed relative to the component and subsequently biased.

[0061] However, alternatively, it is also possible to first electrically connect the sensor element and the contact element (for example, by a material-locking connection), and then mount the composite (also referred to as a sensor unit) to the component by the following steps: placing the sensor element on the measurement surface, then biasing the contact element, and then fixing the contact element in order to keep it in the biased state.

[0062] The component can be, for example, a power semiconductor device, a substrate or a top metallization of a substrate, a base plate or a cooler. Thus, the measurement surface can be the top electrode of a power semiconductor device or the top metallization of a substrate or the surface of a base plate or the surface of a cooler.

[0063] According to another embodiment, a material-locking connection is formed between the contact element and the sensor element. The material-locking connection can also provide an electrical connection between the sensor element and the contact element.

[0064] According to another embodiment, a material-locking connection is formed between the sensor element and the measurement surface. The material-locking connection can also provide an electrical connection between the sensor element and the measurement surface.

[0065] According to another embodiment, a part of the contact element is fixed relative to the component by a threaded connection.

[0066] In the following, an electronic device and a method for manufacturing an electronic device will be explained in more detail with reference to the accompanying drawings based on exemplary embodiments. The accompanying drawings are included to provide further understanding. In the drawings, elements having the same structure and / or function may be referenced by the same reference symbols. It will be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale. As long as elements or components correspond to each other in terms of their functions in different drawings, their descriptions will not be repeated for each of the following drawings. For clarity, elements may not appear with corresponding reference symbols in all drawings. Description of the Drawings

[0067] Figures 1 to 4 Shows different positions in an exemplary embodiment of a method for manufacturing an electronic device and an exemplary embodiment of an electronic device.

[0068] Figures 5 to 7 Shows different positions in another exemplary embodiment of a method for manufacturing an electronic device.

[0069] Figures 8 to 10 Shows different positions in another exemplary embodiment of the method and another exemplary embodiment of the electronic device.

[0070] Figures 11 to 13 Shows different positions in another exemplary embodiment of the method and another exemplary embodiment of the electronic device.

[0071] Figures 14 to 15 Shows different positions in another exemplary embodiment of the method and another exemplary embodiment of the electronic device.

[0072] Figure 16 and Figure 17 Shows another exemplary embodiment of the electronic device.

[0073] Figures 18 to 20 Shows different positions in another exemplary embodiment of the method and another exemplary embodiment of the electronic device.

[0074] Figure 21 and Figure 22 Shows another exemplary embodiment of the electronic device. Detailed Description

[0075] Figure 1 Shows a position where an exemplary embodiment of a sensor unit 10 for an electronic device 100 is provided. The sensor unit 10 includes a contact element 2 and a sensor element 1. The contact element 2 is a spring contact element that can be mechanically biased by compressing or bending it. The contact element 2 is formed of a metal (such as, for example, Cu, Al, or steel).

[0076] The sensor element 1 is, for example, a temperature sensor, such as a thermistor. It can be an NTC, PTC or platinum resistor (e.g., PT100 or PT1000) or a thermocouple. The sensor element 1 includes a top electrode 1a and a bottom electrode 1b. Both electrodes 1a, 1b can be conductive, in particular metallic. The electrodes 1a, 1b are arranged for reading the sensor element 1, but can also be used for supplying current and / or voltage to the sensor element 1.

[0077] The contact element 2 is fixed and electrically connected to the sensor element 1, that is, fixed and electrically connected to the top electrode 1a of the sensor element. The mechanical and electrical connection between the contact element 2 and the sensor element 1 is realized, for example, by a material-locking connection, such as a soldering, sintering, welding or gluing connection. Since the contact element 2 is conductive, the sensor element 1 can be read by means of the contact element 2.

[0078] Figure 2 Another position is shown in which an assembly for different components 3, 6 of an electronic device is provided. One component is a substrate 6 with a top metallization 6a. The substrate 6 is, for example, a DBC substrate. Another component is a power semiconductor device 3, also referred to as a power semiconductor chip, which is mounted on the top side of the substrate 6 and is electrically connected to the top side via wire bonding. The power semiconductor device 3 includes a top electrode 3a which forms a measurement surface 30 and at which a physical quantity should be measured by means of Figure 1 the sensor element 1. By way of example, the power semiconductor device 3 is an IGBT or a power MOSFET, where the top electrode 3a is a source electrode or an emitter electrode, respectively.

[0079] Figure 3 A position is shown in which Figure 1 the sensor unit 10 (a complex of the sensor element 1 and the contact element 2) is placed on the power semiconductor device 3 such that the sensor element 1 abuts against the measurement surface 30. No additional connecting material for forming a material-locking connection is used between the sensor element 1 and the measurement surface 30. Thus, a dry connection exists between the sensor element 1 and the measurement surface 30.

[0080] In Figure 4 the position, an exemplary embodiment of an electronic device 100 is shown. The electronic device 100 is a power semiconductor module 100. In order to from Figure 3In the arrangement in which the power semiconductor module 100 is obtained, the contact element 2 has been compressed or bent and thus has entered its biased state. In this biased state, the contact element 2 applies a force to the sensor element 1 in the direction towards the measurement surface 30, and thereby presses the sensor element 1 against the measurement surface 30. In this way, the sensor element 1 is firmly held and connected to the measurement surface 30 (dry connection) due to the increased frictional force, and a safe and reliable electrical connection (dry electrical contact) is established between the measurement surface 30 and the sensor element 1.

[0081] Figure 4 The device can be manufactured as follows: In the biased state of the contact element 2, the resin 61 has been applied to the substrate 6 and encapsulates a part of the contact element 2. After drying the resin 61, the contact element 2 is fixed in its biased state such that the force applied by the biased contact element 2 to the sensor element 1 acts to prevent the dry connection / dry contact from loosening. The resulting resin body 61 forms the housing frame 61 of the power semiconductor module 100. For example, the cavity surrounded by the housing frame can be filled with gel.

[0082] Alternatively, Figure 4 The device can be manufactured as follows: A prefabricated housing frame 61 can be mounted on the substrate 6, and then the contact element 2 can be clamped in the housing frame 61 such that it remains in its biased state. Alternatively, the contact element can be at least partially embedded in the housing frame as a whole.

[0083] A part of the contact element 2 is not covered by the resin body 61 but is exposed at the top side of the power semiconductor module 100. This part constitutes the terminal region of the contact element 2 for external electrical connection of the contact element 2. Thus, the sensor element 1 can be read, for example, via the contact element 2 and the DC- or AC terminals of the power semiconductor module 100.

[0084] It is possible to obtain a power semiconductor module 100 similar to that described in connection with Figures 5 to 7 by means of another exemplary embodiment of the method explained in connection with Figure 4

[0085] In Figure 5 the position, a contact element 2 as explained in connection with Figure 1 is provided. In contrast to Figure 1 the contact element 2 has not been connected to the sensor element 1.

[0086] In Figure 6 the position, the sensor element 1 (for example, as in connection with Figure 1The same as described) is located on the measurement surface 30 and is achieved by the power semiconductor device 3 mounted on the substrate 6 again. The sensor element 1 is electrically connected and fixed to the power semiconductor device 3, for example, by means of a material-locking connection (such as soldering, welding, gluing, or sintering).

[0087] At the Figure 7 position, Figure 5 the contact element 2 is placed on the top electrode 1a of the sensor element 1, and a dry electrical contact is formed between the contact element 2 and the sensor element 1.

[0088] The contact element 2 can now be biased by compressing or bending it, and can be partially encapsulated with resin 61 in order to fix the contact element 2 in its biased state (see the explanation in connection with Figure 4 ). The resulting power semiconductor module is different from the Figure 4 power semiconductor module in that a dry connection is then formed between the contact element 2 and the sensor element 1 but not between the sensor element 1 and the measurement surface 30. However, here too, the biased contact element generates a force in the power semiconductor module 100 that acts to prevent the loosening of the dry connection.

[0089] Figure 8 shows a position in which a contact element 2 different from that in the previous exemplary embodiment is provided. In this case, the contact element 2 is formed by a push pin. The push pin includes a spring 22 for pressing the tip element or plunger of the push pin away from the barrel or hollow sleeve of the push pin, respectively.

[0090] The contact element 2 further includes means 21 for threaded connection, i.e., an external thread 21.

[0091] Figure 9 shows a position in which a component for different components of an electronic device is provided. The component again includes a substrate 6 and a power semiconductor device 3 mounted thereon. Additionally, the component includes a resin body 61, and an auxiliary terminal (structure) 4 is partially embedded in the resin body. The auxiliary terminal structure 4 projects from the right side of the resin body 61, wherein the projecting portion constitutes a terminal region for externally electrically connecting the auxiliary terminal 4.

[0092] Another exposed portion of the auxiliary terminal structure 4 includes a through hole having means 41 for threaded connection (i.e., an internal thread). The through hole is vertically located above the measurement surface 30 of the power semiconductor device 3.

[0093] Below the through hole, the sensor element 1 is placed on the measurement surface 1. The sensor element 1 is fixed and electrically connected to the measurement surface 30, for example, again by means of a material-locking connection.

[0094] In Figure 10 , another exemplary embodiment of the electronic device 100 is shown. Again, the electronic device 100 is the power semiconductor module 100. The power semiconductor module 100 has been obtained by screwing the contact element 2 of Figure 8 into the through-hole of the auxiliary terminal structure 7 of Figure 9 . Thereby, the tip element of the contact element 2 is in mechanical and electrical contact with the sensor element 1 (i.e., its top electrode), and a dry contact has been formed.

[0095] The screwing also compresses the spring 22 of the contact element 2, so that the contact element 2 is biased. Therefore, the tip element of the contact element 2 presses against the measurement surface 30 through the biased contact element 2, and in this way a reliable dry connection and a reliable dry electrical contact are formed between the contact element 2 and the sensor element 1.

[0096] Due to the threaded connection between the auxiliary terminal structure 4 and the contact element 2, the contact element 2 is fixed in place and fixed in its biased state. Afterwards, a casting material 7, for example in the form of a gel, is applied. The casting material 7 and the resin body 61 together form the housing body of the power semiconductor module 100. For example, the sensor element 1 can be read by means of the contact element 2 and the auxiliary terminal 4 and by means of additional terminals (for example, the main terminals electrically connected to the measurement surface of the chip).

[0097] In Figure 11 's position, two contact elements 2 are provided, and each contact element is implemented as a push pin.

[0098] Figure 12 shows a position in which a component of several components 3, 6, 61, 62 is provided. Here, one component 62 is a circuit board, for example a PCB, which is mounted on the resin body 61 and laterally overlaps the power semiconductor device 3. The component 62 can be a control board and can include control devices. The sensor element 1 is placed on the power semiconductor device 3 and is, for example, fixedly connected to the power semiconductor device.

[0099] In Figure 13 , by screwing the two contact elements 2 of Figure 11 through the threaded holes in the circuit board 62, the two contact elements are installed so that they are in electrical contact with the sensor element 1. Due to the screwing, the contact element 2 is mechanically fixed to the circuit board 62 and at the same time mechanically biased, so that the tip element of the contact element 2 presses against the sensor element 1 and a reliable dry electrical contact is formed.

[0100] In Figure 13In this case, one contact element 2 is in dry electrical contact with the top electrode 1a of the sensor element 1, and another contact element 2 is in dry electrical contact with the bottom electrode 1b. Thus, the sensor element 1 can be read by means of the two contact elements 2.

[0101] In order for both the top electrode 1a and the bottom electrode 1b to be able to contact the contact element 2 from the top side (as Figure 13 shown), the bottom electrode 1b projects beyond the top electrode 1a in the lateral direction.

[0102] Alternatively, the sensor element 1 may include two electrodes 1a and 1b at its top side, such that in this case the sensor element 1 can also be contacted by the two contact elements 2 from the top side.

[0103] Figure 13 Another exemplary embodiment of an electronic device 100 in the form of a power semiconductor module 100 is shown. In this case, the two contact elements 2 of the sensor unit 10 project from the circuit board in the vertical direction, such that the terminal regions of the two contact elements 2 are exposed at the top side of the power semiconductor module 100. These terminal regions of the two contact elements 2 can be electrically connected for reading the sensor element 1.

[0104] Figure 14 A position is shown in which an assembly of a substrate 6, a power semiconductor device 3, and a resin body 61 is provided. A hole is formed in the resin body 61 above the top metallization 6a. In this case, the top metallization 6a forms a measurement surface 60 at which a physical quantity (e.g., temperature) is measured. The sensor element 1 is placed on this top side, in the hole region in the resin body 61.

[0105] In Figure 15 the position, the contact element 2 is mounted by screwing Figure 8 the contact element into the hole in the resin body 61 such that the contact element 2 contacts the sensor element 1. For the screwing to be achieved, the hole in the resin body 61 may include an internal thread. Alternatively, a nut with an internal thread may be embedded in the resin body (not shown).

[0106] Figure 16 An exemplary embodiment of an electronic device 100 as a power semiconductor module 100 is shown. In this case, a thermally conductive material 5 (e.g., in the form of a paste filled with conductive and / or thermally conductive particles (such as metal particles) or in the form of a flexible material sheet) is arranged between the sensor element 1 and the measurement surface 30. Dry electrical contacts can be formed between the material 5 and the sensor element 1 and between the material 5 and the measurement surface 30. The sensor element 1 can be fixed to the contact element 2 by means of a material locking connection.

[0107] In Figure 16 case, the thermally conductive material 5 is also electrically conductive in order to establish an electrical contact between the top electrode 3a and the sensor element 1. For example, if such a thermally conductive material 5 is to be used in an exemplary embodiment of Figure 13 , the material 5 can be, for example, electrically insulating.

[0108] In Figure 17 an exemplary embodiment of the electronic device 100, the tip element of the contact element 2 includes a roughened portion having a plurality of protrusions and recesses. The average roughness of the roughened portion is, for example, at least 1.6 μm. When the contact element 2 is pressed against the top electrode of the sensor element 1 by means of the biased contact element 2, the protrusions can be imprinted into the top electrode and thereby improve the dry connection, for example by penetrating and / or locally destroying the oxide layer present. For this purpose, the top electrode can be relatively soft compared to the material of the roughened surface.

[0109] Figure 18 shows a position in which another exemplary embodiment of the contact element 2 for the electronic device is provided. In this case, the contact element 2 includes a push pin as described above and additionally a terminal structure 24 which is mechanically and electrically connected to the push pin. This connection can be established in different ways, for example by screwing, soldering, gluing, sintering, welding, etc. The terminal structure 24 is a sheet-like element and can be formed of a metal, for example Cu or a Cu alloy.

[0110] In Figure 19 a position, a component of different components for the electronic device 100 is again provided, which components include a substrate 6, a power semiconductor device 3 and a resin body 61. The sensor element 1 is placed on and fixed to a measurement surface 30 which is formed by the top electrode 3a of the power semiconductor device 3.

[0111] Figure 20 shows an exemplary embodiment of the electronic device 100 in the form of a power semiconductor module 100, which advantage is generated by mounting the Figure 18 contact element 2 to the Figure 19 component. The auxiliary terminal structure 24 is, for example, glued to the resin body 61 such that the push pin remains in its biased state. In Figure 20 , for example, a part of the power semiconductor device 3 and the contact element 2 is embedded in a casting 7 in the form of a gel. The terminal structure 24 forms an auxiliary terminal of the power semiconductor module 100.

[0112] Figure 21An exemplary embodiment of the electronic device 100 is shown in a top view of the measurement surface 30. As can be seen here, the sensor element 1 is placed laterally on the measurement surface 30, between two adjacent bonding wires, where the two adjacent bonding wires are both electrically and mechanically connected to the top electrode 3a of the power semiconductor device 3.

[0113] Figure 22 An exemplary embodiment of the electronic device 100 is shown in the form of an assembly of two power semiconductor modules 8 mounted on a cooler 9. The cooler 9 is configured to cool the power semiconductor modules 8. For example, the cooler 9 includes channels for guiding a coolant through the cooler 9. The cooler 9 is formed, for example, from a metal such as Cu or Al. The exposed surface of the cooler 9 serves as the measurement surface 90. A nut 91 with internal threads is mounted on the measurement surface 90. The sensor element 1 is placed on the measurement surface 90, in the hole region of the nut 91. The Figure 8 contact element 2 is screwed into the nut 91, and a dry electrical contact is formed between the sensor element 1 and the contact element 2. The contact element 2 is fixed to the nut 91 in its biased state by means of a threaded connection.

[0114] Instead of the cooler 9 forming the measurement surface, the bottom plate of the power semiconductor module can also form the measurement surface.

[0115] As stated Figures 1 to 22 The embodiments shown in [the reference] represent exemplary embodiments; thus, they do not constitute a complete list of all embodiments of the improved electronic device and the improved method. For example, the actual electronic device and method can differ from the embodiments shown in terms of arrangement, devices, and elements.

[0116] Reference numerals

[0117] 1 Sensor element

[0118] 1a Top electrode

[0119] 1b Bottom electrode

[0120] 2 Contact element

[0121] 3 Power semiconductor device

[0122] 3a Top electrode

[0123] 4 Auxiliary terminal (structure)

[0124] 5 Thermal conductive material

[0125] 6 Substrate

[0126] 6a Top metallization

[0127] 7 Casting / gel

[0128] 8 Power semiconductor module

[0129] 9 Cooler

[0130] 10 Sensor unit for electronic devices

[0131] 21 Device for threaded connection

[0132] 22 Spring

[0133] 24 Auxiliary terminal structure

[0134] 30 Measuring surface

[0135] 41 Device for threaded connection

[0136] 60 Measuring surface

[0137] 61 Resin / resin body / housing frame

[0138] 62 Circuit board

[0139] 90 Measuring surface

[0140] 91 Nut

[0141] 100 Electronic device

Claims

1. An electronic device (100), the electronic device comprising: - a sensor element (1) for measuring a physical quantity in the electronic device (100), - a contact element (2) configured to be mechanically biased, - a measurement surface (30, 60, 90) at which the physical quantity is measured by means of the sensor element (1), wherein, - the sensor element (1) is placed on the measurement surface (30), - the contact element (2) is electrically connected to the sensor element (1), - at least one of the connection between the sensor element (1) and the contact element (2) and the connection between the sensor element (1) and the measurement surface (30, 60, 90) is a dry connection, and - the contact element (2) is mechanically biased to prevent loosening of at least one dry connection, - the sensor element (1) is connected to the measurement surface (30, 40, 50) by means of a material locking connection, - a dry electrical contact is formed between the contact element (2) and the sensor element (1).

2. The electronic device (100) according to claim 1, wherein, - the sensor element (1) is a temperature sensor.

3. The electronic device (100) according to claim 1 or 2, wherein, - the contact element (2) comprises a spring contact or a push pin.

4. The electronic device (100) according to any one of the preceding claims, wherein, - a terminal area for externally electrically connecting the sensor element (1) via the contact element (2) overlaps the sensor element (1) in at least one lateral direction.

5. The electronic device (100) according to any one of the preceding claims, wherein, - a terminal area for externally electrically connecting the sensor element (1) via the contact element (2) is offset from the sensor element (1) in at least one lateral direction.

6. The electronic device (100) according to any one of the preceding claims, wherein, - the sensor element (1) comprises a top electrode (1a) located at the top side of the sensor element (1) and a bottom electrode (1b) located at the bottom side of the sensor element (1) opposite to the top side, - the contact element (2) is connected to the top electrode (1a) of the sensor element (1), - the measurement surface (30, 60, 90) is connected to the bottom electrode (1b) of the sensor element (1).

7. The electronic device (100) according to any one of the preceding claims, which further comprises: - a power semiconductor device (3), wherein, - the sensor element (1) is placed on the power semiconductor device (3).

8. The electronic device (100) according to claim 7, wherein, - the measurement surface (30) is formed by the top electrode (3a) of the power semiconductor device (3).

9. The electronic device (100) according to any one of the preceding claims, wherein, - The contact element (2) is electrically and mechanically connected to the auxiliary terminal (4) of the electronic device (100) by means of a threaded connection. - The auxiliary terminal (4) is externally electrically connectable.

10. The electronic device (100) according to any one of the preceding claims, wherein, - The contact element (2) is fixed to an electrically insulating element of the electronic device (100).

11. The electronic device (100) according to any one of the preceding claims, wherein, - A part of the contact element (2) is exposed and constitutes a terminal area of the contact element (2) for externally electrically connecting the contact element (2).

12. A method for manufacturing an electronic device (100), the method comprising: - Providing a sensor element (1), - Providing a contact element (2) configured to be mechanically biased, - Providing components (3, 6, 9) for the electronic device (100), the components having measurement surfaces (30, 60, 90) at which a physical quantity of the electronic device (100) is measured by means of the sensor element (1), - Placing the sensor element (1) on the measurement surface (30, 60, 90), - Electrically connecting the contact element (2) and the sensor element (1), wherein, - At least one of the connection between the contact element (2) and the sensor element (1) and the connection between the sensor element (1) and the measurement surface (30, 60, 90) is a dry connection, - Mechanically biasing the contact element (2), - Fixing at least a part of the mechanically biased contact element (2) relative to the components (3, 6, 9) such that the contact element (2) remains in a mechanically biased state to prevent loosening of at least one dry connection, wherein, - The sensor element (1) is connected to the measurement surface (30, 40, 50) by means of a material locking connection, - Forming a dry electrical contact between the contact element (2) and the sensor element (1).

13. The method according to claim 12, wherein, - Fixing a part of the contact element (2) relative to the components (3, 6, 9) by means of a threaded connection.

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