Magnetic retention replaceable chuck assembly for picking up and retaining test head unit

Abstract

Embodiments of the invention provide a contact chuck test head for a manipulator of an integrated circuit test system. The contact chuck test head includes a magnetically retained DUT contact unit that can be replaced by a technician without the need for any tool or special device. A contact chuck test head is mounted to an automated manipulator. A magnet is used at an interface between the DUT contact unit and the contact chuck base. This allows the DUT contact unit to be brought into close contact with the chuck base portion, and a magnetic force acts to align and mate the two components together. As the DUT contact units need to be replaced to accommodate different DUT sizes and types, it is advantageous to provide an easy-to-replace mechanism.

Description

[0001] Related Applications

[0002] This application claims the benefit and priority of U.S. Provisional Application Serial No. 63 / 417,478, filed on October 19, 2022, by Sherman (Attorney Docket No. ATSY - 0117 - 00.00US), which is hereby incorporated by reference in its entirety. Technical Field

[0003] Embodiments of the present invention relate to the field of integrated circuit manufacturing and testing. More specifically, embodiments of the present invention relate to systems and methods for testing integrated circuit products using automated robotic transport and manipulation mechanisms, including pick - and - place and / or pick - and - hold machines and / or robots. Background Art

[0004] During the manufacturing process, environmental and electrical testing of packaged or unpackaged integrated circuits is a common operation. Typically, in such testing, integrated circuit devices are subjected to electrical tests, such as "test modes", to confirm functionality, while also being subjected to environmental stress. For example, when conducting electrical tests, the integrated circuit is heated and / or cooled to its specification limits. In some cases, for qualification testing, for example, the integrated circuit may be subjected to stresses beyond its specifications, for example, to determine failure points and / or to establish a "guard band" on its environmental specifications.

[0005] Traditionally, such testing involves placing one or more integrated circuits and their associated test interfaces and support hardware into an environmental chamber or other tester. The environmental chamber will heat and / or cool the integrated circuit under test (known as or referred to as the device under test or "DUT"), and subject the test interfaces and support hardware to the desired test temperature.

[0006] Some test systems employ automated robotic manipulators to move integrated circuits from a source "tray" or "board" to the tester and test environment. Some devices and / or tests require applying a positive pressure or force to the DUT during testing. For example, some package types (such as ball grid array (BGA)) may not make reliable contact without applying force to ensure contact between the ball beads and the contacts of the test equipment. At other times, heaters and / or heat sinks can be held against the DUT during testing. For such tests, a "contact chuck" is typically utilized. A contact chuck may also be referred to as a "pick - and - place chuck", "manipulator chuck", "device chuck", and / or "pick - and - hold chuck". The "contact chuck" or "pick - and - hold chuck" is used to move the DUT from the source "tray" or "board" to the tester and test environment and hold the DUT in place during testing.

[0007] Figure 1 Shows a conventional pick - and - hold assembly or contact chuck assembly 10. The assembly 10 includes two fasteners 11, such as bolts, for securing the assembly 10 to a manipulator (not shown) for movement in the X, Y, and Z dimensions. The assembly 10 is typically oriented downward. For example, a DUT (not shown) will be located within the DUT interface 15.

[0008] The DUT interface 15 is typically specific to a particular DUT. Thus, the assembly 10 is typically replaced for each type of DUT to be tested. For a test setup configured to test 16 DUTs, 32 fasteners 11 are utilized. Therefore, changing from a test system for a first DUT to test a second DUT requires the removal of 32 fasteners 11 and the insertion of 32 fasteners 11. SUMMARY OF THE INVENTION

[0009] Accordingly, embodiments of the present invention provide a contact chuck test head for a manipulator of an integrated circuit tester system. The contact chuck test head includes a magnetically held DUT contact unit that can be replaced by a technician without any tools or special devices. The contact chuck test head is mounted to an automated manipulator. Magnets are used at the interface between the DUT contact unit and the contact chuck base. This allows the DUT contact unit to be brought close to the contact chuck base portion, and the magnetic force acts to align and mate the two components together. Since the DUT contact unit needs to be replaced to accommodate different DUT sizes and types, it is advantageous to provide an easily replaceable mechanism.

[0010] According to a first embodiment of the present invention, a contact chuck test head assembly includes: a device - under - test (DUT) interface unit configured to physically mate with a DUT; and a contact chuck base unit configured to magnetically hold the DUT interface unit. The contact chuck base unit is configured to be magnetically held by a manipulator device, wherein the manipulator device is configured to move the DUT within a test environment. The contact chuck test head assembly is configured to apply a force to the DUT in a test fixture during DUT testing.

[0011] Embodiments include the above, and also include where the contact chuck test head assembly is magnetically attached to a DUT layout unit.

[0012] Embodiments include the above, and also include where the contact chuck test head assembly is magnetically attached to a DUT layout unit heat sink unit.

[0013] Embodiments include the above, and also include a hard stop configured to limit the downward travel of the contact chuck test head assembly.

[0014] The embodiments include the above, and also include alignment protrusions for aligning the contact chuck test head assembly with the test fixture.

[0015] The embodiments include the above, and also include a pneumatic cylinder configured to hold the DUT during movement of the contact chuck test head assembly.

[0016] The embodiments include the above, and also include where the contact chuck test head assembly is further configured to conduct heat energy away from the DUT during testing.

[0017] The embodiments include the above, and also include alignment holes for receiving protrusions from the DUT layout unit to align the contact chuck test head assembly with the DUT layout unit.

[0018] The embodiments include the above, and also include fastening holes configured to couple to a non-magnetic DUT layout unit.

[0019] The embodiments include the above, and also include channels for applying a vacuum to hold the DUT.

[0020] The embodiments include the above, and also include where the channels are further configured to apply gas pressure to eject the DUT.

[0021] According to another embodiment of the present invention, a magnetic device under test layout unit (DLU) includes a DLU heat sink and a contact chuck interface, wherein the DLU is configured to hold the contact chuck by magnetic force.

[0022] The embodiments include the above, and also include a plurality of magnets for coupling to the contact chuck.

[0023] The embodiments include the above, and also include where the magnets comprise samarium cobalt.

[0024] The embodiments include the above, and also include where the DLU includes a magnetic material attracted to the magnets of the contact chuck.

[0025] The embodiments include the above, and also include where the contact chuck interface includes protrusions configured to align with holes of the contact chuck.

[0026] The embodiments include the above, and also include where the contact chuck interface is configured to couple heat energy from the DUT to the DLU heat sink.

[0027] According to a method embodiment of the present invention, a method of testing an integrated circuit device under test (DUT) includes: magnetically coupling a contact chuck to a device under test layout unit (DLU), picking up the DUT using the contact chuck while coupled to the DLU, placing the DUT into a test fixture, and testing the DUT while the DUT is held by the contact chuck.

[0028] The embodiments include the above, and further include that the pick-up also includes applying a vacuum to the DUT through contact with the chuck.

[0029] According to another method embodiment of the present invention, the method of replacing the contact chuck includes: removing the first magnetically held contact chuck from the device under test layout unit (DLU) without using a tool; and magnetically coupling the second contact chuck to the DLU without using a tool.

[0030] According to a further embodiment of the present invention, the pick-and-place system includes: a device under test layout unit (DLU); a first contact chuck configured to be removed from the DLU by manual force without using a tool; and a second contact chuck configured to be attached to the DLU without using a tool. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A conventional pick-up and hold assembly or contact chuck assembly is shown.

[0032] Figure 2 According to an embodiment of the present invention, an exemplary embodiment of a pick-up and hold contact chuck assembly is shown.

[0033] Figure 3A According to an embodiment of the present invention, a magnetic device under test layout unit ("DLU") radiator is shown.

[0034] Figure 3B According to an embodiment of the present invention, a magnetic DLU radiator combined with a magnetic contact chuck assembly is shown.

[0035] Figure 4 According to an embodiment of the present invention, a cross-sectional view of a contact chuck assembly is shown.

[0036] Figure 5 According to an embodiment of the present invention, a contact chuck assembly and a DUT layout unit are shown.

[0037] Figure 6 According to an embodiment of the present invention, an assembled view of a magnetically held contact chuck is shown.

[0038] Figure 7A According to an embodiment of the present invention, a plurality of contact chuck assemblies magnetically attached to a plurality of DLU radiator units are shown.

[0039] Figure 7B According to an embodiment of the present invention, a top isometric view of a plurality of contact chuck assemblies magnetically attached to a common device under test layout unit 600 is shown.

[0040] Figure 7CAn isometric bottom view of a plurality of contact chuck assemblies magnetically attached to a common DUT layout unit, in accordance with an embodiment of the present invention, is shown.

[0041] Figure 8 A nozzle and a pneumatic piston within a contact chuck assembly are shown, in accordance with an embodiment of the present invention.

[0042] The drawings incorporated in and forming a part of this specification are included to illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the invention. Unless otherwise noted, the dimensions are exemplary, and the drawings may not be drawn to scale. Detailed Description

[0043] Reference will now be made in detail to various embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with these embodiments, it is to be understood that these embodiments are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications, and equivalents that may be included within the spirit and scope of the invention as defined by the appended claims. In addition, in the following detailed description of the invention, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, those skilled in the art will recognize that the invention may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the invention.

[0044] Some of the detailed descriptions that follow are presented in the form of program, steps, logic blocks, processes, and other symbolic representations of operations on data bits that can be executed on a computer memory. These descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others skilled in the art. A program, computer-executed steps, logic blocks, processes, etc., are herein and generally considered to be a self-consistent sequence of steps or instructions leading to a desired result. These steps are those requiring physical manipulation of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, transferred, combined, compared, and otherwise manipulated in a computer system. Sometimes, for reasons of generality, it has proven convenient to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, data, etc.

[0045] However, it should be remembered that all such and similar terms are associated with appropriate physical quantities and are merely convenient labels applied to those quantities. Unless otherwise clearly stated, as will be apparent from the following discussion, it is to be understood that in the present invention, the use of terms such as "test" or "heat" or "maintain temperature" or "bring" or "capture" or "store" or "read" or "analyze" or "generate" or "parse" or "receive" or "select" or "determine" or "display" or "present" or "calculate" or "send" or "accept" or "reduce" or "detect" or "set" or "access" or "place" or "test" or "form" or "install" or "remove" or "terminate" or "stop" or "coat" or "process" or "perform" or "generate" or "adjust" or "create" or "execute" or "continue" or "index" or "translate" or "compute" or "measure" or "collect" or "run" refers to the actions and processes of a computer system or similar electronic computing device, or actions and processes under its control, which manipulate and transform data represented as physical (electronic) quantities in the registers and memories of the computer system into other data similarly represented as physical quantities in the memories or registers of the computer system or other such information storage, transmission, or display devices.

[0046] The meaning of "non-transitory computer-readable medium" should be construed to exclude only those types of transitory computer-readable media that are found to be outside the scope of patentable subject matter under 35 U.S.C. § 101 in In re Nuijten, 500 F.3d 1346, 1356 - 57 (Fed. Cir. 2007). The use of this term should be understood to exclude only the propagation of transitory signals themselves from the scope of the claims and not to waive the right to all standard computer-readable media that are more than just the propagation of transitory signals themselves.

[0047] Magnetic holding replaceable chuck assembly for picking up and holding a test head unit

[0048] Figure 2 According to an embodiment of the present invention, an exemplary embodiment of a pick-up and hold contact chuck assembly 200 is shown. The pick-up and hold contact chuck assembly 200 is configured to pick up a device under test ("DUT") from a source tray or plate, move the DUT to a test fixture or slot, place the DUT on the fixture and / or in the slot, and hold and / or secure the DUT in place during testing. Generally, a robotic manipulator moves the test head in the X, Y, and Z directions to place the test head 200 above the device under test ("DUT"). A plurality of magnets 210 mounted on the contact chuck assembly 200 replace the function of the fasteners 11 ( Figure 1 ) to attach the contact chuck assembly 200 to the manipulator (not shown). For example, the DUT (not shown) will be located within the DUT interface 215 and is occluded in this view.

[0049] The number of magnets 210 shown is exemplary. Note that the magnets 210 may not be located in the same position(s) as the fasteners 11. Instead, in some embodiments, the magnets 210 are located at positions on the contact chuck assembly 200 different from the fasteners 11. The holes 211 correspond to the fasteners 11 of the assembly 10, and are provided to ensure reverse compatibility with the assembly 10( Figure 1 ). The contact chuck assembly 200 also includes a plurality of alignment holes 220 for receiving pins and / or dowels to align with the manipulator assembly.

[0050] According to an embodiment of the present invention, the magnets 210 may be aligned with corresponding magnets (opposite poles) of a manipulator assembly (not shown). In some embodiments, the manipulator assembly may not include such magnets. For example, the manipulator assembly may be formed of a magnetic material attracted by the magnets 210.

[0051] Figure 3A According to an embodiment of the present invention, a magnetic DUT layout unit (“DLU (DUT Layout Unit)”) heat sink 300 is shown. The DLU may also be known as or referred to as a chuck fixture, a chuck mounting plate, and / or a chuck attachment plate. The DLU heat sink 300 is configured to be magnetically attached to the magnetic contact chuck assembly 200. The DLU heat sink 300 includes a plurality of magnets 310 configured to align with the magnets 210 of the contact chuck assembly 200( Figure 2 ). The number and positions of the plurality of magnets 310 are exemplary. The DLU heat sink 300 also includes a plurality of alignment holes 320 for receiving pins and / or dowels to align with the magnetic contact chuck assembly 200. In some embodiments, the DLU heat sink 300 may include pins and / or dowels to align with the holes 220 of the magnetic contact chuck assembly 200( Figure 2 ).

[0052] Figure 3B According to an embodiment of the present invention, a magnetic DLU heat sink 300 combined with the magnetic contact chuck assembly 200 is shown. Figure 3B Alignment of the DLU heat sink 300 with the magnetic contact chuck assembly 200 is shown. Figure 3B The DUT interface 215 is also shown. In some embodiments, the contact chuck assembly 200 may hold the DUT by vacuum action.

[0053] Figure 4According to an embodiment of the present invention, a cross-sectional view of a contact chuck assembly 200 is shown. The contact chuck assembly 200 includes a pneumatic tube or cylinder 410. The cylinder 410 is configured to evacuate the device under test, so as to, for example, pick up the device under test from a source tray or plate and place the device under test into a test fixture. The cylinder 410 is also configured to unload the device under test from the test fixture and place the device under test into a post-test tray or plate.

[0054] Figure 5 According to an embodiment of the present invention, a contact chuck assembly 200 and a DUT layout unit ("DLU") 530 are shown. The contact chuck assembly 200 includes a DUT contact unit 510 and a contact chuck base unit 520. The DUT contact unit 510 is assembled into the contact chuck base unit 520 and magnetically held thereon to form the contact chuck assembly 200. The contact chuck assembly 200 is configured to be attached to and magnetically held to the DUT layout unit 530. In the illustrated embodiment, the DUT layout unit 530 does not include protruding heat sink elements, such as "fins". However, it can be understood that the DUT layout unit 530 may still include a heat sink function.

[0055] Figure 6 According to an embodiment of the present invention, an assembled view of a magnetically held contact chuck is shown. A plurality of magnetically held contact chucks 200 are attached to and magnetically held to a DUT layout unit 600 or a magnetically held DLU heat sink unit 610. The DUT interface of the contact chuck 200 may vary depending on the package type of the DUT. For example, a ball grid array (BGA) DUT may typically require a different contact chuck 200 than that required for a leaded ceramic chip carrier (LCCC) package. In some embodiments, a hard stop 620 is configured to limit the downward travel of the contact chuck assembly 200, for example, to prevent the DUT from being forced too far into the test fixture.

[0056] Figure 7A According to an embodiment of the present invention, a plurality of contact chuck assemblies 200 magnetically attached to a plurality of DLU heat sink units 610 are shown. Figure 7B According to an embodiment of the present invention, a top isometric view of a plurality of contact chuck assemblies 200 magnetically attached to a common DUT layout unit 600 is shown.

[0057] Figure 7C According to an embodiment of the present invention, a bottom isometric view of a plurality of contact chuck assemblies 200 magnetically attached to a common DUT layout unit 600 is shown. Figure 7C A portion of the cylinder 410 within the contact chuck assembly 200 is also shown.

[0058] Figure 8Embodiments in accordance with the present invention illustrate nozzles and pneumatic pistons within a contact chuck assembly.

[0059] Embodiments in accordance with the present invention provide systems and methods for a replaceable contact chuck test head utilizing magnetic coupling. Although the present invention has been shown and described with respect to certain exemplary embodiments, equivalent changes and modifications will occur to those skilled in the art upon reading and understanding this specification and the drawings. In particular, with respect to the various functions performed by the above-described components (assemblies, devices, etc.), unless otherwise specified, the terminology used to describe such components (including references to "means") is intended to correspond to any component that performs the specified function of the component (e.g., functionally equivalent), even if not structurally equivalent to the disclosed structure that performs the functions of the exemplary embodiments of the present invention shown herein. Moreover, although a particular feature of the present invention may have been disclosed with respect to only one of several embodiments, such feature may be combined with one or more features of the other embodiments, which may be desirable and advantageous for any given or particular application.

[0060] Accordingly, various embodiments of the present invention are described. Although the present invention has been described by way of specific embodiments, it should be understood that the present invention should not be construed as being limited by these embodiments, but rather should be interpreted in accordance with the following claims.

Claims

1. A contact chuck test head assembly, which comprises: A device under test (DUT) interface unit configured to physically mate with the DUT; A contact chuck base unit configured to magnetically hold the DUT interface unit, wherein the contact chuck base unit is configured to be magnetically held by a manipulator device, wherein the manipulator device is configured to move the DUT within a test environment, and wherein the contact chuck test head assembly is configured to apply a force to the DUT in a test fixture during testing of the DUT.

2. The contact chuck test head assembly according to claim 1, wherein, the contact chuck test head assembly is magnetically attached to a DUT layout unit.

3. The contact chuck test head assembly according to claim 1, wherein, the contact chuck test head assembly is magnetically attached to a DUT layout unit heat sink unit.

4. The contact chuck test head assembly according to claim 1, further comprising a hard stop configured to limit downward travel of the contact chuck test head assembly.

5. The contact chuck test head assembly according to claim 1, further comprising an alignment protrusion for aligning the contact chuck test head assembly with the test fixture.

6. The contact chuck test head assembly according to claim 1, further comprising a pneumatic cylinder configured to hold the DUT during movement of the contact chuck test head assembly.

7. The contact chuck test head assembly according to claim 1, further configured to conduct heat energy away from the DUT during testing.

8. The contact chuck test head assembly according to claim 1, further comprising an alignment hole for receiving a protrusion from a DUT layout unit to align the contact chuck test head assembly with the DUT layout unit.

9. The contact chuck test head assembly according to claim 1, further comprising a fastening hole configured to couple to a non-magnetic DUT layout unit.

10. The contact chuck test head assembly according to claim 1, further comprising a channel for applying a vacuum to hold the DUT.

11. The contact chuck test head assembly according to claim 10, wherein, the channel is further configured to apply gas pressure to eject the DUT.

12. A magnetic device under test layout unit (DLU), which comprises: A DLU heat sink; and A contact chuck interface, wherein the DLU is configured to hold a contact chuck by magnetic force.

13. The DLU according to claim 12, further comprising a plurality of magnets for coupling to the contact chuck.

14. The DLU according to claim 13, wherein, the magnets comprise samarium cobalt.

15. The DLU according to claim 12, wherein, the DLU includes a magnetic material attracted to the magnets of the contact chuck.

16. The DLU according to claim 11, wherein, the contact chuck interface includes a protrusion configured to align with a hole of the contact chuck.

17. The DLU according to claim 12, wherein, the contact chuck interface is configured to couple heat energy from the DUT to the DLU heat sink.

18. A method for testing an integrated circuit device under test (DUT), the method comprising: magnetically coupling a contact chuck to a device layout unit (DLU) under test; picking up the DUT using the contact chuck while coupled to the DLU; placing the DUT into a test fixture; and testing the DUT while held by the contact chuck.

19. The method according to claim 18, wherein the picking up further comprises applying a vacuum to the DUT through the contact chuck.

20. A pick-and-place system, comprising: a device layout unit (DLU) under test; a first contact chuck configured to be removed from the DLU by manual force application and without using tools; and a second contact chuck configured to be attached to the DLU without using tools.

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