Electronic device including wiring

Abstract

An electronic device including wiring is disclosed. An electronic device including a plurality of wires carrying DC power and at least one RF signal according to various embodiments of the present invention may include an RF transmission unit transmitting an RF signal and a power transmission unit transmitting DC power. The power transmission unit may include a first power supply wiring including a conductive material, a second power supply wiring including a conductive material and electrically separated from the first wiring in a first direction, a third power supply wiring disposed between the first power supply wiring and the second power supply wiring in parallel with the second power supply wiring and disposed to be electrically separated from the second power supply wiring, and at least one via electrically connecting the first power supply wiring and the third power supply wiring.

Description

Technical Field

[0001] Various embodiments disclosed herein relate to electronic devices, and more particularly, to electronic devices including wiring. Background Art

[0002] Electronic devices include circuit boards that provide space for placing electrical components such as integrated circuits, passive elements, sensors, and connecting cables, and circuit wiring for electrically connecting to the electrical components. The electrical components are directly arranged on the surface of the circuit board or electrically connected to the circuit board via cables.

[0003] A cable for transmitting signals or power supply, such as a coaxial cable, a ribbon cable, or a flexible cable, may be located inside an electronic device. The flexible cable is used because it is thin and has good flexibility and adaptability, which is conducive to the miniaturization of electronic devices.

[0004] Via the wiring of the circuit board or the flexible cable, power (eg, DC or AC power) may be supplied, a ground may be provided, or various signals such as an RF signal may be transmitted. Summary of the invention

[0005] Solution to the problem

[0006] In order to reduce the size of electronic devices and / or reduce the area of ​​circuit boards, it may be necessary to design power wiring and RF wiring to be adjacent to each other. However, when RF wiring, power wiring and / or ground wiring are arranged adjacent to each other, a crosstalk phenomenon may occur in which an RF signal leaks from the RF wiring through the power wiring or the ground wiring due to electromagnetic interference (EMI), resulting in problems such as noise or malfunction. When shielding is added to prevent such problems, the size and cost of the cable and / or circuit board increase.

[0007] Various embodiments disclosed herein can provide electronic devices including wiring configured to transmit RF signals and power and reduce crosstalk.

[0008] According to various embodiments of the present disclosure, an electronic device including a plurality of wirings through which DC power and at least one RF signal are transmitted may include an RF transmitter configured to transmit the RF signal and a power transmitter configured to transmit the DC power. The power transmitter may include a first power wiring including a conductive material, a second power wiring including a conductive material and electrically spaced apart from the first power wiring in a first direction, a third power wiring disposed between the first power wiring and the second power wiring in parallel with the second power wiring and electrically spaced apart from the second power wiring, and at least one first path electrically connecting the first power wiring and the third power wiring.

[0009] In various embodiments, the second power wiring and the third power wiring may be configured to have a capacitance value, the first path may be configured to have an inductance value, and the capacitance value and the inductance value may be configured to filter the frequency of the RF signal.

[0010] In various embodiments, the width of the second power wiring and the distance between the second power wiring and the third power wiring may be configured so that a capacitor constituted by the second power wiring and the third power wiring has the capacitance value.

[0011] In various embodiments, the power transmitter may include a plurality of first paths, and the number of the first paths and the arrangement intervals between adjacent ones of the first paths may be configured such that the plurality of first paths equivalently have the inductance value.

[0012] In various embodiments, the first vias may be arranged in a plurality of rows in a direction in which the first power wiring extends, and the number of rows may be configured such that the plurality of first vias equivalently have the inductance value.

[0013] In various embodiments, the RF transmitter may include a first conductor having a surface oriented in a first direction, a second conductor positioned parallel to the first conductor relative to the first conductor along the first direction, and a substrate integrated waveguide including a plurality of second vias located at edges of the first conductor and the second conductor and electrically connecting the first conductor and the second conductor.

[0014] In various embodiments, the electronic device includes a plurality of RF transmitters, the RF transmitters may be arranged side by side with the power transmitter, and the power transmitter may be located between the plurality of RF transmitters.

[0015] In various embodiments, the electronic device may include a flexible printed cable, the flexible printed cable may include a first layer having one surface oriented in a first direction, a second layer disposed parallel to the first layer along the first direction relative to the first layer, a third layer disposed parallel to the second layer along the first direction relative to the second layer, and an insulating material including an electrically insulating and flexible material and disposed between adjacent layers of the first layer, the second layer, and the third layer. The first power wiring may be disposed on the first layer, the second power wiring may be disposed on the third layer, and the third power wiring may be disposed on the second layer.

[0016] In various embodiments, the flexible printed cable may include an RF transmitter disposed in parallel with first to third power wirings, and the RF power transmitter may include a first conductor disposed in parallel with the first power wiring on a first layer, a second conductor disposed in parallel with the third power wiring on a second layer, a third conductor disposed in parallel with the third power wiring on a third layer, a plurality of second vias electrically connecting an edge of the first conductor and an edge of the second conductor, and a plurality of third vias electrically connecting an edge of the third conductor and an edge of the second conductor. The first conductor, the second conductor, and the second via may define a first substrate integrated waveguide, and the second conductor, the third conductor, and the third via may define a second substrate integrated waveguide.

[0017] In various embodiments, the flexible printed cable may include a fourth layer disposed between the first layer and the second layer.

[0018] The cable for an electronic device according to various embodiments of the present disclosure may include an RF transmitter configured to transmit an RF signal and a power transmitter configured to transmit DC power. The power transmitter may include a first power wiring including a conductive material, a second power wiring including a conductive material and electrically spaced apart from the first power wiring in a first direction, a third power wiring arranged between the first power wiring and the second power wiring in parallel with the second power wiring and electrically spaced apart from the second power wiring, and at least one first path electrically connecting the first power wiring and the third power wiring.

[0019] In various embodiments, the second power wiring and the third power wiring may be configured to have a capacitance value, the first path may be configured to have an inductance value, and the capacitance value and the inductance value may be configured to filter the frequency of the RF signal.

[0020] In various embodiments, the width of the second power wiring and the distance between the second power wiring and the third power wiring may be configured so that a capacitor constituted by the second power wiring and the third power wiring has the capacitance value.

[0021] In various embodiments, the power transmitter may include a plurality of first paths, and the number of the first paths and the arrangement intervals between adjacent ones of the first paths may be configured such that the plurality of first paths equivalently have the inductance value.

[0022] In various embodiments, the first vias may be arranged to have a plurality of rows in a direction in which the first power wiring extends, and the number of rows may be configured such that the plurality of first vias equivalently have the inductance value.

[0023] In various embodiments, the RF transmitter may include a first conductor having a surface oriented in a first direction, a second conductor positioned parallel to the first conductor relative to the first conductor along the first direction, and a substrate integrated waveguide including a plurality of second vias located at edges of the first conductor and the second conductor and electrically connecting the first conductor and the second conductor.

[0024] In various embodiments, the electronic device may include a plurality of RF transmitters, the RF transmitters may be arranged side by side with the power transmitter, and the power transmitter may be located between the plurality of RF transmitters.

[0025] In various embodiments, the cable may include a first layer having one surface oriented in a first direction, a second layer disposed parallel to the first layer along the first direction relative to the first layer, a third layer disposed parallel to the second layer along the first direction relative to the second layer, and an insulating material including an electrically insulating and flexible material and disposed between adjacent layers of the first layer, the second layer, and the third layer. The first power wiring may be disposed on the first layer, the second power wiring may be disposed on the third layer, and the third power wiring may be disposed on the second layer.

[0026] In various embodiments, the cable includes an RF transmitter arranged in parallel with the first to third power wirings, and the RF transmitter may include a first conductor arranged in parallel with the first power wiring on a first layer, a second conductor arranged in parallel with the third power wiring on a second layer, a third conductor arranged in parallel with the third power wiring on a third layer, a plurality of second vias electrically connecting an edge of the first conductor and an edge of the second conductor, and a plurality of third vias electrically connecting an edge of the third conductor and an edge of the second conductor. The first conductor, the second conductor, and the second via may define a first substrate integrated waveguide, and the second conductor, the third conductor, and the third via may define a second substrate integrated waveguide.

[0027] In various embodiments, the cable can include a fourth layer disposed between the first layer and the second layer.

[0028] According to various embodiments disclosed herein, an equivalent capacitor formed by a third power wiring located between a first power wiring and a second power wiring and an equivalent inductor formed by a first path connecting the first power wiring and the third power wiring provide an electromagnetic bandgap (EBG) structure to filter RF signals. As a result, an electronic device that reduces RF signal crosstalk can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In conjunction with the description of the drawings, the same or similar components may be denoted by the same or similar reference numerals.

[0030] Figure 1 is a block diagram of an electronic device according to various embodiments in a network environment.

[0031] Figure 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0032] Figure 2b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0033] Figure 3 is a perspective view showing the interior of an electronic device according to various embodiments of the present disclosure.

[0034] Figure 4a is a perspective view illustrating an RF transmitter and a power transmitter of an electronic device according to various embodiments.

[0035] Figure 4b is a side view illustrating an RF transmitter of an electronic device according to various embodiments.

[0036] Figure 4c is a cross-sectional view illustrating an RF transmitter and a power transmitter of an electronic device according to various embodiments.

[0037] Figure 4d is a plan view showing various layers of a cable of an electronic device according to various embodiments.

[0038] Figure 5a is a perspective view illustrating a power transmitter according to various embodiments.

[0039] Figure 5b is a circuit diagram illustrating an equivalent circuit of a power transmitter according to various embodiments.

[0040] Figure 6a is a perspective view illustrating a power transmitter according to various embodiments.

[0041] Figure 6b is a cross-sectional view illustrating a power transmitter according to various embodiments.

[0042] Figure 7a is a perspective view illustrating a power transmitter according to various embodiments.

[0043] Figure 7b is a cross-sectional view illustrating a power transmitter according to various embodiments.

[0044] Figure 8a An S-parameter graph showing frequency matching characteristics and transmission / reception characteristics of an electronic device according to various embodiments of the present disclosure is shown.

[0045] Figure 8b A graph illustrating crosstalk characteristics of a power transmitter of an electronic device according to various embodiments of the present disclosure and a comparative example is shown. DETAILED DESCRIPTION

[0046] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0047] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0048] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0049] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0050] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0051] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0052] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0053] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0054] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0055] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0056] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0057] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0058] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0059] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0060] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0061] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0062] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0063] The wireless communication module 192 may support 5G networks after 4G networks and next generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low latency communications (URLLC). The wireless communication module 192 may support high frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 may support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0064] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 197.

[0065] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high frequency band.

[0066] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0067] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0068] Figure 2a is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0069] Figure 2b is a rear perspective view of an electronic device according to an embodiment of the present disclosure.

[0070] Reference Figure 2a and Figure 2bAccording to an embodiment, the electronic device 200 may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the term "housing" may refer to a space defined by the housing. Figure 2a The structure of some of the first surface 210A, the second surface 210B and the side surface 210C in the embodiment. According to another embodiment, at least a portion of the first surface 210A can be defined by a substantially transparent front surface plate 202 (e.g., a glass plate or a polymer plate including various coatings). The second surface 210B can be defined by a substantially opaque rear surface plate 211. The rear surface plate 211 is made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of two or more of these materials. The side surface 210C can be defined by a side surface frame structure (or "side surface member") 218 ​​connected to the front surface plate 202 and the rear surface plate 211 and including metal and / or polymer. In some embodiments, the rear surface plate 211 and the side surface frame structure 218 can be configured as one piece and can include the same material (e.g., a metal material such as aluminum).

[0071] In the illustrated embodiment, the front surface plate 202 may include two first regions 210D at its opposite long side edges, which are bent and seamlessly extended from the first surface 210A toward the rear surface plate 211. Figure 2b ), the rear surface plate 211 may include two second areas 210E at its opposite long side edges, which are bent from the second surface 210B toward the front surface plate 202 and extend seamlessly. In some embodiments, the front surface plate 202 (or the rear surface plate 211) may include only one of the first areas 210D (or the second areas 210E). In another embodiment, some of the first areas 210D or the second areas 210E may not be included. In the above embodiment, when viewed from the side of the electronic device 200, the side surface frame structure 218 may have a first thickness (or width) on the side that does not include the first area 210D or the second area 210E, and may have a second thickness that is less than the first thickness on the side that includes the first area 210D or the second area 210E.

[0072] According to an embodiment, the electronic device 200 may include at least one of the display 201, audio modules 203, 207, and 214, sensor modules 204, 216, and 219, camera modules 205, 212, and 213, a key input device 217, a light emitting element 206, and connector holes 208 and 209. In some embodiments, at least one component (e.g., the key input device 217 or the light emitting element 206) may be omitted from the electronic device 200, or other components may be additionally included in the electronic device 200.

[0073] The display 201 may be visually exposed through, for example, a substantial portion of the front surface plate 202. In some embodiments, at least a portion of the display 201 may be visually exposed through the front surface plate 202, which defines a first surface 210A and a first region 210D of the side surface 210C. In some embodiments, the edge of the display 201 may be configured to be substantially the same shape as the perimeter of the front surface plate 202 adjacent thereto. In another embodiment (not shown), the distance between the perimeter of the display 201 and the perimeter of the front surface plate 202 may be substantially constant so as to increase the exposed area of ​​the display 201.

[0074] In yet another embodiment (not shown), a recess or opening may be provided in a portion of the screen display area of ​​the display 201, and at least one of the audio module 214, the sensor module 204, the camera module 205, and the light emitting element 206 may be aligned with the recess or opening. In yet another embodiment (not shown), the rear surface of the screen display area of ​​the display 201 may include at least one of the audio module 214, the sensor module 204, the camera module 205, the fingerprint sensor 216, and the light emitting element 206. In yet another embodiment (not shown), the display 201 may be coupled to or disposed adjacent to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect an electromagnetic field type stylus. In some embodiments, at least some of the sensor modules 204 and 219 and / or at least some of the key input devices 217 may be disposed in the first area 210D and / or the second area 210E.

[0075] The audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214. The microphone hole 203 may include a microphone disposed therein to obtain external sound, and in some embodiments, a plurality of microphones may be disposed therein to be able to detect the direction of the sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a communication receiver hole 214. In some embodiments, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or may include a speaker without the speaker holes 207 and 214 (e.g., a piezoelectric speaker).

[0076] The sensor modules 204, 216, and 219 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. The sensor modules 204, 216, and 219 include, for example: a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor), which are disposed on a first surface 210A of the housing 210; and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (e.g., a fingerprint sensor 216), which are disposed on a second surface 210B of the housing 210. The fingerprint sensor may be disposed not only on the first surface 210A (e.g., the display 201) of the housing 210, but also on the second surface 210B. The electronic device 200 may further include at least one of sensor modules (not shown) such as a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 204.

[0077] The camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200 and a second camera device 212 and / or a flash 213 disposed on a second surface 210B of the electronic device 200. The camera devices 205 and 212 may include one or more lenses, image sensors, and / or image signal processors. The flash 213 includes, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 200.

[0078] The key input device 217 may be provided on the side surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include some or all of the key input devices 217 described above, and the key input devices 217 not included may be implemented in another form (such as soft keys) on the display 201. In some embodiments, the key input device may include a sensor module 216 provided on the second surface 210B of the housing 210.

[0079] The light emitting element 206 may be disposed, for example, on the first surface 210A of the housing 210. The light emitting element 206 may provide, for example, status information of the electronic device 200 in an optical form. In another embodiment, the light emitting element 206 may provide a light source linked to the operation of, for example, the camera module 205. The light emitting element 206 may include, for example, a light emitting diode (LED), an IR LED, and a xenon lamp.

[0080] The connector holes 208 and 209 may include a first connector hole 208 capable of accommodating a connector (e.g., a USB connector) configured to send power and / or data to / receive power and / or data from an external electronic device and a second connector hole (e.g., a headphone jack) 209 capable of accommodating a connector configured to send audio signals to / receive audio signals from an external electronic device.

[0081] Figure 3 is a perspective view showing the interior of an electronic device according to an embodiment of the present disclosure.

[0082] Reference Figure 3 , the electronic device 300 may include a side surface frame structure 310 (e.g., a housing), a support member 311 (e.g., a bracket), a first printed circuit board 320, a second printed circuit board 340, and a battery 350. In some embodiments, in the electronic device 300, at least one of the above components may be omitted, or other components may be additionally included. At least one component of the electronic device 300 may be Figure 2a or Figure 2b At least one component of the electronic device 200 is the same or similar, and its redundant description will be omitted below.

[0083] The first support member 311 may be disposed inside the electronic device 300 to be connected to the side surface frame structure 310 (e.g., a housing), or may be configured integrally with the side surface frame structure 310. The first support member 311 is made of, for example, a metal material and / or a non-metallic (e.g., polymer) material. A display (not shown) may be coupled to one surface of the first support member 311, and a first printed circuit board 320 and a second printed circuit board 340 may be coupled to another surface. A processor, a memory, a sensor, a camera, and / or a female connector 321 may be mounted on the first printed circuit board 320. The processor includes, for example, one or more of a central processing unit, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor. In some embodiments, the first printed circuit board may be a laminate in which a plurality of PCBs are laminated.

[0084] The female connector 321 can be a member connected to the male connector 323 located at the far end of the cable 322 to electrically connect the electrical components of the electronic device to the cable 322. The term "male" can be used to refer to the connector located at the far end of the cable, and the term "female" can be used to refer to the connector located at the object electrically connected to the cable. The female connector and the male connector can be connected by an interference fit by friction or by a snap fit using elastic lugs. In some embodiments, the female connector can have a receiving portion provided with a conductor contact portion, and the male connector can have a terminal received in the female connector to form an electrical contact at the conductor contact portion. However, the present disclosure is not limited to this, and a configuration opposite to the above configuration is also possible.

[0085] The cable 322 may be a cable that interconnects various electrical components of the electronic device, such as the first and second printed circuit boards 320 and 340, an antenna (not shown), a camera, and / or a display panel (e.g., Figure 2a In some embodiments, the cable 322 may include a ribbon cable, a coaxial cable, a flexible flat cable (FFC), or a flexible printed cable (FPC). A male connector may be provided at a distal end of the cable.

[0086] The second printed circuit board 340 includes other electrical components of the electronic device, for example, an external interface of a power management IC (PMIC), such as an interface for sending power and / or data to / from an external electronic device (e.g., a USB interface) and / or an interface for sending / receiving analog audio signals to / from an external electronic device (e.g., a 3.5 mm headphone jack). The second printed circuit board may include a cable 322 to be connected to the first printed circuit board.

[0087] The battery 350 is a device for supplying power to at least one component of the electronic device 300, and includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as, for example, the first printed circuit board 320 and the second printed circuit board 340. The battery 350 may be integrally disposed inside the electronic device 300, or may be detachably disposed on the electronic device 300.

[0088] The electronic device 300 according to various embodiments may include an electronic device such as a bar type, a foldable type, a rollable type, a sliding type, a wearable type, a tablet personal computer (PC), and / or a notebook PC. The electronic device 300 according to various embodiments of the present disclosure is not limited to the above examples and may include various other electronic devices.

[0089] Figure 4ais a perspective view showing an RF signal circuit 420 and a power supply circuit 410 of an electronic device according to an embodiment of the present disclosure.

[0090] Figure 4b is a side view showing an RF signal circuit 420 of the electronic device according to an embodiment of the present disclosure.

[0091] Figure 4c is a cross-sectional view showing an RF signal circuit 420 and a power supply circuit 410 of an electronic device according to an embodiment of the present disclosure.

[0092] Figure 4d is a plan view showing respective layers of a flexible printed circuit board 400 of an electronic device according to an embodiment of the present disclosure.

[0093] exist Figure 4a and Figure 4d In the figure, the insulating material 405 is omitted.

[0094] Figure 4b yes Figure 4a A side view of the RF signal circuit viewed along the x-axis.

[0095] Figure 4c The cross section is along Figure 4a The cross section is taken along the X-X' direction.

[0096] Reference Figure 4a , Figure 4b , Figure 4c and Figure 4d , electronic devices (e.g. Figure 2a and Figure 2b The electronic device 200 or Figure 3 The electronic device 300 in FIG. 1 may include an RF signal circuit 420 and a power supply circuit 410 .

[0097] The power supply circuit 410 may be a component that supplies power to various electrical components of an electronic device. In various embodiments, the power may be, for example, power supplied in the form of a direct current. In some embodiments, the power may be power supplied in the form of an alternating current. The power supply circuit 410 may include a first power supply conductor 411, a second power supply conductor 412, and a third power supply conductor 413. The first power supply conductor 411, the second power supply conductor 412, and the third power supply conductor 413 include, for example, conductive materials such as copper, silver, aluminum, and / or carbon. The second power supply conductor 412 may be located below the first wiring (along the -z direction in the figure, which may be referred to as the "first direction"). The third power supply conductor 413 may be located between the first power supply conductor 411 and the second power supply conductor 412, and may be arranged substantially parallel to the third power supply conductor 413. Referring to Figure 4dIn various embodiments, the third power conductor 413 may include a plurality of conductive segments 4131 .

[0098] In various embodiments, the power circuit 410 may include one or more first vias 414. The one or more first vias 414 may electrically connect the first power conductor 411 and the second power conductor 412, and may be arranged at a constant pitch dv in the direction (e.g., y direction) in which the power circuit 410 extends. Therefore, the first power conductor 411 and the third power conductor 413 may be electrically connected to each other and may have substantially the same potential, and the second power conductor 412 may have a potential different from that of the first power conductor 411. In various embodiments, the second power conductor 412 of the power circuit 410 operates as a ground wiring, and the first power conductor 411 and the third power conductor 413 may operate as wiring with a voltage. In some embodiments, the first power conductor 411 and the third power conductor 413 may operate as a ground wiring, and the second wiring 412 may have a voltage.

[0099] The RF signal circuit 420 may be a component configured to transmit an RF signal. In various embodiments, the RF signal circuit 420 may include a substrate integrated waveguide (SIW). The substrate integrated waveguide may include a first conductor 421 and a second conductor 422 positioned parallel to the first conductor 421, and may include a plurality of second vias 424 electrically connecting the first conductor 421 and the second conductor 422 at the edges of the first conductor 421 and the second conductor 422. The RF signal propagation path in the substrate integrated waveguide may be defined by the first conductor 421, the second conductor 422, and the plurality of second vias 424.

[0100] In various embodiments, the electronic device may include a plurality of RF signal circuits 420, wherein the plurality of RF signal circuits 420 may be arranged in parallel with the power circuit 410, and the power circuit 410 may be interposed between the plurality of RF signal circuits 420. The effect of this configuration will be described later.

[0101] In various embodiments, the electronic device may include a cable 400 (eg, Figure 3 Cable 322 in ). Figure 4b to Figure 4d In various embodiments, the cable 400 may be a flexible printed cable (FPC) or a flexible printed circuit board (FPCB) having multiple layers. The cable 400 may be a first printed circuit board (eg, Figure 3 The first printed circuit board 320 and the second printed circuit board (eg, Figure 3 In other embodiments, the cable 400 may refer to a flexible printed circuit board (e.g., a second printed circuit board 340 in FIG. 1 ). Figure 3The cable 400 may be a region of the first printed circuit board 320 or the second printed circuit board 340 in which the power circuit 410 and the RF signal circuit 420 are arranged. For example, the cable 400 may have a multilayer structure including a first layer 401, a second layer 402 located below the first layer 401 (along the -z direction in the figure, which may be referred to as a "first direction") to be substantially parallel to the first layer 401, and a third layer 403 located below the second layer 402 to be substantially parallel to the second layer 402. An insulating material 405 may be provided between adjacent layers of the first layer 401, the second layer 402, and the third layer 403. A first power conductor 411 may be provided on the first layer 401, a power conductor 413 may be provided on the second layer 402, and a second power conductor 412 may be provided on the third layer 403.

[0102] Reference Figure 4b to Figure 4d In various embodiments, the RF signal circuit 420 may include a first conductor 421, a second conductor 422, and a third conductor 423. The first conductor 421 and the second conductor 422 may constitute a first substrate integrated waveguide, and the second conductor 422 and the third conductor 423 may constitute a second substrate integrated waveguide. A plurality of second vias 424 may be provided at the edges of the first conductor 421 and the second conductor 422 to constitute the first substrate integrated waveguide while electrically connecting the first conductor 421 and the second conductor 422, and a plurality of third vias 425 may be provided at the edges of the second conductor 422 and the third conductor 423 to constitute the second substrate integrated waveguide while electrically connecting the second conductor 422 and the third conductor 423. Therefore, the cable 400 may include a plurality of substrate integrated waveguides stacked on each other. Therefore, for the cable 400 having a limited area, the arrangement density of the board integrated waveguide may be improved.

[0103] In various embodiments, a slot transition structure 426 to be connected to a microstrip line (eg, a microstrip patch antenna) may be provided at opposite ends of the first conductor 421 and the third conductor 423 .

[0104] Figure 5a is a perspective view showing a power supply circuit 410 according to an embodiment of the present disclosure.

[0105] Figure 5b is a circuit diagram showing an equivalent circuit of the power supply circuit 410 according to an embodiment of the present disclosure.

[0106] Reference Figure 5a and Figure 5b , the power supply circuit 410 may be represented as an equivalent circuit 500 in which an equivalent capacitor 503 and an equivalent inductor 502 are disposed between a plurality of conductive wiring sections 501a, 501b, 501c, and 501d.

[0107] When electromagnetic interference (EMI) is applied from outside the power supply circuit 410, the power supply circuit 410 may function as Figure 5b For example, when an RF signal is transmitted through the RF signal circuit 420, EMI (e.g., noise and / or crosstalk) generated by the RF signal circuit 420 may induce electric and magnetic fields in and around the components of the power circuit 410, and may induce magnetic fields. When the electric and magnetic fields are induced, each component and / or combination of the power circuit 410 may act as a component of the equivalent circuit 500 (e.g., an equivalent capacitor 503 and / or an equivalent inductor 502).

[0108] For example, when EMI is applied to the power circuit 410, a time-varying electric field may be induced between the second power conductor 412 and the third power conductor 413, which are electrically separated from each other. Therefore, charges may be accumulated on the second power conductor 412 and the third power conductor 413. In addition, due to the charge accumulation, a current may flow through the first via 414, which is electrically connected to the third power conductor 413, and thus a magnetic field may be induced around the first via 414. Therefore, the second power conductor 412 and the third power conductor 413 may constitute an equivalent capacitor 503, and the first via 414 may constitute an equivalent inductor 502. In various embodiments, a plurality of vias 414 may collectively act as an equivalent inductor 502.

[0109] The capacitance value (hereinafter, represented as “C”) of the equivalent capacitor 503 constituted by the second power conductor 412 and the third power conductor 413 of the power circuit 410 can be calculated as follows.

[0110] [Equation 1]

[0111]

[0112] In the above equation, h1 is the separation distance between the second power conductor 412 and the third power conductor 413, and A is the area of ​​the third power conductor 413, which corresponds to the width d of the second power conductor 412. x and length d y Based on the above equation, the capacitance value of the equivalent capacitor 503 can be adjusted by adjusting the width of the second power conductor 412 and / or the separation distance between the third power conductor 413 and the second power conductor 412. In particular, since the width dx of the second power conductor 412 is easy to adjust when the present disclosure is implemented in the flexible printed circuit board 400 and / or the printed circuit board, the capacitance of the equivalent capacitor 503 of the present disclosure is easy to adjust.

[0113] The first path 414 of the power circuit 410 may constitute an equivalent inductor 502. The inductive reactance (which may be referred to as "inductance" and will be represented as "L" below) of the equivalent inductor 502 may be calculated as in the following equation.

[0114] [Equation 2]

[0115]

[0116] In the above equation, h 2 is the separation distance between the first power conductor 411 and the third power conductor 413 and corresponds to the height of the first via 414. v is the spacing between adjacent paths in a path, v p is the phase velocity of the RF signal, r v is the radius of the first via 414. Based on the above equation, the inductive reactance value of the equivalent inductor 502 can be adjusted by adjusting the arrangement spacing of the first via 414 and / or the radius of the via. The equivalent capacitor 503 and the equivalent inductor 502 can be connected with other conductive wiring of the power circuit 410 to provide an electromagnetic bandgap (EBG) structure.

[0117] The power supply circuit 410 having the above-mentioned electromagnetic bandgap structure can act as a filter for one or more frequency bands. The filter can be a circuit that blocks and / or attenuates electromagnetic waves in one or more frequency bands. The lower cutoff frequency f of the electromagnetic bandgap structure is L It can be calculated as follows.

[0118] [Equation 3]

[0119]

[0120] In the above equation, v p is the phase velocity of the RF signal.

[0121] In addition, the upper cutoff frequency f U It can be calculated as follows.

[0122] [Equation 4]

[0123]

[0124] In the above equation, Z 0 and β 0 are the characteristic impedance and phase constant of the conductive wiring segments 501a, 501b, 501c and 501d, d y is the length of the second power supply wiring 412 .

[0125] As shown in the above equation, the electromagnetic frequency band that can be blocked by the power circuit 410 can be determined by the capacitance value of the equivalent capacitor 503 and the inductance value of the equivalent inductor 502. Therefore, the power circuit 410 can be blocked by appropriately configuring the width d of the second power conductor 412. x , the separation distance h between the second power conductor 412 and the third power conductor 413 2 , the arrangement distance d of the first passage 414 v and the radius r of the second passage 424 v To filter a specific frequency band. The frequency band can be configured to include the frequency band of the RF signal transmitted from the RF signal circuit 420. Therefore, the crosstalk phenomenon in which the electromagnetic wave from the RF signal circuit 420 flows into the power supply circuit 410 can be prevented and / or reduced. In addition, because the power supply circuit 410 is arranged side by side between the multiple RF signal circuits 420, the crosstalk between the multiple RF signal circuits 420 can also be prevented and / or reduced. In addition, according to the present disclosure, an electromagnetic bandgap structure used as a filter circuit having only wiring and pathways can be realized, and the wiring and pathways are components that can be easily arranged in a multilayer cable. Therefore, even if the electronic device and / or the cable 400 does not include a separate shielding member and / or filter circuit for the power supply circuit 410, noise and crosstalk can be prevented and / or reduced, thereby reducing the cost and size of the electronic device.

[0126] In view of the effect of the power supply circuit 410 described above, although Figures 4a to 4d One power supply circuit 410 is shown, but the present disclosure is not limited thereto. In various embodiments, the electronic device may include a plurality of RF signal circuits 420 and a plurality of power transmitters 410 arranged side by side with each other, and it will be apparent to those skilled in the art that when the power transmitter 410 is arranged between the plurality of RF signal circuits 420, crosstalk between the plurality of RF signal circuits 420 can be prevented.

[0127] Figure 6a is a perspective view showing a power supply circuit 410 according to an embodiment of the present disclosure.

[0128] Figure 6b is a cross-sectional view showing a power supply circuit 410 according to an embodiment of the present disclosure.

[0129] Figure 6b Shown along Figure 6a The cross section is taken along the Y-Y' direction.

[0130] Reference Figure 6a and Figure 6b , the first paths 414 of the power circuit 410 may be arranged in a plurality of rows with reference to the direction in which the power circuit 410 extends. Figure 6a and Figure 6b An embodiment with two rows is shown, but the disclosure is not limited thereto.

[0131] Since the plurality of first vias 414 are arranged in a plurality of rows, it is easy to increase the arrangement density of the first vias 414. Therefore, it is easy to adjust the inductance of the equivalent inductor 502 constituted by the plurality of first vias 414, and thus it is easy to adjust the frequency range of the RF signal filtered by the electromagnetic bandgap structure of the power circuit 410.

[0132] Figure 7a is a perspective view showing a power supply circuit 410 according to an embodiment of the present disclosure.

[0133] Figure 7b is a cross-sectional view showing a power supply circuit 410 according to an embodiment of the present disclosure.

[0134] Figure 7b Shown along Figure 7a The cross section is taken along the WW direction.

[0135] Reference Figure 7a and Figure 7b , the power circuit 410 according to various embodiments may include a fourth wiring 415. For example, the flexible printed cable 400 (such as a flexible printed circuit board) includes a fourth layer disposed between the first layer 401 and the second layer 402, and the fourth wiring 415 may be disposed on the fourth layer. The fourth wiring 415 may be located between the first power conductor 411 and the third power conductor 413. In various embodiments, the fourth wiring 415 may be electrically separated from the first via 414. For example, the fourth wiring 415 includes through holes 416, and the first vias 414 pass through the through holes 416, respectively.

[0136] In some embodiments, the fourth wiring 415 may be a wiring supplying a second power different in voltage, current and / or bias from the power supplied through the first power conductor 411. In another embodiment, the fourth wiring 415 may be a wiring for digital data communication.

[0137] By being located between the first power conductor 411 and the third power conductor 413, the fourth wiring 415 can also receive a protection (filtering) effect against EMI applied from the outside of the power circuit 410 (e.g., the RF signal circuit 420) through the electromagnetic bandgap structure of the power circuit 410. Therefore, noise introduced into the second power supply or digital data communication can be reduced.

[0138] The cables 400 according to the examples and comparative examples of the present disclosure were manufactured, and the scattering parameters (S parameters) and crosstalk were measured. Figure 8a and Figure 8b shown.

[0139] Figure 8aAn S-parameter graph showing frequency matching characteristics and transmission / reception characteristics of an electronic device according to an embodiment of the present disclosure.

[0140] Figure 8b A graph illustrating crosstalk characteristics of an electronic device according to an embodiment of the present disclosure and a power transmitter of a comparative example is shown.

[0141] Figure 8a The curves S11, S33, S55, S77 in FIG. 1 are diagrams showing that the signal is sent to Figure 4c Graphs S21, S43, S65, S87 are graphs indicating the values ​​obtained by measuring the signals reflected to the input terminals S1, S3, S5, and S7 in the RF signal circuit 420, and the measured frequency matching characteristics of the RF signal circuit 420 are shown. Figure 4c The graph shown is a graph of values ​​obtained by measuring signals received at the output terminals S2 , S4 , S6 , and S8 at the input terminals S1 , S3 , S5 , and S7 in the RF signal circuit 420 , and shows the transmission / reception characteristics of the RF signal circuit 420 .

[0142] Figure 8b A graph indicating the degree of noise attenuation measured in the power transmitter 410 by manufacturing an electronic device according to an embodiment of the present disclosure and an electronic device according to a comparative example not including the electromagnetic bandgap structure of the present disclosure is shown.

[0143] Reference Figure 8a In the graphs S11, S33, S55, and S77, it can be seen that the RF signal circuit 420 according to the embodiment of the present disclosure has a low reflectivity in the frequency band of 20 GHz to 40 GHz. This indicates that the multiple substrate integrated waveguides of the RF signal circuit 420 of the present disclosure have good frequency matching with the RF signal transmitted by the RF signal circuit 420.

[0144] Reference Figure 8a From the graphs S21, S43, S65, and S87, it can be seen that the RF signal circuit 420 according to the embodiment of the present disclosure has a low attenuation rate in the 20-40 GHz frequency band. Therefore, it can be seen that the RF signal circuit 420 of the present disclosure can well transmit RF signals having the above frequency band.

[0145] Reference Figure 8b, the electronic device according to the comparative example is generally able to obtain up to -5dB of noise attenuation in the 14-45GHz frequency band, but the electronic device according to the present disclosure is able to obtain up to -25dB of noise attenuation. Therefore, in terms of noise suppression capability, the electronic device according to the present disclosure is superior to the electronic device of the comparative example. In particular, in the 28GHz frequency band used in 5G communications, the present disclosure exhibits a better noise attenuation of -20.5dB compared to the comparative example, and even in the 39GHz frequency band, the present disclosure obtains a noise attenuation of more than -10dB, thus exhibiting a better noise attenuation of -6.5dB compared to the comparative example. Therefore, it can be seen that according to an embodiment of the present disclosure, crosstalk from the RF signal circuit 420 to the power supply circuit 410 can be effectively prevented and / or reduced.

[0146] The embodiments disclosed in the specification and the drawings are provided only to facilitate the description of the technical features according to the embodiments disclosed herein and to help understand the embodiments disclosed herein, and are not intended to limit the scope of the embodiments disclosed herein. Therefore, the scope of the various embodiments disclosed herein should be interpreted in such a way that, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical ideas of the various embodiments disclosed herein are also included in the scope of the various embodiments disclosed herein.

Claims

1. An electronic device, include: a first printed circuit board; a second printed circuit board; as well as a flexible printed circuit board (FPCB) providing an electrical connection between the first circuit board and the second circuit board, The flexible printed circuit board comprises: an RF signal circuit configured to transmit or receive at least one RF signal; and a power circuit configured to transmit the power, The power supply circuit comprises: a first power conductor comprising a conductive material, a second power supply conductor comprising an electrically conductive material and electrically spaced apart from the first power supply conductor in a first direction, a third power conductor disposed between the first power conductor and the second power conductor in parallel with the second power conductor and electrically spaced apart from the second power conductor in the first direction, and At least one first via electrically connects the first power conductor and the third power conductor.

2. The electronic device according to claim 1, wherein the second power conductor and the power conductor wiring are configured to form a capacitor having a capacitance value, wherein the first path is configured to form an inductor having an inductance value when power is transmitted through the power circuit, and The capacitor and the inductor are configured to filter one or more frequency bands of the RF signal when the RF signal is transmitted or received by the RF signal circuit. 3 . The electronic device according to claim 2 , wherein the capacitance value is determined by a width of the second power conductor and a distance between the second power conductor and the third power conductor.

4. The electronic device according to claim 2, wherein the power supply circuit comprises a plurality of the first paths, and The inductance is determined by the arrangement interval and number of the plurality of first vias.

5. The electronic device according to claim 1, wherein the RF signal circuit include: a first conductor having a surface oriented in the first direction; a second conductor positioned relative to the first conductor and parallel to the first conductor in the first direction; as well as a plurality of second vias electrically connecting the first conductor and the second conductor, And wherein the first conductor, the second conductor and the plurality of second vias define a substrate integrated waveguide.

6. The electronic device according to claim 1, wherein the RF signal circuit comprises a first RF signal circuit and a second RF circuit, and The power supply circuit is located between the first RF signal circuit and the second RF signal circuit.

7. The electronic device according to claim 1, wherein the FPCB include: a first layer having a surface oriented in said first direction, a second layer, arranged relative to the first layer and parallel to the first layer in the first direction, a third layer disposed parallel to the second layer in the first direction relative to the second layer, and an insulating material, comprising an electrically insulating and flexible material, and disposed between adjacent layers of the first layer, the second layer, and the third layer, wherein the first power supply conductor is arranged on the first layer, wherein the second power supply conductor is arranged on the third layer, wherein the power supply conductor is arranged on the second layer, The RF signal circuit comprises: a first conductor, arranged on the first layer in parallel with the first power conductor, a second conductor, arranged on the second layer in parallel with the power supply conductor, A third conductor is arranged on the third layer in parallel with the power supply conductor, a plurality of second vias electrically connecting an edge of the first conductor and an edge of the second conductor, and a plurality of third vias electrically connecting an edge of the third conductor and the edge of the second conductor, wherein the first conductor, the second conductor and the second via define a first substrate integrated waveguide, and The second conductor, the third conductor and the third via define a second substrate integrated waveguide. 8 . The electronic device of claim 7 , wherein the FPCB includes a fourth layer disposed between the first layer and the second layer.

9. A flexible printed circuit board (FPCB) for an electronic device, the FPCB include: a radio frequency (RF) signal circuit configured to transmit an RF signal; as well as A power circuit configured to transmit power, The power supply circuit comprises: a first power conductor comprising a conductive material, a second power supply conductor comprising an electrically conductive material and electrically spaced apart from the first power supply conductor in a first direction, a third power supply conductor disposed between the first power supply conductor and the second power supply conductor in parallel with the second power supply conductor and electrically spaced apart from the second power supply conductor, and At least one first via electrically connects the first power conductor and the third power conductor.

10. The flexible printed circuit board according to claim 9, wherein the second power conductor and the third power conductor are configured to form a capacitor having a capacitance value, wherein the first path is configured to form an inductor having an inductance value with the first power conductor and the third power conductor, and The capacitor and the inductor are configured to filter one or more frequency bands of the RF signal when the RF signal is transmitted or received by the RF signal circuit. 11 . The flexible printed circuit board according to claim 10 , wherein the capacitance value is determined by a width of the second power conductor and a distance between the second power conductor and the third power conductor.

12. The flexible printed circuit board according to claim 10, wherein the power transmitter comprises a plurality of the first paths, and The inductance is determined by the arrangement interval and number of the plurality of first vias.

13. The flexible printed circuit board according to claim 11, wherein the RF signal circuit include: a first conductor having a surface oriented in the first direction; a second conductor positioned relative to the first conductor and parallel to the first conductor in the first direction; as well as The substrate integrated waveguide includes a plurality of second vias located at edges of the first conductor and the second conductor and electrically connecting the first conductor and the second conductor.

14. The flexible printed circuit board according to claim 9, further comprising: include: a first layer having a surface oriented in the first direction; a second layer, arranged parallel to the first layer in the first direction relative to the first layer; a third layer, arranged parallel to the second layer in the first direction relative to the second layer; as well as an insulating material, comprising an electrically insulating and flexible material, and disposed between adjacent layers of the first layer, the second layer, and the third layer, wherein the first power supply conductor is arranged on the first layer, wherein the second power supply conductor is arranged on the third layer, wherein the third power supply conductor is arranged on the second layer, The RF signal circuit comprises: a first conductor, arranged on the first layer in parallel with the first power conductor, a second conductor, arranged on the second layer in parallel with the third power conductor, a third conductor, arranged on the third layer in parallel with the second power conductor, a plurality of second vias electrically connecting an edge of the first conductor and an edge of the second conductor, and a plurality of third vias electrically connecting an edge of the third conductor and the edge of the second conductor, wherein the first conductor, the second conductor and the second via define a first substrate integrated waveguide, and The second conductor, the third conductor and the third via define a second substrate integrated waveguide.

15. The flexible printed circuit board according to claim 14, comprising a fourth layer disposed between the first layer and the second layer, and The power supply circuit further includes a fourth wiring provided on the fourth layer and including a plurality of through holes through which the first via passes.

Images