Semiconductor PKG cutting and cleaning device structure and use method thereof

Abstract

The invention discloses a semiconductor PKG cutting and cleaning device structure and a using method thereof, and relates to the field of cleaning devices. The semiconductor PKG cutting and cleaning device structurally comprises an ultrasonic generator, a stainless steel mesh screen is arranged in the ultrasonic generator, a lifting mechanism corresponding to the stainless steel mesh screen is arranged on the ultrasonic generator, the lifting mechanism comprises a supporting fixing base fixedly connected to the back face of the ultrasonic generator, and a lifting type lifting table is arranged on the supporting fixing base; a supporting sleeve is fixedly connected to the lifting table, a bearing table is arranged on the supporting sleeve, and a vibration base is movably connected to the bearing table. According to the semiconductor PKG cutting and cleaning device structure, in the cleaning process after semiconductor PKG cutting is completed, the ultrasonic cleaning mode of the ultrasonic generator is used for replacing manual work, the cleaning effect is better, the vibration assembly is used for enabling the stainless steel mesh screen to vibrate and turn over a product, and therefore it is guaranteed that all parts of the product are completely cleaned without dead corners.

Description

Technical Field

[0001] The present invention relates to the technical field of cleaning devices, and particularly to the structure and usage method of a semiconductor PKG cutting and cleaning device. Background Art

[0002] In the existing DFN QFN package, after cutting, the metal debris is manually cleaned with a brush. The disadvantages are low production efficiency and metal particle residues. Moreover, during the manual cleaning process of the product, it is very easy to miss or incompletely clean the inside of the product's gaps, resulting in some metal debris hidden inside the product. During the next process, the internal metal debris of the product may fall onto the track, causing material jamming and affecting the production efficiency of the testing process. In view of the deficiencies of the prior art, the present invention provides the structure and usage method of a semiconductor PKG cutting and cleaning device to solve the above problems. Summary of the Invention

[0003] (1) Technical Problems to be Solved

[0004] In view of the deficiencies of the prior art, the present invention provides the structure and usage method of a semiconductor PKG cutting and cleaning device. During the cleaning process after semiconductor PKG cutting, the ultrasonic cleaning method of an ultrasonic generator is used to replace manual labor, with better cleaning effects. Moreover, during the cleaning process, the stainless steel mesh sieve has a lifting function for loading products, making the product convenient to pick up and place during the cleaning process. And, during the ultrasonic cleaning process of the product, a vibration component is synchronously used to make the stainless steel mesh sieve oscillate and turn the product, so as to ensure that all parts of the product are comprehensively and thoroughly cleaned without dead corners, ensuring good cleaning effects of the product. This cleaning method is highly efficient, ensuring no metal particle residues on the product, so that the next process will not have material jamming and meets the usage requirements.

[0005] (2) Technical Solutions

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: The structure of a semiconductor PKG cutting and cleaning device includes an ultrasonic generator. Inside the ultrasonic generator, there is a stainless steel mesh sieve, and on the ultrasonic generator, there is a lifting mechanism corresponding to the stainless steel mesh sieve;

[0007] The lifting mechanism includes a support fixing seat fixedly connected to the back of the ultrasonic generator. On the support fixing seat, there is a liftable lifting platform. On the lifting platform, there is a support sleeve fixedly connected, and on the support sleeve, there is a bearing platform;

[0008] On the bearing platform, there is a vibration seat movably connected. On the vibration seat, there is a cross arm fixedly connected, and on the cross arm, there is a support fixing arm for supporting the stainless steel mesh sieve;

[0009] The vibration base is provided with a vibration component for controlling the oscillation of the cross arm, the support fixed arm, and the stainless steel mesh sieve.

[0010] Preferably, the vibration component includes a slide bar fixedly connected to the vibration base and a second motor. The slide bar extends downward through the bearing table and is fixedly connected with a baffle. A first buffer spring is fixedly connected between the baffle and the bearing table. A second buffer spring is fixedly connected between the vibration base and the bearing table. An eccentric wheel is provided at the output end of the second motor.

[0011] Preferably, the bottom of the vibration base is fixedly connected with a lateral support rod. The bottom of the lateral support rod passes through the bearing table and is slidably connected in a support sleeve.

[0012] Preferably, a guide rail rod is fixedly connected inside the support fixing seat. The lifting table is slidably connected to the guide rail rod.

[0013] Preferably, a first motor is fixedly connected to the support fixing seat. A lead screw is provided at the output end of the first motor. The lead screw is threadedly connected to the lifting table.

[0014] Preferably, a drying fan is fixedly connected to the top of the ultrasonic generator.

[0015] Preferably, a reinforcing rib is fixedly connected between the cross arm and the support fixed arm.

[0016] Preferably, the number of holes in the stainless steel mesh sieve is 40 meshes.

[0017] A usage method of the structure of a semiconductor PKG cutting and cleaning device, the usage method includes the following steps:

[0018] Step S1: Pour a solution with an alcohol purity of 90% into the container of the ultrasonic generator, not less than 1 / 2 of the container depth, and turn the heating knob of the ultrasonic generator to heat.

[0019] Step S2: After the temperature rises to 80 °C, control the stainless steel mesh sieve to be placed in the container of the ultrasonic generator.

[0020] Step S3: Pour the product into the stainless steel mesh sieve, and turn the time control knob of the ultrasonic generator to work and time.

[0021] Step S4: When the ultrasonic generator works, it synchronously drives the vibration component to work, driving the stainless steel mesh sieve and the products inside to oscillate and turn over.

[0022] Step S5: After the equipment stops, control the stainless steel mesh sieve to rise, place the product on the side of the drying fan, and blow for half an hour to be boxed and enter the next process.

[0023] The present invention discloses a semiconductor PKG cutting and cleaning device structure and its usage method, and the beneficial effects thereof are as follows:

[0024] 1. In the cleaning process after the semiconductor PKG cutting is completed, for the semiconductor PKG cutting and cleaning device structure, the ultrasonic cleaning method of the ultrasonic generator is used to replace manual labor, and the cleaning effect is better. During the cleaning process, the stainless steel mesh sieve has a lifting function for loading products, making it convenient to pick up and place the products during the cleaning process. Moreover, during the ultrasonic cleaning of the products, the vibration component is synchronously used to make the stainless steel mesh sieve oscillate and turn the products, so as to ensure that all parts of the products are comprehensively cleaned without dead angles, ensuring good cleaning effect of the products. This cleaning method has high efficiency, ensures that there is no metal particle residue on the products, so that the next process will not be jammed, meeting the usage requirements.

[0025] 2. For the semiconductor PKG cutting and cleaning device structure, the drying fan is arranged on the top of the ultrasonic generator, which is convenient for accelerating the drying of the products loaded on the stainless steel mesh sieve when the products are in the raised state after completing the cleaning procedure inside the ultrasonic generator, improving the cleaning and drying speed of the products and facilitating quick entry into the next process.

[0026] 3. For the semiconductor PKG cutting and cleaning device structure, the overall structure of the vibration component is simple, operates stably, and has a long service life. The eccentric wheel is driven by the second motor to rotate to generate vibration, which in turn drives the vibration seat to vibrate up and down. During the up and down vibration of the vibration seat, the vibration seat is limited. Through the action of the first buffer spring, the second buffer spring and the baffle, the vibration seat and the slide rod continuously vibrate up and down, with stable force and small wear. The overall parts are simple and easy to maintain. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 It is the first perspective of the overall structure schematic diagram of the present invention;

[0029] Figure 2 It is the second perspective of the overall structure schematic diagram of the present invention;

[0030] Figure 3 It is the back view schematic diagram of the present invention;

[0031] Figure 4 It is the disassembly schematic diagram of the lifting platform of the present invention;

[0032] Figure 5 This is a cross-sectional view of the support sleeve of the present invention;

[0033] Figure 6 This is a schematic structural view of the slide bar of the present invention.

[0034] In the figure: 1. Ultrasonic generator; 2. Stainless steel mesh sieve; 3. Drying fan; 4. Support fixing seat; 401. First motor; 402. Lead screw; 403. Guide rail rod; 404. Lifting platform; 405. Support sleeve; 406. Loading platform; 5. Vibration seat; 501. Slide bar; 502. Baffle; 503. First buffer spring; 504. Second buffer spring; 505. Second motor; 506. Eccentric wheel; 507. Lateral support rod; 6. Cross arm; 601. Reinforcing rib; 7. Support fixing arm. Detailed implementation manners

[0035] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0036] The embodiments of the present application provide a semiconductor PKG cutting and cleaning device structure and its usage method, which solve the problems in the existing DFN QFN packaging. After cutting, the metal debris is manually cleaned with a brush. The disadvantages are low production efficiency and metal particle residues. Moreover, during the manual cleaning process of the product, it is very easy to miss or incompletely clean the inside of the product's gaps, resulting in some metal debris hidden inside the product. In the next process, the internal metal debris of the product may fall onto the track, causing material jams and affecting the production efficiency of the testing process.

[0037] To better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the specification drawings and specific implementation manners.

[0038] The embodiments of the present invention disclose a semiconductor PKG cutting and cleaning device structure. According to the attached Figure 1-6 As shown, it includes an ultrasonic generator 1. Inside the ultrasonic generator 1, there is a stainless steel mesh sieve 2, and on the ultrasonic generator 1, there is a lifting mechanism corresponding to the stainless steel mesh sieve 2;

[0039] The lifting mechanism includes a support fixing seat 4 fixedly connected to the back of the ultrasonic generator 1. On the support fixing seat 4, there is a liftable lifting platform 404. On the lifting platform 404, there is a support sleeve 405 fixedly connected, and on the support sleeve 405, there is a loading platform 406;

[0040] A vibrating base 5 is movably connected to the bearing platform 406. A cross arm 6 is fixedly connected to the vibrating base 5. A support and fixing arm 7 for supporting the stainless steel mesh sieve 2 is connected to the cross arm 6.

[0041] A vibration assembly for controlling the oscillation of the cross arm 6, the support and fixing arm 7, and the stainless steel mesh sieve 2 is provided on the vibrating base 5.

[0042] Specifically, the vibration assembly includes a slide bar 501 fixedly connected to the vibrating base 5 and a second motor 505. The slide bar 501 extends downward through the bearing platform 406 and is fixedly connected to a baffle 502. A first buffer spring 503 is fixedly connected between the baffle 502 and the bearing platform 406. A second buffer spring 504 is fixedly connected between the vibrating base 5 and the bearing platform 406. An eccentric wheel 506 is provided at the output end of the second motor 505. The overall structure of the provided vibration assembly is simple, operates stably, and has a long service life. The eccentric wheel 506 is driven by the second motor 505 to rotate to generate vibration, thereby driving the vibrating base 5 to vibrate up and down. During the up and down vibration of the vibrating base 5, the vibrating base 5 is limited. Through the action of the first buffer spring 503, the second buffer spring 504, and the baffle 502, the vibrating base 5 and the slide bar 501 continuously vibrate up and down, with stable force and small wear. The overall parts are simple and easy to maintain.

[0043] Furthermore, a lateral support rod 507 is fixedly connected to the bottom of the vibrating base 5. The bottom of the lateral support rod 507 passes through the bearing platform 406 and is slidably connected in a support sleeve 405. The provided vibrating base 5 is supported by the lateral support rod 507, and the lateral support rod 507 is inserted into the inner cavity of the support sleeve 405, thus ensuring the stable force of the vibrating base 5.

[0044] Furthermore, a guide rail rod 403 is fixedly connected inside the support and fixing seat 4. The lifting platform 404 is slidably connected to the guide rail rod 403. The provided guide rail rod 403 provides support and limitation for the lifting platform 404, ensuring the stable force of the lifting platform 404.

[0045] Even further, a first motor 401 is fixedly connected to the support and fixing seat 4. A lead screw 402 is provided at the output end of the first motor 401. The lead screw 402 is threadedly connected to the lifting platform 404. The provided first motor 401 is used to drive the lead screw 402 to rotate, and the lead screw 402 drives the lifting platform 404 to lift, thereby driving the support sleeve 405, the bearing platform 406, the vibrating base 5, the cross arm 6, and the support and fixing arm 7 to lift through the lifting platform 404, so as to control the lifting of the stainless steel mesh sieve 2.

[0046] Specifically disclosed, a drying fan 3 is fixedly connected to the top of the ultrasonic generator 1. The provided drying fan 3 is placed on the top of the ultrasonic generator 1, which facilitates accelerating the drying of the products loaded on the stainless steel mesh sieve 2 when the products are in the raised state after completing the cleaning process inside the ultrasonic generator 1, improving the cleaning and drying speed of the products, and facilitating rapid entry into the next process.

[0047] Furthermore, a reinforcing rib 601 is fixedly connected between the cross arm 6 and the support fixed arm 7. The provided reinforcing rib 601 strengthens the connection between the cross arm 6 and the support fixed arm 7, ensuring the stable connection between the cross arm 6 and the support fixed arm 7, not being easily deformed, and having a good load-bearing effect on the stainless steel mesh sieve 2 and the products.

[0048] Specifically, the number of holes in the stainless steel mesh sieve 2 is 40 meshes.

[0049] The usage method of the semiconductor PKG cutting and cleaning device structure includes the following steps:

[0050] Step S1: Pour a solution with an alcohol purity of 90% into the container of the ultrasonic generator 1, not less than 1 / 2 of the container depth, and twist the heating knob of the ultrasonic generator 1 to heat.

[0051] Step S2: After the temperature rises to 80 °C, control the stainless steel mesh sieve 2 to be placed into the container of the ultrasonic generator 1.

[0052] Step S3: Pour the products into the stainless steel mesh sieve 2, and twist the time control knob of the ultrasonic generator 1 to work and time.

[0053] Step S4: When the ultrasonic generator 1 works, it synchronously drives the vibration component to work, driving the stainless steel mesh sieve 2 and the products inside to vibrate and turn over.

[0054] Step S5: After the equipment stops, control the stainless steel mesh sieve 2 to rise, place the products on the side of the drying fan 3, and blow for half an hour to be boxed and enter the next process.

[0055] When using the lifting mechanism to control the lifting action of the stainless steel mesh sieve 2 in this semiconductor PKG cutting and cleaning device structure, it is driven by the first motor 401. The first motor 401 drives the lead screw 402 to rotate. The lead screw 402 drives the lifting table 404 to move along the guide rail rod 403. The lifting table 404 drives the support sleeve 405 to move. The support sleeve 405 drives the bearing platform 406 to move. The bearing platform 406 drives the vibration seat 5 to move. The vibration seat 5 drives the cross arm 6 to move. The cross arm 6 drives the support fixed arm 7 to move. The support fixed arm 7 drives the stainless steel mesh sieve 2 to move.

[0056] When the vibration component is working, it is driven by the second motor 505. The second motor 505 drives the eccentric wheel 506 to rotate to generate vibration, causing the vibration seat 5 to vibrate up and down. The vibration seat 5 drives the slide bar 501 to move, and the slide bar 501 drives the baffle 502 to move. At the same time, the vibration seat 5 also drives the lateral support rod 507 to slide along the inside of the support sleeve 405. When the vibration seat 5, the slide bar 501 and the baffle 502 vibrate, they synchronously drive the first buffer spring 503 and the second buffer spring 504 to continuously be in a periodic state of compression and tension. When the vibration seat 5 vibrates up and down, it drives the cross arm 6, the support fixed arm 7 and the stainless steel mesh sieve 2 to vibrate. By using the oscillation of the stainless steel mesh sieve 2, the product is turned over up and down, so that the ultrasonic cleaning effect of the product is good and the cleaning process is uniform;

[0057] In summary, for the structure of the semiconductor PKG cutting and cleaning device, during the cleaning process after the semiconductor PKG cutting is completed, the ultrasonic cleaning method of the ultrasonic generator 1 is used to replace manual labor, and the cleaning effect is better. Moreover, during the cleaning process, the stainless steel mesh sieve 2 has a lifting function for loading products, making it convenient to pick up and place the products during the cleaning process. And, during the ultrasonic cleaning process of the products, the vibration component is synchronously used to make the stainless steel mesh sieve 2 oscillate and turn over the products, so as to ensure that all parts of the products are cleaned comprehensively without dead corners, ensuring good cleaning effect of the products. This cleaning method is efficient, ensuring that there is no metal particle residue on the products, so that the next process will not be jammed, meeting the usage requirements.

[0058] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0059] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. Structure of semiconductor PKG cutting and cleaning device, including an ultrasonic generator (1), Characterized in that: A stainless steel mesh sieve (2) is provided inside the ultrasonic generator (1), and a lifting mechanism corresponding to the stainless steel mesh sieve (2) is provided on the ultrasonic generator (1); The lifting mechanism includes a support fixing seat (4) fixedly connected to the back of the ultrasonic generator (1), a lifting platform (404) is provided on the support fixing seat (4), a support sleeve (405) is fixedly connected to the lifting platform (404), and a bearing platform (406) is provided on the support sleeve (405); A vibrating seat (5) is movably connected to the bearing platform (406), a cross arm (6) is fixedly connected to the vibrating seat (5), and a support fixing arm (7) for supporting the stainless steel mesh sieve (2) is connected to the cross arm (6); A vibrating component for controlling the vibration of the cross arm (6), the support fixing arm (7) and the stainless steel mesh sieve (2) is provided on the vibrating seat (5).

2. The structure of the semiconductor PKG cutting and cleaning device according to claim 1, Characterized in that: The vibrating component includes a slide bar (501) and a second motor (505) fixedly connected to the vibrating seat (5), the slide bar (501) extends downward through the bearing platform (406) and is fixedly connected to a baffle (502), a first buffer spring (503) is fixedly connected between the baffle (502) and the bearing platform (406), a second buffer spring (504) is fixedly connected between the vibrating seat (5) and the bearing platform (406), and an eccentric wheel (506) is provided at the output end of the second motor (505).

3. The structure of the semiconductor PKG cutting and cleaning device according to claim 2, Characterized in that: A lateral support rod (507) is fixedly connected to the bottom of the vibrating seat (5), and the bottom of the lateral support rod (507) passes through the bearing platform (406) and is slidably connected inside the support sleeve (405).

4. The structure of the semiconductor PKG cutting and cleaning device according to claim 1, Characterized in that: A guide rail rod (403) is fixedly connected inside the support fixing seat (4), and the lifting platform (404) is slidably connected to the guide rail rod (403).

5. The structure of the semiconductor PKG cutting and cleaning device according to claim 4, Characterized in that: A first motor (401) is fixedly connected to the support fixing seat (4), a lead screw (402) is provided at the output end of the first motor (401), and the lead screw (402) is threadedly connected to the lifting platform (404).

6. The structure of the semiconductor PKG cutting and cleaning device according to claim 1, Characterized in that: A drying fan (3) is fixedly connected to the top of the ultrasonic generator (1).

7. The structure of the semiconductor PKG cutting and cleaning device according to claim 1, Characterized in that: A reinforcing rib (601) is fixedly connected between the cross arm (6) and the support fixing arm (7).

8. The structure of the semiconductor PKG cutting and cleaning device according to claim 1, Characterized in that: The number of holes in the stainless steel mesh sieve (2) is 40 meshes.

9. Method of using the structure of a semiconductor PKG cutting and cleaning device Characterized in that: The method of use includes the following steps: Step S1: Pour a solution with 90% alcohol purity into the container of the ultrasonic generator (1), not less than 1 / 2 of the container depth, and turn the heating knob of the ultrasonic generator (1) to heat; Step S2: After the temperature rises to 80 °C, control the stainless steel mesh sieve (2) to be placed in the container of the ultrasonic generator (1); Step S3: Pour the product into the stainless steel mesh sieve (2), and turn the time control knob of the ultrasonic generator (1) to work and time; Step S4: When the ultrasonic generator (1) works, it synchronously drives the vibration component to work, driving the stainless steel mesh sieve (2) and the products inside to oscillate and turn over; Step S5: After the equipment stops, control the stainless steel mesh sieve (2) to rise, place the product on the side of the drying fan (3), and blow for half an hour before it can be boxed and enter the next process.

Images