Solder strip processing device and method

By designing a welding tape treatment device, the welding tape is cut into arc segments and its ends are shaped and bent, which solves the problem of cell deformation caused by shrinkage of the welding tape and improves the stability and reliability of photovoltaic modules.

CN120055133APending Publication Date: 2025-05-30SUZHOU SOLET AUTOMATION TECH CO LTD
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Patent Information

Application Number
CN202510199664.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-24
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

The shrinkage tensile stress caused by different thermal expansion after welding tape may cause the cell to deform or rupture, affecting the stability and reliability of photovoltaic modules.

Method used

A welding tape treatment device is designed to cut the linear welding tape into an arc segment with continuous bent parts through the cooperation of the arc-shaped projecting structure and the arc-shaped concave block, and the end of the welding tape is shaped and bent, so that it is upturned and the tension on the battery cell is reduced.

Benefits of technology

Effectively alleviate or eliminate the mechanical stress between the welding tape and the battery cell, prevent the deformation and rupture of the battery cell, and improve the stability and reliability of photovoltaic modules.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a solder strip processing device and method, and relates to the technical field of battery piece preparation. Comprising a base, a supporting seat, a movable lower die mechanism and an upper die mechanism, the base serves as a bearing structure of the device, the supporting seat is parallel to the base, a preset interval is formed between the supporting seat and the base, the supporting seat is used for installing a driving mechanism, the movable lower die mechanism is arranged on the supporting seat, and a preset number of lower die assemblies are installed on the movable lower die mechanism. A plurality of arc-shaped protruding structures are arranged on the lower die assembly, and the upper die mechanism is connected to the output end of the driving mechanism. The upper die mechanism is provided with a preset number of upper die assemblies, the upper die assemblies are provided with arc-shaped concave blocks matched with the arc-shaped protruding structures, and the lower die set is matched with the upper die set. When the welding strip is quantitatively cut off, pretreatment is carried out, a traditional linear welding strip is optimized into an arc segment with a local continuous bending part, and the problem that after welding, the welding strip shrinks cold, and consequently a battery piece deforms is solved.
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Description

Technical Field

[0001] The present invention relates to the technical field of solar cell preparation, and in particular to a solder ribbon processing device and method. Background Art

[0002] In the manufacturing process of photovoltaic cell modules, solder ribbons (also known as interconnection bars or connecting bars) play a crucial role. It is a key material for achieving series or parallel connection between multiple solar cells. By using welding technology, the positive electrode of one cell is connected to the negative electrode of another cell, thus constructing an effective current path and ultimately forming a complete circuit system. Therefore, solder ribbons not only need to have excellent electrical conductivity to ensure efficient current transmission between cells, but also need to have certain flexibility and plasticity to adapt to different shapes and sizes of cells and diverse installation requirements.

[0003] In actual operation, in order to achieve a firm connection between the solder ribbon and the cell, heating treatment is usually required for both, and the welding temperature can be as high as 200°C. During this process, due to the influence of high temperature, both the cell and the solder ribbon will undergo thermal expansion. It should be noted that the coefficient of thermal expansion of the solder ribbon is higher than that of the cell, which means that under the same conditions, the longitudinal elongation rate of the solder ribbon after heating is greater than that of the cell. When the welding process ends and the temperature drops, the longitudinal shrinkage rate of the solder ribbon will also be greater than that of the cell. Since the solder ribbon has been welded and fixed to specific points on the cell, when the solder ribbon shrinks, it will exert a pulling force on the cell. This pulling force may cause the cell to arch or even tear, as Figure 8 shown, seriously affecting the integrity and efficiency of the cell.

[0004] In view of the above problems, the present application aims to propose a solution to overcome the technical problem that the cell is deformed or even broken due to the tensile stress generated by the shrinkage of the solder ribbon after welding. The core of this solution lies in how to effectively relieve or eliminate the mechanical stress caused by the thermal expansion difference between the solder ribbon and the cell, thereby protecting the cell from damage and ensuring the stability and reliability of the photovoltaic module. Summary of the Invention

[0005] Object of the Invention: Based on the problems mentioned in the background art, a solder ribbon processing device and method are proposed.

[0006] Technical Solution: A solder ribbon processing device includes:

[0007] A base, which serves as the bearing structure of the processing device;

[0008] A support base, parallel to the base and spaced at a preset distance, forming an accommodation interval; the accommodation interval is used to install a driving mechanism;

[0009] The moving lower die mechanism is arranged on the support base; the moving lower die mechanism is installed with a preset number of lower die components; a plurality of arc-shaped convex structures are elastically arranged on the lower die components;

[0010] The upper die mechanism is connected to the output end of the driving mechanism; the upper die mechanism is installed with a preset number of upper die components; the upper die components are installed with arc-shaped concave blocks adapted to the arc-shaped convex structures;

[0011] The lower die components are adapted to the upper die components, and through the control of the displacement of the output end of the driving mechanism, the lower die group and the upper die group are pressed together, and the welding tape is pressed onto the arc-shaped convex structure through the arc-shaped concave block, so that the straight welding tape is cut into a welding tape with a preset continuous arc-shaped bending form.

[0012] In a further embodiment, the driving mechanism includes:

[0013] The first driving motor is installed through the base;

[0014] The first commutation component is installed on the base; the first commutation component is connected to the output end of the first driving motor;

[0015] A plurality of second commutation components are distributed on the base; the second commutation components are connected to the first commutation component through a synchronous shaft; the third output of the second commutation component is for lifting function.

[0016] In a further embodiment, the moving lower die mechanism includes:

[0017] A plurality of support rails are installed in parallel on the support base; guide rails are installed on the tops of the support rails;

[0018] The second driving motor is installed on the support base; the second driving motor is used to drive the guide rails;

[0019] The lower die mounting plate is connected to the sliding end of the guide rail, and a plurality of lower die components are installed in parallel on the lower die mounting plate.

[0020] In a further embodiment, the lower die component includes:

[0021] A plurality of die plates, a preset number of channels are opened along the horizontal X-axis at the upper ends of the die plates for placing the welding tape; long strip-shaped grooves are opened along the horizontal Y-axis at the upper ends of the die plates; mounting grooves are opened at the bottoms of the die plates;

[0022] The first die is in a long strip shape and is installed in the long strip-shaped groove; arc-shaped convex structures are evenly distributed on the upper surface of the first die; the installation direction of the arc-shaped convexes is the X-axis direction; counterbores are arranged between the arc-shaped convex structures;

[0023] Two groups of lower cutting knives are respectively installed on both sides of the mold plate;

[0024] A cylinder group is installed in the installation groove;

[0025] Two groups of limit pieces are connected to the output ends of the cylinders; A plurality of rectangular holes are opened on both sides of the mold plate;

[0026] A plurality of buckle structures are arranged on the upper surface of the limit piece, the buckle structures pass through the rectangular holes, and the width of the buckle structures is smaller than the length of the rectangular holes.

[0027] In a further embodiment, the upper die assembly includes:

[0028] Upper die mounting plates, the number of which corresponds to the number of the lower die assemblies; A plurality of assembly holes are evenly opened on the upper die mounting plates;

[0029] Arc-shaped concave blocks are fixed through the assembly holes; The end face of the arc-shaped concave block is recessed in an arc shape to form a preset arc structure, and the arc of the end face of the arc-shaped concave block is adapted to the shape of the arc-shaped convex structure;

[0030] Upper cutting knives are installed on both sides of the upper die mounting plate, and the upper cutting knives are aligned with the lower cutting knives to cut the welding tape.

[0031] In a further embodiment, the arc surface parameters of the arc-shaped concave block are a radius of 9 to 12 mm and a arching height of 0.4 to 0.6 mm.

[0032] In a further embodiment, the cutting edge of the lower cutting knife is away from the mold plate; The cutting edge of the upper cutting knife is close to the upper die mounting plate; Bending knives are also installed on both sides of the upper die mounting plate, and the installation positions of the bending knives are close to the upper cutting knives; The end of the cutting edge of the bending knife is higher than the end of the cutting edge of the upper cutting knife. By the bending knife approaching the back of the lower cutting knife, the end of the welding tape is bent at a preset angle, so that the end of the welding tape forms an angle with the horizontal line, and its end is away from the horizontal plane where the mold plate is located.

[0033] In a further embodiment, the long strip-shaped groove and the rectangular hole cut the channel in the X axis direction into a plurality of secondary channels located on the same straight line, and the depths of the secondary channels at both ends of the channel are deeper than the depths of other channels.

[0034] In a further embodiment, it further includes a first collection groove and a second collection groove. Among them, the first collection groove is installed on the support seat, and its collection port is arranged below the position between the mold plates; The second collection groove is installed on the base, and the collection port of the second collection groove is directly below the first collection groove, and corresponding collection holes are opened on the support seat for installing the first collection groove.

[0035] A method for processing a solder ribbon, comprising the following steps:

[0036] S1. Perform multiple arc-shaped synchronous bending treatments on a straight solder ribbon. Design the arc-shaped bending parameters as a diameter of 9 to 12 mm, an arch height of 0.4 to 0.6 mm, and the number and spacing of the arc-shaped bends are set based on actual requirements;

[0037] S2. Use an upper die assembly and a lower die assembly corresponding to the arc-shaped bending parameters to press the straight solder ribbon to make it meet the parameters in step S1;

[0038] S3. After pressing, cut both ends of the bent solder ribbon; at the same time, perform plastic bending on the two ends of the cut solder ribbon to make the two ends upturned;

[0039] S4. Set the distance between the two end plastic bending areas and the secondary channel at the end of the channel so that the ends after plastic bending rebound to be contained in the straight line where they are located.

[0040] Beneficial effects:

[0041] 1. The present invention performs quantitative production and pre-treatment on the solder ribbon used for photovoltaic cell groups. By cutting the traditional straight solder ribbon into arc segments with local continuous bending parts, it is used to eliminate the problem of the bending of the photovoltaic cells caused by the cold shrinkage of the solder ribbon after welding with the cells.

[0042] 2. The present invention processes the ends of the solder ribbon so that the ends are upward, that is, away from the plane where the photovoltaic cells are located, to prevent the ends of the solder ribbon from piercing the photovoltaic cells. Description of the drawings

[0043] Figure 1 is a schematic diagram of the overall structure working of the present invention.

[0044] Figure 2 is a schematic diagram of the upper die mechanism structure of the present invention.

[0045] Figure 3 is a schematic diagram of the bending knife structure in the upper die mechanism of the present invention.

[0046] Figure 4 is a schematic diagram of the arc-shaped concave block structure of the present invention.

[0047] Figure 5 is a schematic diagram of the lower die assembly structure of the present invention.

[0048] Figure 6 is a schematic diagram of the partial structure of the lower die assembly of the present invention.

[0049] Figure 7 is a schematic diagram of the arc-shaped convex structure of the present invention.

[0050] Figure 8It is a schematic diagram of the existing structure in the background art of the present invention.

[0051] Figure 9 It is a schematic diagram of the improved structure of the present invention.

[0052] Figure 10 It is a schematic diagram of the working principle of the present invention.

[0053] The markings in the figure are: base 1, support base 2, drive mechanism includes 3, moving lower die mechanism 4, lower die assembly 5, upper die mechanism 6, upper die assembly 7, first collection groove 8, second collection groove 9, solder tape 10, solar cell 11, first drive motor 31, first commutation component 32, second commutation component 33, support track 41, guide rail 42, lower die mounting plate 43, die plate 51, channel 52, arc-shaped convex structure 53, first die 54, lower cutting knife 55, cylinder group 56, limiting part 57, snap structure 58, upper die mounting plate 61, arc-shaped concave block 62, upper cutting knife 63, bending knife 64. Detailed implementation manners

[0054] The present invention will be further described below with reference to the accompanying drawings.

[0055] Embodiment 1

[0056] Based on the problems mentioned in the background art, as Figure 8 shown, in actual production, when the solder tape 10 and the solar cell 11 are heated and welded, their volumes will expand, resulting in both the solder tape 10 and the solar cell 11 becoming longer. The solar cell 11 is silicon-based, and the solder tape 10 is silver-tin-coated copper, mainly copper. The thermal expansion coefficient of the solar cell 11 is much smaller than that of the solder tape 10. When heated, the expansion and contraction amount of the solder tape 10 is much larger than that of the solar cell 11. After welding and cooling, both the solar cell 11 and the solder tape 10 will contract, and the contraction amount of the solder tape 10 is much larger than that of the solar cell 11. The solder tape 10 between the two solder joints will tightly press the solar cell 11, which may cause the solar cell 11 to arch or even tear.

[0057] Therefore, in this embodiment, the solder tape 10 is pre-treated. The core idea is to set a margin for the solder tape 10 in the traditional solution, and this margin is realized through a continuous micro-arc structure. Then, after welding and cooling, the margin of the solder tape 10 can meet its natural contraction degree, and thus it will not press the solar cell 11.

[0058] Based on this, the present application quantifies and cuts the solder tape 10 used for the photovoltaic solar cell 11, and at the same time optimizes the structure, that is, by optimizing the traditional straight solder tape 10 into a solder tape strip with continuous bending parts or continuous arc segments to meet the subsequent process requirements.

[0059] This embodiment proposes a solder tape processing device, as Figures 1 to 7As shown, the device includes a base 1, a support base 2, a movable lower mold mechanism 4, and an upper mold mechanism 6, wherein the base 1 serves as a bearing structure of the device, the support base 2 is parallel to the base 1, and a preset spacing is formed to form a receiving interval for installing a driving mechanism, and the movable lower mold mechanism 4 is installed with a preset number of lower mold assemblies 5, and countless arc-shaped protrusion structures 53 are arranged on the lower mold assembly 5, such as Figure 7 As shown, the quantity is set based on the actual production demand. The upper mold mechanism 6 is connected to the output end of the driving mechanism. The upper mold mechanism 6 is installed with a corresponding number of upper mold assemblies 7. The upper mold assembly 7 is installed with an arc-shaped concave block 62 adapted to the arc-shaped protrusion structure 53, as shown in FIG. Figure 4 As shown, the lower mold assembly 7 is adapted to the upper mold assembly 5 , and the lower mold assembly 7 and the upper mold assembly 5 are pressed together in the vertical direction by controlling the displacement of the output end of the driving mechanism to cut off the welding strip 10 .

[0060] The core innovation of this application is that Figure 9 As shown, the welding strip 10 is pressed onto the arc-shaped protruding structure 53 by the arc-shaped concave block 62, so that the welding strip 10 is bent into a preset continuous arc shape.

[0061] In actual use, the working scheme is as follows: the upper mold mechanism 6 is driven by the driving mechanism to descend, driving the upper mold assembly 7 to descend, at which time the arc-shaped concave block 62 is pressed on the arc-shaped convex structure 53, so that the original straight-line welding strip 10 is bent into a welding strip 10 with an arc-shaped bend, and the welding strip 10 is cut off synchronously, and the excess waste falls into the first collecting tank 8. After the pressing is completed, the bent welding strip 10 is transported by moving the lower mold mechanism 4.

[0062] In order to further illustrate the scheme in the present application, the above-mentioned various components are further described in detail. The driving mechanism in this embodiment includes a first driving motor 31 installed on the base 1, a first reversing component 32 connected to the first driving motor 31, and a second reversing component 33 connected to the first reversing component 32 through a synchronous shaft. The third output of the second reversing component 33 is a lifting structure, and the other end of the lifting structure is used to connect the upper mold mechanism. The lifting structure can be synchronously realized by the internal structure of the second reversing component 33, such as installing a bevel gear set on the rotating shaft to realize the change of movement direction. At the same time, the second rotating shaft and the lifting end are threadedly connected to realize the lifting function, so it is not described in detail in this embodiment.

[0063] In this embodiment, the movable lower die mechanism 4 includes a support rail 41, a second drive motor, and a lower die mounting plate 43. Among them, a plurality of support rails 41 are parallelly installed on the support base 2. A guide rail 42 is installed on the top of the support rail 41. The second drive motor is installed on the support base 2 and is used to drive the guide rail 42. The lower die mounting plate 43 is installed at the sliding end of the guide rail 42, and a plurality of lower die components 5 are parallelly installed on the lower die mounting plate 43.

[0064] At the same time, the lower die component 5 includes a die plate 51, a first die 54, a cylinder group 56, and a limiting member 57. Among them, a preset number of channels 52 are opened on the surface of the die plate 51 along the horizontal X-axis for temporarily placing the welding tape 10. A plurality of parallel long strip-shaped grooves are opened at the upper end of the die plate 51 along the horizontal Y-axis. The long strip-shaped grooves cut the channels 52 into discontinuous secondary channels. The first die 54 is a long strip-shaped structure and is installed in the long strip-shaped grooves. A plurality of parallel long strip-shaped grooves are opened at the upper end of the die plate 51 along the horizontal Y-axis. As Figure 7 shown, arc-shaped convex structures 53 are evenly distributed on the upper surface of the first die 54. The installation direction of the arc-shaped convex structures 53 is the X-axis direction. Counterbores are arranged between the arc-shaped convex structures 53 for fixed assembly. An installation groove is opened at the bottom of the die plate 51 for installing the cylinder group 56. The output end of the cylinder group 56 is connected to the limiting member 57. The cylinder group 56 is fixed in the installation groove to control the movement of the limiting member 57 along its length direction. The movement spacing is less than the difference between the width of the buckle structure 58 and the length of the rectangular hole. A plurality of rectangular holes are opened on both sides of the die plate 51. A plurality of buckle structures 58 are arranged on the upper surface of the limiting member 57. The buckle structures 58 pass through the rectangular holes, and the width of the buckle structures 58 is less than the length of the rectangular holes. During actual use, when the welding tape 10 is placed on the channels 52, the movable buckle limits the welding tape 10.

[0065] The upper die component 7 in this embodiment includes an upper die mounting plate 61 and countless arc-shaped concave blocks 62. The arc-shaped concave blocks 62 are as Figure 4 shown. Among them, the number of upper die mounting plates 61 corresponds to the number of lower die components 5. A plurality of assembly holes are evenly opened on the upper die mounting plate 61 for elastic assembly of the arc-shaped concave blocks 62. Here, the arc-shaped concave blocks 62 allow setting of the elasticity. The end face of the arc-shaped concave block 62 is arc-shaped concave, forming a preset arc structure. The arc of the end face of the arc-shaped concave block 62 is adapted to the shape of the arc-shaped convex structure 53. Its parameters are a radius of 9 to 12 mm and an arch height of 0.4 to 0.6 mm. Upper cutting knives 63 are installed on both sides of the upper die mounting plate 61. The upper cutting knives 63 are aligned with the lower cutting knives 55 to realize the cutting of the welding tape 10.

[0066] In the above solution, cutting and pressing are carried out synchronously. Therefore, compared with traditional direct cutting, in this application, through the cooperation of the arc-shaped protrusion structure 53 and the arc-shaped concave block 62, the shape of the solder tape 10 to be welded changes from a straight line to a linear shape with a continuous arc. Compared with the straight-line type, the surplus can offset the problem of shrinkage of the solder tape 10 after cold shrinkage at this time.

[0067] Embodiment 2

[0068] Based on the above technical solution, during actual production on the basis of Embodiment 1, it is found that after the solder tape 10 is cut, the end face of its end is plastically deformed and relatively sharp. Especially during the cold shrinkage after the welding of the solder tape 10 mentioned above, its port may face downward and directly pierce the surface of the battery cell 11. Therefore, in this embodiment, this application provides a solution to this phenomenon by introducing a bending knife 64. As Figure 10 shown, the specific solution is that the bending knife 64 is installed close to the upper cutting knife 63. Taking the horizontal plane where the actual equipment is located as the reference, the end of the cutting edge of the bending knife 64 is higher than the end of the cutting edge of the upper cutting knife 63. That is, when the upper cutting knife 63 and the lower cutting knife 55 are aligned and cutting, the upper cutting knife 63 moves down a certain distance. At this time, the bending knife 64 is close to the back of the lower cutting knife 55, and the end of the solder tape 10 is plastically bent at a preset angle, so that the end of the solder tape 10 forms an angle with the horizontal line, and its end is upturned, away from the horizontal plane where the mold plate 51 is located. In this embodiment, the cutting edge of the lower cutting knife 55 is far from the mold plate 51, and the back of the knife faces the mold plate 51.

[0069] However, during this process, the bending knife 64 is likely to cause the part where the end is located to bend downward. Therefore, the grooves of the secondary channels at both ends of the channel 52 are designed to be deeper, that is, long strip-shaped grooves and rectangular holes. The channel 52 in the X-axis direction is cut into multiple secondary channels 52 located on the same straight line, and the depth of the secondary channels at both ends of the channel 52 is deeper than that of other secondary channels. Then the downward bending length of the part is extended. After the bending knife 64 descends and is close to the back of the lower cutting knife 55 to bend the end of the solder tape 10, when the tool is removed, the part of the solder tape with the downward bending length at this time will rebound, and the above-mentioned problem of partial bending can be eliminated.

[0070] This application also includes a first collection groove 8 and a second collection groove 9. The first collection groove 8 is installed on the support seat 2, and its collection port is arranged below the position between the mold plates 51 for collecting the solder tape 10 cut by the cutting knife. The second collection groove 9 is installed on the base 1, and the collection port of the second collection groove 9 is directly below the first collection groove 8. Corresponding collection holes are opened on the support seat 2 for installing the first collection groove 8.

[0071] Embodiment 3

[0072] This embodiment proposes a pretreatment method for solder tapes, which can be implemented by means of the devices in Embodiments 1 to 3 of the market. The method includes the following steps:

[0073] S1. Perform multiple arc synchronous bending treatments on the straight solder tape 10. The designed arc bending parameters are a diameter of 9 to 12 mm, an arch height of 0.4 to 0.6 mm, and the number and spacing of the arc bends are set based on actual requirements;

[0074] S2. Use the upper die assembly 7 and the lower die assembly 5 corresponding to the arc bending parameters to press the straight solder tape 10 to make it meet the parameters in step S1;

[0075] S3. After pressing, cut both ends of the bent solder tape 10; at the same time, perform plastic bending on the two ends of the cut solder tape 10 to make the two ends upturned;

[0076] S4. Based on the material characteristics of the actual solder tape 10, set the distance between the two end plastic bending areas and the secondary channel at the end of the channel 52. At the same time, the depth of the secondary channel here is deeper than that of other secondary channels. After the cutting is completed, the upturned ends after plastic bending rebound to be on the horizontal line where the solder tape is located.

[0077] Finally, weld the solder tape 10 and the battery cell 11. The advantage of this solution is that it emphasizes the pretreatment of the solder tape 10, enabling it to solve the problem that when multiple different materials are welded together in actual production, the deformation degrees of the two substances are different before and after thermal expansion and contraction.

[0078] The above is only the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A welding strip processing device, characterized in that: include: A base, the base serving as a bearing structure of the processing device; A support seat, parallel to the base and spaced apart by a preset distance, forming a receiving area; The accommodating area is used to install the driving mechanism; A movable lower mold mechanism is arranged on the support seat; a preset number of lower mold assemblies are installed on the movable lower mold mechanism; and a plurality of arc-shaped protrusion structures are elastically arranged on the lower mold assembly; An upper die mechanism is connected to the output end of the driving mechanism; a preset number of upper die assemblies are installed on the upper die mechanism; and an arc-shaped concave block adapted to the arc-shaped convex structure is installed on the upper die assembly; The lower mold assembly is adapted to the upper mold assembly, and the lower mold assembly and the upper mold assembly are pressed together by controlling the displacement of the output end of the driving mechanism, and the welding strip is pressed to the arc-shaped convex structure through the arc-shaped concave block, so that the straight welding strip is cut into a welding strip with a preset continuous arc-shaped bending shape.

2. A welding strip processing device according to claim 1, characterized in that: The driving mechanism comprises: A plurality of second reversing components are distributed on the base; the second reversing components are connected to the first reversing components through a synchronous shaft; the third output of the second reversing components is a lifting structure, and the other end of the lifting structure is used to connect to the upper mold mechanism.

3. A welding strip processing device according to claim 1, characterized in that: The movable lower mold mechanism comprises: A plurality of support rails are installed in parallel on the support base; a guide rail is installed on the top of the support rails; A second drive motor is installed on the support seat; the second drive motor is used to drive the guide rail; The lower die mounting plate is connected to the sliding end of the guide rail, and a plurality of lower die assemblies are mounted in parallel on the lower die mounting plate.

4. A welding strip processing device according to claim 3, characterized in that: The lower mold assembly comprises: A plurality of mold plates, wherein the upper end of the mold plate is provided with a preset number of channels along the horizontal X axis for placing the solder strip; the upper end of the mold plate is provided with a long strip groove along the horizontal Y axis; and the bottom of the mold plate is provided with a mounting groove; The first mold is in the shape of a long strip and is installed in the long strip groove; the upper surface of the first mold is evenly distributed with arc-shaped protrusion structures; the installation direction of the arc-shaped protrusions is the X-axis direction; countersunk holes are arranged between the arc-shaped protrusion structures; Two sets of lower cutting knives are respectively installed on two sides of the mold plate; A cylinder group, installed in the installation groove; Two sets of limiters are connected to the output end of the cylinder; a plurality of rectangular holes are provided on both sides of the mold plate; A plurality of buckle structures are arranged on the upper surface of the position-limiting member. The buckle structures pass through the rectangular holes, and the width of the buckle structures is smaller than the length of the rectangular holes.

5. A welding strip processing device according to claim 4, characterized in that: The upper mold assembly comprises: The upper mold mounting plate has a number corresponding to the number of the lower mold assemblies; the upper mold mounting plate is evenly provided with a plurality of assembly holes; The arc-shaped concave block is fixed by the assembly hole; the end surface of the arc-shaped concave block is arc-shaped and sunken to form a preset arc structure, and the arc of the end surface of the arc-shaped concave block is adapted to the shape of the arc-shaped convex structure; The upper cutter is installed on both sides of the upper mold installation plate, and the upper cutter is aligned with the lower cutter to cut the welding strip.

6. A welding strip processing device according to claim 5, characterized in that: The arc surface parameters of the arc-shaped concave block are a radius of 9 to 12 mm and an arch height of 0.4 to 0.6 mm.

7. A welding strip processing device according to claim 5, characterized in that: The blade of the lower cutter is far away from the mold plate; the blade of the upper cutter is close to the upper mold mounting plate; bending knives are also installed on both sides of the upper mold mounting plate, and the installation position of the bending knife is close to the upper cutter; the blade end of the bending knife is higher than the blade end of the upper cutter, and the bending knife is close to the back of the lower cutter to bend the end of the welding strip at a preset angle, so that the end of the welding strip forms an angle with the horizontal line, and its end is far away from the horizontal plane where the mold plate is located.

8. A welding strip processing device according to claim 7, characterized in that: The long strip grooves and the rectangular holes cut the channel in the X-axis direction into a plurality of secondary channels located on the same straight line, wherein the depth of the secondary channels at both ends of the channel is deeper than that of the other channels.

9. A welding strip processing device according to claim 7, characterized in that: It also includes a first collecting trough and a second collecting trough, wherein the first collecting trough is installed on a support seat, and a collecting port thereof is arranged below the position between the mold plates; the second collecting trough is installed on a base, and a collecting port of the second collecting trough is directly below the first collecting trough, and a corresponding collecting hole is provided on the support seat for installing the first collecting trough.

10. A method for processing a welding strip, characterized in that: The following steps are involved: S1. Perform multiple arc-shaped synchronous bending processes on the linear welding strip. The arc-shaped bending parameters are designed to be 9 to 12 mm in diameter and 0.4 to 0.6 mm in arch height. The number and spacing of the arc-shaped bending are set based on actual needs. S2, using the upper mold assembly and the lower mold assembly corresponding to the arc bending parameters, pressing the straight welding strip to meet the parameters in step S1; S3, after lamination, the two ends of the bent solder strip are cut off; at the same time, the two ends of the cut solder strip are shaped and bent so that the two ends are warped upward; S4. Set the distance between the two end shaping and bending zones and the secondary channel at the end of the channel so that the end after shaping and bending rebounds to the straight line contained therein.