A multi-axis linkage-based full-automatic PIN pin welding device

Abstract

The application discloses a kind of PIN needle full-automatic welding equipment based on multi-axis linkage, it is related to welding equipment technical field, including welding machine, the welding machine one side is provided with feeding machine, and the welding machine other side is provided with discharging machine, and feeding machine, welding machine and discharging machine top are equipped with conveying device for conveying, further include: welding equipment, welding equipment is fixedly connected at the top of welding machine, the conveying device outside is provided with the tray of placing base plate, and the top of welding machine is fixedly connected with upper clamp, the range of the pressure sensor that two support cylinder frame top is consistent, so that two groups of data can be compared, the pressure data at PIN needle not welded and the pressure data when welding, so that the degree of bonding of welding is more intuitively judged, adopt double metering redundancy design, through the data cross-validation of two groups of independent sensors, improve the reliability of bonding detection, avoid the misjudgment caused by single-point sensor failure.

Description

Technical Field

[0001] This invention relates to the field of welding equipment technology, and in particular to a fully automatic PIN welding device based on multi-axis linkage. Background Technology

[0002] The fully automatic PIN soldering equipment is a specialized piece of equipment that integrates precision mechanics, automated control, and sensing technology. It is mainly used for the PIN soldering process of electronic components (such as high-frequency heads, water valve coils, etc.), achieving efficient and high-precision automated production by gripping the PIN pins and soldering them to the substrate.

[0003] A stator terminal pin welding device disclosed in patent application CN116423141A includes a frame and a stator fixing fixture. The stator fixing fixture is disposed at the lower part of the frame, and a welding mechanism is disposed at the upper part of the frame. The stator fixing fixture includes a fixing housing, which is disposed below the welding mechanism and rotatably connected to the frame. The upper part of the fixing housing is provided with a fixing mechanism for fixing the workpiece position and a material handling mechanism for facilitating the removal of the workpiece from the fixing mechanism. The bottom of the fixing housing is provided with an intermittent rotation mechanism for controlling the intermittent rotation of the fixing housing. Through the coordinated use of the fixing mechanism, the material handling mechanism, and the intermittent rotation mechanism, the position of the workpiece can be fixed, and the rotation angle of the workpiece can be automatically adjusted during the welding process to perform welding operations at different positions of the workpiece. It also facilitates the removal of the workpiece from the fixing housing by the operator during workpiece replacement.

[0004] As can be seen from the above solutions, when soldering the existing substrate and PIN pins, the substrate needs to be fixed. However, during the docking process, it is often impossible to know whether the substrate and PIN pins are tightly attached. After the soldering is completed, the product needs to be reworked if the poor fit is detected by the testing equipment and a cold solder joint is caused by the poor fit. However, if the PIN pins are pressed by gravity by the gripping equipment to make the PIN pins adhere to the substrate, it is easy to cause damage to the substrate or PIN pins.

[0005] Therefore, it is necessary to provide a fully automated PIN soldering device based on multi-axis linkage to solve the above-mentioned technical problems. Summary of the Invention

[0006] The purpose of this invention is to provide a fully automated PIN soldering device based on multi-axis linkage, so as to solve the problems of the prior art mentioned in the background.

[0007] Based on the above ideas, the present invention provides the following technical solution: It includes a welding machine, with a loading platform on one side and a unloading platform on the other side. The loading platform, welding machine, and unloading platform are topped with a conveying device for transporting materials. The invention also includes:

[0008] The welding equipment is fixedly connected to the top of the welding machine. A tray for placing the substrate is provided on the outside of the conveying device, and an upper clamp is fixedly connected to the top of the welding machine. An electric telescopic cylinder is provided inside the welding machine. A lifting frame is fixedly connected to the telescopic end of the electric telescopic cylinder, which is used to lift the substrate and contact the bottom of the upper clamp to fix the substrate.

[0009] The lifting frame is equipped with a support plate inside, and two support cylinders are fixedly connected to the top of the support plate. The two support cylinders are symmetrically arranged, and each of the two support cylinders is equipped with multiple pressure sensors that contact the bottom of the substrate. These sensors are used to detect the pressure when the PIN pins are connected to the substrate. The support cylinders are equipped with an adjustment component that adjusts the distance between the multiple pressure sensors.

[0010] Both support cylinders are equipped with support components at the top to support the PIN pin substrate during soldering.

[0011] As a further aspect of the present invention: the top of the support cylinder is provided with multiple sliding grooves, which are arranged in a ring around the center of the support cylinder, and the bottom of multiple pressure sensors are fixedly connected to sliding seats, which are slidably connected to the interior of the multiple sliding grooves, and the multiple pressure sensors form a circular ring.

[0012] As a further aspect of the present invention: the adjustment component includes a rotating disk, which is rotatably connected to the inside of the support cylinder frame, and the surface of the rotating disk is provided with multiple arc-shaped grooves, which correspond one-to-one with multiple sliding grooves, and the multiple arc-shaped grooves are arranged in a ring around the center of the support cylinder frame.

[0013] As a further aspect of the present invention: the adjustment assembly further includes multiple drive rods, which are respectively fixedly connected to the bottom of multiple pressure sensors, and one end of the drive rod extends into the arc-shaped groove opened on the outside of the rotating disk and is slidably connected to the arc-shaped groove. An internal threaded cylinder is fixedly connected to the bottom of the rotating disk, and the internal threaded cylinder passes through the support cylinder frame and the support plate in sequence and is rotatably connected to the support cylinder frame and the support plate.

[0014] As a further aspect of the present invention: the support assembly includes a fixed cylinder, which is fixedly connected to the top of the support cylinder frame and located at the center of the support cylinder frame. A through groove is provided at the top of the fixed cylinder, and a sealing bladder is provided inside the fixed cylinder. The sealing bladder is filled with liquid, and part of the sealing bladder extends through the through groove to the top of the fixed cylinder for supporting the bottom of the substrate during PIN pin soldering. A push plate is provided inside the fixed cylinder, which is fixedly connected to the bottom of the sealing bladder. An ejector is provided at the bottom of the push plate.

[0015] As a further aspect of the present invention: the ejector includes multiple telescopic rods, the two ends of which are fixedly connected to the bottom of the push plate and the inside of the fixed cylinder, respectively. A threaded rod is fixedly connected to the bottom of the push plate. The threaded rod passes through the fixed cylinder and extends into the inside of the inner threaded cylinder, and the threaded rod is threadedly connected to the inside of the inner threaded cylinder.

[0016] As a further aspect of the present invention: multiple nozzles are fixedly connected to the top of the support cylinder, and multiple spraying devices are fixedly connected to the top of the inside of the support cylinder. The spraying devices and nozzles are connected through branch pipes. A tactile switch is fixedly connected to the bottom of the support cylinder. The tactile switch is electrically connected to the multiple spraying devices. A rotating ring is fixedly connected to the outside of the internal threaded cylinder. Multiple extrusion blocks are provided on the outside of the rotating ring. When the rotating ring rotates with the internal threaded cylinder, the extrusion blocks trigger the tactile switch, causing the multiple spraying devices to spray cooling agent through the nozzles.

[0017] As a further aspect of the present invention: a movable seat is provided inside the lifting frame, a rotary motor is fixedly connected to the top of the movable seat, the output shaft of the rotary motor is fixedly connected to the support plate, and a drive module for driving the movable seat to move along the X-Y axis is provided inside the lifting frame.

[0018] As a further embodiment of the present invention: transmission wheels are fixedly connected to the outer sides of both internally threaded cylinders, and the two transmission wheels are connected by belt drive. A drive motor is fixedly connected to the bottom of the support plate by a support plate, and the output shaft of the drive motor is fixedly connected to one of the internally threaded cylinders.

[0019] As a further aspect of the present invention: the top of the loading machine is provided with a loading mechanism for conveying substrates, the top of the unloading machine is provided with a unloading mechanism for transferring substrates, and a cleaning mechanism is provided on one side of the top of the unloading machine.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. Multiple pressure sensors can detect the pressure at multiple points of contact between the PIN and the substrate. The multiple pressure sensors distributed in a ring array form a distributed pressure monitoring network, which collects pressure data of all directions on the substrate contact surface in real time. If the measured values ​​of all pressure sensors are within the set threshold range, it is determined that the PIN and the substrate are uniformly bonded over the entire area, triggering a welding command. If there is a local pressure abnormality in the pressure sensor, it is determined that the bonding has failed. The system immediately suspends welding and starts a compensation mechanism to adjust the PIN, thereby ensuring that the PIN is fully bonded. This can be detected in the early stage of welding. The bonding detection and error correction are integrated into the welding preparation stage, intercepting the risk of poor soldering in advance and avoiding rework in subsequent processes.

[0022] 2. Multiple sliding seats drive the fixedly connected pressure sensors to move synchronously. When the diameter of the PIN increases, the adjustment component needs to expand the distribution diameter of the pressure sensors to ensure that the sensor array always maintains uniform contact with the outer edge of the PIN, avoiding the risk of poor soldering caused by contact surface misalignment.

[0023] 3. The pressure sensors on the top of the two support cylinders have the same range of expansion, which allows for comparison of two sets of data: the pressure data at the unsoldered pins and the pressure data during welding. This provides a more intuitive assessment of the welding fit. The dual-metering redundancy design uses cross-validation of data from two independent sensors to improve the reliability of the fit detection and avoid misjudgments caused by single-point sensor failure.

[0024] 4. A telescopic rod is fixedly connected between the push plate and the bottom of the fixed cylinder. The sealing bladder rises under the action of the threaded rod, which in turn pushes the sealing bladder up. Due to the presence of liquid inside the sealing bladder, the contact area between the sealing bladder and the substrate is increased. This, combined with the adjustment of the pressure sensor, allows for automatic adjustment, thereby achieving the effect of automatic adjustment. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0026] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the tray structure of the present invention;

[0028] Figure 3 This is a schematic diagram of the fixture structure of the present invention;

[0029] Figure 4 This is a schematic diagram of the lifting frame structure of the present invention;

[0030] Figure 5 This is a schematic diagram of the movable seat structure of the present invention;

[0031] Figure 6 This is a schematic diagram of the support plate structure of the present invention;

[0032] Figure 7 This is a schematic diagram of the support frame structure of the present invention;

[0033] Figure 8 This is a schematic cross-sectional view of the fixed cylinder structure of the present invention;

[0034] Figure 9 This is a schematic diagram of the sealing bladder structure of the present invention;

[0035] Figure 10 This is the present invention. Figure 9 A magnified structural diagram of part A;

[0036] Figure 11 This is a schematic diagram of the PIN pin of the present invention.

[0037] In the diagram: 1. Feeding machine; 11. Feeding mechanism; 2. Welding machine; 201. Welding equipment; 202. Upper clamp; 3. Unloading machine; 301. Unloading mechanism; 302. Cleaning mechanism; 4. Conveying device; 5. Pallet; 6. Electric telescopic cylinder; 601. Lifting frame; 602. Moving seat; 7. Rotary motor; 701. Support plate; 8. Support cylinder frame; 801. Sliding groove; 802. Sliding seat; 803. Pressure sensor; 804. Rotating disk; 805. Arc groove; 806. Drive rod; 807. Internal threaded cylinder; 9. Fixed cylinder; 900. Pushing disk; 901. Sealing bladder; 902. Threaded rod; 903. Telescopic rod; 10. Nozzle; 101. Spraying device; 102. Rotating ring; 103. Extrusion block; 104. Tactile switch; 111. Drive motor; 112. Transmission wheel. Detailed Implementation

[0038] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0039] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0040] like Figures 1 to 11 As shown, a fully automated PIN soldering device based on multi-axis linkage includes the following embodiments:

[0041] Example 1: As Figures 1 to 2As shown, the system includes a welding machine 2, a loading machine 1 on one side of the welding machine 2, and a unloading machine 3 on the other side. The loading machine 1, welding machine 2, and unloading machine 3 are all equipped with a conveying device 4 on their tops. The conveying device 4 typically uses a transmission belt and transmission wheels to form a conveying structure, which is existing technology. The loading machine 1 has a loading mechanism 11 for substrate conveying on its top, and the unloading machine 3 has a substrate transfer unloading mechanism 301 on its top. A cleaning mechanism 302 is located on one side of the top of the unloading machine 3. The cleaning mechanism 302 performs chip removal after the substrate welding is completed. The system also includes:

[0042] Welding equipment 201 is fixedly connected to the top of welding machine 2. A tray 5 for placing substrate is provided on the outside of conveying device 4, and an upper clamp 202 is fixedly connected to the top of welding machine 2. An electric telescopic cylinder 6 is provided inside welding machine 2. A lifting frame 601 is fixedly connected to the telescopic end of electric telescopic cylinder 6, which is used to lift the substrate and contact the bottom of the upper clamp 202 to fix the substrate.

[0043] In specific implementation, when the loading mechanism 11 at the top of the loading platform 1 transports the substrate, the loading mechanism 11 in this solution can use a pneumatic clamp and an electric telescopic rod to clamp the substrate and move it via the electric telescopic rod to place the substrate on top of the tray 5, and then transport it via the conveying device 4. Alternatively, a robotic arm can be used to grip and place the substrate. When the tray 5 moves into the welding equipment 201, the electric telescopic cylinder 6 inside the welding platform 2 is activated, causing the electric telescopic cylinder 6 to drive the lifting frame 601 upward. At this point, the top edge of the lifting frame 601 contacts the bottom of the substrate, thus placing it... The substrate is lifted and contacts the bottom of the upper clamp 202, which is fixedly connected to the top of the welding equipment 201. The substrate is clamped by the lifting frame 601 and the upper clamp 202, thereby fixing the substrate. At this time, the PIN pins are connected to the substrate by the welding equipment 201. After the connection is completed, welding is performed. The connection between the substrate and the PIN pins can be handled by existing robotic arms with suction heads. This is the existing technology. When the PIN pins contact the substrate, they need to be fully attached to the substrate. If there is a gap, it will cause the PIN pins to be poorly soldered, resulting in defective products. However, it is impossible to accurately know whether the PIN pins are fully attached during the connection process.

[0044] In this plan, such as Figures 4 to 5 As shown, a support plate 701 is provided inside the lifting frame 601. Two support cylinders 8 are fixedly connected to the top of the support plate 701. The two support cylinders 8 are symmetrically arranged, and multiple pressure sensors 803 that contact the bottom of the substrate are provided on the top of each of the two support cylinders 8. These sensors are used to detect the pressure when the PIN pin is docked with the substrate. An adjustment component for adjusting the distance between the multiple pressure sensors 803 is provided inside the support cylinders 8.

[0045] The lifting frame 601 is equipped with a movable seat 602. A rotary motor 7 is fixedly connected to the top of the movable seat 602. The output shaft of the rotary motor 7 is fixedly connected to the support plate 701. The lifting frame 601 is equipped with a drive module for moving the movable seat 602 along the X-Y axis. The drive module can be composed of two sets of lead screw modules.

[0046] Both support cylinders 8 are equipped with support components at their tops to support the PIN pin substrate during soldering.

[0047] In practical implementation, to address the issue of inaccurate determination of complete contact between the PIN pin and the substrate during the connection process, this solution incorporates a support plate 701 within the lifting frame 601. A drive module moves the movable seat 602 within the lifting frame 601. Notably, when the bottom of the lifting frame 601 contacts the substrate, multiple pressure sensors 803 are in contact with the substrate bottom. The drive module aligns the center of one of the support cylinders 8 with the center of the PIN pin location to be soldered. When the PIN pin is pressed to the top of the substrate, the multiple pressure sensors 803 are arranged in a ring around the substrate location of the PIN pin. At this point, the contact between the PIN pin and the substrate can be determined using these multiple pressure sensors. Multiple pressure sensors 803 arranged in a ring array form a distributed pressure monitoring network to collect pressure data of the substrate contact surface in real time. If the measured values ​​of all pressure sensors 803 are within the set threshold range (e.g., ±5%), it is determined that the PIN pins are uniformly bonded to the substrate, triggering a welding command. If there is a local pressure anomaly in the pressure sensor 803, such as a single point pressure below the threshold or an excessive pressure gradient between adjacent sensors, it is determined that the bonding has failed. The system immediately suspends welding and activates a compensation mechanism to adjust the PIN pins, thereby ensuring complete bonding. This can be detected in the early stage of welding, integrating bonding detection and error correction into the welding preparation stage, intercepting the risk of poor soldering in advance and avoiding rework in subsequent processes.

[0048] Example 2: Figures 6 to 8 As shown, the top of the support cylinder frame 8 is provided with multiple sliding grooves 801, which are arranged in a ring around the center of the support cylinder frame 8. The bottom of multiple pressure sensors 803 is fixedly connected to sliding seats 802, which are slidably connected to the interior of the multiple sliding grooves 801. The multiple pressure sensors 803 form a circular ring.

[0049] The adjustment component includes a rotating disk 804, which is rotatably connected to the inside of the support frame 8. The rotating disk 804 has multiple arc-shaped grooves 805 on its surface. The multiple arc-shaped grooves 805 correspond one-to-one with multiple sliding grooves 801, and the multiple arc-shaped grooves 805 are arranged in a ring around the center of the support frame 8.

[0050] The adjustment assembly also includes multiple drive rods 806, which are fixedly connected to the bottom of multiple pressure sensors 803 respectively. One end of the drive rod 806 extends into the arc-shaped groove 805 opened on the outside of the rotating disk 804 and is slidably connected to the arc-shaped groove 805. An internal threaded cylinder 807 is fixedly connected to the bottom of the rotating disk 804. The internal threaded cylinder 807 passes through the support cylinder frame 8 and the support plate 701 in sequence and is rotatably connected to the support cylinder frame 8 and the support plate 701.

[0051] In practice, different sizes of PIN pins are used, such as Figure 11 As shown, the contact surface between the PIN pins and the substrate varies depending on their size. Therefore, in this solution, the internal threaded cylinder 807 is rotated, which in turn drives the fixedly connected rotating disk 804 to rotate. When the rotating disk 804 rotates, the drive rod 806 inside the arc-shaped groove 805 on the outer side of the rotating disk 804 drives the sliding seat 802 to slide within the sliding groove 801. This causes multiple sliding seats 802 to drive the fixedly connected pressure sensors 803 to move synchronously. When the diameter of the PIN pins increases, the adjustment assembly needs to expand the distribution diameter of the pressure sensors 803 to ensure that the sensor array always maintains uniform contact with the outer edge of the PIN pins, avoiding the risk of poor soldering due to contact surface misalignment.

[0052] In this plan, such as Figure 6 As shown, transmission wheels 112 are fixedly connected to the outer sides of the two internally threaded cylinders 807. The two transmission wheels 112 are connected by belt drive. A drive motor 111 is fixedly connected to the bottom of the support plate 701 through a support plate. The output shaft of the drive motor 111 is fixedly connected to one of the internally threaded cylinders 807.

[0053] In practical implementation, this solution uses two support cylinder frames 8. When the internal threaded cylinder 807 needs to rotate, it is driven by a belt and a feeding mechanism 11 to make the two internal threaded cylinders 807 rotate synchronously. This causes the pressure sensors 803 on the top of the two support cylinder frames 8 to move synchronously. The pressure sensors 803 on the top of the two support cylinder frames 8 have the same unfolding range, allowing for comparison of two sets of data: the pressure data at the un-welded PIN pin location and the pressure data during welding. This provides a more intuitive assessment of the welding adhesion. A dual-metering redundancy design, referencing the principle of a dual-metering weighing device for material distribution, is adopted. Cross-validation of data from two independent sensors improves the reliability of the adhesion detection and avoids misjudgments caused by single-point sensor failure.

[0054] Example 3: Figures 7 to 9 As shown, the support assembly includes a fixed cylinder 9, which is fixedly connected to the top of the support cylinder frame 8 and located at the center of the support cylinder frame 8. A through groove is provided on the top of the fixed cylinder 9, and a sealing bladder 901 is provided inside the fixed cylinder 9. The sealing bladder 901 is filled with liquid, and part of the sealing bladder 901 extends through the through groove to the top of the fixed cylinder 9 to support the bottom of the substrate during PIN pin soldering. A push plate 900 is provided inside the fixed cylinder 9, which is fixedly connected to the bottom of the sealing bladder 901. An ejector is provided at the bottom of the push plate 900.

[0055] In practical implementation, when multiple pressure sensors 803 are in contact with the bottom of the substrate, there is a lack of support at the center of the substrate where the PIN pins are soldered. Therefore, in this solution, a sealing bladder 901 is set inside the fixed cylinder 9. The sealing bladder 901 uses a flexible composite film material to encapsulate a phase change medium such as a deionized water / ethylene glycol mixture. During the lifting process of the support cylinder 8, the axial constraint inside the fixed cylinder 9 guides the sealing bladder 901 to deform directionally along the through groove, forming a conformal support surface that matches the curved surface of the bottom of the substrate. This provides support and protection for the bottom of the soldering substrate. At the same time, the point support constrains the heat dissipation path to the vicinity of the support point, making the temperature field of the soldering area more uniform. In addition, the liquid inside the sealing bladder 901 can also absorb heat during the soldering process, thereby improving the heat dissipation effect.

[0056] In this embodiment, the ejector includes multiple telescopic rods 903. The two ends of the multiple telescopic rods 903 are fixedly connected to the push plate 900 and the bottom of the fixed cylinder 9, respectively. A threaded rod 902 is fixedly connected to the bottom of the push plate 900. The threaded rod 902 passes through the fixed cylinder 9 and extends into the interior of the internal threaded cylinder 807. The threaded rod 902 is threadedly connected to the interior of the internal threaded cylinder 807.

[0057] In practical implementation, when multiple pressure sensors 803 are adjusted for different sized PIN needles, the range of bottom support will also change accordingly. In this solution, an ejector is set up. When the inner threaded cylinder 807 rotates, it drives the threaded rod 902 to rotate through the threaded connection. The threaded rod 902 extends into the fixed cylinder 9 and is fixedly connected to the push plate 900. A telescopic rod 903 is fixedly connected between the push plate 900 and the bottom of the fixed cylinder 9. As a result, the sealing bladder 901 rises under the action of the threaded rod 902, causing the push plate 900 to push the sealing bladder 901 to rise. Due to the presence of liquid inside the sealing bladder 901, the contact surface between the sealing bladder 901 and the substrate is increased. With the adjustment of the pressure sensor 803, automatic adjustment is achieved, thereby achieving the effect of automatic adjustment.

[0058] Example 4: Figures 9 to 10As shown, multiple nozzles 10 are fixedly connected to the top of the support cylinder 8, and multiple spraying devices 101 are fixedly connected to the top of the inside of the support cylinder 8. The spraying devices 101 and the nozzles 10 are connected through branch pipes. A tactile switch 104 is fixedly connected to the bottom of the support cylinder 8. The tactile switch 104 is electrically connected to the multiple spraying devices 101. A rotating ring 102 is fixedly connected to the outside of the internal threaded cylinder 807. Multiple extrusion blocks 103 are provided on the outside of the rotating ring 102. When the rotating ring 102 rotates with the internal threaded cylinder 807, the extrusion blocks 103 trigger the tactile switch 104, causing the multiple spraying devices 101 to spray cooling agent through the nozzles 10.

[0059] In specific implementation, when the internal threaded cylinder 807 rotates, a rotating ring 102 is fixedly connected to the internal threaded cylinder 807. When the rotating ring 102 rotates, it will drive the extrusion block 103 to rotate. At this time, it will extrude the tactile switch 104, thereby triggering the tactile switch 104. The tactile switch 104 starts the spraying device 101, and the spraying device 101 sprays the liquid inside it through the nozzle 10 to target the surface of the substrate and the sealing bag 901, improve the overall heat dissipation effect, and accelerate the heat transfer of the liquid inside the sealing bag 901. The liquid can be such as fluorinated liquid, alcohol, etc., and the selection is made according to the specific operation.

[0060] Furthermore, in this solution, by setting two support cylinders 8, when one support cylinder 8 is welding the substrate position, the other support cylinder 8 can drive the support plate 701 to rotate through the rotary motor 7, adjust the angle, and pre-cool the next welding point around it. At the same time, the liquid inside the other sealing bag 901 is in a cooling state. The two support cylinders 8 are used alternately, thereby improving the cooling effect.

[0061] The spraying device 101 can consist of a miniature pump and a storage tank, and can be used in conjunction with a tactile switch 104 through electrical connection.

[0062] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0063] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0064] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A fully automatic PIN welding device based on multi-axis linkage, comprising a welding machine (2), wherein a feeding machine (1) is provided on one side of the welding machine (2), and a discharging machine (3) is provided on the other side of the welding machine (2), and a conveying device (4) for conveying is provided on the top of the feeding machine (1), the welding machine (2), and the discharging machine (3), characterized in that, Also includes: Welding equipment (201) is fixedly connected to the top of welding machine (2). A tray (5) for placing substrate is provided on the outside of the conveying device (4). An upper clamp (202) is fixedly connected to the top of the welding machine (2). An electric telescopic cylinder (6) is provided inside the welding machine (2). A lifting frame (601) is fixedly connected to the telescopic end of the electric telescopic cylinder (6) to lift the substrate and contact the bottom of the upper clamp (202) to fix the substrate. The lifting frame (601) is provided with a support plate (701) inside. Two support cylinders (8) are fixedly connected to the top of the support plate (701). The two support cylinders (8) are symmetrically arranged, and each of the two support cylinders (8) is provided with multiple pressure sensors (803) that contact the bottom of the substrate. These sensors are used to detect the pressure when the PIN pin is connected to the substrate. The support cylinders (8) are provided with an adjustment component to adjust the distance between the multiple pressure sensors (803). Both support cylinders (8) are equipped with support components at the top for supporting the PIN pin substrate during soldering; The top of the support cylinder (8) is provided with multiple sliding grooves (801), the multiple sliding grooves (801) are arranged in a ring around the center of the support cylinder (8), and the bottom of the multiple pressure sensors (803) is fixedly connected with sliding seats (802), the multiple sliding seats (802) are respectively slidably connected inside the multiple sliding grooves (801), and the multiple pressure sensors (803) form a circular ring; The support assembly includes a fixed cylinder (9), which is fixedly connected to the top of the support cylinder frame (8) and located at the center of the support cylinder frame (8). The top of the fixed cylinder (9) has a through groove. A sealing bladder (901) is provided inside the fixed cylinder (9). The sealing bladder (901) is filled with liquid, and part of the sealing bladder (901) extends through the through groove to the top of the fixed cylinder (9) to support the bottom of the substrate during PIN pin soldering. A push plate (900) is provided inside the fixed cylinder (9). The push plate (900) is fixedly connected to the bottom of the sealing bladder (901). An ejector is provided at the bottom of the push plate (900). The lifting frame (601) is provided with a movable seat (602) inside. A rotary motor (7) is fixedly connected to the top of the movable seat (602). The output shaft of the rotary motor (7) is fixedly connected to the support plate (701). The lifting frame (601) is provided with a drive module for driving the movable seat (602) to move along the X-Y axis. Two internal threaded cylinders (807) are fixedly connected to the outer sides of the transmission wheel (112), and the two transmission wheels (112) are connected by belt drive. The bottom of the support plate (701) is fixedly connected to the drive motor (111) by the support plate. The output shaft of the drive motor (111) is fixedly connected to one of the internal threaded cylinders (807).

2. The fully automatic PIN welding equipment based on multi-axis linkage according to claim 1, characterized in that: The adjustment component includes a rotating disk (804), which is rotatably connected to the inside of the support cylinder (8). The rotating disk (804) has multiple arc-shaped grooves (805) on its surface. The multiple arc-shaped grooves (805) correspond one-to-one with multiple sliding grooves (801), and the multiple arc-shaped grooves (805) are arranged in a ring around the center of the support cylinder (8).

3. The fully automatic PIN welding equipment based on multi-axis linkage according to claim 2, characterized in that: The adjustment assembly also includes multiple drive rods (806), which are fixedly connected to the bottom of multiple pressure sensors (803). One end of the drive rod (806) extends into the arc groove (805) on the outside of the rotating disk (804) and is slidably connected to the arc groove (805). An internal threaded cylinder (807) is fixedly connected to the bottom of the rotating disk (804). The internal threaded cylinder (807) passes through the support cylinder frame (8) and the support plate (701) in sequence and is rotatably connected to the support cylinder frame (8) and the support plate (701).

4. The fully automatic PIN soldering equipment based on multi-axis linkage according to claim 3, characterized in that: The ejector includes multiple telescopic rods (903), with both ends of the multiple telescopic rods (903) fixedly connected to the bottom of the push plate (900) and the fixed cylinder (9), respectively. A threaded rod (902) is fixedly connected to the bottom of the push plate (900), and the threaded rod (902) passes through the fixed cylinder (9) and extends into the inner threaded cylinder (807), and the threaded rod (902) is threadedly connected to the inner threaded cylinder (807).

5. The fully automatic PIN soldering equipment based on multi-axis linkage according to claim 4, characterized in that: Multiple nozzles (10) are fixedly connected to the top of the support cylinder (8). Multiple spraying devices (101) are fixedly connected to the top of the inside of the support cylinder (8). The spraying devices (101) and the nozzles (10) are connected through branch pipes. A tactile switch (104) is fixedly connected to the bottom of the support cylinder (8). The tactile switch (104) is electrically connected to the multiple spraying devices (101). A rotating ring (102) is fixedly connected to the outside of the inner threaded cylinder (807). Multiple extrusion blocks (103) are provided on the outside of the rotating ring (102). When the rotating ring (102) rotates with the inner threaded cylinder (807), the extrusion blocks (103) trigger the tactile switch (104) to control the multiple spraying devices (101) to spray cooling agent through the nozzles (10).

6. The fully automatic PIN soldering equipment based on multi-axis linkage according to claim 5, characterized in that: The loading platform (1) is provided with a loading mechanism (11) for substrate conveying on its top, and the unloading platform (3) is provided with a substrate transfer unloading mechanism (301) on its top, and a cleaning mechanism (302) is provided on one side of the top of the unloading platform (3).

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