Negative pressure suction device and electronic paper slice moving method

Abstract

The negative pressure suction device and the electronic paper slice moving method are used for sucking a plurality of planar electronic components at a time, and a back plate and a sealing plate with holes are encircled to form a vacuum cavity; the negative pressure air guide port is formed in the back plate, is communicated with the vacuum cavity and is used for being connected with an external vacuum air pump; the sponge air suction plate comprises a sponge through hole array, the sponge air suction plate covers the perforated sealing plate, and sponge through holes correspond to sealing plate through holes in the perforated sealing plate; in a working state, the electronic component covers more than two sponge through holes, the electronic component is adsorbed by negative pressure, and the negative pressure suction device sucks a plurality of planar electronic components at one time. Laminating the plurality of electronic paper slices based on a negative pressure suction device; the vacuum pump is started, the negative pressure state of the negative pressure suction device is adjusted, and the multiple electronic paper slices are sucked; and in the negative pressure state of the negative pressure suction device, the multiple electronic paper slices are moved by moving the negative pressure suction device.

Description

Technical Field

[0001] This application belongs to the field of electronic paper manufacturing, and particularly relates to a negative pressure suction device and method. Background Art

[0002] Electronic paper modules are now widely used in fields such as supermarket price tags, e-books, mobile phones and other electronic devices; with the increase in market demand and the increasing maturity of automated equipment, the production capacity bottleneck of electronic paper production is obvious.

[0003] In the prior art, in the production of electronic paper laser cutting, there are the following problems: the electronic paper cutting method also more prominently shows bottlenecks as follows: FPL (Flexible Printed Lamination refers to the flexible printing lamination process) electronic paper needs to cut the entire master sheet into hundreds of small pieces of FPL through laser cutting; after FPL cutting, manual material collection is required, and more than 300 pieces are collected one by one, with low efficiency; if FPL is adsorbed by double-sided adhesive, residual glue is likely to adhere to the FPL electronic paper.

[0004] In view of the above problems, it is urgent to improve the deficiencies of the existing operation method by using new fixtures and new methods to improve production efficiency and the yield of good products. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to avoid the deficiencies in the prior art where the collection efficiency of small pieces of FPL is low and it is easy to get dirty after laser cutting of the electronic paper master sheet, and to provide a negative pressure suction device and method that can improve the production capacity and product yield of electronic paper cutting.

[0006] The technical solution of this application to solve the above technical problem is a negative pressure suction device for sucking multiple planar electronic components at one time, including: a back plate, a perforated sealing plate, a sponge suction plate, and a negative pressure air guide port; the back plate and the perforated sealing plate enclose to form a vacuum cavity; the negative pressure air guide port is installed on the back plate and is connected to the vacuum cavity, and the negative pressure air guide port is used to connect to an external vacuum air pump; the sponge suction plate includes a sponge through-hole array, the sponge suction plate covers the above-mentioned perforated sealing plate, and the sponge through-holes correspond to the sealing plate through-holes on the perforated sealing plate; in the working state, the above-mentioned electronic components cover two or more sponge through-holes, and the electronic components are negatively adsorbed, and the negative pressure suction device sucks multiple planar electronic components at one time.

[0007] The diameter of the above-mentioned sponge through-hole is larger than the diameter of the sealing plate through-hole on the above-mentioned perforated sealing plate.

[0008] The above-mentioned sponge suction plate includes a non-through-hole part and multiple product suction parts; the product suction parts include two or more sponge through-holes; in the working state, the above-mentioned electronic components correspond to the above-mentioned product suction parts, and negative pressure is generated in the sponge through-holes to adsorb the above-mentioned electronic components.

[0009] The shape and size of the suction part of the above product correspond to those of the electronic component.

[0010] The above negative pressure suction device further includes a partition board that covers the above sponge suction plate; the partition board includes a partition part and a plurality of adaptation windows. The partition part has no holes, and the adaptation windows are hollowed-out forms; in the working state, the above electronic component corresponds to the above adaptation window, and a negative pressure is generated in the sponge through-hole to adsorb the above electronic component.

[0011] The shape and size of the above adaptation window correspond to those of the electronic component.

[0012] The above partition board is connected to the above sponge suction plate through a connecting component.

[0013] The above negative pressure suction device may be such that the above electronic component is an electronic paper slice, and the above electronic paper slice is obtained by cutting and decomposing a master slice.

[0014] The above negative pressure suction device may include two or more negative pressure air guide ports.

[0015] The above negative pressure suction device may include one or more handles. The handles are fixedly connected to the back plate, and the handles are used to grasp the above negative pressure suction device.

[0016] The technical solution for the present application to solve the above technical problem may also be a method for moving electronic paper slices, which is used to suck and move multiple electronic paper slices at one time. The characteristics are based on the above negative pressure suction device; it includes the following steps A10: the negative pressure suction device is attached to multiple electronic paper slices; step A20: start the vacuum pump, adjust the negative pressure state of the negative pressure suction device, and suck multiple electronic paper slices; step A30: in the negative pressure state of the negative pressure suction device, move multiple electronic paper slices by moving the negative pressure suction device; steps A20 and A10 do not distinguish the order.

[0017] The above method for moving electronic paper slices further includes step A40: after moving multiple electronic paper slices to the target position, release the negative pressure state of the negative pressure suction device to release multiple electronic paper slices.

[0018] One of the beneficial effects of the technical solution in the present application is that when cutting electronic paper, the electronic paper is placed above the porous component. When laser-cutting the electronic paper, when the laser passes through the electronic paper, it is very likely to also pass through the A through-hole, and the probability of the main body of the porous component itself being damaged by laser cutting is small. The longer the porous component can maintain flatness, the higher the yield in the production process. As a high-value consumable in the production process, the detachable design of the porous component is convenient for replacement. The porous design also makes the replacement frequency lower, further improving production efficiency and reducing production costs.

[0019] One of the beneficial effects of the technical solution in this application is that the back plate and the perforated sealing plate enclose to form a vacuum cavity. The planar electronic components are adsorbed by the sponge suction plate, avoiding the gap between the planar electronic components and the vacuum adsorption surface, making the adsorption more reliable.

[0020] One of the beneficial effects of the technical solution in this application is that the back plate and the perforated sealing plate enclose to form a vacuum cavity. The volume of the cavity and the surface available for sucking multiple planar electronic components are large enough to meet the requirement of sucking multiple planar electronic components at one time.

[0021] One of the beneficial effects of the technical solution in this application is that the diameter of the sponge through holes is larger than the diameter of the sealing plate through holes on the above-mentioned perforated sealing plate, enabling the vacuum cavity to maintain the vacuum state more continuously; the diameter of the sponge through holes is larger than the adsorption and fitting area of the planar electronic components, which is more conducive to stable sucking.

[0022] One of the beneficial effects of the technical solution in this application is that the sponge suction plate includes a sponge through hole array, and the soft sponge material is easier to protect the planar electronic components.

[0023] One of the beneficial effects of the technical solution in this application is that the sponge through hole array makes both the direct adsorption area and the adsorption force strong enough to support sucking multiple planar electronic components at one time.

[0024] One of the beneficial effects of the technical solution in this application is that the sponge through holes correspond to the sealing plate through holes on the perforated sealing plate, making the suction channel of the vacuum pump smoother and conducive to maintaining the vacuum state.

[0025] One of the beneficial effects of the technical solution in this application is that there are multiple product suction parts, which can correspond one by one to the multiple planar electronic components to be sucked, and can better adsorb and protect.

[0026] One of the beneficial effects of the technical solution in this application is that the shape and size of the product suction part correspond to the shape and size of the electronic component, which is convenient for better adsorption and protection.

[0027] One of the beneficial effects of the technical solution in this application is that the isolation plate can add an additional layer of protection and reduce sponge wear.

[0028] One of the beneficial effects of the technical solution in this application is that it is applicable to flat-state electronic devices such as electronic paper slices and other screen types.

[0029] One of the beneficial effects of the technical solution in this application is that there are two or more negative pressure air guide ports to ensure that there are enough interfaces for the air pump to evacuate the vacuum; the negative pressure air guide ports are evenly distributed, the vacuum pressure is more balanced, and the adsorption and grasping are more stable.

[0030] One of the beneficial effects of the technical solution in this application is that the handle is used to grasp the above-mentioned negative pressure suction device, facilitating batch grasping operations.

[0031] One of the beneficial effects of the technical solution in this application, the method for moving electronic paper slices, uses a negative pressure suction device, which not only greatly improves efficiency but also reduces the possibility of surface contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a schematic diagram of the negative pressure suction device;

[0033] Figure 2 is a bottom view of the negative pressure suction device;

[0034] Figure 3 is a sectional view of the negative pressure suction device along the central axis;

[0035] Figure 4 is Figure 3 a partially enlarged schematic diagram of

[0036] Figure 5 is a bottom view of the negative pressure suction device;

[0037] Figure 6 is a combined state sectional view of the negative pressure suction device along the central axis;

[0038] Figure 7 is a disassembled state sectional view of the negative pressure suction device along the central axis;

[0039] Figure 8 is a schematic diagram of the isolation plate;

[0040] Figure 9 is a schematic diagram of the negative pressure suction device sucking multiple small FPL display screens. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0041] The following further details the embodiments of the present invention in conjunction with the accompanying drawings.

[0042] It should be noted that the following is a description of the preferred embodiments of this application, which does not constitute any limitation to this application. The description of the preferred embodiments of this application is only for the illustration of the general principle of this application. The embodiments described in this application are only a part of the embodiments of this application, not all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts fall within the scope of protection of this application.

[0043] In the description of this application, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to this application. In addition, the terms "first", "second", and technical features numbered with Arabic numerals such as 1, 2, 3, etc., as well as designations such as "A", "B", are only for descriptive purposes, just for convenience of explanation, and do not represent a sequential relationship in time or space; they cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and numbered with Arabic numerals such as 1, 2, 3, etc. may explicitly or implicitly include one or more of such features. In the description of this application, the meaning of "several" is two or more, unless otherwise specifically defined.

[0044] As described above, there are various problems in the production of laser cutting of electronic paper: the entire mother sheet of electronic paper needs to be cut into hundreds of small pieces of FPL through laser cutting; after the FPL is cut, manual material collection is required, and more than 300 pieces need to be collected one by one, with low efficiency; if the FPL is adsorbed by double-sided adhesive, residual glue is likely to adhere to the FPL electronic paper. Manual collection has very low efficiency and is prone to contamination, reducing the yield rate.

[0045] As Figures 1 to 5 , an embodiment of a negative pressure suction device for sucking multiple planar electronic components at one time, includes: a back plate, a perforated sealing plate, a sponge suction plate, and a negative pressure air guide port; the back plate and the perforated sealing plate enclose to form a vacuum cavity.

[0046] As Figures 1 to 3 , an embodiment of a negative pressure suction device, the negative pressure air guide port is installed on the back plate and communicates with the vacuum cavity, and the negative pressure air guide port is used to connect to an external vacuum air pump.

[0047] As Figures 1 to 4 , an embodiment of a negative pressure suction device, the sponge suction plate includes a sponge through-hole array, the sponge suction plate covers the above-mentioned perforated sealing plate, and the sponge through-holes correspond to the sealing plate through-holes on the perforated sealing plate.

[0048] As Figure 4 , the diameter of the above-mentioned sponge through-holes is larger than the diameter of the sealing plate through-holes on the above-mentioned perforated sealing plate.

[0049] As Figures 5 to 9, An embodiment of a negative pressure suction device, in the working state, the above-mentioned electronic components cover more than two sponge through-holes, and negative pressure is used to adsorb the above-mentioned electronic components. The negative pressure suction device can suck multiple planar electronic components at one time.

[0050] Such as Figure 5 , An embodiment of a negative pressure suction device, the above-mentioned sponge suction plate includes a non-through-hole part and multiple product suction parts; the product suction parts include more than two sponge through-holes.

[0051] Such as Figures 5 to 9 , An embodiment of a negative pressure suction device, in the working state, the above-mentioned electronic components correspond to the above-mentioned product suction parts, and negative pressure is generated in the sponge through-holes to adsorb the above-mentioned electronic components.

[0052] Such as Figures 5 to 9 , An embodiment of a negative pressure suction device, the shape and size of the above-mentioned product suction parts correspond to the shape and size of the electronic components.

[0053] Such as Figures 6 to 9 , An embodiment of a negative pressure suction device further includes a separator plate that covers the above-mentioned sponge suction plate. Such as Figure 8 , The above-mentioned separator plate includes a separation part and multiple adaptation windows. The separation part has no holes, and the adaptation windows are hollow forms. Figure 8 , The separator plate is installed on the sponge suction plate through the cooperation of mounting holes and fasteners.

[0054] Such as Figure 9 , In the working state, the above-mentioned electronic components correspond to the above-mentioned adaptation windows, and negative pressure is generated in the sponge through-holes to adsorb the above-mentioned electronic components. The electronic components can be display screens or electronic paper slices.

[0055] Such as Figures 5 to 9 , An embodiment of a negative pressure suction device, the shape and size of the above-mentioned adaptation windows correspond to the shape and size of the electronic components.

[0056] Such as Figure 6 , The above-mentioned separator plate is connected to the above-mentioned sponge suction plate through a connecting component.

[0057] In some embodiments, the above-mentioned electronic components are electronic paper slices, and the above-mentioned electronic paper slices are obtained by cutting and decomposing a master slice.

[0058] Such as Figures 1 to 3 , An embodiment of a negative pressure suction device includes two or more negative pressure air guide ports; including negative pressure air guide port A and negative pressure air guide port B; negative pressure air guide port A and negative pressure air guide port B are symmetrically arranged on the back plate.

[0059] Such as Figures 1 to 7, an embodiment of a negative pressure suction device, includes one or more handles, the above-mentioned handles are fixedly connected to the back plate, and the handles are used to grasp the above-mentioned negative pressure suction device.

[0060] An embodiment of a method for moving electronic paper slices, which is used to suck and move multiple electronic paper slices at one time, based on the above-mentioned negative pressure suction device; includes the following steps A10: the negative pressure suction device fits multiple electronic paper slices; step A20: start the vacuum pump, adjust the negative pressure state of the negative pressure suction device, and suck multiple electronic paper slices; step A30: in the negative pressure state of the negative pressure suction device, move multiple electronic paper slices by moving the negative pressure suction device. Steps A20 and A10 do not distinguish the order. The vacuum pump can be started first, the negative pressure state of the negative pressure suction device can be adjusted, and then multiple electronic paper slices can be fitted and sucked.

[0061] The embodiment of the method for moving electronic paper slices further includes step A40: after moving multiple electronic paper slices to the target position, release the negative pressure state of the negative pressure suction device and release multiple electronic paper slices.

[0062] The current job fixture for improving the material collection efficiency after electronic paper cutting involves customizing an integrated vacuum sponge suction cup, whose shape matches the size of the electronic paper master sheet and has customized vacuum holes inside. It can suck the entire tray of cut materials at one time.

[0063] The job fixture of the present invention patent for improving the material collection efficiency after electronic paper cutting mainly solves problems such as low operation efficiency and the original fixture using double-sided tape is prone to residual glue adhering to the FPL, etc.

[0064] In the existing vacuum adsorption device, when fitting small pieces of electronic paper, there are many vertical and horizontal gaps in the cut small pieces of electronic paper, and these gaps will leak vacuum; the vacuum leaks, and the subsequent adsorption ability is reduced. Moreover, the size of the vacuum suction cup in the existing technology is too small to meet the requirement of sucking all products at one time.

[0065] In this application, a sponge with a corresponding gas path is made by using a customized mold to solve the problem of overall vacuum leakage caused by local vacuum leakage. The traditional adhesive method is replaced by a vacuum adsorption method. When working: the job fixture, that is, the negative pressure suction device, uses the vacuum pump as the vacuum air source; the sponge surface of the fixture, that is, the negative pressure suction device, fits the product, and all products are sucked at one time. When in use, the operator turns on the vacuum pump; holds the handle and fits the sponge to the small pieces of FPL after the whole machine is cut; takes out all products as a whole, transfers them to the next working station table top, turns off the vacuum source, and the products automatically separate from the fixture, and the product transfer is completed.

[0066] Original operation efficiency: After cutting, it will be divided into 18×18 = 324 small pieces. The time required to pick up each small piece is 1 second, so the total time required is 324 / 60 = 5.4 minutes. In the extreme state, the time required to pick up each small piece is 0.5 seconds, which also takes 2.7 minutes. After improvement, using a customized fixture, the operation efficiency: The time to suck up the whole plate is about 0.5 minutes; the efficiency is increased by 10 times. In the original operation method, there is a certain probability of adhering residual glue on a single-piece FPL. After improvement, using a customized fixture for operation, the probability of adhering residual glue on the FPL is 0.

[0067] As shown in the attached drawings, the above are only embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the invention specification and the attached drawings, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A negative pressure suction device for sucking multiple planar electronic components at one time. It is characterized in that Including: back plate, sealing plate with holes, sponge air intake plate, negative pressure air guide port; The back plate and the sealing plate with holes are combined to form a vacuum cavity; The negative pressure air guide port is installed on the back plate and communicated with the vacuum chamber. The negative pressure air guide port is used to connect with an external vacuum air pump; The sponge air-intake plate comprises a sponge through-hole array, the sponge air-intake plate covers the perforated sealing plate, and the sponge through-holes correspond to the sealing plate through-holes on the perforated sealing plate; In the working state, the electronic component covers more than two sponge through holes, and the electronic component is adsorbed by negative pressure. The negative pressure adsorption device adsorbs multiple planar electronic components at one time.

2. The negative pressure suction device according to claim 1, characterized in that: The diameter of the sponge through hole is greater than the diameter of the sealing plate through hole on the perforated sealing plate.

3. The negative pressure suction device according to claim 1, characterized in that: The sponge air-absorbing plate includes a portion without through-holes and a plurality of product-absorbing portions; the product-absorbing portion includes more than two sponge through-holes; In the working state, the electronic components correspond to the product absorption part, and the sponge through holes generate negative pressure to absorb the electronic components.

4. The negative pressure suction device according to claim 3, characterized in that: The shape and size of the product suction part correspond to the shape and size of the electronic component.

5. The negative pressure suction device according to claim 1, characterized in that: Also includes an isolation plate, the isolation plate covers the sponge air-absorbing plate; The isolation plate includes an isolation portion and a plurality of adapting windows, the isolation portion has no holes, and the adapting windows are hollow windows; In the working state, the electronic component corresponds to the adaptation window, and the sponge through hole generates negative pressure to adsorb the electronic component.

6. The negative pressure suction device according to claim 5, characterized in that: The shape and size of the adaptation window correspond to the shape and size of the electronic component.

7. The negative pressure suction device according to claim 5, characterized in that: The isolation plate is connected to the sponge air-intake plate via a connecting component.

8. The negative pressure suction device according to claim 1, characterized in that: Include any of the following technical features: TA1: The electronic component is an electronic paper slice, and the electronic paper slice is obtained by cutting and decomposing a mother sheet; TA2: includes two or more negative pressure air inlets; TA3: includes one or more handles, wherein the handles are fixedly connected to the back plate, and the handles are used to grasp the negative pressure suction device.

9. A method for moving electronic paper slices, used for sucking and moving multiple electronic paper slices at one time, characterized in that: A negative pressure suction device according to any one of claims 1 to 8; Includes the following Step A10: The negative pressure suction device adheres multiple electronic paper slices; Step A20: starting the vacuum pump, adjusting the negative pressure state of the negative pressure suction device, and sucking a plurality of electronic paper slices; Step A30: in a negative pressure state of the negative pressure suction device, moving the plurality of electronic paper slices by moving the negative pressure suction device; There is no distinction between the order of step A20 and step A10.

10. The electronic paper slice moving method according to claim 1, characterized in that: The method further includes step A40: after moving the multiple electronic paper slices to the target position, releasing the negative pressure state of the negative pressure suction device to release the multiple electronic paper slices.

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