Hot-melt pressure-sensitive adhesive for bonding magnesium oxide board

Abstract

The invention discloses a hot-melt pressure-sensitive adhesive for bonding magnesium oxide boards, and belongs to the technical field of hot-melt adhesives, the hot-melt pressure-sensitive adhesive for bonding magnesium oxide boards comprises the following raw material components: a base material, a plasticizer, a tackifier, a filler and an antioxidant, the base material is selected from one or more of synthetic rubber and natural rubber; the plasticizer is selected from one or more of mineral oil and polybutylene oil; the tackifier is selected from one or more of rosin ester, terpene resin, C5 petroleum resin, coumarone resin, aromatic hydrocarbon petroleum resin and PS resin; the filler is selected from one or more of calcium carbonate, argil, silicon dioxide and talcum powder; the antioxidant is selected from a chain transfer agent and sterically hindered phenols. The hot melt adhesive can uniformly flow between two glass magnesium boards in the bonding process, so that the bonding uniformity, firmness and flatness of the glass magnesium boards are ensured, the curing uniformity of the hot melt adhesive is ensured, and the stability of the finally bonded glass magnesium boards is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of hot melt adhesives, and more specifically, to a hot melt pressure-sensitive adhesive for bonding magnesite boards. Background Art

[0002] The magnesite fireproof board is also known as magnesite board, magnesium oxide board, magnesite board, and magnesium-based board. The materials for producing the magnesite fireproof board include active high-purity magnesium oxide (MgO), high-quality magnesium chloride (MgCl2), alkali-resistant fiberglass cloth, plant fiber, incombustible and light perlite, chemically stable lithopone, polymer, and high-performance modifier.

[0003] During the process of laminating magnesite boards, a hot melt adhesive is required to bond the magnesite boards. Currently, when selecting a hot melt adhesive for bonding magnesite boards, when the commonly used hot melt adhesive adheres between two magnesite boards, the hot melt adhesive may adhere unevenly, resulting in uneven connection between the two magnesite boards. At the same time, during the use of the bonded magnesite boards, the stability of the bonded magnesite boards may also be poor due to the unevenness of the hot melt adhesive.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structure, and a hot melt pressure-sensitive adhesive for bonding magnesite boards is provided, in order to achieve a more practical value. Summary of the Invention

[0005] 1. Technical Problems to be Solved

[0006] Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a hot melt pressure-sensitive adhesive for bonding magnesite boards, which can uniformly flow between two magnesite boards during the bonding process, ensure the uniformity, firmness, and flatness of the bonding of magnesite boards, and at the same time ensure the uniform curing of the hot melt adhesive, thus guaranteeing the stability of the finally bonded magnesite boards.

[0007] 2. Technical Solutions

[0008] To solve the above problems, the present invention adopts the following technical solutions.

[0009] A hot melt pressure-sensitive adhesive for bonding magnesite boards, the raw material components of the hot melt pressure-sensitive adhesive include a base material, a plasticizer, a tackifier, a filler, and an antioxidant, and the ratio of each component by mass is as follows:

[0010] Base material 450 - 600 parts

[0011] Plasticizer 120 - 150 parts

[0012] Tackifier 65 - 80 parts

[0013] Filler 25 - 40 parts

[0014] 10 - 15 parts of antioxidant

[0015] Among them, the base material is selected from one or more of synthetic rubber and natural rubber;

[0016] The plasticizer is selected from one or more of mineral oil and polybutene oil;

[0017] The tackifier is selected from one or more of rosin resin, terpene resin, C5 petroleum resin, coumarone resin, aromatic petroleum resin, and PS resin;

[0018] The filler is selected from one or more of calcium carbonate, clay, silica, and talc powder;

[0019] The antioxidant is selected from chain transfer agents and hindered phenols.

[0020] Furthermore, the ratio of synthetic rubber to natural rubber in the base material is 1:1;

[0021] The synthetic rubber is synthesized by using styrene - butadiene - styrene rubber and styrene - ethylene - butadiene - styrene rubber;

[0022] Natural rubber is a natural polymer compound mainly composed of cis - 1,4 - polyisoprene.

[0023] Furthermore, the plasticizer is selected as polybutene oil.

[0024] Furthermore, the selected tackifier at least includes rosin resin, terpene resin, and aromatic petroleum resin, and the ratio of rosin resin, terpene resin, and aromatic petroleum resin is 3:1:1.

[0025] Furthermore, the filler is selected as calcium carbonate and silica, and the mass ratio of calcium carbonate to silica is 2:1.

[0026] Furthermore, the chain transfer agent is selected as N - phenyl - β - naphthylamine;

[0027] The hindered phenol antioxidant is selected as 2,6 - di - tert - butyl - p - cresol.

[0028] Furthermore, N - tetraphenylmethaneamine is selected to replace N - phenyl - β - naphthylamine as the chain transfer agent.

[0029] Furthermore, the raw materials selected in the hot - melt pressure - sensitive adhesive and their mass parts are 240 parts of synthetic rubber, 240 parts of natural rubber, 120 parts of polybutene oil, 36 parts of rosin resin, 12 parts of terpene resin, 12 parts of aromatic petroleum resin, 12 parts of PS resin, 18 parts of calcium carbonate, 9 parts of silica, 6 parts of N - tetraphenylmethaneamine, and 5 parts of 2,6 - di - tert - butyl - p - cresol.

[0030] Further, measured at a temperature of 180 °C, the viscosity value of this hot-melt pressure-sensitive adhesive is 45,000 - 75,000 mPa·s.

[0031] Further, the melting point of this hot-melt pressure-sensitive adhesive when used for magnesite boards is 70 - 84 °C.

[0032] 3. Beneficial effects

[0033] Compared with the prior art, the advantages of the present invention are as follows:

[0034] In this solution, when bonding two magnesite boards, this hot-melt adhesive is used for the bonding operation between the two magnesite boards. In this hot-melt adhesive, the base material is used to ensure sufficient cohesion and strength during the bonding process, the plasticizer is used to lower the glass transition temperature and melting temperature, improve brittleness, and enhance the melting fluidity. The tackifier is used to continue to twist the surface diffusion or internal diffusion to generate high adhesiveness under certain conditions. The filler is used to change the properties of the hot-melt pressure-sensitive adhesive and reduce the manufacturing cost. The antioxidant can prevent or inhibit the oxidation process to ensure that the hot-melt pressure-sensitive adhesive will not fail during long-term storage. In summary, this hot-melt adhesive can flow evenly between the two magnesite boards during the bonding process, ensuring the bonding uniformity, firmness, and flatness of the magnesite boards. At the same time, due to the relatively low melting point of this hot-melt adhesive, local hardening is not likely to occur during uniform bonding, thereby ensuring uniform curing of the hot-melt adhesive and guaranteeing the stability of the finally bonded magnesite boards. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0036] Example 1:

[0037] A hot-melt pressure-sensitive adhesive for bonding magnesite boards, the raw material components of this hot-melt pressure-sensitive adhesive include a base material, a plasticizer, a tackifier, a filler, and an antioxidant. The ratio of each component by mass is as follows:

[0038] Base material 450 - 600 parts

[0039] Plasticizer 120 - 150 parts

[0040] Tackifier 65 - 80 parts

[0041] Filler 25 - 40 parts

[0042] Antioxidant 10 - 15 parts

[0043] Among them, the base material is selected from one or more of synthetic rubber and natural rubber;

[0044] The plasticizer is selected from one or more of mineral oil and polybutene oil;

[0045] The tackifier is selected from one or more of rosin resin, terpene resin, C5 petroleum resin, coumarone resin, aromatic petroleum resin, and PS resin;

[0046] The filler is selected from one or more of calcium carbonate, clay, silica, and talc powder;

[0047] The antioxidant is selected from chain transfer agents and hindered phenols.

[0048] The base material ensures that sufficient cohesion and strength can be provided during the bonding process. The plasticizer can lower the glass transition temperature and melting temperature, improve brittleness, and enhance the melt fluidity. The tackifier has a wetting effect on the adherend and can generate high adhesiveness under certain conditions through surface diffusion or internal diffusion. The filler is a solid material that does not chemically react with the main material but can change the properties of the hot melt pressure-sensitive adhesive and reduce the manufacturing cost. The antioxidant can prevent or inhibit the oxidation process and ensure that the hot melt pressure-sensitive adhesive does not fail during long-term storage.

[0049] These components work together, enabling the hot melt pressure-sensitive adhesive to exhibit good adhesive performance and aging resistance in the bonding of magnesite boards.

[0050] Example 2:

[0051] Based on the above Example 1, a further description is made.

[0052] Specifically, the ratio of synthetic rubber to natural rubber in the base material is 1:1;

[0053] The synthetic rubber is synthesized by using styrene-butadiene-styrene rubber and styrene-ethylene-butadiene-styrene rubber; this synthetic rubber has good rheological properties and toughness.

[0054] Natural rubber is a natural polymer compound mainly composed of cis-1,4-polyisoprene. 91% - 94% of the natural rubber component is rubber hydrocarbon, and the rest are non-rubber substances such as proteins, fatty acids, ash, and sugars.

[0055] The preparation of the base material needs to have good fluidity and an appropriate molecular weight distribution to ensure that sufficient cohesion and strength can be provided during the bonding process.

[0056] Specifically, the plasticizer is selected as polybutene oil.

[0057] Polybutene oil can reduce the hardness and melt viscosity of the adhesive, thereby improving its low-temperature resistance.

[0058] Specifically, the tackifier selected includes at least rosin ester, terpene resin and aromatic petroleum resin, and the ratio of rosin ester, terpene resin and aromatic petroleum resin is 3:1:1.

[0059] Rosin ester can endow the pressure-sensitive adhesive with necessary tackiness. Terpene resin can also improve the tackiness of the pressure-sensitive adhesive. C5 petroleum resin has good compatibility and the properties of depressing pour point, increasing tackiness and improving viscosity. Coumarone resin can improve the cohesion and adhesion properties of the pressure-sensitive adhesive. Aromatic petroleum resin can enhance the adhesion of the pressure-sensitive adhesive. When selecting, the type of tackifier can be chosen according to needs.

[0060] Among them, the necessary selection of rosin ester, terpene resin and aromatic petroleum resin can effectively ensure the tackiness of the hot-melt pressure-sensitive adhesive.

[0061] Specifically, calcium carbonate and silica are selected as the fillers, and the mass fraction ratio of calcium carbonate and silica is 2:1.

[0062] Calcium carbonate can increase the hardness, wear resistance and heat resistance of the adhesive, and at the same time reduce the cost. Silica can improve the heat resistance and mechanical strength of the adhesive. These fillers play roles such as enhancing, thickening and reducing the cost in the hot-melt pressure-sensitive adhesive.

[0063] Specifically, N-phenyl-β-naphthylamine is selected as the chain transfer agent;

[0064] The sterically hindered phenolic antioxidant is 2,6-di-tert-butyl-p-cresol.

[0065] The chain transfer agent inhibits the oxidation reaction by giving out active hydrogen atoms and forming stable free radicals by itself. The sterically hindered phenolic antioxidant makes the free radicals generated after chain transfer stable by introducing one or two larger tert-butyl groups at the ortho position of the phenolic hydroxyl group and using the steric hindrance effect and higher conjugated system.

[0066] Specifically, N-tetraphenylmethaneamine is selected to replace N-phenyl-β-naphthylamine as the chain transfer agent.

[0067] As a substitute, N-tetraphenylmethaneamine has low toxicity, low pollution, good heat resistance and antioxidant properties, and is safer to use.

[0068] Example 3:

[0069] Based on the above Example 1 and Example 2, a further description is made.

[0070] Specifically, the raw materials selected in the hot melt pressure-sensitive adhesive and their parts by mass are 240 parts of synthetic rubber, 240 parts of natural rubber, 120 parts of polybutene oil, 36 parts of rosin ester, 12 parts of terpene resin, 12 parts of aromatic petroleum resin, 12 parts of PS resin, 18 parts of calcium carbonate, 9 parts of silicon dioxide, 6 parts of N-tetraphenylmethane, and 5 parts of 2,6-di-tert-butyl-p-cresol.

[0071] Specifically, measured in a temperature environment of 180°C, the viscosity value of this hot melt pressure-sensitive adhesive is 45,000 - 75,000 mPa·s.

[0072] Specifically, the melting point of this hot melt pressure-sensitive adhesive when used for magnesite board is 70 - 84°C.

[0073] The hot melt pressure-sensitive adhesive with this formulation has good adhesiveness. When this hot melt pressure-sensitive adhesive is used for bonding magnesite board, it is heated and melted in one direction. After the bonding of the magnesite board is completed, it has high stability.

[0074] The above is only the preferred specific implementation manner of the present invention; however, the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its improved concept, makes equivalent substitutions or changes, and all should be covered by the protection scope of the present invention.

Claims

1. A hot melt pressure sensitive adhesive for bonding glass magnesium plates, characterized in that: The raw materials of this hot melt pressure sensitive adhesive include base material, plasticizer, tackifier, filler and antioxidant, and the proportions of each component by mass are as follows: 450~600 parts of base material Plasticizer 120-150 parts Thickener 65-80 parts Filler 25-40 parts 10-15 parts of antioxidant The base material is selected from one or more of synthetic rubber and natural rubber; The plasticizer is selected from one or more of mineral oil and polybutene oil; The tackifier is selected from one or more of rosin resin, terpene resin, C5 petroleum resin, coumarone resin, aromatic petroleum resin, PS resin; The filler is selected from one or more of calcium carbonate, clay, silicon dioxide, and talcum powder; Antioxidants include chain transfer agents and hindered phenols.

2. The hot melt pressure sensitive adhesive for bonding glass magnesium plates according to claim 1, characterized in that: The ratio of synthetic rubber to natural rubber in the base material is 1:1; The synthetic rubber is synthesized from styrene-butadiene-styrene rubber and styrene-ethylene-butadiene-styrene rubber; Natural rubber is a natural polymer compound with cis-1,4-polyisoprene as the main component.

3. The hot melt pressure sensitive adhesive for bonding glass magnesium plates according to claim 1, characterized in that: Polybutene oil is used as plasticizer.

4. The hot melt pressure sensitive adhesive for bonding glass magnesium plates according to claim 1, characterized in that: The tackifier selected includes at least rosin resin, terpene resin and aromatic petroleum resin, and the ratio of rosin resin, terpene resin and aromatic petroleum resin is 3:1:

1.

5. The hot melt pressure sensitive adhesive for bonding glass magnesium plates according to claim 1, characterized in that: Calcium carbonate and silicon dioxide are selected as fillers, and the mass ratio of calcium carbonate to silicon dioxide is 2:

1.

6. The hot melt pressure sensitive adhesive for bonding glass magnesium plates according to claim 1, characterized in that: The chain transfer agent is N-phenyl-β-naphthylamine; The hindered phenol antioxidant is 2,6-di-tert-butyl-p-cresol.

7. The hot melt pressure sensitive adhesive for bonding glass magnesium plates according to claim 6, characterized in that: N-tetraphenylaminomethane was used as the chain transfer agent instead of N-phenyl-β-naphthylamine.

8. The hot melt pressure sensitive adhesive for bonding glass magnesium plates according to claim 1, characterized in that: The raw materials selected in the hot-melt pressure-sensitive adhesive and their mass proportions are 240 parts of synthetic rubber, 240 parts of natural rubber, 120 parts of polybutene oil, 36 parts of rosin resin, 12 parts of terpene resin, 12 parts of aromatic petroleum resin, 12 parts of PS resin, 18 parts of calcium carbonate, 9 parts of silicon dioxide, 6 parts of N-tetraphenylaminomethane, and 5 parts of 2,6-di-tert-butyl-p-cresol.

9. The hot melt pressure sensitive adhesive for bonding glass magnesium plates according to claim 1, characterized in that: Measured at a temperature of 180°C, the viscosity of the hot melt pressure sensitive adhesive is 45000-75000 mPa·s.

10. The hot melt pressure sensitive adhesive for bonding glass magnesium boards according to claim 1, characterized in that: The melting point of this hot melt pressure sensitive adhesive when used for glass magnesium board is 70-84°C.