Processing method of diamond powder

Abstract

The processing method of the diamond powder comprises the following steps: cleaning the diamond powder; carrying out surface sensitization treatment and activation treatment on the diamond powder; the diamond powder is subjected to chemical electroplating, and a nickel layer is plated on the surface of the diamond powder; wherein electroplating liquid in chemical electroplating comprises nickel sulfate, sodium hypophosphite, sodium tartrate, ammonium chloride and ammonium bifluoride. According to the method, damaged diamond powder can be repaired, burrs on the surface of the diamond powder are passivated, scratches are repaired, and therefore the use efficiency of the diamond powder is improved, and the service life of the diamond powder is prolonged.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, and particularly to a processing method for diamond powder. Background Art

[0002] Currently, semiconductor materials are very hard and difficult to process. Especially in the grinding process, the processing quality directly affects the next process. Diamond powder has characteristics such as high hardness and corrosion resistance, and has become the preferred raw material for grinding electronic products. However, during the processing, the crystallization of diamond is poor, the particle size is uneven. More seriously, the damaged diamond particles will cause scratches on the semiconductor surface, making the grinding effect unsatisfactory. Due to the very small particles, it is difficult to screen the damaged diamonds, which will also cause unnecessary waste.

[0003] Therefore, it is necessary to provide a processing method for diamond powder to overcome the above defects. Summary of the Invention

[0004] The purpose of the present invention is to provide an improved processing method for diamond powder, which can repair the damaged diamond powder, make the burrs on its surface passivated, and repair the scratches, thereby improving the use efficiency of diamond powder and extending its service life.

[0005] To achieve the above purpose, the processing method for diamond powder of the present invention includes the following steps:

[0006] Clean the diamond powder;

[0007] Perform surface sensitization treatment and activation treatment on the diamond powder; and

[0008] Perform chemical electroplating on the diamond powder to deposit a nickel layer on the surface of the diamond powder;

[0009] Among them, the electroplating solution in chemical electroplating includes nickel sulfate, sodium hypophosphite, sodium tartrate, ammonium chloride, ammonium bifluoride.

[0010] Compared with the prior art, in the method of the present invention, first, the diamond powder is cleaned to remove the organic substances doped therein, then the diamond powder is subjected to sensitization treatment and activation treatment, so as to facilitate the subsequent chemical electroplating treatment. Finally, the diamond powder is subjected to chemical electroplating with a specific electroplating solution to form a nickel layer on its surface, thereby repairing the scratches, burrs, etc. on the surface of the damaged diamond powder, so that the diamond powder can be put into use again, improving its efficiency and extending its service life.

[0011] As an embodiment, a sensitization solution is used for the sensitization treatment, and the sensitization solution includes stannous chloride and hydrochloric acid.

[0012] As an example, the concentration of stannous chloride in the sensitizing solution is 10-20 g / L, and the concentration of hydrochloric acid is 20-30 ml / L.

[0013] Preferably, the sensitization treatment is carried out at room temperature for 5-10 minutes.

[0014] Preferably, an activation solution is used for the activation treatment, and the activation solution includes palladium chloride, potassium sodium tartrate, and hydrochloric acid.

[0015] Preferably, in the activation solution, the concentration of palladium chloride is 0.1-0.3 g / L, the concentration of potassium sodium tartrate is 2-4 g / L, and the concentration of hydrochloric acid is 0.2-0.8 ml / L.

[0016] Preferably, in the electroplating solution, the concentration of nickel sulfate is 20-30 g / L, the concentration of sodium hypophosphite is 20-30 g / L, the concentration of sodium tartrate is 15-25 g / L, the concentration of ammonium chloride is 25-35 g / L, and the concentration of ammonium bifluoride is 6-10 g / L.

[0017] Preferably, the electroplating solution further includes sodium dodecyl sulfate and saccharin.

[0018] Preferably, the temperature of the electroplating solution is 50-70 °C.

[0019] Preferably, the time of the electroless plating is 20-30 minutes. Detailed implementation manners

[0020] To make the above objects, features, and advantages of the present application more obvious and understandable, the following describes the detailed implementation manners of the present application in combination with some examples. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific examples disclosed below.

[0021] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0022] In this application, unless otherwise clearly stipulated and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0023] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0024] The following further illustrates the processing method of the diamond powder of the present invention in conjunction with embodiments, but does not limit the present invention thereby. The method of the present invention aims to provide a processing method of diamond powder, which can repair damaged diamond powder, make the burrs on its surface passivated, repair scratches, thereby improving the use efficiency of diamond powder and extending its service life.

[0025] In an embodiment of the processing method of the diamond powder of the present invention, the following steps are included:

[0026] Clean the diamond powder;

[0027] Perform surface sensitization treatment and activation treatment on the diamond powder; and

[0028] Perform chemical electroplating on the diamond powder to deposit a nickel layer on the surface of the diamond powder;

[0029] Among them, the electroplating solution in chemical electroplating includes nickel sulfate, sodium hypophosphite, sodium tartrate, ammonium chloride, ammonium bifluoride.

[0030] In the method of the present invention, first, the diamond powder is cleaned to remove the organic substances doped therein, then the diamond powder is subjected to sensitization treatment and activation treatment, so as to facilitate subsequent chemical electroplating treatment. Finally, the diamond powder is subjected to chemical electroplating with a specific electroplating solution to form a nickel layer on its surface, thereby repairing scratches, burrs, etc. on the surface of the damaged diamond powder, so that the diamond powder can be put back into use, improving its efficiency and extending its service life.

[0031] Specifically, first, the diamond powder can be cleaned with an organic solvent to remove the organic substances doped therein.

[0032] Next, the diamond powder is subjected to sensitization treatment. Specifically, a sensitization solution is prepared. The sensitization solution is prepared with stannous chloride at a concentration of 10 - 20 g / L and hydrochloric acid at a concentration of 20 - 30 ml / L. The diamond powder is stirred evenly in the sensitization solution for 5 - 10 minutes at room temperature. After filtration and washing with water, activation treatment is carried out. Specifically, an activation solution containing palladium chloride, potassium sodium tartrate, and hydrochloric acid is prepared. Specifically, as an example, by mass concentration, the activation solution includes palladium chloride 0.1 - 0.3 g / L, potassium sodium tartrate 2 - 4 g / L, and hydrochloric acid 0.2 - 0.8 ml / L. Specifically, the activation treatment is carried out at room temperature for 5 - 10 minutes. The diamond powder after sensitization treatment and activation treatment is beneficial for subsequent electroless plating treatment.

[0033] Next, alkaline electroless plating is carried out on the diamond powder to form a nickel layer on its surface. Specifically, an electroplating solution including nickel sulfate, sodium hypophosphite, sodium tartrate, ammonium chloride, and ammonium bifluoride is prepared. In one embodiment, by mass concentration, the electroplating solution includes nickel sulfate 20 - 30 g / L, sodium hypophosphite 20 - 30 g / L, sodium tartrate 15 - 25 g / L, ammonium chloride 25 - 35 g / L, and ammonium bifluoride 6 - 10 g / L. As a preferred embodiment, the electroplating solution further includes additive sodium dodecyl sulfate 0.05 - 0.15 g / L and saccharin 0.5 - 2 g / L. Preferably, the pH value of the electroplating solution is 8.5 - 9.5. Specifically, the current density is controlled to be 0.042 - 0.05 A / cm 2 , and the stirring rate of the diamond powder in the electroplating solution is 2000 - 2500 rpm. The temperature of the electroplating solution is controlled at 50 - 70 °C to make the electroplating effect better. The electroplating time is 20 - 30 minutes to fully coat the surface of the diamond powder with nickel to passivate the scratches, burrs, etc. on its surface.

[0034] In summary, in the method of the present invention, first, the diamond powder is cleaned to remove the organic substances doped therein, then the diamond powder is subjected to sensitization treatment and activation treatment, thus facilitating subsequent electroless plating treatment. Finally, specific electroplating solution is used to carry out electroless plating on the diamond powder to form a nickel layer on its surface, thereby repairing the scratches, burrs, etc. on the surface of the damaged diamond powder, so that the diamond powder can be put into use again, improving its efficiency and extending its service life.

[0035] The above-disclosed are only the preferred embodiments of the present invention. Of course, the scope of the rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.

Claims

1. A processing method for diamond powder, characterized in that, it comprises the following steps: Clean the diamond powder; Perform surface sensitization treatment and activation treatment on the diamond powder; and Perform chemical electroplating on the diamond powder to deposit a nickel layer on the surface of the diamond powder; wherein, the electroplating solution in the chemical electroplating comprises nickel sulfate, sodium hypophosphite, sodium tartrate, ammonium chloride, and ammonium bifluoride.

2. The processing method for diamond powder according to claim 1, characterized in that, the sensitization treatment is performed using a sensitization solution, and the sensitization solution comprises stannous chloride and hydrochloric acid.

3. The processing method for diamond powder according to claim 2, characterized in that, in the sensitization solution, the concentration of stannous chloride is 10 - 20 g / L, and the concentration of hydrochloric acid is 20 - 30 ml / L.

4. The processing method for diamond powder according to claim 1, characterized in that, the sensitization treatment is carried out at room temperature for 5 - 10 minutes.

5. The processing method for diamond powder according to claim 1, characterized in that, the activation treatment is performed using an activation solution, and the activation solution comprises palladium chloride, potassium tartrate, and hydrochloric acid.

6. The processing method for diamond powder according to claim 5, characterized in that, in the activation solution, the concentration of palladium chloride is 0.1 - 0.3 g / L, the concentration of potassium tartrate is 2 - 4 g / L, and the concentration of hydrochloric acid is 0.2 - 0.8 ml / L.

7. The processing method for diamond powder according to claim 1, characterized in that, in the electroplating solution, the concentration of nickel sulfate is 20 - 30 g / L, the concentration of sodium hypophosphite is 20 - 30 g / L, the concentration of sodium tartrate is 15 - 25 g / L, the concentration of ammonium chloride is 25 - 35 g / L, and the concentration of ammonium bifluoride is 6 - 10 g / L.

8. The processing method for diamond powder according to claim 1, characterized in that, the electroplating solution further comprises sodium dodecyl sulfate and saccharin.

9. The processing method for diamond powder according to claim 1, characterized in that, the temperature of the electroplating solution is 50 - 70 °C.

10. The processing method for diamond powder according to claim 1, characterized in that, the time of the chemical electroplating is 20 - 30 minutes.