Photoelectric detection sensor device

By designing an electrostatic processing mechanism in the photoelectric sensor device, including an electrostatic release plate and a lateral release plate, combined with mechanical movement, the signal instability problem caused by the impact of static electricity in the prior art is solved, and higher signal stability and sensor performance are achieved.

CN120063339AInactive Publication Date: 2025-05-30GUANGDONG HONGSIMAI TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202510227507.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-27
Publication Date
2025-05-30
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing photoelectric sensor devices are susceptible to static electricity during use, resulting in signal instability and breakdown of sensitive components. The existing single-point grounding method cannot completely solve the static electricity problem.

Method used

A photoelectric detection sensor device including a housing and an electrostatic treatment mechanism is designed. By providing a through hole and a conduit at the bottom of the housing, a built-in electrostatic release plate and a transverse release plate, combined with the mechanical movement of the elastic clamp and the rocker, multi-point grounding and automatic cleaning of static electricity are achieved.

Benefits of technology

It effectively reduces static interference, improves signal stability and overall performance of the sensor, and ensures the accuracy and reliability of infrared detection.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120063339A_ABST
    Figure CN120063339A_ABST
Patent Text Reader

Abstract

The invention relates to the technical field of sensors, in particular to a photoelectric detection sensor device which comprises a shell and an electrostatic processing mechanism, a through hole is formed in the bottom of the shell, a vertically upward guide pipe is arranged on the inner side of the through hole, and the electrostatic processing mechanism comprises an electrostatic discharge plate arranged in the guide pipe. The top end of the electrostatic discharge plate enters the shell along the guide pipe, the bottom end of the electrostatic discharge plate extends out of the bottom of the shell along the guide pipe to be provided with a horizontal bending part, the horizontal bending part is grounded, an elastic clamping plate is arranged on the upper side in the shell, and the outer circle face of a metal plate is discharged to the electrostatic discharge plate. And the static electricity can be released to the ground through the static electricity release plate, and the two static electricity release ways can reduce electromagnetic interference in the use process of the sensor, so that the stability of a detection signal is further improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and particularly to a photoelectric detection sensor device. Background Art

[0002] The photoelectric sensor detection device is composed of components such as a housing, a photodiode, an integrated module, a phototransistor, and spectral response. The phototransistor has an internal amplification function to amplify the photoelectric signal emitted by the photodiode and improve the signal accuracy. According to the detection distance and the intensity of the ambient light, the grades and requirements for the above components are also different. The infrared rays emitted by the diode generate reflected light after detecting the target object, and the reflected light is used as the feedback signal after detection to make the device execute actions.

[0003] During the use of the photoelectric sensor, it is affected by static electricity, and the dust generated on the surface of the circuit board where the module is located provides conditions for the formation of static electricity, resulting in a decline in the performance of the photoelectric sensor. For example, it may cause signal instability or breakdown of various sensitive components (diodes), etc. Therefore, how to effectively eliminate static electricity is an important index for the performance of the current photoelectric sensor. The existing treatment method is the single-point grounding method, that is, a ground wire is set on the housing of the sensor. This static electricity treatment method cannot ensure that all internal components are completely grounded, nor can it ensure that the input current or output signal line is completely grounded, and it needs to be improved. Summary of the Invention

[0004] To solve the above problems, the present invention provides a photoelectric detection sensor device, including a housing and an electrostatic treatment mechanism. A through hole is opened at the bottom of the housing, and a vertical upward conduit is provided inside the through hole. The electrostatic treatment mechanism includes an electrostatic release plate disposed in the conduit. The top end of the electrostatic release plate enters the housing along the conduit, and the bottom end of the electrostatic release plate extends out of the bottom of the housing along the conduit and is provided with a horizontal bending portion, and the horizontal bending portion is grounded. An elastic clamping plate is provided on the upper side inside the housing, and a circuit board is mounted on the elastic clamping plate. Each component constituting the photoelectric detection sensor device is mounted on the circuit board. The top end of the electrostatic release plate contacts the circuit board to release the static electricity on the circuit board. The electrostatic treatment mechanism further includes a transverse release plate disposed on the electrostatic release plate. The transverse release plate is a metal plate, and the back surface of the transverse release plate contacts the front surface of the electrostatic release plate. An inclined surface is provided at the bottom end of the housing, and a contact surface is provided at the top end of the transverse release plate. The contact surface is inclined and contacts the inclined surface to release the static electricity of the housing. The electrostatic treatment mechanism further includes a metal shaft disposed on the housing and a metal plate mounted on the metal shaft. The electrostatic treatment mechanism further includes a rocker connected to the bottom end of the circuit board. The rocker is provided with an opening, and the two sides of the metal plate are in large-area contact with the two surfaces of the opening, and the end surface of the metal plate contacts the electrostatic release plate. Through the metal plate assisting the electrostatic release plate and the transverse release plate, the static electricity on the housing and the circuit board is further released.

[0005] As a further preference, an installation hole is opened on the horizontal bending portion, and the horizontal bending portion is grounded through the installation hole.

[0006] As a further preference, a warping portion extending toward the side portion of the metal plate is provided at the bottom end of the rocker. A contact port is opened on the rocker. The top end of the electrostatic release plate enters the housing through the contact port. The right surface of the electrostatic release plate contacts the right side of the contact port, and a deflection gap is left between the left surface of the electrostatic release plate and the left side of the contact port. An elastic trigger piece is provided on the metal plate. When the metal plate rotates, the elastic trigger piece is brought into frequent contact with the warping portion, and the rocker drives the circuit board to vibrate left and right.

[0007] As a further preference, there are two groups of elastic clamping plates, front and back. Each group of elastic clamping plates is composed of a first elastic plate on the left side and a second elastic plate on the right side. The circuit board is fixed and clamped between the first elastic plate and the second elastic plate, and a space is left between the periphery of the circuit board and the inner wall of the housing.

[0008] As a further preference, both ends in the length direction of the transverse release plate reach both sides of the housing. Hanging holes are provided at both ends in the length direction of the transverse release plate. The signal line and the power line are connected upward from the side of the static electricity release plate in the housing, and the bottom ends of the signal line and the power line can be respectively inserted into the hanging holes.

[0009] As a further preference, a sliding seat is provided on the back surface of the transverse release plate. A sliding groove is provided in the height direction of the static electricity release plate. The sliding seat is a rubber seat. The sliding seat uses the rubber property to damp and slide in the sliding groove. When the housing and the components in the housing descend, the transverse release plate is pushed by the bottom end of the housing, and the sliding seat is driven by the transverse release plate to descend along the sliding groove.

[0010] As a further preference, a metal limiting plate is connected to the back surface of the sliding seat, and the metal limiting plate contacts the back surface of the static electricity release plate.

[0011] As a further preference, a connecting column is provided in the housing. The connecting column is away from the circuit board. A partition plate is provided in the housing. The partition plate divides the connecting column and the circuit board left and right. The partition plate is a plastic plate.

[0012] The beneficial effects of the present invention compared with the prior art are as follows:

[0013] The optoelectronic sensor of this structure has an anti-static function, which ensures the stability of infrared rays during optoelectronic sensing.

[0014] First of all, the anti-static principle is reflected in the component structure, and the specific manifestations are as follows: If static electricity is generated after the components on the circuit board are powered on, the static electricity will be released from the circuit board to the rocker plate, released from the rocker plate to the static electricity release plate, and released to the ground through the static electricity release plate. The static electricity released to the housing is released from the two inner surfaces of the opening to the front and back surfaces of the metal plate, and released from the outer circular surface of the metal plate to the static electricity release plate, and can also be released to the ground through the static electricity release plate. The two static electricity release paths enable the sensor to reduce electromagnetic interference during use, and further improve the stability of the detection signal.

[0015] Secondly, the anti-static principle is also reflected in mechanical movement. Before the device is turned on, press it towards the top of the housing to make it descend. The first elastic plate and the second elastic plate descend. The circuit board descends with the first elastic plate and the second elastic plate on the right side. The components and the rocker on it descend with the circuit board. The housing also drives the metal shaft, and the metal shaft drives the metal plate to descend. At this time, the metal plate rolls along the surface of the static electricity release plate, drives the elastic trigger piece to rotate, uses the elastic trigger piece to touch the rocker, makes the rocker vibrate, the vibration effect is transmitted to the circuit board, and then transmitted to each component by the circuit board, so that dust or metal particles fall off automatically. Static electricity will not be generated on the circuit board due to dust, and the stability performance is further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the overall structure of an optoelectronic detection sensor device provided by an embodiment of the present invention;

[0017] Figure 2 Schematic diagram of the bottom view perspective of an optoelectronic detection sensor device provided by an embodiment of the present invention;

[0018] Figure 3 Schematic diagram of an optoelectronic detection sensor device disassembled provided by an embodiment of the present invention;

[0019] Figure 4 Schematic diagram of an optoelectronic detection sensor device provided by an embodiment of the present invention from Figure 3 Another perspective view;

[0020] Figure 5 Schematic diagram of an optoelectronic detection sensor device with the front and back parts of the housing opened provided by an embodiment of the present invention;

[0021] Figure 6 Schematic diagram of an optoelectronic detection sensor device provided by an embodiment of the present invention from Figure 5 Enlarged view of part A;

[0022] Figure 7 Schematic diagram of an optoelectronic detection sensor device provided by an embodiment of the present invention from Figure 5 Enlarged view of part B;

[0023] Figure 8 Schematic diagram of the triggering structure between the metal plate and the rocker in an optoelectronic detection sensor device provided by an embodiment of the present invention.

[0024] In the figure: 1. Outer shell; 2. Through hole; 3. Duct; 4. Electrostatic discharge plate; 5. Horizontal bending part; 6. Elastic clamping plate; 61. First elastic plate; 62. Second elastic plate; 7. Circuit board; 8. Transverse release plate; 9. Inclined plane; 10. Contact surface; 11. Metal shaft; 12. Metal plate; 13. Opening; 14. Mounting hole; 15. Rocker; 16. Warping part; 17. Contact port; 18. Deflection gap; 19. Hanging hole; 20. Slide seat; 21. Slide groove; 22. Metal limiting plate; 23. Connecting column; 24. Partition plate; 25. Elastic trigger piece. Detailed implementation manners

[0025] The above and other implementation manners and advantages of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described implementation manners are only part of the implementation manners of the present invention, rather than all of them.

[0026] In one implementation manner, as Figures 1-8 shown:

[0027] This embodiment provides a photoelectric detection sensor device, which includes a housing 1 and an electrostatic treatment mechanism. A through hole 2 is opened at the bottom of the housing 1, and a vertical upward conduit 3 is provided inside the through hole 2. The electrostatic treatment mechanism includes an electrostatic release plate 4 disposed in the conduit 3. The top end of the electrostatic release plate 4 enters the housing 1 along the conduit 3, and the bottom end of the electrostatic release plate 4 extends out of the bottom of the housing 1 along the conduit 3 and is provided with a horizontal bending portion 5, and the horizontal bending portion 5 is grounded. An elastic clamping plate 6 is provided on the upper side inside the housing 1, and a circuit board 7 is mounted on the elastic clamping plate 6. Each component constituting the photoelectric detection sensor device is mounted on the circuit board 7. The top end of the electrostatic release plate 4 contacts the circuit board 7 to release the static electricity on the circuit board 7. The electrostatic treatment mechanism further includes a lateral release plate 8 disposed on the electrostatic release plate 4. The lateral release plate 8 is a metal plate, and the back surface of the lateral release plate 8 contacts the front surface of the electrostatic release plate 4. An inclined surface 9 is provided at the bottom end of the housing 1, and a contact surface 10 is provided at the top end of the lateral release plate 8. The contact surface 10 is inclined and contacts the inclined surface 9 to release the static electricity of the housing 1. The electrostatic treatment mechanism further includes a metal shaft 11 disposed on the housing 1 and a metal plate 12 mounted on the metal shaft 11. The electrostatic treatment mechanism further includes a rocker 15 connected to the bottom end of the circuit board 7. The rocker 15 is provided with an opening 13. The two sides of the metal plate 12 are in large-area contact with the two surfaces of the opening 13, and the end surface of the metal plate 12 contacts the electrostatic release plate 4. With the assistance of the metal plate 12 to the electrostatic release plate 4 and the lateral release plate 8, the static electricity on the housing 1 and the circuit board 7 is further released. An installation hole 14 is opened on the horizontal bending portion 5, and the horizontal bending portion 5 is grounded through the installation hole 14. Supported by the electrostatic release plate 4, the sensor device is positioned within the test range. The electrostatic release plate 4 also serves as a connection structure when the photoelectric detection sensor is used on the device, and the static electricity generated during its operation is released by using the electrostatic release plate 4. The lateral release plate 8 assists the electrostatic release plate 4 to change the single-point grounding method to a large-area grounding method, improving the static electricity release efficiency.

[0028] The bottom end of the rocker 15 is provided with a warping part 16 extending towards the side of the metal plate 12. A contact port 17 is formed on the rocker 15. The top end of the static electricity release plate 4 enters the housing 1 through the contact port 17. The right side of the static electricity release plate 4 contacts the right side of the contact port 17, and a deflection gap 18 is left between the left side of the static electricity release plate 4 and the left side of the contact port 17. An elastic trigger piece 25 is arranged on the metal plate 12. When the metal plate 12 rotates, the elastic trigger piece 25 is brought into frequent contact with the warping part 16, and the rocker 15 drives the circuit board 7 to vibrate left and right. The deflection gap 18 is the vibration space when the rocker 15 vibrates left and right. The rocker 15 transmits the vibration effect to the circuit board 7, enabling the dust on the circuit board 7 to fall downward by vibration. According to the usage characteristics of the circuit board 7, it can be known that the dust on the circuit board will accumulate static electricity. When the static electricity accumulates to a certain extent, it will cause damage to electronic components or other failures. Therefore, before the sensor is powered on, the circuit board 7 is cleaned in advance through the above principle, ensuring the stability of the sensor.

[0029] As Figure 4 shown, there are two sets of elastic clamping plates 6 in the front and back directions. Each set of elastic clamping plates 6 is composed of a first elastic plate 61 on the left side and a second elastic plate 62 on the right side. The circuit board 7 is fixed and clamped between the first elastic plate 61 and the second elastic plate 62, and a space is left between the periphery of the circuit board 7 and the inner wall of the housing 1. After the circuit board 7 is clamped by the first elastic plate 61 and the second elastic plate 62, it is fixed by industrial glue, enabling the circuit board 7 to form the condition of vibrating left and right in the housing 1. When the elastic trigger piece 25 rotates to contact the warping part 16, the rocker 15 can drive the circuit board 7 to vibrate left and right.

[0030] The two ends in the length direction of the horizontal release plate 8 reach both sides of the housing 1. Hanging holes 19 are formed at the two ends in the length direction of the horizontal release plate 8. The signal line and the power line are connected upward beside the static electricity release plate 4 in the housing 1, and the bottom ends of the signal line and the power line can be respectively inserted into the hanging holes 19. The horizontal release plate 8 is always in contact with the inclined surface 9 at the bottom end of the housing 1 by the contact surface 10, and the back surface of the horizontal release plate 8 is also in large-area contact with the static electricity release plate 4, enabling the static electricity on the housing 1 to be quickly released to the static electricity release plate 4. During wiring use, the signal line is inserted into one hanging hole 19, and the power line is inserted into one hanging hole 19. The static electricity generated by the signal line and the power line is released to the horizontal release plate 8 and finally released to the static electricity release plate 4 through the horizontal release plate 8.

[0031] The anti-static principle is embodied in the component structure in this invention, and the specific manifestations are as follows: When the components (photosensitive components, photodiodes, integrated modules, etc.) on the circuit board 7 are powered on and generate static electricity, the static electricity will be released to the rocker 15 through the circuit board 7, released to the static electricity release board 4 through the rocker 15, and released to the ground through the static electricity release board 4. The static electricity released to the outer shell 1 is released from the two inner surfaces of the opening 13 to the front and back surfaces of the metal plate 12, and released to the static electricity release board 4 from the outer circular surface of the metal plate 12, and can also be released to the ground through the static electricity release board 4. The above two static electricity release paths can reduce electromagnetic interference during the use of the sensor and further improve the stability of the detection signal.

[0032] The anti-static principle is also embodied in the movement of components in this invention. During the sensing operation, dust, metal particles, etc. will inevitably form on the components on the circuit board 7, which will also increase the static electricity phenomenon formed on each component and the pin welding positions. The circuit board 7 and each component are placed in the outer shell 1 and are stationary, resulting in inconvenient cleaning. This invention can complete automatic cleaning through the movement relationship between the components in the above-mentioned static electricity treatment mechanism, and the specific manifestations are as follows: Before the device served by the sensor is powered on, press the top of the outer shell 1, so that the outer shell 1 descends. The outer shell 1 drives the first elastic plate 61 and the second elastic plate 62 on the right side to descend. The first elastic plate 61 and the second elastic plate 62 on the right side drive the circuit board 7 to descend. The circuit board 7 drives the components and the rocker 15 above it to descend. The outer shell 1 also drives the metal shaft 11, and the metal shaft 11 drives the metal plate 12 to descend. At this time, the metal plate 12 rolls along the surface of the static electricity release board 4, and the metal plate 12 drives the elastic trigger piece 25 to rotate. The elastic trigger piece 25 is used to touch the rocker 15, so that the rocker 15 generates vibration. The vibration effect is transmitted to the circuit board 7 and then to each component, so that the dust or metal particles fall off automatically. As Figure 3 shown, a round hole is opened at the bottom end of the outer shell 1. In addition to introducing signal lines and power lines, the round hole can also be used as an exhaust hole for dust and / or metal particles. This mechanical cleaning method only requires manual pressing of the outer shell 1 once to complete. After completing this operation, then drag the outer shell 1 back up to the initial position to ensure that the infrared hole is aligned with the detection object again.

[0033] As Figure 3 、 Figure 4 shown, a connecting column 23 is provided in the outer shell 1. The connecting column 23 is far away from the circuit board 7. A partition plate 24 is provided in the outer shell 1. The partition plate 24 separates the connecting column 23 and the circuit board 7 left and right. The partition plate 24 is a plastic plate. The outer shell 1 is formed by buckling two plastic shells in the front and back, and then they are fixed together by screwing into the connecting column 23. And the screws may also generate a magnetic field. The setting of the partition plate 24 isolates the screws from the circuit board 7 and each component on the circuit board 7, further ensuring the stability of the infrared detection of the sensor.

[0034] As Figure 1 , Figure 2 shown, a sliding seat 20 is provided on the back surface of the horizontal release plate 8, and a sliding groove 21 is formed in the height direction of the static electricity release plate 4. The sliding seat 20 is a rubber seat, and the sliding seat 20 utilizes the rubber property to damp and slide in the sliding groove 21. When the housing 1 and the components inside the housing 1 descend following the housing 1, the horizontal release plate 8 is pushed by the bottom end of the housing 1, and the horizontal release plate 8 drives the sliding seat 20 to descend along the sliding groove 21. A metal limiting plate 22 is connected to the back surface of the sliding seat 20, and the metal limiting plate 22 contacts the back surface of the static electricity release plate 4. When the housing 1 descends, it also pushes the horizontal release plate 8 to descend, and the horizontal release plate 8 drives the sliding seat 20 to descend, improving the stability. Moreover, the sliding seat 20 also utilizes its rubber damping characteristic to ensure that the position is self-locked after the housing 1 descends. Of course, when the housing 1 rises to the initial position for use, the position can also be self-locked through the damping performance.

[0035] The above orientation references do not represent the specific orientations of the components in this implementation scheme. This implementation scheme is only for the convenience of describing the scheme and is set with relative descriptions with reference to the orientations in the figure. In essence, the specific orientations of the components are based on their actual installation, actual use, and the habitual orientation descriptions of those skilled in the art. This is hereby stated.

[0036] The above-described specific implementation manners have further elaborated on the invention purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only the specific implementation manners of the present invention and are not used to limit the protection scope of the present invention. It is particularly pointed out that for those skilled in the art, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A photoelectric detection sensor device, characterized in that: The invention comprises a shell (1) and an electrostatic treatment mechanism, wherein a through hole (2) is provided at the bottom of the shell (1), a vertical upward conduit (3) is provided inside the through hole (2), the electrostatic treatment mechanism comprises an electrostatic release plate (4) arranged in the conduit (3), the top end of the electrostatic release plate (4) enters into the shell (1) along the conduit (3), the bottom end of the electrostatic release plate (4) extends along the conduit (3) to the bottom of the shell (1) and is provided with a horizontal bending portion (5), the horizontal bending portion (5) is grounded, an elastic clamping plate (6) is provided on the upper side of the inner part of the shell (1), a circuit board (7) is mounted on the elastic clamping plate (6), various components constituting the photoelectric detection sensor device are mounted on the circuit board (7), the top end of the electrostatic release plate (4) contacts the circuit board (7) to release the static electricity on the circuit board (7), and the electrostatic treatment mechanism further comprises a transverse release plate (8) arranged on the electrostatic release plate (4), the transverse release plate (8) The invention relates to a metal plate, wherein the back side of the lateral release plate (8) contacts the front side of the electrostatic release plate (4), the bottom end of the housing (1) is provided with an inclined surface (9), the top end of the lateral release plate (8) is provided with a contact surface (10), the contact surface (10) is inclined and contacts the inclined surface (9) to release the electrostatic of the housing (1), the electrostatic treatment mechanism also includes a metal shaft (11) provided on the housing (1), and a metal plate (12) mounted on the metal shaft (11), the electrostatic treatment mechanism also includes a seesaw (15) connected to the bottom end of the circuit board (7), the seesaw (15) is provided with an opening (13), the two sides of the metal plate (12) contact with the two sides of the opening (13) over a large area, the end face of the metal plate (12) contacts the electrostatic release plate (4), and the metal plate (12) assists the electrostatic release plate (4) and the lateral release plate (8) to further release the static electricity on the housing (1) and the circuit board (7).

2. A photoelectric detection sensor device according to claim 1, characterized in that: The horizontal bending portion (5) is provided with a mounting hole (14), and the horizontal bending portion (5) is grounded through the mounting hole (14).

3. A photoelectric detection sensor device according to claim 2, characterized in that: The bottom end of the seesaw (15) is provided with a warping portion (16) extending toward the side of the metal plate (12); a contact opening (17) is provided on the seesaw (15); the top end of the electrostatic release plate (4) enters the housing (1) through the contact opening (17); the right side of the electrostatic release plate (4) contacts the right side of the contact opening (17); a deflection gap (18) is left between the left side of the electrostatic release plate (4) and the left side of the contact opening (17); an elastic trigger sheet (25) is provided on the metal plate (12); when the metal plate (12) rotates, the elastic trigger sheet (25) is brought into frequent contact with the warping portion (16), and the seesaw (15) drives the circuit board (7) to vibrate left and right.

4. A photoelectric detection sensor device according to claim 3, characterized in that: The elastic clamping plates (6) are divided into two groups, front and rear, each group of the elastic clamping plates (6) is composed of a first elastic plate (61) on the left and a second elastic plate (62) on the right. The circuit board (7) is fixed and clamped between the first elastic plate (61) and the second elastic plate (62), and a space is left between the periphery of the circuit board (7) and the inner wall of the housing (1).

5. A photoelectric detection sensor device according to claim 4, characterized in that: Both ends of the transverse release plate (8) in the length direction reach both sides of the housing (1), and hanging holes (19) are provided at both ends of the transverse release plate (8) in the length direction. The signal line and the power line are connected upward from the side of the electrostatic release plate (4) into the housing (1), and the bottom ends of the signal line and the power line can be respectively passed through the hanging holes (19).

6. A photoelectric detection sensor device according to claim 5, characterized in that: A slide seat (20) is provided on the back side of the transverse release plate (8), and a slide groove (21) is provided in the height direction of the electrostatic release plate (4). The slide seat (20) is a rubber seat. The slide seat (20) utilizes the rubber property for damping and slides in the slide groove (21). When the housing (1) and the components in the housing (1) descend along with the housing (1), the bottom end of the housing (1) pushes the transverse release plate (8), and the transverse release plate (8) drives the slide seat (20) to descend along the slide groove (21).

7. A photoelectric detection sensor device according to claim 6, characterized in that: The back side of the slide seat (20) is connected to a metal limiting plate (22), and the metal limiting plate (22) contacts the back side of the static electricity release plate (4).

8. The photoelectric detection sensor device according to claim 7, characterized in that: A connecting column (23) is provided in the housing (1), and the connecting column (23) is far away from the circuit board (7). A partition plate (24) is provided in the housing (1), and the partition plate (24) separates the connecting column (23) and the circuit board (7) on the left and right. The partition plate (24) is a plastic plate.