Abnormity tracing method of LED product reliability experiment board

Abstract

The invention discloses an abnormity tracing method for an LED product reliability experiment board, and the method comprises the steps: preparing a reliability experiment board which is provided with tracing information capable of tracing abnormity of a front process; performing a reliability experiment on the reliability experiment board, determining an experiment state of the reliability experiment board, and when the experiment state is an abnormal state, recording abnormal information of an abnormal position on the reliability experiment board according to the tracing information; and determining an abnormal source according to the abnormal information. Compared with the conventional single lamp bead packaging process, the method has the advantages that the situation that when the reliability experiment board is abnormal in the reliability experiment process, due to the fact that the single lamp bead does not have any production process information, only which lamp beads are abnormal can be known, and the reliability of the reliability experiment board is influenced can be avoided through the overall packaging process; however, which process or which production equipment the abnormal source of the lamp bead is in cannot be traced, so that the abnormal place cannot be effectively improved, and the quality and the reliability of an LED product cannot be improved.

Description

Technical Field

Background Art

[0003] In existing LED product reliability test boards, the entire packaged LED bracket is peeled into single LED beads, then subjected to spectral sorting and taping, and then through an SMT mounter, mounted on the corresponding experimental PCB board for reliability test. However, in this process, since the single LED beads have been disrupted after the above processes, it is impossible to know from which entire LED bracket they are peeled, and there is no production process information on the LED beads themselves. When an anomaly occurs in the experiment, it is simply impossible to trace which process, which machine, or which set of molds in the previous stage has problems, thus unable to trace the source of the anomaly.

Summary of the Invention

[0005] To achieve the above object, the present invention proposes a method for tracing anomalies of an LED product reliability test board, including the following steps: Prepare a reliability test board, and the reliability test board is provided with traceability information for tracing anomalies in the previous process; Conduct a reliability test on the reliability test board, determine the test state of the reliability test board, and when the test state is an abnormal state, record the abnormal information at the abnormal position on the reliability test board according to the traceability information; Confirm the source of the anomaly according to the abnormal information.

[0006] For the method for tracing anomalies of an LED product reliability test board as described above, the step of preparing the reliability test board includes: Prepare an entire LED bracket; Prepare a PCB test board corresponding to the LED bead positions of the entire LED bracket; Place the lamp beads of the whole LED bracket in one-to-one correspondence with the lamp bead coordinate positions of the PCB experimental board, and perform overall encapsulation to obtain the reliability experimental board.

[0007] For an abnormal tracing method of an LED product reliability experimental board as described above, the tracing information includes the production process information of the whole LED bracket and the lamp bead coordinate position information of the PCB experimental board.

[0008] For an abnormal tracing method of an LED product reliability experimental board as described above, the abnormal information includes the coordinate position information of the abnormal lamp beads and the production process information of the corresponding whole LED bracket.

[0009] For an abnormal tracing method of an LED product reliability experimental board as described above, before performing the reliability experiment on the reliability experimental board to determine the experimental state of the reliability experimental board, it further includes: Perform an abnormal test on the reliability experimental board before the reliability experiment.

[0010] For an abnormal tracing method of an LED product reliability experimental board as described above, the step of performing an abnormal test on the reliability experimental board before the experiment includes: Perform an electrical test on the reliability experimental board; If abnormal situations such as dim or dead lamp beads occur, the reliability experimental board is a non-conforming product.

[0011] For an abnormal tracing method of an LED product reliability experimental board as described above, performing the reliability experiment on the reliability experimental board to determine the experimental state of the reliability experimental board includes: When the reliability experimental board reaches the corresponding experimental node, perform an electrical test on the reliability experimental board again; If abnormal situations such as dim or dead lamp beads occur, the experimental state of the reliability experimental board is an abnormal state.

[0012] For an abnormal tracing method of an LED product reliability experimental board as described above, the reliability experiment is that the corresponding experimental node is a preset experimental time interval or set specific experimental conditions.

[0013] Compared with the prior art, an abnormal tracing method of an LED product reliability experimental board proposed by the present invention has the following beneficial effects: 1. The abnormal traceability method proposed in the embodiments of the present invention is mainly realized by improving the packaging process of the reliability test board for preparation. Compared with the previous process of packaging single LED beads, the overall packaging process can avoid the situation that when abnormalities occur during the reliability test of the reliability test board, since there is no production process information on a single LED bead, only which specific LED beads have abnormalities can be known, but the source of the abnormality of the LED bead cannot be traced to which process or which production equipment, thus it is impossible to effectively improve the places with abnormalities and enhance the quality and reliability of LED products.

[0014] 2. The reliability test board proposed in the embodiments of the present invention packages the LED beads together with the entire bracket onto the PCB test board. This structure can increase the adhesion between the LED beads and the PCB test board, prevent the loosening or falling off abnormalities caused by the bumping of single LED beads, reduce the misjudgment ratio of the experiment caused by the loosening of the LED beads due to bumping, and improve the accuracy of the experimental results.

Description of the Drawings

[0016] Figure 1 It is a flowchart of an abnormal traceability method for a reliability test board of an LED product of the present invention; Figure 2 For Figure 1 the specific process of step S1 in; Figure 3 For Figure 1 the specific flowchart before step S2 in; Figure 4 For Figure 3 the specific flowchart of step S20 in; Figure 5 For Figure 1 the specific flowchart of step S2 in.

Detailed Embodiments

[0018] Please refer to Figures 1 to 5 as shown, the embodiments of the present invention propose an abnormal traceability method for a reliability test board of an LED product, including steps S1 - S3, where: S1, prepare a reliability test board, and traceability information for abnormal previous processes is provided on the reliability test board.

[0019] Specifically, this step is a crucial one. The reliability test board obtained through this step carries traceability information that can trace back the abnormalities in the previous process. During the experiment, when an abnormality occurs, the source of the abnormality in the LED product manufacturing process can be traced based on the traceability information, thereby enabling targeted improvement of the LED product manufacturing process and enhancing the reliability of the LED product.

[0020] Further, as a preferred implementation manner rather than a limitation of this solution, step S1 further includes steps S11 - S13, where: S11, prepare a whole-piece LED bracket; S12, prepare a PCB test board corresponding to the lamp bead positions of the whole-piece LED bracket; S13, place the lamp beads of the whole-piece LED bracket in one-to-one correspondence with the lamp bead coordinate positions of the PCB test board, and perform overall encapsulation to obtain the reliability test board.

[0021] Specifically, in the embodiments of the present invention, the whole-piece LED bracket prepared through step S11 is defaulted to be an LED bracket that has been potted, that is, single LED lamp beads are potted on the whole-piece LED bracket to form the whole-piece LED lamp bead bracket. The preparation of the whole-piece LED bracket and the potting of single lamp beads onto the LED bracket to form the whole-piece LED bracket are prior art means, and the present invention embodiments will not elaborate on the process of preparing the whole-piece LED bracket and potting. It is worth noting that the production process information is recorded during the production of the whole-piece LED bracket, and the production process information may include, but is not limited to, the mold number of the production process and the machine number corresponding to the process.

[0022] When preparing the PCB test board, the size of the PCB test board is designed according to the size of the whole-piece LED bracket. More importantly, the pad layout on the PCB test board for soldering lamp beads is designed according to the lamp bead positions on the whole-piece LED bracket, that is, the pads on the PCB test board are in one-to-one correspondence with the lamp bead positions on the whole-piece LED bracket. In addition, coordinate information is also provided on the PCB test board, and the coordinate information is used to identify the specific coordinate positions of the lamp beads. In the embodiments of the present invention, the size of the whole-piece LED bracket, as well as the lamp bead positions and the spacing between lamp beads on the LED bracket, can be set according to the parameters of the actual production equipment or according to the actual design requirements of the user. The present invention embodiments do not make specific limitations on this.

[0023] In addition, when encapsulating the whole LED bracket and the PCB experimental board, it is necessary to place the lamp beads of the whole LED bracket in one-to-one correspondence with the lamp bead coordinate positions of the PCB experimental board, and then encapsulate them through an STM mounter, so that the prepared reliability experimental board carries the production process information of the whole LED bracket and the lamp bead position information of the whole LED bracket, that is, the prepared reliability experimental board carries traceability information for tracing abnormalities in the previous process. In subsequent reliability experiments, the source of the abnormality can be traced.

[0024] In this embodiment, compared with the previous process of encapsulating single lamp beads, this overall encapsulation process can avoid the situation where when abnormalities occur during the reliability experiment of the reliability experimental board, since there is no production process information on a single lamp bead, only which specific lamp beads are abnormal can be known, but it is impossible to determine in which process or which production equipment the abnormality of the lamp bead originated, so it is impossible to effectively improve the areas with abnormalities and enhance the quality and reliability of LED products; at the same time, the overall encapsulation process also avoids the cumbersome process of encapsulating single lamp beads one by one, greatly improving the experimental test efficiency of the reliability experiment; In addition, encapsulating the LED lamp beads together with the whole bracket onto the PCB experimental board can increase the adhesion between the LED lamp beads and the PCB experimental board, prevent abnormalities such as loosening or falling off of single lamp beads caused by bumping, reduce the misjudgment ratio of the experiment caused by lamp bead loosening due to bumping, and improve the accuracy of the experimental results.

[0025] Furthermore, as a preferred implementation manner rather than a limitation of this solution, the traceability information includes the production process information of the whole LED bracket and the lamp bead coordinate position information of the PCB experimental board.

[0026] S2. Conduct a reliability experiment on the reliability experimental board, determine the experimental state of the reliability experimental board, and when the experimental state is an abnormal state, record the abnormal information of the abnormal position on the reliability experimental board according to the traceability information.

[0027] Specifically, since the reliability experimental board prepared in the previous step carries the traceability information, when conducting a reliability experiment on the reliability experimental board, if an abnormality occurs during the experiment, that is, when the experimental state of the reliability experiment is an abnormal state, the corresponding abnormal information can be recorded according to the traceability information on the reliability experimental board; Among them, the abnormal information includes the coordinate position information of the abnormal lamp beads and the production process information of the corresponding whole LED bracket.

[0028] In this embodiment, by recording the coordinate position information of abnormal lamp beads and the production process information of the corresponding whole LED bracket, the source of the problem can be quickly located, so that the production process can be adjusted in time, avoiding the inability to quickly locate the source when there is an abnormality and the need to conduct a large-scale investigation of the entire batch of products, thereby improving the efficiency of anomaly resolution.

[0029] Further, as a preferred implementation manner rather than a limitation of this solution, before step S2 of performing a reliability experiment on the reliability test board to determine the experimental state of the reliability test board, there is also step S20, where: S20, perform an abnormality test on the reliability test board before the reliability experiment.

[0030] Further, as a preferred implementation manner rather than a limitation of this solution, step S20 includes steps S201 - S202, where: S201, perform an electrical test on the reliability test board; S202, if abnormal situations such as dim or bright lamp beads or dead lamps occur, then the reliability test board is a non-conforming product.

[0031] In this embodiment, performing an abnormality test on the reliability test board before the reliability experiment is to discover potential defects or abnormal situations that the reliability test board may have in advance. If it is found that the reliability test board does have abnormal situations, the source of the abnormality can be determined in advance for improvement; in addition, by screening out the problematic reliability test boards, the accuracy and reliability of subsequent experimental results can be ensured.

[0032] Further, as a preferred implementation manner rather than a limitation of this solution, step S2 also includes steps S21 - S22, where: S21, when the reliability test board reaches the corresponding experimental node, perform an electrical test on the reliability test board again; S22, if abnormal situations such as dim or bright lamp beads or dead lamps occur, then the experimental state of the reliability test board is an abnormal state.

[0033] Among them, the reliability experiment includes but is not limited to environmental life experiment, electrical characteristic experiment, and optical characteristic experiment, and the corresponding experimental node is a preset experimental time interval or a set specific experimental condition.

[0034] Specifically, when the reliability test board is conducting relevant reliability experiments such as environmental life experiments, electrical characteristics experiments and optical characteristics experiments, when the reliability test board reaches the corresponding experimental node, the reliability test board will be electrically tested again. If at this time, there are abnormal conditions such as dim lamp beads or dead lamps on the reliability test board, the abnormal information of the abnormal position will be recorded according to the traceability information of the reliability test board, that is, the coordinate position information corresponding to the abnormal lamp beads on the reliability test board at this time and the corresponding production process information of the entire LED bracket will be recorded.

[0035] In addition, if necessary, the corresponding mold or equipment can be improved according to the abnormal information, and the reliability test board produced and prepared can be subjected to relevant reliability tests again, so that the stability and reliability of the final LED product can meet the design requirements.

[0036] S3: confirm the source of the exception based on the exception information.

[0037] Specifically, according to the abnormal information, that is, according to the coordinate position information corresponding to the abnormal lamp beads on the reliability test board, and the corresponding production process information of the entire LED bracket, reverse investigation is carried out to determine the source of the abnormality, so that targeted improvements can be made to the location where the abnormality occurs.

[0038] For better understanding, the embodiment of the present invention defines the lamp bead coordinate information on the PCB experimental board as 1, 2, 3, 4, ... on the X-axis and 1, 2, 3, 4, ... on the Y-axis for illustration. In actual use, the lamp bead coordinate information on the PCB experimental board may also be defined in other forms such as letters, and the embodiment of the present invention will not be elaborated herein.

[0039] If during the experiment, the (3,4) lamp beads of the reliability test board have an abnormality, it means that the lamp beads in the 3rd row and 4th column of the reliability test board have an abnormality. Combined with the production process information on the entire LED bracket, it can be determined which mold and which production equipment produced the entire LED bracket has an abnormality. It can also be determined that the abnormality occurred when packaging the lamp beads, and the abnormality occurred when packaging the lamp beads in the 3rd row and 4th column. Then, based on this abnormal information, reverse investigation can be performed to determine the source of the abnormality.

[0040] Ordinary technicians in the relevant field should understand that the above is an implementation method provided in combination with specific content, and it is not considered that the specific implementation of the present invention is limited to these descriptions. At the same time, due to different industry naming, it is not limited to the above naming, nor is it limited to English naming. Any similarity or similarity with the method, structure, etc. of the present invention, or a number of technical deductions or substitutions made on the premise of the concept of the present invention, should be regarded as the protection scope of the present invention.

Claims

1. A method for tracing abnormalities of a LED product reliability test board, characterized in that: include: Prepare a reliability test board, on which traceability information for tracing abnormalities of the previous process is provided; Performing a reliability experiment on the reliability experiment board to determine an experiment state of the reliability experiment board, and when the experiment state is an abnormal state, recording abnormal information of an abnormal position on the reliability experiment board according to the traceability information; According to the abnormal information, the source of the abnormality is confirmed.

2. The abnormality tracing method of the LED product reliability test board according to claim 1 is characterized in that: The steps of preparing the reliability test board include: Prepare a whole piece of LED bracket; Prepare a PCB experimental board corresponding to the positions of the lamp beads of the whole LED bracket; The lamp beads of the entire LED bracket are placed in one-to-one correspondence with the coordinate positions of the lamp beads of the PCB test board, and the overall packaging is performed to obtain the reliability test board.

3. The abnormality tracing method of the LED product reliability test board according to claim 2 is characterized in that: The traceability information includes the production process information of the entire LED bracket and the coordinate position information of the lamp beads of the PCB experimental board.

4. The abnormality tracing method of the LED product reliability test board according to claim 2 is characterized in that: The abnormal information includes the coordinate position information of the abnormal lamp bead and the corresponding production process information of the entire LED bracket.

5. The abnormality tracing method of the LED product reliability test board according to claim 1 is characterized in that: Before the reliability test board is subjected to a reliability test and the test state of the reliability test board is determined, the method further includes: An abnormality test is performed on the reliability test board before the reliability test.

6. The abnormality tracing method of the LED product reliability test board according to claim 5, characterized in that: The abnormality test on the reliability experiment board before the experiment includes: Conducting electrical testing on the reliability test board; If the lamp bead shows abnormal conditions such as dim light or dead light, the reliability test board is an unqualified product.

7. The abnormality tracing method of the LED product reliability test board according to claim 1, characterized in that: The step of performing a reliability experiment on the reliability experiment board to determine an experimental state of the reliability experiment board includes: When the reliability experiment board reaches a corresponding experiment node, the reliability experiment board is electrically tested again; If the lamp bead appears abnormal conditions such as dim light, dead light, etc., the experimental state of the reliability experiment board is abnormal.

8. The abnormality tracing method of the LED product reliability test board according to claim 7, characterized in that: The reliability experiment is a preset experiment time interval or setting specific experiment conditions for corresponding experiment nodes.

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