Heat dissipation method and system for computer host

Abstract

The invention relates to the technical field of computer hosts, and discloses a heat dissipation method for a computer host, which comprises the following steps of: identifying a heating element of the computer host, analyzing the heating power and the distribution condition of the heating element, and identifying the heat dissipation requirement of the computer host; identifying the cooling medium types of the heating element and the heat dissipation element, identifying the heat source temperature of the heating element, and analyzing the heat dissipation characteristics of the heat dissipation element; analyzing a heat dissipation rule of the heat dissipation element, identifying heat factors of the heat dissipation element and the heat dissipation element, and identifying a heat transfer relationship of the heat factors; the temperature data of the heating element is monitored in real time, the temperature change trend of the heating element is analyzed, and a multi-mode heat dissipation mode of the computer host is set; and performing heat dissipation processing on the computer host based on the multi-mode heat dissipation mode to obtain a heat dissipation result. The heat dissipation mode can be automatically switched according to the actual running condition of the computer host, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of computer hosts, and particularly to a method and system for realizing the heat dissipation of a computer host. Background Art

[0002] Computer host heat dissipation refers to reducing the heat generated by internal hardware of a computer through various methods and devices to keep the hardware within a safe operating temperature range. With the continuous upgrade of computer technology, the computing power of the CPU has been continuously improved. As the core computing component, the computer host often accompanies high power consumption and high heat generation while producing high performance. To ensure the stable operation of the computer system, it is necessary to improve the heat dissipation ability of the computer host.

[0003] In the prior art, the heat dissipation of a computer host mainly adopts the air-cooling heat dissipation method, and the heat is transferred from the radiator to the air through a fan. Although this method can achieve a certain heat dissipation effect, the heat dissipation efficiency is limited by the air heat transfer coefficient. For high-power and high-heat components, air-cooling heat dissipation may not be able to provide sufficient heat dissipation capacity, affecting the heat dissipation effect of the computer host. Summary of the Invention

[0004] To solve the above problems, the present invention provides a method and system for realizing the heat dissipation of a computer host, which can automatically switch the heat dissipation mode according to the actual operation situation of the computer host and improve the heat dissipation efficiency.

[0005] In a first aspect, the present invention provides a method for realizing the heat dissipation of a computer host, including:

[0006] Obtain the computer host to be cooled, identify the heating elements of the computer host, analyze the heating power and distribution of the heating elements, and identify the heat dissipation requirements of the computer host according to the heating power and the distribution;

[0007] According to the heat dissipation requirements, identify the heat dissipation elements of the computer host, identify the cooling medium types of the heating elements and the heat dissipation elements, analyze the medium flow performance corresponding to the cooling medium types, identify the heat source temperature of the heating elements, and analyze the heat dissipation characteristics of the heat dissipation elements based on the heat source temperature and the medium flow performance;

[0008] Analyze the heat dissipation law of the heat dissipation elements, identify the heat factors of the heating elements and the heat dissipation elements, and identify the heat transfer relationship of the heat factors according to the heat dissipation characteristics and the heat dissipation law;

[0009] Real-time monitor the temperature data of the heating elements, analyze the temperature change trend of the heating elements based on the temperature data, and set the multi-modal heat dissipation mode of the computer host according to the temperature change trend and the heat transfer relationship;

[0010] Based on the multi-modal heat dissipation mode, heat dissipation treatment is performed on the computer host to obtain a heat dissipation result.

[0011] In a possible implementation manner of the first aspect, the analysis of the heat generation power of the heat generating element includes:

[0012] Identify the structural parameters and material properties of the heat generating element, and analyze the heat dissipation efficiency of the heat generating element according to the structural parameters and material properties;

[0013] Identify the working load condition of the heat generating element;

[0014] Collect the voltage parameters and current parameters of the heat generating element;

[0015] Analyze the heat generation power of the heat generating element according to the voltage parameters, current parameters, the heat dissipation efficiency, and the working load condition.

[0016] In a possible implementation manner of the first aspect, the identification of the heat dissipation requirement of the computer host according to the heat generation power and the distribution situation includes:

[0017] Identify the hot spot area of the heat generating element according to the heat generation power and the distribution situation;

[0018] Analyze the heat generation situation of the hot spot area;

[0019] Analyze the heat flux density of the heat generating element based on the heat generation situation;

[0020] Determine the heat transfer resistance factor of the heat generating element according to the heat flux density;

[0021] Collect the ambient temperature and working temperature of the heat generating element, and analyze the maximum temperature limit of the heat generating element based on the ambient temperature and the working temperature;

[0022] Combine the heat transfer resistance factor and the maximum temperature limit to identify the heat dissipation requirement of the computer host.

[0023] In a possible implementation manner of the first aspect, the identification of the cooling medium types of the heat generating element and the heat dissipating element includes:

[0024] Obtain the thermal performance parameters of the heat generating element;

[0025] Based on the thermal performance parameters, identify the power dissipation situation and heat flux intensity of the heat generating element;

[0026] Identify the element material attributes of the heat dissipating element;

[0027] Analyze the heat dissipation method of the heating element in combination with the power dissipation situation, the heat flux intensity, and the element material properties;

[0028] Based on the heat dissipation method, identify the types of cooling media for the heating element and the heat dissipation element.

[0029] In a possible implementation manner of the first aspect, analyzing the heat dissipation characteristics of the heat dissipation element based on the heat source temperature and the medium flow performance includes:

[0030] Identify the heating element corresponding to the heat source temperature and determine the heat source power of the heating element; based on the heat source power, calculate the thermal resistance parameter of the heat dissipation element using the following formula:

[0031]

[0032] where R represents the thermal resistance parameter of the heat dissipation element, ΔT represents the difference between the heat source temperature corresponding to the heat dissipation element and the ambient temperature, and P represents the heat source power of the heating element corresponding to the heat dissipation element;

[0033] Based on the thermal resistance parameter and the heat source power, identify the thermal resistance requirement of the heat dissipation element;

[0034] Extract the heat dissipation coefficient of the heat dissipation element;

[0035] Based on the heat dissipation coefficient and the thermal resistance parameter, calculate the heat dissipation area of the heat dissipation element using the following formula:

[0036]

[0037] where S represents the heat dissipation area of the heat dissipation element, P' represents the power consumption of the heating element corresponding to the heat dissipation element, k represents the heat dissipation coefficient of the heat dissipation element, T a ' represents the surface temperature of the heating element corresponding to the heat dissipation element, T b ' represents the ambient temperature corresponding to the heat dissipation element;

[0038] Based on the medium flow performance, analyze the heat exchange efficiency of the heat dissipation element;

[0039] Combining the thermal resistance requirement, the heat dissipation area, and the heat exchange efficiency, analyze the heat dissipation characteristics of the heat dissipation element.

[0040] In a possible implementation manner of the first aspect, analyzing the heat dissipation law of the heat dissipation element includes:

[0041] Identify the high-temperature heating area and the low-temperature heating area corresponding to the heat dissipation element;

[0042] Analyze the heat flow path of the heat dissipation element based on the high-temperature heating area and the low-temperature heating area;

[0043] Identify the fluid medium in the heat flow path of the heat dissipation element;

[0044] Calculate the flow velocity of the fluid medium using the following formula:

[0045]

[0046] where v represents the flow velocity of the fluid medium, d represents the diameter of the radiator corresponding to the fluid medium, q represents the operating speed of the radiator corresponding to the fluid medium, and r represents other influencing factors of the radiator corresponding to the fluid medium;

[0047] Analyze the heat flow rate of the heat dissipation element based on the flow velocity;

[0048] Identify the geometric shape of the heat dissipation element and the property parameters of the flowing medium;

[0049] Analyze the convective heat conduction efficiency of the heat dissipation element based on the geometric shape, the property parameters, and the flow velocity;

[0050] Analyze the heat dissipation law of the heat dissipation element by combining the heat flow path, the heat flow rate, and the convective heat conduction efficiency.

[0051] In a possible implementation manner of the first aspect, the identifying the heat transfer relationship of the heat factor according to the heat dissipation characteristics and the heat dissipation law includes:

[0052] Identify the heating element and the heat dissipation element corresponding to the heat factor;

[0053] Determine the heat distribution of the heating element and the geometric layout of the heat dissipation element;

[0054] Identify the spatial distribution of the heat factor according to the heat distribution and the geometric layout;

[0055] Analyze the energy efficiency ratio of the heating element and the heat exchange effectiveness of the heat dissipation element based on the heat dissipation law and the heat dissipation law;

[0056] Identify the energy conversion efficiency of the heat factor according to the energy efficiency ratio and the heat exchange effectiveness;

[0057] Analyze the thermal balance relationship between the heating element and the heat dissipation element;

[0058] Extract the temperature change situation corresponding to the heat factor;

[0059] Analyze the response speed of the heating element and the heat dissipation element to the temperature change situation;

[0060] Combined with the spatial distribution, the energy conversion efficiency, the heat balance relationship and the response speed, identify the heat transfer relationship of the heat factor.

[0061] In a possible implementation manner of the first aspect, analyzing the temperature change trend of the heating element based on the temperature data includes:

[0062] Perform time series analysis on the temperature data to obtain time series temperature data;

[0063] Identify the classification attributes of the time series temperature data;

[0064] Based on the classification attributes, analyze the influencing factors of the temperature change of the heating element;

[0065] Identify the single-factor time pattern of the influencing factors of the temperature change;

[0066] Calculate the correlation degree between the single-factor time pattern and the temperature change of the heating element;

[0067] According to the correlation degree of the temperature change, analyze the temperature change trend of the heating element.

[0068] In a possible implementation manner of the first aspect, setting the multi-modal heat dissipation mode of the computer host according to the temperature change trend and the heat transfer relationship includes:

[0069] According to the temperature change trend and the heat transfer relationship, determine the heat management requirements of the computer host;

[0070] Based on the heat management requirements, define the combined heat dissipation method of the computer host;

[0071] According to the combined heat dissipation method, set the multi-state heat dissipation structure of the computer host;

[0072] Identify the output heat of the computer host and define the safety threshold of the output heat;

[0073] Based on the safety threshold and the heat management requirements, set the classification switching threshold of the combined heat dissipation method;

[0074] According to the classification switching threshold, set the mode switching condition of the combined heat dissipation method;

[0075] Combined with the mode switching condition, the classification switching threshold and the multi-state heat dissipation structure, set the multi-modal heat dissipation mode of the computer host.

[0076] Second aspect, the heat dissipation system for implementing a computer mainframe provided by the present invention is characterized in that the system includes:

[0077] A heat dissipation requirement identification module, configured to obtain a computer mainframe to be cooled, identify the heating elements of the computer mainframe, analyze the heating power and distribution of the heating elements, and identify the heat dissipation requirements of the computer mainframe according to the heating power and the distribution;

[0078] A heat dissipation characteristic analysis module, configured to identify the heat dissipation elements of the computer mainframe according to the heat dissipation requirements, identify the types of cooling media for the heating elements and the heat dissipation elements, analyze the medium flow performance corresponding to the types of cooling media, identify the heat source temperature of the heating elements, and analyze the heat dissipation characteristics of the heat dissipation elements based on the heat source temperature and the medium flow performance;

[0079] A heat transfer relationship determination module, configured to analyze the heat dissipation law of the heat dissipation elements, identify the heat factors of the heating elements and the heat dissipation elements, and identify the heat transfer relationship of the heat factors according to the heat dissipation characteristics and the heat dissipation law;

[0080] A combined heat dissipation setting module, configured to monitor the temperature data of the heating elements in real time, analyze the temperature change trend of the heating elements based on the temperature data, and set the multi-modal heat dissipation mode of the computer mainframe according to the temperature change trend and the heat transfer relationship;

[0081] A heat dissipation processing module, configured to perform heat dissipation processing on the computer mainframe based on the multi-modal heat dissipation mode to obtain a heat dissipation result.

[0082] Compared with the prior art, the technical principle and beneficial effects of this solution are as follows:

[0083] In the embodiments of the present invention, by obtaining the computer mainframe to be cooled and identifying the heating elements of the computer mainframe, the total heat load and the heat source position of the computer mainframe can be determined, the heating power and distribution of the heating elements can be analyzed, and the heat dissipation requirements of the computer mainframe can be identified to help design a suitable heat dissipation system. Secondly, in the embodiments of the present invention, by identifying the types of cooling media of the heating elements and the heat dissipation elements and analyzing the medium flow performance corresponding to the types of cooling media, the performance of the heat dissipation system can be predicted and optimized to ensure the thermal stability and performance of the computer mainframe under various working conditions, so as to analyze the heat dissipation characteristics of the heat dissipation elements and ensure that the computer mainframe can maintain a stable operating temperature under various workloads, preventing system crashes or performance degradation caused by overheating. Thirdly, in the embodiments of the present invention, by analyzing the heat dissipation law of the heat dissipation elements, the heat transfer relationship between the heating elements and the heat dissipation elements can be determined according to the heat dissipation characteristics of the heating elements. Further, in the embodiments of the present invention, by monitoring the temperature data of the heating elements in real time and analyzing the temperature change trend of the heating elements, the heat generated during the operation of the computer mainframe can be obtained in real time, and the temperature change trend can be predicted to prevent hardware failures caused by overheating in advance. According to the temperature change trend and the heat transfer relationship, a multi-modal heat dissipation mode of the computer mainframe is set, integrating multiple heat dissipation technologies, flexibly adjusting the heat dissipation strategy according to the changes in the ambient temperature and system load to adapt to different working environments, extending the service life of the computer mainframe, dynamically adjusting the heat dissipation intensity according to the actual heat load, reducing unnecessary energy consumption, and improving energy utilization efficiency. Finally, in the embodiments of the present invention, by performing heat dissipation processing on the computer mainframe based on the multi-modal heat dissipation mode to obtain a heat dissipation result, the heat dissipation method can be automatically selected or adjusted according to different situations to ensure that the computer mainframe maintains a stable temperature while operating efficiently, preventing damage to the system caused by excessive temperature, thereby enhancing the stability of the system, extending its service life, and reducing unnecessary energy consumption and improving energy utilization efficiency at the same time. Therefore, the heat dissipation method for realizing the computer mainframe proposed by the present invention can automatically switch the heat dissipation method according to the actual situation of the computer mainframe operation and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0084] The drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present invention and, together with the specification, are used to explain the principles of the present invention.

[0085] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0086] Figure 1 A flowchart showing the process of a heat dissipation method for a computer mainframe provided by an embodiment of the present invention;

[0087] Figure 2 A schematic diagram of modules of a heat dissipation system for a computer mainframe provided by an embodiment of the present invention. Detailed implementation manners

[0088] It should be understood that the specific implementation manners described herein are only used to explain the present invention and are not used to limit the present invention.

[0089] The embodiment of the present invention provides a heat dissipation method for a computer mainframe. The execution subject of the heat dissipation method for the computer mainframe includes, but is not limited to, at least one of electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiment of the present invention. In other words, the heat dissipation method for the computer mainframe can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes, but is not limited to: a single server, a server cluster, a cloud server, or a cloud server cluster, etc. The server can be an independent server or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, Content Delivery Network (CDN), and big data and artificial intelligence platforms.

[0090] Refer to Figure 1 As shown, it is a flowchart showing the process of a heat dissipation method for a computer mainframe provided by an embodiment of the present invention. Among them, Figure 1 The heat dissipation method for the computer mainframe described in

[0091] S1. Obtain the computer mainframe to be cooled, identify the heat-generating components of the computer mainframe, analyze the heat generation power and distribution of the heat-generating components, and identify the heat dissipation requirements of the computer mainframe according to the heat generation power and the distribution.

[0092] By obtaining the computer mainframe to be cooled and identifying the heat-generating components of the computer mainframe in the embodiment of the present invention, the total heat load and the heat source position of the computer mainframe can be determined. The computer mainframe refers to the central processing unit in the computer system, and the heat-generating components refer to electronic components that generate heat during normal operation, such as a central processing unit, a graphics processing unit, a memory module, etc.

[0093] Optionally, the identification of the heat-generating components of the computer mainframe can be determined by temperature monitoring software, such as Core Temp software.

[0094] Furthermore, by analyzing the heat generation power and distribution of the heating elements in the embodiments of the present invention, the heat dissipation requirements of the computer mainframe can be clarified, and thus a more reasonable heat dissipation solution can be formulated. The heat generation power refers to the rate of heat generated by each heating element in the computer mainframe under normal working or full-load working conditions, and the distribution refers to the spatial layout and heat distribution of the heating elements inside the computer mainframe.

[0095] Exemplarily, the spatial layout of the heating elements can be obtained by directly opening the computer mainframe and observing and recording the positions and relative layouts of the heating elements (such as the CPU, GPU, power supply, etc.), and then a thermal imager can be used to capture the heat distribution of the heating elements and their surrounding areas when the computer mainframe is running.

[0096] As an embodiment of the present invention, the analysis of the heat generation power of the heating elements includes: identifying the structural parameters and material properties of the heating elements, and analyzing the heat dissipation efficiency of the heating elements according to the structural parameters and material properties; identifying the working load conditions of the heating elements; collecting the voltage parameters and current parameters of the heating elements; and analyzing the heat generation power of the heating elements according to the voltage parameters, current parameters, the heat dissipation efficiency and the working load conditions.

[0097] Among them, the structural parameters refer to the physical structure and design features of the heating elements, including dimensions, shapes, layouts, and the configuration of heat dissipation devices (such as heat sinks, fans, etc.), the material properties refer to the physical and chemical characteristics of various materials that make up the heating elements and their heat dissipation systems, the heat dissipation efficiency refers to the ability of the heat dissipation system to transfer heat from the heating elements to the surrounding environment, the working load conditions refer to the working state of the heating elements within a specific time, including the types, complexities, and durations of the tasks they execute, the current parameters refer to the charge flow through components (such as resistors, semiconductor devices, etc.), and the voltage parameters refer to the potential difference applied across the two ends of the components.

[0098] Optionally, the analysis of the heat dissipation efficiency of the heating elements according to the structural parameters and material properties can be achieved by using a thermal imager to measure the temperatures of the heating elements and heat sinks for evaluation. The identification of the working load conditions of the heating elements can be obtained through system monitoring tools, such as the Zabbix monitoring tool. The collection of the voltage parameters and current parameters of the heating elements can be achieved by using a multimeter. For example, by setting the multimeter to the appropriate voltage or current measurement mode and connecting its probes to the corresponding points of the circuit, the voltage and current values can be directly read.

[0099] In an embodiment of the present invention, by identifying the heat dissipation requirement of the computer mainframe according to the heat generation power and the distribution situation, a suitable heat dissipation system can be designed. The heat dissipation requirement refers to the heat dissipation conditions and performance required to ensure that the heat generating components in the computer mainframe can operate within a safe and effective temperature range.

[0100] As an embodiment of the present invention, the identifying the heat dissipation requirement of the computer mainframe according to the heat generation power and the distribution situation includes: identifying the hot spot area of the heat generating component according to the heat generation power and the distribution situation; analyzing the heat generation situation of the hot spot area; analyzing the heat flux density of the heat generating component based on the heat generation situation; determining the heat transfer resistance factor of the heat generating component according to the heat flux density; collecting the ambient temperature and the working temperature of the heat generating component, and analyzing the maximum temperature limit of the heat generating component based on the ambient temperature and the working temperature; and identifying the heat dissipation requirement of the computer mainframe by combining the heat transfer resistance factor and the maximum temperature limit.

[0101] Among them, the hot spot area refers to the part of the heat generating component where the temperature is significantly higher than other areas. The heat generation situation refers to the total amount and distribution characteristics of the heat generated by the heat generating component during operation. The heat flux density refers to the amount of heat passing through a unit area per unit time. The heat transfer resistance factor refers to the resistance encountered during the heat transfer process. The ambient temperature refers to the temperature of the surrounding environment where the heat generating component is located. The working temperature refers to the temperature of the heat generating component under normal working conditions. The maximum temperature limit refers to the highest temperature that the heat generating component can withstand.

[0102] Optionally, the analysis of the heat generation situation of the hot spot area can be realized by performing a thermal simulation analysis on the heat generating component using ANSYS simulation software. The analysis of the heat flux density of the heat generating component based on the heat generation situation can be determined by Fourier's law. The analysis of the maximum temperature limit of the heat generating component based on the ambient temperature and the working temperature can be determined using the material properties and the safe working temperature of the heat generating component.

[0103] S2. According to the heat dissipation requirement, identify the heat dissipation components of the computer mainframe, identify the cooling medium types of the heat generating components and the heat dissipation components, analyze the medium flow performance corresponding to the cooling medium types, identify the heat source temperature of the heat generating components, and analyze the heat dissipation characteristics of the heat dissipation components based on the heat source temperature and the medium flow performance.

[0104] In the embodiments of the present invention, by identifying the heat dissipation components of the computer host according to the heat dissipation requirements, the heat dissipation efficiency can be optimized by understanding the thermal characteristics of the heat dissipation components, ensuring that heat can be quickly and effectively transferred from the heat source to the environment. The heat dissipation components refer to the components used for heat flow in a computer host or other electronic devices, such as heat sinks, fans, and heat pipes.

[0105] Optionally, the identification of the heat dissipation components of the computer host can be implemented by using the HWi NFO system monitoring software.

[0106] Furthermore, in the embodiments of the present invention, by identifying the types of cooling media for the heating components and the heat dissipation components, and analyzing the media flow performance corresponding to the types of cooling media, the performance of the heat dissipation system can be predicted and optimized, ensuring the thermal stability and performance of the computer host under various working conditions. The types of cooling media refer to the types of substances used to absorb and transfer the heat of the heating components, such as air, water, and liquid metal. The media flow performance refers to the characteristics of the flow of the cooling media in the system, such as flow rate, flow volume, and thermal conductivity.

[0107] Optionally, the analysis of the media flow performance corresponding to the types of cooling media can be obtained by using the MacroF l ow heat flow analysis software.

[0108] As an embodiment of the present invention, the identification of the types of cooling media for the heating components and the heat dissipation components includes: obtaining the thermal performance parameters of the heating components; based on the thermal performance parameters, identifying the power dissipation situation and heat flow intensity of the heating components; identifying the component material properties of the heat dissipation components; combining the power dissipation situation, the heat flow intensity, and the component material properties, analyzing the heat dissipation method of the heating components; and according to the heat dissipation method, identifying the types of cooling media for the heating components and the heat dissipation components.

[0109] Among them, the thermal performance parameters refer to the thermal characteristic parameters used to describe and evaluate the heating components, such as junction temperature. The power dissipation situation refers to the power consumed by the heating components during normal operation. The heat flow intensity refers to the distribution intensity of the power dissipation on the surface area of the heating components. The component material properties refer to the physical and chemical properties of the materials constituting the heat dissipation components, such as thermal conductivity, specific heat capacity, and density. The heat dissipation method refers to various technologies and methods used to manage and flow the heat generated by the heating components, such as natural heat dissipation, liquid heat dissipation, and heat pipes.

[0110] Optionally, the acquisition of the thermal performance parameters of the heating components can be implemented by using thermal modeling software, such as Ansys Icepak software. The identification of the component material properties of the heat dissipation components can be obtained through experimental tests. The identification of the power dissipation situation of the heating components based on the thermal performance parameters can be achieved by using the product of voltage and current.

[0111] The embodiment of the present invention helps to design a heat dissipation system that can adapt to different ambient temperatures by identifying the heat source temperature of the heating element, thereby ensuring that the computer host can operate reliably in high or low temperature environments. The heat source temperature refers to the actual temperature of the element that generates heat in the computer host, including node temperature, shell temperature, surface temperature, etc.

[0112] Optionally, the heat source temperature identification of the heating element can be achieved by using a system built-in temperature sensor.

[0113] Furthermore, the embodiment of the present invention can ensure that the computer host can maintain a stable operating temperature under various workloads and prevent system crash or performance degradation due to overheating by analyzing the heat dissipation characteristics of the heat dissipation element based on the heat source temperature and the medium flow performance. The heat dissipation characteristics refer to the characteristics exhibited by the heat dissipation element during the heat dissipation process, such as thermal conductivity, heat capacity, thermal resistance, etc.

[0114] As an embodiment of the present invention, the analysis of the heat dissipation characteristics of the heat dissipation element based on the heat source temperature and the medium flow performance includes: identifying the heating element corresponding to the heat source temperature, and determining the heat source power of the heating element; calculating the thermal resistance parameter of the heat dissipation element based on the heat source power; identifying the thermal resistance requirement of the heat dissipation element according to the thermal resistance parameter and the heat source power; extracting the heat dissipation coefficient of the heat dissipation element; calculating the heat dissipation area of ​​the heat dissipation element based on the heat dissipation coefficient and the thermal resistance parameter; analyzing the heat exchange efficiency of the heat dissipation element according to the medium flow performance; and analyzing the heat dissipation characteristics of the heat dissipation element in combination with the thermal resistance requirement, the heat dissipation area and the heat exchange efficiency.

[0115] Among them, the heat source power refers to the rate at which the heating element converts the consumed electrical energy into thermal energy per unit time, the thermal resistance parameter refers to a physical quantity that describes the resistance to heat transfer from the heat source to the environment, the thermal resistance requirement refers to the thermal resistance value required to control the temperature of the heating element within a safe operating range, the heat dissipation coefficient refers to the ability of a fluid (such as air or water) to remove heat from the heat dissipation surface, the heat dissipation area refers to the surface area of ​​a heat dissipation element (such as a heat sink), and the heat exchange efficiency refers to the ability of a heat dissipation system to transfer heat from a heat source to the environment, including the efficiency of heat conduction, convection and radiation.

[0116] Optionally, the heat dissipation coefficient extraction of the heat dissipation element can be achieved using a Savvy Calculator heat dissipation calculator, and according to the medium flow performance, the heat exchange efficiency analysis of the heat dissipation element can be obtained through thermal simulation software based on finite element thermal fluid analysis technology, such as FLOTHERM software.

[0117] In an alternative embodiment of the present invention, based on the heat source power, the thermal resistance parameter of the heat dissipation element is calculated using the following formula:

[0118]

[0119] Wherein, R represents the thermal resistance parameter of the heat dissipation element, ΔT represents the difference between the heat source temperature corresponding to the heat dissipation element and the ambient temperature, and P represents the heat source power of the heating element corresponding to the heat dissipation element.

[0120] In another alternative embodiment of the present invention, based on the heat dissipation coefficient and the thermal resistance parameter, the heat dissipation area of the heat dissipation element is calculated using the following formula:

[0121]

[0122] Wherein, S represents the heat dissipation area of the heat dissipation element, P' represents the power consumption of the heating element corresponding to the heat dissipation element, k represents the heat dissipation coefficient of the heat dissipation element, T a ' represents the surface temperature of the heating element corresponding to the heat dissipation element, and T b ' represents the ambient temperature corresponding to the heat dissipation element.

[0123] S3. Analyze the heat dissipation law of the heat dissipation element, identify the heat factors of the heating element and the heat dissipation element, and based on the heat dissipation characteristics and the heat dissipation law, identify the heat transfer relationship of the heat factors.

[0124] By analyzing the heat dissipation law of the heat dissipation element in the embodiment of the present invention, it is possible to prevent key components such as the CPU and GPU from being downclocked due to excessive temperature, thereby maintaining the best performance. The heat dissipation law refers to the law of heat transfer, such as the direction of heat flow is always from the high-temperature region to the low-temperature region.

[0125] As an embodiment of the present invention, the analysis of the heat dissipation law of the heat dissipation element includes: identifying the high-temperature heating region and the low-temperature heating region corresponding to the heat dissipation element; based on the high-temperature heating region and the low-temperature heating region, analyzing the heat flow path of the heat dissipation element; identifying the fluid medium in the heat flow path of the heat dissipation element; calculating the flow velocity of the fluid medium; based on the flow velocity, analyzing the heat flow rate of the heat dissipation element; identifying the geometric shape of the heat dissipation element and identifying the property parameters of the flowing medium; based on the geometric shape, the property parameters and the flow velocity, analyzing the convective heat conduction efficiency of the heat dissipation element; and combining the heat flow path, the heat flow rate and the convective heat conduction efficiency, analyzing the heat dissipation law of the heat dissipation element.

[0126] Among them, the high-temperature heat generation area refers to the area in the computer mainframe that generates the most heat. The low-temperature heat generation area refers to the area where the heat has been transferred and dissipated into the environment, such as the outer surface of the heat sink and the surrounding air. The heat flow path refers to the path by which heat is transferred from the high-temperature heat generation area to the low-temperature heat generation area, including three methods: heat conduction, heat convection, and heat radiation. The fluid medium refers to the liquid or gas used for cooling, such as air or water. The flow velocity refers to the rate at which the fluid flows in the heat dissipation system. The heat flow rate refers to the value of the heat passing through a specific area per unit time. The geometric shape refers to the shape structure of the heat dissipation element. The property parameters refer to the physical property parameters of the fluid medium, such as density, thermal conductivity, specific heat capacity, and dynamic viscosity, etc. The convective heat transfer efficiency refers to the heat exchange efficiency between the fluid medium and the surface of the heat dissipation element.

[0127] Optionally, based on the high-temperature heat generation area and the low-temperature heat generation area, the analysis of the heat flow path of the heat dissipation element can be achieved by using the method of heat flowing from high temperature to low temperature. The analysis of the heat flow rate of the heat dissipation element can be obtained through the heat transfer rate and the flow velocity of the fluid medium. Based on the geometric shape, the property parameters, and the flow velocity, the analysis of the convective heat transfer efficiency of the heat dissipation element can be measured by the convective heat transfer coefficient.

[0128] In an optional embodiment of the present invention, the following formula is used to calculate the flow velocity of the fluid medium:

[0129]

[0130] Among them, v represents the flow velocity of the fluid medium, d represents the diameter of the radiator corresponding to the fluid medium, q represents the operating speed of the radiator corresponding to the fluid medium, and r represents other influencing factors of the radiator corresponding to the fluid medium.

[0131] Furthermore, in the embodiment of the present invention, by identifying the heat factors of the heating element and the heat dissipation element, the heat transfer relationship between the heating element and the heat dissipation element can be determined. The heat factor refers to the energy generated by the heating element (such as CPU, GPU) and needs to be transferred to the surrounding environment through the heat dissipation element (such as radiator, fan).

[0132] Optionally, the identification of the heat factors of the heating element and the heat dissipation element can be achieved by using an infrared thermal imager.

[0133] In the embodiments of the present invention, by identifying the heat transfer relationship of the heat factor according to the heat dissipation characteristics and the heat dissipation law, it is helpful to design an effective heat dissipation solution, prevent the heating element from overheating, thereby ensuring the stable operation and long-term reliability of the computer host, slowing down the aging of components, extending the service life of hardware. The heat transfer relationship refers to the way, path, and efficiency of heat transfer of the computer host between different objects or between different parts of the same object.

[0134] As an embodiment of the present invention, the identifying the heat transfer relationship of the heat factor according to the heat dissipation characteristics and the heat dissipation law includes: identifying the heating element and the heat dissipation element corresponding to the heat factor; determining the heat distribution of the heating element and the geometric layout of the heat dissipation element; identifying the spatial distribution of the heat factor according to the heat distribution and the geometric layout; analyzing the energy efficiency ratio of the heating element and the heat exchange efficiency of the heat dissipation element based on the heat dissipation law and the heat dissipation law; identifying the energy conversion efficiency of the heat factor according to the energy efficiency ratio and the heat exchange efficiency; analyzing the thermal balance relationship between the heating element and the heat dissipation element; extracting the temperature change situation corresponding to the heat factor; analyzing the response speed of the heating element and the heat dissipation element to the temperature change situation; and identifying the heat transfer relationship of the heat factor by combining the spatial distribution, the energy conversion efficiency, the thermal balance relationship, and the response speed.

[0135] Among them, the heat distribution refers to the distribution state of the heat generated by the heating element during operation inside the element. The geometric layout refers to the physical structure and spatial arrangement of the heat dissipation element, including the shape, size of the radiator, the arrangement of fins, and the relative position with other heat dissipation components. The spatial distribution refers to the distribution of heat in three-dimensional space, including the heat distribution inside the heating element and the heat dissipation element and between them. The heat exchange efficiency refers to the ability of the heat dissipation element to exchange heat with the surrounding environment (usually air or liquid) per unit time. The energy conversion efficiency refers to the efficiency of the heating element to convert the input electrical energy into the required output energy (such as computing power). The thermal balance relationship refers to the balance state between the heat generated by the heating element and the heat dissipated by the heat dissipation element. The temperature change situation refers to the change of the temperature of the heating element and the heat dissipation element over time under specific operating conditions. The response speed refers to the speed of response of the heating element and the heat dissipation element to the temperature change.

[0136] Optionally, according to the heat distribution and the geometric layout, the spatial distribution identification of the heat factor can be obtained by simulating the heat distribution in space using numerical simulation software, such as COMSOL Multiphysics software. Based on the heat dissipation law and the heat dissipation law, the energy efficiency ratio analysis of the heating element can be calculated using the power consumption and output performance of the heating element. Based on the heat dissipation law and the heat dissipation law, the heat exchange efficiency analysis of the heat dissipation element can be determined by experimental methods, such as using a heat transfer test device to measure the ability of the heat dissipation element to exchange heat with the fluid per unit time. The response speed analysis of the heating element and the heat dissipation element to the temperature change can be determined using the time required for the heating element and the heat dissipation element to reach a new thermal equilibrium state after an external temperature change.

[0137] S4. Real-time monitor the temperature data of the heating element. Based on the temperature data, analyze the temperature change trend of the heating element. According to the temperature change trend and the heat transfer relationship, set the multi-modal heat dissipation mode of the computer host.

[0138] In the embodiment of the present invention, by real-time monitoring the temperature data of the heating element, the heat generated by the computer host during operation can be obtained in real time, and the temperature change trend can be predicted to prevent hardware failures caused by overheating in advance. The temperature data refers to the actual temperature values of the monitored heating elements (such as the CPU, GPU, etc. in the computer host), including the surface temperature of the element, the ambient temperature, the core temperature of the element, etc.

[0139] Optionally, the real-time monitoring of the temperature data of the heating element can be implemented using the temperature monitoring system of the hardware component, such as the Speccy system.

[0140] Furthermore, in the embodiment of the present invention, by analyzing the temperature change trend of the heating element based on the temperature data, it is possible to help identify overheating or overcooling situations, thereby adjusting the heat dissipation strategy, improving energy utilization efficiency, reducing unnecessary energy waste. At the same time, it is possible to predict the aging trend and potential failure risks of the computer host components, so as to perform maintenance before problems occur, reduce the risk of unexpected shutdowns, and reduce maintenance costs. The temperature change trend refers to the pattern of the temperature of the heating element changing over time.

[0141] As an embodiment of the present invention, analyzing the temperature change trend of the heating element based on the temperature data includes: performing time series analysis on the temperature data to obtain time series temperature data; identifying the classification attributes of the time series temperature data; analyzing the influencing factors of the temperature change of the heating element based on the classification attributes; identifying the single-factor time patterns of the temperature change influencing factors; calculating the correlation degree between the single-factor time patterns and the temperature change of the heating element; and analyzing the temperature change trend of the heating element according to the temperature change correlation degree.

[0142] Among them, the time series temperature data refers to the sequence of temperature values of the heating element recorded over time, the classification attribute refers to the type of temperature source in the time series temperature data, such as the temperature data generated by the workload, the temperature change influencing factors refer to the external conditions and internal variables that affect the temperature change, such as the ambient temperature, the single-factor time pattern refers to the regular pattern of different factor types in the time series data, such as periodic change, trend change or seasonal change, and the temperature change correlation degree refers to the strength of the correlation between different factors and the temperature change.

[0143] Optionally, the analysis of the temperature change influencing factors of the heating element based on the classification attributes can be identified by a machine learning model, such as the ARIMA model, the time pattern analysis of the temperature change influencing factors can be implemented using a time series analysis toolkit, such as the ts learn toolkit, and the calculation of the correlation degree between the single-factor time pattern and the temperature change of the heating element can be determined by the Pearson correlation coefficient formula.

[0144] By setting the multi-modal cooling mode of the computer mainframe according to the temperature change trend and the heat transfer relationship, the embodiment of the present invention can integrate multiple cooling technologies, flexibly adjust the cooling strategy according to the changes in the ambient temperature and system load to adapt to different working environments, extend the service life of the computer mainframe, dynamically adjust the cooling intensity according to the actual heat load, reduce unnecessary energy consumption, and improve energy utilization efficiency. The multi-modal cooling mode refers to the combined use of multiple different cooling technologies or methods in the computer mainframe cooling system, such as air cooling, liquid cooling, heat pipes, phase change materials, etc.

[0145] As an embodiment of the present invention, setting the multimodal heat dissipation mode of the computer mainframe according to the temperature change trend and the heat transfer relationship includes: determining the heat management requirements of the computer mainframe according to the temperature change trend and the heat transfer relationship; defining the combined heat dissipation method of the computer mainframe based on the heat management requirements; setting the polymorphic heat dissipation structure of the computer mainframe according to the combined heat dissipation method; identifying the output heat of the computer mainframe and defining the safety threshold of the output heat; setting the classification switching threshold of the combined heat dissipation method based on the safety threshold and the heat management requirements; setting the mode switching condition of the combined heat dissipation method according to the classification switching threshold; and setting the multimodal heat dissipation mode of the computer mainframe in combination with the mode switching condition, the classification switching threshold and the polymorphic heat dissipation structure.

[0146] Among them, the heat management requirement refers to the heat dissipation capacity required for maintaining the hardware components within a safe temperature range when the computer mainframe is in different working states. The combined heat dissipation method refers to a method of combining different heat dissipation technologies (such as air cooling, water cooling, heat pipes, etc.). The polymorphic heat dissipation structure refers to various heat dissipation components and paths designed inside the computer mainframe, such as adding fans, heat sinks, heat pipes, etc. with different configurations inside. The output heat refers to the total heat generated during the operation of the computer mainframe. The safety threshold refers to the maximum temperature limit that the computer mainframe hardware can withstand. The classification switching threshold refers to the switching point between different heat dissipation modes set in the multimodal heat dissipation system according to different heat dissipation requirements and safety thresholds. The mode switching condition refers to the specific temperature or load condition that triggers the switching between heat dissipation modes.

[0147] Optionally, the identification of the output heat of the computer mainframe can be determined by measuring the power consumption and time of the computer mainframe hardware. The definition of the safety threshold of the output heat can be achieved by using the long-term stability test of the computer mainframe. The setting of the classification switching threshold of the combined heat dissipation method based on the safety threshold and the heat management requirements can be determined by analyzing the efficiency of different heat dissipation modes and the safe temperature range of the hardware.

[0148] S5. Based on the multimodal heat dissipation mode, perform heat dissipation processing on the computer mainframe to obtain a heat dissipation result.

[0149] In the embodiments of the present invention, by performing heat dissipation processing on the computer mainframe based on the multi-modal heat dissipation mode, a heat dissipation result is obtained. The heat dissipation method can automatically select or adjust the heat dissipation method according to different situations, ensure that the computer mainframe maintains a stable temperature while operating efficiently, prevent damage to the system caused by excessive temperature, thereby enhancing the stability of the system and extending its service life. At the same time, it can reduce unnecessary energy consumption and improve energy utilization efficiency. The heat dissipation result refers to the effects and performance manifestations achieved after applying the multi-modal heat dissipation system, such as temperature reduction, maintaining the performance of the computer mainframe, reducing the noise level, etc.

[0150] It can be seen that in the embodiments of the present invention, by obtaining the computer mainframe to be cooled and identifying the heating elements of the computer mainframe, the total heat load and the heat source position of the computer mainframe can be determined, the heating power and distribution of the heating elements can be analyzed, and the heat dissipation requirements of the computer mainframe can be identified to help design a suitable heat dissipation system. Secondly, in the embodiments of the present invention, by identifying the types of cooling media of the heating elements and the heat dissipation elements and analyzing the medium flow performance corresponding to the types of cooling media, the performance of the heat dissipation system can be predicted and optimized to ensure the thermal stability and performance of the computer mainframe under various working conditions, so as to analyze the heat dissipation characteristics of the heat dissipation elements and ensure that the computer mainframe can maintain a stable operating temperature under various workloads and prevent system crashes or performance degradation caused by overheating. Thirdly, in the embodiments of the present invention, by analyzing the heat dissipation law of the heat dissipation elements, the heat transfer relationship between the heating elements and the heat dissipation elements can be determined according to the heat dissipation characteristics of the heating elements. Further, in the embodiments of the present invention, by monitoring the temperature data of the heating elements in real time and analyzing the temperature change trend of the heating elements, the heat generated during the operation of the computer mainframe can be obtained in real time, and the temperature change trend can be predicted to prevent hardware failures caused by overheating in advance. According to the temperature change trend and the heat transfer relationship, the multi-modal heat dissipation mode of the computer mainframe is set, integrating multiple heat dissipation technologies, flexibly adjusting the heat dissipation strategy according to the changes in the ambient temperature and system load to adapt to different working environments and extend the service life of the computer mainframe. Then, the heat dissipation intensity is dynamically adjusted according to the actual heat load to reduce unnecessary energy consumption and improve energy utilization efficiency. Finally, in the embodiments of the present invention, by performing heat dissipation processing on the computer mainframe based on the multi-modal heat dissipation mode, a heat dissipation result is obtained. The heat dissipation method can automatically select or adjust the heat dissipation method according to different situations, ensure that the computer mainframe maintains a stable temperature while operating efficiently, prevent damage to the system caused by excessive temperature, thereby enhancing the stability of the system and extending its service life. At the same time, it can reduce unnecessary energy consumption and improve energy utilization efficiency. Therefore, the heat dissipation method for realizing the computer mainframe proposed by the present invention can automatically switch the heat dissipation method according to the actual situation of the computer mainframe operation and improve the heat dissipation efficiency.

[0151] Such as Figure 2As shown, it is a system functional module diagram for implementing the heat dissipation of a computer mainframe according to the present invention.

[0152] The heat dissipation system 200 for implementing the computer mainframe according to the present invention can be installed in an electronic device. According to the implemented functions, the heat dissipation system for implementing the computer mainframe may include a heat dissipation requirement identification module 201, a heat dissipation characteristic analysis module 202, a heat transfer relationship determination module 203, a combined heat dissipation setting module 204, and a heat dissipation processing module 205. The modules in the present invention can also be referred to as units, which refer to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, and are stored in the memory of the electronic device.

[0153] In the embodiments of the present invention, the functions of each module / unit are as follows:

[0154] The heat dissipation requirement identification module 201 is used to obtain the computer mainframe to be dissipated heat, identify the heat-generating components of the computer mainframe, analyze the heat generation power and distribution of the heat-generating components, and identify the heat dissipation requirements of the computer mainframe according to the heat generation power and the distribution;

[0155] The heat dissipation characteristic analysis module 202 is used to identify the heat dissipation components of the computer mainframe according to the heat dissipation requirements, identify the cooling medium types of the heat-generating components and the heat dissipation components, analyze the medium flow performance corresponding to the cooling medium types, identify the heat source temperature of the heat-generating components, and analyze the heat dissipation characteristics of the heat dissipation components based on the heat source temperature and the medium flow performance;

[0156] The heat transfer relationship determination module 203 is used to analyze the heat dissipation law of the heat dissipation components, identify the heat factors of the heat-generating components and the heat dissipation components, and identify the heat transfer relationship of the heat factors according to the heat dissipation characteristics and the heat dissipation law;

[0157] The combined heat dissipation setting module 204 is used to monitor the temperature data of the heat-generating components in real time, analyze the temperature change trend of the heat-generating components based on the temperature data, and set the multi-modal heat dissipation mode of the computer mainframe according to the temperature change trend and the heat transfer relationship;

[0158] The heat dissipation processing module 205 is used to perform heat dissipation processing on the computer mainframe based on the multi-modal heat dissipation mode to obtain a heat dissipation result.

[0159] Specifically, each module in the heat dissipation system 200 for implementing the computer mainframe in the embodiments of the present invention uses the same technical means as those Figure 1 described in the heat dissipation method for implementing the computer mainframe, and can produce the same technical effects, which will not be elaborated here.

[0160] In addition, in each embodiment of the present invention, each functional module may be integrated into a processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit. The above integrated unit may be implemented in the form of hardware, or in the form of a combination of hardware and software functional modules.

[0161] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms.

[0162] Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be construed as limiting the claimed invention.

[0163] It should be noted that, in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0164] The above description is only a specific implementation manner of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for achieving heat dissipation of a computer host, characterized in that: The method comprises: Acquire a computer host to be cooled, identify a heating element of the computer host, analyze the heating power and distribution of the heating element, and identify the cooling requirement of the computer host according to the heating power and the distribution; According to the heat dissipation demand, the heat dissipation element of the computer host is identified, the type of cooling medium of the heat dissipation element and the heat dissipation element is identified, and the medium flow performance corresponding to the cooling medium type is analyzed, the heat source temperature of the heat dissipation element is identified, and the heat dissipation characteristics of the heat dissipation element are analyzed based on the heat source temperature and the medium flow performance; Analyze the heat dissipation law of the heat dissipation element, identify the heat factor of the heating element and the heat dissipation element, and identify the heat transfer relationship of the heat factor according to the heat dissipation characteristics and the heat dissipation law; Monitor the temperature data of the heating element in real time, analyze the temperature change trend of the heating element based on the temperature data, and set the multi-modal heat dissipation mode of the computer host according to the temperature change trend and the heat transfer relationship; Based on the multi-modal heat dissipation mode, the computer host is subjected to heat dissipation treatment to obtain a heat dissipation result.

2. The method according to claim 1, characterized in that The analyzing the heating power of the heating element includes: Identifying structural parameters and material properties of the heating element, and analyzing the heat dissipation efficiency of the heating element according to the structural parameters and material properties; Identifying the workload of the heating element; Collecting voltage parameters and current parameters of the heating element; The heating power of the heating element is analyzed according to the voltage parameter, the current parameter, the heat dissipation efficiency and the workload.

3. The method according to claim 1, characterized in that The step of identifying the heat dissipation requirement of the computer host according to the heat generation power and the distribution condition includes: According to the heating power and the distribution, identifying the hot spot area of ​​the heating element; Analyzing the heating condition of the hot spot area; Based on the heating condition, analyzing the heat flux density of the heating element; Determining a heat transfer resistance factor of the heating element according to the heat flux density; collecting the ambient temperature and the operating temperature of the heating element, and analyzing the maximum temperature limit of the heating element based on the ambient temperature and the operating temperature; The heat transfer resistance factor and the maximum temperature limit are combined to identify the heat dissipation requirements of the computer host.

4. The method according to claim 1, characterized in that: The identifying the cooling medium types of the heating element and the heat dissipation element includes: Obtaining thermal performance parameters of the heating element; Based on the thermal performance parameters, identifying the power dissipation and heat flux intensity of the heating element; Identifying a component material property of the heat dissipation component; Analyze the heat dissipation method of the heating element in combination with the power dissipation, the heat flux intensity and the material properties of the element; According to the heat dissipation mode, the cooling medium types of the heating element and the heat dissipation element are identified.

5. The method according to claim 1, characterized in that The analyzing the heat dissipation characteristics of the heat dissipation element based on the heat source temperature and the medium flow performance includes: Identifying a heating element corresponding to the heat source temperature, and determining the heat source power of the heating element; Based on the heat source power, the thermal resistance parameter of the heat dissipation element is calculated using the following formula: Wherein, R represents the thermal resistance parameter of the heat dissipation element, ΔT represents the difference between the heat source temperature corresponding to the heat dissipation element and the ambient temperature, and P represents the heat source power of the heating element corresponding to the heat dissipation element; identifying the thermal resistance requirement of the heat dissipation element according to the thermal resistance parameter and the heat source power; Extracting the heat dissipation coefficient of the heat dissipation element; Based on the heat dissipation coefficient and the thermal resistance parameter, the heat dissipation area of ​​the heat dissipation element is calculated using the following formula: Among them, S represents the heat dissipation area of ​​the heat dissipation element, P' represents the power consumption of the heating element corresponding to the heat dissipation element, k represents the heat dissipation coefficient of the heat dissipation element, T a ' represents the surface temperature of the heating element corresponding to the heat dissipation element, T b 'Indicates the ambient temperature corresponding to the heat dissipation element; Analyzing the heat exchange efficiency of the heat dissipation element according to the medium flow performance; The heat dissipation characteristics of the heat dissipation element are analyzed in combination with the thermal resistance requirement, the heat dissipation area, and the heat exchange efficiency.

6. The method according to claim 1, characterized in that The analyzing the heat dissipation rule of the heat dissipation element includes: Identifying a high-temperature heating area and a low-temperature heating area corresponding to the heat dissipation element; Analyzing the heat flow path of the heat dissipation element based on the high temperature heating area and the low temperature heating area; identifying a fluid medium of the heat dissipation element in the heat flow path; The flow velocity of the fluid medium is calculated using the following formula: Wherein, v represents the flow velocity of the fluid medium, d represents the diameter of the radiator corresponding to the fluid medium, q represents the operating speed of the radiator corresponding to the fluid medium, and r represents other influencing factors of the radiator corresponding to the fluid medium; analyzing the heat flow rate of the heat dissipation element according to the flow rate; Identifying the geometric shape of the heat dissipation element and identifying the property parameters of the flow medium; Analyzing the convective heat conduction efficiency of the heat dissipation element based on the geometric shape, the property parameter and the flow velocity; The heat dissipation law of the heat dissipation element is analyzed in combination with the heat flow path, the heat flow rate and the convection heat conduction efficiency.

7. The method according to claim 1, characterized in that The step of identifying the heat transfer relationship of the heat factor according to the heat dissipation characteristics and the heat dissipation law includes: Identify the heating element and the cooling element corresponding to the heat factor; Determining the heat distribution of the heating element and the geometric layout of the heat dissipation element; identifying a spatial distribution of the heat factor based on the heat distribution and the geometric layout; Based on the heat dissipation law and the heat dissipation law, analyzing the energy efficiency ratio of the heating element and the heat exchange efficiency of the heat dissipation element; Identifying the energy conversion efficiency of the heat factor according to the energy efficiency ratio and the heat exchange efficiency; Analyzing the thermal balance relationship between the heating element and the heat dissipation element; Extracting the temperature change corresponding to the heat factor; Analyzing the response speed of the heating element and the heat dissipation element to the temperature change; The heat transfer relationship of the heat factor is identified by combining the spatial distribution, the energy conversion efficiency, the heat balance relationship and the response speed.

8. The method according to claim 1, characterized in that The analyzing the temperature change trend of the heating element based on the temperature data includes: Performing time series analysis on the temperature data to obtain time series temperature data; identifying classification attributes of the time series temperature data; Based on the classification attributes, analyzing the factors affecting the temperature change of the heating element; Identifying the single factor temporal pattern of the temperature change influencing factor; Calculating the correlation between the single factor time pattern and the temperature change of the heating element; The temperature change trend of the heating element is analyzed according to the temperature change correlation.

9. The method according to claim 1, characterized in that: The multi-modal heat dissipation mode of the computer host is set according to the temperature change trend and the heat transfer relationship, including: Determining the thermal management requirements of the computer host according to the temperature change trend and the heat transfer relationship; Based on the thermal management requirements, define a combined heat dissipation method of the computer host; According to the combined heat dissipation mode, a polymorphic heat dissipation structure of the computer host is set; Identifying the output heat of the computer host and defining a safety threshold of the output heat; Based on the safety threshold and the thermal management requirement, setting a classification switching threshold of the combined heat dissipation mode; According to the classification switching threshold, setting a mode switching condition of the combined heat dissipation mode; The multi-mode heat dissipation mode of the computer host is set in combination with the mode switching condition, the classification switching threshold and the multi-mode heat dissipation structure.

10. A heat dissipation system for a computer host, characterized in that: The system comprises: A heat dissipation demand identification module is used to obtain a computer host to be cooled, identify a heating element of the computer host, analyze the heating power and distribution of the heating element, and identify the heat dissipation demand of the computer host according to the heating power and the distribution; a heat dissipation characteristic analysis module, for identifying the heat dissipation element of the computer host according to the heat dissipation demand, identifying the heat dissipation element and the cooling medium type of the heat dissipation element, analyzing the medium flow performance corresponding to the cooling medium type, identifying the heat source temperature of the heat dissipation element, and analyzing the heat dissipation characteristics of the heat dissipation element based on the heat source temperature and the medium flow performance; a heat transfer relationship determination module, used to analyze the heat dissipation law of the heat dissipation element, identify the heat factor of the heat-generating element and the heat dissipation element, and identify the heat transfer relationship of the heat factor according to the heat dissipation characteristics and the heat dissipation law; A combined heat dissipation setting module, used for real-time monitoring of the temperature data of the heating element, analyzing the temperature change trend of the heating element based on the temperature data, and setting the multi-modal heat dissipation mode of the computer host according to the temperature change trend and the heat transfer relationship; The heat dissipation processing module is used to perform heat dissipation processing on the computer host based on the multi-modal heat dissipation mode to obtain a heat dissipation result.

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