Method for determining equivalent parameters of micro solder joints in chip packaging

Abstract

The present invention discloses a method for determining equivalent parameters of micro-solder points in chip packaging, which relates to the technical field of "finite element numerical simulation" of semiconductor packaging. The micro-solder point area to be simulated on the chip, which contains all micro-solder points, is divided into multiple equivalent areas according to the spacing distribution law of the micro-solder points; for any equivalent area, the equivalent volume fraction of the micro-solder points and the filling material in the equivalent area is determined according to the size of the equivalent area and the size of the micro-solder points in the equivalent area; the equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent area are determined according to the equivalent volume fraction of the micro-solder points and the filling material in the equivalent area, the Poisson's ratio, elastic modulus and thermal expansion coefficient of the micro-solder points and the filling material. This method divides the micro-solder points of the chip into regions for equivalence, and subsequently simulates multiple equivalent areas through corresponding equivalent material parameters, which can ensure the accuracy of simulation calculations while improving calculation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of "finite element numerical simulation" of semiconductor packaging, and in particular to a method for determining equivalent parameters of micro solder joints in chip packaging. Background Art

[0002] With the development of microelectronics technology, 2.5D packaging is widely used in high-performance computing, AI chips, image processing and other fields.

[0003] Among them, 2.5D packaging is an advanced semiconductor packaging technology that mainly uses an interposer to achieve vertical integration of multiple chips to form a highly integrated, low-power, high-performance system. Each chip is connected to the interposer through a micro solder joint (ubump). The ubump connection not only achieves high-density interconnection, but also reduces the package volume, while improving the electrical performance of the package, and also shows high advantages in power consumption, heat dissipation and package area. Among them, in 2.5D packaging technology, micro solder joints are usually simulated to simulate the mechanical and thermal behaviors of micro solder joints under different working conditions, and then analyze their impact on chip warping, and finally predict the warping accuracy of the chip. However, due to the large number of ubumps on the chip, the number can reach hundreds of thousands, which makes the simulation calculation of the ubump area on the chip more complicated.

[0004] Therefore, there is an urgent need in the prior art for a method that can improve the simulation calculation efficiency of the micro solder joint area on the chip while ensuring the simulation accuracy. Summary of the Invention

[0005] Based on this, it is necessary to provide a method for determining the equivalent parameters of micro-solder joints in chip packaging to address the above technical problems. This method divides the micro-solder joints of the chip into regions for equivalence, and then simulates multiple equivalent regions through the corresponding equivalent elastic modulus and equivalent thermal expansion coefficient. This can ensure the accuracy of simulation calculations while improving calculation efficiency.

[0006] The present invention adopts the following technical solutions:

[0007] The present invention provides a method for determining equivalent parameters of micro solder joints in chip packaging by region, comprising:

[0008] Divide the micro solder joint area to be simulated on the chip, which contains all micro solder joints, into multiple equivalent areas according to the spacing distribution rule of the micro solder joints;

[0009] For any equivalent region, the equivalent volume fractions of the micro-solder points and the filling material in the equivalent region are determined according to the size of the equivalent region and the size of the micro-solder points in the equivalent region; the filling material is filled in the pores around the micro-solder points;

[0010] Determine the equivalent Poisson's ratio of the equivalent area according to the equivalent volume fractions of the micro-solder joints and the filling material in the equivalent area, and the Poisson's ratios of the micro-solder joints and the filling material;

[0011] The equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent area are determined based on the equivalent volume fraction of the micro-solder joint and the filling material, the Poisson's ratio, elastic modulus and thermal expansion coefficient of the micro-solder joint and the filling material, and the equivalent Poisson's ratio of the equivalent area.

[0012] Optionally, the micro solder joint area to be simulated on the chip, which includes all micro solder joints, is divided into multiple equivalent areas according to the spacing distribution rule of the micro solder joints, including:

[0013] Define multiple spacing ranges. According to the principle that the spacing between adjacent micro-solder points within the same spacing range is located in the same equivalent area, divide all micro-solder points on the micro-solder point area to be simulated from left to right and from top to bottom to obtain multiple equivalent areas.

[0014] Optionally, determining the equivalent volume fractions of the micro solder joints and the filling material in the equivalent region according to the size of the equivalent region and the size of the micro solder joints in the equivalent region includes:

[0015] Determine the volume of the equivalent region according to the size of the equivalent region, and determine the total volume of the micro-solder joints according to the size of the micro-solder joints in the equivalent region;

[0016] The ratio of the total volume of the micro-solder points to the volume of the equivalent region is determined as the equivalent volume fraction of the micro-solder points in the equivalent region;

[0017] The difference between 1 and the equivalent volume fraction of the micro solder joint in the equivalent region is determined as the equivalent volume fraction of the filling material in the equivalent region.

[0018] Optionally, the equivalent Poisson's ratio is calculated as:

[0019]

[0020] in, represents the equivalent Poisson's ratio of the ith equivalent region, and are the equivalent volume fractions of micro solder joints and filling materials in the ith equivalent region, v s and v u represent the Poisson’s ratio of the micro solder joint and the filling material, respectively.

[0021] Optionally, determining the equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent region based on the equivalent volume fractions of the micro-solder joints and the filling material, the Poisson's ratio, the elastic modulus, and the thermal expansion coefficient of the micro-solder joints and the filling material in the equivalent region, and the equivalent Poisson's ratio of the equivalent region includes:

[0022] Determine the out-of-plane thermal expansion coefficient of the equivalent area based on the equivalent volume fraction of the micro solder joint and the filling material in the equivalent area, as well as the elastic modulus and thermal expansion coefficient of the micro solder joint and the filling material;

[0023] Determine the equivalent elastic modulus of the equivalent area according to the equivalent volume fraction of the micro-solder joint and the filling material in the equivalent area, as well as the Poisson's ratio and elastic modulus of the micro-solder joint and the filling material;

[0024] The equivalent thermal expansion coefficient of the equivalent area is determined based on the equivalent volume fraction of the micro solder joint and the filling material in the equivalent area, the thermal expansion coefficient and Poisson's ratio of the micro solder joint and the filling material, and the equivalent Poisson's ratio and the out-of-plane thermal expansion coefficient.

[0025] Optionally, the out-of-plane thermal expansion coefficient is calculated as:

[0026]

[0027] Among them, α i represents the out-of-plane thermal expansion coefficient of the ith equivalent region, are the equivalent volume fractions of micro solder joints and filling materials in the ith equivalent region, E s 、E u are the elastic moduli of the micro solder joint and the filling material, α s , α u represent the thermal expansion coefficients of the micro solder joint and the filling material, respectively.

[0028] Optionally, the calculation formula of the equivalent elastic modulus is:

[0029]

[0030] in, represents the equivalent elastic modulus of the ith equivalent region, and are the equivalent volume fractions of micro solder joints and filling materials in the ith equivalent region, v s and v u are the Poisson's ratios of the micro solder joint and the filling material, E s 、E u represent the elastic moduli of the micro solder joint and the filling material, respectively.

[0031] Optionally, the calculation formula of the equivalent thermal expansion coefficient is:

[0032]

[0033] in, represents the equivalent thermal expansion coefficient of the ith equivalent region, and denote the equivalent volume fractions of micro solder joints and filling materials in the ith equivalent region, α s , α u are the thermal expansion coefficients of the micro solder joint and the filling material, v s and v u represent the Poisson’s ratio of the micro solder joint and the filling material, respectively, represents the equivalent Poisson's ratio of the i-th equivalent region, α i represents the out-of-plane thermal expansion coefficient of the i-th equivalent region.

[0034] The present invention provides a device for determining equivalent parameters of micro solder joints in chip packaging by region, comprising:

[0035] A division module is used to divide the micro-solder point area to be simulated on the chip containing all micro-solder points into multiple equivalent areas according to the spacing distribution law of the micro-solder points;

[0036] an acquisition module, configured to determine, for any equivalent region, an equivalent volume fraction of the micro-solder point and the filling material in the equivalent region according to the size of the equivalent region and the size of the micro-solder point in the equivalent region; the filling material is filled in pores around the micro-solder point;

[0037] The equivalent module is used to determine the equivalent Poisson's ratio of the equivalent area based on the equivalent volume fractions of the micro-solder joints and the filling materials in the equivalent area, as well as the Poisson's ratios of the micro-solder joints and the filling materials; and to determine the equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent area based on the equivalent volume fractions of the micro-solder joints and the filling materials, the Poisson's ratios of the micro-solder joints and the filling materials, and the equivalent Poisson's ratio of the equivalent area.

[0038] The present invention provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the method for determining equivalent parameters of micro solder joints in chip packaging is implemented.

[0039] The present invention provides a computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, the method for determining equivalent parameters of micro solder joints in chip packaging is implemented.

[0040] At least one of the above technical solutions adopted by the present invention can achieve the following beneficial effects:

[0041] In the present invention, all micro solder joints in the chip are divided into multiple equivalent areas according to the spacing distribution law, which is equivalent to combining complex individual units into several large areas. In this way, the processing of each individual unit becomes processing several areas, which greatly reduces the number of objects that need to be processed, thereby significantly improving the subsequent simulation calculation speed of the chip micro solder joints.

[0042] Furthermore, dividing the equivalent areas by the spacing distribution pattern of micro-solder points can make each equivalent area more representative in terms of physical properties, providing a reasonable basis for subsequent accurate simulation.

[0043] Moreover, for any equivalent area, the equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent area are determined according to the size of the micro-solder joint in the equivalent area, as well as the Poisson's ratio, elastic modulus and thermal expansion coefficient of the micro-solder joint and the filling material. In this way, the equivalent elastic modulus and equivalent thermal expansion coefficient of all equivalent areas can be used to accurately simulate the mechanical and thermal behaviors of the micro-solder joint in the actual working environment to a certain extent, and then analyze the warping structure of the chip, thereby improving the simulation calculation accuracy of the micro-solder joint. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0045] Figure 1 A schematic flow chart of a method for determining equivalent parameters of micro solder joints in chip packaging provided by the present invention;

[0046] Figure 2 A schematic diagram of the distribution of micro solder joint equivalent areas in a chip provided by the present invention;

[0047] Figure 3 A schematic diagram of equivalent area distribution of a global equivalent model provided by the present invention;

[0048] Figure 4 A schematic diagram of an initial model structure provided by the present invention;

[0049] Figure 5 A schematic diagram of a regional equivalent model structure provided by the present invention;

[0050] Figure 6 A schematic diagram of a global equivalent model structure provided by the present invention;

[0051] Figure 7 A schematic diagram of equivalent deformation of an initial model provided by the present invention;

[0052] Figure 8A schematic diagram of equivalent deformation of a regional equivalent model provided by the present invention;

[0053] Figure 9 A schematic diagram of equivalent deformation of a global equivalent model provided by the present invention;

[0054] Figure 10 A schematic diagram of a device for determining equivalent parameters of micro solder joints in chip packaging according to the present invention;

[0055] Figure 11 A schematic diagram of a computer device for implementing a method for determining equivalent parameters of micro solder joint regions in chip packaging provided by the present invention. DETAILED DESCRIPTION

[0056] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0057] In 2.5D packaging technology, micro-solder joint equivalent methods have attracted widespread attention. Therefore, developing a high-performance equivalent method is crucial. This paper proposes a method for determining equivalent parameters for micro-solder joints in different regions to determine the accuracy of warpage prediction. This method is not only of great significance for breaking through technical bottlenecks in the packaging field, but also helps to improve the independent research and development capabilities of domestic chip packaging and meet the actual needs of the high-end electronics industry.

[0058] The present invention aims to propose a method for determining equivalent parameters of micro solder joints in chip packaging by dividing them into regions, and to achieve high-precision equivalent parameter processing of different regions through fine regional division, so as to ensure the calculation accuracy of Warpage while improving the calculation efficiency.

[0059] The technical solutions provided by various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0060] Figure 1 The present invention is a flowchart of a method for determining equivalent parameters of micro solder joints in chip packaging by region, which specifically includes the following steps:

[0061] S101, dividing a micro solder joint area to be simulated on a chip containing all micro solder joints into a plurality of equivalent areas according to a distribution rule of spacing between micro solder joints.

[0062] Among them, the micro-solder point area to be simulated containing all micro-solder points on the chip is divided into multiple equivalent areas according to the spacing distribution law of the micro-solder points, including: defining multiple spacing ranges, and according to the principle that the micro-solder points within the same spacing range between adjacent micro-solder points are located in the same equivalent area, all micro-solder points on the micro-solder point area to be simulated are divided from left to right and from top to bottom to obtain multiple equivalent areas.

[0063] Optionally, the coordinates of each micro-solder point in the chip to be simulated can be input into the equivalent partitioning model, and the spacing distribution pattern of the micro-solder points in the chip to be simulated is analyzed by the equivalent partitioning model to obtain multiple spacing ranges. Based on the principle that the spacing between adjacent micro-solder points and the micro-solder points within the same spacing range are located in the same equivalent area, multiple equivalent areas are obtained; that is, the micro-solder points with the same or similar spacing between adjacent micro-solder points in the chip to be simulated are divided into the same equivalent area.

[0064] In an exemplary embodiment, an initial chip model is established: an initial chip model (chip to be simulated) is established in the simulation software ANSYS, the model including the main chip and 540 micro solder joints, and the filling material covering the micro solder joints; a regional equivalent model is established: the 540 micro solder joints are divided into 5 equivalent regions according to the distribution pattern between their spacing, from left to right and from top to bottom, as equivalent region 1 to equivalent region 5, as shown in FIG. Figure 2 shown.

[0065] S102, for any equivalent region, determining the equivalent volume fractions of the micro-solder points and the filling material in the equivalent region according to the size of the equivalent region and the size of the micro-solder points in the equivalent region; the filling material is filled in the pores around the micro-solder points.

[0066] Among them, according to the size of the equivalent region and the size of the micro-solder joints in the equivalent region, the equivalent volume fractions of the micro-solder joints and the filling material in the equivalent region are determined, including: determining the volume of the equivalent region according to the size of the equivalent region, and determining the total volume of the micro-solder joints according to the size of the micro-solder joints in the equivalent region; determining the ratio of the total volume of the micro-solder joints to the volume of the equivalent region as the equivalent volume fraction of the micro-solder joints in the equivalent region; and determining the difference between 1 and the equivalent volume fraction of the micro-solder joints in the equivalent region as the equivalent volume fraction of the filling material in the equivalent region in the equivalent region.

[0067] Specifically, the equivalent volume fractions of micro-solder joints and filling materials in the equivalent area are calculated as follows:

[0068]

[0069] in, represents the equivalent volume fraction of the micro solder joint in the equivalent region in the i-th equivalent region, represents the total volume of the micro solder joint in the ith equivalent region, V i represents the volume of the i-th equivalent region, represents the equivalent volume fraction of the filling material in the equivalent region in the i-th equivalent region.

[0070] S103 , determining an equivalent Poisson's ratio of the equivalent region according to the equivalent volume fractions of the micro-solder joints and the filling material in the equivalent region, and the Poisson's ratios of the micro-solder joints and the filling material.

[0071] The calculation formula of the equivalent Poisson's ratio is:

[0072]

[0073] in, represents the equivalent Poisson's ratio of the ith equivalent region, and are the equivalent volume fractions of the micro solder joint and the filling material in the ith equivalent region, v s and v u represent the Poisson’s ratio of the micro solder joint and the filling material, respectively.

[0074] S104 , determining an equivalent elastic modulus and an equivalent thermal expansion coefficient of the equivalent region based on the equivalent volume fractions of the micro solder joints and the filling material, the Poisson's ratio, the elastic modulus, and the thermal expansion coefficient of the micro solder joints and the filling material, and the equivalent Poisson's ratio of the equivalent region.

[0075] Specifically, the out-of-plane thermal expansion coefficient of the equivalent region is determined based on the equivalent volume fractions of the micro-solder joints and the filling material in the equivalent region, as well as the elastic modulus and thermal expansion coefficient of the micro-solder joints and the filling material;

[0076] Determine the equivalent elastic modulus of the equivalent area according to the equivalent volume fraction of the micro-solder joint and the filling material in the equivalent area, as well as the Poisson's ratio and elastic modulus of the micro-solder joint and the filling material;

[0077] The equivalent thermal expansion coefficient of the equivalent area is determined based on the equivalent volume fraction of the micro solder joint and the filling material in the equivalent area, the thermal expansion coefficient and Poisson's ratio of the micro solder joint and the filling material, and the equivalent Poisson's ratio and the out-of-plane thermal expansion coefficient.

[0078] The calculation formula for the out-of-plane thermal expansion coefficient is:

[0079]

[0080] Among them, α i represents the out-of-plane thermal expansion coefficient of the ith equivalent region, E s 、E u are the elastic moduli of the micro solder joint and the filling material, αs , α u represent the thermal expansion coefficients of the micro solder joint and the filling material, respectively.

[0081] The calculation formula of equivalent elastic modulus is:

[0082]

[0083] in, represents the equivalent elastic modulus of the ith equivalent region.

[0084] The calculation formula for the equivalent thermal expansion coefficient is:

[0085]

[0086] in, represents the equivalent thermal expansion coefficient of the ith equivalent region.

[0087] In an exemplary embodiment, the equivalent fraction of the total volume of the micro-solder joints contained in each equivalent region to the total volume of the equivalent region is calculated, and then, according to the different equivalent regions divided, based on the known elastic modulus, thermal expansion coefficient, Poisson's ratio and other material parameters of the micro-solder joints and filling materials in the initial model, the corresponding equivalent parameters are calculated using formulas (2)-(5) to perform deformation simulation.

[0088] To verify the effectiveness of the proposed method, simulated deformation analysis can be performed on the initial model, the regional equivalent model, and the global equivalent model. The initial model is then used as a benchmark to compare the results of the regional equivalent model and the global equivalent model.

[0089] First, fixed constraints are imposed on the main chip to ensure the stability of the simulation results. Then, the working environment of the chip is simulated, and thermal expansion loads are applied to simulate deformation. The deformation distribution of the three models in the overall and chip surface is analyzed.

[0090] Then, by comparing the regional equivalent model with the initial model, the difference in deformation amplitude between the regional model and the initial model is analyzed to verify whether the regional equivalent idea can effectively characterize the Warpage deformation performance of the initial model; by comparing the global equivalent model with the initial model, the accuracy difference in simulation results between the global equivalent model and the initial model is compared. The superiority of the regional equivalent method in Warpage prediction is evaluated by the difference in the results of the two comparisons. Among them, the global equivalent model means that all micro solder joints in the chip are regarded as one equivalent region as a whole, such as Figure 3 shown.

[0091] Finally, combined with the comparison results, the proposed method is evaluated for its balance between model simplification and computational accuracy, providing a reference for further optimization. If the deformation simulation results of the regional equivalent model can better reproduce the behavior of the initial model, it proves that the proposed regional equivalent concept is reasonable.

[0092] Specifically, taking the ubump model in 2.5D packaging and the corresponding regional equivalent model and global equivalent model as examples, the modeling structure is as follows: Figures 4 to 6 As shown, Figure 4 is a schematic diagram of the initial model structure. Figure 5 is a schematic diagram of the regional equivalent model structure. Figure 6 It is a schematic diagram of the global equivalent model structure. The parameters of the three model structures are shown in Tables 1 to 3. Table 1 is the initial model structure parameters, Table 2 is the regional equivalent model structure parameters, and Table 3 is the global equivalent model structure parameters.

[0093] Table 1

[0094]

[0095] Table 2

[0096]

[0097] Table 3

[0098]

[0099] The study simulated the deformation of the initial model, the regional equivalent model, and the global equivalent model as a whole and on the upper surface, fixed the main chip through the equivalent region, and compared the simulated deformation results of the regional equivalent model and the global equivalent model with the simulated deformation results of the initial model in turn to achieve high-precision prediction of Warpage. The ambient temperature for the simulated deformation was set to 260°C, the fixed support was the four corners of the bottom of the model, and the thermal condition was 25°C. The simulation results are as follows Figures 7 to 9 shown.

[0100] from Figures 7 to 9 It can be seen that the simulated deformation results of the regional equivalent model are well consistent with the simulated deformation results of the initial model, indicating that the regional equivalent model algorithm is reasonable and reliable in predicting Warpage; through the difference between the results of the initial model and the regional equivalent model, and the initial model and the global equivalent model, it can be seen that the simulated deformation results of the regional equivalent model are better than those of the global equivalent model, indicating that the regional equivalent model algorithm is more accurate than the global equivalent model algorithm and can better predict Warpage.

[0101] When applying the method for determining equivalent parameters of micro solder joints in chip packaging provided by the present invention, it is not necessary to use Figure 1 The steps are executed in the order shown. The specific execution order of the steps can be determined according to needs, and the present invention does not limit this.

[0102] The above is a method for determining equivalent parameters of micro solder joints in chip packages by region provided by one or more embodiments of the present invention. Based on the same idea, the present invention also provides a corresponding device for determining equivalent parameters of micro solder joints in chip packages by region, such as Figure 10 shown.

[0103] Figure 10 Schematic diagram of a device for determining equivalent parameters of micro solder joints in chip packaging according to the present invention. The device 1000 includes:

[0104] A division module 1001 is configured to divide the micro-solder point area to be simulated on the chip, which includes all micro-solder points, into a plurality of equivalent areas according to the spacing distribution rule of the micro-solder points;

[0105] An acquisition module 1002 is configured to determine, for any equivalent region, an equivalent volume fraction of the micro-solder point and the filling material in the equivalent region based on the size of the equivalent region and the size of the micro-solder point in the equivalent region; the filling material is filled in pores around the micro-solder point;

[0106] The equivalent module 1003 is used to determine the equivalent Poisson's ratio of the equivalent area based on the equivalent volume fractions of the micro-solder joints and the filling materials in the equivalent area, as well as the Poisson's ratios of the micro-solder joints and the filling materials; and to determine the equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent area based on the equivalent volume fractions of the micro-solder joints and the filling materials in the equivalent area, the Poisson's ratios of the micro-solder joints and the filling materials, the elastic modulus and the thermal expansion coefficient of the micro-solder joints and the filling materials, and the equivalent Poisson's ratio of the equivalent area.

[0107] The specific definitions of the device for determining equivalent parameters of micro-solder joints by region in a chip package can be found in the aforementioned definitions of the method for determining equivalent parameters of micro-solder joints by region in a chip package and are not further elaborated here. Each module in the device for determining equivalent parameters of micro-solder joints by region in a chip package can be implemented in whole or in part via software, hardware, or a combination thereof. Each of these modules can be embedded in or independent of a processor in a computer device in hardware form, or stored in a computer device memory in software form, so that the processor can call and execute the corresponding operations of each module.

[0108] The present invention also provides a computer-readable storage medium, which stores a computer program, which can be used to execute the above Figure 1 A method for determining equivalent parameters of micro solder joints in chip packaging is provided.

[0109] The present invention also provides Figure 11 The structural diagram of the computer equipment shown in FIG. Figure 11 As shown in the figure, at the hardware level, the computer device includes a processor, an internal bus, a network interface, a memory, and a non-volatile memory. Of course, it may also include other hardware required for the business. The processor reads the corresponding computer program from the non-volatile memory into the memory and then runs it to achieve the above Figure 1 A method for determining equivalent parameters of micro solder joints in chip packaging is provided.

[0110] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided by the present invention can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0111] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present invention.

Claims

1. A method for determining equivalent parameters of micro solder joints in chip packaging, characterized in that: The method comprises: Divide the micro solder joint area to be simulated on the chip, which contains all micro solder joints, into multiple equivalent areas according to the spacing distribution rule of the micro solder joints; For any equivalent region, determining the equivalent volume fractions of the micro-solder points and the filling material in the equivalent region according to the size of the equivalent region and the size of the micro-solder points in the equivalent region; the filling material is filled in the pores around the micro-solder points; Determine the equivalent Poisson's ratio of the equivalent area according to the equivalent volume fractions of the micro-solder joints and the filling material in the equivalent area, and the Poisson's ratios of the micro-solder joints and the filling material; The equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent area are determined based on the equivalent volume fraction of the micro-solder joint and the filling material, the Poisson's ratio, elastic modulus and thermal expansion coefficient of the micro-solder joint and the filling material, and the equivalent Poisson's ratio of the equivalent area.

2. The method according to claim 1, characterized in that The method of dividing the micro solder joint area to be simulated on the chip containing all micro solder joints into multiple equivalent areas according to the spacing distribution rule of the micro solder joints includes: Define multiple spacing ranges. According to the principle that the spacing between adjacent micro-solder points within the same spacing range is located in the same equivalent area, divide all micro-solder points on the micro-solder point area to be simulated from left to right and from top to bottom to obtain multiple equivalent areas.

3. The method according to claim 1, characterized in that Determining the equivalent volume fractions of the micro solder joints and the filling material in the equivalent region according to the size of the equivalent region and the size of the micro solder joints in the equivalent region includes: Determine the volume of the equivalent region according to the size of the equivalent region, and determine the total volume of the micro-solder joints according to the size of the micro-solder joints in the equivalent region; The ratio of the total volume of the micro-solder points to the volume of the equivalent region is determined as the equivalent volume fraction of the micro-solder points in the equivalent region; The difference between 1 and the equivalent volume fraction of the micro solder joint in the equivalent region is determined as the equivalent volume fraction of the filling material in the equivalent region.

4. The method according to claim 1, wherein The calculation formula of the equivalent Poisson's ratio is: in, represents the equivalent Poisson's ratio of the ith equivalent region, and are the equivalent volume fractions of micro solder joints and filling materials in the ith equivalent region, v s and v u represent the Poisson’s ratio of the micro solder joint and the filling material, respectively.

5. The method according to claim 1, wherein Determining the equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent region based on the equivalent volume fraction of the micro solder joint and the filling material in the equivalent region, the Poisson's ratio, the elastic modulus and the thermal expansion coefficient of the micro solder joint and the filling material, and the equivalent Poisson's ratio of the equivalent region includes: Determine the out-of-plane thermal expansion coefficient of the equivalent area based on the equivalent volume fraction of the micro solder joint and the filling material in the equivalent area, as well as the elastic modulus and thermal expansion coefficient of the micro solder joint and the filling material; Determine the equivalent elastic modulus of the equivalent area according to the equivalent volume fraction of the micro-solder joint and the filling material in the equivalent area, as well as the Poisson's ratio and elastic modulus of the micro-solder joint and the filling material; The equivalent thermal expansion coefficient of the equivalent area is determined based on the equivalent volume fraction of the micro solder joint and the filling material in the equivalent area, the thermal expansion coefficient and Poisson's ratio of the micro solder joint and the filling material, and the equivalent Poisson's ratio and the out-of-plane thermal expansion coefficient.

6. The method according to claim 5, characterized in that The calculation formula of the out-of-plane thermal expansion coefficient is: Among them, α i represents the out-of-plane thermal expansion coefficient of the ith equivalent region, are the equivalent volume fractions of micro solder joints and filling materials in the ith equivalent region, E s 、E u are the elastic moduli of the micro solder joint and the filling material, α s , α u represent the thermal expansion coefficients of the micro solder joint and the filling material, respectively.

7. The method according to claim 5, characterized in that The calculation formula of the equivalent elastic modulus is: in, represents the equivalent elastic modulus of the ith equivalent region, and are the equivalent volume fractions of micro solder joints and filling materials in the ith equivalent region, v s and v u are the Poisson's ratios of the micro solder joint and the filling material, E s 、E u represent the elastic moduli of the micro solder joint and the filling material, respectively.

8. The method according to claim 5, characterized in that The calculation formula of the equivalent thermal expansion coefficient is: in, represents the equivalent thermal expansion coefficient of the ith equivalent region, and denote the equivalent volume fractions of micro solder joints and filling materials in the ith equivalent region, α s , α u are the thermal expansion coefficients of the micro solder joint and the filling material, v s and v u represent the Poisson’s ratio of the micro solder joint and the filling material, respectively, represents the equivalent Poisson's ratio of the i-th equivalent region, α i represents the out-of-plane thermal expansion coefficient of the i-th equivalent region.

9. A device for determining equivalent parameters of micro solder joints in chip packaging, characterized in that: include: A division module is used to divide the micro-solder point area to be simulated on the chip containing all micro-solder points into multiple equivalent areas according to the spacing distribution law of the micro-solder points; an acquisition module, configured to determine, for any equivalent region, an equivalent volume fraction of the micro-solder point and the filling material in the equivalent region according to the size of the equivalent region and the size of the micro-solder point in the equivalent region; the filling material is filled in pores around the micro-solder point; The equivalent module is used to determine the equivalent Poisson's ratio of the equivalent area based on the equivalent volume fractions of the micro-solder joints and the filling materials in the equivalent area, as well as the Poisson's ratios of the micro-solder joints and the filling materials; and to determine the equivalent elastic modulus and equivalent thermal expansion coefficient of the equivalent area based on the equivalent volume fractions of the micro-solder joints and the filling materials, the Poisson's ratios of the micro-solder joints and the filling materials, and the equivalent Poisson's ratio of the equivalent area.

10. A computer-readable storage medium, characterized in that The storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 8 is implemented.

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