Printed circuit board production environment monitoring management method, device, equipment and medium

Abstract

The invention relates to a printed circuit board production environment monitoring management method, device and equipment and a medium, and is applied to the technical field of printed circuit board production, and the method comprises the steps: obtaining environment monitoring data, electrostatic monitoring data, video monitoring data and the production type of a circuit board; determining a monitoring data threshold based on the production type; determining first abnormal information based on the environment monitoring data and the monitoring data threshold; determining second abnormal information based on the monitoring data threshold, the static monitoring data and the video monitoring data; and determining an environment management strategy based on the first abnormal information and the second abnormal information. The method has the effect of improving the efficiency and reliability of monitoring and managing the production environment of the printed circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board production, and in particular, to a method, device, equipment and medium for monitoring and managing the production environment of printed circuit boards. Background Art

[0002] Printed circuit boards (PCBs) are an important part of modern electronic products and are widely used in various electronic devices. With the progress of technology and the growth of market demand, the production process of PCBs has become increasingly complex and refined. In order to ensure product quality and production efficiency, the monitoring and management of the production environment have become particularly important.

[0003] Currently, the environmental monitoring systems on the market mainly include manual detection methods and semi-automatic detection methods. Manual detection is usually carried out by staff carrying portable detection equipment to regularly inspect the workshop environment. Although this method has a low cost, due to many human factors, it is easy to cause problems such as inaccurate data collection and lagging response. Semi-automatic detection monitors a certain environmental factor in a specific area through a fixed single-function sensor, mostly for single-dimensional data collection, lacking comprehensive analysis capabilities, unable to comprehensively reflect the overall situation of the production environment. At the same time, the handling of abnormal situations often relies on manual judgment, with a slow response speed and easy to make mistakes. Summary of the Invention

[0004] In order to improve the efficiency and reliability of monitoring and managing the production environment of printed circuit boards, the present application provides a method, device, equipment and medium for monitoring and managing the production environment of printed circuit boards.

[0005] In a first aspect, the present application provides a method for monitoring and managing the production environment of printed circuit boards, adopting the following technical solutions: A method for monitoring and managing the production environment of printed circuit boards, comprising: Obtaining environmental monitoring data, static electricity monitoring data, video monitoring data, and the production type of the circuit board; Determining a monitoring data threshold based on the production type; Determining first abnormal information based on the environmental monitoring data and the monitoring data threshold; Determining second abnormal information based on the monitoring data threshold, the static electricity monitoring data, and the video monitoring data; Determining an environmental management strategy based on the first abnormal information and the second abnormal information.

[0006] By adopting the above technical solutions, through comprehensively considering environmental monitoring data, electrostatic monitoring data, and video monitoring data, it is possible to achieve comprehensive and accurate monitoring of the production environment. By dynamically adjusting the monitoring data thresholds according to different production types, the reliability of environmental monitoring is improved. By automatically formulating environmental management strategies based on the first abnormal information and the second abnormal information, the efficiency of environmental management is improved. In summary, the efficiency and reliability of the monitoring and management of the printed circuit board production environment are improved.

[0007] Optionally, determining the monitoring data threshold based on the production type includes: Obtain historical production information, where the historical production information includes historical production type, historical monitoring data, and circuit board quality inspection data; Based on the historical production type, divide the historical production information into multiple historical production combinations, and each historical production combination corresponds to one historical production type; Analyze the circuit board quality inspection data and the historical monitoring data in each historical production combination to obtain the corresponding relationship between each historical production type and the monitoring data threshold; Based on the production type and the corresponding relationship, determine the monitoring data threshold of the circuit board.

[0008] By adopting the above technical solutions, when dynamically determining the monitoring data thresholds of printed circuit boards of different production types, the circuit board quality inspection data is considered, thereby improving the reliability of the monitoring data thresholds.

[0009] Optionally, determining the second abnormal information based on the monitoring data threshold, the electrostatic monitoring data, and the video monitoring data includes: If the electrostatic monitoring data exceeds the monitoring data threshold, obtain the physical data of the production area; Construct a three-dimensional model of the production area based on finite element software; Based on the electrostatic monitoring data and the three-dimensional model, determine a three-dimensional electric field distribution model; Based on the three-dimensional electric field distribution model, determine the charge position; Based on the charge position, the electrostatic monitoring data, the monitoring data threshold, and the video monitoring data, determine the second abnormal information.

[0010] By adopting the above technical solutions, construct a three-dimensional model of the production area according to finite element software, and combine the three-dimensional model and the electrostatic monitoring data through finite element software to obtain a three-dimensional electric field distribution model of the production area. Determine the charge position through the three-dimensional electric field distribution model, improve the accuracy of the charge position, and thus improve the reliability of the second abnormal information.

[0011] Optionally, determining the second abnormal information based on the charge position, the electrostatic monitoring data, the monitoring data threshold, and the video monitoring data includes: Determining an abnormal position image based on the video monitoring data and the charge position; Identifying the abnormal type from the abnormal position image; Determining the abnormal device or abnormal personnel based on the abnormal position image and the abnormal type; Determining the second abnormal information based on the charge position, the electrostatic monitoring data, the monitoring data threshold, the abnormal device, and the abnormal personnel.

[0012] By adopting the above technical solution, through the image recognition technology, the abnormal type, abnormal device, and abnormal personnel can be quickly and accurately identified, thereby improving the efficiency of determining the second abnormal information.

[0013] Optionally, determining the environmental management strategy based on the first abnormal information and the second abnormal information includes: Determining the abnormal type and the abnormal position based on the first abnormal information and the second abnormal information; Determining the abnormal adjustment strategy based on the abnormal type and the abnormal position; Generating an adjustment instruction based on the abnormal adjustment strategy; Calculating the environmental adjustment period based on the generation time of the adjustment instruction and the preset adjustment duration; Obtaining the adjustment monitoring data, where the adjustment monitoring data includes the environmental monitoring data, the electrostatic monitoring data, and the video monitoring data after the generation of the adjustment instruction; Determining the environmental management strategy based on the environmental adjustment period, the adjustment monitoring data, and the abnormal adjustment strategy.

[0014] By adopting the above technical solution, automatically determining the abnormal adjustment strategy according to the abnormal type and the abnormal position improves the speed of abnormal response, sets the environmental adjustment period for the abnormal adjustment strategy, and thus can timely discover problems existing in the abnormal adjustment strategy.

[0015] Optionally, determining the environmental management strategy based on the environmental adjustment period, the adjustment monitoring data, and the abnormal adjustment strategy includes: Judging whether there is still an abnormality when the environmental adjustment period is reached based on the adjustment monitoring data and the monitoring data threshold; If there is still an abnormality when the environmental adjustment period is reached, generating a warning message based on the adjustment monitoring data corresponding to the environmental adjustment period; Determine an environmental management strategy based on the warning information and the abnormal adjustment strategy.

[0016] By adopting the above technical solution, if there are still abnormalities when the environmental adjustment deadline arrives, a warning information is generated, so that the staff can handle the abnormalities in time.

[0017] Optionally, after determining the environmental management strategy based on the first abnormal information and the second abnormal information, the method further includes: Obtain the abnormal conditions in the circuit board production process, where the abnormal conditions include the abnormal type and the number of abnormalities; Determine the quality inspection type based on the abnormal type; Determine the quality inspection ratio adjustment coefficient based on the number of abnormalities; Obtain the circuit board information; Determine the quality inspection information based on the circuit board information, where the quality inspection information includes the quality inspection type and the quality inspection ratio corresponding to each quality inspection type; Calculate the quality inspection quantity based on the quality inspection ratio adjustment coefficient, the quality inspection ratio and the production quantity; Determine the quality inspection strategy based on the quality inspection quantity and the quality inspection type.

[0018] By adopting the above technical solution, different ratio adjustment coefficients are set according to different abnormal conditions in the circuit board production process, so as to determine different quality inspection quantities, improve the reliability of quality inspection, and thus improve the quality of the printed circuit boards leaving the factory.

[0019] In a second aspect, the present application provides a printed circuit board production environment monitoring and management device, adopting the following technical solution: A printed circuit board production environment monitoring and management device, comprising: A monitoring data acquisition module, configured to acquire environmental monitoring data, static electricity monitoring data, video monitoring data, and the production type of the circuit board; A monitoring threshold determination module, configured to determine a monitoring data threshold based on the production type; A first abnormality determination module, configured to determine first abnormal information based on the environmental monitoring data and the monitoring data threshold; A second abnormality determination module, configured to determine second abnormal information based on the monitoring data threshold, the static electricity monitoring data, and the video monitoring data; A management strategy determination module, configured to determine an environmental management strategy based on the first abnormal information and the second abnormal information.

[0020] By adopting the above technical solutions, by comprehensively considering environmental monitoring data, static electricity monitoring data, and video monitoring data, it is possible to achieve comprehensive and accurate monitoring of the production environment. By dynamically adjusting the monitoring data threshold according to different production types, the reliability of environmental monitoring is improved. By automatically formulating environmental management strategies based on the first abnormal information and the second abnormal information, the efficiency of environmental management is improved. In summary, the efficiency and reliability of the monitoring and management of the printed circuit board production environment are improved.

[0021] In a third aspect, the present application provides an electronic device, adopting the following technical solutions: An electronic device includes a processor, and the processor is coupled with a memory; A computer program capable of being loaded and executed by the processor for the printed circuit board production environment monitoring and management method according to any one of the first aspects is stored on the memory.

[0022] In a fourth aspect, the present application provides a computer-readable storage medium, adopting the following technical solutions: A computer-readable storage medium stores a computer program capable of being loaded and executed by the processor for the printed circuit board production environment monitoring and management method according to any one of the first aspects. Description of the Drawings

[0023] Figure 1 is a schematic flowchart of a printed circuit board production environment monitoring and management method provided by an embodiment of the present application.

[0024] Figure 2 is a structural block diagram of a printed circuit board production environment monitoring and management device provided by an embodiment of the present application.

[0025] Figure 3 is a structural block diagram of an electronic device provided by an embodiment of the present application. Detailed Embodiments

[0026] The following further describes the present application in detail with reference to the drawings.

[0027] The embodiment of the present application provides a printed circuit board production environment monitoring and management method. The printed circuit board production environment monitoring and management method can be executed by an electronic device. The electronic device can be a server or a terminal device. The server can be an independent physical server, a server cluster or a distributed system composed of multiple physical servers, or a cloud server providing cloud computing services. The terminal device can be a smart phone, a tablet computer, a desktop computer, etc., but is not limited thereto.

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Apparently, the described embodiments are some, but not all, of the embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the scope of protection of this application.

[0029] In addition, the term "or" in this document merely describes the association relationship of associated objects and indicates that there can be three relationships. For example, A or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally represents an "or" relationship between the associated objects before and after, unless otherwise specified.

[0030] As Figure 1 shown, a method for monitoring and managing the production environment of a printed circuit board, the main process of this method is described as follows (Steps S101 to S105): Step S101, obtain environmental monitoring data, static electricity monitoring data, video monitoring data, and the production type of the circuit board.

[0031] A variety of environmental monitoring devices, charge monitoring devices, and video monitoring devices are installed in the production area of the printed circuit board. The environmental monitoring devices include, but are not limited to, temperature sensors, humidity sensors, smoke sensors, dust particle sensors, dust sensors, etc. Obtain environmental monitoring data from the environmental monitoring devices. The charge monitoring device can be a charge sensor or other devices for detecting charge, and no specific limitation is made here. Obtain static electricity monitoring data from the charge monitoring device. The video monitoring device can be a camera, and obtain video monitoring data from the video monitoring device.

[0032] Different types of printed circuit boards have different requirements for the production environment. Obtain the production type of the circuit board from the staff.

[0033] Step S102, determine the monitoring data threshold based on the production type.

[0034] Specifically, determining the monitoring data threshold based on the production type includes: obtaining historical production information, where the historical production information includes historical production type, historical monitoring data, and circuit board quality inspection data; dividing the historical production information into multiple historical production combinations based on the historical production type, and each historical production combination corresponds to a historical production type; analyzing the circuit board quality inspection data and historical monitoring data in each historical production combination to obtain the corresponding relationship between each historical production type and the monitoring data threshold; determining the monitoring data threshold of the circuit board based on the production type and the corresponding relationship.

[0035] In this embodiment, historical production information is obtained from a database. Historical production information with the same historical production type is divided into a historical production combination, and multiple historical production combinations are obtained. The circuit board quality inspection data includes qualified inspection and unqualified inspection. The historical monitoring data corresponding to the unqualified circuit board quality inspection data does not meet the monitoring data threshold, and the historical monitoring data corresponding to the qualified circuit board quality inspection data meets the monitoring data threshold. The circuit board quality inspection data and the historical monitoring data in each historical production combination are analyzed through a data analysis tool to obtain the corresponding relationship between each historical production type and the monitoring data threshold. The monitoring data threshold of the circuit board is found from the corresponding relationship according to the production type. Among them, the data analysis tool can be Excel, Python, or SQL.

[0036] Step S103: Determine the first abnormal information based on the environmental monitoring data and the monitoring data threshold.

[0037] Compare the environmental monitoring data with the corresponding monitoring data threshold, determine the abnormal environmental data as the environmental monitoring data that does not meet the monitoring data threshold. If there is abnormal environmental data, determine the position corresponding to the abnormal environmental data as the abnormal position, and jointly determine the abnormal environmental data, the abnormal position, the abnormal type of the abnormal environmental data (such as temperature abnormality, humidity abnormality, etc.) and the corresponding monitoring data threshold as the first abnormal information.

[0038] Step S104: Determine the second abnormal information based on the monitoring data threshold, the static electricity monitoring data, and the video monitoring data.

[0039] Specifically, determining the second abnormal information based on the monitoring data threshold, the static electricity monitoring data, and the video monitoring data includes: if the static electricity monitoring data exceeds the monitoring data threshold, obtain the physical data of the production area; construct a three-dimensional model of the production area based on finite element software; determine a three-dimensional electric field distribution model based on the static electricity monitoring data and the three-dimensional model; determine the charge position based on the three-dimensional electric field distribution model; determine the second abnormal information based on the charge position, the static electricity monitoring data, the monitoring data threshold, and the video monitoring data.

[0040] In this embodiment, if the electrostatic monitoring data exceeds the corresponding monitoring data threshold, physical data of the production area is obtained from a database or from a staff member, and the physical data is used to construct a three-dimensional model of the production area through finite element software. The finite element software can be LUSAS, or ANSYS, or MSC.Nastran. The electrostatic monitoring data is used to obtain the electric field distribution through the finite element software, and the electric field distribution is combined with the three-dimensional model to form a three-dimensional electric field distribution model of the production area. The position where the charge is located, that is, the charge position, which is also the abnormal position, is determined from the three-dimensional electric field distribution model of the electric field distribution. The second abnormal information is determined according to the charge position, the electrostatic monitoring data, the monitoring data threshold, and the video monitoring data.

[0041] More specifically, determining the second abnormal information based on the charge position, the electrostatic monitoring data, the monitoring data threshold, and the video monitoring data includes: determining an abnormal position image based on the video monitoring data and the charge position; identifying the abnormal type from the abnormal position image; determining the abnormal device or abnormal person based on the abnormal position image and the abnormal type; and determining the second abnormal information based on the charge position, the electrostatic monitoring data, the monitoring data threshold, the abnormal device, and the abnormal person.

[0042] In this embodiment, the correspondence between the video monitoring device and the shooting area is obtained from the database, and the video monitoring device that can capture the charge position is determined according to the correspondence. The video monitoring data corresponding to this video monitoring device is determined as abnormal video data, the moment when the electrostatic monitoring data is obtained is determined as the abnormal moment, and the image frame corresponding to the abnormal moment in the abnormal video data is intercepted as the abnormal position image.

[0043] The abnormal type is obtained by identifying the abnormal position image through a machine learning model. The abnormal type includes device abnormality (that is, there is no person in the abnormal position image, and the static electricity is caused by the device) and personnel abnormality (that is, there is a person in the abnormal position image, and the static electricity is caused by the unqualified wearing of the anti-static equipment by the staff member). The abnormal position image is further identified through the machine learning model. If the abnormal type is device abnormality, the abnormal device is identified. If the abnormal type is personnel abnormality, the abnormal person is identified. The charge position, the electrostatic monitoring data, the monitoring data threshold, the abnormal device, and the abnormal person are jointly determined as the second abnormal information. The machine learning model can be a convolutional neural network model or an MLP-Mixer model, and no specific limitation is made here.

[0044] Step S105: Determine an environmental management strategy based on the first abnormal information and the second abnormal information.

[0045] Determine the environmental management strategy by comprehensively considering the first abnormal information and the second abnormal information, so that the environmental management strategy can simultaneously solve the abnormalities corresponding to the first abnormal information and the second abnormal information.

[0046] Specifically, determining the environmental management strategy based on the first abnormal information and the second abnormal information includes: determining the abnormal type and abnormal location based on the first abnormal information and the second abnormal information; determining the abnormal adjustment strategy based on the abnormal type and abnormal location; generating an adjustment instruction based on the abnormal adjustment strategy; calculating the environmental adjustment period based on the generation time of the adjustment instruction and the preset adjustment duration; obtaining the adjustment monitoring data, where the adjustment monitoring data includes the environmental monitoring data, static electricity monitoring data, and video monitoring data after the generation of the adjustment instruction; and determining the environmental management strategy based on the environmental adjustment period, the adjustment monitoring data, and the abnormal adjustment strategy.

[0047] In this embodiment, find the abnormal type and abnormal location from the first abnormal information and the second abnormal information. There may be multiple abnormal types and abnormal locations. One abnormal location may have multiple abnormal types, and one abnormal type may also exist in multiple abnormal locations. The database stores the correspondence between the abnormal type and the abnormal adjustment method. For example: if the abnormal type is temperature abnormality, the abnormal adjustment method is to start the temperature adjustment device. Obtain the abnormal adjustment method corresponding to the current abnormal type from the database. The abnormal adjustment strategy is to adjust the abnormality at the abnormal location according to the abnormal adjustment method corresponding to the abnormal type. Generate an adjustment instruction for the corresponding adjustment device according to the abnormal adjustment method in the abnormal adjustment strategy, and immediately send the adjustment instruction to the corresponding adjustment device. The environmental adjustment period = the generation time of the adjustment instruction + the preset adjustment duration (pre-set, not specifically limited here). Real-time obtain the environmental monitoring data, static electricity monitoring data, and video monitoring data after the generation of the adjustment instruction, that is, real-time obtain the adjustment monitoring data, and determine the environmental management strategy according to the environmental adjustment period, the adjustment monitoring data, and the abnormal adjustment strategy.

[0048] More specifically, determining the environmental management strategy based on the environmental adjustment period, the adjustment monitoring data, and the abnormal adjustment strategy includes: judging whether there is still an abnormality when the environmental adjustment period is reached based on the adjustment monitoring data and the monitoring data threshold; if there is still an abnormality when the environmental adjustment period is reached, generating a warning message based on the adjustment monitoring data corresponding to the environmental adjustment period; and determining the environmental management strategy based on the warning message and the abnormal adjustment strategy.

[0049] In this embodiment, after obtaining the adjustment monitoring data, it is determined in real time according to the above determination methods of the first abnormal information and the second abnormal information whether there is still an abnormality, and whether the moment when there is no abnormality is before the environmental adjustment period, that is, when the environmental adjustment period is reached, whether the abnormality is resolved. If there is still an abnormality when the environmental adjustment period is reached, it means that the abnormal adjustment strategy cannot resolve the abnormality within the preset adjustment duration. A warning message is generated and sent to the corresponding staff so that the staff can process the abnormality as soon as possible. The warning message includes the adjustment monitoring data when the environmental adjustment period is reached. The environmental management strategy includes automatically making abnormal adjustments according to the abnormal adjustment strategy and generating a warning message to enable the staff to process the abnormality as soon as possible.

[0050] Specifically, after determining the environmental management strategy based on the first abnormal information and the second abnormal information, the method further includes: obtaining the abnormal conditions during the production process of the circuit board, where the abnormal conditions include the abnormal type and the number of abnormalities; determining the quality inspection type based on the abnormal type; determining the quality inspection ratio adjustment coefficient based on the number of abnormalities; obtaining the circuit board information; determining the quality inspection information based on the circuit board information, where the quality inspection information includes the quality inspection type and the quality inspection ratio corresponding to each quality inspection type; calculating the quality inspection quantity based on the quality inspection ratio adjustment coefficient, the quality inspection ratio, and the production quantity; and determining the quality inspection strategy based on the quality inspection quantity and the quality inspection type.

[0051] In this embodiment, during the production process of a batch of printed circuit boards, an abnormal environment may be encountered, and the abnormal environment may affect the production quality of the printed circuit boards. Obtain the abnormal types and the number of abnormalities corresponding to each abnormal type during the production process of this batch of circuit boards, obtain the quality inspection type corresponding to each abnormal type from the database, obtain the quality inspection ratio adjustment coefficient corresponding to the number of abnormalities from the database, and obtain the circuit board information of this batch from the staff. The circuit board information includes, but is not limited to, the circuit board model and the production quantity of this batch. Different circuit board models have different quality inspection types and quality inspection ratios during quality inspection. Look up the quality inspection type corresponding to this batch of circuit boards and the quality inspection ratio corresponding to each quality inspection type from the database according to the circuit board model. The quality inspection quantity of this batch = production quantity × quality inspection ratio × quality inspection ratio adjustment coefficient. It should be noted that since the quality inspection ratio adjustment coefficients and / or quality inspection ratios corresponding to different abnormal types may be different, the quality inspection quantities of the quality inspection types corresponding to different abnormal types may also be different. The quality inspection strategy is to perform quality inspection on the printed circuit boards according to the quality inspection quantity corresponding to each quality inspection type, thereby improving the quality of the printed circuit boards leaving the factory.

[0052] Figure 2The structural block diagram of a printed circuit board production environment monitoring and management device 200 provided by an embodiment of the present application.

[0053] As Figure 2 shown, the printed circuit board production environment monitoring and management device 200 mainly includes: A monitoring data acquisition module 201, configured to acquire environmental monitoring data, static electricity monitoring data, video monitoring data, and the production type of the circuit board; A monitoring threshold determination module 202, configured to determine a monitoring data threshold based on the production type; A first anomaly determination module 203, configured to determine first anomaly information based on the environmental monitoring data and the monitoring data threshold; A second anomaly determination module 204, configured to determine second anomaly information based on the monitoring data threshold, the static electricity monitoring data, and the video monitoring data; A management strategy determination module 205, configured to determine an environmental management strategy based on the first anomaly information and the second anomaly information.

[0054] As an optional implementation manner of this embodiment, the monitoring threshold determination module 202 is further specifically configured to determine a monitoring data threshold based on the production type, including: acquiring historical production information, where the historical production information includes historical production type, historical monitoring data, and circuit board quality inspection data; dividing the historical production information into multiple historical production combinations based on the historical production type, and each historical production combination corresponds to a historical production type; analyzing the circuit board quality inspection data and the historical monitoring data in each historical production combination to obtain the corresponding relationship between each historical production type and the monitoring data threshold; and determining the monitoring data threshold of the circuit board based on the production type and the corresponding relationship.

[0055] As an optional implementation manner of this embodiment, the second anomaly determination module 204 is further specifically configured to determine second anomaly information based on the monitoring data threshold, the static electricity monitoring data, and the video monitoring data, including: if the static electricity monitoring data exceeds the monitoring data threshold, acquiring the physical data of the production area; constructing a three-dimensional model of the production area based on finite element software; determining a three-dimensional electric field distribution model based on the static electricity monitoring data and the three-dimensional model; determining the charge position based on the three-dimensional electric field distribution model; and determining the second anomaly information based on the charge position, the static electricity monitoring data, the monitoring data threshold, and the video monitoring data.

[0056] As an alternative implementation of this embodiment, the second anomaly determination module 204 is further specifically configured to determine second anomaly information based on the charge position, the electrostatic monitoring data, the monitoring data threshold, and the video monitoring data, including: determining an anomaly position image based on the video monitoring data and the charge position; identifying the anomaly type from the anomaly position image; determining the anomalous device or anomalous person based on the anomaly position image and the anomaly type; and determining the second anomaly information based on the charge position, the electrostatic monitoring data, the monitoring data threshold, the anomalous device, and the anomalous person.

[0057] As an alternative implementation of this embodiment, the management strategy determination module 205 is further specifically configured to determine an environment management strategy based on the first anomaly information and the second anomaly information, including: determining the anomaly type and the anomaly position based on the first anomaly information and the second anomaly information; determining an anomaly adjustment strategy based on the anomaly type and the anomaly position; generating an adjustment instruction based on the anomaly adjustment strategy; calculating an environment adjustment period based on the generation time of the adjustment instruction and a preset adjustment duration; obtaining adjustment monitoring data, where the adjustment monitoring data includes the environment monitoring data, the electrostatic monitoring data, and the video monitoring data after the generation of the adjustment instruction; and determining the environment management strategy based on the environment adjustment period, the adjustment monitoring data, and the anomaly adjustment strategy.

[0058] As an alternative implementation of this embodiment, the management strategy determination module 205 is further specifically configured to determine an environment management strategy based on the environment adjustment period, the adjustment monitoring data, and the anomaly adjustment strategy, including: determining whether there is still an anomaly when the environment adjustment period is reached based on the adjustment monitoring data and the monitoring data threshold; if there is still an anomaly when the environment adjustment period is reached, generating a warning message based on the adjustment monitoring data corresponding to the environment adjustment period; and determining the environment management strategy based on the warning message and the anomaly adjustment strategy.

[0059] As an alternative implementation of this embodiment, after determining the environment management strategy based on the first anomaly information and the second anomaly information, the management strategy determination module 205 is further specifically configured to: obtain the anomaly situation during the circuit board production process, where the anomaly situation includes the anomaly type and the number of anomalies; determine the quality inspection type based on the anomaly type; determine the quality inspection ratio adjustment coefficient based on the number of anomalies; obtain the circuit board information; determine the quality inspection information based on the circuit board information, where the quality inspection information includes the quality inspection type and the quality inspection ratio corresponding to each quality inspection type; calculate the quality inspection quantity based on the quality inspection ratio adjustment coefficient, the quality inspection ratio, and the production quantity; and determine the quality inspection strategy based on the quality inspection quantity and the quality inspection type.

[0060] In one example, the modules in any of the above devices may be one or more integrated circuits configured to implement the above methods. For example: one or more application specific integrated circuits (ASICs), or one or more digital signal processors (DSPs), or one or more field programmable gate arrays (FPGAs), or a combination of at least two of these integrated circuit forms.

[0061] For another example, when the modules in the device can be implemented in the form of a processing element scheduler, the processing element may be a general-purpose processor, such as a central processing unit (CPU) or other processors that can call programs. For another example, these modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).

[0062] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described devices and modules can refer to the corresponding processes in the foregoing method embodiments, and will not be described herein again.

[0063] Figure 3 FIG. is a structural block diagram of an electronic device 300 provided by an embodiment of the present application.

[0064] As Figure 3 shown, the electronic device 300 includes a processor 301 and a memory 302, and may further include one or more of an information input / output (I / O) interface 303, a communication component 304, and a communication bus 305.

[0065] Among them, the processor 301 is used to control the overall operation of the electronic device 300 to complete all or part of the steps of the above-mentioned printed circuit board production environment monitoring and management method; the memory 302 is used to store various types of data to support the operation of the electronic device 300. These data may include, for example, instructions for any application or method operating on the electronic device 300, as well as application-related data. The memory 302 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, one or more of a magnetic disk or an optical disc.

[0066] The I / O interface 303 provides an interface between the processor 301 and other interface modules. The above-mentioned other interface modules can be a keyboard, a mouse, buttons, etc. These buttons can be virtual buttons or physical buttons. The communication component 304 is used for wired or wireless communication between the electronic device 300 and other devices. Wireless communication, such as Wi-Fi, Bluetooth, near field communication (NFC), 2G, 3G or 4G, or a combination of one or more of them. Therefore, the corresponding communication component 304 may include: a Wi-Fi component, a Bluetooth component, an NFC component.

[0067] The electronic device 300 can be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components, and is used to execute the printed circuit board production environment monitoring and management method given in the above embodiments.

[0068] The communication bus 305 may include a path for transmitting information between the above components. The communication bus 305 can be a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The communication bus 305 can be divided into an address bus, a data bus, a control bus, and the like.

[0069] The electronic device 300 may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Tablet Computers), PMPs (Portable Multimedia Players), vehicle terminals (such as vehicle navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc., and may also be a server, etc.

[0070] This application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned printed circuit board production environment monitoring and management method are implemented.

[0071] The computer-readable storage medium may include: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs.

[0072] The term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or apparatus that comprises a series of elements includes not only those elements but also other elements not expressly listed, or elements that are inherent to such process, method, article or apparatus.

[0073] The above description is only a preferred embodiment of the present application and an explanation of the technical principles applied. Those skilled in the art should understand that the scope of the application involved in the present application is not limited to the technical solutions formed by the specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the aforementioned application concept. For example, the technical solutions formed by mutually replacing the above features with the technical features (but not limited to) having similar functions applied in the present application.

Claims

1. A printed circuit board production environment monitoring and management method, characterized in that: include: Obtain environmental monitoring data, electrostatic monitoring data, video monitoring data, and production type of circuit boards; determining a monitoring data threshold based on the production type; Determine first abnormal information based on the environmental monitoring data and the monitoring data threshold; Determining second abnormal information based on the monitoring data threshold, the static electricity monitoring data, and the video monitoring data; An environmental management strategy is determined based on the first exception information and the second exception information.

2. The method according to claim 1, characterized in that: The determining of the monitoring data threshold based on the production type comprises: Acquire historical production information, wherein the historical production information includes historical production types, historical monitoring data, and circuit board quality inspection data; Dividing the historical production information into a plurality of historical production combinations based on the historical production type, each of the historical production combinations corresponding to one of the historical production types; Analyzing the circuit board quality inspection data and the historical monitoring data in each of the historical production combinations to obtain a corresponding relationship between each of the historical production types and the monitoring data threshold; The monitoring data threshold of the circuit board is determined based on the production type and the corresponding relationship.

3. The method according to claim 1, characterized in that The determining the second abnormal information based on the monitoring data threshold, the static electricity monitoring data and the video monitoring data includes: If the static electricity monitoring data exceeds the monitoring data threshold, obtaining physical data of the production area; Constructing a three-dimensional model of the production area based on finite element software; Determine a three-dimensional electric field distribution model based on the electrostatic monitoring data and the three-dimensional model; determining a charge position based on the three-dimensional electric field distribution model; Second abnormality information is determined based on the charge position, the static electricity monitoring data, the monitoring data threshold, and the video monitoring data.

4. The method according to claim 3, characterized in that The determining of the second abnormal information based on the charge position, the electrostatic monitoring data, the monitoring data threshold and the video monitoring data includes: Determine an abnormal position image based on the video monitoring data and the charge position; Identify the abnormal position image to obtain the abnormal type; Determine abnormal equipment or abnormal personnel based on the abnormal position image and the abnormal type; Second abnormality information is determined based on the charge position, the static electricity monitoring data, the monitoring data threshold, the abnormal device, and the abnormal person.

5. The method according to claim 1, characterized in that The determining of the environment management strategy based on the first abnormal information and the second abnormal information includes: Determine an abnormality type and an abnormality location based on the first abnormality information and the second abnormality information; Determining an abnormality adjustment strategy based on the abnormality type and the abnormality location; generating an adjustment instruction based on the abnormal adjustment strategy; Calculating the environmental adjustment period based on the generation time of the adjustment instruction and the preset adjustment duration; Acquire adjustment monitoring data, wherein the adjustment monitoring data includes the environmental monitoring data, the static electricity monitoring data, and the video monitoring data after the adjustment instruction is generated; The environmental management strategy is determined based on the environmental adjustment deadline, the adjustment monitoring data, and the abnormal adjustment strategy.

6. The method according to claim 5, characterized in that The determining the environmental management strategy based on the environmental adjustment period, the adjustment monitoring data and the abnormal adjustment strategy includes: Determine whether an abnormality still exists when the environmental adjustment deadline is reached based on the adjustment monitoring data and the monitoring data threshold; If the abnormality still exists when the environmental adjustment deadline is reached, generating early warning information based on the adjustment monitoring data corresponding to the environmental adjustment deadline; An environmental management strategy is determined based on the early warning information and the abnormal adjustment strategy.

7. The method according to claim 1, characterized in that After determining the environment management strategy based on the first abnormal information and the second abnormal information, the method further includes: Acquire abnormal conditions in the circuit board production process, wherein the abnormal conditions include abnormal type and abnormal number; determining a quality inspection type based on the abnormality type; Determining a quality inspection ratio adjustment coefficient based on the number of abnormalities; Get circuit board information; Determine quality inspection information based on the circuit board information, the quality inspection information including a quality inspection type and a quality inspection ratio corresponding to each quality inspection type; Calculating the quality inspection quantity based on the quality inspection ratio adjustment coefficient, the quality inspection ratio and the production quantity; A quality detection strategy is determined based on the quality detection quantity and the quality detection type.

8. A printed circuit board production environment monitoring and management device, characterized in that: include: A monitoring data acquisition module is used to acquire environmental monitoring data, electrostatic monitoring data, video monitoring data, and production type of circuit boards; A monitoring threshold determination module, used to determine a monitoring data threshold based on the production type; A first abnormality determination module, configured to determine first abnormality information based on the environmental monitoring data and the monitoring data threshold; A second abnormality determination module, configured to determine second abnormality information based on the monitoring data threshold, the static electricity monitoring data, and the video monitoring data; A management policy determination module is used to determine an environment management policy based on the first abnormality information and the second abnormality information.

9. An electronic device, characterized in that: comprising a processor coupled to a memory; The processor is configured to execute a computer program stored in the memory, so that the electronic device executes the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The method comprises a computer program or an instruction, which, when executed on a computer, causes the computer to execute the method according to any one of claims 1 to 7.

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