Material carrying method for semiconductor product production and related device

Abstract

The invention relates to the technical field of semiconductor product production, in particular to a material carrying method for semiconductor product production and a related device. According to the material carrying method, in material carrying control equipment, production link information and material real-time positions corresponding to target semiconductor materials and non-value-added process configuration conditions and non-value-added equipment real-time states corresponding to non-value-added process equipment need to be obtained; according to the production link information and the material real-time position corresponding to each target semiconductor material, and the non-value-added process configuration condition and the non-value-added equipment real-time state corresponding to each non-value-added process equipment, configuring a corresponding material carrying task for the target semiconductor material; and the material carrying tasks are issued to the multiple material carrying carriers. And carrying the corresponding target semiconductor material in the material carrying carrier according to the material carrying task. In this way, the semiconductor material carrying efficiency can be improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor product manufacturing, and in particular, to a material handling method and related device for semiconductor product manufacturing. Background Art

[0002] In the field of semiconductor product manufacturing, semiconductor materials need to be frequently transported between different process equipment.

[0003] In related technologies, in the manufacturing process of certain semiconductor products, non-value-added process operations (such as baking) are required after multiple different value-added processes. Traditional material handling methods rely on manual operations. Due to the need for frequent loading and unloading, value-added process equipment and non-value-added process equipment are often cross-distributed. That is to say, non-value-added process equipment is scattered near different value-added process equipment to facilitate manual loading and unloading by operators. Although this layout reduces the manual handling distance to some extent, it brings problems such as high labor costs, increased risk of material mixing, and low utilization rate of non-value-added process equipment, affecting the efficiency of transporting semiconductor materials during the semiconductor product manufacturing process. Summary of the Invention

[0004] This application aims to at least solve one of the technical problems existing in the prior art. For this purpose, this application proposes a material handling method and related device for semiconductor product manufacturing, which helps to improve the efficiency of transporting semiconductor materials.

[0005] According to the material handling method for semiconductor product manufacturing in the first aspect embodiment of this application, which is applied to a material handling control device, it includes:

[0006] For the first number of target semiconductor materials, obtain the production process information and real-time material position corresponding to each of the target semiconductor materials;

[0007] For the second number of non-value-added process equipment, obtain the non-value-added process configuration conditions and real-time non-value-added equipment status corresponding to each of the non-value-added process equipment;

[0008] According to the production process information and the real-time material position corresponding to each of the target semiconductor materials, and the non-value-added process configuration conditions and the real-time non-value-added equipment status corresponding to each of the non-value-added process equipment, configure corresponding material handling tasks for the target semiconductor materials;

[0009] Send the material handling tasks to multiple material handling carriers, so as to transport each of the target semiconductor materials through the material handling carriers.

[0010] According to some embodiments of the present application, configuring a corresponding material handling task for the target semiconductor material according to the production process information corresponding to each target semiconductor material, the real-time position of the material, the non-value-added process configuration conditions corresponding to each non-value-added process equipment, and the real-time status of the non-value-added equipment includes:

[0011] For each target semiconductor material, generating a material handling path corresponding to the target semiconductor material according to the corresponding production process information, the real-time position of the material, the non-value-added process configuration conditions corresponding to each non-value-added process equipment, and the real-time status of the non-value-added equipment;

[0012] Based on the material handling path, configuring the material handling task for the corresponding target semiconductor material.

[0013] According to some embodiments of the present application, the generating, for each target semiconductor material, a material handling path corresponding to the target semiconductor material according to the corresponding production process information, the real-time position of the material, the non-value-added process configuration conditions corresponding to each non-value-added process equipment, and the real-time status of the non-value-added equipment includes:

[0014] Performing production node analysis on the production process information corresponding to each target semiconductor material to determine the downstream node of the target semiconductor material; wherein, the downstream node is configured with corresponding node constraint information;

[0015] In response to the downstream node being a non-value-added operation node, based on the real-time status of the non-value-added equipment corresponding to the non-value-added process equipment, determining candidate non-value-added process equipment in an idle state from each non-value-added process equipment;

[0016] According to the non-value-added process configuration conditions and the node constraint information corresponding to the non-value-added operation node, determining the target non-value-added process equipment from each candidate non-value-added process equipment in an idle state;

[0017] According to the production process information, the real-time position of the material, and the target non-value-added process equipment corresponding to each target semiconductor material, generating the material handling path corresponding to the target semiconductor material.

[0018] According to some embodiments of the present application, the node constraint information corresponding to the non-value-added operation node includes process requirement constraint information, and the determining, according to the non-value-added process configuration conditions and the node constraint information corresponding to the non-value-added operation node, the target non-value-added process equipment from each candidate non-value-added process equipment in an idle state includes:

[0019] Obtain the non - value - added process configuration conditions corresponding to each of the candidate non - value - added process equipment;

[0020] Match the non - value - added process configuration conditions corresponding to each of the candidate non - value - added process equipment with the process requirement constraint information to determine the target non - value - added process equipment.

[0021] According to some embodiments of the present application, matching the non - value - added process configuration conditions corresponding to each of the candidate non - value - added process equipment with the process requirement constraint information to determine the target non - value - added process equipment includes:

[0022] Match the non - value - added process configuration conditions corresponding to each of the candidate non - value - added process equipment with the process requirement constraint information to obtain matching associated equipment;

[0023] Obtain the effective accommodation space corresponding to each of the matching associated equipment;

[0024] According to the effective accommodation space, determine the target non - value - added process equipment for the target semiconductor material.

[0025] According to some embodiments of the present application, before configuring the material handling task for the corresponding target semiconductor material based on the material handling path, it further includes:

[0026] In response to the downstream node being a value - added operation node, extract the downstream handling position from the node constraint information;

[0027] Generate the material handling path corresponding to the target semiconductor material according to the downstream handling position and the real - time position of the material.

[0028] According to some embodiments of the present application, generating the material handling path corresponding to the target semiconductor material according to the production link information, the real - time position of the material, and the target non - value - added process equipment corresponding to each of the target semiconductor materials includes:

[0029] Determine the target material handling quantity according to the production link information corresponding to each of the target semiconductor materials;

[0030] Obtain the handling load quantity and the corresponding processing bin location information in the target non - value - added process equipment;

[0031] Generate a target transportation event based on the target material handling quantity, the handling load quantity, and the processing bin location information;

[0032] Generate the material handling path corresponding to each of the target semiconductor materials based on the target transportation event.

[0033] According to some embodiments of the present application, generating the target transportation event based on the target material handling quantity, the handling load quantity, and the processing storage location information includes:

[0034] Based on the target material handling quantity, the handling load quantity, and the processing storage location information, matching the target transportation event from a pre-constructed set of transportation events.

[0035] According to some embodiments of the present application, before matching the target transportation event from the pre-constructed set of transportation events based on the target material handling quantity, the handling load quantity, and the processing storage location information, pre-constructing the set of transportation events is further included, specifically including:

[0036] Obtaining a plurality of preset transportation arrays corresponding to different transportation requirements;

[0037] Based on each of the preset transportation arrays, constructing a preset transportation event for the corresponding transportation requirement; wherein each preset transportation event is used to indicate a path planning method for solving one of the transportation requirements.

[0038] According to some embodiments of the present application, a first communication connection is established between the material handling control device and the production batch arrangement system, and a second communication connection is established between the material handling control device and the material tracking system. Obtaining the production process information and the real-time material position corresponding to each of the first number of target semiconductor materials includes:

[0039] Obtaining the production batch information corresponding to each of the target semiconductor materials from the production batch arrangement system via the first communication connection;

[0040] Performing production process analysis on the production batch information to determine the production process information;

[0041] Obtaining the real-time material position corresponding to each of the target semiconductor materials from the material tracking system via the second communication connection.

[0042] According to some embodiments of the present application, obtaining the production process information and the real-time material position corresponding to each of the first number of target semiconductor materials further includes:

[0043] In response to being unable to obtain valid production batch information via the first communication connection, receiving a custom input instruction issued by the production administrator;

[0044] Obtaining the production process information from the custom input instruction.

[0045] According to some embodiments of the present application, the receiving of the custom input instruction issued by the production administrator in response to the inability to obtain valid production batch information via the first communication connection includes:

[0046] In response to the inability to obtain valid production batch information via the first communication connection, push an instruction editing program to the production management terminal corresponding to the production administrator;

[0047] In response to the production administrator performing an instruction editing operation based on the instruction editing program, obtain the custom input instruction.

[0048] A material handling method for semiconductor product production according to an embodiment of the second aspect of the present application, applied to a material handling vehicle, includes:

[0049] Receive a material handling task from a material handling control device; wherein, the material handling task is obtained by the material handling control device through the following steps: for the first number of target semiconductor materials, obtain the production process information and the real-time material position corresponding to each of the target semiconductor materials; for the second number of non-value-added process devices, obtain the non-value-added process configuration conditions and the real-time non-value-added device status corresponding to each of the non-value-added process devices; according to the production process information and the real-time material position corresponding to each of the target semiconductor materials, and the non-value-added process configuration conditions and the real-time non-value-added device status corresponding to each of the non-value-added process devices, configure the corresponding material handling task for the target semiconductor materials;

[0050] According to the material handling task, perform a handling operation on the corresponding target semiconductor material.

[0051] According to some embodiments of the present application, the performing of the handling operation on the corresponding target semiconductor material according to the material handling task includes:

[0052] Perform task parsing on the material handling task to obtain the handling starting position, the handling ending position, the material handling path, and the current real-time material position of the target semiconductor material;

[0053] Control the material handling vehicle to move from the current real-time material position to the handling starting position;

[0054] In response to the material handling vehicle reaching the handling starting position, execute a pick-up action subtask to load the target semiconductor material onto the material handling vehicle;

[0055] Control the material handling vehicle to move from the handling starting position along the material handling path to the handling ending position;

[0056] In response to the material handling vehicle reaching the handling end position, perform the placement action subtask to unload the target semiconductor material from the material handling vehicle.

[0057] A material handling control device for semiconductor product production according to an embodiment of the third aspect of the present application includes:

[0058] A first acquisition module for acquiring production process information and real-time material positions corresponding to each of the first number of target semiconductor materials for the first number of target semiconductor materials;

[0059] A second acquisition module for acquiring non-value-added process configuration conditions and non-value-added equipment real-time status corresponding to each of the second number of non-value-added process equipment for the second number of non-value-added process equipment;

[0060] A material handling task configuration module for configuring corresponding material handling tasks for the target semiconductor materials according to the production process information and the real-time material positions corresponding to each of the target semiconductor materials, and the non-value-added process configuration conditions and the non-value-added equipment real-time status corresponding to each of the non-value-added process equipment;

[0061] A task issuing module for issuing the material handling tasks to a plurality of material handling vehicles to handle each of the target semiconductor materials through the material handling vehicles.

[0062] A material handling vehicle for semiconductor product production according to an embodiment of the fourth aspect of the present application includes:

[0063] A task receiving module for receiving material handling tasks from a material handling control device; wherein the material handling tasks are obtained by the material handling control device through the following steps: acquiring production process information and real-time material positions corresponding to each of the first number of target semiconductor materials for the first number of target semiconductor materials; acquiring non-value-added process configuration conditions and non-value-added equipment real-time status corresponding to each of the second number of non-value-added process equipment for the second number of non-value-added process equipment; configuring corresponding material handling tasks for the target semiconductor materials according to the production process information and the real-time material positions corresponding to each of the target semiconductor materials, and the non-value-added process configuration conditions and the non-value-added equipment real-time status corresponding to each of the non-value-added process equipment;

[0064] A handling execution module for performing a handling operation on the corresponding target semiconductor material according to the material handling task.

[0065] Fifth aspect, an embodiment of the present application provides a computer-readable storage medium. The storage medium stores a program, and when the program is executed by a processor, it implements the material handling method for semiconductor product production as described in any one of the embodiments of the first aspect and the second aspect of the present application.

[0066] The material handling method and related device for semiconductor product production according to the embodiments of the present application have at least the following beneficial effects:

[0067] In the material handling control device of the material handling method for semiconductor product production of the present application: for the first number of target semiconductor materials, obtain the production process information and real-time material positions corresponding to each target semiconductor material; for the second number of non-value-added process devices, obtain the non-value-added process configuration conditions and real-time non-value-added device status corresponding to each non-value-added process device; according to the production process information and real-time material positions corresponding to each target semiconductor material, and the non-value-added process configuration conditions and real-time non-value-added device status corresponding to each non-value-added process device, configure corresponding material handling tasks for the target semiconductor materials; send the material handling tasks to multiple material handling carriers to carry the target semiconductor materials through the material handling carriers. In the material handling carrier: receive the material handling task from the material handling control device; perform a handling operation on the corresponding target semiconductor material according to the material handling task. In this way, it helps to improve the efficiency of handling semiconductor materials.

[0068] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. Description of the Drawings

[0069] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0070] Figure 1 is a schematic flowchart of the material handling method for semiconductor product production provided by an embodiment of the present application;

[0071] Figure 2 is a schematic flowchart of step S101 in some embodiments;

[0072] Figure 3 is another part of the schematic flowchart of step S101 in some embodiments;

[0073] Figure 4 is another part of the schematic flowchart of step S301 in some embodiments;

[0074] Figure 5 is a schematic flowchart of step S103 in some embodiments;

[0075] Figure 6 It is a schematic flow chart of step S501 in some embodiments;

[0076] Figure 7 It is a schematic flow chart of step S603 in some embodiments;

[0077] Figure 8 It is a schematic flow chart of step S702 in some embodiments;

[0078] Figure 9 It is a schematic flow chart of step S604 in some embodiments;

[0079] Figure 10 It is a schematic flow chart of pre - constructing a set of carrier events in some embodiments;

[0080] Figure 11 It is a schematic flow chart of step S502 in some embodiments;

[0081] Figure 12 It is a schematic diagram of the communication architecture between a material handling carrier and non - value - added process equipment in some embodiments;

[0082] Figure 13 It is a schematic flow chart of step S106 in some embodiments;

[0083] Figure 14 It is a schematic diagram of the structure of a material handling control device for semiconductor product production provided by an embodiment of the present application;

[0084] Figure 15 It is a schematic diagram of the structure of a material handling carrier for semiconductor product production provided by an embodiment of the present application;

[0085] Figure 16 It is a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present application. Detailed implementation manners

[0086] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present application and should not be construed as limiting the present application.

[0087] In the description of the present application, the meaning of "several" is one or more, the meaning of "multiple" is more than two, and understandings such as "greater than", "less than", "exceeding", etc. do not include the corresponding number, while understandings such as "above", "below", "within", etc. include the corresponding number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0088] In the description of the present application, it should be understood that for the description of directions, such as the directions or positional relationships indicated by "above", "below", "left", "right", "front", "rear", etc., they are based on the directions or positional relationships shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation to the present application.

[0089] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0090] In the description of the present application, it should be noted that unless otherwise clearly defined, words such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present application in combination with the specific content of the technical solution. In addition, the identification of specific steps hereinafter does not represent a limitation on the step sequence and execution logic. The execution sequence and execution logic between each step should be understood and inferred with reference to the content described in the embodiments.

[0091] In the field of semiconductor product manufacturing, semiconductor materials need to be frequently transported and loaded / unloaded between different process equipment.

[0092] In the semiconductor product manufacturing process, the classification of process equipment is crucial for understanding the production process and optimizing production efficiency. Value-added process equipment and non-value-added process equipment are two different classifications, and they play different roles in the production process of semiconductor products.

[0093] Value-added process equipment refers to those equipment that directly process semiconductor products to increase their performance, functionality, or value. These value-added process equipment usually involve the core manufacturing process of semiconductor chips. Among them, the value-added process equipment can specifically include cutting equipment required for PCB substrate preparation, surface mounting process equipment, equipment for automatically identifying and grasping PCB substrates, and dispensing machines and chip mounters used in the chip mounting process. In some other embodiments, the process equipment can also include equipment required for the plastic frame pasting process, pick-and-place machines used in the photosensitive chip and light-emitting chip pasting processes, wire bonding equipment in the wire bonding process, and film flipping equipment and cassettes in the transfer process.

[0094] Relatively speaking, although non-value-added process equipment is equally crucial for the final quality and performance of semiconductor products, its role does not directly increase the value or functionality of semiconductor products. These non-value-added process equipment are mainly responsible for auxiliary production tasks. For example, a material baking oven is used to bake semiconductor materials to remove moisture or stress and cure adhesive materials, an ultraviolet irradiation device is used to reduce the adhesion between the back of the chip and the transition film through ultraviolet light, and a plasma gas cleaning device is used to remove impurities and residues on the chip surface through plasma. Although these steps are crucial for ensuring the quality and reliability of semiconductor products, they do not directly participate in the structure construction of semiconductor chips, so they are classified as non-value-added process equipment. The non-value-added process equipment provides the necessary conditions for the efficient operation of the value-added process equipment and lays a good foundation for subsequent value-added process steps.

[0095] It should be understood that although non-value-added process equipment does not directly increase the value of semiconductor products, it plays a key role in ensuring the smooth progress of the production process and the quality of the final product. Semiconductor manufacturing is a complex process that requires the collaborative work of value-added process equipment and non-value-added process equipment. For this reason, semiconductor materials need to be transported and loaded / unloaded between value-added process equipment and non-value-added process equipment.

[0096] In the related technologies of semiconductor product manufacturing, traditional handling and loading / unloading operations rely on manual operations. For some semiconductor products, due to the special requirements of their processing technology, non-value-added process operations (such as baking) need to be carried out after certain value-added process operations. This will result in multiple non-value-added processes during the entire manufacturing process of semiconductor products, and non-value-added processes need to be completed in separate non-value-added process equipment. Therefore, value-added process equipment and non-value-added process equipment are often cross-distributed, that is, non-value-added process equipment is scattered near different value-added process equipment to facilitate manual handling and loading / unloading operations. Although this layout is convenient for manual operations to a certain extent, it also brings a series of problems:

[0097] First, since semiconductor materials need to be frequently transported and loaded / unloaded between different value-added process equipment and non-value-added process equipment, this process often relies on manual operation. This reliance leads to high labor costs because operators need to frequently perform loading and unloading tasks for non-value-added process equipment. In addition, the efficiency of manual operation is relatively low because it cannot match the high speed and precision of automated handling.

[0098] Second, the frequency of manual operation also increases the risk of material mixing. In a fast-paced production environment, employees may cause material confusion due to negligence or fatigue, which not only affects the quality of the produced semiconductor products but may also lead to the scrapping of the entire production batch, resulting in huge economic losses.

[0099] Furthermore, due to the low utilization rate of non-value-added process equipment, each non-value-added process equipment can usually only process one batch of materials, which limits the production flexibility and efficiency. When the non-value-added process equipment is idle, new materials cannot be allocated in a timely manner, resulting in equipment idleness and unable to fully utilize its production capacity.

[0100] In summary, the cross-distribution layout of the existing value-added process equipment and non-value-added process equipment leads to problems such as high labor costs, increased risk of material mixing, and low utilization rate of non-value-added process equipment. These problems not only affect production efficiency and product quality but also increase operation and maintenance costs.

[0101] This application aims to at least solve one of the technical problems existing in the prior art. For this purpose, this application proposes a material handling method and related device for semiconductor product production, which helps to improve the efficiency of handling semiconductor materials.

[0102] The following is a further description based on the accompanying drawings.

[0103] Referring to Figure 1 , according to the material handling method for semiconductor product production provided by the embodiment of this application, in the material handling control equipment:

[0104] Step S101, for the first number of target semiconductor materials, obtain the production link information and real-time material position corresponding to each target semiconductor material;

[0105] Step S102, for the second number of non-value-added process equipment, obtain the non-value-added process configuration conditions and non-value-added equipment real-time status corresponding to each non-value-added process equipment;

[0106] Step S103, according to the production link information and real-time material position corresponding to each target semiconductor material, and the non-value-added process configuration conditions and non-value-added equipment real-time status corresponding to each non-value-added process equipment, configure corresponding material handling tasks for the target semiconductor materials;

[0107] Step S104: Issue a material handling task to multiple material handling carriers to handle each target semiconductor material through the material handling carriers.

[0108] According to the material handling method for semiconductor product production provided by the embodiments of the present application, in the material handling carrier:

[0109] Step S105: Receive a material handling task from the material handling control device;

[0110] Step S106: Perform a handling operation on the corresponding target semiconductor material according to the material handling task.

[0111] For the material handling method for semiconductor product production of the present application, in the material handling control device, it is necessary to obtain the production process information and real-time material position corresponding to each target semiconductor material for the first number of target semiconductor materials; obtain the non-value-added process configuration conditions and non-value-added device real-time status corresponding to each non-value-added process device for the second number of non-value-added process devices; configure a corresponding material handling task for the target semiconductor material according to the production process information and real-time material position corresponding to each target semiconductor material, the non-value-added process configuration conditions and non-value-added device real-time status corresponding to each non-value-added process device; issue the material handling task to multiple material handling carriers, and the material handling carriers receive the material handling task from the material handling control device; perform a handling operation on the corresponding target semiconductor material according to the material handling task. In this way, it helps to improve the efficiency of handling semiconductor materials.

[0112] During the semiconductor product production process, semiconductor materials refer to semi-finished products at different production stages, which are the objects of the process flow in the semiconductor product production process. These semiconductor materials may include, but are not limited to: wafers, die, etc.

[0113] A wafer is the starting point of semiconductor manufacturing. It is a large-diameter circular silicon wafer that has been processed with high precision and has a flat and pure surface.

[0114] Die, also known as chips, are the products after wafer cutting. After these die are packaged and tested, they become different types of semiconductor products.

[0115] In summary, semiconductor materials are semi-finished products in the semiconductor product production process, and they include wafers, die, etc. After a series of processing, these semiconductor materials are finally transformed into semiconductor finished products, such as diodes, power modules, etc.

[0116] In step S101 of some embodiments, for the first number of target semiconductor materials, obtain the production process information and real-time material position corresponding to each target semiconductor material;

[0117] In the process of semiconductor product manufacturing, precisely managing and tracking the location and status of each semiconductor material is crucial for ensuring production efficiency and product quality. Target semiconductor materials refer to semi-finished products or raw materials that need to be processed, handled, or transported at the current time point or production stage. Step S101 needs to obtain the production process information of these target semiconductor materials during the production process and their real-time material locations within the factory.

[0118] First, identify and track the production process information of each semiconductor material, which includes understanding the current production stage of each semiconductor material. For example, whether the semiconductor material is waiting to enter a non-value-added process equipment, whether the semiconductor material is undergoing a certain processing step, or whether the semiconductor material has completed a certain process and is ready to enter the next process. This information is crucial for determining the next actions of the material because different production processes may require different processing methods and time arrangements.

[0119] Second, obtaining the real-time location information of semiconductor materials is the basis for realizing automated handling. By using some tracking means, such as RFID, barcode scanning, or vision recognition systems, the exact location of the container corresponding to each semiconductor material can be monitored in real time. This can include not only the physical location of the material within the factory but also their relative positions within specific process equipment. The real-time location information helps the handling process of the embodiments of the present application to quickly respond to production changes. For example, in case of certain equipment failures or production bottlenecks, the handling tasks and paths can be adjusted in a timely manner.

[0120] By combining the production process information and the real-time material location, step S101 provides the necessary data basis for the subsequent handling task configuration. These data enable the embodiments of the present application to make more precise decisions. For example, determining which materials need to be processed first, which materials need to wait, and how to most effectively plan the handling path to reduce the handling time and improve the overall production efficiency. In short, step S101 lays the foundation for realizing efficient automated handling and production process optimization by precisely obtaining and analyzing the production process information and real-time location of target semiconductor materials.

[0121] Referring to Figure 2 , according to some embodiments of the present application, for the first number of target semiconductor materials, obtaining the corresponding production process information and real-time material location of each target semiconductor material in step S101 may include:

[0122] Step S201, obtaining the production batch information corresponding to each target semiconductor material from the production batch arrangement system via the first communication connection;

[0123] Step S202: Analyze the production process information of the production batch to determine the production process information;

[0124] Step S203: Obtain the real-time positions of the target semiconductor materials corresponding to each material from the material tracking system via the second communication connection.

[0125] In some embodiments of the present application, the material handling control device realizes seamless docking with the production batch arrangement system and the material tracking system through the established communication connections, thereby efficiently obtaining the production process information and real-time positions of the target semiconductor materials. Among them, a first communication connection is established between the material handling control device and the production batch arrangement system, and a second communication connection is established between the material handling control device and the material tracking system.

[0126] In step S201 of some embodiments, the material handling control device obtains the production batch information corresponding to each target semiconductor material from the production batch arrangement system through the first communication connection. It should be noted that the production batch arrangement system is a key information system used to manage and optimize the production process in semiconductor product manufacturing. The main function of this system is to plan and arrange production batches to ensure the efficiency and orderliness of the production process. In the field of semiconductor product manufacturing, due to the production process involving multiple complex steps and processes, the role of the production batch arrangement system is particularly important.

[0127] In some more specific embodiments, the production batch arrangement system may include a dedicated database that stores detailed information about different production batches, including the bill of materials, processing sequence, required equipment, estimated start and end times, etc. for each batch. The production batch arrangement system will formulate a detailed production plan based on this information, combined with the actual production capacity and resource status of the factory, such as the availability of equipment, process requirements, and priority settings.

[0128] It should be noted that the production batch information is key data in the semiconductor product production process, which includes important information such as the processing sequence of materials, required processes, and expected completion time. By obtaining this information, the material handling control device can understand the specific position of each target semiconductor material in the production process and the upcoming processing steps.

[0129] In step S202 of some embodiments, the material handling control device analyzes the production process of the obtained production batch information to determine the specific production process information. This step is necessary because the production batch information contains a large amount of data, and the material handling control device needs to extract the information directly related to material handling from it. It should be noted that the production process analysis can screen, classify, and organize the production batch information to identify the current production stage of each target semiconductor material. For example, whether the target semiconductor material is waiting to enter a non-value-added process device, is undergoing a specific processing step, or has completed a certain process and is ready to enter the next link.

[0130] In step S203 of some embodiments, the material handling control device obtains the real-time positions of the target semiconductor materials corresponding to each target semiconductor material from the material tracking system through a second communication connection. The material tracking system monitors the movement of each semiconductor material in the factory by using technologies such as RFID, barcode scanning, or visual recognition. Through this step, the material handling control device can grasp the exact position of each material in real time, which is crucial for planning the handling path and scheduling the handling tasks.

[0131] In summary, through the three steps of step S201 to step S203, the material handling control device can comprehensively understand the production process information and real-time positions of the target semiconductor materials. The integration of this information enables the material handling control device to make more accurate decisions. For example, determining which target semiconductor materials need to be processed first, which target semiconductor materials can wait, and how to most effectively plan the handling path to reduce the handling time and improve the overall production efficiency.

[0132] Referring to Figure 3 , according to some embodiments of the present application, step S101 for the first number of target semiconductor materials to obtain the production process information and real-time positions of the target semiconductor materials corresponding to each target semiconductor material may further include:

[0133] Step S301, in response to being unable to obtain valid production batch information via the first communication connection, receiving a custom input instruction issued by the production administrator;

[0134] Step S302, obtaining the production process information from the custom input instruction.

[0135] In some embodiments of the present application, in addition to obtaining the production process information of the target semiconductor materials through the production batch arrangement system, a backup solution is also provided to address possible failures or limitations. Specifically, when it is impossible to obtain valid production batch information from the production batch arrangement system through the first communication connection, the embodiments of the present application can take steps S301 to S302 to obtain the production process information.

[0136] In step S301 of some embodiments, in response to the situation where valid production batch information cannot be obtained through the first communication connection, the embodiments of the present application will receive a custom input instruction from the production administrator. It should be noted that valid production batch information refers to information that is accurate, complete, timely, and can guide the production process and decision-making. In semiconductor product production, valid production batch information is crucial for tracking the entire production process from raw materials to the final product, and it helps ensure that the product meets the predetermined specifications and quality standards at each manufacturing stage. In the case where valid production batch information cannot be obtained through the first communication connection, a custom input instruction issued by the production administrator needs to be received. This custom input instruction is issued by the production administrator. When, due to system failures, communication problems, or certain special conditions, valid production batch information cannot be obtained through the first communication connection, the production administrator can be allowed to manually intervene based on experience and on-site conditions through the issued custom input instruction to ensure the normal progress of semiconductor product production.

[0137] Referring to Figure 4 , according to some embodiments of the present application, step S301, in response to being unable to obtain valid production batch information via the first communication connection, receiving a custom input instruction issued by the production administrator, may include:

[0138] Step S401, in response to being unable to obtain valid production batch information via the first communication connection, pushing an instruction editing program to the production management terminal corresponding to the production administrator;

[0139] Step S402, in response to the production administrator performing an instruction editing operation based on the instruction editing program, obtaining the custom input instruction.

[0140] In step S401 of some embodiments, when valid production batch information cannot be obtained through the first communication connection, the embodiments of the present application actively push an instruction editing program to the production management terminal corresponding to the production administrator. This instruction editing program comes with a corresponding operation interface, allowing the production administrator to manually input or edit some custom production instruction information. Since the embodiments of the present application cannot automatically obtain the required production batch information from the production batch arrangement system, the instruction editing program provides an alternative solution, enabling the production administrator to directly intervene and use their knowledge and experience to input the necessary production instruction information. This instruction editing program may include various input fields and options to ensure that the production administrator can provide complete production instruction information, which may include, but is not limited to, the processing sequence of the target semiconductor material, processing equipment, start time, and end time, etc.

[0141] Step S402 of some embodiments corresponds to the process of obtaining these custom input instructions after the production administrator performs an instruction editing operation based on the instructions using an instruction editing program. The production instruction information input by the production administrator through the instruction editing program will be received and integrated into the production process to form custom input instructions. These custom input instructions may include manual adjustments to production batches, temporary changes in emergency situations, or descriptions of specific production conditions. Embodiments of the present application can parse these custom input instructions and convert them into executable production tasks and scheduling instructions to guide subsequent production activities.

[0142] The embodiments of the present application illustrated by steps S401 to S402 provide an effective solution to address the limitations in the production batch information acquisition link. This method not only improves the robustness of the material handling method of the embodiments of the present application but also enhances the flexibility and adaptability of the production process. In the face of unexpected situations or failures, the production administrator can quickly take action through the instruction editing program and ensure the normal progress of the production process by manual input, thereby reducing production delays and potential quality risks.

[0143] Step S302 of some embodiments is the process of obtaining production link information from these custom input instructions. The custom input instructions issued by the production administrator may include the current positions of the target semiconductor materials, the expected processing steps, the required equipment, and the time schedule, etc. By parsing the custom input instructions, the required production link information can be extracted and integrated into the production process.

[0144] The embodiments of the present application illustrated by steps S301 to S302, by introducing this mechanism of custom input, when it is impossible to obtain effective production batch information via the first communication connection, the custom input of the production administrator can be used as an effective supplement to ensure the accuracy and reliability of the production link information. This method not only improves the fault tolerance of the material handling method of the present application but also enhances the adaptability to complex production environments, thus ensuring the efficiency and accuracy of semiconductor material handling during the semiconductor product production process.

[0145] Step S102 of some embodiments obtains the non-value-added process configuration conditions and non-value-added equipment real-time status corresponding to each of the second number of non-value-added process equipment;

[0146] In the field of semiconductor product production, obtaining the configuration conditions and real-time status of non-value-added process equipment is crucial for ensuring the accuracy and efficiency of non-value-added processes. Step S102 involves obtaining the non-value-added process configuration conditions and non-value-added equipment real-time status corresponding to each of the second number of non-value-added process equipment.

[0147] First, the non - value - added process configuration conditions refer to the specific parameters required for each non - value - added process equipment. Among them, when the non - value - added process equipment is specifically a material baking oven, the non - value - added process configuration conditions may include baking temperature and time, and these non - value - added process configuration conditions can be determined according to the moisture - sensitive level of the semiconductor device and the thickness of the device. Based on these non - value - added process configuration conditions, the material baking oven, as the non - value - added process equipment, can remove moisture and volatiles inside the device through baking, ensuring that the semiconductor material has qualified performance and reliability.

[0148] Second, the real - time status of the non - value - added equipment of the non - value - added process equipment can be used to reflect whether the non - value - added process equipment is currently in an idle state or a running state. For example, when the material baking oven is used as the non - value - added process equipment, by understanding the real - time status of the material baking oven, the embodiments of the present application can arrange the material handling tasks more effectively to schedule the semiconductor materials that need to be baked. If the material baking oven is in an idle state, new materials can be immediately arranged to enter the baking process, thereby reducing the waiting time and improving production efficiency. If the current non - value - added process equipment is running, the embodiments of the present application can arrange other idle non - value - added process equipment of the same type to process the semiconductor materials, avoiding unnecessary waiting.

[0149] It can be seen that the real - time status of the non - value - added equipment of the non - value - added process equipment helps to optimize resource allocation. In the case of a multi - non - value - added process equipment configuration, the material flow can be dynamically adjusted according to the idle or running state of the non - value - added process equipment to ensure the balanced use of all non - value - added process equipment, avoiding overloading of some non - value - added process equipment while other non - value - added process equipment is idle. At the same time, it will also optimize the production cycle of the product, reduce the production time in the product packaging manufacturing process, and improve production efficiency.

[0150] In some embodiments, it can also reflect the internal real - time parameters such as temperature, pressure, and humidity of the non - value - added process equipment, and these parameters play a role in preventing production interruptions and ensuring product quality. On this basis, the real - time status of the non - value - added equipment is closely related to product quality control. When the non - value - added process equipment is specifically a material baking oven, if the material baking oven is in a running state, it is necessary to ensure that the baking conditions (such as temperature, humidity, etc.) meet the requirements to ensure the quality of material baking. If the material baking oven shows an abnormality, such as the temperature deviating from the set value, measures can be taken in a timely manner to avoid possible quality problems.

[0151] To achieve remote control and data acquisition of non-value-added process equipment, the embodiments of the present application may adopt an intelligent non-value-added process equipment management system to realize automatic uploading and downloading of equipment programs and parameter verification. For example, when the non-value-added process equipment is specifically a material baking oven, the embodiments of the present application can monitor the equipment status and temperature curve in real time, and automatically pause the processing of the baking batch in case of abnormalities. In this way, the embodiments of the present application can not only improve the automation level of non-value-added processes, but also help reduce human errors and improve production efficiency and product quality.

[0152] In step S103 of some embodiments, according to the production link information and real-time material position corresponding to each target semiconductor material, and the non-value-added process configuration conditions and real-time status of each non-value-added process equipment, a corresponding material handling task is configured for the target semiconductor material;

[0153] In the field of semiconductor product production, the configuration of material handling tasks is a complex process, which involves real-time monitoring and intelligent decision-making on the status of semiconductor materials and non-value-added process equipment.

[0154] First, by obtaining the production link information and real-time material position of the target semiconductor material in real time, the embodiments of the present application can understand the current production stage and specific position of each material. This information plays an indicative role in determining the next action of the material. For example, if a material has just completed a key processing step and needs to immediately enter a non-value-added process equipment for non-value-added process treatment, the embodiments of the present application can prioritize the configuration of the handling task according to this information to ensure that the material can enter the non-value-added process equipment in time.

[0155] Secondly, the embodiments of the present application also need to obtain the non-value-added process configuration conditions and real-time status of each non-value-added process equipment. When the non-value-added process equipment is specifically a material baking oven, the non-value-added process configuration conditions may include parameters such as the baking temperature, time, and humidity set for the material baking oven. The real-time status of the non-value-added process equipment, such as whether it is idle or in use, directly affects the scheduling and execution of the material handling task. If a material baking oven serving as a non-value-added process equipment is in an idle state, the embodiments of the present application can immediately arrange for the material that needs to be baked to enter; if the non-value-added process equipment is in use, the embodiments of the present application need to arrange the handling of the material according to the completion time of the current non-value-added process equipment and the next idle time period.

[0156] Combining the above two aspects of information, the embodiments of the present application can configure the most suitable handling tasks for target semiconductor materials. This can include determining which non-value-added process equipment each target semiconductor material should enter, and can also include planning the best handling path and time to reduce waiting and delays during the handling process. In this way, step S103 ensures that the semiconductor materials can be transported to the correct non-value-added process equipment at the correct time, thereby improving production efficiency, reducing errors and costs in manual operations, and also improving the utilization rate of non-value-added process equipment.

[0157] Referring to Figure 5 , according to some embodiments of the present application, step S103 configures corresponding material handling tasks for the target semiconductor materials according to the production link information and real-time material positions corresponding to each target semiconductor material, the non-value-added process configuration conditions corresponding to each non-value-added process equipment, and the real-time status of the non-value-added equipment, which may include:

[0158] Step S501, for each target semiconductor material, generate a material handling path corresponding to the target semiconductor material according to the corresponding production link information and real-time material position, the non-value-added process configuration conditions corresponding to each non-value-added process equipment, and the real-time status of the non-value-added equipment;

[0159] Step S502, based on the material handling path, configure a material handling task for the corresponding target semiconductor material.

[0160] In some embodiments of the present application, step S103 aims to accurately configure corresponding material handling tasks for each target semiconductor material. This process involves multiple key factors, including the production link information of the target semiconductor material, the real-time position of the material, as well as the configuration conditions of the non-value-added process equipment and the real-time status of the non-value-added process equipment.

[0161] Step S501 of some embodiments requires that the embodiments of the present application generate a material handling path corresponding to each target semiconductor material according to its corresponding production link information and real-time material position, and the non-value-added process configuration conditions corresponding to each non-value-added process equipment and the real-time status of the non-value-added equipment. This step needs to calculate the most effective and fastest handling path according to the real-time production environment data. This can involve multiple factors, such as avoiding the intersection of handling paths, optimizing the path length, reducing the handling time, physical obstacles in the production workshop, the handling situation of other materials, the current load of the production line, and ensuring that the materials can arrive in time when the non-value-added process equipment is available.

[0162] Referring to Figure 6, according to some embodiments of the present application, step S501 generates a material handling path corresponding to each target semiconductor material according to the corresponding production process information, the real-time position of the material, the non-value-added process configuration conditions corresponding to each non-value-added process equipment, and the real-time status of the non-value-added equipment, which may include:

[0163] Step S601, perform production node analysis on the production process information corresponding to each target semiconductor material to determine the downstream node of the target semiconductor material; wherein, the downstream node is configured with corresponding node constraint information;

[0164] Step S602, in response to the downstream node being a non-value-added operation node, based on the real-time status of the non-value-added equipment corresponding to the non-value-added process equipment, determine the candidate non-value-added process equipment in an idle state from each non-value-added process equipment;

[0165] Step S603, determine the target non-value-added process equipment from the candidate non-value-added process equipment in an idle state according to the non-value-added process configuration conditions and the node constraint information corresponding to the non-value-added operation node;

[0166] Step S604, generate a material handling path corresponding to the target semiconductor material according to the production process information, the real-time position of the material, and the target non-value-added process equipment corresponding to each target semiconductor material.

[0167] In step S601 of some embodiments, the embodiments of the present application perform production node analysis on the production process information corresponding to each target semiconductor material to determine the downstream node of the target semiconductor material. This step is the basis of path planning because the downstream node determines the next production process that the material needs to go to. In the process of semiconductor product production, each production node has specific operations and requirements. Therefore, the embodiments of the present application need to analyze the production process information corresponding to each target semiconductor material to determine the next destination corresponding to each of these target semiconductor materials. It should be noted that the downstream node is also configured with corresponding node constraint information, which may include time limits, temperature requirements, humidity conditions, etc., and has a direct impact on the configuration of the material handling task.

[0168] In step S602 of some embodiments, for the case where the downstream node is specifically a non-value-added operation node. In this case, the embodiments of the present application need to determine which of all the non-value-added process equipment are in an idle state and can be used as candidate non-value-added process equipment based on the real-time status of the non-value-added equipment corresponding to the non-value-added process equipment. This step is to ensure that the material can enter the non-value-added process equipment in time for necessary processing, and at the same time reduce the time consumed waiting for the non-value-added process equipment, thereby improving production efficiency.

[0169] In step S603 of some embodiments, according to the non - value - added process configuration conditions and the node constraint information corresponding to the non - value - added operation nodes, the target non - value - added process equipment is determined from each candidate non - value - added process equipment in an idle state. In this step, the embodiments of the present application not only consider the real - time state of the non - value - added process equipment, but also combine the non - value - added process configuration conditions and the node constraint information corresponding to the non - value - added operation nodes to determine the final target non - value - added process equipment from the candidate non - value - added process equipment in an idle state. It should be noted that this decision - making process can comprehensively consider multiple factors. For example, when the non - value - added process equipment is specifically a material baking oven, factors such as baking temperature, baking time, the capacity of the material baking oven, and the time window and quality standards of the downstream nodes, etc.

[0170] Referring to Figure 7 , according to some embodiments of the present application, the node constraint information corresponding to the non - value - added operation nodes includes process requirement constraint information. Step S603 determines the target non - value - added process equipment from each candidate non - value - added process equipment in an idle state according to the non - value - added process configuration conditions and the node constraint information corresponding to the non - value - added operation nodes, and may include:

[0171] Step S701, obtaining the non - value - added process configuration conditions corresponding to each candidate non - value - added process equipment;

[0172] Step S702, matching the non - value - added process configuration conditions corresponding to each candidate non - value - added process equipment with the process requirement constraint information to determine the target non - value - added process equipment.

[0173] In some embodiments of the present application, the key task of step S603 is to determine the final target non - value - added process equipment from the candidate non - value - added process equipment in an idle state to meet the processing requirements of specific semiconductor materials. This decision - making process needs to comprehensively consider the non - value - added process configuration conditions and the node constraint information corresponding to the non - value - added operation nodes, especially the process requirement constraint information.

[0174] In step S701 of some embodiments, the non - value - added process configuration conditions corresponding to each candidate non - value - added process equipment are obtained. These non - value - added process configuration conditions may refer to the temperature range, humidity control, pressure conditions, and other parameters that each candidate non - value - added process equipment can provide respectively. Each candidate non - value - added process equipment may have different configuration conditions, and these different configuration conditions determine the types of materials they process and the processing requirements are different. Based on this, the embodiments of the present application can accurately understand the capabilities of each candidate non - value - added process equipment in order to determine the target non - value - added process equipment in the subsequent steps.

[0175] In step S702 of some embodiments, a process of matching the non - value - added process configuration conditions corresponding to each candidate non - value - added process equipment with the process requirement constraint information. When the non - value - added process corresponds to a baking process, the process requirement constraint information may include requirements such as the baking temperature, time, humidity, etc. required for the target semiconductor material, and these requirements come from the specific needs of downstream nodes. For example, they may be determined by the properties, processing history, or end - use of the target semiconductor material. In the embodiments of the present application, these requirements are compared with the capabilities of the candidate non - value - added process equipment to determine which current candidate non - value - added process equipment is most suitable for performing the processing task for the target semiconductor material. In some embodiments, the matching process in the embodiments of the present application may involve various matching logics and algorithms to ensure that the selected non - value - added process equipment can not only meet the current processing requirements but also take into account production efficiency and resource optimization.

[0176] Referring to Figure 8 , according to some embodiments of the present application, step S702 matches the non - value - added process configuration conditions corresponding to each candidate non - value - added process equipment with the process requirement constraint information to determine the target non - value - added process equipment, including:

[0177] Step S801, match the non - value - added process configuration conditions corresponding to each candidate non - value - added process equipment with the process requirement constraint information to obtain the matching associated equipment;

[0178] Step S802, obtain the effective accommodation space corresponding to each matching associated equipment;

[0179] Step S803, determine the target non - value - added process equipment for the target semiconductor material according to the available effective accommodation space.

[0180] In step S801 of some embodiments, the non - value - added process configuration conditions of each candidate non - value - added process equipment are compared with the process requirement constraint information of a specific semiconductor material. Through this comparison, the embodiments of the present application can identify which candidate non - value - added process equipment can meet the processing requirements of which target semiconductor materials, so as to mark the corresponding matching associated equipment for each target semiconductor material.

[0181] In step S802 of some embodiments, obtain the effective accommodation space corresponding to each matching associated equipment. The effective accommodation space refers to the space inside the non - value - added process equipment that can actually be used to place materials, which may be affected by the internal structure of the non - value - added process equipment, the occupied space, or the specific material placement requirements. The embodiments of the present application need to evaluate the effective accommodation space of each matching associated equipment to determine whether they have enough space to accommodate the semiconductor materials to be processed.

[0182] In step S803 of some embodiments, based on the effective accommodation space information, the final non-value-added process equipment is determined for the target semiconductor material. In this step, the embodiments of the present application will select the matching associated equipment that has both sufficient effective accommodation space and can meet the processing requirements as the target non-value-added process equipment. This decision is not limited to considerations of technical parameters and space capacity, and other factors such as the energy efficiency, maintenance cycle, and location convenience of the non-value-added process equipment can also be combined to ensure that the selected non-value-added process equipment can maximize production efficiency and economic benefits while ensuring processing quality.

[0183] In the embodiments of the present application illustrated by steps S801 to S803, this process ensures that each target semiconductor material can be processed in the most suitable non-value-added process equipment selected from multiple candidate non-value-added process equipment, thereby improving the accuracy and efficiency of the semiconductor product production process.

[0184] In the embodiments of the present application illustrated by steps S701 and S702, the target non-value-added process equipment that is currently most suitable for performing the processing task can be accurately determined for each target semiconductor material from multiple candidate non-value-added process equipment. This process not only ensures the quality and efficiency of the processing operation, but also improves the flexibility and responsiveness of the entire semiconductor product production process. By intelligently matching the configuration conditions and processing requirements of each candidate non-value-added process equipment, the embodiments of the present application can optimize resource utilization, reduce energy waste, and improve the overall performance of production.

[0185] In step S604 of some embodiments, according to the production link information, the real-time position of the material, and the target non-value-added process equipment corresponding to each target semiconductor material, a material handling path corresponding to the target semiconductor material is generated. The embodiments of the present application can use some path planning algorithms to calculate the optimal handling path from the current position of the material to the target non-value-added process equipment. In this process, factors that can be considered include physical obstacles in the production workshop, the handling situation of other materials, the current load of the production line, etc., to ensure the feasibility and efficiency of the material handling path.

[0186] Refer to Figure 9 , according to some embodiments of the present application, step S604 generates a material handling path corresponding to the target semiconductor material according to the production link information, the real-time position of the material, and the target non-value-added process equipment corresponding to each target semiconductor material, including:

[0187] Step S901, determining the target material handling quantity according to the production link information corresponding to each target semiconductor material;

[0188] Step S902, obtaining the handling load quantity and the corresponding processing bin location information in the target non-value-added process equipment;

[0189] Step S903: Generate a target transportation event based on the target material handling quantity, the handling load quantity, and the processing bin location information.

[0190] Step S904: Generate a material handling path corresponding to each target semiconductor material based on the target transportation event.

[0191] In step S901 of some embodiments, determine the target material handling quantity according to the production process information corresponding to each target semiconductor material.

[0192] It should be noted that the target material handling quantity refers to the quantity of target semiconductor materials that need to be handled currently. Among them, the target material handling quantity is directly related to the total quantity of semiconductor materials that need to be handled in the current production process. The determination of the target material handling quantity can be based on the analysis of the production plan, including all semiconductor materials to be handled in the current production process. Since the production process information of semiconductor materials includes: whether the semiconductor material is waiting to enter a non-value-added process equipment, whether the semiconductor material is undergoing a certain processing step, or whether the semiconductor material has completed a certain process and is ready to enter the next process, etc. Therefore, the current situation of each target semiconductor material can be clarified from these production process information. For example, if there is a batch of target semiconductor materials on the production line that need to enter the material baking oven for baking, then count the quantity of this batch of target semiconductor materials to determine the target material handling quantity, so as to clarify how many materials need to be transported to the material baking oven, which is the target non-value-added process equipment. Determining the target material handling quantity is crucial for evaluating the scale and complexity of the handling task, because it directly affects the required handling resources and time arrangements.

[0193] In step S902 of some embodiments, obtain the handling load quantity and the corresponding processing bin location information in the target non-value-added process equipment.

[0194] It should be noted that the handling load quantity refers to the number of semiconductor materials that each material handling vehicle (such as an automated guided vehicle AGV) can carry in a single handling task. This information is crucial for ensuring handling efficiency and safety, because it determines how to arrange these material handling vehicles to maximize their usage efficiency. The processing bin location information reflects the usage situation of the processing bins in the target non-value-added process equipment, including which bins are idle and which are in use. These information are crucial for planning the handling path and scheduling the handling task, because they directly affect whether the materials can be successfully unloaded onto the target non-value-added process equipment.

[0195] It should be understood that obtaining the number of handling loads and the processing bin information aims to evaluate the quantity and capacity of the currently available handling carriers, as well as the usage of the processing bins in the target non-value-added process equipment, providing crucial data support for subsequent handling path planning and task scheduling. This not only helps improve the execution efficiency of handling tasks but also helps reduce waiting time and resource waste during the production process, thereby enhancing the efficiency of the entire semiconductor manufacturing process.

[0196] In step S903 of some embodiments, a target transport event is generated based on the target material handling quantity, the number of handling loads, and the processing bin information.

[0197] It should be noted that this step is the core of converting the collected data into actual handling tasks. The target material handling quantity refers to the total number of semiconductor materials that need to be handled currently, and the number of handling loads refers to the quantity of materials that each handling carrier can carry. Through these two data, the number of handling carriers required to complete the handling task and possible handling batches can be calculated. The processing bin information provides details of the available storage or processing locations in the target non-value-added process equipment, which is crucial for determining the destination of material unloading.

[0198] In some more specific embodiments, when generating the target transport event, the embodiments of the present application comprehensively consider these factors and create a detailed handling plan. This plan will include the allocation of each handling carrier, the materials to be handled, the estimated handling time, the handling route, and the target bin. The generation of the target transport event needs to consider the priority of the production process, the scheduling of handling carriers, and possible congestion situations to ensure that the handling tasks can be completed on time.

[0199] In step S904 of some embodiments, a material handling path corresponding to each target semiconductor material is generated based on the target transport event.

[0200] It should be noted that the material handling path is generated based on the already generated target transport event. Among them, the material handling path is used to indicate the positions passed by the material handling carrier when performing the material handling task.

[0201] In some more specific embodiments, the planning process of the material handling path can also consider the starting position of the material, the target position, the movement route of the handling carrier, and the conditions in the production workshop. The embodiments of the present application can use some algorithms to optimize the path, avoid conflicts with other handling tasks, and at the same time consider the availability and maintenance time of various process equipment to optimize the overall production process.

[0202] It should be understood that the embodiments of the present application shown in steps S901 to S904 can ensure that the handling process of semiconductor materials is efficient and orderly, and can adapt to dynamic changes in the production process. This method not only improves production efficiency but also reduces possible errors and delays in the material handling process, thus providing strong support for the production of semiconductor products. Through precise path planning and resource scheduling, this embodiment of the present application can maximize the utilization of handling carriers and production equipment, reduce waiting and idle time, and improve the throughput and flexibility of the entire production line.

[0203] According to some embodiments of the present application, generating a target transportation event based on the target material handling quantity, the transportation load quantity, and the processing bin information includes:

[0204] Matching a target transportation event from a pre-constructed set of transportation events based on the target material handling quantity, the transportation load quantity, and the processing bin information.

[0205] It should be noted that the target material handling quantity is determined according to the production process information, which represents the total amount of semiconductor materials that need to be handled currently; the transportation load quantity refers to the quantity of materials that each handling carrier can carry in a single handling task; the processing bin information provides the usage situation of the processing bins in the target non-value-added process equipment, including which bins are idle and which are in use. It should be understood that the target material handling quantity, the transportation load quantity, and the processing bin information are very important for planning the handling path and scheduling the handling tasks.

[0206] It should be pointed out that the set of transportation events contains pre-set transportation events corresponding to various handling requirements. The transportation data set is pre-constructed according to various possible handling requirements. The target transportation event is matched from this pre-constructed set of transportation events, which directly corresponds to the specific handling requirements in the current production process. This matching process may involve searching and selecting from the pre-constructed set of transportation events to find the event that best suits the current handling task. In some embodiments, the generation of the target transportation event can be a dynamic process that can be adjusted according to real-time production data and handling requirements.

[0207] Matching a target transportation event from a pre-constructed set of transportation events means that: the target transportation event is a plan tailored for a specific handling task, which may include information such as the materials to be handled, the allocation of handling carriers, the handling route, the estimated handling time, and the target bin. The generation of the target transportation event needs to consider the priority of the production process, the scheduling of handling carriers, and possible congestion situations to ensure that the handling task can be completed on time.

[0208] In this way, the target transportation event can ensure that the handling process of semiconductor materials is efficient and orderly, and can adapt to the dynamic changes in the production process. This method not only improves production efficiency but also reduces errors and delays that may occur during the material handling process, thus providing support for the production of semiconductor products. The target transportation event can make greater use of handling carriers and production equipment, reduce waiting and idle time, and improve the throughput and flexibility of the entire production line.

[0209] Referring to Figure 10 , according to some embodiments of the present application, before matching the target transportation event from the pre-constructed transportation event set based on the target material handling quantity, handling load quantity, and processing bin location information, it further includes pre-constructing the transportation event set, specifically including:

[0210] Step S1001, obtaining a plurality of preset transportation arrays corresponding to different transportation requirements;

[0211] Step S1002, based on each preset transportation array, constructing a preset transportation event for the corresponding transportation requirement; wherein, each preset transportation event is used to indicate the path planning method for solving one transportation requirement.

[0212] In step S1001 of some embodiments, obtaining a plurality of preset transportation arrays corresponding to different transportation requirements;

[0213] It should be noted that each preset transportation array includes preset processing bin location information, preset handling load quantity, and preset material handling quantity that match one transportation requirement. In the embodiments of the present application, the preset transportation arrays are the basis for constructing the pre-constructed transportation event set, and they are designed for specific handling requirements. Each preset transportation array is for meeting a specific handling requirement.

[0214] In step S1002 of some embodiments, based on each preset transportation array, constructing a preset transportation event for the corresponding transportation requirement; wherein, each preset transportation event is used to indicate the path planning method for solving one transportation requirement.

[0215] It should be noted that the preset transportation events are detailed plans for specific handling requirements, and they indicate the path planning methods for solving the handling requirements. In some embodiments, the construction of these preset transportation events can also consider the priorities of the production process, the scheduling of handling carriers, and possible congestion situations.

[0216] In some more specific embodiments of the present application, the preset processing bin information may indicate that the number of occupied bins inside the target non - value - added process equipment is 0, 1, or 2; the preset handling load number may indicate that the load number of the material handling carrier is 2, that is, the material handling carrier can carry at most 2 semiconductor materials; the preset material handling number may indicate the number of materials that need to be handled on the rack accommodating semiconductor materials under different transportation requirements. It should be noted that the material turning operation refers to the operation of loading and unloading by using an idle accommodation position between the target non - value - added process equipment and the material handling carrier, or between the rack and the material handling carrier to turn the position of the semiconductor material. The same - group transportation means that a material handling carrier transports two semiconductor materials simultaneously during one trip. Here, one trip refers to a round - trip transportation of the material handling carrier between the rack and the target non - value - added process equipment.

[0217] The pre - constructed set of transportation events is shown in Table 1 below:

[0218]

[0219] Table 1

[0220] For the first type of transportation requirement, the preset material handling number is 1 and the preset processing bin information is 0, that is, the number of materials that need to be handled on the rack is 1 and the number of occupied bins inside the target non - value - added process equipment is 0. At this time, the preset transportation event is: using the material handling carrier to transport material A from the rack to the target non - value - added process equipment. Since there are 2 unoccupied processing bins inside the target non - value - added process equipment as idle accommodation positions during loading and unloading, material A can be directly transported from the rack to the target non - value - added process equipment to complete the corresponding preset transportation event, without turning the semiconductor material, and no material turning operation occurs. In addition, a material handling carrier transports only one semiconductor material during one trip, and no same - group transportation occurs.

[0221] For the second type of transportation requirement, the preset material handling number is 2 and the preset processing bin information is 0, that is, the number of materials that need to be handled on the rack is 2 and the number of occupied bins inside the target non - value - added process equipment is 0. At this time, the preset transportation event is: using the material handling carrier to transport material A and material B from the rack to the target non - value - added process equipment in sequence. Since there are 2 unoccupied processing bins inside the target non - value - added process equipment as idle accommodation positions during loading and unloading, material A and material B can be directly transported from the rack to the target non - value - added process equipment to complete the corresponding preset transportation event, without turning the semiconductor material, and no material turning operation occurs. In addition, a material handling carrier transports two semiconductor materials simultaneously during one trip, and same - group transportation occurs.

[0222] For the 3rd transportation requirement, the preset number of material handling is 0, and the preset processing storage location information is 1, that is, the number of materials to be handled on the rack is 0, and the occupied storage location inside the target non-value-added process equipment is 1. At this time, the preset transportation event is: use the material handling vehicle to transport Material A from the target non-value-added process equipment to the rack. Since there are 2 idle accommodation positions on the material handling vehicle during loading and unloading, Material A can be directly transported from the target non-value-added process equipment to the rack to complete the corresponding preset transportation event, without reversing the semiconductor material, and no material reversing operation occurs. In addition, a material handling vehicle transports only one semiconductor material in one trip, and no group transportation occurs.

[0223] For the 4th transportation requirement, the preset number of material handling is 0, and the preset processing storage location information is 2, that is, the number of materials to be handled on the rack is 0, and the occupied storage location inside the target non-value-added process equipment is 2. At this time, the preset transportation event is: use the material handling vehicle to transport Material A and Material B from the target non-value-added process equipment to the rack in sequence. Since there are 2 idle accommodation positions on the material handling vehicle during loading and unloading, Material A and Material B can be directly transported from the target non-value-added process equipment to the rack to complete the corresponding preset transportation event, without reversing the semiconductor material, and no material reversing operation occurs. In addition, a material handling vehicle transports two semiconductor materials at the same time in one trip, and group transportation occurs.

[0224] For the 5th transportation requirement, the preset number of material handling is 1, and the preset processing storage location information is 1, that is, the number of materials to be handled on the rack is 1, and the occupied storage location inside the target non-value-added process equipment is 1. At this time, the preset transportation event is: use the material handling vehicle to first transport Material A from the rack to the target non-value-added process equipment, and then use the material handling vehicle to transport Material B from the target non-value-added process equipment to the rack. Since there is 1 idle accommodation position in the target non-value-added process equipment and 1 idle accommodation position on the material handling vehicle during loading and unloading, these two idle accommodation positions need to be used to reverse Materials A and B to complete loading and unloading, so a material reversing operation occurs. In addition, a material handling vehicle transports two semiconductor materials at the same time in one trip, and group transportation occurs.

[0225] For the 6th transportation requirement, the preset number of material handling is 2, and the preset processing bin information is 1, that is, the number of materials to be handled on the rack is 2, and the occupied bin inside the target non - value - added process equipment is 1. At this time, the preset transportation event is: using the material handling vehicle to first transport Material A and Material B from the rack to the target non - value - added process equipment, and then using the material handling vehicle to transport Material C from the target non - value - added process equipment to the rack. Since there is 1 idle accommodation position in the target non - value - added process equipment and no idle accommodation position in the material handling vehicle during loading and unloading, these two idle accommodation positions are needed to turn around Material A, Material B, and Material C to complete loading and unloading, so a material turning operation occurs. In addition, a material handling vehicle transports two semiconductor materials simultaneously in one trip, resulting in a same - group transportation.

[0226] For the 7th transportation requirement, the preset number of material handling is 1, and the preset processing bin information is 2, that is, the number of materials to be handled on the rack is 1, and the occupied bin inside the target non - value - added process equipment is 2. At this time, the preset transportation event is: using the material handling vehicle to first transport Material A from the rack to the target non - value - added process equipment, and then using the material handling vehicle to transport Material B and Material C from the target non - value - added process equipment to the rack. Since there is 1 idle accommodation position in the target non - value - added process equipment and no idle accommodation position in the material handling vehicle during loading and unloading, these two idle accommodation positions are needed to turn around Material A, Material B, and Material C to complete loading and unloading, so a material turning operation occurs. In addition, a material handling vehicle transports two semiconductor materials simultaneously in one trip, resulting in a same - group transportation.

[0227] For the 8th transportation requirement, the preset number of material handling is 2, and the preset processing bin information is 2, that is, the number of materials to be handled on the rack is 2, and the occupied bin inside the target non - value - added process equipment is 2. At this time, the preset transportation event is: using the material handling vehicle to first transport Material C and Material D from the target non - value - added process equipment to the rack using the material handling vehicle, and then transport Material A and Material B from the rack to the target non - value - added process equipment. Since the material handling vehicle first goes to the target non - value - added process equipment, and there is no idle accommodation position in the target non - value - added process equipment and 2 idle accommodation positions in the material handling vehicle during loading and unloading, Material A and Material B can be directly transported from the target non - value - added process equipment to the rack. Further, when the material handling vehicle goes to the rack, there is no idle accommodation position in the material handling vehicle during loading and unloading, but there are idle accommodation positions on the rack. At this time, the idle accommodation positions on the rack can be used to turn around Material A, Material B, Material C, and Material D to complete loading and unloading, so a material turning operation occurs. In addition, a material handling vehicle transports two semiconductor materials simultaneously in one trip, resulting in a same - group transportation.

[0228] It should be noted that the material transfer operation and the same-group transportation are two key concepts in this application for improving the handling efficiency of semiconductor materials. The material transfer operation refers to the situation during the material handling process where, when the storage location of the target non-value-added process equipment is occupied and direct loading and unloading cannot be carried out, a transfer operation is required to rearrange the position of the material. The idle accommodation positions can be inside the target equipment, on the material handling carrier, or on the rack, to ensure the smooth movement of semiconductor materials between equipment. The role of the material transfer operation is to solve spatial conflicts, optimize material flow, reduce waiting time, and thus improve the continuity and efficiency of the entire production process.

[0229] The same-group transportation means that a material handling carrier transports two or more semiconductor materials in a single trip. The role of this approach is to improve the utilization rate of the handling carrier, reduce the number of round trips, and thus reduce the handling cost and time. Through the same-group transportation, the handling path can be more effectively planned, making the handling process more compact and efficient. Especially in the case of handling a large number of materials or requiring frequent handling, the same-group transportation can significantly improve the handling efficiency.

[0230] Combining the material transfer operation and the same-group transportation, the embodiments of this application can flexibly handle various production scenarios. Whether facing a tight equipment storage location or the need to efficiently handle a large number of materials, through intelligent scheduling and planning, the optimization of semiconductor material handling can be achieved. This optimization not only improves production efficiency but also helps to reduce production costs and enhance the flexibility and responsiveness of the production line.

[0231] The embodiments of this application shown via steps S601 to S604 have realized the whole process from the parsing of production link information to the determination of the target non-value-added process equipment and then to the generation of the material handling path. This process not only improves the accuracy and efficiency of semiconductor material handling but also ensures the continuity and flexibility of the production process.

[0232] In step S502 of some embodiments, based on the material handling path, a material handling task is configured for the corresponding target semiconductor material. This step involves converting the result of path planning into specific handling instructions, which will be sent to the material handling carrier, such as an automated guided vehicle (AGV). The configuration of the handling task can include not only the target location but also specific requirements during the handling process, such as the handling speed, safety checkpoints, and the precise placement position of the material.

[0233] Refer to Figure 11 , according to some embodiments of this application, before step S502 configures a material handling task for the corresponding target semiconductor material based on the material handling path, it may further include:

[0234] Step S1101: In response to the downstream node being a value-added operation node, extract the downstream handling location from the node constraint information.

[0235] Step S1102: Generate a material handling path corresponding to the target semiconductor material based on the downstream handling location and the real-time location of the material.

[0236] In some embodiments of the present application, step S502 involves configuring a material handling task for the corresponding target semiconductor material based on the material handling path. However, before entering this step, the embodiments of the present application need to handle some additional situations, especially when the downstream node is a value-added operation node. In this case, steps S1101 and S1102 provide a method to determine the material handling path of the target semiconductor material.

[0237] Step S1101 of some embodiments is specifically for the cases where the downstream node is a value-added operation node. In the process of semiconductor product production, the cases where the downstream node is a value-added operation node cover a wide range of production links, which can involve different processing steps, detection procedures, or storage requirements. For example:

[0238] Process equipment nodes: Specifically, it can include cutting equipment required for PCB substrate preparation, surface mounting process equipment, equipment for automatically identifying and grasping PCB substrates, and dispensing machines and chip mounters used in the chip mounting process. In some other embodiments, the process equipment can also include equipment required for the plastic frame pasting process, pick-and-place machines used in the photosensitive chip and light-emitting chip pasting processes, and wire bonding equipment in the wire bonding process.

[0239] Storage areas: In the production process, sometimes it is necessary to temporarily store materials in specific storage areas, such as on shelves, to wait for subsequent processes or due to production scheduling needs. These storage areas are also a type of value-added operation node.

[0240] Packaging and shipping preparation areas: For semiconductor products that have completed all manufacturing processes, the downstream node may be a packaging line or a shipping preparation area to package the products and prepare for shipment.

[0241] It should be noted that these value-added operation nodes are important components in the process of semiconductor product production, and each value-added operation node has its specific functions and requirements. The embodiments of the present application need to be able to identify these different downstream nodes and configure appropriate material handling tasks for each downstream node to ensure the smoothness and efficiency of the entire production process.

[0242] In the case where the downstream node is a value-added operation node, the embodiments of the present application need to extract the downstream handling position from the node constraint information. The node constraint information can include various instructions and parameters, such as the positions of specific value-added process equipment, workstations, racks, or other production links. These node constraint information are crucial for determining the next position where the material needs to go after completing the current process. The embodiments of the present application will parse the node constraint information of these value-added operation nodes to identify the accurate downstream handling position.

[0243] In step S1102 of some embodiments, based on the downstream handling position and the real-time position of the material extracted in step S1101, a material handling path corresponding to the target semiconductor material is generated. This step needs to comprehensively consider factors such as the distance between the two positions, the workshop layout, and other factors that may affect the handling efficiency. The embodiments of the present application can use some path planning algorithms to calculate the optimal handling path, so that this handling path can not only ensure that the target semiconductor material can move safely and quickly from the current position to the downstream handling position, but also avoid conflicts with other handling tasks, reducing waiting and congestion.

[0244] Through the embodiments of the present application shown in steps S1101 to S1102, an accurate handling path can be generated for the target semiconductor materials whose downstream nodes are value-added operation nodes. This process ensures that even in the value-added process, the target semiconductor materials can be effectively transported to the correct positions, thus ensuring the continuity and efficiency of the entire production process. This flexible processing method enables the embodiments of the present application to adapt to changing production requirements, improves the adaptability to complex production environments, and ensures the high efficiency and accuracy of material handling in the semiconductor product production process.

[0245] Through the embodiments of the present application shown in steps S501 and S502, it is jointly ensured that the target semiconductor materials can be efficiently and accurately transported to the predetermined production links. Through intelligent path planning and task configuration, this process not only improves production efficiency, reduces the time and cost of material handling, enhances the flexibility and responsiveness of production, but also enables the semiconductor product production process to more flexibly adapt to changing production requirements and conditions.

[0246] In step S104 of some embodiments, a material handling task is sent to multiple material handling carriers to handle each target semiconductor material through the material handling carriers;

[0247] In the semiconductor product production process, the material handling control equipment needs to send a material handling task to multiple material handling carriers, which is the key execution stage of automated material handling. The core of this step is to ensure that the target semiconductor materials can move accurately and efficiently from the current position to the designated non-value-added process equipment or other process equipment.

[0248] First, the material handling vehicle can include an Automated Guided Vehicle (AGV) or other automated transportation equipment. These material handling vehicles are equipped with navigation and identification systems, which can automatically identify the location of the target semiconductor material according to the issued task instructions and transport it to the correct destination.

[0249] In the embodiments of the present application, multiple factors can be considered when the material handling control device issues a material handling task, including but not limited to: the current position, availability, handling path of each material handling vehicle, and the priority of the target semiconductor material. The embodiments of the present application can allocate tasks to the most suitable material handling vehicle according to these factors to ensure the smoothness and efficiency of the handling process. For example, if a material handling vehicle is relatively close to the location of the target semiconductor material and is not performing other tasks currently, the embodiments of the present application can preferentially select this vehicle to perform the material handling task.

[0250] In addition, the embodiments of the present application also need to ensure that the issuance of the material handling task does not conflict with other tasks, and avoid path crossing or resource contention. Therefore, the embodiments of the present application can also monitor the status and position of all handling vehicles in real time, as well as other logistics activities in the factory, to optimize task allocation and path planning. This helps to reduce the waiting time and potential congestion during the handling process and improve the overall handling efficiency.

[0251] In steps S105 to S106 of some embodiments, receive a material handling task from the material handling control device, and perform a handling operation on the corresponding target semiconductor material according to the material handling task.

[0252] It should be noted that after the material handling vehicle receives the material handling task, it can perform the handling operation according to the built-in program and the real-time data corresponding to the material handling task. This can include arriving at the location of the target semiconductor material, identifying and grasping the material, and then transporting the material along the planned path to the designated non-value-added process equipment, rack, process equipment or other locations. During the entire handling process, the material handling vehicle may encounter various challenges, such as path obstacles, equipment failures or emergencies. Therefore, the material handling vehicle needs to have a certain intelligent decision-making ability to be able to adjust the path in time or request manual intervention when encountering problems.

[0253] Refer to Figure 12, in some more specific embodiments, there is a communication architecture between the material handling vehicle and the non - value - added process equipment. This communication architecture allows for effective information exchange between the material handling vehicle and the non - value - added process equipment. In this communication architecture, the non - value - added process equipment is equipped with a SECS - GEM Agent, which is a software agent based on the SEMI E30 standard and can be used to implement communication between the non - value - added process equipment and the Manufacturing Execution System (MES), the factory control system, or the material handling vehicle. Among them, the SECS - GEM Agent can communicate with the IDSServer through the REST API.

[0254] The IDS Server, that is, the Intelligent Dispatching Server, plays a core role in the embodiments of this application. It is responsible for receiving information from the SECS - GEM Agent of the non - value - added process equipment and optimizing the entire production process by analyzing this information. The IDS Server communicates with the material handling vehicle through a wireless network, sending handling tasks and instructions, and at the same time collecting the status and location information of the vehicle to achieve real - time monitoring and scheduling. The material handling vehicle in the embodiments of this application, such as an Automated Guided Vehicle (AGV), can maintain a connection with the IDS Server. This connection enables the material handling vehicle to receive commands from the IDS Server, such as handling tasks and path planning instructions. In addition, the material handling vehicle can also send its current status and location information back to the IDS Server for the IDS Server to perform real - time scheduling and optimization.

[0255] The REST API, that is, the Representational State Transfer Application Programming Interface, is a design style of network application programming interface used to implement communication between the client and the server. It should be noted that the REST API, as the communication bridge between the IDS Server and the SECS - GEM Agent, allows the two to interact through standardized requests and responses. The design principles of the REST API include using standard HTTP methods (such as GET, POST, PUT, DELETE) to perform different operations and identifying resources through URIs (Uniform Resource Identifiers). This design makes the API easy to understand and use, and also facilitates communication and integration between different devices.

[0256] In the embodiments of the present application, the IDS Server sends requests to the SECS-GEM Agent through the REST API to obtain the status information of non-value-added process equipment or send commands. After receiving the requests, the SECS-GEM Agent processes these requests and returns the corresponding data. In addition, the SECS-GEM Agent can also send event notifications to the IDS Server through the REST API, such as when the equipment completes a production cycle or encounters a fault. This two-way communication mechanism ensures the real-time update of information and the smooth operation of the process.

[0257] By combining the use of the IDS Server and the REST API, the embodiments of the present application can achieve a high degree of automation and intelligence. The intelligent scheduling function of the IDS Server combined with the flexibility and standardization of the REST API provides an efficient, reliable, and easy-to-maintain solution for material handling in the semiconductor manufacturing process. This integrated communication method not only improves production efficiency but also enhances scalability and interoperability, enabling different types of devices to work together under a unified communication standard.

[0258] In the Passive mode, the non-value-added process equipment can refrain from actively sending information and instead wait for requests from the Manufacturing Execution System (MES), the factory control system, or the material handling carrier. When the material handling carrier needs to interact with the non-value-added process equipment, it sends a request to the non-value-added process equipment. After receiving the request, the non-value-added process equipment provides the corresponding information or performs the corresponding operation according to the request. In this mode, the communication of the non-value-added process equipment is responsive. It does not actively push information but provides services after receiving a request.

[0259] In the Active mode, the non-value-added process equipment can actively send information to the material handling carrier or the central control system. For example, it can specifically include equipment status updates, alarms, completion notifications, or other important event information. Active communication allows the non-value-added process equipment to immediately notify the material handling carrier or the control system when a critical event occurs, thus making the entire production process smoother and more efficient.

[0260] The design of the entire communication architecture aims to improve the automation level in the semiconductor manufacturing process, ensure the coordinated work between the material handling carrier and the non-value-added process equipment, thereby improving production efficiency and reducing manual intervention. Through this integrated communication method, interoperability between devices can be achieved, enabling devices from different manufacturers to work together under a unified communication standard, which plays a role in enhancing the flexibility and scalability of semiconductor manufacturing.

[0261] It should be understood that steps S104 to S106 are the key links for realizing the automatic handling of semiconductor materials. The material handling control device ensures that the first number of target semiconductor materials can be accurately and efficiently handled to the correct positions by intelligently issuing tasks to multiple material handling carriers. In this way, through the embodiments of the present application, it not only helps to improve the production efficiency of semiconductor products during the production process, reduces the labor cost, but also enhances the flexibility and scalability of production.

[0262] Referring to Figure 13 , according to some embodiments of the present application, step S106 may perform a handling operation on the corresponding target semiconductor material according to the material handling task, including:

[0263] Step S1301, perform task parsing on the material handling task to obtain the handling start position, the handling end position, the material handling path, and the current real-time position of the target semiconductor material;

[0264] Step S1302, control the material handling carrier to move from the current real-time position of the material to the handling start position;

[0265] Step S1303, in response to the material handling carrier reaching the handling start position, execute the pick-up action subtask to load the target semiconductor material onto the material handling carrier;

[0266] Step S1304, control the material handling carrier to move from the handling start position along the material handling path to the handling end position;

[0267] Step S1305, in response to the material handling carrier reaching the handling end position, execute the placement action subtask to unload the target semiconductor material from the material handling carrier.

[0268] In some embodiments of the present application, step S106 describes the process of the material handling carrier performing a handling operation on the target semiconductor material according to the material handling task. This process ensures that each target semiconductor material can be accurately handled from the real-time position of the material to the designated position.

[0269] In step S1301 of some embodiments, task parsing is performed on the material handling task to obtain the handling start position, the handling end position, the material handling path, and the current real-time position of the target semiconductor material. This step is the prerequisite for the material handling carrier to perform the handling operation. The embodiments of the present application need to extract key information from the material handling task, including the handling start position, the handling end position, the material handling path, and the current real-time position of the target semiconductor material. These information are crucial for the subsequent handling operations and reflect the specific requirements of the material handling task.

[0270] In step S1302 of some embodiments, the material handling vehicle is controlled to move from the current real-time position of the material to the handling starting position. This step is the starting action of the material handling operation. In the embodiments of the present application, the material handling vehicle (such as an AGV) will be guided to reach the predetermined starting position safely and accurately along the set path or instruction.

[0271] Step S1303 of some embodiments is executed after the material handling vehicle reaches the handling starting position. In this step, the embodiments of the present application will execute the picking action subtask, that is, loading the target semiconductor material onto the material handling vehicle. This step requires precise operation to ensure the safety and integrity of the target semiconductor material and avoid any damage during handling.

[0272] Step S1304 of some embodiments is the position movement stage of the material handling vehicle during the handling process. In this step, the embodiments of the present application control the material handling vehicle to move from the handling starting position to the handling ending position along the previously parsed material handling path. During this process, the embodiments of the present application can monitor the position and status of the material handling vehicle in real time to ensure that it follows the material handling path and make adjustments when encountering obstacles or deviations.

[0273] Step S1305 of some embodiments is executed after the material handling vehicle reaches the handling ending position. In this step, the embodiments of the present application will execute the placing action subtask, that is, unloading the target semiconductor material from the material handling vehicle.

[0274] Through the five sub-steps of step S1301 to step S1305 of the embodiments of the present application, the whole process from task parsing to material loading, handling, and unloading can be realized. This process not only improves the efficiency and accuracy of semiconductor material handling, but also enhances the flexibility and responsiveness of production, which is crucial for improving the overall performance of semiconductor product production.

[0275] Referring to Figure 14 , the material handling control device for semiconductor product production according to the embodiments of the present application includes:

[0276] A first acquisition module 1401, configured to acquire the production process information and the real-time position of the material corresponding to each of the first number of target semiconductor materials;

[0277] A second acquisition module 1402, configured to acquire the non-value-added process configuration conditions and the real-time status of the non-value-added equipment corresponding to each of the second number of non-value-added process equipment;

[0278] A material handling task configuration module 1403, configured to configure corresponding material handling tasks for the target semiconductor materials according to the production process information, real-time positions of the materials corresponding to each of the target semiconductor materials, non-value-added process configuration conditions corresponding to each of the non-value-added process equipment, and real-time states of the non-value-added equipment;

[0279] A task distribution module 1404, configured to distribute the material handling tasks to multiple material handling carriers, so as to handle each of the target semiconductor materials through the material handling carriers.

[0280] It can be seen that the content in the above embodiments of the material handling method for semiconductor product production is applicable to the embodiments of the material handling control equipment for semiconductor product production. The functions specifically implemented in the embodiments of the material handling control equipment for semiconductor product production are the same as those in the above embodiments of the material handling method for semiconductor product production, and the beneficial effects achieved are also the same as those in the above embodiments of the material handling method for semiconductor product production.

[0281] Refer to Figure 15 , a material handling carrier for semiconductor product production according to an embodiment of the present application includes:

[0282] A task receiving module 1501, configured to receive a material handling task from a material handling control equipment; wherein, the material handling task is obtained by the material handling control equipment through the following steps: for a first number of target semiconductor materials, obtaining the production process information and real-time positions of the materials corresponding to each of the target semiconductor materials; for a second number of non-value-added process equipment, obtaining the non-value-added process configuration conditions and real-time states of the non-value-added equipment corresponding to each of the non-value-added process equipment; and configuring corresponding material handling tasks for the target semiconductor materials according to the production process information, real-time positions of the materials corresponding to each of the target semiconductor materials, non-value-added process configuration conditions corresponding to each of the non-value-added process equipment, and real-time states of the non-value-added equipment;

[0283] A handling execution module 1502, configured to perform a handling operation on the corresponding target semiconductor material according to the material handling task.

[0284] It can be seen that the content in the above embodiments of the material handling method for semiconductor product production is applicable to the embodiments of the material handling carrier for semiconductor product production. The functions specifically implemented in the embodiments of the material handling carrier for semiconductor product production are the same as those in the above embodiments of the material handling method for semiconductor product production, and the beneficial effects achieved are also the same as those in the above embodiments of the material handling method for semiconductor product production.

[0285] Reference Figure 16 , Figure 16 illustrates the hardware structure of an electronic device according to another embodiment. The electronic device may include:

[0286] A processor 1601, which can be implemented in ways such as a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0287] A memory 1602, which can be implemented in forms such as a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 1602 can store an operating system and other application programs. When implementing the technical solutions provided in the embodiments of this specification through software or firmware, the relevant program codes are stored in the memory 1602 and are called by the processor 1601 to execute the material handling method for semiconductor product production in the embodiments of the present application;

[0288] An input / output interface 1603, which is used to implement information input and output;

[0289] A communication interface 1604, which is used to implement communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or through wireless means (such as mobile network, WIFI, Bluetooth, etc.);

[0290] A bus 1605, which transmits information between various components of the device (such as the processor 1601, the memory 1602, the input / output interface 1603, and the communication interface 1604);

[0291] Among them, the processor 1601, the memory 1602, the input / output interface 1603, and the communication interface 1604 achieve communication connections with each other inside the device through the bus 1605.

[0292] The embodiments of the present application also provide a computer program product, which includes a computer program. The processor of the computer device reads and executes this computer program, so that the computer device executes the material handling method for semiconductor product production described above.

[0293] In the description of the present disclosure and the above-mentioned accompanying drawings, terms such as "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present disclosure described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "comprise" and "include" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that comprises a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0294] It should be understood that in the present disclosure, "at least one (item)" means one or more, and "a plurality" means two or more. "And / or" is used to describe the association relationship of associated objects and indicates that three relationships may exist. For example, "A and / or B" may mean: only A exists, only B exists, and both A and B exist at the same time. Among them, A and B can be singular or plural. The character " / " generally means that the associated objects before and after are in an "or" relationship. "At least one (one) of the following" or its similar expression means any combination of these items, including any combination of single item (one) or plural items (ones). For example, at least one (one) of a, b or c may mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0295] It should be understood that in the description of the embodiments of the present application, the meaning of "a plurality (or multiple items)" is more than two. Understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number.

[0296] In several embodiments provided by the present disclosure, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces, and the indirect coupling or communication connection of devices or units can be in electrical, mechanical or other forms.

[0297] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0298] In addition, the functional units in various embodiments of the present disclosure may be integrated in a processing unit, may exist separately as individual physical units, or two or more units may be integrated in one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

[0299] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present disclosure, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in various embodiments of the present disclosure. The aforementioned storage medium may include: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0300] It should also be understood that the various embodiments provided in the embodiments of the present application can be combined arbitrarily to achieve different technical effects.

[0301] The above is a specific description of the embodiments of the present disclosure, but the present disclosure is not limited to the above embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present disclosure, and these equivalent deformations or substitutions are all included within the scope defined by the claims of the present disclosure.

Claims

1. A material handling method for semiconductor product production, characterized in that: Applications in material handling control equipment, including: For a first number of target semiconductor materials, obtaining production link information and real-time location of each target semiconductor material; For a second number of non-value-added process equipment, obtaining a non-value-added process configuration condition and a real-time status of the non-value-added equipment corresponding to each of the non-value-added process equipment; According to the production link information and the real-time location of each target semiconductor material, the non-value-added process configuration conditions and the real-time status of each non-value-added process equipment, corresponding to each target semiconductor material, a corresponding material handling task is configured for the target semiconductor material; The material handling tasks are issued to a plurality of material handling carriers so that the target semiconductor materials are each handled by the material handling carriers.

2. The method according to claim 1, characterized in that The configuring corresponding material handling tasks for the target semiconductor materials according to the production link information and the real-time location of the materials corresponding to each of the target semiconductor materials, the non-value-added process configuration conditions and the real-time status of the non-value-added process equipment corresponding to each of the non-value-added process equipment, comprises: For each of the target semiconductor materials, a material handling path corresponding to the target semiconductor material is generated according to the corresponding production link information and the real-time location of the material, the non-value-added process configuration conditions corresponding to each of the non-value-added process equipment, and the real-time status of the non-value-added equipment; Based on the material handling path, the material handling task is configured for the corresponding target semiconductor material.

3. The method according to claim 2, characterized in that For each of the target semiconductor materials, according to the corresponding production link information and the real-time location of the material, the non-value-added process configuration conditions corresponding to each of the non-value-added process equipment, and the real-time status of the non-value-added equipment, a material handling path corresponding to the target semiconductor material is generated, including: Performing production node analysis on the production link information corresponding to each target semiconductor material to determine the downstream node of the target semiconductor material; wherein the downstream node is configured with corresponding node constraint information; In response to the downstream node being a non-value-added operation node, based on the real-time status of the non-value-added equipment corresponding to the non-value-added process equipment, determining a candidate non-value-added process equipment in an idle state from each of the non-value-added process equipment; Determine a target non-value-added process equipment from each of the candidate non-value-added process equipment in an idle state according to the non-value-added process configuration condition and the node constraint information corresponding to the non-value-added operation node; The material handling path corresponding to the target semiconductor material is generated according to the production link information corresponding to each target semiconductor material, the real-time location of the material and the target non-value-added process equipment.

4. The method according to claim 3, characterized in that The node constraint information corresponding to the non-value-added operation node includes process requirement constraint information, and determining a target non-value-added process equipment from each of the candidate non-value-added process equipment in an idle state according to the non-value-added process configuration condition and the node constraint information corresponding to the non-value-added operation node includes: Acquire the non-value-added process configuration condition corresponding to each of the candidate non-value-added process equipment; The non-value-added process configuration conditions corresponding to each of the candidate non-value-added process equipment are matched with the process requirement constraint information to determine the target non-value-added process equipment.

5. The method according to claim 4, characterized in that Matching the non-value-added process configuration conditions corresponding to each of the candidate non-value-added process equipment with the process requirement constraint information to determine the target non-value-added process equipment, including: Matching the non-value-added process configuration conditions corresponding to each candidate non-value-added process equipment with the process requirement constraint information to obtain matching associated equipment; Obtaining the effective accommodation space corresponding to each of the matching associated devices; The target non-value-added process equipment is determined for the target semiconductor material according to the effective accommodation vacancy.

6. The method according to claim 3, characterized in that Before configuring the material handling task for the corresponding target semiconductor material based on the material handling path, the method further includes: In response to the downstream node being a value-added operation node, extracting a downstream transport position from the node constraint information; The material transport path corresponding to the target semiconductor material is generated according to the downstream transport position and the real-time position of the material.

7. The method according to claim 3, characterized in that The step of generating the material handling path corresponding to the target semiconductor material according to the production link information corresponding to each target semiconductor material, the real-time location of the material, and the target non-value-added process equipment comprises: Determine the target material handling quantity according to the production link information corresponding to each target semiconductor material; Obtaining the number of transported loads and the processing location information corresponding to the target non-value-added process equipment; Generate a target transport event based on the target material handling number, the handling load number and the processing storage location information; Based on the target transport event, the material transport path corresponding to each of the target semiconductor materials is generated.

8. The method according to claim 7, characterized in that The generating a target transport event based on the target material transport number, the transport load number and the processing storage location information includes: Based on the target material handling number, the handling load number and the processing storage location information, the target transport event is obtained by matching from a pre-constructed transport event set.

9. The method according to claim 8, characterized in that Before obtaining the target transport event from the pre-constructed transport event set based on the target material transport number, the transport load number and the processing storage location information, the transport event set is pre-constructed, specifically including: Acquire multiple preset transport arrays corresponding to different transport requirements; Based on each of the preset transport arrays, a preset transport event is constructed for the corresponding transport demand; wherein each of the preset transport events is used to indicate a path planning method for solving one of the transport demands.

10. The method according to any one of claims 1 to 9, characterized in that: A first communication connection is established between the material handling control device and the production batch arrangement system, and a second communication connection is established between the material handling control device and the material tracking system. For the first number of target semiconductor materials, the production link information and the real-time location of the materials corresponding to each of the target semiconductor materials are obtained, including: Acquiring production batch information corresponding to each of the target semiconductor materials from the production batch arrangement system via the first communication connection; Performing production link analysis on the production batch information to determine the production link information; The real-time location of the material corresponding to each of the target semiconductor materials is obtained from the material tracking system via the second communication connection.

11. The method according to claim 10, characterized in that The step of obtaining the production link information and the real-time location of each target semiconductor material for the first number of target semiconductor materials further includes: In response to failure to obtain valid production batch information via the first communication connection, receiving a custom input instruction issued by a production manager; The production link information is obtained from the custom input instruction.

12. The method according to claim 11, characterized in that In response to failure to obtain valid production batch information via the first communication connection, receiving a custom input instruction issued by a production administrator includes: In response to failure to obtain valid production batch information via the first communication connection, pushing an instruction editing program to a production management terminal corresponding to the production administrator; In response to the production manager performing an instruction editing operation based on the instruction editing program, the custom input instruction is acquired.

13. A material handling method for semiconductor product production, characterized in that: Applications in material handling vehicles, including: Receive a material handling task from a material handling control device; wherein the material handling task is obtained in the material handling control device through the following steps: for a first number of target semiconductor materials, obtain the production link information and the real-time location of the material corresponding to each of the target semiconductor materials; for a second number of non-value-added process equipment, obtain the non-value-added process configuration conditions and the real-time status of the non-value-added process equipment corresponding to each of the non-value-added process equipment; configure the corresponding material handling task for the target semiconductor material according to the production link information and the real-time location of the material corresponding to each of the target semiconductor materials, the non-value-added process configuration conditions and the real-time status of the non-value-added process equipment corresponding to each of the non-value-added process equipment; According to the material handling task, a handling operation is performed on the corresponding target semiconductor material.

14. The method according to claim 13, characterized in that The performing a handling operation on the corresponding target semiconductor material according to the material handling task includes: Performing task analysis on the material handling task to obtain a handling starting point position, a handling end point position, the material handling path, and a current real-time position of the target semiconductor material; Control the material handling vehicle to move from the current real-time position of the material to the handling starting position; In response to the material handling carrier arriving at the handling starting position, executing a picking action subtask to load the target semiconductor material onto the material handling carrier; Controlling the material transport vehicle to move from the transport starting position to the transport end position along the material transport path; In response to the material handling carrier arriving at the handling end position, a placement action subtask is executed to unload the target semiconductor material from the material handling carrier.

15. A material handling control device for semiconductor product production, characterized in that: include: A first acquisition module is used to acquire production link information and real-time location of each target semiconductor material for a first number of target semiconductor materials; A second acquisition module is used to acquire, for a second number of non-value-added process equipment, non-value-added process configuration conditions and non-value-added equipment real-time status corresponding to each of the non-value-added process equipment; A material handling task configuration module, configured to configure a corresponding material handling task for each target semiconductor material according to the production link information and the real-time location of the material corresponding to each target semiconductor material, the non-value-added process configuration condition and the real-time status of the non-value-added process equipment corresponding to each non-value-added process equipment; The task issuing module is used to issue the material handling tasks to a plurality of material handling vehicles so that the target semiconductor materials are transported by the material handling vehicles.

16. A material handling vehicle for semiconductor product production, characterized in that: include: A task receiving module is used to receive a material handling task from a material handling control device; wherein the material handling task is obtained in the material handling control device through the following steps: for a first number of target semiconductor materials, obtaining the production link information and the real-time location of the materials corresponding to each of the target semiconductor materials; for a second number of non-value-added process equipment, obtaining the non-value-added process configuration conditions and the real-time status of the non-value-added process equipment corresponding to each of the non-value-added process equipment; and configuring the corresponding material handling task for the target semiconductor material according to the production link information and the real-time location of the materials corresponding to each of the target semiconductor materials, the non-value-added process configuration conditions and the real-time status of the non-value-added process equipment corresponding to each of the non-value-added process equipment; The transport execution module is used to perform a transport operation on the corresponding target semiconductor material according to the material transport task.

17. A computer-readable storage medium, characterized in that: The storage medium stores a program, and the program is executed by a processor to implement the material handling method for semiconductor product production as described in any one of claims 1 to 14.

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