Semiconductor measuring device

Abstract

The invention relates to the technical field of semiconductors, and provides a semiconductor measuring device which comprises a workpiece table used for bearing a measured substrate; a plurality of camera parts which can move to a position above a specified part of the substrate to be measured to shoot the specified part and acquire a measurement image; an image processing unit capable of processing the measurement image; the plurality of backlight source parts can move to the lower part of a specified part of the substrate to be detected and provide illumination for the specified part from the lower part through the workpiece table; the backlight source parts and the camera parts are arranged in a one-to-one correspondence manner; the control part drives the corresponding camera part / backlight source part to move to the position above / below the designated part of the measured substrate, and the backlight source part reaches the designated part of the measured substrate before the camera part. By means of the configuration, the multiple camera parts are arranged and matched with the backlight source part, all the camera parts can detect the substrate at the same time, the movement stroke of all the camera parts can be shortened, and the detection efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a semiconductor measuring device. Background Art

[0002] In the field of semiconductor manufacturing, with the continuous development and progress of productivity, the requirements for cost, efficiency, and yield rate indicators are constantly increasing, posing more stringent requirements on the technical capabilities of production line equipment. Measuring equipment is a key device for yield control in the production line and an important tool for measuring whether the production line is operating stably. Measuring equipment is mainly used for measuring the pattern dimensions after exposure and etching, and by measuring and monitoring the process stability of exposure and etching, the process can be timely feedback and adjusted to reduce yield losses.

[0003] With the continuous increase in resolution requirements, the line width and overlay process window formed after lithography and etching processes are getting smaller and smaller. If key parameters such as Critical Dimension (hereinafter referred to as CD) and Overlay (hereinafter referred to as OVL) deviate from the control target, it will directly affect the electrical performance of the device.

[0004] In end products, for example, many problems in end display screens are related to the above key parameters in the process. For example, display light leakage has an important relationship with OVL, and abnormal display electrical signals and leakage currents during device turn-on and turn-off are mostly related to CD.

[0005] It is essential to measure and control these parameters in the process. In the liquid crystal display screen process, measuring equipment is used to measure key parameters such as CD and OVL after multi-layer pattern exposure and etching, and by monitoring and timely feedback the process to ensure the yield of end products.

[0006] Existing measuring equipment usually uses an optical measuring head for horizontal movement. According to the measured point coordinates that have been edited, the optical measuring head moves to each measured point coordinate respectively to measure parameters such as CD and OVL for each point.

[0007] With the continuous increase in the production line generation line and the continuous increase in the size of the substrate, in order to cover the detection of the entire substrate surface, the reciprocating movement stroke of a single measuring head is relatively large, the entire measurement process takes a long time, and the production efficiency is low. The form of a single measuring head no longer meets the requirements of production rate. Moreover, with the continuous increase in the size of the substrate, the detection range of the substrate increases, and the uniformity of its illumination brightness becomes worse, resulting in a large difference in the brightness and darkness levels at different positions of the substrate, affecting the detection accuracy.

[0008] On this basis, a semiconductor measuring device is proposed to improve the detection efficiency and detection accuracy. Summary of the Invention

[0009] The invention provides a semiconductor measuring device to improve the detection efficiency and detection accuracy.

[0010] The semiconductor measuring device includes:

[0011] A workpiece stage for carrying a substrate to be measured;

[0012] A plurality of camera heads capable of moving above a specified portion of the substrate to be measured to capture an image of the specified portion and obtain a measurement image;

[0013] An image processing unit capable of processing the measurement image to measure the size of a specified portion of the substrate to be measured based on the measurement image;

[0014] A plurality of backlight units capable of moving below a specified portion of the substrate to be measured to provide illumination to the specified portion from below through the workpiece stage;

[0015] Each backlight unit is provided corresponding to a camera head one by one;

[0016] A control unit drives the corresponding camera head / backlight unit to move above / below a specified portion of the substrate to be measured, wherein the backlight unit arrives at the specified portion of the substrate to be measured prior to the camera head.

[0017] Optionally, the plurality of camera heads can separately move along a track in a first direction, and the track can drive the plurality of camera heads to move synchronously along a second direction, and both the first direction and the second direction are parallel to the extending direction of the substrate to be measured.

[0018] Optionally, at least one of the plurality of camera heads is provided with a fine motion driving device, and the fine motion driving device can make the corresponding camera head move separately along the second direction.

[0019] Optionally, among the plurality of camera heads, a structural member is provided on each camera head without a fine motion driving device, and the structural member makes the initial positions of the camera heads without a fine motion driving device and the camera heads with a fine motion driving device the same in the second direction.

[0020] Optionally, a backlight driving device is provided on each backlight unit, and the backlight driving device enables the plurality of backlight units to move separately along the first direction and the second direction.

[0021] Optionally, each camera head includes a plurality of magnification cameras that can be switched for use, and there is a magnification measurement deviation between the measurement positions of the plurality of magnification cameras.

[0022] Optionally, when the magnification camera on the camera head switches, the control unit drives the corresponding backlight unit to move below the magnification camera in use according to the magnification measurement deviation.

[0023] Optionally, at least one of the plurality of camera heads is equipped with a limit sensor, and the limit sensor is used to detect the distance between the adjacent camera heads along the first direction to prevent interference between the two.

[0024] In summary, the semiconductor measurement device includes:

[0025] A workpiece stage for carrying a substrate to be measured; a plurality of camera heads capable of moving above a specified portion of the substrate to be measured to capture an image of the specified portion and obtain a measurement image; an image processing unit capable of processing the measurement image to measure the size of a specified portion of the substrate to be measured according to the measurement image; a plurality of backlight units capable of moving below a specified portion of the substrate to be measured and providing illumination for the specified portion from below through the workpiece stage; each backlight unit is provided in one-to-one correspondence with a camera head; a control unit that drives the corresponding camera head / backlight unit to move above / below a specified portion of the substrate to be measured, wherein the backlight unit reaches the specified portion of the substrate to be measured before the camera head.

[0026] With such a configuration, in the present invention, a plurality of camera heads are provided and cooperated with the backlight units. Each camera head can simultaneously detect the substrate, which helps to shorten the moving stroke of each camera head, shorten the moving time of the camera head, and further shorten the detection time of the camera head, thereby improving the detection efficiency.

[0027] The backlight unit moves relative to the workpiece stage. The moving speed of the backlight unit is relatively fast, or the backlight unit starts moving earlier than its corresponding camera head, so as to reach the specified portion of the substrate to be measured before the camera head, so as to provide stable and sufficient illumination for the camera head during image acquisition in real time, so as to improve the detection accuracy and detection stability. In addition, the moving speed of the backlight unit is relatively fast. When the backlight unit and its corresponding camera head move from one portion to be specified to the next portion to be specified, the backlight unit can move to the corresponding specified portion before the camera head, and provide stable illumination for the camera head when performing image recognition on the specified portion. On the one hand, it can shorten the waiting time of the camera head for preparation and improve the detection efficiency. On the other hand, when the camera head reaches the specified portion, the backlight unit reaches the specified portion in advance and stops moving, which can improve the phenomenon of unstable illumination caused by the movement of the backlight unit, is conducive to improving the imaging quality, improving the detection accuracy, and ensuring the yield of the terminal product. Description of the Drawings

[0028] Figure 1 It is a schematic structural diagram of the semiconductor measurement device according to Embodiment 1 of the present invention;

[0029] Figure 2 Schematic diagram of the movement structure of the backlight unit in the first embodiment of the present invention Figure 1 ;

[0030] Figure 3 Schematic diagram of the movement structure of the backlight unit in the first embodiment of the present invention Figure 2 ;

[0031] Figure 4 Schematic diagram of the structure of the camera head in the first embodiment of the present invention;

[0032] Figure 5 Schematic diagram of the structure of the semiconductor measurement device in the second embodiment of the present invention.

[0033] Among them, the reference numerals are as follows:

[0034] 10 - workpiece stage;

[0035] 20 - camera head; 201 - first magnification camera; 202 - second magnification camera; 203 - third magnification camera;; 21 - first camera head; 22 - second camera head; 23 - third camera head;

[0036] 30 - backlight unit; 31 - first backlight; 32 - second backlight;

[0037] 40 - movement component; 41 - first guide rail; 42 - sliding block;

[0038] 50 - fine motion drive device;

[0039] 60 - limit sensor;

[0040] 70 - structural member;

[0041] 80 - backlight drive device; 81 - lamp stand; 82 - ball screw; 83 - transmission belt;.

[0042] 90 - substrate;

[0043] X - first direction; Y - second direction.

[0044] As used in the invention, the singular forms "a", "an" and "the" include plural referents, the term "or" is generally used in the sense of including "and / or", the term "several" is generally used in the sense of including "at least one", the term "at least two" is generally used in the sense of including "two or more", in addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third" may explicitly or implicitly include one or at least two of such features. In addition, as used in the invention, "mounted", "connected", "coupled", an element "disposed" on another element should be understood in a broad sense, generally only indicating a connection, coupling, cooperation or transmission relationship between two elements, and the two elements may be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate element, rather than being construed as indicating or implying a spatial position relationship between the two elements, that is, an element may be in any position such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For those of ordinary skill in the art, the specific meanings of the above terms in the invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right are used relative to the exemplary embodiments as shown in the figures, with the upward or upper direction towards the top of the corresponding figure and the downward or lower direction towards the bottom of the corresponding figure.

[0045] Existing measuring devices usually use an optical measurement head for horizontal movement, and an optical measurement head only includes a magnification camera. According to the measured point coordinates that have been edited, the optical measurement moves to each measured point coordinate respectively to measure parameters such as CD and OVL for each point.

[0046] As the generation line of the production line continues to increase and the size of the substrate continues to increase, in order to cover the detection of the entire substrate surface, the reciprocating movement stroke of a single measurement head is relatively large, the entire measurement process takes a long time, the production efficiency is low, and the form of a single measurement head no longer meets the requirements of the production rate. Moreover, as the size of the substrate continues to increase, the detection range of the substrate increases, and the uniformity of its illumination brightness becomes worse, resulting in a large difference in the brightness and darkness levels at different positions of the substrate, affecting the detection accuracy.

[0047] On this basis, a semiconductor measuring device is proposed to improve the detection efficiency and detection accuracy.

[0048] Embodiment 1:

[0049] A semiconductor measuring device is proposed in this embodiment;

[0050] As Figure 1As shown, the semiconductor measurement device includes: a workpiece stage 10, a camera head 20, a backlight unit 30, and a motion assembly 40;

[0051] In this embodiment, there is one motion assembly 40, and N camera heads 20 are arranged on the motion assembly 40, where N is a positive integer greater than or equal to 2. In this embodiment, N = 2, so there are two camera heads 20 on the motion assembly 40, namely a first camera head 21 and a second camera head 22.

[0052] The workpiece stage 10 is used to carry the substrate to be measured; the workpiece stage 10 has a carrying surface, and the substrate to be detected is horizontally attached to this carrying surface. In this embodiment, the direction perpendicular to the workpiece stage 10 refers to the direction perpendicular to its carrying surface, and this direction is also perpendicular to the substrate carried on the workpiece stage 10. Similarly, the direction parallel to the workpiece stage 10 refers to the direction parallel to its carrying surface. The workpiece stage 10 can be a fixed platform structure or a movable structure. When it is a movable structure, the workpiece stage 10 can be driven to move to adjust the pose of the substrate. In this embodiment, since the camera head 20 can be driven to move, the workpiece stage 10 can be set as a fixed platform structure, and at this time, the pose of the substrate can be adapted by the movement of the camera head 20. The workpiece stage 10 can adopt an existing structure, and no more details will be described here.

[0053] The camera head 20 is arranged above the workpiece stage 10, and the camera head 20 and the backlight unit 30 can at least move along the direction parallel to the workpiece stage 10. The camera head 20 can move above the specified part of the substrate to be measured carried on the workpiece stage 10, and take a picture of this specified part to obtain a measurement image.

[0054] The motion assembly 40 is used to drive the camera head 20 to move along a first direction X and a second direction Y. The first direction X and the second direction Y are perpendicular to each other and parallel to the workpiece stage 10. Since the substrate to be measured is carried on the workpiece stage 10, the first direction X and the second direction Y are also parallel to the extension direction of the substrate to be measured.

[0055] As Figure 1 shown, in this embodiment, the motion assembly 40 includes a first guide rail 41. The first guide rail 41 is arranged on the workpiece stage 10 and moves along the second direction Y. The N camera heads 20 are arranged on the first guide rail 41 and move along the first direction X.

[0056] Among them, the first track 41 extends along the first direction X. A slider 42 is arranged on the first guide rail 41. The slider 42 is arranged to move along the first direction X on the first guide rail 41. The camera head 20 is installed on the slider 42. In addition, the motion assembly 40 should also include a second slide rail (not shown in the figure). The second slide rail extends along the second direction Y. The first guide rail 41 has legs, and its legs are slidably arranged along the second direction Y on the second slide rail. Then the first guide rail 41 is arranged above the workpiece table 10 in a suspended manner, so that each camera head 20 is arranged above the workpiece table 10. And when the first guide rail 41 moves along the second slide rail in the second direction Y, each camera head 20 is also driven to synchronously perform relative movement with the workpiece table 10. In addition, it is easy to think that the motion assembly can also include a driving device for driving the workpiece table 10 to move along the second direction Y, which can also enable the first guide rail 41 to drive each camera head 20 arranged thereon to perform relative movement in the second direction Y with respect to the workpiece table 10; among them, the first track 41 and the slider 42 can be driven by a linear motor or other linear drive structures.

[0057] In this embodiment, the motion assembly 40 adopts an existing motion gantry, which has the function of moving along the first direction X, the second direction Y and even vertically. Of course, the motion assembly 40 can also adopt other structures that can realize movement along the first direction X and the second direction Y.

[0058] Please continue to refer to Figure 2 As shown, the backlight unit 30 is arranged below the workpiece table 10. The backlight unit 30 can move to below the designated part of the substrate to be measured. The backlight unit 30 can adopt LED lights. The backlight unit 30 is used to provide illumination for the designated part of the substrate to be measured carried on the workpiece table 10 from below through the workpiece table 10. Therefore, the workpiece table 10 is preferably a glass panel, which allows the light of the backlight unit 30 to be transmitted to the back of the substrate to provide illumination for the substrate.

[0059] A plurality of the backlight units 30 are arranged, and each of the backlight units 30 is arranged in one-to-one correspondence with each of the camera heads 20, that is, the number of the backlight units 30 is the same as the number of the camera heads 20.

[0060] Please continue to refer to Figure 2 As shown, in this embodiment, two camera heads 20 are arranged, so two backlight units 30 are also arranged, namely the first backlight 31 and the second backlight 32.

[0061] The backlight unit 30 can move at least in a direction parallel to the worktable 10, and the moving speed of the backlight unit 30 is greater than that of the camera head 20. Alternatively, after receiving a driving instruction, the backlight unit 30 moves earlier than the camera head 20, so that the backlight unit 30 can reach the specified part of the substrate to be measured before the camera head 20.

[0062] A backlight driving device 80 is provided below the worktable 10. The backlight driving device 80 enables multiple backlight units 30 to move independently along the first direction X and the second direction Y.

[0063] Please continue to refer to Figure 2 and Figure 3 As shown, the backlight driving device 80 includes a lamp platform 81, a ball screw 82, and a transmission belt 83. The lamp platform 81 is in threaded transmission cooperation with the ball screw 82, so the lamp platform 81 can be driven to move along the second direction Y. In addition, two transmission belts 83 are provided on the lamp platform 81. The first backlight 31 and the second backlight 32 are respectively mounted on one transmission belt 83. The transmission belt 83 can drive the corresponding backlight unit to move along the first direction X, and the lamp platform 81 can drive the transmission belt 83 to move along the second direction Y. Therefore, the first backlight 31 and the second backlight 32 can be respectively driven to move along the first direction X and the second direction Y.

[0064] Of course, each backlight unit 30 can also be driven to move by configuring a set of driving structures similar to or other known ones as the motion component 40 to ensure the independent and flexible driving of each backlight unit 30.

[0065] In the present invention, multiple camera heads 20 are provided and cooperate with the backlight unit 30. Each camera head 20 can simultaneously detect the substrate, which helps to shorten the moving stroke of each camera head, shorten the moving time of the camera head, and further shorten the detection time of the camera head, thereby improving the detection efficiency.

[0066] The backlight unit 30 can move in a direction parallel to the worktable 10, and its moving speed is greater than that of the camera head 20. This enables the backlight unit 30 to move adaptively to a specified part, providing stable and sufficient illumination for the camera head 20 during image acquisition in real time, thereby improving the detection accuracy and stability. Additionally, the moving speed of the backlight unit 30 is relatively fast, or the backlight unit 30 starts moving earlier than its corresponding camera head 20. Therefore, when the backlight unit 30 and its corresponding camera head 20 move from one part to be specified to the next part to be specified, the backlight unit 30 can move to the corresponding specified part prior to the camera head 20, providing stable illumination for the camera head 20 during image recognition at the specified part. On the one hand, this can shorten the waiting time for the camera head 20 to get ready and improve the detection efficiency. On the other hand, when the camera head 20 reaches the specified part, the backlight unit 30 has already arrived at the specified part in advance and stopped moving, which can improve the phenomenon of unstable illumination caused by the movement of the backlight unit 30, facilitating the improvement of the imaging quality and the detection accuracy.

[0067] Further, the semiconductor measurement device further includes a fine motion driving device 50.

[0068] At least one of the camera heads 20 is equipped with the fine motion driving device 50. The fine motion driving device 50 is connected between the motion assembly 40 and the camera head 20. The fine motion driving device 50 can enable its corresponding camera head 20 to move independently along the second direction Y for fine-tuning the position of the camera head 20 along the second direction Y. Here, the fine-tuning specifically refers to an adjustment in units of μm. The fine motion driving device 50 can, for example, adopt a high-precision linear motor, a high-precision ball screw, or other high-precision linear adjustment structures.

[0069] Please continue to refer to Figure 1 As shown, in this embodiment, N = 2, and only one camera head 20 is equipped with the fine motion driving device 50. As Figure 1 shown, the first camera head 21 is equipped with the fine motion driving device 50. The motion assembly 40 is used to drive the camera head 20 mounted thereon to perform long-stroke movements along the first direction X and the second direction Y, so that the camera head 20 can quickly reach the specified position.

[0070] The fine motion driving device 50 can finely adjust the position of the first imaging head 21 along the second direction Y, compensate for the positions of the two imaging heads along the second direction Y, and further compensate for the placement error of the substrate to match the pose of the substrate. There is a standard placement position for the substrate 90 on the worktable 10. However, in practice, when the substrate 90 is placed on the worktable 10, there will always be an error, resulting in an error between its actual position and the standard position. There are identification points on the substrate 90, and the identification points are generally cross-shaped marks. At this time, the two imaging heads 20 need to identify the two cross-shaped marks, and the first imaging head 21 and the second imaging head 22 are respectively facing the cross-shaped marks to match the actual position of the substrate 90, so as to establish a coordinate system based on the actual position of the substrate 90.

[0071] Since the placement error of the substrate 90 is very small, in fact, the distance that the imaging head 20 needs to actually adjust based on the substrate 90 is also very small. Therefore, the fine motion driving device 50 is provided to meet the fine adjustment of the imaging head 20.

[0072] At the standard position, the two cross-shaped marks on the substrate 90 are arranged at intervals along the first direction X. When there is a rotational error between the actual placement of the substrate 90 and the standard position, the actual positions of its cross-shaped marks will have a slight movement along the second direction Y relative to the standard position.

[0073] During alignment, first, the motion component 40 drives the second imaging head 22 to move and face one of the cross-shaped marks along a direction perpendicular to the worktable 10. At this time, the position of the first guide rail 41 is determined, and it cannot be guaranteed that the other cross-shaped mark is within the field of view of the first imaging head 21. Then, the first imaging head 21 moves along the first direction X on the first guide rail 41, and is finely driven by the fine motion driving device 50 along the second direction Y, so that the first imaging head 21 faces the other cross-shaped mark.

[0074] In the above structure, among the N imaging heads 20 provided on the motion component 40, by setting at least one fine motion driving device 50 to match with N - 1 of the imaging heads 20 respectively, the matching of each imaging head 20 with the actual position of the substrate 90 can be satisfied.

[0075] Furthermore, among the N imaging heads 20, a structural member 70 is provided on each imaging head 20 without a fine motion driving device 50. The structural member 70 is connected between the motion component 40 and the imaging head 20. The structural member 70 makes the initial positions of the imaging heads 20 without a fine motion driving device 50 and the imaging heads 20 with a fine motion driving device 50 the same in the second direction Y, that is, the detection centers of the N imaging heads 20 are facing each other along the first direction X.

[0076] Please continue to refer to Figure 1As shown, the second camera head 22 is equipped with a structural member 70. The specific structure of the structural member 70 is not limited herein, and it can be connected to structures such as brackets and pads. The main function of the structural member 70 is to compensate for the position of the second camera head 22. Since the first camera head 21 is provided with a fine motion driving device 50, the actual position of the first camera head 21 protrudes forward along the second direction Y. Therefore, in order to make the position of the second camera head 22 along the second direction Y match that of the first camera head 21, the structural member 70 is added to ensure that the detection centers of the two are directly opposite along the first direction X, that is, the nominal coordinates of the two detection centers in the second direction Y are the same. The detection center of the camera head 20 refers to the center of its magnification camera.

[0077] Furthermore, among the N camera heads 20, at least one of the camera heads 20 is equipped with a limit sensor 60, and the limit sensor 60 is used to detect the distance between the adjacent camera heads 20 along the first direction X to prevent interference between the two.

[0078] Please continue to refer to Figure 1 As shown, in this embodiment, both the first camera head 21 and the second camera head 22 are equipped with a limit sensor 60. The limit sensor 60 can be installed on the camera head body or directly on the slider 42. The limit sensor 60 is, for example, a non-contact distance sensor, which faces the adjacent camera head 20 to detect the distance between the adjacent camera heads. When the distance is less than the set threshold, the limit sensor 60 sends a signal to the control unit (the control unit will be described in detail in the following content), and the corresponding camera head is controlled to stop moving along the first direction X through the control unit.

[0079] Of course, the limit sensor 60 can be provided only on a part of the camera heads 20, for example, only on the first camera head 21 or the second camera head 22 to detect the distance between the two. The limit sensor 60 can also be a transmissive sensor, with its transmitting end installed on one camera head and its receiving end installed on the adjacent camera head.

[0080] Furthermore, the semiconductor measurement device further includes a control unit.

[0081] The control unit is used to specify a specified part of the substrate and control a camera head 20 and a backlight unit 30 to move to a first target position and a second target position respectively. The first target position is located above the worktable 10 and directly faces the specified part along a direction perpendicular to the worktable 10, and the second target position is located below the worktable 10 and directly faces the specified part along a direction perpendicular to the worktable 10. That is, when the control unit specifies the coordinates of the specified part on the substrate 90, it controls a camera head 20 to move directly above the specified part and controls a backlight unit 30 to move directly below the specified part.

[0082] The control unit generally includes at least one processor, which can be a central processing unit (CPU), or can also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0083] The at least one processor can communicate with a plurality of peripheral devices via a bus subsystem. These peripheral devices can include a storage system, a user interface input device, a user interface output device, and a network interface.

[0084] The network interface provides an interface to an external network and / or other devices. The network interface includes one or more interfaces known in the art, such as LAN, WLAN, Bluetooth, and other wired and wireless interfaces.

[0085] The user interface input device can include a keyboard, a pointing device such as a mouse, trackball, touchpad, or graphics tablet, a scanner, a foot pedal, a joystick, a touch screen embedded in a display, an audio input device such as a speech recognition system, a microphone, and other types of input devices. Generally speaking, the term "input device" is intended to include various conventional and proprietary devices and means for inputting information into the controller.

[0086] The user interface output device can include a display subsystem, a printer, a fax machine, or a non-visual display such as an audio output device. The display subsystem can be a flat panel device, such as a liquid crystal display (LCD), a light emitting diode (LED) display, a touch screen display, etc. The display subsystem can also provide a non-visual display, such as via an audio output device. Generally speaking, the term "output device" is intended to include various conventional and proprietary devices and means for outputting information from the control unit to the user.

[0087] The storage system can store the basic programming and data structures for implementing various functions of the present invention. For example, the database and modules that implement the measurement function of the measurement device of the present invention can be stored in the storage system. The software module is usually executed by the processor as the image processing unit. It can calculate the coordinates of each specified part through the software module, and send the coordinate instructions of each specified part to the driving structures (the motion assembly 40 and the driving structures of the ball screw 82 and the transmission belt 83) of the imaging head 20 and the backlight unit 30 through the control unit, so as to drive an imaging head 20 and a backlight unit 30 to move to the corresponding specified parts. In a distributed environment, the software module can be stored on multiple computer systems and executed by the processors of multiple computer systems. The software module can also process the measurement images collected by the imaging head 20, so as to measure the dimensions of the specified parts of the substrate to be measured according to the measurement images. The above software modules are all prior arts and will not be elaborated here. The storage system generally includes a memory subsystem and a file storage system. The memory subsystem generally includes multiple memories, including a main random access memory RAM for storing instructions and data during program execution and a read-only memory ROM for storing fixed instructions therein. The file storage subsystem provides permanent non-volatile storage for programs and data files. The file storage system can include a hard disk drive and associated removable media, a compact disc CD drive, an optical drive, a DVD, a solid-state memory, and / or other removable media. One or more of these drives can be located at remote locations on other connected computers at other sites connected to the control unit. The modules for implementing the functions of the present invention can be stored by the file storage system.

[0088] The bus subsystem provides components for enabling various components and subsystems of the control unit to communicate with each other as expected. The various subsystems and components of the control unit do not have to be in the same physical location, but can be distributed at various locations within a distributed network. The bus subsystem can be a single bus or multiple buses can be set up based on requirements.

[0089] The control unit described above is only intended as an example to only show one implementation of the present invention. Due to the ever-changing nature of computers and networks, in other alternative embodiments, the control unit may also have certain differences from the configuration of the controller depicted above, which will not be elaborated here.

[0090] Furthermore, the imaging head 20 includes multiple magnification cameras, the acquisition magnifications of each magnification camera are different, there is a magnification measurement deviation between the measurement positions of the multiple magnification cameras, and the magnification camera 201 can adopt an existing camera.

[0091] Such as Figure 4As shown, taking the first camera head 21 as an example, it includes three magnification cameras, namely the first magnification camera 201, the second magnification camera 202, and the third magnification camera 203. Among them, the magnification of the second magnification camera 202 is greater than that of the first magnification camera 201, and the magnification of the third magnification camera 203 is greater than that of the second magnification camera 202.

[0092] When actually performing image acquisition, a certain magnification camera can be selected based on actual usage requirements.

[0093] The control unit is further configured to select one of the magnification cameras on the camera head 20, and the first target position makes the selected magnification camera face the specified part in a direction perpendicular to the worktable 10.

[0094] The software module calculates the distribution of the specified parts on the substrate. Since the circuit pattern positions and line thicknesses corresponding to the respective specified parts are different. Therefore, the magnification requirements for image acquisition of different specified parts are also different. Thus, the control unit can adapt the magnification camera with the corresponding magnification based on different specified parts.

[0095] As Figure 4 shown, assuming that the first backlight 31 first moves to the second target position facing the specified part. If the first magnification camera 201 is selected in the first camera head 21, then the first magnification camera 201 needs to move a distance X1 in the first direction X and a distance Y1 in the second direction Y; if the second magnification camera 202 is selected in the first camera head 21, then the second magnification camera 202 needs to move a distance X2 in the first direction X and a distance Y2 in the second direction Y; if the third magnification camera 203 is selected in the first camera head 21, then the second magnification camera 203 needs to move a distance X3 in the first direction X and a distance Y3 in the second direction Y.

[0096] The control unit is further configured to switch the magnification camera for imaging. When the magnification camera on the camera head 20 is switched, the control unit drives the corresponding backlight unit to move below the magnification camera in use according to the magnification measurement deviation.

[0097] Please continue to combine with Figure 4 shown, when the first magnification camera 201 is selected, then the first magnification camera 201 needs to move a distance X1 in the first direction X and a distance Y1 in the second direction Y. Then when switching from the first magnification camera 201 to the second magnification camera 202, the first camera head 21 may not move. At this time, the control unit controls the first backlight 31 to move a distance X2 - X1 in the first direction X and a distance Y2 - Y1 in the second direction Y.

[0098] In addition, when the fine motion driving device 50 drives the first imaging head 21 to perform fine adjustment in the second direction Y, assuming the fine adjustment amount is ΔY, the first backlight 31 can perform a displacement of ΔY accordingly. However, since the adjustment amount of ΔY is relatively small, even if the first backlight 31 does not displace, the backlight illumination conditions can usually be ensured to meet the requirements. Therefore, when the fine motion driving device 50 drives the first imaging head 21 to perform fine adjustment in the second direction Y, the first backlight 31 may not perform a displacement either.

[0099] Further, the control unit sequentially switches the magnification cameras on the imaging head 20 in ascending order of magnification. When a specified portion on the substrate is selected, image acquisition of the detection is sequentially performed through each magnification camera to improve the detection accuracy.

[0100] In other alternative embodiments, the imaging head 20 may include two or more magnification cameras, or magnification cameras integrating different functions.

[0101] In summary, the semiconductor measuring device includes:

[0102] A workpiece stage 10 for carrying a substrate to be measured; a plurality of imaging heads 20 capable of moving above a specified portion of the substrate to be measured to image the specified portion and obtain a measurement image; an image processing unit capable of processing the measurement image to measure the size of a specified portion of the substrate to be measured according to the measurement image; a plurality of backlight units 30 capable of moving below a specified portion of the substrate to be measured to provide illumination for the specified portion from below through the workpiece stage 10; each backlight unit 30 is provided corresponding to one of the imaging heads 20; a control unit driving the corresponding imaging head 20 / backlight unit 30 to move above / below a specified portion of the substrate to be measured, and the moving speed of the backlight unit 30 is greater than the moving speed of the detection head 20.

[0103] A workpiece stage 10, at least two imaging heads 20 and backlight units 30; the workpiece stage 10 is used for carrying a substrate; the imaging heads 20 are arranged above the workpiece stage 10, and the imaging heads 20 are used for image acquisition of the substrate carried on the workpiece stage 10; the backlight units 30 are arranged below the workpiece stage 10, and the backlight units 30 are used for illuminating the substrate carried on the workpiece stage 10 through the workpiece stage 10; the imaging heads 20 and the backlight units 30 can move at least along a direction parallel to the workpiece stage 10, and the moving speed of the backlight unit 30 is greater than the moving speed of the imaging head 20.

[0104] Configured in this way, in the present invention, multiple camera heads 20 are provided and cooperate with the backlight unit 30. Each camera head 20 can detect the substrate simultaneously, which helps to shorten the moving stroke of each camera head, shorten the movement time of the camera head, and further shorten the detection time of the camera head, improving the detection efficiency.

[0105] The backlight unit 30 can move along a direction parallel to the worktable 10, and its moving speed is greater than that of the camera head 20. This enables the backlight unit 30 to move adaptively to a specified part to provide stable and sufficient illumination for the camera head 20 during image acquisition in real time, thereby improving the detection accuracy and detection stability. Additionally, the moving speed of the backlight unit 30 is relatively fast. When the backlight unit 30 and the corresponding camera head 20 move from one part to be specified to the next part to be specified, the backlight unit 30 can move to the corresponding specified part prior to the camera head 20, providing stable illumination for the camera head 20 when performing image recognition on the specified part. On the one hand, this can shorten the waiting time of the camera head 20 for preparation and improve the detection efficiency. On the other hand, when the camera head 20 reaches the specified part, the backlight unit 30 has already reached the specified part and stopped moving, which can improve the phenomenon of unstable illumination caused by the movement of the backlight unit 30, facilitating the improvement of the imaging quality and the detection accuracy.

[0106] Embodiment Two

[0107] The difference between this embodiment and Embodiment One lies in the different number of motion components 40 and the different number of camera heads 20 provided on each motion component 40.

[0108] As Figure 5 shown, in this embodiment, two sets of motion components 40 are provided, and three camera heads 20 are provided on each motion component 40. N = 3. Therefore, a third camera head 23 is newly added on each motion component 40.

[0109] Taking one of the motion components 40 as an example for illustration, the first camera head 21, the second camera head 22, and the third camera head 23 are provided on this motion component 40. Among them, the first camera head 21 and the third camera head 23 are equipped with micro motion driving devices 50, the second camera head 22 is equipped with a structural member 70, and a limit sensor 60 is provided on each camera head.

[0110] The installation method of the camera heads on the other motion component 40 is similar to the above structure.

[0111] Correspondingly, two sets of backlight units 30 can be provided below the worktable 10, and each set includes three backlight units 30 to respectively adapt to the three camera heads on one motion component 40.

[0112] In this embodiment, through two sets of motion components 40 and three camera heads on each set, image acquisition can be performed on each monitoring point on the substrate more flexibly and efficiently, which is conducive to further improving the detection efficiency.

[0113] In other alternative embodiments, the number of motion components 40 and the number N of camera heads provided on the motion components 40 can be adaptively adjusted based on actual usage requirements.

[0114] In this embodiment, the number of backlight units 30 is the same as the number of camera heads 20. In other alternative embodiments, when the number of camera heads is large, the number of backlight units 30 can also be slightly less than the number of camera heads 20, and the computer reasonably matches the backlight units 30 and the camera heads 20 to meet the actual lighting requirements.

[0115] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other.

[0116] The above description is only a description of the preferred embodiments of the invention and does not limit the scope of the invention in any way. Any changes and modifications made by those of ordinary skill in the art in the technical field of the invention based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A semiconductor measuring device, characterized in that, comprising: a workpiece stage for carrying a substrate to be measured; a plurality of camera heads capable of moving above a specified portion of the substrate to be measured to image the specified portion and obtain a measurement image; an image processing unit capable of processing the measurement image to measure the size of a specified portion of the substrate to be measured based on the measurement image; a plurality of backlight units capable of moving below a specified portion of the substrate to be measured to provide illumination to the specified portion from below through the workpiece stage; each backlight unit is provided corresponding to a camera head one by one; a control unit that drives the corresponding camera head / backlight unit to move above / below a specified portion of the substrate to be measured, wherein the backlight unit reaches the specified portion of the substrate to be measured prior to the camera head.

2. The semiconductor measuring device according to claim 1, characterized in that, the plurality of camera heads can separately move along a track in a first direction, and the track can drive the plurality of camera heads to move synchronously in a second direction, and both the first direction and the second direction are parallel to the extending direction of the substrate to be measured.

3. The semiconductor measuring device according to claim 2, characterized in that, at least one of the plurality of camera heads is provided with a fine motion driving device, and the fine motion driving device can make its corresponding camera head move separately along the second direction.

4. The semiconductor measuring device according to claim 3, characterized in that, among the plurality of camera heads, each camera head without a fine motion driving device is provided with a structural member, and the structural member makes the initial positions of the camera heads without a fine motion driving device and the camera heads with a fine motion driving device the same in the second direction.

5. The semiconductor measuring device according to claim 2, characterized in that, each backlight unit is provided with a backlight driving device, and the backlight driving device enables the plurality of backlight units to move separately along the first direction and the second direction.

6. The semiconductor measuring device according to claim 2, characterized in that, each camera head includes a plurality of magnification cameras that can be switched for use, and there is a magnification measurement deviation between the measurement positions of the plurality of magnification cameras.

7. The semiconductor measuring device according to claim 6, characterized in that, when the magnification camera on the camera head is switched, the control unit drives the corresponding backlight unit to move below the magnification camera in use according to the magnification measurement deviation.

8. The semiconductor measuring device according to claim 2, characterized in that, at least one of the plurality of camera heads is equipped with a limit sensor for detecting the distance between the adjacent camera heads along the first direction to prevent interference between the two.

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