Cooling device for wafer bearing table of probe station

Abstract

The invention relates to the technical field of wafer processing devices, and discloses a probe station wafer bearing table cooling device which comprises a bottom plate, supporting side plates are fixedly connected to the two sides of the top of the bottom plate, a fixing plate is fixedly connected between the tops of the two supporting side plates, and a mounting plate is fixedly connected to the top of the fixing plate. The mounting plate provides a mounting position and can also play a role in noise reduction, a microscope is arranged outside the mounting plate, a cooling platform mechanism is arranged at the top of the bottom plate, the cooling platform mechanism plays a role in cooling, and accelerated cooling mechanisms are arranged on the two sides of the cooling platform mechanism. The accelerated cooling mechanism can accelerate cooling of the heat conduction structure, so that the cooling device can maintain the cooling effect during long-time cooling, and the problem of performance fluctuation easily caused by long-time high-temperature operation of the probe table in the wafer processing process can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing devices, and specifically to a temperature reduction device for a wafer carrier of a probe station. Background Art

[0002] The wafer carrier of the probe station provides a stable support plane for the wafer to ensure that the wafer will not be deformed, bent or dropped due to external forces or its own gravity during the test, and to ensure that the wafer is in a relatively stable physical state for the subsequent operations to proceed smoothly. The temperature reduction device of the wafer carrier of the probe station can provide a temperature reduction effect for the high-temperature operation of the probe station during the wafer processing.

[0003] The temperature reduction device of the wafer carrier of the probe station in the prior art mainly conducts temperature reduction through heat conduction, but the structure providing heat conduction lacks a temperature reduction structure, which leads to the temperature rise of the heat conduction structure during long-term temperature reduction, resulting in a decrease in the temperature reduction effect, and then leading to performance fluctuation problems easily caused by the long-term high-temperature operation of the probe station during the wafer processing. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a temperature reduction device for a wafer carrier of a probe station, which solves the problem that the temperature reduction device of the wafer carrier of the probe station in the prior art lacks a temperature reduction structure, resulting in the temperature rise of the heat conduction structure and the decrease in the temperature reduction effect, and then leading to performance fluctuations easily caused by the long-term high-temperature operation of the probe station.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: A temperature reduction device for a wafer carrier of a probe station, including a bottom plate, both sides of the top of the bottom plate are fixedly connected with support side plates, a fixed plate is fixedly connected between the tops of the two support side plates, a mounting plate is fixedly connected to the top of the fixed plate. The mounting plate provides a mounting position and can also play a role in noise reduction. A microscope is arranged outside the mounting plate. A temperature reduction platform mechanism is arranged on the top of the bottom plate, and the temperature reduction platform mechanism plays a role in temperature reduction. Accelerated temperature reduction mechanisms are arranged on both sides of the temperature reduction platform mechanism, and the accelerated temperature reduction mechanisms are used to accelerate the temperature reduction of the temperature reduction platform mechanism.

[0006] Preferably, the cooling platform mechanism includes a mounting frame, the bottom of the mounting frame is fixedly connected to the top of the bottom plate, a plurality of highly thermally conductive metal plates are arranged inside the mounting frame, a plurality of thermal greases are arranged inside the mounting frame, a cooling pipe is fixedly connected between the plurality of highly thermally conductive metal plates and the inside of the plurality of thermal greases, the top of the top highly thermally conductive metal plate is fixedly connected to a thermally conductive metal seat, the top of the thermally conductive metal seat is fixedly connected to a thermally conductive metal column, the top of the thermally conductive metal column is fixedly connected to a carrier sheet, a cooling coil is fixedly connected inside the carrier sheet, one end of the cooling coil is fixedly connected to one end of the cooling pipe, the other end of the cooling coil is fixedly connected to the outside of the accelerated cooling mechanism, a water pump is fixedly connected to the top of the bottom plate, a water suction pipe is fixedly connected to the input end of the water pump, a water outlet pipe is fixedly connected to the output end of the water pump, the end of the water outlet pipe away from the water pump is fixedly connected to the other end of the cooling pipe, and a water tank is fixedly connected inside one of the support side plates.

[0007] Preferably, the accelerated cooling mechanism includes two connecting plates, one side of each of the two connecting plates is respectively fixedly connected to both sides of the bottom of the mounting frame, a fixed seat is fixedly connected to the top of the connecting plate, an installation box is fixedly connected to the side of the fixed seat close to the mounting frame, an impeller is rotatably connected inside the installation box, a connecting rotating column is fixedly connected to the side of the impeller close to the mounting frame, a fan is fixedly connected to the side of the connecting rotating column close to the mounting frame, and a connecting pipe is fixedly connected between the two installation boxes.

[0008] Preferably, a water injection pipe is fixedly connected to one side of the water tank, and a sealing cover is fixedly connected to the top of the water injection pipe.

[0009] Preferably, a fixed semi-circle is fixedly connected to the top of the connecting plate, and an outer frame is fixedly connected to the inner side of the fixed semi-circle.

[0010] Preferably, a mounting frame is fixedly connected to the inside of the outer frame, and the end of the fan away from the impeller is rotatably connected to the side of the mounting frame close to the installation box.

[0011] Preferably, the other end of the cooling coil is fixedly connected to the outside of one of the installation boxes, and a water return pipe is fixedly connected to the top of the other installation box.

[0012] Preferably, the end of the water return pipe away from the installation box is fixedly connected to the outside of the water tank, and a plurality of heat dissipation rings are fixedly connected to the top of the carrier sheet.

[0013] Preferably, the plurality of highly thermally conductive metal plates and the plurality of thermal greases are arranged in an alternating manner, and the highly thermally conductive metal plates and the thermal greases are fixedly connected.

[0014] Preferably, support feet are fixedly connected to the four corners of the bottom of the bottom plate, and a sealing gasket is arranged inside the sealing cover.

[0015] The present invention provides a temperature reduction device for a wafer carrier table of a probe station. It has the following beneficial effects:

[0016] 1. Through the accelerated cooling mechanism, the present invention can accelerate the cooling of the heat conduction structure, and then enable the cooling device to maintain the cooling effect during long-term cooling. Therefore, it can solve the problem of performance fluctuations easily caused by long-term high-temperature operation of the probe station during wafer processing.

[0017] 2. The present invention drives the accelerated cooling mechanism to operate through the cooling platform mechanism, so that it can play a cooling role without adding other power units. Therefore, long-term cooling can be achieved by using one power unit, and then the cost of adding power units can be saved. Therefore, the cost of the temperature reduction device for the wafer carrier table of the probe station can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional view of the present invention Figure 1 ;

[0019] Figure 2 is a three-dimensional view of the present invention Figure 2 ;

[0020] Figure 3 is a schematic structural view of the connecting pipe in the present invention;

[0021] Figure 4 is a schematic structural view of the cooling pipe in the present invention;

[0022] Figure 5 is a schematic structural view of the carrier sheet in the present invention;

[0023] Figure 6 is a schematic structural view of the mounting frame in the present invention;

[0024] Figure 7 is a schematic structural view of the mounting bracket in the present invention;

[0025] Figure 8 is a schematic structural view of the impeller in the present invention.

[0026] Among them, 1. bottom plate; 2. supporting side plate; 3. fixing plate; 4. mounting plate; 5. microscope; 6. cooling platform mechanism; 601. mounting frame; 602. high thermal conductivity metal plate; 603. thermal conductive silicone grease; 604. cooling pipe; 605. thermal conductive metal seat; 606. thermal conductive metal column; 607. carrier sheet; 608. heat dissipation ring; 609. cooling coil; 610. water pump; 611. water suction pipe; 612. water outlet pipe; 613. water tank; 614. water injection pipe; 615. sealing cover; 7. accelerating cooling mechanism; 701. connecting plate; 702. fixing seat; 703. mounting box; 704. impeller; 705. connecting rotating column; 706. fan; 707. outer frame; 708. fixing semi-circle; 709. mounting bracket; 710. connecting pipe; 711. return pipe; 8. support feet. Detailed implementation manners

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] Please refer to the attached Figure 1 - attached Figure 8 , the embodiment of the present invention provides a cooling device for a probe table wafer carrier table, including a bottom plate 1. Both sides of the top of the bottom plate 1 are fixedly connected with supporting side plates 2, and the supporting side plates 2 play a supporting role. Between the tops of the two supporting side plates 2 is fixedly connected with a fixing plate 3, and the fixing plate 3 can provide an installation position. The top of the fixing plate 3 is fixedly connected with a mounting plate 4. While providing an installation position, the mounting plate 4 can also play a role in noise reduction. An external part of the mounting plate 4 is provided with a microscope 5. The top of the bottom plate 1 is provided with a cooling platform mechanism 6, and the cooling platform mechanism 6 plays a role in cooling. Both sides of the cooling platform mechanism 6 are provided with an accelerating cooling mechanism 7, and the accelerating cooling mechanism 7 is used to accelerate the cooling of the cooling platform mechanism 6.

[0029] The cooling platform mechanism 6 includes an installation frame 601 which can provide an installation position. The bottom of the installation frame 601 is fixedly connected to the top of the bottom plate 1. Inside the installation frame 601, there are multiple high - thermal - conductivity metal plates 602 and multiple thermal greases 603. The combination of the high - thermal - conductivity metal plates 602 and the thermal greases 603 can play a role in heat dissipation. There is a cooling pipe 604 fixedly connected between the interiors of the multiple high - thermal - conductivity metal plates 602 and the multiple thermal greases 603. The cooling pipe 604 can admit liquid. Therefore, the high - thermal - conductivity metal plates 602 and the thermal greases 603 can dissipate heat for the liquid in the cooling pipe 604. The top of the top high - thermal - conductivity metal plate 602 is fixedly connected to a thermal - conductivity metal seat 605 which plays an installation role and can conduct heat. The top of the thermal - conductivity metal seat 605 is fixedly connected to a thermal - conductivity metal column 606 which plays a connecting role and can conduct heat. The top of the thermal - conductivity metal column 606 is fixedly connected to a carrier sheet 607 which can also conduct heat. Inside the carrier sheet 607, there is a cooling coil 609 which can admit liquid and can dissipate heat for the carrier sheet 607 through the liquid. One end of the cooling coil 609 is fixedly connected to one end of the cooling pipe 604, and the other end of the cooling coil 609 is fixedly connected to the outside of the accelerated cooling mechanism 7. The top of the bottom plate 1 is fixedly connected to a water pump 610 which can provide the power for the liquid to flow. The input end of the water pump 610 is fixedly connected to a water suction pipe 611 which plays a connecting role. The output end of the water pump 610 is fixedly connected to a water outlet pipe 612 which plays a connecting role. The end of the water outlet pipe 612 away from the water pump 610 is fixedly connected to the other end of the cooling pipe 604. Inside one of the support side plates 2, there is a water tank 613 which can provide a space for storing liquid. One side of the water tank 613 is fixedly connected to a water injection pipe 614. The top of the water injection pipe 614 is fixedly connected to a sealing cover 615. The water injection pipe 614 can facilitate the injection of the heat - dissipation liquid, and the sealing cover 615 can seal the water injection pipe 614. The multiple high - thermal - conductivity metal plates 602 and the multiple thermal greases 603 are arranged alternately, and the high - thermal - conductivity metal plates 602 and the thermal greases 603 are fixedly connected. The four corners of the bottom of the bottom plate 1 are all fixedly connected to support feet 8. There is a sealing gasket inside the sealing cover 615. During heat dissipation, the water pump 610 is started. The input end of the water pump 610 pumps out the coolant inside the water tank 613 through the water suction pipe 611, and pumps it into the interior of the cooling pipe 604 through the output end of the water pump 610 and the water outlet pipe 612. The liquid then enters the interior of the cooling coil 609 through the cooling pipe 604. The liquid enters the interior of the accelerated cooling mechanism 7 through the other end of the cooling coil 609, and then returns to the interior of the water tank 613 through the accelerated cooling mechanism 7. At this time, the flow of the cooling liquid is completed.When the liquid flows into the high - thermal - conductivity metal plate 602 and the thermal grease 603, it can be accelerated in heat dissipation by the high - thermal - conductivity metal plate 602 and the thermal grease 603. Subsequently, the temperature of the liquid inside the cooling coil 609 can be decreased, and then the heat of the carrier wafer 607 can be dissipated, thus avoiding the performance fluctuation problem caused by the high - temperature operation of the probe station during the wafer processing. At the same time, due to the accelerated heat dissipation of the high - thermal - conductivity metal plate 602, and since the carrier wafer 607, the heat - dissipation ring 608 and the thermal - conductivity metal base 605 all have the function of heat conduction, the heat of the carrier wafer 607 can be dissipated. Meanwhile, the heat - dissipation ring 608 can also be used to accelerate the heat dissipation of the carrier wafer 607. Therefore, the high temperature of the probe station can be avoided.

[0030] The accelerated cooling mechanism 7 includes two connecting plates 701 which provide installation positions. One side of each of the two connecting plates 701 is fixedly connected to both sides of the bottom of the installation frame 601 respectively. A fixed seat 702 is fixedly connected to the top of the connecting plate 701 which can provide an installation position. A mounting box 703 is fixedly connected to the side of the fixed seat 702 close to the installation frame 601 which can provide an installation position. An impeller 704 is rotatably connected inside the mounting box 703 which can rotate after the liquid flows. A connecting rotating column 705 is fixedly connected to the side of the impeller 704 close to the installation frame 601 which plays a connecting role. A fan 706 is fixedly connected to the side of the connecting rotating column 705 close to the installation frame 601 which can generate wind after rotation. A connecting pipe 710 is fixedly connected between the two mounting boxes 703 which can connect the two mounting boxes 703. A fixed semi-circle 708 is fixedly connected to the top of the connecting plate 701 which provides an installation position. An outer frame 707 is fixedly connected to the inner side of the fixed semi-circle 708 which provides an installation position. A mounting bracket 709 is fixedly connected inside the outer frame 707 which can maintain the stability of the fan 706 during rotation. The end of the fan 706 away from the impeller 704 is rotatably connected to the side of the mounting bracket 709 close to the mounting box 703. The other end of the cooling coil 609 is fixedly connected to the outside of one of the mounting boxes 703. A return water pipe 711 is fixedly connected to the top of the other mounting box 703. The end of the return water pipe 711 away from the mounting box 703 is fixedly connected to the outside of the water tank 613. A plurality of heat dissipation rings 608 are fixedly connected to the top of the bearing piece 607. When the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603 dissipate heat for a long time, their own temperatures will also rise. Therefore, the accelerated cooling mechanism 7 is needed to dissipate heat for the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603, so as to maintain the heat dissipation effect of the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603. When the other end of the cooling coil 609 passes the liquid into the inside of the mounting box 703, it can drive the impeller 704 to rotate. When the impeller 704 rotates, it can drive the connecting rotating column 705 to rotate. After the connecting rotating column 705 rotates, it can drive the fan 706 to rotate. After the fan 706 rotates, it can generate wind to dissipate heat for the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603. Therefore, the heat dissipation effect of the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603 can be maintained. When the liquid enters one of the mounting boxes 703, it can enter the inside of the other mounting box 703 through the connecting pipe 710, so as to drive the impeller 704 inside the other mounting box 703 to rotate, and then enable the two fans 706 to rotate. At the same time, the liquid inside the other mounting box 703 will enter the inside of the water tank 613 through the return water pipe 711.

[0031] Working principle: During heat dissipation, the water pump 610 is started. The input end of the water pump 610 pumps out the coolant inside the water tank 613 through the suction pipe 611, and pumps it into the inside of the cooling pipe 604 through the output end of the water pump 610 and the outlet pipe 612. The liquid then enters the inside of the cooling coil 609 through the cooling pipe 604. The liquid enters the inside of the accelerated cooling mechanism 7 through the other end of the cooling coil 609, and the liquid is returned to the inside of the water tank 613 through the accelerated cooling mechanism 7. At this time, the flow of the cooling liquid is completed. When the liquid flows into the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603, it can be accelerated in heat dissipation by the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603. Subsequently, the temperature of the liquid inside the cooling coil 609 can be decreased, and then the carrier sheet 607 can be cooled, thereby avoiding the performance fluctuation problem caused by the high-temperature operation of the probe station during the wafer processing. At the same time, due to the accelerated heat dissipation of the high thermal conductivity metal plate 602, and the carrier sheet 607, the heat dissipation ring 608, and the thermal conductive metal seat 605 all have the function of heat conduction, the carrier sheet 607 can be cooled, and at the same time, the heat dissipation ring 608 can be used to accelerate the heat dissipation of the carrier sheet 607. Therefore, the high temperature of the probe station can be avoided;

[0032] When the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603 are dissipating heat for a long time, their own temperatures will also increase. Therefore, the accelerated cooling mechanism 7 is required to dissipate heat for the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603, so as to maintain the heat dissipation effect of the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603. When the other end of the cooling coil 609 passes the liquid into the inside of the installation box 703, it can drive the impeller 704 to rotate. When the impeller 704 rotates, it can drive the connecting rotating column 705 to rotate. After the connecting rotating column 705 rotates, it can drive the fan 706 to rotate. After the fan 706 rotates, it can generate wind to dissipate heat for the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603. Therefore, the heat dissipation effect of the high thermal conductivity metal plate 602 and the thermal conductive silicone grease 603 can be maintained. When the liquid enters one of the installation boxes 703, it can enter the inside of the installation box 703 through the connecting pipe 710, thereby driving the impeller 704 inside the other installation box 703 to rotate, and then enabling the two fans 706 to rotate. At the same time, the liquid inside the other installation box 703 will enter the inside of the water tank 613 through the return pipe 711.

[0033] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A probe station wafer carrier platform cooling device, comprising a bottom plate (1), characterized in that: Support side plates (2) are fixedly connected to both sides of the top of the bottom plate (1); a fixing plate (3) is fixedly connected between the tops of the two supporting side plates (2); a mounting plate (4) is fixedly connected to the top of the fixing plate (3); the mounting plate (4) provides a mounting position and can also play a role in noise reduction; a microscope (5) is arranged outside the mounting plate (4); a cooling platform mechanism (6) is arranged on the top of the bottom plate (1); the cooling platform mechanism (6) plays a role in cooling; accelerated cooling mechanisms (7) are arranged on both sides of the cooling platform mechanism (6); the accelerated cooling mechanism (7) is used to accelerate the cooling of the cooling platform mechanism (6).

2. The probe station wafer carrier platform cooling device according to claim 1, characterized in that: The cooling platform mechanism (6) comprises a mounting frame (601), the bottom of the mounting frame (601) is fixedly connected to the top of the bottom plate (1), a plurality of high thermal conductivity metal plates (602) are arranged inside the mounting frame (601), a plurality of thermal conductive silicone greases (603) are arranged inside the mounting frame (601), a cooling tube (604) is fixedly connected between the plurality of high thermal conductivity metal plates (602) and the interior of the plurality of thermal conductive silicone greases (603), a thermal conductive metal seat (605) is fixedly connected to the top of the high thermal conductivity metal plate (602), a thermal conductive metal column (606) is fixedly connected to the top of the thermal conductive metal seat (605), a bearing sheet (606) is fixedly connected to the top of the thermal conductive metal column (606), and a heat conducting metal plate (606) is fixedly connected to the top of the heat conducting metal plate (602). 07), a cooling coil (609) is fixedly connected inside the carrier plate (607), one end of the cooling coil (609) is fixedly connected to one end of the cooling tube (604), and the other end of the cooling coil (609) is fixedly connected to the outside of the accelerated cooling mechanism (7), a water pump (610) is fixedly connected to the top of the bottom plate (1), the input end of the water pump (610) is fixedly connected to a water pumping pipe (611), the output end of the water pump (610) is fixedly connected to a water outlet pipe (612), and one end of the water outlet pipe (612) away from the water pump (610) is fixedly connected to the other end of the cooling tube (604), and a water tank (613) is fixedly connected inside one of the supporting side plates (2).

3. The probe station wafer carrier platform cooling device according to claim 2, characterized in that: The accelerated cooling mechanism (7) comprises two connecting plates (701), one side of the two connecting plates (701) is respectively fixedly connected to the two sides of the bottom of the installation frame (601), the top of the connecting plate (701) is fixedly connected with a fixing seat (702), the side of the fixing seat (702) close to the installation frame (601) is fixedly connected with a mounting box (703), the inside of the installation box (703) is rotatably connected with an impeller (704), the side of the impeller (704) close to the installation frame (601) is fixedly connected with a connecting rotating column (705), the side of the connecting rotating column (705) close to the installation frame (601) is fixedly connected with a fan (706), and a connecting pipe (710) is fixedly connected between the two installation boxes (703).

4. The probe station wafer carrier platform cooling device according to claim 2, characterized in that: A water injection pipe (614) is fixedly connected to one side of the water tank (613), and a sealing cover (615) is fixedly connected to the top of the water injection pipe (614).

5. The probe station wafer carrier platform cooling device according to claim 3, characterized in that: The top of the connecting plate (701) is fixedly connected to a fixed half circle (708), and the inner side of the fixed half circle (708) is fixedly connected to an outer frame (707).

6. The probe station wafer carrier platform cooling device according to claim 5, characterized in that: A mounting frame (709) is fixedly connected inside the outer frame (707), and one end of the fan (706) away from the impeller (704) is rotatably connected to a side of the mounting frame (709) close to the mounting box (703).

7. The probe station wafer carrier platform cooling device according to claim 3, characterized in that: The other end of the cooling coil (609) is fixedly connected to the outside of one of the installation boxes (703), and the top of the other installation box (703) is fixedly connected to a return pipe (711).

8. The probe station wafer carrier platform cooling device according to claim 7, characterized in that: One end of the water return pipe (711) away from the installation box (703) is fixedly connected to the outside of the water tank (613), and a plurality of heat dissipation rings (608) are fixedly connected to the top of the supporting plate (607).

9. The probe station wafer carrier platform cooling device according to claim 2, characterized in that: The plurality of high thermal conductivity metal plates (602) and the plurality of thermal conductive silicone greases (603) are arranged in an alternating manner, and the high thermal conductivity metal plates (602) and the thermal conductive silicone greases (603) are fixedly connected.

10. The probe station wafer carrier platform cooling device according to claim 4, characterized in that: The four bottom corners of the base plate (1) are fixedly connected with support feet (8), and a sealing gasket is arranged inside the sealing cover (615).

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