Integrated circuit board production and processing equipment

Abstract

The invention belongs to the technical field of integrated circuit processing, and particularly relates to integrated circuit board production and processing equipment which comprises a processing main body and a translation assembly arranged on the processing main body, and further comprises a packaging mechanism and a post-processing mechanism, the packaging mechanism is arranged on the processing main body, and the post-processing mechanism is arranged on the processing main body; the packaging mechanism comprises a mixing assembly, a defoaming type stirring assembly, an output assembly and a turbulent bubble reducing assembly, the mixing assembly is arranged on the packaging mechanism, the defoaming type stirring assembly is arranged on the mixing assembly, the output assembly is arranged on the defoaming type stirring assembly, and the turbulent bubble reducing assembly is arranged on the mixing assembly; through the arrangement of the defoaming type stirring assembly, the vacuum pump exhausts air to reduce the air pressure in the container, so that bubbles dissolved or retained in the resin are expanded and quickly float to the surface to be discharged.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit processing, and specifically refers to a production and processing device for integrated circuit boards. Background Art

[0002] An integrated circuit is a highly precise electronic component that integrates multiple electronic elements on a tiny chip to form a complete circuit functional unit. This highly integrated design enables integrated circuits to have advantages such as small size, low power consumption, and high performance, and they are widely used in various electronic devices.

[0003] In the production and processing of integrated circuits, packaging is a crucial step. Packaging not only protects the chip from the external environment but also enables the connection between the chip and the external circuit. However, there is a significant drawback in the current integrated circuit packaging process, that is, bubbles are easily generated during the packaging process. These bubbles may stem from various factors such as the characteristics of the packaging resin material, resin moisture absorption caused by improper production and storage conditions, and the mismatch between the resin material and the equipment trough size. The presence of bubbles will seriously affect the quality of the package, reducing its strength and moisture resistance, and at the same time will also have an adverse impact on the electrical insulation performance. This will not only shorten the service life of the integrated circuit but also may cause the chip to operate unreliably, having a negative impact on the overall performance of the electronic device. Summary of the Invention

[0004] To solve the above problems, the present invention proposes a production and processing device for integrated circuit boards.

[0005] The technical solution adopted by the present invention is as follows: The present invention provides a production and processing device for integrated circuit boards, including a processing main body, and a translation component arranged on the processing main body. It also includes a packaging mechanism and a post-processing mechanism. The packaging mechanism is arranged on the processing main body, and the post-processing mechanism is arranged on the processing main body; the packaging mechanism includes a mixing component, a defoaming stirring component, an output component, and a turbulent bubble reduction component. The mixing component is arranged on the packaging mechanism, the defoaming stirring component is arranged on the mixing component, the output component is arranged on the defoaming stirring component, and the turbulent bubble reduction component is arranged on the mixing component.

[0006] Further, the processing body includes a processing table, on which a support column is provided. At the upper end of the support column, there is a support block, and at the lower end of the support block, there is a groove body. At the upper end of the processing table, there is a sliding groove, and a slider is slidably arranged in the sliding groove. At the upper end of the slider, there is a support block, and at the upper end of the support block, there is a moving base. At the rear side of the top end of the processing table, there is a first motor, and at the front side of the top end of the processing table, there is a fixed block. The output end of the first motor is provided with a first lead screw, and one end of the first lead screw is rotatably connected to the side wall of the fixed block. A sleeve is arranged on the first lead screw, and the first lead screw is threadedly connected to the sleeve. The upper end of the sleeve is connected to the lower end of the moving base.

[0007] Further, the translation assembly includes a third motor, which is arranged in the support block. The output end of the third motor is provided with one end of a second lead screw, and the other end of the second lead screw is rotatably arranged on the inner side wall of the groove body. On the inner side wall of the groove body, there is a slide bar, and a moving block is slidably sleeved on the slide bar. The second lead screw is sleeved with the moving block, and the second lead screw is threadedly connected to the moving block.

[0008] Further, the mixing assembly includes a first lifting cylinder, the cylinder seat of which is arranged at the lower end of the moving block. The output end of the first lifting cylinder is provided with a lifting plate. On one side of the top end of the lifting plate, there is an annular resin storage tank, and on the other side of the top end of the lifting plate, there is a curing agent storage tank. The lower end of the outer side wall of the annular resin storage tank is connected to the water pumping end of a first gear pump in a through manner, and the output end of the first gear pump is connected to a first output pipe in a through manner. A fourth electronic valve is arranged on the first output pipe. The lower end of the outer side wall of the curing agent storage tank is connected to the water pumping end of a second gear pump in a through manner, and the output end of the second gear pump is connected to a second output pipe in a through manner. A fifth electronic valve is arranged on the second output pipe. An air vent valve is arranged at the upper end of the side wall of the mixing tank.

[0009] Further, the defoaming stirring assembly includes a mixing tank, which is arranged at the upper end of the lifting plate. One end of the first output pipe is connected to the outer side wall of the mixing tank in a through manner, and one end of the second output pipe is connected to the other outer side wall of the mixing tank in a through manner. A stirring pipe is rotatably arranged at the upper end of the mixing tank. A first bevel gear is sleeved on the upper end of the side wall of the stirring pipe, and the first bevel gear is arranged outside the mixing tank. An air extraction hole is opened at the upper end of the side wall of the stirring pipe, and the air extraction hole is arranged inside the mixing tank. Stirring rods are arranged on the side wall of the stirring pipe. At one side of the top end of the mixing tank, there is a second motor, and the output end of the second motor is provided with a second bevel gear. The first bevel gear and the second bevel gear are meshed and rotatably connected. At the other side of the top end of the mixing tank, there is a second vacuum pump. The top end of the stirring pipe is connected to the rotating interface of a rotary joint in a through manner, and the air extraction end of the second vacuum pump is connected to the fixed interface of the rotary joint.

[0010] Further, the output component includes a third gear pump. The suction end of the third gear pump is connected to the lower end of the stirring tank through penetration, and the output end of the third gear pump is connected to one end of a third output pipe through penetration. A first electronic valve is provided on the third output pipe.

[0011] Further, the turbulent bubble reduction component includes an atomization chamber. The atomization chamber is provided at the lower end of the lifting plate. A defoaming agent storage tank is provided at the inner top end of the atomization chamber. The lower end of the defoaming agent storage tank is connected to a drip pipe through penetration. A second electronic valve is provided on the drip pipe. A liquid collection chamber is provided at the inner bottom end of the atomization chamber. An ultrasonic atomization sheet is provided in the liquid collection chamber. A fan is provided on the side wall of the atomization chamber. One end of a fourth output pipe is connected to the other side wall of the atomization chamber through penetration, and the other end of the fourth output pipe is connected to the outer side wall of an annular chamber through penetration. A mist outlet is opened at the lower end of the annular chamber. The annular chamber is sleeved on the side wall of the third output pipe.

[0012] Further, the post-treatment mechanism includes a demoulding component and a curing component. The demoulding component is arranged on the moving base, and the curing component is arranged on the moving base.

[0013] Further, the demoulding component includes a packaging block. The packaging block is arranged on the moving base. An encapsulation groove is provided at the upper end of the packaging block. A flexible silica gel film is provided on the inner wall of the encapsulation groove. A second lifting cylinder is provided at the inner bottom end of the packaging block. A top plate is provided at the output end of the second lifting cylinder. A support rod is provided at the upper end of the top plate. A support plate is provided at the upper end of the support rod. The support plate is arranged at the inner bottom end of the encapsulation groove.

[0014] Further, the curing component includes an annular enclosure. A sealing cover is detachably provided at the upper end of the annular enclosure. A heating element is provided on the inner side wall of the annular enclosure. A first vacuum pump is provided on the outer side wall of the annular enclosure. The air extraction end of the first vacuum pump is arranged inside the annular enclosure. A nitrogen storage tank is provided at the inner bottom end of the moving base. The output end of the nitrogen storage tank is connected to a fifth output pipe through penetration. The air outlet end of the fifth output pipe is arranged inside the annular enclosure. A third electronic valve is provided on the fifth output pipe. A pressure reducing valve is provided on the fifth output pipe. The pressure reducing valve is arranged above the third electronic valve.

[0015] The beneficial effects achieved by the present invention with the above structure are as follows:

[0016] (1) The setting of the defoaming type stirring component. The vacuum pump extracts air to reduce the air pressure inside the container, prompting the bubbles dissolved or retained in the resin to expand and quickly float to the surface and be discharged. This process can significantly reduce the bubble residue inside the resin, avoid voids or cracks caused by bubbles after curing, and thus enhance the overall density of the material.

[0017] (2) The presence of air bubbles will weaken the strength, toughness and durability of the epoxy resin. Through the defoaming stirring component, the tensile strength, impact resistance and fatigue resistance of the material are significantly improved.

[0018] (3) The setting of the defoaming stirring component can reduce defects such as depressions and ripples on the surface of the cured resin, making the appearance of the finished product smoother and flatter, meeting the high standards of precision industrial scenarios.

[0019] (4) The setting of the turbulent air bubble reducing component helps to reduce production costs by reducing the waste of conductive paste and improving its utilization rate.

[0020] (5) The setting of the turbulent air bubble reducing component can use the atomized defoaming agent to reduce the interfacial turbulent air bubbles during the flow of the mixed solvent, and simultaneously eliminate the air bubbles during the stirring and pouring stages.

[0021] (6) The setting of the curing component fills the nitrogen in the nitrogen storage tank into the annular enclosure to reduce the influence of oxidation reaction on the encapsulation layer.

[0022] (7) The atomized defoaming agent quickly eliminates the micro air bubbles generated during the pouring process through particle dispersion.

[0023] (8) The setting of the demoulding component facilitates the removal after the integrated circuit encapsulation is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the present invention, the drawings required for description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is a main view of a production and processing equipment for an integrated circuit board according to the present invention;

[0026] Figure 2 It is a schematic structural diagram of a production and processing equipment for an integrated circuit board according to the present invention;

[0027] Figure 3 It is a schematic structural diagram of the post-processing mechanism;

[0028] Figure 4 It is a schematic structural diagram of the encapsulation mechanism;

[0029] Figure 5 It is a schematic left view of the internal structure of the processing table;

[0030] Figure 6 It is a bottom view of the annular cavity;

[0031] Figure 7 ForFigure 3 Partial enlarged view of part A;

[0032] Figure 8 is Figure 4 Partial enlarged view of part B;

[0033] Figure 9 is Figure 4 Partial enlarged view of part C.

[0034] Wherein, 1, processing main body, 2, encapsulation mechanism, 3, post-processing mechanism, 4, translation component, 5, processing table, 6, support column, 7, support block, 8, tank body, 9, sliding groove, 10, slider, 11, moving base, 12, first motor, 13, first lead screw, 14, sleeve, 15, fixed block, 16, mixing component, 17, defoaming stirring component, 18, output component, 19, turbulent bubble reduction component, 20, first lifting cylinder, 21, lifting plate, 22, annular resin storage tank, 23, first gear pump, 24, first output pipe, 25, curing agent storage tank, 26, second gear pump, 27, second output pipe, 28, stirring tank, 29, stirring pipe, 30, stirring rod, 31, air extraction hole, 32, second motor, 33, first bevel gear, 34, second bevel gear, 35, rotary joint, 36, third output pipe, 37, first electronic valve, 38, third gear pump, 39, atomization chamber, 40, defoaming agent storage tank, 41, annular chamber, 42, ultrasonic atomization sheet, 43, fourth output pipe, 44, second electronic valve, 45, liquid collection chamber, 46, demoulding component, 47, curing component, 48, encapsulation block, 49, encapsulation groove, 50, flexible silica gel film, 51, support plate, 52, support rod, 53, top plate, 54, second lifting cylinder, 55, annular enclosure, 56, heating element, 57, sealing cover, 58, first vacuum pump, 59, nitrogen storage tank, 60, fifth output pipe, 61, third electronic valve, 62, pressure reducing valve, 63, third motor, 64, second lead screw, 65, slide bar, 66, moving block, 67, fourth electronic valve, 68, fifth electronic valve, 69, second vacuum pump, 70, drip tube, 71, support block, 72, fan, 73, fog outlet, 74, ventilation valve. Detailed implementation manners

[0035] To make the objectives, features, and advantages of the present invention more obvious and understandable, the technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings in the specific embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in this patent, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this patent.

[0036] Such asFigures 1 - 9 As shown in the figure, the present invention provides a production and processing device for an integrated circuit board, including a processing main body 1, a translation component 4 arranged on the processing main body 1, a packaging mechanism 2 and a post-processing mechanism 3. The packaging mechanism 2 is arranged on the processing main body 1, and the post-processing mechanism 3 is arranged on the processing main body 1.

[0037] The processing main body 1 includes a processing table 5, support columns 6, support blocks 7, a groove body 8, a sliding groove 9, a sliding block 10, a moving base 11, a first motor 12, a first lead screw 13, a sleeve 14, a fixed block 15 and a support block 71. Support columns 6 are arranged on the processing table 5, support blocks 7 are arranged at the upper ends of the support columns 6, a groove body 8 is arranged at the lower end of the support block 7, a sliding groove 9 is arranged at the upper end of the processing table 5, a sliding block 10 is slidably arranged in the sliding groove 9, a support block 71 is arranged at the upper end of the sliding block 10, a moving base 11 is arranged at the upper end of the support block 71, a first motor 12 is arranged at the rear side of the top end of the processing table 5, a fixed block 15 is arranged at the front side of the top end of the processing table 5, the output end of the first motor 12 is provided with a first lead screw 13, one end of the first lead screw 13 is rotatably connected to the side wall of the fixed block 15, a sleeve 14 is arranged on the first lead screw 13, the first lead screw 13 is threadedly connected to the sleeve 14, and the upper end of the sleeve 14 is connected to the lower end of the moving base 11.

[0038] The translation component 4 includes a third motor 63, a second lead screw 64, a slide bar 65 and a moving block 66. The third motor 63 is arranged in the support block 7, one end of a second lead screw 64 is arranged at the output end of the third motor 63, the other end of the second lead screw 64 is rotatably arranged on the inner side wall of the groove body 8, a slide bar 65 is arranged on the inner side wall of the groove body 8, the moving block 66 is slidably sleeved on the slide bar 65, the moving block 66 is sleeved on the second lead screw 64, and the second lead screw 64 is threadedly connected to the moving block 66.

[0039] The packaging mechanism 2 includes a mixing component 16, a defoaming stirring component 17, an output component 18 and a turbulent bubble reduction component 19. The mixing component 16 is arranged on the packaging mechanism 2, the defoaming stirring component 17 is arranged on the mixing component 16, the output component 18 is arranged on the defoaming stirring component 17, and the turbulent bubble reduction component 19 is arranged on the mixing component 16.

[0040] The mixing component 16 includes a first lifting cylinder 20, a lifting plate 21, an annular resin storage tank 22, a first gear pump 23, a first output pipe 24, a curing agent storage tank 25, a second gear pump 26, a second output pipe 27, a fourth electronic valve 67 and a fifth electronic valve 68. The cylinder base of the first lifting cylinder 20 is arranged at the lower end of the moving block 66. The output end of the first lifting cylinder 20 is provided with a lifting plate 21. One side of the top end of the lifting plate 21 is provided with an annular resin storage tank 22. The other side of the top end of the lifting plate 21 is provided with a curing agent storage tank 25. The lower end of the outer side wall of the annular resin storage tank 22 is connected to the water suction end of the first gear pump 23 in a penetrating manner. The output end of the first gear pump 23 is connected to the first output pipe 24 in a penetrating manner. A fourth electronic valve 67 is arranged on the first output pipe 24. The lower end of the outer side wall of the curing agent storage tank 25 is connected to the water suction end of the second gear pump 26 in a penetrating manner. The output end of the second gear pump 26 is connected to the second output pipe 27 in a penetrating manner. A fifth electronic valve 68 is arranged on the second output pipe 27. An air vent valve 74 is arranged at the upper end of the side wall of the mixing tank 28.

[0041] The defoaming and stirring component 17 includes a mixing tank 28, a stirring pipe 29, a stirring rod 30, an air extraction hole 31, a second motor 32, a first bevel gear 33, a second bevel gear 34, a rotary joint 35, a second vacuum pump 69 and an air vent valve 74. The mixing tank 28 is arranged at the upper end of the lifting plate 21. One end of the first output pipe 24 is connected to the outer side wall of the mixing tank 28 in a penetrating manner. One end of the second output pipe 27 is connected to the other outer side wall of the mixing tank 28 in a penetrating manner. A stirring pipe 29 is rotatably arranged at the upper end of the mixing tank 28. The first bevel gear 33 is sleeved on the upper end of the side wall of the stirring pipe 29. The first bevel gear 33 is arranged outside the mixing tank 28. The air extraction hole 31 is opened at the upper end of the side wall of the stirring pipe 29. The air extraction hole 31 is arranged inside the mixing tank 28. Stirring rods 30 are arranged on the side wall of the stirring pipe 29. A second motor 32 is arranged at one side of the top end of the mixing tank 28. The output end of the second motor 32 is provided with a second bevel gear 34. The first bevel gear 33 and the second bevel gear 34 are meshed and rotatably connected. A second vacuum pump 69 is arranged at the other side of the top end of the mixing tank 28. The top end of the stirring pipe 29 is connected to the rotary interface of the rotary joint 35 in a penetrating manner. The air extraction end of the second vacuum pump 69 is connected to the fixed interface of the rotary joint 35.

[0042] The output component 18 includes a third output pipe 36, a first electronic valve 37 and a third gear pump 38. The suction end of the third gear pump 38 is connected to the lower end of the mixing tank 28 in a penetrating manner. The output end of the third gear pump 38 is connected to one end of the third output pipe 36 in a penetrating manner. A first electronic valve 37 is arranged on the third output pipe 36.

[0043] The turbulent bubble reduction component 19 includes an atomization chamber 39, an antifoaming agent storage tank 40, an annular chamber 41, an ultrasonic atomization sheet 42, a fourth output pipe 43, a second electronic valve 44, a liquid collection chamber 45, a drip pipe 70, a fan 72 and a mist outlet 73. The atomization chamber 39 is arranged at the lower end of the lifting plate 21. At the inner top of the atomization chamber 39, there is an antifoaming agent storage tank 40. The lower end of the antifoaming agent storage tank 40 is connected through the drip pipe 70, and a second electronic valve 44 is arranged on the drip pipe 70. At the inner bottom of the atomization chamber 39, there is a liquid collection chamber 45, and an ultrasonic atomization sheet 42 is arranged in the liquid collection chamber 45. A fan 72 is arranged on the side wall of the atomization chamber 39. One end of a fourth output pipe 43 is connected through the side wall of the atomization chamber 39, and the other end of the fourth output pipe 43 is connected through the outer side wall of the annular chamber 41. A mist outlet 73 is opened at the lower end of the annular chamber 41, and the annular chamber 41 is sleeved on the side wall of the third output pipe 36.

[0044] The post-treatment mechanism 3 includes a demolding component 46 and a curing component 47. The demolding component 46 is arranged on the moving base 11, and the curing component 47 is arranged on the moving base 11.

[0045] The demolding component 46 includes a packaging block 48, a packaging groove 49, a flexible silica gel film 50, a support plate 51, a support rod 52, a top plate 53 and a second lifting cylinder 54. The packaging block 48 is arranged on the moving base 11. At the upper end of the packaging block 48, there is a packaging groove 49. A flexible silica gel film 50 is arranged on the inner wall of the packaging groove 49. At the inner bottom of the packaging block 48, there is a second lifting cylinder 54. The output end of the second lifting cylinder 54 is provided with a top plate 53. At the upper end of the top plate 53, there is a support rod 52. At the upper end of the support rod 52, there is a support plate 51, and the support plate 51 is arranged at the inner bottom of the packaging groove 49.

[0046] The curing component 47 includes an annular enclosure 55, a heating element 56, a sealing cover 57, a first vacuum pump 58, a nitrogen storage tank 59, a fifth output pipe 60, a third electronic valve 61 and a pressure reducing valve 62. The sealing cover 57 is detachably arranged at the upper end of the annular enclosure 55. A heating element 56 is arranged on the inner side wall of the annular enclosure 55. A first vacuum pump 58 is arranged on the outer side wall of the annular enclosure 55, and the air extraction end of the first vacuum pump 58 is arranged inside the annular enclosure 55. At the inner bottom of the moving base 11, there is a nitrogen storage tank 59. The output end of the nitrogen storage tank 59 is connected through the fifth output pipe 60, and the air outlet end of the fifth output pipe 60 is arranged inside the annular enclosure 55. A third electronic valve 61 is arranged on the fifth output pipe 60, and a pressure reducing valve 62 is arranged on the fifth output pipe 60, and the pressure reducing valve 62 is arranged above the third electronic valve 61.

[0047] During specific use, first open the sealing cover 57, place the integrated circuit board on the support plate 51, open the fourth electronic valve 67 and the fifth electronic valve 68, start the first gear pump 23 and the second gear pump 26, and convey the epoxy resin in the annular resin storage tank 22 and the curing agent in the curing agent storage tank 25 to the mixing tank 28. Subsequently, close the fourth electronic valve 67 and the fifth electronic valve 68. The output end of the second motor 32 rotates to drive the second bevel gear 34 to rotate. The second bevel gear 34 rotates to drive the first bevel gear 33 to rotate. The first bevel gear 33 rotates to drive the mixing pipe 29 to rotate. The mixing pipe 29 rotates to drive the mixing rod 30 to rotate, and stir and mix the epoxy resin and the curing agent. After the stirring is completed, start the second vacuum pump 69 to extract the air in the mixing tank 28. By reducing the air pressure in the mixing tank 28, the bubbles dissolved or retained in the mixed solvent of the epoxy resin and the curing agent are promoted to expand and quickly float to the surface and be discharged. After the defoaming is completed, open the air vent valve 74, start the third gear pump 38, and extrude the mixed solvent in the mixing tank 28 through the third output pipe 36 into the encapsulation groove 49. At the same time, open the fan 72, the second electronic valve 44, and the ultrasonic atomizing sheet 42. The defoaming agent in the defoaming agent storage tank 40 drips onto the ultrasonic atomizing sheet 42 through the drip tube 70, is atomized by the ultrasonic atomizing sheet 42, and enters the fourth output pipe 43 and the annular cavity 41 together with the air flow generated by the fan 72, and is finally sprayed into the encapsulation groove 49 through the mist outlet 73. The atomized defoaming agent can reduce the interfacial turbulent bubbles during the flow of the mixed solvent, and synchronously eliminate the bubbles in the stirring and pouring stages. The inner wall of the flexible silica gel film 50 is pre-coated with a release agent. The height of the lifting plate 21 is controlled by controlling the output end of the first lifting cylinder 20, so as to control the height of the output assembly 18. By controlling the forward or reverse rotation of the output end of the third motor 63, the second lead screw 64 is driven to rotate forward or reverse, so as to drive the moving block 66 to move left and right. The moving block 66 moves left and right to drive the first lifting cylinder 20 to move left and right. The first lifting cylinder 20 moves left and right to drive the lifting plate 21 to move left and right. The lifting plate 21 drives the output assembly 18 to move left and right. The forward or reverse rotation of the output end of the first motor 12 drives the first lead screw 13 to rotate forward or reverse. The first lead screw 13 rotates forward or reverse to drive the sleeve 14 to move back and forth. The sleeve 14 moves back and forth to drive the base 11 to move back and forth, so as to adjust the front and back positions of the encapsulation block 48, which is convenient for injecting the mixed agent into the encapsulation groove 49. Subsequently, install the sealing cover 57 on the upper end of the annular enclosure 55, start the first vacuum pump 58 to extract the air in the annular enclosure 55, open the third electronic valve 61 and the pressure reducing valve 62, and fill the nitrogen in the nitrogen storage tank 59 into the annular enclosure 55 to reduce the influence of the oxidation reaction on the encapsulation layer. Subsequently, close the third electronic valve 61 and the pressure reducing valve 62, start the heating element 56 to heat the annular enclosure 55. After the mixed agent is cured, the output end of the second lifting cylinder 54 moves upward to drive the top plate 53 to move upward. The top plate 53 moves upward to drive the support rod 52 to move upward.The support rod 52 moves upward to drive the support plate 51 to move upward, ejecting the encapsulated integrated circuit. The above is the overall working process of the present invention. Repeat this step when using it next time.

[0048] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. An integrated circuit board production and processing equipment, comprising a processing body (1), and a translation assembly (4) arranged on the processing body (1), characterized in that: The invention also comprises a packaging mechanism (2) and a post-processing mechanism (3); the packaging mechanism (2) is arranged on the processing body (1), and the post-processing mechanism (3) is arranged on the processing body (1); the packaging mechanism (2) comprises a mixing component (16), a defoaming stirring component (17), an output component (18) and a turbulent bubble reducing component (19); the mixing component (16) is arranged on the packaging mechanism (2), the defoaming stirring component (17) is arranged on the mixing component (16), the output component (18) is arranged on the defoaming stirring component (17), and the turbulent bubble reducing component (19) is arranged on the mixing component (16).

2. The integrated circuit board production and processing equipment according to claim 1, characterized in that: The processing body (1) comprises a processing table (5), a supporting column (6) is provided on the processing table (5), a supporting block (7) is provided at the upper end of the supporting column (6), a groove (8) is provided at the lower end of the supporting block (7), a slide groove (9) is provided at the upper end of the processing table (5), a sliding block (10) is provided in the sliding groove (9), a supporting block (71) is provided at the upper end of the supporting block (71), a movable base (11) is provided at the upper end of the processing table ( 5), a first motor (12) is provided at the rear side of the top end of the processing table (5), a fixed block (15) is provided at the front side of the top end of the processing table (5), a first lead screw (13) is provided at the output end of the first motor (12), one end of the first lead screw (13) is rotatably connected to the side wall of the fixed block (15), a sleeve (14) is provided on the first lead screw (13), the first lead screw (13) and the sleeve (14) are threadedly connected, and the upper end of the sleeve (14) is connected to the lower end of the movable base (11).

3. The integrated circuit board production and processing equipment according to claim 2, characterized in that: The translation assembly (4) comprises a third motor (63), the third motor (63) is arranged in the support block (7), the output end of the third motor (63) is provided with one end of a second lead screw (64), the other end of the second lead screw (64) is rotatably arranged on the inner wall of the groove body (8), the inner wall of the groove body (8) is provided with a sliding rod (65), the sliding rod (65) is slidably sleeved on the moving block (66), the second lead screw (64) is sleeved on the moving block (66), and the second lead screw (64) and the moving block (66) are threadedly connected.

4. The integrated circuit board production and processing equipment according to claim 3, characterized in that: The mixing assembly (16) comprises a first lifting cylinder (20), the cylinder seat of the first lifting cylinder (20) is arranged at the lower end of the moving block (66), the output end of the first lifting cylinder (20) is provided with a lifting plate (21), one side of the top end of the lifting plate (21) is provided with an annular resin storage tank (22), the other side of the top end of the lifting plate (21) is provided with a curing agent storage tank (25), the lower end of the outer wall of the annular resin storage tank (22) is connected to the pumping end of the first gear pump (23) through the lower end of the outer wall of the annular resin storage tank (22) The output end of the first gear pump (23) is connected to the first output pipe (24), and the first output pipe (24) is provided with a fourth electronic valve (67). The lower end of the outer wall of the curing agent storage tank (25) is connected to the pumping end of the second gear pump (26), and the output end of the second gear pump (26) is connected to the second output pipe (27), and the second output pipe (27) is provided with a fifth electronic valve (68). The upper end of the side wall of the stirring tank (28) is provided with a vent valve (74).

5. The integrated circuit board production and processing equipment according to claim 4, characterized in that: The defoaming stirring assembly (17) comprises a stirring tank (28), wherein the stirring tank (28) is arranged at the upper end of the lifting plate (21), the outer wall of the stirring tank (28) is connected to one end of the first output pipe (24), and the other outer wall of the stirring tank (28) is connected to one end of the second output pipe (27). A stirring tube (29) is rotatably arranged at the upper end of the stirring tank (28), and the upper end of the side wall of the stirring tube (29) is sleeved with a first bevel gear (33), and the first bevel gear (33) is arranged outside the stirring tank (28). An air extraction hole (31) is provided at the upper end of the side wall of the stirring tube (29), and the air extraction hole (31) is provided at the upper end of the side wall of the stirring tube (29). An air hole (31) is arranged inside the stirring tank (28); a stirring rod (30) is arranged on the side wall of the stirring tube (29); a second motor (32) is arranged on one side of the top end of the stirring tank (28); a second bevel gear (34) is arranged at the output end of the second motor (32); the first bevel gear (33) and the second bevel gear (34) are meshed and rotatably connected; a second vacuum pump (69) is arranged on the other side of the top end of the stirring tank (28); the top end of the stirring tube (29) is connected to a rotating interface of a rotating joint (35); and an exhaust end of the second vacuum pump (69) is connected to a fixed interface of the rotating joint (35).

6. The integrated circuit board production and processing equipment according to claim 5, characterized in that: The output assembly (18) comprises a third gear pump (38), the suction end of the third gear pump (38) is connected to the lower end of the stirring tank (28), and the output end of the third gear pump (38) is connected to one end of a third output pipe (36), and the third output pipe (36) is provided with a first electronic valve (37).

7. The integrated circuit board production and processing equipment according to claim 6, characterized in that: The turbulent bubble reduction component (19) comprises an atomizing chamber (39), wherein the atomizing chamber (39) is arranged at the lower end of the lifting plate (21), a defoaming agent storage tank (40) is arranged at the top end of the atomizing chamber (39), a dripping pipe (70) is connected to the lower end of the defoaming agent storage tank (40), a second electronic valve (44) is arranged on the dripping pipe (70), and a liquid collecting chamber (45) is arranged at the bottom end of the atomizing chamber (39), wherein the liquid collecting chamber (45) is provided with an ultrasonic atomizing sheet (42), a fan (72) is provided on the side wall of the atomizing chamber (39), one end of a fourth output tube (43) is connected to the other side wall of the atomizing chamber (39), the other end of the fourth output tube (43) is connected to the outer wall of the annular chamber (41), a mist outlet (73) is provided at the lower end of the annular chamber (41), and the annular chamber (41) is sleeved on the side wall of the third output tube (36).

8. The integrated circuit board production and processing equipment according to claim 7, characterized in that: The post-processing mechanism (3) comprises a demoulding component (46) and a curing component (47); the demoulding component (46) is arranged on a movable base (11); and the curing component (47) is arranged on a movable base (11).

9. The integrated circuit board production and processing equipment according to claim 8, characterized in that: The demoulding assembly (46) comprises a packaging block (48), wherein the packaging block (48) is arranged on a movable base (11), a packaging groove (49) is arranged at the upper end of the packaging block (48), a flexible silicone film (50) is arranged on the inner wall of the packaging groove (49), a second lifting cylinder (54) is arranged at the inner bottom end of the packaging block (48), a top plate (53) is arranged at the output end of the second lifting cylinder (54), a support rod (52) is arranged at the upper end of the top plate (53), a support plate (51) is arranged at the upper end of the support rod (52), and the support plate (51) is arranged at the inner bottom end of the packaging groove (49).

10. The integrated circuit board production and processing equipment according to claim 9, characterized in that: The curing assembly (47) comprises an annular enclosure (55), the upper end of which is detachably provided with a sealing cover (57), the inner side wall of the annular enclosure (55) is provided with a heating element (56), the outer side wall of the annular enclosure (55) is provided with a first vacuum pump (58), the exhaust end of the first vacuum pump (58) is arranged in the annular enclosure (55), the inner bottom end of the movable base (11) is provided with a nitrogen storage tank (59), the output end of the nitrogen storage tank (59) is connected to a fifth output pipe (60), the outlet end of the fifth output pipe (60) is arranged in the annular enclosure (55), the fifth output pipe (60) is provided with a third electronic valve (61), the fifth output pipe (60) is provided with a pressure reducing valve (62), and the pressure reducing valve (62) is arranged above the third electronic valve (61).

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