A semiconductor device detection and processing system and a processing method

Abstract

A semiconductor device detection and processing system and a processing method belong to the technical field of semiconductor detection and processing. The semiconductor device detection and processing system includes: an input slot, a switching slot, and an output slot that are sequentially arranged along the same conveying track for conveying semiconductor devices; the switching slot is movably arranged along a direction perpendicular to the conveying direction; a turntable is rotatably arranged in the middle of the switching slot, and the axis of rotation is perpendicular to the top surface of the switching slot. A material passing slot is opened on the top surface of the turntable, and its cross-section is the same as that of the switching slot; the input slot is provided with a first detection component for detecting semiconductor devices in a first posture; the switching slot is provided with a second detection component for detecting semiconductor devices in a second posture; both the first detection component and the second detection component are provided with contact rods corresponding to the pins of the semiconductor device one by one for connecting the pins of the semiconductor device. This solution can effectively reduce unnecessary processing procedures, save processing time, and thus improve production efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor detection and processing, and particularly relates to a semiconductor device detection and processing system and a processing method. Background Art

[0002] Semiconductor devices mainly include a package body and pins extending to the outside of the package body. The pins of most semiconductor devices are symmetrically arranged on opposite sides of the package body to improve the convenience during production and use. However, as Figure 1 shown, the pins of some semiconductor devices are not symmetrically arranged on both sides of the package body, and such semiconductor structures have a certain impact on the detection process during production.

[0003] For such semiconductor devices, existing equipment needs to detect the posture of the semiconductor device before detection and perform posture adjustment on devices with inconsistent postures, so that the semiconductor devices entering the detection device are in the same posture. It can also be understood that the pins of the semiconductor devices with the same structure are oriented in the same direction. Usually, for semiconductor devices in two postures, the pin orientations are exactly opposite. The existing method requires a certain amount of time during the semiconductor posture detection and adjustment process, which affects the improvement of production efficiency. After detection, unqualified semiconductor devices need to be discharged through a separate waste channel, and among the discharged waste products, there are some, or even about half, of the semiconductor devices that have been posture-adjusted before the detection process. This means that there is a meaningless time consumption in the previous posture detection and adjustment process. Summary of the Invention

[0004] To solve the deficiencies of the prior art, the present invention provides a semiconductor device detection and processing system and a processing method, which can effectively reduce unnecessary processing procedures, save processing time, and thus improve production efficiency.

[0005] To achieve the purpose of the present invention, the following scheme is proposed:

[0006] A semiconductor device detection and processing system includes: an input slot, a switching slot, and an output slot that are sequentially arranged along the same conveying track for conveying semiconductor devices;

[0007] The switching slot is movably arranged perpendicular to the conveying direction;

[0008] The input slot is provided with a first detection component for detecting semiconductor devices;

[0009] The switching slot is provided with a second detection component for detecting semiconductor devices that are unqualified in the detection by the first detection component;

[0010] Both the first detection component and the second detection component are provided with contact rods corresponding to the pins of the semiconductor device one by one for connecting the pins of the semiconductor device;

[0011] A turntable is rotatably provided in the middle of the switching slot, which is used to rotate the semiconductor devices qualified by the second detection component by 180 degrees. The axis of rotation is perpendicular to the top surface of the switching slot. A material-passing slot is opened on the top surface of the turntable, and its cross-section is the same as that of the switching slot.

[0012] A processing method for a semiconductor device detection and processing system includes the following steps:

[0013] S1: The semiconductor devices are fed into the input slot and are first detected by the first detection component in the input slot;

[0014] S2: When the detection result in step S1 is qualified, the semiconductor devices pass through the switching slot, the material-passing slot and are transferred to the cutting component provided on the output slot, and a part of the pins on one side of the semiconductor devices are cut off by the cutting component;

[0015] When the detection result in step S1 is unqualified, the semiconductor devices enter the material-passing slot;

[0016] S3: The second detection component is used to perform a second detection on the semiconductor devices in the material-passing slot;

[0017] S4: When the detection result in step S3 is qualified, the turntable rotates by 180 degrees, and the rotated semiconductor devices are fed into the output slot, and a part of the pins on one side of the semiconductor devices are cut off by the cutting component;

[0018] When the detection result in step S3 is unqualified, the switching slot drives the material-passing slot and the unqualified semiconductor devices to move to one side of the output slot, and the unqualified semiconductor devices are discharged outside the output slot.

[0019] The beneficial effects of the present invention are as follows: By setting two detection components in this solution, not only the semiconductor devices in different postures are detected, but also the postures of each semiconductor are distinguished at the same time. The solution does not require a separate posture detection device to detect the posture of the semiconductor devices, saving the posture detection link. After two detections, only the semiconductor devices with inconsistent postures and qualified ones are adjusted in posture to save the number of posture adjustment processes. The above solution overall achieves the purpose of saving the semiconductor detection and processing time from multiple aspects, which helps to improve the production efficiency of semiconductor devices. Description of the Drawings

[0020] The drawings described herein are only for illustrating the selected embodiments, not all possible implementation schemes, and are not intended to limit the scope of the present invention.

[0021] Figure 1 The structural schematic diagram of the semiconductor device after cutting off a part of the pins on one side is shown.

[0022] Figure 2 Shows the overall structural schematic diagram of the preferred solution of the present application.

[0023] Figure 3 Shows Figure 2 The partial enlarged view at position A in

[0024] Figure 4 Shows Figure 2 The partial enlarged view at position B in

[0025] Figure 5 Shows the other side view of the preferred solution of the present application.

[0026] Figure 6 Shows the partial enlarged view of the installation part of the flat plate on the input slot.

[0027] Figure 7 Shows the bottom schematic diagram of the preferred structure of the present application.

[0028] Figure 8 Shows the structural schematic diagram of the sliding plate and the turntable.

[0029] Figure 9 Shows the structural schematic diagram of the bottom of the turntable and the rotating shaft.

[0030] Figure 10 Shows the internal structural schematic diagram of the preferred solution of the sliding plate and the turntable.

[0031] Figure 11 Shows the partial cross-sectional view of the preferred structure of the sliding plate and the turntable.

[0032] Markings in the figure: sliding plate - 1, counterbore - 101, positioning hole - 102, annular groove - 103, through hole - 104, input slot - 11, switching slot - 12, output slot - 13, flat plate - 14, connecting piece - 15, rubber ring - 16, compression spring - 17, position detection sensor - 18, stop bar - 19, turntable - 2, material passing slot - 21, rib - 22, pressing strip - 23, positioning pin - 24, support spring - 25, rotating rod - 26, mounting hole - 261, rotating shaft - 27, clamping groove - 271, ejector rod - 28, conical surface - 281, push rod - 29, first detection component - 31, second detection component - 32, contact rod - 33, mounting plate - 34, gantry - 35, telescopic cylinder - 36, baffle - 37, strip hole - 371, return spring - 38, cutting component - 4, tool holder - 41, tool plate - 42. Specific embodiments

[0033] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will describe the embodiments of the present invention in detail with reference to the accompanying drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0034] Embodiment 1, as Figures 2 to 5 shown, a semiconductor device detection and processing system includes: an input slot 11, a switching slot 12, and an output slot 13 that are sequentially arranged along the same conveying track for conveying semiconductor devices. The cross-sections of the input slot 11, the switching slot 12, and the output slot 13 are all rectangular slot structures. When conveying semiconductor devices, the semiconductor devices are moved and arranged on the top surfaces of the input slot 11, the switching slot 12, and the output slot 13. It can also be understood that the top surfaces of the input slot 11, the switching slot 12, and the output slot 13 are the conveying surfaces. The pins on both sides of the semiconductor device face the two sides of the rectangular slot structure respectively, and the length direction of the semiconductor device is consistent with the extending direction of the rectangular slot structure.

[0035] The switching slot 12 is movably arranged along the direction perpendicular to the conveyance of the semiconductor device, and the movement track is parallel to the conveyance surface of the switching slot 12.

[0036] A turntable 2 is rotatably arranged in the middle of the switching slot 12, and the rotation axis is perpendicular to the top surface of the switching slot 12. A material passing slot 21 is opened on the top surface of the turntable 2, and its cross-section is the same as that of the switching slot 12. When the semiconductor device moves into the material passing slot 21 at the top of the turntable 2, the orientation of the pins of the semiconductor device can be adjusted by rotating the turntable 2 by 180 degrees, so as to achieve the purpose of posture adjustment, so that the pins of the same structure face the same direction when the semiconductor is fed into the output slot 13.

[0037] As a preferred solution, the turntable 2 is controlled to rotate by a motor or a rotary cylinder.

[0038] The input slot 11 is provided with a first detection component 31 for detecting semiconductor devices in posture one.

[0039] The switching slot 12 is provided with a second detection component 32 for detecting semiconductor devices in posture two. The so-called posture one and posture two described here do not limit the specific postures of the semiconductor devices, but are for the convenience of indicating that the first detection component 31 and the second detection component 32 are respectively used to detect semiconductor devices with different pin orientations; as Figure 1 shown in the semiconductor device, defining the side where the pins are cut off facing the right side of the input slot 11, the switching slot 12, and the output slot 13 as posture one; then when the side where the pins of the semiconductor device are cut off faces the left side of the input slot 11, the switching slot 12, and the output slot 13, it is posture two.

[0040] Both the first detection component 31 and the second detection component 32 are provided with contact rods 33 corresponding one-to-one to the pins of the semiconductor device for connecting the pins of the semiconductor device. By contacting each pin through the corresponding contact rods 33 one by one, the electrical performance of the semiconductor device can be tested.

[0041] During operation, the semiconductor device is fed into the input slot 11 and transferred to the switching slot 12. When the semiconductor device moves to the position of the first detection component 31, the first detection component 31 detects the semiconductor device; when the result detected by the first detection component 31 is qualified, it indicates that the quality of the inspected semiconductor device is qualified, and it is conveyed in the state of attitude one. The inspected qualified semiconductor device is discharged through the switching slot 12, the material passing slot 21 and the output slot 13; when the result detected by the first detection component 31 is unqualified, it indicates that the inspected semiconductor device itself is unqualified or the inspected semiconductor device is conveyed in the state of attitude two. The inspected semiconductor device moves towards the material passing slot 21. When the inspected semiconductor device moves to the position of the second detection component 32, the second detection component 32 is used to perform a second detection on the inspected semiconductor device. If the detection result is still unqualified, it indicates that the inspected semiconductor product itself is unqualified, then the switching slot 12 is moved in a direction perpendicular to the conveyance, so that the switching slot 12 is staggered from the output slot 13, and the semiconductor devices that are unqualified in both detections are discharged outside the output slot 13. Specifically, a waste collection box or a waste slot parallel to the output slot 13 can be provided on both sides or one side of the output slot 13 for collecting semiconductor devices that are unqualified in both inspections. If the detection result of the second detection component 32 is qualified, the turntable 2 is used to drive the qualified semiconductor device to rotate 180 degrees to adjust the orientation of the semiconductor device, and the semiconductor device in the state of attitude one is adjusted to the state of attitude one, so that the orientation of the pins of the semiconductor device qualified by the second detection component 32 is the same as the orientation of the pins of the semiconductor device qualified by the first detection component 31, which is convenient for subsequent processing or packaging. After the semiconductor device is adjusted in posture, it is output through the output slot 13.

[0042] The above solution not only detects semiconductor devices in different postures by setting two detection components, but also distinguishes the postures of each semiconductor at the same time. And this solution does not require a separate posture detection device to detect the posture of the semiconductor device, saving the posture detection link. After two detections, only the semiconductor devices with inconsistent postures and qualified ones are adjusted in posture, and the products with unqualified postures and unqualified products themselves will not be blindly adjusted in posture, so as to save the number of posture adjustment processes; the above solution overall achieves the purpose of saving the semiconductor detection and processing time from multiple aspects, which helps to improve the production efficiency of semiconductor devices.

[0043] Preferably, as Figure 2 , Figure 5As shown, the first detection component 31 and the second detection component 32 are both arranged above the conveying track. That is, the first detection component 31 is arranged above the input slot 11, and the second detection component 32 is arranged above the switching slot 12. Both the first detection component 31 and the second detection component 32 include a mounting plate 34. The touch rod 33 vertically passes through the corresponding mounting plate 34. The mounting plate 34 is parallel to the top surfaces of the input slot 11 and the switching slot 12, and the mounting plate 34 is movably arranged along its vertical direction to adjust the distance between the bottom of the touch rod 33 and the top surfaces of the input slot 11 and the switching slot 12. When the mounting plate 34 moves downward, the bottom of the touch rod 33 can be brought into contact with the pins of the semiconductor device to meet the requirements of semiconductor detection. When the mounting plate 34 moves upward, the distance between the touch rod 33 and the top surfaces of the input slot 11 and the switching slot 12 can be increased, so as to facilitate the smooth passage of the semiconductor device. In specific implementation, a telescopic cylinder or a linear motor can be used to control the movement of the mounting plate 34.

[0044] As a further preferred structure, as Figure 2 , Figure 3 and Figure 5 shown, gantry frames 35 are arranged on both sides of the mounting plate 34. At least one guide rod passes through the cross beam of the gantry frame 35 at each end of the top of the mounting plate 34 for guiding the mounting plate 34. A connecting plate is arranged in the middle of the gantry frames 35 on both sides. Each end of the connecting plate is provided with a telescopic cylinder 36. The telescopic rods of the two telescopic cylinders 36 are respectively vertically directed towards the input slot 11 and the switching slot 12. A mounting plate 34 is provided at the lower end of each telescopic rod. In this way, the movement of the mounting plate 34 can be controlled by the telescopic cylinder 36.

[0045] Preferably, as Figure 2 , Figure 3 and Figure 5As shown in the figure, one end of the mounting plate 34 above the switching slot 12 facing the output slot 13 is provided with a baffle 37. The baffle 37 is perpendicular to the mounting plate 34 and is movably arranged in a direction perpendicular to the mounting plate 34. Specifically, the baffle 37 is provided with a strip-shaped hole 371 along the direction perpendicular to the bottom of the mounting plate 34. At least two screws are passed through the strip-shaped hole 371, and the screws are connected to the end face of the mounting plate 34. When the baffle 37 is in a suspended state, the lower end of the baffle 37 is lower than the lower end of the contact rod 33. When the semiconductor device abuts against the baffle 37, the semiconductor device is located in the middle of the material passing slot 21 and below the second detection component 32. The purpose of the above setting is to use the baffle 37 to limit the semiconductors detected as unqualified by the first detection component 31 in the material passing slot 21, so as to facilitate the second detection component 32 to perform a second detection on the semiconductor devices that are unqualified in the first detection. When the semiconductor device abuts against the baffle 37, move the mounting plate 34 downward to drive the lower end of the contact rod 33 to contact the pin. Because in the suspended state, the lower end of the baffle 37 is lower than the lower end of the contact rod 33, so during the downward movement of the mounting plate 34, the lower end of the baffle 37 will first contact the top surface of the material passing slot 21. After the baffle 37 abuts against the top surface of the material passing slot 21, the mounting plate 34 needs to continue to descend until the lower end of the contact rod 33 abuts against the pin. During the continuous downward movement of the mounting plate 34, the baffle 37 will move upward relative to the mounting plate 34 along the strip-shaped hole 371 to adapt to the change in the position of the mounting plate 34. When the turntable 2 rotates, moving the mounting plate 34 upward can make the lower ends of the baffle 37 and the contact rod 33 higher than the top surface of the turntable 2, so as to prevent affecting the normal rotation of the turntable 2. The purpose of setting at least two screws in this solution is to prevent the baffle 37 from swinging.

[0046] As a further preferred structure, as Figure 3 shown, a return spring 38 is provided at the lower end of the strip-shaped hole 371. It is located between the lower end of the strip-shaped hole 371 and the upper screw and is in a compressed state. Setting the return spring 38 can make the baffle 37 automatically descend relative to the mounting plate 34 after the contact rod 33 is separated from the pin, so that the lower end of the baffle 37 returns to a state lower than the lower end of the contact rod 33 again. When the return spring 38 is not provided, the baffle 37 will also move downward by itself under the action of gravity, but setting the return spring 38 can prevent the baffle 37 from failing to descend smoothly due to friction or jamming between parts.

[0047] Preferably, as Figure 5 、 Figure 6As shown in the figure, on both sides of the input slot 11, a flat plate 14 is vertically penetrated respectively. The distance between the two flat plates 14 in the conveying direction of the input slot 11 is greater than or equal to the length of the semiconductor device. The distance between the two flat plates 14 in the width direction of the input slot 11 is greater than or equal to the maximum width of the input slot 11. It can also be understood that the distance between the two flat plates 14 in the width direction of the input slot 11 is greater than the maximum distance between the two side pins of the semiconductor device. The outer ends of the two flat plates 14 are connected to the same connecting member 15. The connecting member 15 is in the shape of a plate or a frame structure. The connecting member 15 is movably arranged along the length direction of the flat plate 14. When the semiconductor device is between the two flat plates 14, the semiconductor device is exactly located below the first detection component 31. This structure can not only accurately limit the semiconductor device below the first detection component 31, but also control the output of the semiconductor device.

[0048] Preferably, the conveying track is in an inclined state. One end of the input slot 11 is higher than one end of the output slot 13. Then the semiconductor device can be automatically conveyed along the input slot 11, the switching slot 12 and the output slot 13 under the action of gravity. When the semiconductor device moves into the feeding slot 21, the baffle 37 can be used for blocking and limiting. When the semiconductor device is conveyed inside the input slot 11, by reciprocally moving the connecting member 15, the single-piece conveying of the semiconductor device can be controlled. As Figure 6 shown in the figure, when the upper flat plate 14 is inserted between two adjacent semiconductor devices, the lower flat plate 14 is outside the input slot 11. At this time, the semiconductor device between the two flat plates 14 can automatically convey towards the switching slot 12 along the arrow direction under the action of gravity. Then move the connecting member 15 upward, and the lower flat plate 14 can be inserted into the input slot 11 until the upper flat plate 14 moves outside the input slot 11. At this time, the upper semiconductor device will be automatically conveyed between the two flat plates 14 for the first detection component 31 to detect. After the detection is completed, move the connecting member 15 downward again. When the upper flat plate 14 is inserted between two adjacent semiconductor devices again, the lower flat plate 14 will also be outside the input slot 11, and the detected semiconductor device will automatically convey towards the switching slot 12. Specifically, the movement of the connecting member 15 can be driven and controlled by a cylinder or a linear motor.

[0049] Preferably, as Figure 5 、 Figure 8 、 Figure 10 and Figure 11 shown in the figure, the switching slot 12 is opened on the top surface of a sliding plate 1. A counterbore 101 is opened on the top surface of the sliding plate 1 corresponding to the middle section of the switching slot 12. The turntable 2 is rotatably arranged in the counterbore 101, and at least one positioning hole 102 is provided at the bottom of the counterbore 101.

[0050] On both sides of the material passage groove 21, there are convex strips 22 protruding inward. There is a gap between the convex strips 22 and the top surface of the material passage groove 21. When the semiconductor device is located inside the material passage groove 21, the pins on both sides of the semiconductor device are respectively located in the gaps on both sides. Below the corresponding convex strips 22 on the top surface of the material passage groove 21, there is an embedded pressure strip 23 parallel to the convex strips 22. Vertically provided at the bottom of the pressure strip 23 is a positioning pin 24. The bottom of the positioning pin 24 protrudes from the bottom surface of the turntable 2, and between the lower end of the positioning pin 24 and the bottom surface of the turntable 2, there is a support spring 25, which forms a downward pressure on the pressure strip 23.

[0051] As Figure 11 shown, when the lower end of the positioning pin 24 is embedded in the positioning hole 102, the material passage groove 21 is aligned with the switching groove 12. Under the action of the support spring 25, the top surface of the pressure strip 23 is lower than or flush with the top surface of the material passage groove 21. At this time, the semiconductor device can smoothly enter the switching groove 12 and the material passage groove 21 from the input groove 11.

[0052] As Figure 10 shown, when the bottom surface of the positioning pin 24 contacts the bottom surface of the counterbore 101, the top surface of the pressure strip 23 and the bottom surface of the convex strip 22 are used to clamp the pins. And if you want the positioning pin 24 to move out of the positioning hole 102 and move to the bottom surface of the counterbore 101, it can only be achieved by rotating the turntable 2. That is to say, when the turntable 2 is rotated, the lower end of the positioning pin 24 will move out of the positioning hole 102 and move to the bottom surface of the counterbore 101, thereby pushing the pressure strip 23 upward by the positioning pin 24, so as to use the pressure strip 23 to clamp the pins of the semiconductor device to the bottom surface of the convex strip 22, to prevent the semiconductor device from being thrown out from the end of the material passage groove 21 during the process of the turntable 2 rotating to adjust the posture of the semiconductor device.

[0053] The above solution not only meets the positioning requirements of the turntable 2, but also solves the problem that the semiconductor device is thrown out under the influence of centrifugal force during the rotation of the turntable 2. The element driving the rotation of the turntable 2 can be a motor or a rotary cylinder, and the motor or the rotary cylinder can be installed at the bottom of the sliding plate 1, and the drive shaft passes through the sliding plate 1 and is coaxially connected to the turntable 2; specifically, the sliding plate 1 can be driven by a cylinder or a linear motor to move, so as to achieve the purpose of moving the switching groove 12.

[0054] As a further preferred structure, as Figure 10 、 Figure 11 shown, the positioning hole 102 can be opened in the annular groove 103 coaxially opened at the bottom of the counterbore 101, and the lower end of the positioning pin 24 and the support spring 25 can both be arranged inside the annular groove 103.

[0055] As a further preference, the support spring 25 is a cylindrical spring structure, and it is sleeved on the lower end of the positioning pin 24.

[0056] As a further preferred solution, a ball is embedded at the bottom of the positioning pin 24 to reduce the friction between the positioning pin 24 and the bottom surface of the counterbore 101.

[0057] Preferably, a rubber layer is provided on the top surface of the pressure strip 23, which can not only prevent the pins from being extruded and deformed, but also improve the stability when pressing the pins.

[0058] Preferably, as Figures 7 to 11 shown, two moving directions of the switching groove 12 are provided on the sliding plate 1, and turntables 2 are provided in both of the two switching grooves 12;

[0059] A rotating rod 26 is coaxially provided at the bottom of the turntable 2. The lower end of the rotating rod 26 passes downward through the bottom of the sliding plate 1. The lower end of the rotating rod 26 has a square structure. A rotating shaft 27 is provided below the middle of the input groove 11 and the output groove 13. The rotating shaft 27 is perpendicular to the top surface of the material passing groove 21, and the rotating shaft 27 is rotatably arranged around its axis. Specifically, a rotating cylinder or a motor can be used to drive the rotating shaft 27 to rotate. A clamping groove 271 is provided at the top of the rotating shaft 27.

[0060] When the material passing groove 21 is aligned with the switching groove 12 and the input groove 11 at the same time, the square structure at the lower end of the rotating rod 26 is inserted into the clamping groove 271, and the extending directions on both sides of the clamping groove 271 are the same as the moving direction of the switching groove 12. In this way, the turntable 2 can be driven to rotate by the rotating shaft 27; and after the turntable 2 rotates 180 degrees and completes the posture adjustment process of the semiconductor device, the extending directions on both sides of the clamping groove 271 can still maintain the same orientation as the moving direction of the switching groove 12; thus, when the second detection component 32 detects an unqualified semiconductor device, moving the sliding plate 1 along the direction perpendicular to the conveying of the semiconductor device can move the lower end of the rotating rod 26 connected to the clamping groove 271 out of one side of the clamping groove 271, and insert the corresponding square structure of the rotating rod 26 at the bottom of the other turntable 2 into the other side of the clamping groove 271, so that the material passing groove 21 of the other turntable 2 is aligned with the input groove 11, so as to achieve the purpose of seamlessly connecting the semiconductor devices, thereby improving the detection and processing efficiency; and during the process of discharging the unqualified semiconductor devices, the corresponding turntable 2 is not subjected to a rotating torque, so the orientation of its corresponding material passing groove 21 will remain unchanged, which is convenient for the rotating rod 26 to be connected to the clamping groove 271 again.

[0061] Further preferably, as Figure 10 、 Figure 11As shown, a mounting hole 261 is coaxially opened at the bottom of the rotating rod 26, a push rod 28 is coaxially penetrated inside the mounting hole 261, a conical surface 281 with the cone top facing downward is coaxially provided on the top, a plurality of push rods 29 are penetrated along the normal direction on the side wall of the same cross section of the rotating rod 26, a rubber ring 16 is sleeved on the outer side of the push rod 29 corresponding to the outer side of the push rod 29, the rubber ring 16 is located in the through hole 104 on the sliding plate 1 through which the rotating rod 26 is penetrated, and a compression spring 17 is provided between the top of the push rod 28 and the top surface of the mounting hole 261.

[0062] When the rotating rod 26 is separated from the slot 271, the compression spring 17 is in a compressed state, the lower end of the push rod 28 protrudes from the lower end of the rotating rod 26, and the lower end of the push rod 28 is lower than the bottom surface of the slot 271, the inner end of the push rod 29 abuts against the conical surface 281, the outer end of the push rod 29 is pressed against the inner wall of the rubber ring 16, and the outer wall of the rubber ring 16 is pressed against the inner wall of the through hole 104, so as to utilize the friction between the rubber ring 16, the push rod 29 and the through hole 104 to ensure the relative stability between the rotating disk 2 and the sliding plate 1, so as to prevent the rotating disk 2 from rotating arbitrarily after the rotating rod 26 is separated from the slot 271, thereby affecting the cooperation between the rotating rod 26 and the slot 271 again.

[0063] When the lower end of the rotating rod 26 is connected to the slot 271, the lower end of the push rod 28 is supported on the bottom surface of the slot 271, the conical surface 281 is separated from the inner end of the push rod 29, and the rubber ring 16 automatically shrinks to the surface of the rotating rod 26 under the action of elastic force, so that the outer wall of the rubber ring 16 is separated from the inner wall of the through hole 104, so that the rotating shaft 27 can drive the turntable 2 to rotate.

[0064] In order to make the lower end of the push rod 28 move smoothly to the bottom surface of the slot 271, chamfered surfaces can be set on both side edges of the bottom surface of the slot 271, or the lower end of the push rod 28 can be set as a hemispherical structure, or a ball can be embedded at the bottom of the push rod 28.

[0065] As a preferred solution, for some semiconductor devices with an asymmetric pin design, in order to share equipment such as lead frames, transfer tools, plastic encapsulation molds, and rib punching with semiconductor devices having a symmetric pin structure, the lead frame is first fabricated according to the symmetric pin structure and die bonding and encapsulation are completed during the early stage of manufacturing the semiconductor device with asymmetric pins. Then, some pins on one side of the semiconductor device are cut off, and finally, a semiconductor device with an asymmetric pin structure is formed. In the traditional process, usually, the redundant pins are first cut off, and then the attitude detection, attitude adjustment, and electrical performance detection of the semiconductor device are carried out, and the process is rather complicated. Moreover, there are also products with unqualified electrical performance after pin cutting, which also leads to waste of the previous pin cutting and attitude adjustment work. To further improve production efficiency and reduce unnecessary pin cutting work, through the above solution, the electrical performance detection of the semiconductor device can be completed before pin cutting. After that, only the products with qualified electrical performance are subjected to attitude adjustment and pin cutting treatment. In this way, the time wasted on pin cutting and attitude adjustment for unqualified products can be reduced, and the production efficiency of semiconductor devices can be further improved. To achieve the above effects, as Figure 2 , Figure 4 and Figure 5 shown, this embodiment further includes the following technical solution. A cutting assembly 4 is provided on one side of the output slot 13 for cutting off some pins on one side of the semiconductor device. The cutting assembly 4 includes a tool holder 41 arranged in parallel on one side of the output slot 13 and a tool plate 42 arranged in parallel above the tool holder 41. The tool plate 42 is movably arranged in a direction perpendicular to the top surface of the output slot 13. During operation, the semiconductor device detected as qualified by the first detection assembly 31 and the semiconductor device detected as qualified by the second detection assembly 32 and with its attitude adjusted enter the output slot 13 and move to the cutting assembly 4. The pins to be cut are located between the tool holder 41 and the tool plate 42. The tool plate 42 is lowered, and the pins are cut off by using the shearing structure formed by the tool plate 42 and the tool holder 41.

[0066] Further preferably, as Figure 4 , Figure 5 shown, a position detection sensor 18 and a stop lever 19 controlled by a cylinder are provided at the bottom of the output slot 13. When the semiconductor device abuts against the stop lever 19, the position detection sensor 18 simultaneously monitors the in-place signal of the semiconductor device. At this time, the pins to be cut are exactly located between the tool holder 41 and the tool plate 42. Then, the tool plate 42 is controlled to move downward by using a hydraulic cylinder or a cylinder, so that the pins are cut off by using the tool plate 42 and the tool holder 41. After the pin cutting is completed, the tool plate 42 rises, and the stop lever 19 moves downward under the control of the cylinder to release the blocking effect on the semiconductor device, so that the semiconductor device after pin cutting continues to be conveyed.

[0067] Embodiment 2, the processing method of the semiconductor device detection and processing system, includes the following steps:

[0068] S1: The semiconductor device is fed into the input slot 11 and undergoes the first detection using the first detection component 31 within the input slot 11.

[0069] S2: When the detection result in step S1 is qualified, the semiconductor device passes through the switching slot 12, the material passing slot 21 and is transferred to the cutting component 4 provided on the output slot 13. The cutting component 4 cuts off a part of the pins on one side of the semiconductor device. The semiconductor device that has passed the detection by the first detection component 31 not only indicates that the electrical continuity of each pin to be retained is qualified, but also proves that the orientation of the pins of the semiconductor device meets the preset direction, that is, during the subsequent conveying process, there is no need to adjust its posture, and the side with the pins to be cut off is already corresponding to the cutting component 4.

[0070] When the detection result in step S1 is unqualified, the semiconductor device enters the material passing slot 21. There are two situations for the unqualified semiconductor devices here. The first is that the orientation of the pins of the semiconductor device is qualified, that is, the posture is qualified, but the product itself is unqualified. The second is that the product itself is qualified, but because the orientation of the pins is reversed, the first detection component 31 cannot complete the detection on it. Therefore, the second detection component 32 is needed for further detection.

[0071] S3: The second detection component 32 is used to perform the second detection on the semiconductor device in the material passing slot 21.

[0072] S4: When the detection result in step S3 is qualified, the turntable 2 rotates 180 degrees. Since the detection is qualified here, it means that the semiconductor device product itself is qualified, but the orientation of the pins does indeed have a reversal. Therefore, it is necessary to rotate 180 degrees for posture adjustment. After completing the posture adjustment of the semiconductor, the rotated semiconductor device is fed into the output slot 13, and a part of the pins on one side of the semiconductor device is cut off using the cutting component 4.

[0073] When the detection result in step S3 is unqualified, the switching slot 12 drives the material passing slot 21 and the unqualified semiconductor device to move towards one side of the output slot 13, and the unqualified semiconductor device is discharged outside the output slot 13. When the detection result of the second detection component 32 is still unqualified, it means that the product itself is unqualified. Therefore, there is no need to perform posture adjustment and pin cutting work on it to reduce unnecessary processing work and improve production efficiency.

[0074] The above is only the preferred embodiment of the present invention and does not represent the only one or limit the present invention. Those skilled in the art should understand that without departing from the scope of the present invention, various changes or equivalent substitutions made to the present invention all fall within the scope of protection of the present invention.

Claims

1. A semiconductor device detection and processing system, characterized in that, Including: An input slot (11), a switching slot (12) and an output slot (13) for conveying semiconductor devices are sequentially arranged along the same conveying track; The switching slot (12) is movably arranged along a direction perpendicular to the conveying direction of the semiconductor device, and the moving track is parallel to the conveying surface of the switching slot (12); The input slot (11) is provided with a first detection component (31) for detecting semiconductor devices; The switching slot (12) is provided with a second detection component (32) for detecting semiconductor devices that fail to pass the detection by the first detection component (31); Both the first detection component (31) and the second detection component (32) are provided with contact rods (33) corresponding one-to-one to the pins of the semiconductor device for connecting the pins of the semiconductor device; A turntable (2) is rotatably arranged in the middle of the switching slot (12) for rotating the semiconductor devices that pass the detection by the second detection component (32) by 180 degrees. The axis of rotation is perpendicular to the top surface of the switching slot (12). A material passing slot (21) is formed on the top surface of the turntable (2), and its cross-section is the same as that of the switching slot (12).

2. The semiconductor device detection and processing system according to claim 1, wherein Both the first detection component (31) and the second detection component (32) are arranged above the conveying track. Both the first detection component (31) and the second detection component (32) include mounting plates (34). The contact rods (33) vertically pass through the corresponding mounting plates (34). The mounting plates (34) are parallel to the top surfaces of the input slot (11) and the switching slot (12), and the mounting plates (34) are movably arranged along their own vertical directions.

3. A semiconductor device detection and processing system according to claim 2, characterized in that One end of the mounting plate (34) above the switching slot (12) facing the output slot (13) is provided with a baffle (37). The baffle (37) is perpendicular to the mounting plate (34) and is movably arranged along a direction perpendicular to the mounting plate (34). A strip-shaped hole (371) is formed in the baffle (37) along a direction perpendicular to the bottom of the mounting plate (34). At least two screws are passed through the strip-shaped hole (371), and the screws are connected to the end face of the mounting plate (34). When the baffle (37) is in a suspended state, the lower end of the baffle (37) is lower than the lower end of the contact rod (33). When the semiconductor device abuts against the baffle (37), the semiconductor device is located in the middle of the material passing slot (21) and below the second detection component (32).

4. A semiconductor device detection and processing system according to claim 1, characterized in that, One flat plate (14) is vertically penetrated through each of the two sides of the input slot (11). The distance between the two flat plates (14) in the conveying direction of the input slot (11) is greater than or equal to the length of the semiconductor device. The distance between the two flat plates (14) in the width direction of the input slot (11) is greater than or equal to the maximum width of the input slot (11). The outer ends of the two flat plates (14) are connected to the same connecting piece (15). The connecting piece (15) is movably arranged along the length direction of the flat plate (14). When the semiconductor device is between the two flat plates (14), the semiconductor device is exactly located below the first detection component (31).

5. A semiconductor device detection and processing system according to claim 3 or 4, characterized in that The conveying track is in an inclined state, and one end of the input slot (11) is higher than one end of the output slot (13).

6. The semiconductor device detection and processing system according to claim 1, wherein, The switching groove (12) is formed on the top surface of a sliding plate (1), a countersunk hole (101) is formed on the top surface of the sliding plate (1) corresponding to the middle section of the switching groove (12), the rotating disk (2) is rotatably disposed in the countersunk hole (101), and at least one positioning hole (102) is formed at the bottom of the countersunk hole (101); The two sides of the material passage groove (21) are provided with convex strips (22) protruding inwards, and there is a gap between the convex strips (22) and the top surface of the material passage groove (21). When the semiconductor device is located inside the material passage groove (21), the pins on both sides of the semiconductor device are respectively located in the gaps on both sides. A pressure strip (23) parallel to the convex strip (22) is embedded below the top surface of the material passage groove (21) corresponding to the convex strip (22). A positioning pin (24) is vertically provided at the bottom of the pressure strip (23). The bottom of the positioning pin (24) protrudes from the bottom surface of the turntable (2), and a support spring (25) is provided between the lower end of the positioning pin (24) and the bottom surface of the turntable (2). When the lower end of the positioning pin (24) is embedded in the positioning hole (102), the material passage groove (21) is aligned with the switching groove (12), and the top surface of the pressure strip (23) is lower than the top surface of the material passage groove (21) or is flush with the top surface of the material passage groove (21); When the bottom surface of the positioning pin (24) contacts the bottom surface of the countersunk hole (101), the top surface of the pressing strip (23) and the bottom surface of the convex strip (22) are used to press the pin.

7. A semiconductor device detection and processing system according to claim 6, wherein, Two switching grooves (12) are provided on the sliding plate (1) for moving in two directions, and a rotating disk (2) is provided in each of the two switching grooves (12); A rotating rod (26) is coaxially arranged at the bottom of the rotating disk (2), the lower end of the rotating rod (26) passes downward through the bottom of the sliding plate (1), the lower end of the rotating rod (26) is a square structure, a rotating shaft (27) is arranged below the middle of the input groove (11) and the output groove (13), the rotating shaft (27) is perpendicular to the top surface of the material passing groove (21), and the rotating shaft (27) is arranged to rotate around the axis, and a clamping groove (271) is opened at the top of the rotating shaft (27); When the material passage slot (21) is aligned with the switching slot (12) and the input slot (11) at the same time, the square structure at the lower end of the rotating rod (26) is inserted into the clamping slot (271), and the extension direction of both sides of the clamping slot (271) is consistent with the moving direction of the switching slot (12).

8. A semiconductor device detection and processing system according to claim 7, wherein, A mounting hole (261) is coaxially formed at the bottom of the rotating rod (26), a push rod (28) is coaxially penetrated inside the mounting hole (261), a conical surface (281) with the cone top facing downward is coaxially formed at the top of the push rod (28), a plurality of push rods (29) are penetrated along the normal direction on the side wall of the same cross section of the rotating rod (26), a rubber ring (16) is sleeved on the outer side of the push rod (29) corresponding to the outer side of the push rod (29), the rubber ring (16) is located in a through hole (104) penetrated by the rotating rod (26) on the sliding plate (1), and a compression spring (17) is provided between the top of the push rod (28) and the top surface of the mounting hole (261); When the rotating rod (26) is separated from the card slot (271), the compression spring (17) is in a compressed state. The lower end of the ejector rod (28) protrudes from the lower end of the rotating rod (26), and the lower end of the ejector rod (28) is lower than the bottom surface of the card slot (271). The inner end of the push rod (29) abuts against the conical surface (281), the outer end of the push rod (29) presses against the inner wall of the rubber ring (16), and the outer wall of the rubber ring (16) presses against the inner wall of the through hole (104). When the lower end of the rotating rod (26) is connected to the card slot (271), the lower end of the ejector rod (28) is supported on the bottom surface of the card slot (271), the conical surface (281) is separated from the inner end of the push rod (29), and the outer wall of the rubber ring (16) is separated from the inner wall of the through hole (104).

9. A semiconductor device detection and processing system according to claim 1, characterized in that A cutting component (4) is provided on one side of the output slot (13) for cutting a part of the pins on one side of the semiconductor device. The cutting component (4) includes a tool holder (41) arranged in parallel on one side of the output slot (13), and a tool plate (42) arranged in parallel above the tool holder (41). The tool plate (42) is movably arranged in a direction perpendicular to the top surface of the output slot (13).

10. A processing method of the semiconductor device detection and processing system according to claim 9, characterized in that, It includes the following steps: S1: The semiconductor device is fed from the input slot (11) and undergoes the first detection by the first detection component (31) in the input slot (11). S2: When the detection result of step S1 is qualified, the semiconductor device passes through the switching slot (12), the material passing slot (21) and is transferred to the cutting component (4) arranged on the output slot (13), and a part of the pins on one side of the semiconductor device are cut off by the cutting component (4). When the detection result of step S1 is unqualified, the semiconductor device enters the material passing slot (21). S3: The second detection component (32) is used to perform the second detection on the semiconductor device in the material passing slot (21). S4: When the detection result of step S3 is qualified, the turntable (2) rotates 180 degrees, and the rotated semiconductor device is fed into the output slot (13), and a part of the pins on one side of the semiconductor device are cut off by the cutting component (4). When the detection result of step S3 is unqualified, the switching slot (12) drives the material passing slot (21) and the unqualified semiconductor device to move to one side of the output slot (13), and the unqualified semiconductor device is discharged outside the output slot (13).

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