Wafer film expanding device

Abstract

The invention relates to a wafer film expanding device which comprises a film expanding carrying table outer ring assembly, a film expanding carrying table inner ring assembly, a film expanding reciprocating pressing assembly and a wafer film expanding jacking execution mechanism, and the wafer film expanding jacking execution mechanism drives the film expanding carrying table outer ring assembly in the middle of the upper portion to move in the vertical direction. And a film expanding carrying table inner ring assembly is mounted on the inner ring of the film expanding carrying table outer ring assembly. The wafer film expanding device provided by the invention can realize full-automatic film expanding, realizes reasonable separation of die gaps, and is convenient for subsequent processes.

Description

Technical Field

[0001] The present invention relates to the technical field related to the semiconductor industry, and in particular to a wafer film expanding device. Background Art

[0002] With the development of the semiconductor industry, especially the miniaturization of chip sizes and the development of semiconductor packaging towards high integration and miniaturization, many high - requirement packaging processes begin to use stealth dicing, and then the wafer or chip with an attached film is completely separated along a predetermined line to obtain independent individuals. Because it is necessary to avoid quality problems such as burrs during the dicing process, and at the same time ensure that the dies in the wafer are separated by the required gap. On the other hand, the products on the market mainly use a manual - operated mother - son ring for film expansion to separate the dies (where die refers to a single diced and unpackaged semiconductor chip, usually called a "bare chip"), with low efficiency and unable to meet the requirements of automation. This requires high - precision equipment and strict process control, which is quite challenging.

[0003] In view of the above - mentioned defects, the inventor actively conducts research and innovation in order to create a wafer film expanding device that is more valuable in the industry. Summary of the Invention

[0004] To solve any of the above - mentioned technical problems, the purpose of the present invention is to provide a wafer film expanding device.

[0005] To achieve the above - mentioned purpose, the present invention adopts the following technical solutions:

[0006] The wafer film expanding device includes an outer - ring component of the film - expanding stage, an inner - ring component of the film - expanding stage, a reciprocating film - pressing component for film expansion, and a wafer film - expanding lifting actuator. The wafer film - expanding lifting actuator drives the outer - ring component of the film - expanding stage in the middle above to move in the vertical direction, and an inner - ring component of the film - expanding stage is installed inside the outer - ring component of the film - expanding stage;

[0007] The wafer film - expanding lifting actuator successively includes an execution plate, a lead - screw connecting plate, and a bottom connecting plate from top to bottom. The execution plate is connected to the bottom connecting plate below through a plurality of support columns. The driving end of the motor at the middle of the bottom of the bottom connecting plate is connected to the lead - screw through a coupling by an electric - motor fixing block and a plurality of motor connecting shafts. The lead - screw drives the lead - screw connecting plate to move in the vertical direction through a lead - screw nut. The lead - screw connecting plate is connected to a lifting chassis above the execution plate through a plurality of lifting - chassis guiding shafts, and the lifting chassis is connected to the outer - ring component of the film - expanding stage above;

[0008] The reciprocating film - pressing component for film expansion includes a steel - ring support located above the outer side of the outer - ring component of the film - expanding stage and capable of moving left and right.

[0009] As a further improvement of the present invention, film expanding steel ring positioning components are installed on both the left and right sides of the outer ring assembly of the film expanding stage. A lifting cylinder is installed on the execution flat plate directly below the film expanding steel ring positioning components. The driving end at the top of the lifting cylinder drives the upper film expanding steel ring positioning components to move in the vertical direction through a lifting plate.

[0010] As a further improvement of the present invention, the film expanding steel ring positioning components sequentially include a positioning flat plate and a positioning bottom plate from top to bottom. The front and rear sides of the positioning flat plate and the positioning bottom plate are respectively connected together by a plurality of support blocks. Positioning cylinder one and positioning cylinder two are respectively installed at the bottoms of the positioning flat plate near the front and rear sides. Positioning cylinder one and positioning cylinder two respectively drive the clamping shafts located above the positioning flat plate to move in the direction towards the inner and outer sides. The clamping shafts are used for side clamping and positioning of the inner steel ring.

[0011] As a further improvement of the present invention, a sensor one and a sensor two are respectively installed on the positioning bottom plate below positioning cylinder one and positioning cylinder two. Positioning induction sheets are respectively installed at the bottoms of the clamping shafts above sensor one and sensor two; A plurality of positioning guide shafts are installed on the execution flat plate through bearing three. The tops of the positioning guide shafts are installed at the bottom of the positioning bottom plate. The bottoms of the positioning guide shafts pass through the execution flat plate and are then connected to the lower guide shaft connecting plate; A plurality of limit shafts are installed on the execution flat plate below the positioning bottom plate.

[0012] As a further improvement of the present invention, the outer ring assembly of the film expanding stage includes a film expanding circular base plate and a film expanding pressing plate. The inner ring assembly of the film expanding stage includes a suction cup base, a cover plate, an intermediate connecting plate, a frame, and an adsorption stage; A bearing one is installed on the outer ring of the film expanding circular base plate. A plurality of balls are evenly installed on the outer side of the bearing one along the circumferential direction. A film expanding pressing plate is installed on the inner ring of the film expanding circular base plate; A cover plate is installed on the suction cup base. The cover plate is connected to the frame through an intermediate connecting plate. The frame is located inside the film expanding circular base plate. An adsorption stage is installed inside the frame. The suction cup base protrudes from the bottom of the film expanding circular base plate.

[0013] As a further improvement of the present invention, a plurality of suction cup base guide shafts are installed at the bottom of the suction cup base. The suction cup base guide shafts are installed on the execution flat plate through bearing two. The bottoms of the suction cup base guide shafts pass through the execution flat plate and are then installed on the main support sheet metal. And a side support sheet metal is installed between two adjacent main support sheet metals.

[0014] As a further improvement of the present invention, an inner ring vacuum joint, an outer ring vacuum joint, and a center ring are installed on the suction cup base.

[0015] As a further improvement of the present invention, steel ring support plates and slider support plates are respectively installed on the front and rear sides of the bottom of the steel ring support. A reciprocating cylinder fixing plate is installed on the inner side of the steel ring support plate, and a guide rail plate is installed on the inner side of the slider support plate. The reciprocating cylinder installed on the inner side of the reciprocating cylinder fixing plate drives the steel ring support plate to move in the left-right direction through a sliding plate and a first reciprocating connecting plate in sequence. The slider support plate moves along the left-right direction on the guide rail plate through the guide rail. The reciprocating cylinder fixing plate and the guide rail plate are respectively installed on the front and rear sides of the execution flat plate. The left sides of the reciprocating cylinder fixing plate and the guide rail plate are connected together through a second reciprocating connecting plate. The second reciprocating connecting plate is connected to the outer support plate below through a rear support plate, and a reinforcing plate is installed on the rear support plate; at least one buffer is installed on the right side of the reciprocating cylinder fixing plate through a buffer support.

[0016] As a further improvement of the present invention, the lifting chassis guide shaft is installed on the execution flat plate through bearing four; at least one lifting sensor is installed at the bottom of the lifting chassis through a sensor fixing plate, and a lifting induction piece adapted to the above-mentioned lifting sensor is installed on the execution flat plate on one side of the lifting sensor.

[0017] As a further improvement of the present invention, at least one adjusting screw is installed on one side of the bottom of the bottom connecting plate through an adjusting fixing block.

[0018] By means of the above solution, the present invention has at least the following advantages:

[0019] The present invention provides a wafer film expanding device, which can realize full-automatic film expansion, reasonably separate the die gaps, and facilitate subsequent processes.

[0020] The present invention includes a reciprocating motion mechanism, which compresses the steel ring when needed, and the wafer film expanding lifting mechanism lifts the wafer to realize uniform separation of the film. After the components of the wafer film expanding mechanism descend, the expanding film reciprocating motion mechanism can retract to facilitate blanking.

[0021] The present invention provides an expanding film steel ring positioning and clamping assembly, which can clamp the steel ring, effectively fix the steel ring, and prevent the steel ring from moving during the lifting process.

[0022] The present invention provides an outer ring assembly of the expanding film stage, which can ensure guiding the film during the lifting process of the wafer film expanding lifting mechanism and prevent the film from breaking.

[0023] The present invention provides an inner ring assembly of the expanding film stage. In the inner ring assembly of the expanding film stage, the outer ring adsorption vacuum and the inner ring adsorption vacuum of the device can effectively fix the film and the wafer.

[0024] The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly and be able to implement it according to the content of the specification, the following will describe in detail with reference to the preferred embodiments of the present invention and the accompanying drawings. Brief Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 is a schematic structural diagram of a wafer film expanding device of the present invention;

[0027] Figure 2 is Figure 1 a schematic structural diagram of the outer ring assembly of the film expanding carrier table in ;

[0028] Figure 3 is Figure 1 a schematic structural diagram of the inner ring assembly of the film expanding carrier table in ;

[0029] Figure 4 is Figure 3 a bottom view of ;

[0030] Figure 5 is Figure 1 a schematic structural diagram of the film expanding reciprocating pressing assembly in ;

[0031] Figure 6 is Figure 1 a schematic structural diagram of the film expanding steel ring positioning assembly in ;

[0032] Figure 7 is Figure 1 a schematic structural diagram of the wafer film expanding lifting actuator in.

[0033] Among them, the meanings of the reference numerals in the drawings are as follows.

[0034] Steel ring 1, outer ring assembly 2 of the film expanding carrier table, inner ring assembly 3 of the film expanding carrier table, film expanding reciprocating pressing assembly 4, film expanding steel ring positioning assembly 5, wafer film expanding lifting actuator 6;

[0035] Bearing one 201, ball 202, film expanding round chassis 203, film expanding pressing disc 204;

[0036] Main support sheet metal 301, side support sheet metal 302, bearing two 303, suction cup base 304, inner ring vacuum joint 305, outer ring vacuum joint 306, center ring 307, suction cup base guide shaft 308, cover plate 309, intermediate connecting plate 310, frame 311, adsorption stage 312;

[0037] Buffer 401, buffer bracket 402, steel ring bracket support plate 403, reciprocating connecting plate one 404, reciprocating cylinder 405, steel ring bracket 406, slider support plate 407, guide rail 408, outer side support plate 409, rear side support plate 410, reinforcement plate 411, reciprocating connecting plate two 412, guide rail plate 413, reciprocating cylinder fixing plate 414, sliding plate 415;

[0038] Positioning cylinder one 501, positioning flat plate 502, positioning shaft 503, sensor one 504, positioning cylinder two 505, positioning bottom plate 506, sensor two 507, induction piece 508, support block 509;

[0039] Execution flat plate 601, positioning guide shaft 602, sensor three 603, lifting chassis 604, lifting chassis guide shaft 605, bearing three 606, limit shaft 607, jacking cylinder 608, support column 609, adjustment fixing block 610, adjustment screw 611, motor 612, motor fixing block 613, coupling 614, motor connecting shaft 615, bottom connecting plate 616, lead screw 617, lead screw connecting plate 618, guide shaft connecting plate 619, bearing four 620, sensor fixing plate 621, jacking plate 622. Detailed implementation manners

[0040] The following will further describe in detail the specific implementation manners of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0041] In order to enable those skilled in the art of this technology to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Usually, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but only represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention.

[0042] As Figures 1 to 7 shown,

[0043] The first embodiment of the present invention:

[0044] As Figure 1 , a wafer expanding film device includes an outer ring component 2 of the expanding film stage, an inner ring component 3 of the expanding film stage, a reciprocating pressing component 4 for expanding the film, and a wafer expanding film lifting actuator 6. The wafer expanding film lifting actuator 6 drives the outer ring component 2 of the expanding film stage in the middle above to move in the vertical direction. An inner ring component 3 of the expanding film stage is installed inside the outer ring component 2 of the expanding film stage, and a steel ring positioning component 5 is installed on both sides of the upper part of the wafer expanding film lifting actuator 6. Among them, a steel ring 1 can be placed between the reciprocating pressing component 4 for expanding the film and the outer ring component 2 of the expanding film stage and the inner ring component 3 of the expanding film stage.

[0045] I. The wafer expanding film lifting actuator 6 mainly includes an execution flat plate 601, a lead screw connecting plate 618, and a bottom connecting plate 616.

[0046] As Figure 7 , adjusting fixing blocks 610 are provided on both sides of the bottom connecting plate 616. Adjusting screws 611 are provided in the adjusting fixing blocks 610. A motor connecting shaft 615 is provided below the bottom connecting plate 616. A motor fixing block 613 is provided below the motor connecting shaft 615. A motor 612 is installed on the motor fixing block 613. The motor 612 is connected to a lead screw 617 through a coupling 614. A support column 609 is also provided above the bottom connecting plate 616. An execution flat plate 601 is provided above the support column 609. A lead screw connecting plate 618 is provided on the slider of the lead screw 617. A lifting chassis guiding shaft 605 is provided on the lead screw connecting plate 618. A bearing four 620 (linear bearing) is provided in the lifting chassis guiding shaft 605. A lifting chassis 604 is installed at the end of the lifting chassis guiding shaft 605. A sensor three 603 is provided at one place of the lifting chassis 604. A positioning guiding shaft 602 and a bearing three 606 (linear bearing) are also provided on the execution flat plate 601. A limiting shaft 607 is also provided above the execution flat plate 601. Lifting cylinders 608 are provided on both sides of the execution flat plate 601. A lifting plate 622 is installed above the lifting cylinders 608.

[0047] II. The steel ring positioning component 5 for expanding the film mainly includes a positioning flat plate 502 and a positioning bottom plate 506.

[0048] As Figure 6 , support blocks 509 are installed on both sides of the positioning bottom plate 506. A positioning flat plate 502 is installed above the support blocks 509. A positioning cylinder one 501 is installed on one side below the positioning flat plate 502. A positioning cylinder two 505 is installed on the other side below the positioning flat plate 502. Positioning shafts 503 are respectively installed on the positioning cylinder one 501 and the positioning cylinder two 505. A sensor one 504 and a sensor two 507 are also installed on the positioning bottom plate 506.

[0049] III. The film expanding reciprocating pressing assembly 4 mainly includes a steel ring support and a support plate 403, a reciprocating cylinder 405, a steel ring support 406, a guide rail plate 413, and a reciprocating cylinder fixing plate 414.

[0050] As Figure 5 , a reciprocating cylinder 405 is installed on one side of the reciprocating cylinder fixing plate 414, a sliding plate 415 is installed on the reciprocating cylinder 405, the sliding plate 415 is connected to the steel ring support and a support plate 403 through a reciprocating connecting plate 404. A buffer support 402 is provided on one side of the reciprocating cylinder fixing plate 414, a buffer 401 is provided on the buffer support 402. A steel ring support 406 is installed above the steel ring support and a support plate 403. A slider support plate 407 is also installed on the other side of the steel ring support 406. A guide rail 408 is installed on the guide rail plate 413, and a slider support plate 407 is installed on the guide rail 408. A reciprocating connecting plate 412 is installed on the guide rail plate 413 and the cylinder fixing plate 414. A rear support plate 410 is installed below the reciprocating connecting plate 412, an outer support plate 409 is installed on the rear support plate 410, and a reinforcing plate 411 is installed on the outer support plate 409.

[0051] IV. The inner ring assembly 3 of the film expanding stage mainly includes a suction cup base 304, a cover plate 309, an intermediate connecting plate 310, a frame 311, and an adsorption stage 312.

[0052] As Figures 3 to 4 , an intermediate connecting plate 310 is installed below the cover plate 309, a frame 311 is installed on the outside of the intermediate connecting plate 310, an adsorption stage 312 is installed inside the frame 311. A suction cup base 304 is installed above the cover plate 309, a suction cup base guide shaft 308 is installed on the suction cup base 304, a bearing two 303 (linear bearing) is installed in the suction cup base guide shaft 308, a main support sheet metal 301 is installed on the suction cup base guide shaft 308, and a side support sheet metal 302 is installed on the main support sheet metal 301.

[0053] V. The outer ring assembly 2 of the film expanding stage mainly includes a film expanding round chassis 203 and a film expanding pressure plate 204.

[0054] As Figure 2 , a bearing one 201 is installed on the upper circle of the film expanding round chassis 203, a ball 202 is installed on the outside of the bearing one 201, and a film expanding pressure plate 204 is installed inside the film expanding round chassis 203.

[0055] A brief description of the working process of the present invention:

[0056] When film expansion is required, first place the steel ring 1 with the wafer and the film on the film expansion steel ring positioning assembly 5 on the left and the film expansion steel ring positioning assembly 5 on the right. Then, the positioning cylinder 501 on the film expansion steel ring positioning assembly 5 contracts to drive the clamping shaft 503 to clamp the steel ring 1. The film expansion reciprocating pressing assembly 4 drives the steel ring bracket 406 to move from one end to the other end by the reciprocating cylinder 405. Then, the lifting cylinder 608 in the wafer film expansion lifting actuator 6 drives the lifting plate 622 to move upward, and the lifting plate 622 drives the film expansion steel ring positioning assembly 5 to move upward to clamp the steel ring in the vertical direction.

[0057] The motor 612 drives the lead screw 617 to rotate through the coupling 614, driving the lifting chassis 604 to move upward, driving the inner ring assembly 3 of the film expansion stage and the outer ring assembly 2 of the film expansion stage to move upward. Each die in the wafer after cutting is expanded. Then, the inner ring vacuum joint 305 of the inner ring assembly 3 of the film expansion stage is opened to adsorb the die through the adsorption stage 312. The outer ring vacuum joint 3065 of the inner ring assembly 3 of the film expansion stage is opened to adsorb the outer ring film. During the upward movement of the inner ring wafer, the balls 202 in the outer ring assembly 2 of the film expansion stage can guide the film to prevent the film from breaking, completing the film expansion operation of the wafer and ensuring the normal production of the next process.

[0058] The present invention provides a wafer film expansion device, which can realize full-automatic film expansion, reasonably separate the die gaps, and facilitate the subsequent processes. It contains a reciprocating motion mechanism that presses the steel ring when needed, and a wafer film expansion lifting mechanism that lifts the wafer to evenly separate the film. After the components of the wafer film expansion mechanism descend, the film expansion reciprocating motion mechanism can retract to facilitate material removal.

[0059] The film expansion steel ring positioning and clamping assembly can clamp the steel ring, effectively fix the steel ring, and prevent the steel ring from moving during the lifting process.

[0060] The outer ring assembly of the film expansion stage can ensure guiding the film during the lifting process of the wafer film expansion lifting mechanism to prevent the film from breaking.

[0061] The inner ring assembly of the film expansion stage has outer ring adsorption vacuum and inner ring adsorption vacuum in the inner ring assembly of the film expansion stage, which can effectively fix the film and the wafer.

[0062] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0063] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium; it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific circumstances.

[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that for those of ordinary skill in the art in the technical field, without departing from the technical principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer expansion device, characterized in that: The device comprises a film expansion platform outer ring component (2), a film expansion platform inner ring component (3), a film expansion reciprocating pressing component (4) and a wafer film expansion lifting actuator (6), wherein the wafer film expansion lifting actuator (6) drives the film expansion platform outer ring component (2) at the upper middle part to move in the vertical direction, and the film expansion platform inner ring component (3) is installed on the inner ring of the film expansion platform outer ring component (2); The wafer film expansion lifting actuator (6) includes an execution plate (601), a screw connecting plate (618) and a bottom connecting plate (616) from top to bottom. The execution plate (601) is connected to the bottom connecting plate (616) below through a plurality of supporting columns (609). The driving end of the motor (612) installed at the bottom middle of the bottom connecting plate (616) through a motor fixing block (613) and a plurality of motor connecting shafts (615) is connected to the screw (617) through a coupling (614). The screw (617) drives the screw connecting plate (618) to move in the vertical direction through a screw nut. The screw connecting plate (618) is connected to a lifting chassis (604) located above the execution plate (601) through a plurality of lifting chassis guide shafts (605). The lifting chassis (604) is connected to the outer ring assembly (2) of the film expansion carrier above. The film expansion reciprocating pressing assembly (4) comprises a steel ring bracket (406) which is located above and outside the outer ring assembly (2) of the film expansion platform and can move left and right.

2. The wafer expansion device according to claim 1, characterized in that: Film expansion steel ring positioning assemblies (5) are installed on both the left and right sides of the film expansion platform outer ring assembly (2), and a lifting cylinder (608) is installed on the execution plate (601) directly below the film expansion steel ring positioning assembly (5). The driving end at the top of the lifting cylinder (608) drives the upper film expansion steel ring positioning assembly (5) to move in the vertical direction through the lifting plate (622).

3. The wafer expansion device according to claim 2, characterized in that: The expanded film steel ring positioning assembly (5) includes a positioning plate (502) and a positioning base plate (506) from top to bottom, and the front and rear sides of the positioning plate (502) and the positioning base plate (506) are connected together by a plurality of support blocks (509) respectively. Positioning cylinder one (501) and positioning cylinder two (502) are respectively installed at the bottom of the positioning plate (502) near the front and rear sides. The positioning cylinder one (501) and the positioning cylinder two (502) respectively drive the positioning shaft (503) located above the positioning plate (502) to move in the direction toward the inside and outside, and the positioning shaft (503) is used to perform side clamping and positioning processing on the inner steel ring (1).

4. The wafer expansion device according to claim 3, characterized in that: A sensor 1 (504) and a sensor 2 (507) are respectively installed on the positioning base plate (506) below the positioning cylinder 1 (501) and the positioning cylinder 2 (502), and a positioning sensing sheet (508) is respectively installed on the bottom of the positioning shaft (503) above the sensor 1 (504) and the sensor 2 (507); a plurality of positioning guide shafts (602) are installed on the execution plate (601) through bearing 3 (606), the top of the positioning guide shaft (602) is installed on the bottom of the positioning base plate (506), and the bottom of the positioning guide shaft (602) passes through the execution plate (601) and is then connected to the guide shaft connecting plate (619) below; a plurality of limiting shafts (607) are installed on the execution plate (601) below the positioning base plate (506).

5. The wafer expansion device according to claim 1, characterized in that: The film expansion platform outer ring component (2) includes a film expansion circular bottom plate (203) and a film expansion pressure plate (204), and the film expansion platform inner ring component (3) includes a suction cup base (304), a cover plate (309), an intermediate connecting plate (310), a frame (311) and an adsorption platform (312); a bearing 1 (201) is installed on the outer ring of the film expansion circular bottom plate (203), and a plurality of balls (202) are evenly installed on the outer side of the bearing 1 (201) along the circumferential direction. ), a film expansion pressure plate (204) is installed on the inner ring of the film expansion circular bottom plate (203); a cover plate (309) is installed on the suction cup base (304), and the cover plate (309) is connected to the frame (311) through an intermediate connecting plate (310), and the frame (311) is located in the film expansion circular bottom plate (203), and an adsorption platform (312) is installed in the frame (311), and the suction cup base (304) protrudes from the bottom of the film expansion circular bottom plate (203).

6. The wafer expansion device according to claim 5, characterized in that: A plurality of suction cup base guide shafts (308) are installed at the bottom of the suction cup base (304); the suction cup base guide shafts (308) are installed on the execution plate (601) via bearing 2 (303); the bottom of the suction cup base guide shaft (308) passes through the execution plate (601) and is then installed on the main support sheet metal (301); and a side support sheet metal (302) is installed between two adjacent main support sheet metals (301).

7. The wafer expansion device according to claim 5, characterized in that: An inner ring vacuum joint (305), an outer ring vacuum joint (306) and a center ring (307) are installed on the suction cup base (304).

8. The wafer expansion device according to claim 1, characterized in that: A steel ring support plate (403) and a slider support plate (407) are respectively installed on the front and rear sides of the bottom of the steel ring support (406); a reciprocating cylinder fixing plate (414) is installed on the inner side of the steel ring support plate (403); a guide plate (413) is installed on the inner side of the slider support plate (407); a reciprocating cylinder (405) installed on the inner side of the reciprocating cylinder fixing plate (414) drives the steel ring support plate (403) to move in the left and right directions through a sliding plate (415) and a reciprocating connecting plate (404); the slider support plate (407) is moved on the guide plate (413) through a guide rail (408). The reciprocating cylinder fixing plate (414) and the guide plate (413) are respectively mounted on the front and rear sides of the execution plate (601); the left sides of the reciprocating cylinder fixing plate (414) and the guide plate (413) are connected together through a reciprocating connecting plate 2 (412); the reciprocating connecting plate 2 (412) is connected to the outer supporting plate (409) below through a rear supporting plate (410), and a reinforcing plate (411) is mounted on the rear supporting plate (410); at least one buffer (401) is mounted on the right side of the reciprocating cylinder fixing plate (414) through a buffer bracket (402).

9. The wafer expansion device according to claim 1, characterized in that: The lifting chassis guide shaft (605) is installed on the execution plate (601) through bearing four (620); at least one lifting sensor is installed at the bottom of the lifting chassis (604) through a sensor fixing plate (621), and a lifting induction plate compatible with the above-mentioned lifting sensor is installed on the execution plate (601) on one side of the lifting sensor.

10. The wafer expansion device according to claim 1, wherein: At least one adjusting screw (611) is installed on one side of the bottom of the bottom connecting plate (616) via an adjusting fixing block (610).

Images