Dielectric waveguide vertical interconnection structure, manufacturing method and communication equipment

Abstract

The present application discloses a dielectric waveguide vertical interconnection structure, a manufacturing method, and a communication device, relating to the field of communication technology. The disclosed dielectric waveguide vertical interconnection structure includes: a dielectric plate; a plurality of through-hole structures vertically provided on the periphery of a preset area of the dielectric plate; the through-hole structures are used to constrain the propagation direction of electromagnetic waves input into the preset area to be parallel to the height direction of the through-hole structures. The present application provides a through-hole structure perpendicular to the periphery of the preset area of the dielectric plate, and utilizes the provided through-hole structure to constrain the propagation direction of the electromagnetic waves in the preset area to be parallel to the height direction of the through-hole structure, so that the transmission direction of the electromagnetic waves is perpendicular to the dielectric plate, thereby achieving vertical transmission of the electromagnetic waves, thereby achieving vertical interconnection of channels on different planes, which is further conducive to integration with structures on channels on other planes.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a dielectric waveguide vertical interconnection structure, a manufacturing method and a communication device. Background Art

[0002] With the continuous advancement of technology, communication electronic devices require higher levels of integration and smaller size. The importance of high-density integration lies in improving the performance and functional density of electronic devices, reducing device size and weight, lowering power consumption, improving reliability, and extending device life. Currently, existing dielectric waveguide interconnect structures, such as substrate-integrated coaxial cables, can achieve multi-layer array distribution, improving transmission rates.

[0003] However, when the existing dielectric waveguide interconnect structure transmits electromagnetic waves on its dielectric plate, each channel is independently distributed and can only be transmitted in the horizontal direction. There are interconnection problems when connecting channels on different planes, which is not conducive to integration with structures on other planar channels. Summary of the Invention

[0004] The main purpose of the present invention is to provide a dielectric waveguide vertical interconnection structure, a manufacturing method and a communication device, aiming to solve the technical problem that the existing technology has interconnection problems in connecting channels on different planes, which is not conducive to integration with structures on other plane channels.

[0005] To achieve the above-mentioned object, the present invention provides a dielectric waveguide vertical interconnection structure, the dielectric waveguide vertical interconnection structure comprising: a dielectric plate;

[0006] A plurality of through-hole structures are vertically opened on the periphery of the predetermined area of the dielectric plate;

[0007] The through-hole structure is used to constrain the propagation direction of the electromagnetic wave input into the preset area to be parallel to the height direction of the through-hole structure.

[0008] In one embodiment, the dielectric plate includes: a first conductor region and a second conductor region;

[0009] The first conductor area and the second conductor area are arranged on both sides of the preset area;

[0010] A plurality of through-hole structures are provided in both the first conductor region and the second conductor region;

[0011] The through-hole structure in the first conductor region and the through-hole structure in the second conductor region are symmetrical based on the preset region.

[0012] In one embodiment, the dielectric plate further comprises: a dielectric region;

[0013] The dielectric area is disposed between the first conductor area and the second conductor area and includes the preset area;

[0014] A portion of the dielectric region outside the preset region is provided with a plurality of the through-hole structures;

[0015] The through-hole structures in the dielectric region are symmetrical based on the preset region.

[0016] In one embodiment, each of the through-hole structures in the first conductor region and the second conductor region is a metal through-hole;

[0017] The arrangement direction of each of the metal through holes is perpendicular to the propagation direction of the electromagnetic wave.

[0018] In one embodiment, each of the through-hole structures in the dielectric region is an air through-hole;

[0019] The arrangement direction of each of the air holes is perpendicular to the propagation direction of the electromagnetic wave.

[0020] In addition, to achieve the above-mentioned object, the present invention also proposes a method for manufacturing a dielectric waveguide vertical interconnection structure, the method comprising the following steps:

[0021] Get the media board;

[0022] A plurality of through-hole structures are vertically provided on the periphery of a predetermined area of the dielectric plate;

[0023] By adjusting each of the through-hole structures, the propagation direction of the electromagnetic wave input into the preset area is constrained to be parallel to the height direction of the through-hole structure.

[0024] In one embodiment, the through-hole structure includes a metal through-hole, and the step of vertically opening a plurality of through-hole structures on the periphery of the predetermined area of the dielectric plate includes:

[0025] Dividing a first conductor area and a second conductor area on both sides of the preset area of the dielectric plate;

[0026] A plurality of the metal through holes are respectively provided in the first conductor region and the second conductor region, and the metal through holes in the first conductor region and the metal through holes in the second conductor region are symmetrically distributed based on the preset area.

[0027] In one embodiment, the through-hole structure further includes air through-holes, and after the step of dividing the first conductor area and the second conductor area on both sides of the predetermined area of the dielectric plate, the method further includes:

[0028] Dividing the area between the first conductor area and the second conductor area into a dielectric area, wherein the dielectric area includes the preset area;

[0029] A plurality of air through holes are opened in a portion of the medium area outside the preset area, and the air through holes in the medium area are symmetrically distributed based on the preset area.

[0030] In one embodiment, the step of constraining the propagation direction of the electromagnetic wave input into the preset area to be parallel to the height direction of the through-hole structure by adjusting the through-hole structure includes:

[0031] By adjusting the size parameters of each metal through hole, the electric field component of the electromagnetic wave in the direction perpendicular to the height of the metal through hole is constrained;

[0032] The electric field component of the electromagnetic wave in the height direction of the air through-hole is constrained by adjusting the size parameters of each of the air through-holes.

[0033] In addition, to achieve the above-mentioned object, the present invention further proposes a communication device, which includes the dielectric waveguide vertical interconnection structure described above.

[0034] One or more technical solutions proposed in this application have at least the following technical effects:

[0035] The dielectric waveguide vertical interconnect structure disclosed in this application includes: a dielectric plate; a plurality of through-hole structures perpendicularly formed on the periphery of a predetermined region of the dielectric plate; the through-hole structures are used to constrain the propagation direction of electromagnetic waves input into the predetermined region to be parallel to the height direction of the through-hole structures. This application achieves vertical transmission of electromagnetic waves by providing through-hole structures perpendicular to the periphery of the predetermined region of the dielectric plate, and utilizing the through-hole structures to constrain the propagation direction of electromagnetic waves in the predetermined region to be parallel to the height direction of the through-hole structures, thereby making the transmission direction of the electromagnetic waves perpendicular to the dielectric plate. This allows for vertical interconnection of channels on different planes, further facilitating integration with structures on channels on other planes. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0038] Figure 1 A schematic diagram of the three-dimensional structure of the dielectric waveguide vertical interconnection structure provided in an embodiment of the present application;

[0039] Figure 2 A top view of a dielectric waveguide vertical interconnect structure provided in an embodiment of the present application;

[0040] Figure 3 A front view of a dielectric waveguide vertical interconnect structure provided in an embodiment of the present application;

[0041] Figure 4 This is a flow chart of an embodiment of a method for manufacturing a dielectric waveguide vertical interconnect structure of the present application.

[0042] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0043] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not intended to limit the present application.

[0044] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0045] The main solution of the embodiment of the present application is: a plurality of through-hole structures are vertically opened on the periphery of a preset area of a dielectric plate of a dielectric waveguide vertical interconnection structure; the through-hole structure is used to constrain the propagation direction of the electromagnetic wave input into the preset area to be parallel to the height direction of the through-hole structure.

[0046] While existing technologies for connecting channels on different planes have interconnection issues, hindering integration with structures on other planar channels, the present invention provides a through-hole structure perpendicular to the periphery of a predetermined area of a dielectric plate. This through-hole structure constrains the propagation direction of electromagnetic waves in the predetermined area to be parallel to the height direction of the through-hole structure, making the transmission direction of the electromagnetic waves perpendicular to the dielectric plate. This achieves vertical transmission of electromagnetic waves, thereby enabling vertical interconnection of channels on different planes and facilitating integration with structures on other planar channels.

[0047] Based on this, the first embodiment of the present application is proposed. In the first embodiment, a dielectric waveguide vertical interconnection structure is provided. Figure 1 , Figure 1 A schematic diagram of the three-dimensional structure of the dielectric waveguide vertical interconnection structure provided in an embodiment of the present application. Figure 1 The structure shown is located in the xyz space coordinate system.

[0048] In this embodiment, the dielectric waveguide vertical interconnection structure includes: a dielectric plate 10 .

[0049] It should be noted that the dielectric plate 10 may be made of a material with a high dielectric constant, and is used to limit the propagation of electromagnetic waves along a specific path.

[0050] A plurality of through-hole structures 30 are vertically formed on the periphery of the predetermined area 20 of the dielectric plate 10 .

[0051] It should be noted that the above-mentioned preset area 20 may be a pre-selected area for transmitting electromagnetic waves.

[0052] It is understandable that the through hole structure 30 may be a cylindrical structure with a hollow interior.

[0053] In a specific implementation, a preset area 20 can be selected in the dielectric plate 10 based on needs, and then multiple through-hole structures 30 are opened vertically (ie, in the z direction) around the preset area 20 so that the preset area 20 is surrounded by the through-hole structures 30 .

[0054] The through-hole structure 30 is used to constrain the propagation direction of the electromagnetic wave input into the predetermined area 20 to be parallel to the height direction of the through-hole structure 30 .

[0055] In a specific implementation, electromagnetic waves can be input into the preset area 20 in any direction. When the electromagnetic waves propagate from the preset area 20 to the through-hole structure 30, the metallized inner wall of the through-hole structure 30 will reflect the electromagnetic waves, preventing them from diffusing into the surrounding space. By adjusting the size parameters of the through-hole structure 30, the electric field of the electromagnetic waves can be constrained so that the electromagnetic waves are constrained to the preset area 20 and parallel to the height direction of the through-hole structure 30, that is, constrained to be transmitted along the z direction, thereby realizing vertical transmission of the electromagnetic waves.

[0056] The above-mentioned through-hole structure 30 can be used to vertically connect other multi-layer planar structures, realizing multi-layer stacking interconnection and improving integration. The through-hole structure 30's confinement of electromagnetic waves enables stable transmission of electromagnetic waves between multi-layer stacking interconnections. It can also transmit electromagnetic waves in both longitudinal cross-section magnetic mode and longitudinal cross-section electric mode propagation modes, reducing design complexity and increasing design freedom.

[0057] The dielectric waveguide vertical interconnect structure disclosed in this embodiment includes: a dielectric plate; a plurality of through-hole structures perpendicularly formed on the periphery of a predetermined region of the dielectric plate; the through-hole structures are used to constrain the propagation direction of electromagnetic waves input into the predetermined region to be parallel to the height direction of the through-hole structures. This embodiment achieves vertical transmission of electromagnetic waves by providing through-hole structures perpendicular to the periphery of the predetermined region of the dielectric plate and utilizing the through-hole structures to constrain the propagation direction of electromagnetic waves in the predetermined region to be parallel to the height direction of the through-hole structures. This enables vertical transmission of electromagnetic waves perpendicular to the dielectric plate, thereby realizing vertical interconnection of channels on different planes and facilitating integration with structures on channels on other planes.

[0058] Based on the first embodiment of the present application, the second embodiment of the present application is proposed. In the second embodiment of the present application, the same or similar contents as those of the first embodiment can be referred to the above introduction and will not be repeated hereafter.

[0059] This embodiment can continue to refer to Figure 1 In this embodiment, the dielectric plate 10 includes a first conductor region 401 and a second conductor region 402 .

[0060] It should be noted that the first conductor region 401 and the second conductor region 402 may be regions for conducting electricity.

[0061] The first conductive region 401 and the second conductive region 402 are located on both sides of the predetermined region 20 .

[0062] In a specific implementation, the areas of the dielectric plate 10 on both sides of the preset area 20 can be divided into a first conductor area 401 and a second conductor area 402 , and the first conductor area 401 and the second conductor area 402 are symmetrical with respect to the preset area 20 .

[0063] A plurality of through-hole structures 30 are defined in both the first conductor region 401 and the second conductor region 402 .

[0064] The through-hole structure 30 in the first conductor region 401 and the through-hole structure 30 in the second conductor region 402 are symmetrical based on the predetermined area 20 .

[0065] In the specific implementation, refer to Figure 2 , Figure 2 A top view of a dielectric waveguide vertical interconnect structure provided in an embodiment of the present application, Figure 2 The structure shown is located in the xyz coordinate system. A through-hole array consisting of multiple through-hole structures 30 can be vertically (i.e., along the z-direction) provided in each of the first conductor region 401 and the second conductor region 402. Furthermore, the through-hole structures 30 in the first conductor region 401 and the through-hole structures 30 in the second conductor region 402 are symmetrical with respect to the predetermined area 20.

[0066] In this embodiment, continue to refer to Figure 1 or Figure 2 The dielectric plate 10 further includes a dielectric area 50 .

[0067] The dielectric region 50 is disposed between the first conductive region 401 and the second conductive region 402 , and includes the predetermined region 20 .

[0068] In a specific implementation, the area between the first conductor area 401 and the second conductor area 402 and including the preset area 20 on the dielectric plate 10 may be used as the dielectric area 50 .

[0069] A portion of the dielectric region 50 outside the predetermined region 20 is provided with a plurality of through-hole structures 30 .

[0070] The through-hole structures 30 in the dielectric region 50 are symmetrical based on the predetermined region 20 .

[0071] In a specific implementation, multiple through-hole structures 30 may be vertically (ie, along the z-direction) opened in the dielectric region 50 outside the predetermined region 20 , and the through-hole structures 30 in the dielectric region 50 are symmetrical with respect to the predetermined region 20 .

[0072] In this embodiment, each of the through-hole structures 30 in the first conductor region 401 and the second conductor region 402 is a metal through-hole 301 .

[0073] The arrangement direction of each of the metal through holes 301 is perpendicular to the propagation direction of the electromagnetic wave.

[0074] In a specific implementation, holes can be opened in the first conductor region 401 and the second conductor region 402, and then electroplated or filled with metal material to form the through-hole structures, which are metal through-holes. That is, each through-hole structure 30 in the first conductor region 401 and the second conductor region 402 is a metal through-hole 301. The arrangement direction of each metal through-hole 301 is perpendicular to the propagation direction of the electromagnetic wave, that is, arranged along the y-axis.

[0075] Furthermore, each metal through hole 301 can be used for conducting electricity and enhancing the reflection and confinement effect of electromagnetic waves. By adjusting the size parameters of the metal through hole 301, the left and right (x direction) electric fields of the electromagnetic waves can be confined.

[0076] In this embodiment, each of the through-hole structures 30 in the dielectric region 50 is an air through-hole 302 .

[0077] The arrangement direction of each of the air holes 302 is perpendicular to the propagation direction of the electromagnetic wave.

[0078] In a specific implementation, mutually symmetrical holes can be opened in the dielectric region 50 outside the predetermined region 20, and then filled with air or other low-dielectric-constant materials, such as nitrogen or argon. The formed through-hole structure 30 is the air through-hole 302. The arrangement direction of each air through-hole 302 is perpendicular to the propagation direction of the electromagnetic wave, that is, arranged along the y-axis.

[0079] Furthermore, each air hole 302 has low dielectric constant and low loss characteristics, which can reduce the propagation loss of electromagnetic waves. Moreover, by adjusting the size parameters of the air holes 302, the upper and lower electric fields (z direction) of the electromagnetic waves can be constrained.

[0080] For example, this embodiment is illustrated by using a substrate-integrated non-radiative dielectric waveguide at the circuit board level. The dielectric waveguide vertical interconnect structure of this embodiment can operate in the W band (75-110 GHz), supports two electromagnetic wave propagation modes: longitudinal magnetic mode and longitudinal electric mode, and realizes vertical transmission of electromagnetic waves. In addition, it uses LTCC process ceramic board material (dielectric constant 9.8, dielectric loss tangent 0.002). Figure 3 , Figure 3 This is a front view of the dielectric waveguide vertical interconnect structure provided in an embodiment of the present application. Figure 3 The structure shown is located in the xyz space coordinate system, and the thickness of the dielectric plate 10 is h1 = 0.864 mm. The width of the dielectric plate 10 is L2 = 5.2 mm. Figure 2 The length of the dielectric plate 10 is L1 = 7 mm. Each metal through-hole 301 has a radius of r1 = 0.3 mm, and the distance between the edges of adjacent metal through-holes 301 is g1 = 0.1 mm. Each air through-hole 302 has a radius of r2 = 0.25 mm, and the distance between the edges of adjacent air through-holes 302 is g2 = 0.1 mm. The width of the predetermined area 20 is a1 = 1 mm, and the length of the predetermined area 20 is b1 = 1.4 mm.

[0081] The above parameters are for illustration only and do not limit the present invention.

[0082] It should be understood that referring to Figure 3 After constraining the electric field direction of the electromagnetic wave through the metal through-hole 301 and the air through-hole 302, the propagation direction of the electromagnetic wave in the preset area 20 can be made perpendicular to the substrate plane (xy plane), that is, the electromagnetic wave is controlled to propagate along the z direction in the preset area 20, so that it can be used for interconnection between multi-layer channels, reduce the structural size, and improve the integration.

[0083] It should be noted that the above examples are only used to understand the present application and do not constitute a limitation on the dielectric waveguide vertical interconnection structure of the present application. More simple transformations based on this technical concept are all within the scope of protection of the present application.

[0084] In addition, in order to achieve the above purpose, the present application also proposes a method for manufacturing a dielectric waveguide vertical interconnection structure, referring to Figure 4 , Figure 4 This is a flow chart of an embodiment of a method for manufacturing a dielectric waveguide vertical interconnect structure of the present application.

[0085] like Figure 4 As shown, in this embodiment, the method for manufacturing a dielectric waveguide interconnect structure includes steps S10 to S30:

[0086] Step S10: Obtain a dielectric plate.

[0087] Step S20 , vertically opening a plurality of through-hole structures on the periphery of a predetermined area of the dielectric plate.

[0088] Step S30 , constraining the propagation direction of the electromagnetic wave input into the preset area to be parallel to the height direction of the through-hole structure by adjusting each of the through-hole structures.

[0089] In a specific implementation, a dielectric plate made of a high-dielectric-constant material is obtained. A predetermined area is then selected within the plate based on the desired requirements. Multiple through-hole structures are then vertically opened around the periphery of the predetermined area, enclosing the predetermined area. Electromagnetic waves can be input into the predetermined area from any direction. When the electromagnetic wave propagates from the predetermined area to the through-hole structure, the metallized inner walls of the through-hole structure reflect the electromagnetic wave, preventing it from spreading into the surrounding space. By adjusting the dimensional parameters of the through-hole structure, the electric field of the electromagnetic wave can be confined to the predetermined area and parallel to the height direction of the through-hole structure, thereby achieving vertical transmission of the electromagnetic wave.

[0090] In a feasible embodiment, the through-hole structure includes a metal through-hole, and step S20 includes: steps S201-S202:

[0091] Step S201 : dividing a first conductor area and a second conductor area on both sides of a preset area of the dielectric plate.

[0092] Step S202 : opening a plurality of the metal through-holes in the first conductor region and the second conductor region respectively, and distributing the metal through-holes in the first conductor region and the metal through-holes in the second conductor region symmetrically based on the preset area.

[0093] In a specific implementation, the dielectric plate area on both sides of the predetermined area can be divided into a first conductor area and a second conductor area, and the first and second conductor areas are symmetrical about the predetermined area. Multiple holes are then vertically opened in the first and second conductor areas, respectively. Each hole is electroplated or filled with a metal material to form a through-hole structure, namely, a metal through-hole. Specifically, each through-hole structure in the first and second conductor areas is a metal through-hole, and the arrangement direction of each metal through-hole is perpendicular to the propagation direction of the electromagnetic wave. Furthermore, the metal through-holes in the first and second conductor areas are symmetrical about the predetermined area.

[0094] In a feasible embodiment, the through-hole structure further includes air through-holes, and step S201 may further include steps S203 to S204:

[0095] Step S203: Divide the area between the first conductor area and the second conductor area into a dielectric area.

[0096] Wherein, the medium area includes the preset area.

[0097] Step S204 : opening a plurality of air holes in a portion of the dielectric region outside the preset region, and distributing the air holes in the dielectric region symmetrically based on the preset region.

[0098] In a specific implementation, the area between the first and second conductor areas and including the predetermined area can be defined as the dielectric area on the dielectric plate. Symmetrical holes can be formed in the dielectric area outside the predetermined area and then filled with air or another low-dielectric-constant material, such as nitrogen or argon. The resulting through-hole structure is referred to as an air through-hole. The arrangement of the air through-holes is perpendicular to the propagation direction of the electromagnetic wave. Furthermore, the air through-holes in the dielectric area are symmetrical with respect to the predetermined area.

[0099] In a feasible implementation, step S30 may include steps S301 and S302:

[0100] Step S301 : Constraining the electric field component of the electromagnetic wave in a direction perpendicular to the height of the metal through-hole by adjusting the size parameters of each of the metal through-holes.

[0101] Step S302 : Constraining the electric field component of the electromagnetic wave in the height direction of the air holes by adjusting the size parameters of the air holes.

[0102] In a specific implementation, the left and right electric fields of the electromagnetic wave, i.e., the electric field components in the direction perpendicular to the height of the metal through-hole, can be constrained by adjusting the size parameters of the air through-hole. The upper and lower electric fields of the electromagnetic wave, i.e., the electric field components in the height direction of the air through-hole, can be constrained by adjusting the size parameters of the air through-hole. Based on the left and right constraints of the electromagnetic waves by the metal through-holes and the air through-holes, the propagation direction of the electromagnetic wave in the preset area can be made perpendicular to the substrate plane, thereby being able to be used for interconnection between multi-layer channels, reducing the structural size and improving the integration.

[0103] This embodiment obtains a dielectric plate; defines multiple through-hole structures perpendicularly around the periphery of a predetermined region of the dielectric plate; and, by adjusting each through-hole structure, constrains the propagation direction of electromagnetic waves input into the predetermined region to be parallel to the height direction of the through-hole structure. This embodiment provides through-hole structures perpendicular to the periphery of the predetermined region of the dielectric plate, and utilizes the through-hole structures to constrain the propagation direction of electromagnetic waves in the predetermined region to be parallel to the height direction of the through-hole structures. This allows the propagation direction of electromagnetic waves to be perpendicular to the dielectric plate, thus achieving vertical transmission of electromagnetic waves. This allows for vertical interconnection of channels on different planes, further facilitating integration with structures on channels on other planes.

[0104] The present application also provides a communication device, which includes the dielectric waveguide vertical interconnection structure described above.

[0105] The communication device provided herein employs the dielectric waveguide vertical interconnect structure of the aforementioned embodiment, resolving the prior art's technical issues of interconnection issues for connecting channels on different planes, hindering integration with structures on other plane channels. Compared to the prior art, the communication device provided herein achieves the same beneficial effects as the dielectric waveguide vertical interconnect structure of the aforementioned embodiment. Other technical features of the communication device are the same as those disclosed in the aforementioned dielectric waveguide vertical interconnect structure embodiment and are not further elaborated here.

[0106] The above description is only part of the embodiments of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A dielectric waveguide vertical interconnect structure, characterized in that: The dielectric waveguide vertical interconnection structure includes: a dielectric plate; The dielectric area of the dielectric plate is arranged between the first conductor area and the second conductor area of the dielectric plate and includes a preset area; A plurality of metal through holes and a plurality of air through holes are vertically opened on the periphery of the predetermined area of the dielectric plate, each of the metal through holes is located in the first conductor area and the second conductor area, and each of the air through holes is located in the dielectric area and outside the predetermined area; Each of the metal through holes and each of the air through holes is used to constrain the propagation direction of the electromagnetic wave input into the preset area to be parallel to the height direction of each of the metal through holes and each of the air through holes.

2. The dielectric waveguide vertical interconnect structure according to claim 1, wherein: The metal through hole in the first conductor region and the metal through hole in the second conductor region are symmetrical based on the preset region.

3. The dielectric waveguide vertical interconnect structure according to claim 2, wherein: The air through holes in the medium area are symmetrical based on the preset area.

4. The dielectric waveguide vertical interconnect structure according to claim 3, wherein: The arrangement direction of each of the metal through holes is perpendicular to the propagation direction of the electromagnetic wave.

5. The dielectric waveguide vertical interconnect structure according to claim 3, wherein: The arrangement direction of each of the air holes is perpendicular to the propagation direction of the electromagnetic wave.

6. A method for manufacturing a dielectric waveguide vertical interconnection structure, characterized in that: The method for manufacturing a dielectric waveguide vertical interconnect structure comprises the following steps: Get the media board; A plurality of metal through holes and a plurality of air through holes are vertically opened on the periphery of the predetermined area of the dielectric plate; By adjusting each of the metal through holes and each of the air through holes, the propagation direction of the electromagnetic wave input into the preset area is constrained to be parallel to the height direction of each of the metal through holes and each of the air through holes; The step of vertically opening a plurality of metal through holes and a plurality of air through holes on the periphery of the predetermined area of the dielectric plate comprises: Dividing a first conductor area and a second conductor area on both sides of the preset area of the dielectric plate; A plurality of metal through holes are respectively provided in the first conductor region and the second conductor region, and the metal through holes in the first conductor region and the metal through holes in the second conductor region are symmetrically distributed based on the preset area; After the step of dividing the first conductor area and the second conductor area on both sides of the preset area of the dielectric plate, the method further includes: Dividing the area between the first conductor area and the second conductor area into a dielectric area, wherein the dielectric area includes the preset area; A plurality of air through holes are opened in a portion of the medium area outside the preset area, and the air through holes in the medium area are symmetrically distributed based on the preset area.

7. The method for manufacturing a dielectric waveguide vertical interconnect structure according to claim 6, wherein: The step of constraining the propagation direction of the electromagnetic wave input into the preset area to be parallel to the height direction of each metal through hole and each air through hole by adjusting each metal through hole and each air through hole comprises: Constraining the electric field component of the electromagnetic wave in a direction perpendicular to the height of the metal through-hole by adjusting the size parameters of each of the metal through-holes; The electric field component of the electromagnetic wave in the height direction of the air through-hole is constrained by adjusting the size parameters of each of the air through-holes.

8. A communication device, characterized in that: The communication device comprises the dielectric waveguide vertical interconnection structure according to any one of claims 1 to 5.

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