Connector gold wire bonding method and device

Abstract

The invention relates to a connector gold wire bonding method and device, and belongs to the field of gold wire bonding, and the method comprises the steps: cleaning a bonding region, and welding a microstrip connector on a cavity housing; wrapping and fixing the tail pin of the micro-strip connector, and carrying out gold wire bonding on the tail pin of the micro-strip connector and the PCB; and unwrapping and fixing the tail pin of the microstrip connector, and cleaning the bonding area to complete gold wire bonding. According to the invention, through an active constraint mechanism, the problems of vibration and deformation caused by insufficient suspension support in the bonding process of the tail pin of the microstrip connector with a high length-diameter ratio are effectively solved, and the strength and success rate of gold wire bonding are significantly improved.

Description

Technical Field

[0001] The present invention belongs to the field of gold wire bonding, and particularly relates to a method and device for gold wire bonding of a connector. Background Art

[0002] In the field of manufacturing radio frequency microstrip connectors, gold wire bonding is a core process to achieve the reliability of high-frequency signal transmission. When the tail microstrip of a microstrip connector enters the device cavity, the tail pin of the microstrip connector is often exposed alone in the cavity due to lack of effective support. As the ratio of the length to the diameter of the tail pin of the microstrip connector (microstrip aspect ratio) increases, the tail pin of the microstrip connector is prone to uncontrolled deformation and high-frequency flutter under the action of pressure and ultrasonic energy during the bonding process, resulting in an inability to form a stable contact at the bonding interface, which becomes a key factor restricting the bonding yield. This problem is particularly prominent in application scenarios where the microstrip aspect ratio is significantly increased. For example, above the K and Ka bands in the microwave frequency band, miniaturized connectors are mostly selected to be integrated on communication modules with multiple ports. However, the diameter size of the tail pins of the connectors usually used for gold wire bonding is mostly less than 0.5 mm, and some are even less than 0.3 mm. If direct gold wire bonding is carried out, there will be problems such as difficult bonding and insufficient bonding strength due to the inability to effectively suppress the vibration of the microstrip during the bonding process.

[0003] The existing technology mainly improves the bonding effect by optimizing the pretreatment of the bonding interface and adjusting the device parameters. Typical solutions include ultrasonic or chemical cleaning treatment of the bonding end face to remove contaminants, improve the surface flatness of the coating, and compensate for the defect of insufficient support by increasing the bonding times, power or pressure parameters during the bonding process. Although such methods can improve the interface bonding state in the short term, they essentially still do not change the suspended state of the tail pin of the microstrip connector in the device cavity, and the problem of the lack of its inherent mechanical support still exists. When the microstrip aspect ratio reaches a certain threshold, simply relying on process parameter adjustment can no longer effectively suppress the vibration of the microstrip during the bonding process. For example, when the microstrip aspect ratio is above 1.5, due to difficult bonding and insufficient bonding strength, the risk of bonding failure increases significantly.

[0004] The limitations of the above technical solutions are mainly reflected in the lack of an active control mechanism for the dynamic stability of the tail pin of the microstrip connector. Especially under the working conditions where the microstrip aspect ratio increases significantly, it is difficult to eliminate the bending and vibration phenomena of the tail pin of the microstrip connector under the bonding impact load, resulting in the deviation of the bonding force transmission path from the predetermined contact area, and ultimately leading to insufficient bonding strength or even bonding failure. Therefore, there is an urgent need to develop a method and device for gold wire bonding of a connector. Summary of the Invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides a method and device for gold wire bonding of a connector. The technical problems to be solved by the present invention are realized through the following technical solutions: The present invention provides a method for gold wire bonding of a connector, including: Clean the area to be bonded, and weld the microstrip connector to the cavity housing; Wrap and fix the tail pins of the microstrip connector, and perform gold wire bonding between the tail pins of the microstrip connector and the PCB board; Remove the wrapping and fixing of the tail pins of the microstrip connector, clean the bonding area, and complete the gold wire bonding.

[0006] In an embodiment of the present invention, cleaning the area to be bonded and welding the microstrip connector to the cavity housing includes: Clean the cavity housing and the tail pins of the microstrip connector respectively with a degreasing cleaning agent, and bake at a temperature of 240 °C for at least 5 minutes after cleaning; After baking, weld the microstrip connector to the cavity housing by reflow soldering, and the temperature range of the reflow soldering is 240~260 °C.

[0007] In an embodiment of the present invention, wrapping and fixing the tail pins of the microstrip connector includes: Prepare a bonding tooling according to the bonding area between the cavity housing and the microstrip connector; Press-fit the bonding tooling into the cavity housing, so that the upper end surface of the bonding tooling cooperating with the cavity housing is not higher than the upper surface of the cavity housing; Wrap and fix the tail pins of the microstrip connector through the bonding tooling.

[0008] In an embodiment of the present invention, the bonding tooling includes a fixed section and an extension section connected to each other. The fixed section is press-fitted and assembled with the cavity housing and wraps and fixes the tail pins of the microstrip connector; the extension section extends out of the cavity housing.

[0009] In an embodiment of the present invention, performing gold wire bonding between the tail pins of the microstrip connector and the PCB board includes: Set the bonding parameters, and perform gold wire bonding between the tail pins of the microstrip connector and the PCB board according to the preset bonding parameters. Among them, the bonding parameters are: the bonding pressure range is 13~30 g, the bonding power range is 140~170 mW, the bonding time range is 50~80 ms, and the ultrasonic energy parameter is 130 LSB.

[0010] In an embodiment of the present invention, removing the wrapping and fixing of the tail pins of the microstrip connector and cleaning the bonding area includes: Take out the bonding tooling through the extension section, clean the bonding area with anhydrous ethanol, and ensure that there is no residue in the bonding area and the cavity housing.

[0011] The present invention also provides a connector gold wire bonding device for the above-mentioned connector gold wire bonding method. The device includes: a cavity housing, a microstrip connector, and a bonding tooling. Among them, a plurality of the microstrip connectors are fixedly connected to the cavity housing; the cavity housing is provided with a plurality of bonding holes, and the tail pins of the plurality of microstrip connectors respectively extend out from the plurality of bonding holes, and the plurality of bonding toolings are detachably connected to the tail pins of the plurality of microstrip connectors respectively; Each of the bonding toolings includes a fixed section and an extended section connected to each other. The fixed section is arranged in the bonding hole and is in transitional fit or interference fit with the tail pin of the microstrip connector.

[0012] In an embodiment of the present invention, the ratio of the length to the diameter of the tail pin of the microstrip connector is greater than or equal to 2.

[0013] In an embodiment of the present invention, both the fixed section and the extended section are made of flexible non-metallic materials. An open positioning hole is provided on one side of the fixed section, and the opening angle range of the positioning hole is 10° to 12°.

[0014] In an embodiment of the present invention, a plurality of the bonding toolings are arranged side by side as a whole for batch wrapping and fixing of the tail pins of multiple rows of the microstrip connectors.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: In the connector gold wire bonding method of the present invention, the bonding area is segmented and cleaned and baked at high temperature before bonding to eliminate the influence of pollutants on the interface bonding; by wrapping and fixing the tail pins of the microstrip connectors to provide constraints during the bonding process, the vibration of the tail pins of the microstrip connectors during the bonding process is inhibited, ensuring that the bonding pressure is stably applied to the bonding area, significantly improving the strength and success rate of the gold wire bonding, and effectively solving the problems of vibration and deformation of the tail pins of the high aspect ratio microstrip connectors due to insufficient suspended support during the bonding process. This method dynamically balances the mechanical stability of the tail pins of the microstrip connectors, avoids bonding failure or bonding offset, and significantly improves the reliability of signal transmission. Compared with the traditional passive solution that relies on optimizing bonding parameters, its active constraint mechanism can adapt to the application scenarios where the aspect ratio of the microstrip is significantly increased, and can be extended to various types of microstrip connectors, with strong versatility and convenient operation, greatly reducing the process complexity and improving the bonding yield.

[0016] In the connector gold wire bonding method of the present invention, only during the gold wire bonding process operation, the tail pins of the microstrip connectors are wrapped and fixed, and are immediately taken out after this process is completed, and do not exist on the product as a part of the product bonding, will not affect the performance and environmental resistance of the product, and there are no residues on the tail pins of the microstrip connectors, without residual hidden dangers.

[0017] The connector gold wire bonding device provided by the present invention actively controls the suspended deformation of the tail pin of the microstrip connector through a physical constraint mechanism, and realizes the dynamic support for the tail pin of the microstrip connector with a high aspect ratio from the structural level through the cooperative design of the detachable bonding tooling and the cavity housing. The bonding tooling wraps and fixes the tail pin of the microstrip connector in a transitional or tight fit manner, forming a stable mechanical transmission path during the bonding process to offset the vibration and bending deformation caused by the ultrasonic impact load.

[0018] The above description is only an overview of the technical solution of the present invention. In order to be able to understand the technical means of the present invention more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, the following specific preferred embodiments are given and described in detail in conjunction with the accompanying drawings. Brief Description of the Drawings

[0019] Figure 1 is a flowchart of a connector gold wire bonding method provided by an embodiment of the present invention; Figure 2 is provided by an embodiment of the present invention Figure 1 flowchart of step 1 in; Figure 3 is provided by an embodiment of the present invention Figure 1 flowchart of step 2 in; Figure 4 is a schematic structural diagram of a connector gold wire bonding device provided by an embodiment of the present invention; Figure 5 is a partial structural schematic diagram of the connector gold wire bonding device provided by an embodiment of the present invention; Figure 6 is a partial structural schematic diagram of the cavity housing provided by an embodiment of the present invention; Figure 7 is a schematic structural diagram of the bonding tooling provided by an embodiment of the present invention; Figure 8 is a partial structural schematic diagram of the bonding tooling provided by an embodiment of the present invention; Figure 9 is a schematic structural diagram of another connector gold wire bonding device provided by an embodiment of the present invention; Figure 10 is provided by an embodiment of the present invention Figure 9 structural schematic diagram at I in; Detailed Description of the Embodiment

[0020] In order to further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following provides a detailed description of a connector gold wire bonding method and device according to the present invention in conjunction with the accompanying drawings and specific embodiments.

[0021] The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the specific embodiments in conjunction with the accompanying drawings. Through the description of the specific embodiments, a more in-depth and specific understanding of the technical means and effects adopted by the present invention to achieve the predetermined purpose can be obtained. However, the accompanying drawings are only for reference and illustration, and are not used to limit the technical solution of the present invention.

[0022] Embodiment 1 This embodiment provides a method for gold wire bonding of a connector, which can be used for a millimeter-wave connector with a frequency applied up to 50 GHz, and gold wire leads with a diameter of 25 μm are used for bonding on the end face of a microstrip with a length of 1.3 mm of a microstrip connector, and the diameter of the tail pin of the microstrip connector is 0.3 mm.

[0023] As Figure 1 shown, Figure 1 is a flowchart of a method for gold wire bonding of a connector provided by an embodiment of the present invention.

[0024] In this embodiment, the method for gold wire bonding of a connector includes: Step 1: Clean the area to be bonded, and weld the microstrip connector to the cavity housing.

[0025] As Figure 2 shown, Figure 2 is provided by an embodiment of the present invention Figure 1 a flowchart of Step 1.

[0026] In an optional embodiment, Step 1 includes: Step 1.1: Clean the cavity housing and the tail pin of the microstrip connector respectively with a degreasing cleaning agent, and bake at a temperature of 240 °C for at least 5 min after cleaning.

[0027] Exemplarily, the area to be bonded is the cavity housing and the tail pin of the microstrip connector.

[0028] Exemplarily, the degreasing cleaning agent can adopt HT-1 type degreasing cleaning agent.

[0029] Step 1.2: After baking, weld the microstrip connector to the cavity housing by reflow soldering, and the temperature range of reflow soldering is 240~260 °C.

[0030] Step 2: Wrap and fix the tail pin of the microstrip connector, and perform gold wire bonding between the tail pin of the microstrip connector and the PCB (Printed Circuit Board).

[0031] As Figure 3 shown, Figure 3 is provided by an embodiment of the present invention Figure 1 a flowchart of Step 2.

[0032] In an optional embodiment, step 2 includes: Step 2.1: Prepare a bonding tooling according to the bonding area between the cavity housing and the microstrip connector.

[0033] Exemplarily, a bonding tooling matching the bonding dimensions of the tail pins of different microstrip connectors can be designed to ensure that the tail pins of the microstrip connector can be fixed and the bonding process is not affected. By actively fixing the tail pins of the microstrip connector, the bonding environment of the connector is improved, and the bonding success rate of the microstrip connector is effectively increased.

[0034] Exemplarily, the bonding tooling is made of a flexible non-metallic material, such as a non-metallic organic fluorine material, so as not to damage the surface plating of the tail pins of the microstrip connector.

[0035] Step 2.2: Press-fit the bonding tooling into the cavity housing so that the upper end surface of the bonding tooling mating with the cavity housing is not higher than the upper surface of the cavity housing.

[0036] Exemplarily, after the microstrip connector is welded, the bonding tooling at least partially wraps and fixes the tail pins of the microstrip connector, and the part of the bonding tooling wrapping the tail pins of the microstrip connector does not exceed the upper surface of the cavity housing.

[0037] It should be noted that by wrapping and fixing the tail pins of the microstrip connector with the bonding tooling to form a ring-shaped support, the lateral bending and high-frequency vibration caused by ultrasonic energy are resisted during the bonding process, ensuring that the bonding pressure is evenly transmitted to the contact position and avoiding mechanical instability caused by the excessive aspect ratio of the microstrip. And the limit design that the bonding tooling does not exceed the upper surface of the cavity housing avoids assembly interference between the bonding tooling and the cavity housing, ensures that the ultrasonic energy is focused on the predetermined bonding area during the bonding process, and prevents energy scattering or bonding deviation caused by the protrusion of the bonding tooling. This structural feature fundamentally eliminates the problem of the tail pins of the microstrip connector being suspended, improves the contact stability of the bonding interface, and solves the core problem of insufficient bonding strength of the tail pins of the microstrip connector with a high aspect ratio (greater than or equal to 2).

[0038] Step 2.3: Wrap and fix the tail pins of the microstrip connector with the bonding tooling; Step 2.4: Set the bonding parameters and perform gold wire bonding on the tail pins of the microstrip connector and the PCB board according to the preset bonding parameters. Among them, the bonding parameters are: the bonding pressure range is 13 - 30 g, the bonding power range is 140 - 170 mW, the bonding time range is 50 - 80 ms, and the ultrasonic energy parameter is 130 LSB.

[0039] In an alternative embodiment, the bonding tooling includes a fixed section and an extension section that are interconnected. The fixed section is press-fitted and assembled with the cavity housing and wraps around the tail pins of the microstrip connector. The extension section extends outside the cavity housing. During assembly, the extension section serves as an axial alignment reference, guiding the bonding tooling to be pressed into the cavity housing along a predetermined path, ensuring rapid and precise alignment of the fixed section with the tail pins of the microstrip connector and reducing the assembly adjustment time. At the same time, the extension section can also serve as an external operation handle, eliminating the need to contact the fixed section or the tail pins of the microstrip connector with tools during disassembly and avoiding secondary damage to the bonding area caused by direct application of force.

[0040] Step 3: Remove the wrapping and fixation of the tail pins of the microstrip connector, clean the bonding area, and complete the gold wire bonding.

[0041] In an alternative embodiment, Step 3 includes: removing the bonding tooling through the extension section, and cleaning the bonding area with anhydrous ethanol to ensure that there are no residues in the bonding area and inside the cavity housing.

[0042] It should be noted that the bonding tooling is only used to assist in the gold wire bonding process operation, that is, the bonding tooling is only used to wrap and fix the tail pins of the microstrip connector during the gold wire bonding process operation, and it is immediately removed after this process is completed. Since the bonding tooling does not remain on the product as part of the product bonding, it does not affect the performance and environmental resistance of the product. At the same time, there are no residues on the tail pins of the microstrip connector, eliminating the risk of residues. Especially compared with the existing solution that uses glue dots to assist the tail pins of the microstrip connector, the advantage in terms of no residue risk is particularly prominent. In addition, by setting the extension section, it is possible to ensure the mechanical stability of the tail pins of the microstrip connector through the fixed section, and it is also possible to achieve rapid replacement and reuse of the bonding tooling through the extension section, completely solving the problem of low maintenance efficiency caused by difficult disassembly in the traditional solution.

[0043] Exemplarily, the microstrip connector uses a millimeter-wave connector with a frequency application of 50 GHz, and gold wire leads with a diameter of 25 μm are bonded on a circle with a diameter of 0.3 mm. Pull-off tests are respectively performed on two groups of 10 microstrip connectors after bonding, and the pull-off force results are shown in Tables 1 and 2.

[0044] Table 1 Pull-off force of Au wire with a diameter of 25 μm before using the bonding tooling (unit: g)

[0045] Table 2 Pull-off force of Au wire with a diameter of 25 μm after using the tooling (unit: g)

[0046] Before using the bonding tooling: Based on GJB548B, the qualified rate of the pull-off force is 70%; based on GB / T4937, the qualified rate of the pull-off force is 40%. After using the bonding tooling, based on GJB548B, the qualified rate of the pull-off force is 95%; based on GB / T4937, the qualified rate of the pull-off force is 90%.

[0047] It can be seen that by adopting the gold wire bonding method for the connector of the present invention, the vibration deformation of the tail pin of the microstrip connector during the bonding process is effectively suppressed through the active support structure. The qualified rates of the pull-off force under the GJB548B and GB / T4937 standards have been greatly improved (95%, 90%), which is significantly optimized compared with before the tooling was not used (70%, 40%). This technology breaks through the bottleneck of the lack of support when the length-diameter ratio of the tail pin of the microstrip connector increases in the traditional process. By restricting the degrees of freedom of the tail pin of the microstrip connector in real time, the problems of stress concentration and unstable contact at the bonding interface are eliminated, enabling the microstrip connector to maintain high mechanical strength and electrical contact reliability of the bonding point under complex working conditions.

[0048] The gold wire bonding method for the connector of the present invention conducts segmented cleaning and high-temperature baking on the bonding area before bonding to eliminate the influence of pollutants on the interface bonding; through the wrapped fixed support of the tail pin of the microstrip connector, constraints are provided during the bonding process, suppressing the tremor of the tail pin of the microstrip connector during the bonding process, ensuring that the bonding pressure is stably applied to the bonding area, significantly improving the strength and success rate of the gold wire bonding, and effectively solving the problems of vibration and deformation of the tail pin of the high length-diameter ratio microstrip connector due to insufficient suspended support during the bonding process. This method dynamically balances the mechanical stability of the tail pin of the microstrip connector, avoids bonding failure or bonding offset, and significantly improves the reliability of signal transmission. Compared with the traditional passive solution that relies on optimizing bonding parameters, its active constraint mechanism can adapt to the application scenarios where the length-diameter ratio of the microstrip significantly increases, and can be extended to various types of microstrip connectors, with strong versatility and convenient operation, greatly reducing the process complexity and improving the bonding yield.

[0049] Embodiment 2 This embodiment provides a gold wire bonding device for the connector, which is used for the gold wire bonding method of the connector in Embodiment 1, as Figures 4 to 6 shown Figure 4 is a schematic structural diagram of a gold wire bonding device for the connector provided by an embodiment of the present invention; Figure 5 is a partial structural diagram of the gold wire bonding device for the connector provided by an embodiment of the present invention; Figure 6 is a partial structural diagram of the cavity housing provided by an embodiment of the present invention.

[0050] In this embodiment, the connector gold wire bonding device includes: a cavity housing 100, a microstrip connector 200, and a bonding tooling 300. Among them, a plurality of microstrip connectors 200 are fixedly connected to the cavity housing 100; the cavity housing 100 is provided with a plurality of bonding holes, and the tail pins of the plurality of microstrip connectors 200 extend out through the plurality of bonding holes one by one, and the plurality of bonding toolings 300 are detachably connected to the tail pins of the plurality of microstrip connectors 200 one by one; As Figure 7 and Figure 8 shown, Figure 7 FIG. 8 is a schematic structural diagram of the bonding tooling provided by an embodiment of the present invention; Figure 8 FIG. 9 is a partial structural schematic diagram of the bonding tooling provided by an embodiment of the present invention.

[0051] In this embodiment, each bonding tooling 300 includes a connected fixed section 310 and an extension section 320. The fixed section 310 is disposed in the bonding hole and is in transitional fit or interference fit with the tail pin of the microstrip connector 200.

[0052] Exemplarily, the cavity housing 100 can be made of aluminum alloy material with a silver-plated surface for easy welding.

[0053] Exemplarily, the bonding holes provided on the cavity housing 100 are in clearance fit with the outer surface of the fixed section 310 of the bonding tooling 300, adapting to the high-density integration requirements of the small microstrip connector 200 and facilitating the loading and unloading of the bonding tooling 300.

[0054] In an alternative embodiment, the ratio of the length to the diameter of the tail pin of the microstrip connector 200 is greater than or equal to 2.

[0055] In an alternative embodiment, both the fixed section 310 and the extension section 320 are made of flexible non-metallic materials. An open positioning hole is provided on one side of the fixed section 310, and the opening angle of the positioning hole ranges from 10° to 12°.

[0056] Exemplarily, the diameter of the tail pin of the microstrip connector 200 can be set to 0.3 mm, and the length can be set to 1.3 mm, and the ratio of its length to the diameter is greater than 4.

[0057] Exemplarily, the surface roughness of the tail pin of the microstrip connector 200 is not less than 0.8. Soft gold (purity of 99.99%) is plated on the surface of the tail pin of the microstrip connector 200, and the gold layer thickness is greater than or equal to 2 μm.

[0058] Exemplarily, both the fixed section 310 and the extension section 320 are made of flexible non-metallic materials, such as non-metallic organic fluorine materials. Specifically, polytetrafluoroethylene (PTFE) materials can be used. The PTFE materials have low material costs, are easy to process, and will not damage the surface coating of the tail pins of the microstrip connector 200. The non-metallic characteristics of the bonding tooling 300 can protect the integrity of the surface coating of the tail pins of the microstrip connector 200, maintain the conductivity of the bonding surface, and at the same time, the detachable design can also avoid the influence of tooling residues on the environmental resistance of the product.

[0059] Exemplarily, the fixed section 310 extends into the bonding hole of the cavity housing 100. For example, the length of the fixed section 310 can be set to 1 mm. The outside of the fixed section 310 can be set to be circular, and its diameter size can be set to 0.7 mm. The inside of the fixed section 310 can be set to be circular, and its diameter size can be set to 0.3 mm.

[0060] Specifically, after the bonding tooling 300 is fixed in place, the upper end surface of the fixed section 310 does not exceed the upper surface of the bonding hole provided on the cavity housing 100 to avoid affecting the bonding process.

[0061] Furthermore, for the convenience of clamping the bonding tooling 300, an open positioning hole is provided on one side of the fixed section 310, so that certain deformation can occur when the fixed section 310 clamps the tail pins of the microstrip connector 200, and it is convenient for loading and unloading. In this way, a tight fit or an interference fit can be formed between the bonding tooling 300 and the tail pins of the microstrip connector 200, thereby achieving effective fixation.

[0062] The principle is that the bonding tooling 300 is arranged between the cavity housing 100 and the tail pins of the microstrip connector 200. By wrapping the tail pins of the microstrip connector 200 that were originally exposed in the cavity housing 100 with the fixed section 310, protection and support can be provided for the tail pins of the microstrip connector 200. During the gold wire bonding process, it can protect the tail pins of the microstrip connector 200 from vibrating under the external force of the bonding machine, and enable the bonding machine tool head to stably apply pressure on the end surface of the tail pins of the microstrip connector 200, thereby achieving a good bonding effect.

[0063] It can be understood that the bonding tooling 300 of the present invention needs to be customized and used according to the actual size of the microstrip connector 200, and is applicable to multiple series and various types of microstrip connectors 200, such as not limited to radio frequency coaxial connectors, and can also be extended to applications such as micro miniature connectors, bead connectors, and pin connectors, and is not limited to semi-automatic or manual bonding machine equipment.

[0064] In addition, the bonding tooling 300 can be set to be single, or multiple bonding toolings 300 can be arranged side by side.

[0065] As Figure 9 and Figure 10 shown, Figure 9 FIG. is a schematic structural diagram of another connector gold wire bonding device provided by an embodiment of the present invention; Figure 10 is provided by an embodiment of the present invention Figure 9 Schematic diagram of the structure at I in

[0066] In an alternative embodiment, multiple bonding toolings 300 are arranged side by side as a whole for batch wrapping and fixing of the tail pins of multiple rows of microstrip connectors 200.

[0067] Specifically, according to the structure of the cavity housing 100 and the bonding requirements of the microstrip connector 200, multiple bonding toolings 300 can be arranged side by side to form a combined arrangement clamping tooling or a multi-connected clamping tooling. When in use, the bonding tooling 300 arranged side by side as a whole is used in cooperation with the cavity housing 100 and the tail pins of multiple microstrip connectors 200 to support the synchronous fixing of the tail pins of multiple rows of microstrip connectors 200, significantly improving the process efficiency in high-density bonding scenarios.

[0068] The connector gold wire bonding device provided by the present invention actively controls the suspended deformation of the tail pins of the microstrip connector through a physical constraint mechanism, and realizes dynamic support for the tail pins of the microstrip connector with a high aspect ratio from a structural level through the cooperative design of the detachable bonding tooling and the cavity housing. The bonding tooling wraps and fixes the tail pins of the microstrip connector in a transitional or interference fit manner, forming a stable mechanical transmission path during the bonding process to offset the vibration and bending deformation caused by the ultrasonic impact load.

[0069] It should be noted that in this text, relative terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant is intended to cover non-exclusive inclusion, so that an article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the article or device comprising said element. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The orientation or positional relationship indicated by "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0070] The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without departing from the concept of the present invention, several simple deductions or substitutions can be made, and all should be regarded as belonging to the protection scope of the present invention.

Claims

1. A connector gold wire bonding method, characterized in that: include: Clean the area to be bonded and solder the microstrip connector to the cavity housing; Wrapping and fixing the tail pin of the microstrip connector, and performing gold wire bonding on the tail pin of the microstrip connector and the PCB board; The tail pin of the microstrip connector is unwrapped and fixed, the bonding area is cleaned, and the gold wire bonding is completed.

2. The connector gold wire bonding method according to claim 1, characterized in that: Cleaning the area to be bonded and welding the microstrip connector to the cavity housing includes: The cavity housing and the tail pins of the microstrip connector are cleaned with a degreasing cleaning agent, and baked at a temperature of 240° C. for at least 5 minutes after cleaning; After baking, the microstrip connector is soldered to the cavity housing by reflow soldering, and the temperature range of the reflow soldering is 240-260°C.

3. The connector gold wire bonding method according to claim 1, characterized in that: The tail pin of the microstrip connector is wrapped and fixed, and includes: preparing a bonding tool according to the bonding area between the cavity housing and the microstrip connector; Press-fit the bonding fixture into the cavity shell so that the upper end surface of the bonding fixture matching the cavity shell is not higher than the upper surface of the cavity shell; The tail pin of the microstrip connector is wrapped and fixed by the bonding tool.

4. The connector gold wire bonding method according to claim 3, characterized in that: The bonding tool comprises a fixed section and an extension section which are connected to each other. The fixed section is press-fitted with the cavity shell and wraps and fixes the tail pin of the microstrip connector; the extension section extends out of the cavity shell.

5. The connector gold wire bonding method according to claim 1, characterized in that: Performing gold wire bonding on the tail pin of the microstrip connector and the PCB board includes: The bonding parameters are set, and the tail pin of the microstrip connector is gold-wire bonded to the PCB board according to the preset bonding parameters, wherein the bonding parameters are: the bonding pressure range is 13~30g, the bonding power range is 140~170mW, the bonding time range is 50~80ms, and the ultrasonic energy parameter is 130LSB.

6. The connector gold wire bonding method according to claim 4, characterized in that: Unwrapping and fixing the tail pin of the microstrip connector and cleaning the bonding area include: The bonding tool is taken out through the extension section, and the bonding area is cleaned with anhydrous ethanol to ensure that there is no residue in the bonding area and the cavity shell.

7. A connector gold wire bonding device, characterized in that: The connector gold wire bonding method according to any one of claims 1 to 6, the device comprises: a cavity housing, a microstrip connector and a bonding tool, wherein: The plurality of microstrip connectors are fixedly connected to the cavity shell; the cavity shell is provided with a plurality of bonding holes, the tail pins of the plurality of microstrip connectors extend out from the plurality of bonding holes in a one-to-one correspondence, and the plurality of bonding fixtures are detachably connected to the tail pins of the plurality of microstrip connectors in a one-to-one correspondence; Each of the bonding tools comprises a fixing section and an extension section which are connected to each other. The fixing section is arranged in the bonding hole and is transitionally matched or tightly matched with the tail pin of the microstrip connector.

8. The connector gold wire bonding device according to claim 7, characterized in that: The ratio between the length and the diameter of the tail pin of the microstrip connector is greater than or equal to 2.

9. The connector gold wire bonding device according to claim 7, characterized in that: The fixing section and the extending section are both made of flexible non-metallic materials. An open positioning hole is provided on one side of the fixing section. The opening angle range of the positioning hole is 10-12°.

10. The connector gold wire bonding device according to claim 7, characterized in that: A plurality of the bonding fixtures are arranged in parallel as a whole, and are used for batch wrapping and fixing of tail pins of multiple rows of the microstrip connectors.

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