Optical network equipment

Abstract

The invention provides optical network equipment, and belongs to the technical field of communication. The optical network device is applied to an FTTH or FTTR system architecture. The optical network equipment comprises a shell, a circuit board assembly, an optical port connector, a photoelectric converter, a main chip and a first network port connector. The circuit board assembly is located in the shell and comprises at least three layers of circuit boards. The optical port connector, the photoelectric converter, the main chip and the first network port connector are located on a circuit board, and at least one circuit board is arranged between the circuit board where the photoelectric converter is located and the circuit board where the main chip is located. Therefore, the distance between the photoelectric converter and the main chip is far, and the photoelectric converter and the main chip are separated by the circuit board, so that the influence of heat emitted by the main chip on the photoelectric converter is reduced, and the reliability of the optical network equipment is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technologies, and particularly to an optical network device. Background Art

[0002] An optical network device, such as an optical network unit (ONU) or an optical network terminal (ONT), includes an optical-electric converter and a main chip. The optical-electric converter is used for optical-electric conversion. The main chip is used for receiving and processing the electrical signals sent by the optical-electric converter, and sending electrical signals to the optical-electric converter.

[0003] During the operation of the ONU, the main chip will emit a large amount of heat, and the optical-electric converter is a heat-sensitive component. Therefore, the heat emitted by the main chip will affect the optical-electric converter, and even cause the optical-electric converter to fail. Summary of the Invention

[0004] The present disclosure provides an optical network device. The main chip and the optical-electric converter of the optical network device are separated by a circuit board, reducing the influence of the heat emitted by the main chip on the optical-electric converter. The technical solution of the optical network device is as follows.

[0005] The present disclosure provides an optical network device. The optical network device includes a housing, a circuit board assembly, an optical port connector, an optical-electric converter, a main chip, and a first network port connector. The circuit board assembly is located inside the housing, and the circuit board assembly includes at least three circuit boards. The optical port connector, the optical-electric converter, the main chip, and the first network port connector are located on the circuit board, and there is at least one circuit board between the circuit board where the optical-electric converter is located and the circuit board where the main chip is located. The optical port connector is optically connected to the optical-electric converter, and the main chip is electrically connected to the optical-electric converter and the first network port connector respectively.

[0006] The technical solution provided by the present disclosure is such that by setting at least one circuit board between the circuit board where the optical-electric converter is located and the circuit board where the main chip is located, the distance between the optical-electric converter and the main chip is relatively far, and they are separated by at least one circuit board. In this way, the heat conduction rate between the main chip and the optical-electric converter is low, reducing the influence of the heat emitted by the main chip on the optical-electric converter, and improving the reliability of the optical-electric converter and the optical network device.

[0007] In one implementation, the circuit board assembly includes a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board that are stacked in sequence. The fourth circuit board is adjacent to the panel of the housing. The optical transceiver is located on the first circuit board. The main chip is located on the third circuit board. The first network port connector is located on the fourth circuit board and is exposed on the panel. Among them, the optical transceiver and the main chip are separated by the second circuit board, so that the heat conduction rate between the main chip and the optical transceiver is relatively low.

[0008] In one implementation, the optical network device further includes a power interface connector and a power management circuit. The power interface connector and the power management circuit are located on the second circuit board. The power management circuit is configured to process the electrical energy input by the power interface connector and then supply power to the optical transceiver and the main chip. Among them, the power management circuit includes at least one of a protection circuit, a soft start circuit, and a filtering circuit. The second circuit board can also be regarded as a power supply board, and the power supply board separates the optical transceiver and the main chip.

[0009] In one implementation, the optical network device further includes a transformer. The transformer is located on the first circuit board. The input end of the transformer is connected to the power management circuit, and the output ends of the transformer are respectively connected to the optical transceiver and the main chip. The transformer is configured to step down the electrical energy output by the power management circuit and then supply power to the optical transceiver and the main chip. Among them, the transformer can be a 56V - 12V transformer.

[0010] In one implementation, the optical network device further includes an Ethernet physical layer chip and a second network port connector. The Ethernet physical layer chip and the second network port connector are located on the first circuit board, and the Ethernet physical layer chip is electrically connected to the main chip and the second network port connector respectively. Among them, the transmission rates of the first network port connector and the second network port connector can be different.

[0011] In one implementation, the circuit board assembly further includes a first electrical connector, a second electrical connector, and a third electrical connector. The first circuit board and the second circuit board are electrically connected through the first electrical connector, the second circuit board and the third circuit board are electrically connected through the second electrical connector, and the third circuit board and the fourth circuit board are electrically connected through the third electrical connector. Among them, at least one of the first electrical connector and the second electrical connector is a flexible board, and the flexible board has low transmission loss.

[0012] The technical solution provided by the present disclosure separates the optical - electrical converter and the main chip by the second circuit board, reducing the influence of the heat generated by the main chip on the optical - electrical converter. However, this will make the signal transmission path between the optical - electrical converter and the main chip relatively long. The present disclosure sets at least one of the first electrical connector and the second electrical connector as a flexible board, so that the signal transmission path between the optical - electrical converter and the main chip passes through at least one flexible board. Since the transmission loss of the flexible board is low, the reliability of signal transmission between the optical - electrical converter and the main chip can be improved. In addition, the flexible board is small in volume and does not require screws for fixation, saving space inside the optical network device.

[0013] In one implementation, the first electrical connector and the third electrical connector are flexible boards, and the second electrical connector is a board - to - board connector. Among them, the first circuit board, the second circuit board, and the first electrical connector can be integrally formed. Then, the first circuit board and the second circuit board are folded in half so that the first circuit board and the second circuit board are arranged in a stacked manner. The third circuit board, the fourth circuit board, and the third electrical connector can be integrally formed. Then, the third circuit board and the fourth circuit board are folded in half so that the third circuit board and the fourth circuit board are arranged in a stacked manner.

[0014] In one implementation, the circuit board assembly further includes a plurality of male - female studs, which are used to fix the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board inside the housing. Among them, male - female studs are provided between the first circuit board and the bottom wall of the housing, between the first circuit board and the second circuit board, between the second circuit board and the third circuit board, and between the third circuit board and the fourth circuit board. In this way, the male - female studs can support the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board, so that when each circuit board is pressed, the displacement of the circuit board is small, and the upper - layer circuit board will not squeeze the electrical components on the lower - layer circuit board, improving the reliability of the optical network device.

[0015] In one implementation, along the direction from the bottom wall to the panel, the inside of the housing sequentially includes a first accommodation part and a second accommodation part, and there is a step surface between the first accommodation part and the second accommodation part. The first circuit board, the second circuit board, and the third circuit board are located in the first accommodation part, and the fourth circuit board is located in the second accommodation part and abuts against the step surface. In this way, the male - female studs and the step surface jointly support the fourth circuit board, so that when the fourth circuit board is under pressure, it is less likely to move towards the third circuit board, and the fourth circuit board is less likely to press down the electrical components on the third circuit board, further improving the reliability of the optical network device. And because the step surface supports the fourth circuit board, it is beneficial to reduce the number of male - female studs used to support the fourth circuit board, thereby reducing the number of mounting holes for the male - female studs on the fourth circuit board. With the reduction of the number of mounting holes, the effective device layout area on the fourth circuit board is increased.

[0016] In one implementation, there are at most two male-female studs between the third circuit board and the fourth circuit board. In this way, there are at most two mounting holes corresponding to the male-female studs on the fourth circuit board, so that the effective device layout area on the fourth circuit board is relatively large.

[0017] In one implementation, the circuit board assembly further includes a heat pipe, which is located between the second circuit board and the third circuit board and is thermally connected to the second circuit board and the third circuit board respectively. In this way, the heat pipe can equalize the temperature of the second circuit board and the third circuit board, which is beneficial to the heat dissipation of the second circuit board and the third circuit board.

[0018] In one implementation, the male-female stud between the second circuit board and the third circuit board passes through the heat pipe. In this way, the heat on the heat pipe can be conducted to the housing through the male-female stud, which is beneficial to improving the heat dissipation efficiency of the heat pipe.

[0019] In one implementation, the housing includes a bottom case assembly and a panel. The bottom case assembly includes a bottom wall, which is disposed opposite to the panel. The circuit board assembly includes a first circuit board, which is adjacent to the bottom wall. The optical-electric converter is located on the side of the first circuit board facing the bottom wall and is thermally connected to the bottom case assembly. Among them, the optical-electric converter being thermally connected to the bottom case assembly can be that the bottom case assembly abuts against the optical-electric converter, or a heat-conducting pad is provided between the bottom case assembly and the optical-electric converter, with one side of the heat-conducting pad fitting the bottom case assembly and the other side fitting the optical-electric converter.

[0020] In one implementation, the bottom case assembly includes a bottom case and a first radiator. The wall of the bottom case opposite to the first circuit board includes a first opening, which is disposed opposite to the optical-electric converter. The first radiator includes a first plate body and a first boss. The first plate body is located outside the bottom case, and the first boss passes through the first opening and is thermally connected to the optical-electric converter.

[0021] Among them, the first boss being thermally connected to the optical-electric converter can be that the first boss abuts against the optical-electric converter, or a heat-conducting pad is provided between the first boss and the optical-electric converter, with one side of the heat-conducting pad fitting the first boss and the other side fitting the optical-electric converter.

[0022] The technical solution provided by the present disclosure, by providing a first opening on the housing, setting the first boss of the first radiator to pass through the first opening and be thermally connected to the optical-electric converter, enables the optical-electric converter to dissipate heat through an independent radiator, reduces the influence of the heat dissipated by other heat-generating devices on the optical-electric converter, and improves the heat dissipation efficiency and reliability of the optical-electric converter.

[0023] In one implementation, a plurality of bumps are provided between the bottom case and the first plate body. One end of the bump abuts against the bottom case, and the other end abuts against the first plate body, so that there is a gap between the bottom case and the first plate body.

[0024] In the technical solution provided by the present disclosure, by providing a gap between the first plate body and the bottom case, the heat conduction rate between the bottom case and the first plate body is reduced. In this way, after the heat of other heat-generating components (such as the main chip) in the optical network device is conducted to the bottom case, it is not easy to be conducted from the bottom case to the first heat sink, further reducing the influence of the heat of the main chip on the optical-electricity converter and improving the reliability of the optical-electricity converter.

[0025] In one implementation, one side of the first circuit board facing the bottom wall further includes a heat-generating component, and the wall of the bottom case opposite to the first circuit board further includes a second opening, and the second opening is disposed opposite to the heat-generating component. The bottom case assembly further includes a second heat sink, and the second heat sink includes a second plate body and a second boss. The second plate body is located outside the bottom case, the second boss passes through the second opening, and is thermally connected to the heat-generating component. Wherein, the heat-generating component is a transformer or an Ethernet physical layer chip.

[0026] In the technical solution provided by the present disclosure, by providing the second boss of the second heat sink to abut against the heat-generating components on the first circuit board other than the optical-electricity converter, the heat dissipation efficiency of these heat-generating components is improved. Moreover, the heat-generating components dissipate heat through the second heat sink instead of sharing the first heat sink with the optical-electricity converter, reducing the influence of the heat dissipated by the heat-generating components on the optical-electricity converter and improving the reliability of the optical-electricity converter.

[0027] In one implementation, there is a gap between the first plate body and the bottom case, the second plate body is attached to the bottom case, and the thickness of the second plate body is greater than that of the first plate body, so that the bottom walls of the first plate body and the second plate body are flush.

[0028] In one implementation, the first heat sink further includes a shielding enclosure, and the shielding enclosure passes through the first opening and surrounds the optical-electricity converter. In this way, the first heat sink can not only dissipate heat from the optical-electricity converter, but also achieve electromagnetic shielding of the optical-electricity converter.

[0029] In one implementation, the optical-electricity converter includes a bidirectional optical subassembly (BOSA), and the BOSA is disposed on the first circuit board in a BOSA on board (BOB) manner. In this way, compared with using a complete optical module as the optical-electricity converter, the BOSA is more easily cooled.

[0030] In one implementation, the main chip is thermally connected to the panel. In this way, the heat of the main chip is conducted to the panel, while the heat of the optical-electricity converter is conducted to the bottom wall of the bottom case assembly, and the distance between the bottom wall and the panel is relatively far. Thus, the heat conduction rate of the heat of the main chip to the optical-electricity converter is reduced, and the influence of the heat dissipated by the main chip on the optical-electricity converter is reduced.

[0031] In one implementation, the fourth circuit board includes a third opening which is disposed opposite to the main chip. The panel includes a third boss which is thermally connected to the main chip. Wherein, the third opening is used to avoid the third boss or the thermal pad between the third boss and the main chip. Description of the Drawings

[0032] Figure 1 is a schematic diagram of the system architecture of FTTH;

[0033] Figure 2 is a schematic diagram of a home network system;

[0034] Figure 3 is a schematic diagram of another home network system;

[0035] Figure 4 is a schematic diagram of an optical network device provided by an embodiment of the present disclosure;

[0036] Figure 5 is a schematic diagram of an optical network device provided by an embodiment of the present disclosure;

[0037] Figure 6 is an exploded view of an optical network device provided by an embodiment of the present disclosure;

[0038] Figure 7 is a schematic diagram of a circuit board assembly and related devices provided by an embodiment of the present disclosure;

[0039] Figure 8 is a schematic diagram of a first circuit board and related devices provided by an embodiment of the present disclosure;

[0040] Figure 9 is a schematic diagram of a second circuit board and related devices provided by an embodiment of the present disclosure;

[0041] Figure 10 is a schematic diagram of a third circuit board and related devices provided by an embodiment of the present disclosure;

[0042] Figure 11 is a schematic diagram of a fourth circuit board and related devices provided by an embodiment of the present disclosure;

[0043] Figure 12 is a schematic diagram of a circuit board assembly and related devices provided by an embodiment of the present disclosure;

[0044] Figure 13 is a schematic diagram of the internal structure of an optical network device provided by an embodiment of the present disclosure;

[0045] Figure 14 is an exploded view of a circuit board assembly provided by an embodiment of the present disclosure;

[0046] Figure 15 Schematic diagrams of a second circuit board, a third circuit board, and a heat pipe provided by an embodiment of the present disclosure;

[0047] Figure 16 Schematic diagram of a heat pipe provided by an embodiment of the present disclosure;

[0048] Figure 17 Schematic diagram of the bottom of an optical network device provided by an embodiment of the present disclosure;

[0049] Figure 18 Schematic diagrams of a bottom case and a first heat sink provided by an embodiment of the present disclosure;

[0050] Figure 19 Schematic diagram of a first heat sink provided by an embodiment of the present disclosure;

[0051] Figure 20 Schematic diagrams of a first heat sink and an optical and electrical converter provided by an embodiment of the present disclosure;

[0052] Figure 21 Schematic diagram of a partial structure of an optical network device provided by an embodiment of the present disclosure;

[0053] Figure 22 Schematic diagram of another first heat sink provided by an embodiment of the present disclosure;

[0054] Figure 23 Schematic diagrams of another first heat sink and an optical and electrical converter provided by an embodiment of the present disclosure;

[0055] Figure 24 Schematic diagrams of a bottom case, a first heat sink, and a second heat sink provided by an embodiment of the present disclosure;

[0056] Figure 25 Schematic diagram of a second heat sink provided by an embodiment of the present disclosure;

[0057] Figure 26 Schematic diagram of a panel provided by an embodiment of the present disclosure;

[0058] Figure 27 Schematic diagram of a heat dissipation method of a main chip provided by an embodiment of the present disclosure.

[0059] Legend Explanation

[0060] 1. Housing, 110. First accommodation part, 120. Second accommodation part, 130. Step surface, 101. Bottom shell assembly, 1011. Bottom shell, 10110. Bump, 10111. First opening, 10112. Second opening, 1012. First radiator, 12120. Gap, 10121. First plate body, 10122. First boss, 10123. Shielding enclosure, 10124. Opening, 1013. Second radiator, 10131. Second plate body, 10132. Second boss, 102. Panel, 1021. Third boss;

[0061] 2. Circuit board assembly, 21. First circuit board, 22. Second circuit board, 23. Third circuit board, 24. Fourth circuit board, 241. Third opening, 25. First electrical connector, 26. Second electrical connector, 27. Third electrical connector, 28. Male-female stud, 29. Heat pipe, 291. First support leg, 292. Second support leg, 293. Fourth opening;

[0062] 3. Optical port connector;

[0063] 4. Optical-electric converter;

[0064] 5. Main chip;

[0065] 6. First network port connector;

[0066] 7. Power interface connector;

[0067] 8. Power management circuit, 81. Protection circuit, 82. Soft start circuit, 83. Filter circuit;

[0068] 9. Transformer;

[0069] 10. Ethernet physical layer chip;

[0070] 11. Second network port connector;

[0071] 12. Thermal pad. Detailed implementation manners

[0072] Fiber to the home (FTTH) means that the operator's network directly enters the home through an optical distribution network (ODN) and is connected to an optical network unit (ONU) installed indoors. Figure 1 Shows a schematic diagram of the system architecture of an FTTH. As Figure 1As shown in the figure, the FTTH system includes an optical line terminal (OLT), an ODN, and an ONU. The OLT is located in the central computer room and is connected to a switch. The OLT is connected to the ONU indoors through the ODN. Among them, the ODN includes an optical splitter, a backbone optical fiber connected between the optical splitter and the OLT, and a branch optical fiber connected between the optical splitter and the ONU. The OLT, the ONU, and the ODN located between the OLT and the ONU form a passive optical network (PON). The ONU can also be replaced by an optical network terminal (ONT).

[0073] After fiber is connected to households, there are two technical solutions in total to solve the problem of signal coverage in each room. As Figure 2 shown, the first technical solution is that the ONU includes multiple network port connectors, and the multiple network port connectors are respectively connected to the terminal devices in each room through multiple network cables. The terminal device can be a computer, a camera, a wireless access point (AP), etc.

[0074] As Figure 3 shown, the second technical solution is to use the ONU in Figure 1 as the main ONU, and set slave ONUs in each room. The main ONU is respectively connected to the slave ONUs in each room through multiple optical fibers. The slave ONU includes a network port connector, and the network port connector is connected to the terminal device in the room through a network cable. The terminal device can be a computer, a camera, or an AP, etc. Among them, this technology is called fiber to the room (FTTR).

[0075] The optical network device provided by the embodiments of the present disclosure can be the ONU in Figure 2 or the slave ONU in Figure 3 . Such an ONU includes an optical port connector, a network port connector, an optical - to - electrical converter, and a main chip. The optical port connector is used to connect to the OLT or the main ONU through an optical fiber. The network port connector is used to connect to the terminal device through a network cable. The optical - to - electrical converter is optically connected to the optical port connector, and the main chip is electrically connected to the optical - to - electrical converter and the network port connector respectively.

[0076] When transmitting a downstream signal, the optical - electrical converter receives the downstream optical signal through the optical port connector, converts the downstream optical signal into a downstream electrical signal, and sends the downstream electrical signal to the main chip. After the main chip processes the downstream electrical signal, it sends the signal to the terminal device through the network port connector. When transmitting an upstream signal, the main chip receives the upstream electrical signal sent by the terminal device through the network port connector, processes the upstream electrical signal, and then sends it to the optical - electrical converter. The optical - electrical converter converts the upstream electrical signal into an upstream optical signal and sends the upstream optical signal through the optical port connector.

[0077] During the operation of the ONU, the main chip emits a large amount of heat, and the optical - electrical converter is a heat - sensitive component. Therefore, the heat emitted by the main chip will affect the optical - electrical converter and even cause the optical - electrical converter to fail. Among them, this technical problem is particularly serious in ONUs with small device size, high heat density, and limited installation space. For example, in an ONU that meets the international M45 standard, the size of the panel of this type of ONU is 45mm×Nmm, where N is an integer multiple of 45, such as 45 or 90.

[0078] In view of the above - mentioned technical problems, the embodiments of the present disclosure provide an optical network device, which can be the above - mentioned ONU or ONT. Figure 4 and Figure 5 shows the external shape diagram of the optical network device. Figure 6 shows the exploded view of the optical network device. As Figure 6 shown, the optical network device includes a housing 1 (including a bottom - case assembly 101 and a panel 102), a circuit - board assembly 2, and related devices located on the circuit - board assembly 2. Among them, the circuit - board assembly 2 includes at least three layers of circuit boards. Exemplarily, as Figure 6 shown, the circuit - board assembly 2 includes four layers of circuit boards arranged in a stacked manner.

[0079] Figure 7 shows the schematic diagram of the circuit - board assembly 2 and related devices. As Figure 7As shown in the figure, the optical network device includes an optical port connector 3, an optical-electric converter 4, a main chip 5, and a first network port connector 6. Among them, the optical port connector 3 is optically connected to the optical-electric converter 4, and the main chip 5 is electrically connected to the optical-electric converter 4 and the first network port connector 6 respectively. When transmitting a downstream signal, the optical-electric converter 4 receives a downstream optical signal through the optical port connector 3, converts the downstream optical signal into a downstream electrical signal, and sends the downstream electrical signal to the main chip 5. After processing the downstream electrical signal, the main chip 5 sends it out through the first network port connector 6. When transmitting an upstream signal, the main chip 5 receives an upstream electrical signal through the first network port connector 6, processes the upstream electrical signal, and sends it to the optical-electric converter 4. The optical-electric converter 4 converts the upstream electrical signal into an upstream optical signal and sends it out through the optical port connector 3. The main chip 5 can also be referred to as a system-on-a-chip (SOC), and the main chip 5 can integrate a MAC function.

[0080] The optical port connector 3, the optical-electric converter 4, the main chip 5, and the first network port connector 6 are all disposed on the circuit board of the circuit board assembly 2. The optical port connector 3, the optical-electric converter 4, the main chip 5, and the first network port connector 6 can be disposed on any circuit board of the circuit board assembly 2.

[0081] In some examples, the circuit board where the optical-electric converter 4 is located is different from the circuit board where the main chip 5 is located. For example, there is at least one circuit board between the circuit board where the optical-electric converter 4 is located and the circuit board where the main chip 5 is located. In this way, the distance between the optical-electric converter 4 and the main chip 5 is relatively far, and they are separated by at least one circuit board (such as Figure 7 the second circuit board 22). This makes the heat conduction rate between the main chip 5 and the optical-electric converter 4 relatively low, reduces the influence of the heat dissipated by the main chip 5 on the optical-electric converter 4, and improves the reliability of the optical-electric converter 4 and the optical network device. After actual measurement, compared with setting the main chip 5 and the optical-electric converter 4 on the same circuit board, adopting the technical solution provided by the embodiment of the present disclosure can make the temperatures of the main chip 5 and the optical-electric converter 4 drop by at least 5°C.

[0082] In some examples, as Figure 7 shown, the main chip 5 is closer to the panel 102 relative to the optical-electric converter 4. Exemplarily, the main chip 5 dissipates heat through the panel 102, and the optical-electric converter 4 dissipates heat by attaching to the bottom wall of the housing 1. The panel 102 and the bottom wall are relatively far apart, reducing the heat conduction rate between the main chip 5 and the optical-electric converter 4.

[0083] In some examples, the optical-electric converter 4 is located on a circuit board adjacent to the bottom wall, and the main chip 5 is located on any other circuit board.

[0084] In some examples, as Figure 7As shown, the circuit board assembly 2 includes a first circuit board 21, a second circuit board 22, a third circuit board 23, and a fourth circuit board 24 that are stacked in sequence, and the fourth circuit board 24 is adjacent to the panel 102 of the housing 1. Among them, the optical - electrical converter 4 is located on the first circuit board 21, and the main chip 5 is located on the third circuit board 23. The first network port connector 6 is located on the fourth circuit board 24 and is exposed on the panel 102. In this way, the optical - electrical converter 4 and the main chip 5 are separated by the second circuit board 22. In some examples, the second circuit board 22 is a power supply board, and the power supply board is used to introduce power and supply power to devices such as the optical - electrical converter 4 and the main chip 5.

[0085] It should be noted that the circuit board assembly 2 may also include a greater or smaller number of circuit boards. For example, the circuit board assembly 2 includes three - layer circuit boards or five - layer circuit boards, etc. Below, taking the circuit board assembly 2 including the first circuit board 21, the second circuit board 22, the third circuit board 23, and the fourth circuit board 24 as an example, the devices arranged on each of the above - mentioned circuit boards will be described.

[0086] Figure 8 A schematic diagram of a first circuit board and related devices is shown. In some examples, as Figure 8 shown, an optical port connector 3 and an optical - electrical converter 4 are provided on the first circuit board 21, and the optical port connector 3 is optically connected to the optical - electrical converter 4.

[0087] In some examples, as Figure 8 shown, the optical - electrical converter 4 includes a bidirectional optical sub - assembly (BOSA), and the BOSA is arranged on the first circuit board 21 in the form of BOSA on board (BOB). In this way, compared with using a complete optical module as the optical - electrical converter 4, the BOSA is more likely to dissipate heat. The heat dissipation method of the BOSA will be described later.

[0088] In some examples, as Figure 8 shown, a transformer 9 is also provided on the first circuit board 21. The input end of the transformer 9 is connected to the power supply board (the second circuit board 22), and the output ends of the transformer 9 are respectively connected to the optical - electrical converter 4 and the main chip 5. The transformer 9 is used to step down the electric energy output by the power supply board and supply power to the optical - electrical converter 4 and the main chip 5. Among them, the transformer 9 can be a 56V - to - 12V transformer.

[0089] In some examples, as Figure 8As shown, an Ethernet physical layer chip 10 and a second network port connector 11 are further provided on the first circuit board 21. The Ethernet physical layer chip 10 is electrically connected to the main chip 5 and the second network port connector 11 respectively. Among them, the rates of the second network port connector 11 and the first network port connector 6 are different. In some examples, the rate of the first network port connector 6 is GE, and the rate of the second network port connector 11 is 10GE. The Ethernet physical layer chip can also be called a PHY (physical layer chip) chip.

[0090] Figure 9 A schematic diagram of a second circuit board and related devices is shown. In some examples, as Figure 9 shown, the optical network device further includes a power interface connector 7 and a power management circuit 8. The power interface connector 7 and the power management circuit 8 are located on the second circuit board 22. The power management circuit 8 is used to process the electric energy input by the power interface connector 7 and then supply power to the optical and electrical converter 4 and the main chip 5. Among them, the power management circuit 8 includes at least one of a protection circuit 81, a soft start circuit 82, and a filtering circuit 83. Exemplarily, as Figure 9 shown, the power management circuit 8 includes a protection circuit 81, a soft start circuit 82, and a filtering circuit 83 connected in sequence. Among them, the protection circuit 81 is electrically connected to the power interface connector 7, and the filtering circuit 83 can be electrically connected to the transformer 9. It should be noted that, in some examples, the transformer 9 is provided on the second circuit board 22.

[0091] Figure 10 A schematic diagram of a third circuit board and related devices is shown. In some examples, as Figure 10 shown, a main chip 5 and related circuits matching the main chip 5, such as a memory and a transformer (not shown in the figure), etc., are provided on the third circuit board 23. Among them, the transformer can be used to receive the electric energy output by the transformer 9 on the first circuit board 21, step it down and then output it to supply power to the main chip 5. The transformer can be a 12V - 3.3V transformer, a 3.3V - 0.8V transformer, etc.

[0092] Figure 11 A schematic diagram of a fourth circuit board and related devices is shown. In some examples, as Figure 11 shown, a first network port connector 6 is provided on the fourth circuit board 24. Among them, there can be multiple first network port connectors 6, for example, four.

[0093] Next, an exemplary description of the electrical connection methods of the above-mentioned respective circuit boards will be given. As Figure 12As shown, the first circuit board 21 and the second circuit board 22 are electrically connected through a first electrical connector 25, the second circuit board 22 and the third circuit board 23 are electrically connected through a second electrical connector 26, and the third circuit board 23 and the fourth circuit board 24 are electrically connected through a third electrical connector 27. Thus, the first circuit board 21, the second circuit board 22, the third circuit board 23, and the fourth circuit board 24 are electrically connected in sequence.

[0094] The embodiments of the present disclosure do not limit the types of the above-mentioned respective electrical connectors. The electrical connector can be a flexible board or a board-to-board connector. In some examples, at least one of the first electrical connector 25 and the second electrical connector 26 is a flexible board. Among them, the transmission loss of the flexible board is lower than that of the board-to-board connector.

[0095] The technical solution provided by the embodiments of the present disclosure separates the optical-electric converter 4 and the main chip 5 by the second circuit board 22, reducing the influence of the heat generated by the main chip 5 on the optical-electric converter 4, but making the signal transmission path between the optical-electric converter 4 and the main chip 5 relatively long. Among them, the transmission path includes the first circuit board 21, the first electrical connector 25, the second circuit board 22, the second electrical connector 26, and the third circuit board 23. By setting at least one of the first electrical connector 25 and the second electrical connector 26 as a flexible board, the signal transmission path between the optical-electric converter 4 and the main chip 5 passes through at least one flexible board, and the transmission loss of the flexible board is low. Therefore, the reliability of signal transmission between the optical-electric converter 4 and the main chip 5 can be improved. In addition, the flexible board has a small volume and does not require screws for fixation, saving space inside the optical network device.

[0096] In some examples, as Figure 12 shown, the first electrical connector 25 and the third electrical connector 27 are flexible boards, and the second electrical connector 26 is a board-to-board connector. Among them, the first circuit board 21, the second circuit board 22, and the first electrical connector 25 can be integrally formed. Then, the first circuit board 21 and the second circuit board 22 are folded in half to form Figure 12 the stacked form shown. The third circuit board 23, the fourth circuit board 24, and the third electrical connector 27 can be integrally formed. Then, the third circuit board 23 and the fourth circuit board 24 are folded in half and form Figure 12 the stacked form shown.

[0097] Next, the fixing methods of the above-mentioned respective circuit boards will be exemplarily described. In some examples, as Figure 12As shown, the circuit board assembly 2 further includes a plurality of male-female studs 28, which are used to fix the first circuit board 21, the second circuit board 22, the third circuit board 23, and the fourth circuit board 24 inside the housing 1. Among them, the male-female stud 28 refers to a stud with external threads at one end and internal threads at the other end. In addition to the male-female studs 28, the circuit board assembly 2 may further include screws, and the screws cooperate with the male-female studs 28 to fix each layer of the circuit board.

[0098] In some examples, as Figure 12 shown, male-female studs 28 are provided between the first circuit board 21 and the bottom wall of the housing 1, between the first circuit board 21 and the second circuit board 22, between the second circuit board 22 and the third circuit board 23, and between the third circuit board 23 and the fourth circuit board 24. In this way, the male-female studs 28 can support the first circuit board 21, the second circuit board 22, the third circuit board 23, and the fourth circuit board 24, so that when each circuit board is pressed, the displacement of the circuit board is small, and the upper circuit board will not squeeze the components on the lower circuit board, improving the reliability of the optical network device.

[0099] It should be noted that the circuit board assembly 2 may further include circuit boards with other numbers of layers, and male-female studs 28 are provided between adjacent two circuit boards. Moreover, male-female studs 28 are also provided between the bottom wall and the circuit board.

[0100] In addition to providing male-female studs 28 to support the circuit board, in some other examples, as Figure 13 shown, along the direction from the bottom wall to the panel 102, the inside of the housing 1 sequentially includes a first accommodating portion 110 and a second accommodating portion 120, and there is a step surface 130 between the first accommodating portion 110 and the second accommodating portion 120. The first circuit board 21, the second circuit board 22, and the third circuit board 23 are located in the first accommodating portion 110, and the fourth circuit board 24 is located in the second accommodating portion 120 and abuts against the step surface 130. In this way, the fourth circuit board 24 is supported by the male-female studs 28 and the step surface 130 together, so that when the fourth circuit board 24 is under pressure, it is less likely to move towards the third circuit board 23, and the fourth circuit board 24 is less likely to press down on the components on the third circuit board 23, further improving the reliability of the optical network device.

[0101] Moreover, since the step surface 130 can support the fourth circuit board 24, it is also beneficial to reduce the number of male-female studs 28 used to support the fourth circuit board 24, thereby reducing the number of mounting holes corresponding to the male-female studs 28 on the fourth circuit board 24. And with the reduction of the number of mounting holes, the effective device layout area on the fourth circuit board 24 is increased. Exemplarily, as Figure 14 shown, there are at most two male-female studs 28 between the third circuit board 23 and the fourth circuit board 24.

[0102] AsFigure 14 As shown, for other circuit boards not supported by the stepped surface 130, at least three male-female studs 28 are required for support. For example, the first circuit board 21 is supported by three male-female studs 28, the second circuit board 22 is supported by three male-female studs 28, the third circuit board 23 is supported by four male-female studs 28, and the fourth circuit board 24 is supported by two male-female studs 28. It can be seen that the setting of the stepped surface 130 reduces the number of male-female studs 28 supporting the fourth circuit board 24.

[0103] It should be noted that the circuit board assembly 2 may further include circuit boards of other layers. The circuit board adjacent to the panel 102 is located in the second accommodating portion 120 and is supported by the stepped surface 130, and other circuit boards are located in the first accommodating portion 110.

[0104] In some examples, as Figure 13 shown, the interior of the housing 1 includes two stepped surfaces 130, and the two stepped surfaces 130 respectively abut against both sides of the fourth circuit board 24. It should be noted that the edge of the circuit board does not include traces. Therefore, the edge of the circuit board lapping on the stepped surface 130 will not cause a reduction in the effective device layout area of the circuit board.

[0105] In some examples, as Figure 15 shown, the circuit board assembly 2 further includes a heat pipe plate 29. The heat pipe plate 29 is located between the second circuit board 22 and the third circuit board 23 and is thermally connected to the second circuit board 22 and the third circuit board 23 respectively. In this way, the heat pipe plate 29 can equalize the temperature of the second circuit board 22 and the third circuit board 23, thereby improving the heat dissipation efficiency of the second circuit board 22 and the third circuit board 23.

[0106] In some examples, as Figure 15 shown, the male-female stud 28 between the second circuit board 22 and the third circuit board 23 passes through the heat pipe plate 29. In this way, the heat on the heat pipe plate 29 can be conducted to the housing 1 via the male-female stud 28, which is beneficial to improving the heat dissipation efficiency of the heat pipe plate 29.

[0107] In some examples, as Figure 16 shown, the heat pipe plate 29 includes a first support leg 291 and a second support leg 292. Both the first support leg 291 and the second support leg 292 are passed through by the male-female stud 28, and the first support leg 291 is supported by the second circuit board 22, and the second support leg 292 supports the third circuit board 23. Exemplarily, as Figure 16 shown, the first support leg 291 is one, and the second support leg 292 is two.

[0108] In some examples, as Figure 16 shown, the heat pipe plate 29 includes a fourth opening 293, and the fourth opening 293 can be used to avoid components on the second circuit board 22 or the third circuit board 23.

[0109] Next, an exemplary description of the heat dissipation method of the optical and electrical converter 4 will be given. In some examples, as Figure 6 shown, the housing 1 includes a bottom housing assembly 101 and a panel 102. The bottom housing assembly 101 includes a bottom wall, and the bottom wall is disposed opposite to the panel 102. As Figure 7 shown, the circuit board assembly 2 includes a first circuit board 21. The optical and electrical converter 4 is located on one side of the first circuit board 21 facing the bottom wall and is thermally connected to the bottom housing assembly 101. Among them, the optical and electrical converter 4 being thermally connected to the bottom housing assembly 101 may be that the bottom housing assembly 101 abuts against the optical and electrical converter 4, or a heat conduction pad 12 may be provided between the bottom housing assembly 101 and the optical and electrical converter 4. One side of the heat conduction pad 12 abuts against the bottom housing assembly 101, and the other side abuts against the optical and electrical converter 4.

[0110] In some examples, the bottom housing assembly 101 includes a bottom housing 1011, and the optical and electrical converter 4 is thermally connected to the bottom wall of the bottom housing 1011.

[0111] In other examples, as Figure 17 and Figure 18 shown, the bottom housing assembly 101 includes a bottom housing 1011 and a first heat sink 1012. The wall of the bottom housing 1011 opposite to the first circuit board 21 includes a first opening 10111. As Figure 19 shown, the first heat sink 1012 includes a first plate body 10121 and a first boss 10122. The first plate body 10121 is located outside the bottom housing 1011. The first boss 10122 passes through the first opening 10111 and is thermally connected to the optical and electrical converter 4 (such as a BOSA) (as Figure 20 shown). Among them, the first boss 10122 being thermally connected to the optical and electrical converter 4 may be that the first boss 10122 abuts against the optical and electrical converter 4, or a heat conduction pad 12 may be provided between the first boss 10122 and the optical and electrical converter 4. One side of the heat conduction pad 12 abuts against the first boss 10122, and the other side abuts against the optical and electrical converter 4 (as Figure 20 shown).

[0112] The technical solution provided by the embodiments of the present disclosure, by providing the first opening 10111 in the bottom housing 1011 and arranging the first boss 10122 of the first heat sink 1012 to pass through the first opening 10111 and be thermally connected to the optical and electrical converter 4, enables the optical and electrical converter 4 to dissipate heat through an independent heat sink, further reducing the influence of the heat dissipated by other heat generating devices (such as the main chip 5) on the optical and electrical converter 4, and improving the heat dissipation efficiency and reliability of the optical and electrical converter 4.

[0113] In some examples, as Figure 18 and Figure 21As shown, a plurality of bumps 10110 are provided between the bottom case 1011 and the first plate body 10121. One end of the bump 10110 abuts against the bottom case 1011, and the other end abuts against the first plate body 10121, so that there is a gap 10120 between the bottom case 1011 and the first plate body 10121.

[0114] In the technical solution provided by the embodiment of the present disclosure, by providing the gap 10120 between the first plate body 10121 and the bottom case 1011, the heat conduction rate between the bottom case 1011 and the first plate body 10121 is reduced. In this way, after the heat of other heat-generating devices (such as the main chip 5) in the optical network device is conducted to the bottom case 1011, it is not easy to be conducted from the bottom case 1011 to the first heat sink 1012, further reducing the influence of the heat dissipated by other heat-generating devices on the optical-electric converter 4 and improving the reliability of the optical-electric converter 4.

[0115] In some examples, as Figure 18 shown, the bumps 10110 are provided on the bottom case 1011. For example, the bumps 10110 are integrally formed on the outer wall of the bottom case 1011.

[0116] In some examples, as Figure 22 shown, the first heat sink 1012 further includes a shielding enclosure 10123. The shielding enclosure 10123 passes through the first opening 10111 and surrounds the optical-electric converter 4 (as Figure 23 shown). In this way, the first heat sink 1012 can not only dissipate the heat of the optical-electric converter 4, but also achieve electromagnetic shielding of the optical-electric converter 4. In addition, as Figure 22 and Figure 23 shown, the shielding enclosure 10123 includes an opening 10124, and the optical port connector 3 or the optical part of the optical-electric converter 4 passes through the opening 10124.

[0117] In some examples, as Figure 22 shown, the shielding enclosure 10123 surrounds the first boss 10122. Alternatively, the shielding enclosure 10123 is provided on the side of the first boss 10122 facing the optical-electric converter 4.

[0118] In some examples, the surface of the first circuit board 21 facing the bottom wall further includes heat-generating devices. For example, Figure 8 the transformer 9 and the Ethernet physical layer chip 10 in Figure 24 shown. As Figure 25As shown in the figure, the second radiator 1013 includes a second plate body 10131 and a second boss 10132. The second plate body 10131 is located outside the bottom case 1011. The second boss 10132 passes through the second opening 10112 and is thermally connected to the heat-generating device.

[0119] In the technical solution provided by the embodiment of the present disclosure, by setting the second boss 10132 to be thermally connected to the heat-generating devices on the first circuit board 21 except for the optical transceiver 4, the heat dissipation efficiency of these heat-generating devices is improved. Moreover, the heat-generating devices dissipate heat through the second radiator 1013 instead of sharing the first radiator 1012 with the optical transceiver 4, reducing the influence of the heat dissipated by these heat-generating devices on the optical transceiver 4 and improving the reliability of the optical transceiver 4.

[0120] In some examples, as Figure 25 shown, the second radiator 1013 includes three second bosses 10132. One second boss 10132 is used to support the second network port connector 11, one second boss 10132 is used to be thermally connected to the Ethernet physical layer chip 10, and the other second boss 10132 is used to be thermally connected to the transformer 9. Among them, the second boss 10132 being thermally connected to the Ethernet physical layer chip 10 can be that the second boss 10132 is in contact with the Ethernet physical layer chip 10, or a thermal pad 12 is provided between the second boss 10132 and the Ethernet physical layer chip 10. The second boss 10132 being thermally connected to the transformer 9 can be that the second boss 10132 is in contact with the transformer 9, or a thermal pad 12 is provided between the second boss 10132 and the transformer 9.

[0121] In some examples, as Figure 17 shown, there is a gap between the first radiator 1012 and the second radiator 1013. In this way, the heat conduction rate between the first radiator 1012 and the second radiator 1013 is reduced, and further the influence of the heat dissipated by other heat-generating devices on the first circuit board 21 on the optical transceiver 4 is reduced.

[0122] In some examples, as Figure 21 shown, there is a gap 10120 between the first plate body 10121 and the bottom case 1011, and the second plate body 10131 is in contact with the bottom case 1011. Moreover, the thickness of the second plate body 10131 is greater than the thickness of the first plate body 10121. Thus, the bottom walls of the first plate body 10121 and the second plate body 10131 are flush.

[0123] Next, an exemplary description will be given of the heat dissipation method of the main chip 5. In some examples, the main chip 5 is thermally connected to the panel 102. In this way, the heat of the main chip 5 is conducted to the panel 102, while the heat of the optical-electric converter 4 is conducted to the bottom wall of the bottom case assembly 101, and the distance between the bottom wall and the panel 102 is relatively far. Thus, the heat conduction rate of the main chip 5 to the optical-electric converter 4 is reduced, and the influence of the heat dissipated by the main chip 5 on the optical-electric converter 4 is reduced.

[0124] In some examples, as Figure 26 shown, the panel 102 includes a third boss 1021, and the third boss 1021 is thermally connected to the main chip 5. Among them, the third boss 1021 being thermally connected to the main chip 5 may be that the third boss 1021 is in contact with the main chip 5, or a heat-conducting pad 12 is provided between the third boss 1021 and the main chip 5.

[0125] In some examples, for the case where the main chip 5 is disposed on the third circuit board 23. As Figure 27 and Figure 11 shown, the fourth circuit board 24 includes a third opening 241, and the third opening 241 is disposed opposite to the main chip 5. The third opening 241 is used to avoid the third boss 1021 or the heat-conducting pad 12.

[0126] In some other examples, the main chip 5 can also be directly disposed on the fourth circuit board 24, and then the main chip 5 can be directly in contact with the panel 102.

[0127] It should be noted that the optical network device provided by the embodiments of the present disclosure can comply with the M45 standard, and the size of the panel 102 of the optical network device is 45mm×90mm.

[0128] The above are only optional embodiments of the present disclosure, and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. An optical network device, characterized in that: The optical network device comprises a housing (1), a circuit board assembly (2), an optical port connector (3), a photoelectric converter (4), a main chip (5) and a first network port connector (6); The circuit board assembly (2) is located inside the housing (1), and the circuit board assembly (2) comprises at least three layers of circuit boards; The optical port connector (3), the photoelectric converter (4), the main chip (5) and the first network port connector (6) are located on a circuit board, and there is at least one circuit board between the circuit board where the photoelectric converter (4) is located and the circuit board where the main chip (5) is located; The optical port connector (3) is optically connected to the photoelectric converter (4), and the main chip (5) is electrically connected to the photoelectric converter (4) and the first network port connector (6) respectively.

2. The optical network device according to claim 1, characterized in that: The circuit board assembly (2) comprises a first circuit board (21), a second circuit board (22), a third circuit board (23) and a fourth circuit board (24) which are stacked in sequence, and the fourth circuit board (24) is adjacent to the panel (102) of the housing (1); The photoelectric converter (4) is located on the first circuit board (21), the main chip (5) is located on the third circuit board (23), and the first network port connector (6) is located on the fourth circuit board (24) and exposed on the panel (102).

3. The optical network device according to claim 2, characterized in that: The optical network device further comprises a power interface connector (7) and a power management circuit (8), wherein the power interface connector (7) and the power management circuit (8) are located on the second circuit board (22); The power management circuit (8) is used to process the electric energy input by the power interface connector (7) and then supply power to the photoelectric converter (4) and the main chip (5), wherein the power management circuit (8) includes at least one of a protection circuit (81), a slow-start circuit (82) and a filter circuit (83).

4. The optical network device according to claim 3, characterized in that: The optical network device further comprises a transformer (9), wherein the transformer (9) is located on the first circuit board (21); The input end of the transformer (9) is connected to the power management circuit (8), and the output end of the transformer (9) is respectively connected to the photoelectric converter (4) and the main chip (5). The transformer (9) is used to reduce the voltage of the electric energy output by the power management circuit (8) and then supply power to the photoelectric converter (4) and the main chip (5).

5. The optical network device according to any one of claims 2 to 4, characterized in that: The optical network device further comprises an Ethernet physical layer chip (10) and a second network port connector (11); the Ethernet physical layer chip (10) and the second network port connector (11) are located on the first circuit board (21); and the Ethernet physical layer chip (10) is electrically connected to the main chip (5) and the second network port connector (11), respectively.

6. The optical network device according to any one of claims 1 to 5, characterized in that: The circuit board assembly (2) further comprises a first electrical connector (25), a second electrical connector (26) and a third electrical connector (27); The first circuit board (21) and the second circuit board (22) are electrically connected via the first electrical connector (25), the second circuit board (22) and the third circuit board (23) are electrically connected via the second electrical connector (26), and the third circuit board (23) and the fourth circuit board (24) are electrically connected via the third electrical connector (27); Wherein, at least one of the first electrical connector (25) and the second electrical connector (26) is a flexible board.

7. The optical network device according to claim 6, characterized in that: The first electrical connector (25) and the third electrical connector (27) are flexible boards, and the second electrical connector (26) is a board-to-board connector.

8. The optical network device according to any one of claims 2 to 7, characterized in that: The circuit board assembly (2) further comprises a plurality of male and female studs (28), wherein the plurality of male and female studs (28) are used to fix the first circuit board (21), the second circuit board (22), the third circuit board (23) and the fourth circuit board (24) inside the housing (1); Wherein, the male and female studs (28) are provided between the first circuit board (21) and the bottom wall of the shell (1), between the first circuit board (21) and the second circuit board (22), between the second circuit board (22) and the third circuit board (23), and between the third circuit board (23) and the fourth circuit board (24).

9. The optical network device according to claim 8, characterized in that: Along the direction of the bottom wall pointing toward the panel (102), the interior of the housing (1) comprises a first accommodating portion (110) and a second accommodating portion (120) in sequence, and a step surface (130) is provided between the first accommodating portion (110) and the second accommodating portion (120); The first circuit board (21), the second circuit board (22) and the third circuit board (23) are located in the first accommodating portion (110), and the fourth circuit board (24) is located in the second accommodating portion (120) and abuts against the step surface (130).

10. The optical network device according to claim 9, characterized in that: At most two of the male and female studs (28) are included between the third circuit board (23) and the fourth circuit board (24).

11. The optical network device according to any one of claims 8 to 10, characterized in that: The circuit board assembly (2) further comprises a temperature averaging plate (29), wherein the temperature averaging plate (29) is located between the second circuit board (22) and the third circuit board (23), and is thermally connected to the second circuit board (22) and the third circuit board (23), respectively.

12. The optical network device according to claim 11, characterized in that: The male and female studs (28) between the second circuit board (22) and the third circuit board (23) pass through the temperature equalizing plate (29).

13. The optical network device according to any one of claims 1 to 12, characterized in that: The housing (1) comprises a bottom housing component (101) and a panel (102); the bottom housing component (101) comprises a bottom wall, and the bottom wall is arranged opposite to the panel (102); The circuit board assembly (2) comprises a first circuit board (21), the first circuit board (21) being adjacent to the bottom wall, the photoelectric converter (4) being located on a side of the first circuit board (21) facing the bottom wall, and being thermally connected to the bottom shell assembly (101).

14. The optical network device according to claim 13, characterized in that: The bottom shell assembly (101) comprises a bottom shell (1011) and a first heat sink (1012); The wall of the bottom shell (1011) opposite to the first circuit board (21) comprises a first opening (10111), and the first opening (10111) is arranged opposite to the photoelectric converter (4); The first heat sink (1012) comprises a first plate body (10121) and a first boss (10122), wherein the first plate body (10121) is located outside the bottom shell (1011), and the first boss (10122) passes through the first opening (10111) and is thermally connected to the photoelectric converter (4).

15. The optical network device according to claim 14, characterized in that: A plurality of protrusions (10110) are provided between the bottom shell (1011) and the first plate body (10121), one end of the protrusion (10110) abuts against the bottom shell (1011), and the other end abuts against the first plate body (10121), so that a gap (10120) is provided between the bottom shell (1011) and the first plate body (10121).

16. The optical network device according to claim 14 or 15, characterized in that: The first heat sink (1012) further comprises a shielding enclosure (10123), wherein the shielding enclosure (10123) passes through the first opening (10111) and surrounds the photoelectric converter (4).

17. The optical network device according to any one of claims 14 to 16, characterized in that: The first circuit board (21) further comprises a heating device on a side facing the bottom wall, and the bottom shell (1011) further comprises a second opening (10112) on a wall opposite to the first circuit board (21), and the second opening (10112) is arranged opposite to the heating device; The bottom shell assembly (101) also includes a second heat sink (1013), and the second heat sink (1013) includes a second plate body (10131) and a second boss (10132). The second plate body (10131) is located outside the bottom shell (1011), and the second boss (10132) passes through the second opening (10112) and is thermally connected to the heating device.

18. The optical network device according to claim 17, characterized in that: There is a gap (10120) between the first plate body (10121) and the bottom shell (1011), the second plate body (10131) and the bottom shell (1011) are in close contact with each other, and the thickness of the second plate body (10131) is greater than the thickness of the first plate body (10121).

19. The optical network device according to any one of claims 14 to 18, characterized in that: The photoelectric converter (4) comprises a bidirectional optical component BOSA, the BOSA being arranged on the first circuit board (21) in a plate-like manner, and the BOSA being thermally connected to the first boss (10122).

20. The optical network device according to any one of claims 1 to 19, characterized in that: The main chip (5) is thermally connected to the panel (102).

21. The optical network device according to any one of claims 2 to 5, characterized in that: The fourth circuit board (24) comprises a third opening (241), and the third opening (241) is arranged opposite to the main chip (5); The panel (102) comprises a third boss (1021), and the third boss (1021) is thermally connected to the main chip (5), wherein the third opening (241) is used to avoid the third boss (1021) or the thermal pad between the third boss (1021) and the main chip (5).

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