Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of communication, the electronic equipment comprises a double-diaphragm microphone and an equipment main body, and the double-diaphragm microphone is provided with a first pickup hole and a second pickup hole which are arranged back to back; the equipment main body is provided with an accommodating cavity, and the double-diaphragm microphone is located in the accommodating cavity; the equipment main body is provided with a display surface and a back surface opposite to the display surface, the equipment main body is provided with a first through hole and a second through hole, one end of the first through hole penetrates through the back surface, and the other end of the first through hole is communicated with the first pickup hole; one end of the second through hole penetrates through the surface, adjacent to or opposite to the back face, of the device body, and the other end of the second through hole is communicated with the second pickup hole.

Description

Technical Field

[0001] This application belongs to the field of communication technologies, and particularly relates to an electronic device. Background Art

[0002] With the rapid development of electronic devices, the applications of electronic devices are becoming more and more extensive. Electronic devices such as mobile phones and tablet computers play an increasingly important role in people's work, life, entertainment, etc.

[0003] In related technologies, in order to implement the sound pickup function of an electronic device, the electronic device is usually configured with a microphone. Specifically, the microphone is disposed inside the device body, and the device body is provided with a through hole. External audio information enters the device body through the opening and is then received by the microphone to implement the sound pickup function.

[0004] However, in related technologies, the microphone is usually disposed at the top position of the electronic device. At this time, the sound pickup range of the electronic device is close to the top position of the electronic device. Therefore, the sound pickup range of the electronic device is small, resulting in a poor sound pickup effect of the electronic device. Summary of the Invention

[0005] The purpose of the embodiments of this application is to provide an electronic device, which can solve the technical problem of poor sound pickup effect of the electronic device.

[0006] To solve the above technical problem, this application is implemented as follows: This application discloses an electronic device, including: A dual-diaphragm microphone having a first sound pickup hole and a second sound pickup hole arranged back to back; A device body having a receiving cavity, and the dual-diaphragm microphone is located in the receiving cavity; the device body has a display surface and a back surface arranged back to back with the display surface, and the device body is provided with a first through hole and a second through hole. One end of the first through hole penetrates the back surface, and the other end of the first through hole is communicated with the first sound pickup hole; one end of the second through hole penetrates the surface of the device body adjacent to or back to the back surface, and the other end of the second through hole is communicated with the second sound pickup hole.

[0007] In the embodiment of the present application, the dual-diaphragm microphone has a first sound pickup hole and a second sound pickup hole arranged back to back. At this time, both sides of the dual-diaphragm microphone can perform sound pickup operations. The device body is provided with a first through hole and a second through hole. One end of the first through hole penetrates the back surface, and the other end of the first through hole is communicated with the first sound pickup hole. One end of the second through hole penetrates the surface of the device body adjacent to or opposite to the back surface, and the other end of the second through hole is communicated with the second sound pickup hole. The electronic device disclosed in the present application can realize dual-channel sound pickup. One is to pick up sound from the back of the electronic device, and the other is to pick up sound from the side of the electronic device. Therefore, the sound pickup range of the electronic device can be effectively increased, which is beneficial to improving the sound pickup effect of the electronic device. Description of the Drawings

[0008] Figure 1 is a front view of an electronic device disclosed in an embodiment of the present application; Figure 2 is a back view of an electronic device disclosed in an embodiment of the present application; Figure 3 is a cross-sectional view of the first electronic device disclosed in an embodiment of the present application; Figure 4 is a cross-sectional view of the second electronic device disclosed in an embodiment of the present application; Figure 5 is a cross-sectional view of the third electronic device disclosed in an embodiment of the present application; Figure 6 is a cross-sectional view of the fourth electronic device disclosed in an embodiment of the present application; Figure 7 is a structural diagram of a dual-diaphragm microphone of an electronic device disclosed in an embodiment of the present application.

[0009] Description of the Reference Numerals: 100 - Dual - diaphragm microphone, 110 - First sound - pickup hole, 120 - Second sound - pickup hole, 200 - Device main body, 201 - Accommodation cavity, 202 - Display surface, 203 - Back surface, 204 - First through - hole, 2041 - First sound - guiding section, 2042 - Second sound - guiding section, 2043 - Third sound - guiding section, 205 - Second through - hole, 2051 - Fourth sound - guiding section, 2052 - Fifth sound - guiding section, 2053 - Sixth sound - guiding section, 2054 - Seventh sound - guiding section, 206 - Third through - hole, 210 - Device housing, 211 - Frame body, 2111 - Sound - guiding channel, 212 - Battery cover, 220 - Display module, 230 - Main - board bracket, 2301 - First area, 2302 - Second area, 231 - First through - hole, 232 - Third through - hole, 233 - Accommodation groove, 240 - Circuit board, 241 - Second through - hole, 242 - Fifth through - hole, 251 - First sealing part, 2511 - First communication hole, 252 - Second sealing part, 2521 - Second communication hole, 253 - Third sealing part, 2531 - Third communication hole, 254 - Fourth sealing part, 2541 - Fourth communication hole, 255 - Fifth sealing part, 2551 - Fifth communication hole, 256 - Sixth sealing part, 2561 - Sixth communication hole, 257 - Seventh sealing part, 2571 - Seventh communication hole, 258 - Eighth sealing part, 2581 - Eighth communication hole, 260 - Flexible circuit board, 261 - Fourth through - hole. Detailed implementation mode

[0010] The following will clearly describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0011] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally represents an "or" relationship between the associated objects before and after.

[0012] The following will, with reference to the accompanying drawings, describe in detail the electronic device provided in the embodiments of the present application through specific embodiments and their application scenarios.

[0013] Please refer to Figures 1 to 7, an embodiment of the present application discloses an electronic device, and the disclosed electronic device includes a dual-diaphragm microphone 100 and a device body 200.

[0014] As Figure 7 shown, the dual-diaphragm microphone 100 has a first sound pickup hole 110 and a second sound pickup hole 120 arranged opposite to each other. At this time, the dual-diaphragm microphone 100 picks up sound from opposite sides respectively. The dual-diaphragm microphone 100 includes a first diaphragm and a second diaphragm, and these two diaphragms can vibrate independently and generate electrical signals. The above-mentioned first sound pickup hole 110 corresponds to the first diaphragm, and the second sound pickup hole 120 corresponds to the second diaphragm. At this time, the sound wave entering through the first sound pickup hole 110 will cause the first diaphragm to vibrate, and the sound wave entering through the second sound pickup hole 120 will cause the second diaphragm to vibrate.

[0015] In an alternative solution, the dual-diaphragm microphone 100 may include a housing, a circuit component, a first parallel plate capacitor, and a second parallel plate capacitor. The circuit component, the first parallel plate capacitor, and the second parallel plate capacitor are all located inside the housing, and the opposite side surfaces of the housing are respectively provided with the first sound pickup hole 110 and the second sound pickup hole 120. The first parallel plate capacitor here may include a first back plate and the above-mentioned first diaphragm. The first diaphragm is opposite to the first sound pickup hole 110. Therefore, the first parallel plate capacitor here is used to perform acoustic-electric conversion on the sound wave entering through the first sound pickup hole 110. Similarly, the second parallel plate capacitor may include a second back plate and the above-mentioned second diaphragm. The second diaphragm is opposite to the second sound pickup hole 120. Therefore, the second parallel plate capacitor here is used to perform acoustic-electric conversion on the sound wave entering through the second sound pickup hole 120.

[0016] Of course, the dual-diaphragm microphone 100 in the present application is not limited to the capacitive type listed in the present application, and may also be an electrodynamic type, a piezoelectric type, or other types. The present application does not limit the specific type of the dual-diaphragm microphone 100. The specific working principle of the dual-diaphragm microphone 100 is well-known technology and is not limited in this article.

[0017] The device main body 200 is the main component of the electronic device. The device main body 200 includes, but is not limited to, components such as a device housing 210, a display module 220, and a circuit device. The device main body 200 is provided with a receiving cavity 201. Here, the aforementioned receiving cavity 201 may be provided on the device housing 210, or the receiving cavity 201 may be formed by enclosing the device housing 210 and the display module 220. The specific formation structure of the receiving cavity 201 is not limited in this article. The dual-diaphragm microphone 100 is located in the receiving cavity 201. The device main body 200 has a display surface 202 and a back surface 203 disposed opposite to the display surface 202. Here, the display surface 202 refers to the surface of the electronic device for display, which is located on the display module 220 of the electronic device. The specific structure of the display module 220 is a well-known technology and is not limited in this article. The back surface 203 is the surface on the side of the electronic device facing away from the display module 220. Here, the back surface 203 can be understood as the surface of the back cover of the electronic device, or can also be understood as the surface of the battery cover 212.

[0018] The device main body 200 is provided with a first through hole 204 and a second through hole 205. One end of the first through hole 204 penetrates the back surface 203, and the other end of the first through hole 204 is communicated with the first sound pickup hole 110. At this time, the first through hole 204 communicates the external environment of the electronic device with the first sound pickup hole 110. The first through hole 204 is located on the back surface 203 of the electronic device. Therefore, the first through hole 204 is used to realize the backside sound collection of the electronic device. One end of the second through hole 205 penetrates the surface of the device main body 200 adjacent to or opposite to the back surface 203. The other end of the second through hole 205 is communicated with the second sound pickup hole 120. At this time, the second through hole 205 communicates the external environment of the electronic device with the second sound pickup hole 120. The second through hole 205 can be provided on the side frame of the device housing 210 of the electronic device; or the gap between the device housing 210 and the display module 220 forms the second through hole 205; or, the second through hole 205 can be provided on the display module 220. At this time, the second through hole 205 is located on the side of the electronic device. Therefore, the top, bottom, or side sound collection of the electronic device can be realized.

[0019] In the disclosed embodiments of the present application, the electronic device can realize dual-channel sound collection. One is the backside sound collection of the electronic device, and the other is the side sound collection of the electronic device. Therefore, the sound collection range of the electronic device can be effectively increased, which is beneficial to improving the sound collection effect of the electronic device.

[0020] In addition, the electronic device of the present application adopts the combination of the dual-diaphragm microphone 100 and the dual-channel method. Using one microphone can realize sound collection in multiple directions. Therefore, while improving the sound collection effect of the electronic device, the layout structure of the electronic device can be optimized, and at the same time, the cost of the electronic device can be reduced.

[0021] In addition, the dual-diaphragm microphone 100 in the present application, in cooperation with the first through hole 204 and the second through hole 205, can collect sound waves from multiple directions. Therefore, after the sound waves from multiple directions are subjected to electroacoustic conversion, a directional signal can be output, enabling the electronic device to achieve directional sound pickup. Thus, in the present application, a single microphone can be used to achieve directional sound pickup. Directional sound pickup means that when the electronic device picks up sound, it is more sensitive to the sound source in a certain direction, so the sound pickup in this direction is enhanced, while the sound pickup in other directions is weakened. For example, when it is necessary to enhance the sound pickup of the top of the electronic device, at this time, the dual-diaphragm microphone 100 can output a signal with enhanced top directivity and weaken the sound pickup signal in the opposite direction.

[0022] In the related art, in order to achieve the directional sound pickup function of an electronic device, multiple microphones need to be provided on the electronic device to form a microphone array. At this time, the sound waves received by the multiple microphones are subjected to separate electroacoustic conversion to be converted into multiple digital signals, and the microphone signals at this time have no directivity. Then, the multiple-channel microphone signals are input into an algorithm for processing, and after processing, a directional signal can be generated, thereby achieving directional sound pickup.

[0023] In the electronic device disclosed in the present application, the dual-diaphragm microphone 100, in cooperation with the first through hole 204 and the second through hole 205, can achieve the collection of multiple sound waves. Therefore, after the dual-diaphragm microphone 100 performs electroacoustic conversion, a directional signal can be output. Thus, the dual-diaphragm microphone 100 itself can achieve directional sound pickup, eliminating the need to set up a microphone array and simplifying the processing logic of the electronic device and the algorithm processing program of the electronic device.

[0024] In another alternative solution, the dual-diaphragm microphone 100 can be used to output a directional signal and an omnidirectional signal. Here, the omnidirectional signal is also called non-directional or non-pointing signal, and such a signal is equally sensitive to sounds from all directions. Therefore, the electronic device has a first sound pickup state and a second sound pickup state. In the first sound pickup state, the dual-diaphragm microphone 100 can be used to output a directional signal to achieve directional sound pickup; in the second sound pickup state, the dual-diaphragm microphone 100 can be used to output an omnidirectional signal. Here, the omnidirectional signal can be understood as the electronic device being more sensitive to the sound signals on the back surface 203 and the directions adjacent to or opposite to the back surface 203.

[0025] In this solution, the electronic device can not only achieve directional sound pickup but also omnidirectional sound pickup, thus increasing the application scenarios of the electronic device and further improving the performance of the electronic device.

[0026] Furthermore, the directional signal and the omnidirectional signal output by the dual-diaphragm microphone 100 can also be simultaneously input into the algorithm for optimization processing to generate an optimized directional microphone signal. In this solution, the directional signal output by the dual-diaphragm microphone 100 is a mono channel, so the directional signal is optimized by the omnidirectional signal to form a stereo channel directional microphone signal, which is conducive to further improving the sound collection effect of the electronic device.

[0027] In the above solution, the algorithm for processing the directional signal and the omnidirectional signal in the electronic device is a well-known technology, which will not be described in detail in this article.

[0028] In the solution disclosed in the present application, the electronic device can have three sound receiving states. When the electronic device is in the first sound receiving state, the dual-diaphragm microphone 100 can be used to output a directional signal; when the electronic device is in the second sound receiving state, the dual-diaphragm microphone 100 can be used to output an omnidirectional signal. When the electronic device is in the third sound receiving state, the directional microphone signal after the directional signal and the omnidirectional signal input algorithm optimization processing is output. At this time, the electronic device disclosed in the present application has multiple sound receiving modes, so the sound receiving performance of the electronic device can be better achieved.

[0029] In another alternative, if Figure 3 , Figure 5 as well as Figure 6 As shown, the device body 200 may include a device housing 210 and a display module 220. The device housing 210 may include a battery cover 212 and a frame 211. The battery cover 212 and the display module 220 are respectively located on opposite sides of the frame 211. The battery cover 212 and the display module 220 may enclose a receiving cavity 201 with the frame 211. The surface of the battery cover 212 on the side away from the display module 220 may be a back surface 203, and the display module 220 on the side away from the battery cover 212 may have a display surface 202. The battery cover 212 may be provided with the above-mentioned first through hole 204, and the frame 211 may be provided with a second through hole 205. The second through hole 205 may be provided on the side of the frame 211. The frame 211 here may be an integrated structure. Of course, the frame 211 can also be a disassembled structure. For example, the frame 211 can include a side frame and a frame body. The side frame is arranged around the frame body. The outer surface of the side frame here is part of the appearance surface of the electronic device, and the frame body is used to support the functional components of the electronic device. For example, the display module 220 and the circuit board 240 can be arranged on the frame body. The above-mentioned second through hole 205 can be opened in the side frame. Alternatively, the first through hole 204 runs through the side frame and the frame body. The specific structure of the frame 211 is not limited herein.

[0030] In this solution, the first through hole 204 and the second through hole 205 are respectively formed on the frame 211 of the device housing 210 and the battery cover 212, thereby making the manufacturing process of the electronic device simpler, thereby helping to reduce the difficulty of manufacturing the electronic device.

[0031] In another optional embodiment, if Figure 4 As shown, the device body 200 may include a device housing 210 and a display module 220, and the device housing 210 may include a battery cover 212 and a frame 211, and the battery cover 212 and the display module 220 may be located on opposite sides of the frame 211. The surface of the battery cover 212 on the side away from the display module 220 may be the above-mentioned back side 203. The side of the display module 220 away from the battery cover 212 may have the above-mentioned display surface 202. The battery cover 212 is provided with a first through hole 204. An assembly gap may be formed between the frame 211 and the display module 220, and the assembly gap may serve as the above-mentioned second through hole 205. The frame 211 here may be an integrated structure, and of course the frame 211 may also be a detachable structure, for example, the frame 211 may include a side frame and a frame body, and the side frame is arranged around the frame body. The specific structure of the frame 211 is not limited herein.

[0032] In this solution, an assembly gap is formed between the frame 211 and the display module 220, and the assembly gap serves as the second through hole 205. In this case, no hole is required to be opened on the frame 211, thereby reducing the number of holes in the device housing 210 of the electronic device, which is beneficial to improving the waterproof and dustproof performance of the electronic device. In addition, no hole is required to be opened on the frame 211 of the electronic device, which is also beneficial to improving the consistency of the frame 211, thereby improving the strength and appearance performance of the frame 211.

[0033] The present application discloses a stacking structure in an electronic device. Of course, the electronic device may also be other stacking structures, which are not limited herein. Figure 3 and Figure 4 As shown, the device body 200 further includes a mainboard bracket 230 and a circuit board 240, and both the mainboard bracket 230 and the circuit board 240 can be located in the accommodating cavity 201. The mainboard bracket 230 can be located on the side of the circuit board 240 facing the battery cover 212. The dual-diaphragm microphone 100 can be located between the mainboard bracket 230 and the circuit board 240, and the dual-diaphragm microphone 100 is carried on the circuit board 240 and electrically connected to the circuit board 240. The circuit board 240 here can be a mainboard of an electronic device, or a sub-board of an electronic device, which is not limited in this article.

[0034] The main board bracket 230 may be provided with a first through hole 231 in its thickness direction, and the first sound pickup hole 110 may be communicated with the first through hole 204 through the first through hole 231. At this time, the sound wave entering the first through hole 204 enters the first sound pickup hole 110 through the first through hole 231. The circuit board 240 may be provided with a second through hole 241 in its thickness direction, and the second sound pickup hole 120 may be communicated with the second through hole 205 through the second through hole 241. At this time, the sound wave entering the second through hole 205 enters the second sound pickup hole 120 through the second through hole 241.

[0035] In this solution, the double diaphragm microphone 100 is located between the circuit board 240 and the main board bracket 230, so that the circuit board 240 and the main board bracket 230 can clamp the double diaphragm microphone 100, which is beneficial to improving the installation reliability of the double diaphragm microphone 100. In addition, the through holes provided on the circuit board 240 and the main board bracket 230 are beneficial to increasing the length of the sound receiving channels corresponding to the first sound pickup hole 110 and the second sound pickup hole 120, so it is beneficial to the settlement of dust and water vapor, thus avoiding the risk of blockage of the first sound pickup hole 110 and the second sound pickup hole 120, and improving the acoustic performance of the electronic device.

[0036] Further, the device body 200 may further include a first sealing portion 251, a second sealing portion 252 and a third sealing portion 253. The first sealing portion 251 may be located between the main board bracket 230 and the battery cover 212. The first sealing portion 251 may be provided with a first communication hole 2511, and the first through hole 231 and the first through hole 204 are communicated through the first communication hole 2511. At this time, the first sealing portion 251 seals the connection between the first through hole 231 and the first through hole 204, thus avoiding the phenomenon of sound leakage in the gap between the main board bracket 230 and the battery cover 212.

[0037] The second sealing portion 252 may be located between the main board bracket 230 and the double diaphragm microphone 100. The second sealing portion 252 may be provided with a second communication hole 2521, and the first through hole 231 may be communicated with the first sound pickup hole 110 through the second communication hole 2521. At this time, the second sealing portion 252 seals the connection between the first through hole 231 and the first sound pickup hole 110, thus avoiding the phenomenon of sound leakage in the gap between the main board bracket 230 and the double diaphragm microphone 100.

[0038] The third sealing portion 253 may be located between the circuit board 240 and the frame 211. The third sealing portion 253 may be provided with a third connecting hole 2531, and the second through hole 205 may be connected to the second through hole 241 through the third connecting hole 2531. At this time, the third sealing portion 253 seals the connection between the second through hole 241 and the second through hole 205, thereby preventing sound leakage from the gap between the circuit board 240 and the frame 211.

[0039] This solution can avoid the risk of sound leakage in electronic equipment, thereby helping to further improve the acoustic performance of electronic equipment.

[0040] Optionally, the first sealing portion 251, the second sealing portion 252 and the third sealing portion 253 can all be made of materials such as foam and rubber. Of course, they can also be made of other sealing materials, which is not limited in this document.

[0041] In an alternative approach, Figure 4 As shown, a sound guide channel 2111 may also be provided on the frame 211, and one end of the sound guide channel 2111 may be connected to the second through hole 205, where the second through hole 205 refers to the assembly gap formed by the frame 211 and the display module 220. The other end of the sound guide channel 2111 is connected to the second sound pickup hole 120. In this solution, the sound guide channel 2111 is conducive to increasing the length of the channel corresponding to the second sound pickup hole 120, thereby facilitating the settling of dust and water vapor, and avoiding the risk of the second sound pickup hole 120 being blocked. In addition, the provision of the sound guide channel 2111 on the frame 211 also facilitates the flexible adjustment of the position of the dual-diaphragm microphone 100, thereby optimizing the layout structure of the electronic device.

[0042] In another optional embodiment, if Figure 5 and Figure 6 As shown, the device body 200 may further include a mainboard bracket 230, a flexible circuit board 260 and a circuit board 240, and the mainboard bracket 230, the flexible circuit board 260 and the circuit board 240 are all located in the accommodating cavity 201. The circuit board 240 is located on the side of the mainboard bracket 230 away from the battery cover 212, and the dual-diaphragm microphone 100 may be disposed on the side of the mainboard bracket 230 facing the battery cover 212. The dual-diaphragm microphone 100 may be electrically connected to the circuit board 240 through the flexible circuit board 260.

[0043] The mainboard bracket 230 may be provided with a third through hole 232 along the thickness direction thereof, and the second through hole 205 may be connected to the second sound pickup hole 120 through the third through hole 232 .

[0044] In this solution, the dual-diaphragm microphone 100 is disposed on the side of the main board bracket 230 facing the battery cover 212, thus avoiding the risk of interference between the dual-diaphragm microphone 100 and the functional devices on the circuit board 240. In addition, the dual-diaphragm microphone 100 is separated from the circuit board 240 and electrically connected to the circuit board 240 through the flexible printed circuit board 260, thereby reducing the occupation of the area of the circuit board 240 and facilitating the optimization of the electrical connection structure of the circuit board 240.

[0045] In the above solution, the dual-diaphragm microphone 100 is stacked on the surface of the side of the main board bracket 230 facing the battery cover 212. At this time, the stacking thickness of the dual-diaphragm microphone 100 and the main board bracket 230 is relatively large, thus resulting in a relatively large thickness of the electronic device, which is not conducive to the development of the electronic device towards thin and light.

[0046] Based on this, in another alternative solution, as Figure 5 and Figure 6 shown, a receiving groove 233 can be formed on the side of the main board bracket 230 facing the battery cover 212, and the dual-diaphragm microphone 100 can be located in the receiving groove 233. The third through hole 232 penetrates the bottom of the receiving groove 233. In this solution, the dual-diaphragm microphone 100 is installed in the receiving groove 233 formed in the main board bracket 230, so that the stacking thickness of the dual-diaphragm microphone 100 and the main board bracket 230 can be reduced, thereby reducing the thickness of the electronic device, and further being more conducive to the development of the electronic device towards thin and light.

[0047] Furthermore, as Figure 5 and Figure 6 shown, a part of the flexible printed circuit board 260 can be located on the side of the main board bracket 230 facing the battery cover 212. At this time, a part of the area of the flexible printed circuit board 260 can cover the notch of the receiving groove 233, and the flexible circuit board 240 can be provided with a fourth through hole 261. The first through hole 204 can be communicated with the first sound pickup hole 110 through the fourth through hole 261. In this solution, the flexible printed circuit board 260 can block the notch of the receiving groove 233, thereby being able to protect the dual-diaphragm microphone 100, and further improving the safety of the electronic device.

[0048] In another solution, the device body 200 can further include a fourth sealing portion 254 and a fifth sealing portion 255. The fourth sealing portion 254 can be located between the battery cover 212 and the flexible printed circuit board 260. The fourth sealing portion 254 can be provided with a fourth communication hole 2541. The first through hole 204 can be communicated with the fourth through hole 261 through the fourth communication hole 2541. The fourth sealing portion 254 here is used to seal the gap between the battery cover 212 and the flexible printed circuit board 260, thereby avoiding the occurrence of sound leakage in the gap between the battery cover 212 and the flexible printed circuit board 260.

[0049] The fifth sealing portion 255 may be located between the dual-diaphragm microphone 100 and the bottom of the receiving groove 233. The fifth sealing portion 255 may be provided with a fifth communication hole 2551, and the second sound pickup hole 120 may be communicated with the third through hole 232 through the fifth communication hole 2551. The fifth sealing portion 255 here is used to seal the gap between the dual-diaphragm microphone 100 and the bottom of the receiving groove 233, so as to avoid the phenomenon of sound leakage in the gap between the dual-diaphragm microphone 100 and the bottom of the receiving groove 233.

[0050] This solution can avoid the risk of internal sound leakage in the electronic device, which is beneficial to further improving the acoustic performance of the electronic device.

[0051] Optionally, both the fourth sealing portion 254 and the fifth sealing portion 255 may be made of materials such as foam and rubber. Of course, other sealing materials may also be used, which are not limited in this article.

[0052] In another alternative solution, as Figure 5 shown, the circuit board 240 is provided with a fifth through hole 242 along its thickness direction, and the second through hole 205 may be communicated with the third through hole 232 through the fifth through hole 242. At this time, the sound wave collected by the second through hole 205 enters the second sound pickup hole 120 after passing through the fifth through hole 242 and the third through hole 232. At this time, in order not to affect the installation position of the circuit board 240 in the device housing 210, the fifth through hole 242 is directly provided on the circuit board 240 to communicate the second through hole 205 and the second sound pickup hole 120. In this solution, the position and size of the circuit board 240 do not change, so this channel setting method will not affect the stacking layout structure of the electronic device.

[0053] Furthermore, the device body 200 may further include a sixth sealing portion 256 and a seventh sealing portion 257. The sixth sealing portion 256 may be located between the main board bracket 230 and the circuit board 240. The sixth sealing portion 256 may be provided with a sixth communication hole 2561, and the third through hole 232 may be communicated with the fifth through hole 242 through the sixth communication hole 2561. At this time, the sixth sealing portion 256 is used to seal the gap between the main board bracket 230 and the circuit board 240, so as to avoid the phenomenon of sound leakage in the gap between the main board bracket 230 and the circuit board 240.

[0054] The seventh sealing portion 257 may be located between the frame body 211 and the circuit board 240. The seventh sealing portion 257 may be provided with a seventh communication hole 2571, and the fifth through hole 242 may be communicated with the second through hole 205 through the seventh communication hole 2571. At this time, the seventh sealing portion 257 is used to seal the gap between the frame body 211 and the circuit board 240, so as to avoid the phenomenon of sound leakage in the gap between the frame body 211 and the circuit board 240.

[0055] This solution can avoid the risk of internal sound leakage in the electronic device, which is beneficial to further improve the acoustic performance of the electronic device.

[0056] Optionally, both the sixth sealing portion 256 and the seventh sealing portion 257 can be made of materials such as foam and rubber. Of course, other sealing materials can also be used, and this is not limited in this article.

[0057] In another alternative solution, as Figure 6 shown, the main board bracket 230 can include a first area 2301 and a second area 2302 arranged in parallel. The first area 2301 is disposed opposite to the circuit board 240. The second area 2302 can protrude from the edge of the circuit board 240. The receiving groove 233 can be opened in the second area 2302. The side of the second area 2302 facing away from the battery cover 212 is connected to the frame 211. In this solution, the second area 2302 of the main board bracket 230 is directly connected to the frame 211. Therefore, there is no need to open holes in the circuit board 240, which avoids setting a transfer hole between the second through hole 205 and the third through hole 232, and thus is beneficial to avoid the risk of sound leakage between the second through hole 205 and the second through hole 241.

[0058] Furthermore, the device body 200 can further include an eighth sealing portion 258. The eighth sealing portion 258 can be located between the second area 2302 and the frame 211. The eighth sealing portion 258 can be provided with an eighth communication hole 2581. The second through hole 205 can be communicated with the third through hole 232 through the eighth communication hole 2581. At this time, the eighth sealing portion 258 is used to seal the gap between the main board bracket 230 and the frame 211, so as to avoid the phenomenon of sound leakage in the gap between the main board bracket 230 and the frame 211.

[0059] This solution can avoid the risk of internal sound leakage in the electronic device, which is beneficial to further improve the acoustic performance of the electronic device.

[0060] Optionally, the eighth sealing portion 258 can be made of materials such as foam and rubber. Of course, other sealing materials can also be used, and this is not limited in this article.

[0061] In another alternative solution, the first through hole 204 may include a first sound guiding section 2041, a second sound guiding section 2042, and a third sound guiding section 2043 that are sequentially connected. One end of the first sound guiding section 2041 facing away from the second sound guiding section 2042 may penetrate the back surface 203, and one end of the third sound guiding section 2043 facing away from the second sound guiding section 2042 may communicate with the first sound pickup hole 110. Among them, the central axis of the first sound guiding section 2041 may intersect the central axis of the second sound guiding section 2042, and the central axis of the first sound guiding section 2041 may be parallel to the central axis of the third sound guiding section 2043. In this solution, the first sound guiding section 2041, the second sound guiding section 2042, and the third sound guiding section 2043 form a bent channel, and the bent channel is more convenient for dust and water vapor to settle, thus further avoiding the risk of the first sound pickup hole 110 being blocked.

[0062] In another solution, the second through hole 205 may include a fourth sound guiding section 2051, a fifth sound guiding section 2052, a sixth sound guiding section 2053, and a seventh sound guiding section 2054 that are sequentially connected. One end of the fourth sound guiding section 2051 facing away from the fifth sound guiding section 2052 penetrates the surface of the device body 200 adjacent to the back surface 203. One end of the seventh sound guiding section 2054 facing away from the sixth sound guiding section 2053 may communicate with the second sound pickup hole 120. Among them, the central axis of the fourth sound guiding section 2051 may intersect the central axis of the fifth sound guiding section 2052, the central axis of the fourth sound guiding section 2051 may be parallel to the central axis of the sixth sound guiding section 2053, and the central axis of the fourth sound guiding section 2051 may intersect the central axis of the seventh sound guiding section 2054. In this solution, the fourth sound guiding section 2051, the fifth sound guiding section 2052, the sixth sound guiding section 2053, and the seventh sound guiding section 2054 form a bent channel, and the bent channel is more convenient for dust and water vapor to settle, thus further avoiding the risk of the second sound pickup hole 120 being blocked.

[0063] In another alternative embodiment, the electronic device may further include a single diaphragm microphone. Here, the single diaphragm microphone refers to a microphone with only one diaphragm. The single diaphragm microphone may have a third sound pickup hole, and the single diaphragm microphone may be located in the accommodation cavity 201. The device body 200 is provided with a third through hole 206. One end of the third through hole 206 may penetrate the surface of the device body 200 adjacent to or opposite to the back surface 203, and the other end of the third through hole 206 communicates with the third sound pickup hole. The third through hole 206 and the second through hole 205 may be respectively located on opposite sides of the device body 200. Here, one of the third through hole 206 and the second through hole 205 may be located at the top of the device body 200, and the other may be located at the bottom of the device body 200.

[0064] In this solution, the single diaphragm microphone can collect sound waves on the side of the electronic device away from the dual diaphragm microphone 100, thereby further increasing the sound collection direction of the electronic device, thereby further increasing the sound reception range of the electronic device, which is beneficial to further improve the sound reception effect of the electronic device.

[0065] In addition, the signal output by the single-diaphragm microphone after acoustic-electric conversion and the directional signal and omnidirectional signal output by the dual-diaphragm microphone 100 can be simultaneously input into the processing algorithm to output an optimized microphone signal. At this time, the three signals can be processed by the algorithm to obtain a more accurate directional signal, thereby further improving the sound reception effect of the electronic device.

[0066] The electronic device disclosed in the embodiment of the present invention may be a smart phone, a tablet computer, an e-book reader or a wearable device. Of course, the electronic device may also be other devices, which is not limited in the embodiment of the present invention.

[0067] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: A dual-diaphragm microphone, wherein the dual-diaphragm microphone has a first sound pickup hole and a second sound pickup hole arranged opposite to each other; A device body, wherein the device body is provided with a accommodating cavity, and the dual-diaphragm microphone is located in the accommodating cavity; the device body has a display surface and a back surface arranged opposite to the display surface, and the device body is provided with a first through hole and a second through hole, one end of the first through hole passes through the back surface, and the other end of the first through hole is connected to the first sound pickup hole; one end of the second through hole passes through a surface of the device body adjacent to or opposite to the back surface, and the other end of the second through hole is connected to the second sound pickup hole.

2. The electronic device according to claim 1, characterized in that: The device body includes a device shell and a display module, the device shell includes a battery cover and a frame, the battery cover and the display module are respectively located on opposite sides of the frame, the battery cover and the frame form the accommodating cavity, the surface of the battery cover on the side away from the display module is the back side, the side of the display module away from the battery cover has the display surface, the battery cover is provided with the first through hole; the frame is provided with the second through hole.

3. The electronic device according to claim 1, characterized in that: The device body includes a device shell and a display module, the device shell includes a battery cover and a frame, the battery cover and the display module are respectively located on opposite sides of the frame, the surface of the battery cover on the side away from the display module is the back side, the side of the display module away from the battery cover has the display surface, and the battery cover is provided with the first through hole; an assembly gap is formed between the frame and the display module, and the assembly gap serves as the second through hole.

4. The electronic device according to claim 2 or 3, characterized in that: The device body further includes a mainboard bracket and a circuit board, wherein the mainboard bracket and the circuit board are both located in the accommodating cavity, the mainboard bracket is located on a side of the circuit board facing the battery cover, the dual-diaphragm microphone is located between the mainboard bracket and the circuit board, and the dual-diaphragm microphone is carried on the circuit board and electrically connected to the circuit board; The mainboard bracket is provided with a first through hole along its thickness direction, and the first sound pickup hole is connected with the first through hole through the first through hole; the circuit board is provided with a second through hole along its thickness direction, and the second sound pickup hole is connected with the second through hole through the second through hole.

5. The electronic device according to claim 4, characterized in that: The device body further comprises a first sealing portion, a second sealing portion and a third sealing portion, wherein the first sealing portion is located between the mainboard bracket and the battery cover, and the first sealing portion is provided with a first connecting hole, and the first through hole and the first through hole are connected through the first connecting hole; The second sealing portion is located between the mainboard bracket and the dual-diaphragm microphone, the second sealing portion is provided with a second connecting hole, and the first through hole is connected to the first sound pickup hole through the second connecting hole; The third sealing portion is located between the circuit board and the frame body. The third sealing portion is provided with a third communicating hole. The second through hole is connected to the second through hole through the third communicating hole.

6. The electronic device according to claim 3, characterized in that: The frame body is provided with a sound guide channel, one end of the sound guide channel is connected with the second through hole, and the other end of the sound guide channel is connected with the second sound pickup hole.

7. The electronic device according to claim 2 or 3, characterized in that: The device body further comprises a mainboard bracket, a flexible circuit board and a circuit board, wherein the mainboard bracket, the flexible circuit board and the circuit board are all located in the accommodating cavity; the circuit board is located on a side of the mainboard bracket away from the battery cover, and the dual-diaphragm microphone is arranged on a side of the mainboard bracket facing the battery cover, and the dual-diaphragm microphone is electrically connected to the circuit board through the flexible circuit board; The mainboard bracket is provided with a third through hole along the thickness direction thereof, and the second through hole is connected with the second sound pickup hole through the third through hole.

8. The electronic device according to claim 7, characterized in that: A receiving groove is formed on one side of the mainboard bracket facing the battery cover, the dual-diaphragm microphone is located in the receiving groove, and the third through hole penetrates the bottom of the receiving groove; A partial area of ​​the flexible circuit board covers the notch of the accommodating groove, and a fourth through hole is opened in the flexible circuit board, and the first through hole is connected with the first sound pickup hole through the fourth through hole.

9. The electronic device according to claim 8, characterized in that: The circuit board is provided with a fifth through hole along the thickness direction thereof, and the second through hole is connected with the third through hole through the fifth through hole.

10. The electronic device according to claim 8, characterized in that: The mainboard bracket includes a first area and a second area arranged in parallel, the first area is arranged opposite to the circuit board, the second area protrudes from the edge of the circuit board, the accommodating groove is opened in the second area, and the second area is connected to the frame on a side away from the battery cover.

11. The electronic device according to claim 9 or 10, characterized in that: The device body further includes a fourth sealing portion and a fifth sealing portion, wherein the fourth sealing portion is located between the battery cover and the flexible circuit board, and the fourth sealing portion is provided with a fourth connecting hole, and the first through hole is connected to the fourth through hole through the fourth connecting hole; The fifth sealing portion is located between the dual-diaphragm microphone and the bottom of the accommodating groove, and a fifth connecting hole is formed in the fifth sealing portion. The second sound pickup hole is connected to the third through hole through the fifth connecting hole.

12. The electronic device according to claim 9, characterized in that: The device body further includes a sixth sealing portion and a seventh sealing portion, wherein the sixth sealing portion is located between the mainboard bracket and the circuit board, and the sixth sealing portion is provided with a sixth connecting hole, and the third through hole is connected to the fifth through hole through the sixth connecting hole; The seventh sealing portion is located between the frame and the circuit board. The seventh sealing portion is provided with a seventh communicating hole. The fifth through hole is connected to the second through hole through the seventh communicating hole.

13. The electronic device according to claim 10, characterized in that: The device body further includes an eighth sealing portion, the eighth sealing portion is located between the second area and the frame body, the eighth sealing portion is provided with an eighth communicating hole, and the second through hole is connected to the third through hole through the eighth communicating hole.

14. The electronic device according to claim 1, characterized in that: The first through hole includes a first sound guide segment, a second sound guide segment and a third sound guide segment which are connected in sequence, wherein one end of the first sound guide segment which faces away from the second sound guide segment passes through the back surface, and one end of the third sound guide segment which faces away from the second sound guide segment is connected to the first sound pickup hole; wherein the central axis of the first sound guide segment intersects with the central axis of the second sound guide segment, and the central axis of the first sound guide segment is parallel to the central axis of the third sound guide segment.

15. The electronic device according to claim 1, characterized in that: The second through hole includes a fourth sound guide segment, a fifth sound guide segment, a sixth sound guide segment and a seventh sound guide segment which are connected in sequence, wherein an end of the fourth sound guide segment which is away from the fifth sound guide segment passes through a surface of the device body adjacent to the back side, and an end of the seventh sound guide segment which is away from the sixth sound guide segment is connected to the second sound pickup hole; wherein a central axis of the fourth sound guide segment intersects with a central axis of the fifth sound guide segment, a central axis of the fourth sound guide segment is parallel to a central axis of the sixth sound guide segment, and a central axis of the fourth sound guide segment intersects with a central axis of the seventh sound guide segment.

16. The electronic device according to claim 1, characterized in that: The electronic device also includes a single diaphragm microphone, which has a third sound pickup hole and is located in the accommodating cavity; the device body is provided with a third through hole, one end of the third through hole passes through a surface of the device body adjacent to or opposite to the back side, and the other end of the third through hole is connected to the third sound pickup hole, and the third through hole and the second through hole are respectively located on opposite sides of the device body.

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