Display panel, preparation method of display panel and display module

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display module, and the display panel comprises a flexible substrate which comprises wires; the bonding pad assembly is arranged on one side of the flexible substrate, the bonding pad assembly comprises more than two first binding parts which are arranged at intervals in the first direction, a spacer region is arranged between every two adjacent first binding parts in the first direction, each first binding part comprises a bonding pad, and the bonding pads are connected with the wires; wherein the spacer region is provided with a through groove, the through groove penetrates through the flexible substrate, the spacer region is further provided with a wiring gap, and all the wires are connected with all the bonding pads through the wiring gap. According to the display panel provided by the embodiment of the invention, the through groove penetrating through the flexible substrate is formed in the spacer region, so that the problem that the flexible substrate between the first binding parts is extruded and accumulated due to the deformation quantity generated by the flexible substrate and the displacement quantity of the bonding pad in the binding process of the bonding pad of the first binding parts is solved, and therefore, cracks of the flexible substrate are improved; therefore, the problem is solved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and particularly relates to a display panel, a preparation method of the display panel, and a display module. Background Art

[0002] At present, the electrical connection between a display panel and a chip is mainly realized through a bonding process. In the Chip On Pi (COP) technology where the chip is directly bonded to the flexible substrate, the display panel is directly bonded to the chip, and the bonding area of the display panel will be deformed due to the bonding pressure, which easily causes problems such as breakage of the array lines in the display panel. Summary of the Invention

[0003] Embodiments of the present application provide a display panel, a preparation method of the display panel, and a display module, which can avoid the problem that the flexible substrate of the display panel has cracks, resulting in broken traces.

[0004] In a first aspect, according to an embodiment of the present application, a display panel is provided, including: a flexible substrate including traces; a pad assembly disposed on one side of the flexible substrate, the pad assembly including two or more first bonding parts spaced along a first direction, a spacing area is provided between two adjacent first bonding parts along the first direction, the first bonding part includes a pad, and the pad is connected to the trace; wherein, a through groove is provided in the spacing area, the through groove penetrates through the flexible substrate, a trace gap is further provided in the spacing area, and each trace is connected to each pad via the gap.

[0005] According to an aspect of an embodiment of the present application, the through groove includes a first through groove located on one side of each pad in the first direction, and the trace gap is provided on at least one side of the first through groove in a second direction, and the first direction intersects with the second direction.

[0006] According to an aspect of an embodiment of the present application, two or more pads are spaced along the second direction, the first through grooves corresponding to adjacent pads are spaced, the trace gaps corresponding to each pad are provided between the first through grooves, and the traces connected to each pad are connected to each pad via the corresponding trace gaps.

[0007] According to an aspect of an embodiment of the present application, the pads of two or more first bonding parts are aligned along the first direction, and the first through groove is provided between two adjacent pads along the first direction.

[0008] According to an aspect of an embodiment of the present application, one of the two first through grooves corresponding to two adjacent pads spaced along the second direction has a larger size than the other.

[0009] According to one aspect of the embodiments of the present application, the through groove further includes a second through groove disposed on one side of the pad in the second direction, and a routing gap is disposed on the side of the second through groove away from the pad in the second direction.

[0010] According to one aspect of the embodiments of the present application, the second through groove includes at least two second sub-grooves, and the routing gap is disposed between a second sub-groove of one pad and a second sub-groove of an adjacent pad spaced apart in the second direction.

[0011] According to one aspect of the embodiments of the present application, the second through groove communicates with the first through groove.

[0012] According to one aspect of the embodiments of the present application, the second sub-groove communicates with the first through groove.

[0013] According to one aspect of the embodiments of the present application, one of the two second sub-grooves disposed on both sides of the same routing gap has a larger size than the other.

[0014] According to one aspect of the embodiments of the present application, two second through grooves corresponding to the pads disposed on adjacent two bonding portions communicate with the first through groove in the first direction, and one of the two second through grooves has a larger size than the other.

[0015] According to one aspect of the embodiments of the present application, one of the two second sub-grooves located on one side of the first through groove in the first direction and communicating with the same first through groove has a larger size than the other.

[0016] According to one aspect of the embodiments of the present application, the routing connects the pads via a plurality of routing gaps aligned in the first direction;

[0017] According to one aspect of the embodiments of the present application, the distances from the routing to the first through grooves on both sides are kept consistent.

[0018] In a second aspect, according to the embodiments of the present application, a method for manufacturing a display panel is provided, including:

[0019] Fabricating routing in a flexible substrate;

[0020] Fabricating a pad assembly on one side of the flexible substrate, the pad assembly including two or more first bonding portions spaced apart in the first direction, a spacing area is disposed between two adjacent first bonding portions in the first direction, the first bonding portion includes a pad, and the pad is connected to the routing;

[0021] Opening a through groove in the spacing area, the through groove penetrates the flexible substrate, the spacing area further includes a routing gap, and each routing connects each pad via the routing gap.

[0022] In a third aspect, according to an embodiment of the present application, a display module is provided, including a display panel as described in any one of the first aspect embodiments above; a second bonding member; and the display panel is bonded to the second bonding member.

[0023] According to one aspect of an embodiment of the present application, the second bonding member includes a chip, and the chip includes a chip body and a second bonding portion connected to the chip body, and the display panel is bonded to the second bonding member through the second bonding portion.

[0024] According to one aspect of an embodiment of the present application, the second bonding portion includes bumps, and the bumps are connected to the chip body along the thickness direction of the chip body.

[0025] In the display panel, the preparation method of the display panel, and the display module provided by the embodiments of the present application, through grooves penetrating the flexible substrate are provided in the spacer area, which improves the problem of the accumulation of extrusion of the flexible substrate between the first bonding portions caused by the deformation amount of the flexible substrate and the displacement amount of the pads during the bonding process of the pads of the first bonding portion, thereby improving the problem that the flexible substrate cracks and the wiring breaks. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The features, advantages, and technical effects of exemplary embodiments of the present application will be described below with reference to the drawings.

[0027] Figure 1 is a top view structural schematic diagram of a display panel provided by an embodiment of the present application;

[0028] Figure 2 is Figure 1 an enlarged structural schematic diagram of area A in the embodiment;

[0029] Figure 3 is an enlarged structural schematic diagram of area A of another display panel provided by an embodiment of the present application;

[0030] Figure 4 is a flowchart schematic diagram of a preparation method of a display panel provided by an embodiment of the present application;

[0031] Figures 5 to 7 is a process schematic diagram of process steps of a preparation method of a display panel provided by an embodiment of the present application;

[0032] Figure 8 is a top view structural schematic diagram of a display module provided by an embodiment of the present application;

[0033] Figure 9 is Figure 8 a cross-sectional structural schematic diagram along the B-B direction in the embodiment.

[0034] Wherein:

[0035] 10 - Flexible substrate; 11 - Trace

[0036] 20 - Pad assembly; 2 - First bonding part; 21 - Pad

[0037] 30 - Spacer; 31 - Through - slot; 32 - Trace gap; 311 - First through - slot; 312 - Second through - slot; 3121 - Second sub - slot

[0038] 4 - Second bonding member; 40 - Chip; 41 - Chip body; 42 - Second bonding part; 421 - Bump

[0039] 100 - Display panel; 1000 - Display module

[0040] X - First direction; Y - Second direction; Z - Thickness direction

[0041] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale Detailed implementation manners

[0042] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are set forth in order to provide a comprehensive understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application. In the drawings and the following description, at least some of the well - known structures and technologies are not shown in order to avoid unnecessarily obscuring the present application; and, for clarity, the dimensions of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in any suitable manner in one or more embodiments

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover a non - exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising ······" does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element

[0044] The orientation terms used in the following description are all the directions shown in the figures, and do not limit the specific structure of the display panel and the display module of the present application. In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "arrangement" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0045] Currently, the display screen needs to adopt a bonding process to achieve the electrical connection between the display screen and the chip. In the bonding process, COP bonding is the most mainstream solution among the bonding processes adopted in the current related technologies. The main implementation scheme of COP bonding is to directly mount the chip on the flexible display screen. When finally completing the encapsulation of the display screen, the COP bonding scheme is to directly bend a part of the flexible display screen and the chip together to the backlight side of the display screen to complete the final encapsulation step. By adopting COP encapsulation, while achieving a thinner encapsulation thickness, the frame width on the side where the display screen is connected to the chip can be further narrowed, realizing a higher screen-to-body ratio.

[0046] In the COP bonding process, the bonding connection between the pins of the chip and the connection components of the flexible display screen needs to be completed by using a thermocompression bonding connection technology.

[0047] Thermocompression bonding technology is a connection method for bonding and electrically connecting a chip or other components to a substrate or a wafer. The two are combined through high temperature and appropriate pressure is applied during the bonding process to ensure close contact between their surfaces, and finally a connection relationship with good strength is formed.

[0048] Since the connection components on the flexible display screen usually include multiple rows of regularly arranged sub-connection components, the area between multiple rows of sub-connection components is not only used to separate multiple rows of sub-connection components, but also an array line for connecting each sub-connection component is arranged. When completing the step of thermocompression bonding to electrically connect the chip and the flexible display screen, the flexible material polyimide (PI) of the flexible substrate in the interval area between multiple rows of sub-connection components will have a large deformation due to thermocompression, and the sub-connection components will also have a certain displacement amount, resulting in cracks easily occurring in the flexible substrate in the interval area, causing the array lines arranged in this area to break, leading to problems such as abnormal display effects.

[0049] Based on the consideration and technical needs of solving the above problems, the present application proposes a display panel, a preparation method of the display panel, and a display module.

[0050] Please refer to Figure 1 and Figure 2, in a first aspect, an embodiment of the present application provides a display panel 100, including a flexible substrate 10 and a pad assembly 20.

[0051] The flexible substrate 10 includes traces 11.

[0052] The pad assembly 20 is disposed on one side of the flexible substrate 10. The pad assembly 20 includes two or more first bonding portions 2 spaced along a first direction X. A spacer region 30 is provided between two adjacent first bonding portions 2 along the first direction X. The first bonding portion 2 includes a pad 21, and the pad 21 is connected to the trace 11.

[0053] Wherein, a through groove 31 is provided in the spacer region 30, the through groove 31 penetrates through the flexible substrate 10, and a trace gap 32 is further provided in the spacer region 30. Each trace 11 is connected to each pad 21 via the trace gap 32.

[0054] In the display panel 100 provided by the embodiment of the present application, a through groove 31 penetrating through the flexible substrate 10 is provided in the spacer region 30, which improves the problem of extrusion accumulation of the flexible substrate 10 between the first bonding portions 2 caused by the deformation amount of the flexible substrate 10 and the displacement amount of the pad 21 during the bonding process of the pad 21 of the first bonding portion 2, thereby improving the problem that the flexible substrate 10 cracks and causes the trace 11 to break.

[0055] The flexible substrate 10 should be understood here to include a substrate material and film layers such as organic layers and inorganic layers prepared on the substrate material for arranging array lines and encapsulation. The material of the substrate material can be polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone or polyethylene naphthalate; the inorganic layer can specifically be film layers such as silicon nitride, silicon oxide, silicon oxynitride, etc., and the material of the organic layer can be hexamethyldisiloxane, epoxy resin or polyimide (PI), and can also be other silicon-based adhesive materials with a light transmittance of more than 90%, or other organic adhesive materials with a slightly lower light transmittance (greater than 80%) and a slightly higher bending strength. In this regard, the embodiment of the present application does not make any restrictions.

[0056] Optionally, the traces 11 are specifically disposed between film layers such as the inorganic layer and the organic layer in the flexible substrate 10. While the multiple traces 11 are insulated and spaced by the inorganic layer, part of the inorganic layer and the organic layer realize the encapsulation of the entire display panel 100. The traces 11 can be led out from the display area of the display panel 100 via the non-display area of the display panel 100 between various different inorganic layers to achieve electrical connection with an external chip or other components. The embodiment of the present application does not make any restrictions on the specific position setting of the traces 11 led out from the flexible substrate 10.

[0057] The pad assembly 20 is disposed on one side of the flexible substrate 10, and the pad assembly 20 is exposed from one side of the flexible substrate 10 to facilitate electrical connection with a chip or other components.

[0058] Optionally, both the pad assembly 20 and the trace 11 are electrically conductive components and are both arranged in a patterned manner. The trace 11 is a pattern with a wider pitch and a thinner line width; the pad assembly 20 is a pattern with a denser pitch and a thicker line width. The pad assembly 20 having a pattern with a denser pitch and a thicker line width can ensure that when the display panel 100 is connected to a chip or other components, such as a Flexible Printed Circuit (FPC), it has better connectivity and conductivity, is conducive to installation, and reduces the probability of failures.

[0059] The pad assembly 20 is provided with first bonding portions 2 spaced along the first direction X, and pads 21 are further provided within the first bonding portions 2. In the embodiment of the present application, the pad assembly 20 divides the pads 21 into a plurality of first bonding portions 2 arranged at intervals along the first direction X.

[0060] Since the trace 11 needs to form electrical connections with each of the pads 21 in the pad assembly 20, at least one trace 11 in the structural arrangement of the display panel 100 needs to pass through a spacer 30 provided between two first bonding portions 2 to achieve the electrical connection between the pads 21 and the trace 11.

[0061] The spacer 30 is provided between the first bonding portions 2. When the display panel 100 is electrically connected to a chip or other components using a thermocompression bonding technique, the spacer 30 will undergo a large deformation due to thermocompression, and at the same time, the first bonding portions 2 on both sides of the spacer 30 will also have a displacement amount towards the spacer 30.

[0062] The spacer 30 is provided with a through groove 31. The provision of the through groove 31 can improve the problem of the flexible substrate 10 in the spacer 30 between the first bonding portions 2 being squeezed and accumulated due to the deformation amount of the flexible substrate 10 and the displacement amount of the pads 21 during the bonding process. The generated deformation amount and displacement amount are absorbed by the through groove 31, and the flexible substrate 10 is not likely to crack.

[0063] The through groove 31 is a groove penetrating the flexible substrate 10, and it at least penetrates the flexible material of the prepared substrate, the inorganic layer and the organic layer for arranging the array lines and encapsulation. It is not easy for any part of the film layer in the flexible substrate 10 to cause squeezing and accumulation of the flexible substrate 10 in the spacer 30.

[0064] The spacer 30 is also provided with a wiring gap 32. The wiring 11 can pass through the spacer 30 via the wiring gap 32. And since the spacer 30 is provided with a through slot 31, the problem that the wiring 11 breaks due to cracks generated in the flexible substrate 10 can be improved.

[0065] In some embodiments, the through slot 31 includes a first through slot 311 located on one side of each pad 21 in the first direction X. The wiring gap 32 is provided on at least one side of the first through slot 311 in the second direction Y, and the first direction X intersects with the second direction Y.

[0066] In these embodiments, the first through slot 311 is provided on one side of the pad 21 in the first direction X, which can absorb the displacement amount of the pad 21 along the first direction X, and further improve the problem that the flexible substrate 10 in the spacer 30 is extruded and accumulated, resulting in cracks and causing the wiring 11 to break.

[0067] In the related art, during the connection step of thermocompression bonding, the displacement amount of the pad 21 on one side in the first direction X is larger, resulting in cracks in the flexible substrate 10 in the spacer 30 on the first direction X side of the pad 21 first.

[0068] In the embodiments of the present application, the first through slot 311 is provided on one side of the pad 21 in the first direction X, which can better improve the problem of extrusion and accumulation of the flexible substrate 10 in the spacer 30 and reduce the risk of cracks in the flexible substrate 10.

[0069] At the same time, the wiring gap 32 is provided on at least one side of the first through slot 311 in the second direction Y, which can prevent the wiring 11 from passing through between the first through slot 311 and the pad 21, and further reduce the risk of the wiring 11 breaking.

[0070] Optionally, for the sake of clear illustration, the first direction X and the second direction Y are perpendicular to each other.

[0071] The directions defined as the first direction X and the second direction Y are only for convenience of description. The specific settings of the first direction X and the second direction Y in the embodiments of the present application are not limited, as long as it is ensured that the first direction X and the second direction Y intersect and are not the same or opposite directions.

[0072] In some alternative embodiments, two or more pads 21 are spaced along the second direction Y. The first through slots 311 corresponding to adjacent pads 21 are spaced. The wiring gaps 32 corresponding to each pad 21 are provided between the first through slots 311. The wirings 11 connected to each pad 21 are connected to each pad 21 via their corresponding wiring gaps 32.

[0073] In these alternative embodiments, the first through slots 311 are arranged at intervals, and the routing gap 32 is arranged between the first through slots 311. While ensuring that each pad 21 is correspondingly provided with a first through slot 311 on one side in the first direction X, the space between the through slots 31 is reasonably utilized to arrange the routing gap 32, so as to realize the reasonable arrangement of the routing 11.

[0074] In some embodiments, the pads 21 of two or more first bonding parts 2 are arranged in alignment along the first direction X, and the first through slots 311 are arranged between two adjacent pads 21 along the first direction X.

[0075] In these embodiments, the first through slots 311 are arranged between two adjacent pads 21 along the first direction X, which can further absorb the displacement amount of the two adjacent pads 21 along the first direction X, and further improve the problem that the flexible substrate 10 in the spacer area 30 is squeezed and accumulated, resulting in cracks and causing the routing 11 to break.

[0076] In the related art, when the pads 21 in two first bonding parts 2 are arranged in alignment along the first direction X, in the connection step of thermocompression bonding, the material of the flexible substrate 10 in the spacer area 30 between the two pads 21 first generates cracks. And since the multiple pads 21 in one first bonding part 2 can be arranged at intervals along the second direction Y, the cracks generated between two pads 21 that are arranged in alignment along the first direction X and belong to two different first bonding parts 2 can extend along the second direction Y, and multiple cracks extend and connect into a crack that penetrates the entire spacer area 30 along the second direction Y, resulting in the problem that multiple routings 11 in the spacer area 30 are all broken.

[0077] In the embodiments of the present application, first through slots 311 are arranged between the pads 21 that are oppositely arranged along the first direction X and belong to two different first bonding parts 2, so that the displacement amount of the two pads 21 and the deformation amount of the material of the flexible substrate 10 between the two pads 21 are both absorbed by the first through slots 311, which can better improve the problem of extrusion and accumulation of the flexible substrate 10 in the spacer area 30 and reduce the risk of cracks in the flexible substrate 10.

[0078] In some alternative embodiments, one of the two first through slots 311 corresponding to two adjacent pads 21 arranged at intervals along the second direction Y has a larger size than the other.

[0079] In these alternative embodiments, the sizes of two adjacent first through slots 311 are not the same, which further makes it difficult for the spacer area 30 to form a crack that penetrates the entire spacer area 30 along the second direction Y, and further reduces the risk of cracks in the flexible substrate 10.

[0080] Please refer to Figure 3, in some embodiments, the through groove further includes a second through groove 312 disposed on one side of the pad 21 in the second direction Y, and the trace gap 32 is disposed on the side of the second through groove 312 away from the pad 21 in the second direction.

[0081] In these embodiments, the second through groove 312 is disposed on one side of the pad 21 in the second direction Y, which can further absorb the displacement of the pad 21 along the second direction Y, further improve the problem of extrusion accumulation of the flexible substrate 10 in the spacer 30, and reduce the risk of the flexible substrate 10 cracking and causing the trace 11 to break.

[0082] In the related art, during the thermal compression bonding connection step of the pad 21, partial displacement also occurs on one side of the pad 21 in the second direction Y, resulting in cracks easily appearing in the flexible substrate 10 in the spacer 30 on one side of the pad 21 in the second direction Y.

[0083] In the embodiments of the present application, the through groove 31 further includes a second through groove 312 disposed on one side of the pad 21 in the second direction Y, which can better improve the problem of extrusion accumulation of the flexible substrate 10 in this area of the spacer 30, thereby reducing the risk of cracks in the flexible substrate 10.

[0084] At the same time, the trace gap 32 is disposed on the side of the second through groove 312 away from the pad 21 in the second direction Y, which can enable the trace 11 to pass through between the second through groove 312 and the pad 21, further reducing the risk of the trace 11 breaking.

[0085] In some alternative embodiments, the second through groove 312 includes at least two second sub-grooves 3121, and the trace gap 32 is disposed between a second sub-groove 3121 of one pad 21 and a second sub-groove 3121 of another adjacent pad 21 spaced apart in the second direction Y.

[0086] In these alternative embodiments, the second through groove 312 further includes two second sub-grooves 3121, and the trace gap 32 is disposed between the second sub-grooves 3121 belonging to two second through grooves 312 respectively. Since the displacement amounts of the pads 21 along the second direction Y in the thermal compression bonding connection step are different, setting the second through groove 312 as two second sub-grooves 3121 can better absorb the displacement amount of the pad 21 along the second direction Y, improve the problem of extrusion accumulation of the flexible substrate 10, and thus reduce the risk of cracks in the flexible substrate 10.

[0087] In some alternative embodiments, the second through groove 312 communicates with the first through groove 311.

[0088] In these alternative embodiments, while the second through slot 312 can be prepared simultaneously with the first through slot 311, after the first through slot 311 communicates with the second through slot 312, the through slot 31 can provide more redundant space for the displacement of the pad 21 along the first direction X and the second direction Y, which can better improve the problem of extrusion and accumulation of the flexible substrate 10 in the spacer 30, thereby reducing the risk of cracks in the flexible substrate 10.

[0089] In some alternative embodiments, the second sub-slot 3121 communicates with the first through slot 311.

[0090] In these alternative embodiments, while the second sub-slot 3121 can be prepared simultaneously with the first through slot 311, the first through slot 311 and the two second sub-slots 3121 can form a redundant space around one end of the pad 21, which can better improve the problem of extrusion and accumulation of the flexible substrate 10 in the spacer 30, thereby reducing the risk of cracks in the flexible substrate 10.

[0091] In some embodiments, one of the two second sub-slots 3121 disposed on both sides of the same trace gap 32 has a larger size than the other.

[0092] In these embodiments, the sizes of the two second sub-slots 3121 disposed on both sides of the same trace gap 32 are inconsistent, further improving the problem that the crack formed between the two second sub-slots 3121 extends further along the second direction Y.

[0093] In some alternative embodiments, the two second through slots 312 corresponding to the pads 21 disposed on adjacent two bonding portions communicate with the first through slot 311 along the first direction X, and one of the two second through slots 312 has a larger size than the other.

[0094] In these alternative embodiments, the sizes of the two second through slots 312 connected to the same first through slot 311 are inconsistent and can be flexibly adjusted according to actual design requirements.

[0095] In some alternative embodiments, one of the two second sub-slots 3121 located on one side of the first through slot 311 along the first direction X and communicating with the same first through slot 311 has a larger size than the other.

[0096] In these alternative embodiments, the sizes of the two second sub-slots 3121 located on one side of the first through slot 311 along the first direction X and communicating with each other are inconsistent, further improving the problem that the crack formed between the two second sub-slots 3121 extends further along the second direction Y.

[0097] In some embodiments, the trace 11 connects the pad 21 via a plurality of trace gaps 32 aligned along the first direction X.

[0098] In these embodiments, the trace 11 may need to pass through a plurality of spacer regions 30. When the trace 11 passes through the plurality of spacer regions 30, by arranging and connecting the pads 21 via a plurality of trace gaps 32 aligned in the first direction X, it is possible to save the layout space of the trace 11 while improving the problem that the trace 11 needs to extend along the second direction Y and the trace gaps 32 cannot effectively protect it.

[0099] The trace 11 passes through the spacer region 30 via a trace gap 32 within one spacer region 30. In the case where the trace 11 needs to pass through a plurality of spacer regions 30, the trace 11 selects a plurality of trace gaps 32 aligned in the first direction X. The path of the trace 11 is the shortest, which can save the layout space of the trace 11 while improving the problem that the portion of the trace 11 that needs to extend along the second direction Y between the spacer regions 30 cannot be effectively protected by the trace gaps 32.

[0100] In some alternative embodiments, the distances from the trace 11 to the first through slots 311 on both sides are kept the same.

[0101] In these alternative embodiments, the distances from the trace 11 to the first through slots 311 on both sides of the trace gap 32 are kept the same, further enhancing the protection effect of the trace gap 32 on the trace 11.

[0102] Please refer to Figure 4 , Second aspect, the embodiments of the present application further provide a method for manufacturing a display panel 100, including:

[0103] Step S10, please refer to Figure 5 , prepare the trace 11 within the flexible substrate 10;

[0104] Step S20, please refer to Figure 6 , prepare a pad assembly 20 on one side of the flexible substrate 10. The pad assembly 20 includes two or more first bonding portions 2 spaced apart in the first direction X. A spacer region 30 is provided between two adjacent first bonding portions 2 in the first direction X. The first bonding portion 2 includes a pad 21, and the pad 21 is connected to the trace 11;

[0105] Step S30, please refer to Figure 7 , open a through slot 31 in the spacer region 30. The through slot 31 penetrates the flexible substrate 10. The spacer region 30 further includes a trace gap 32, and each trace 11 is connected to each pad 21 via the trace gap 32.

[0106] The method for manufacturing the display panel 100 provided by the embodiments of the present application penetrates and sets the through slot 31 on the flexible substrate 10 after the flexible substrate 10 and the pad assembly 20 are manufactured, which does not affect the existing process steps and has simple process steps.

[0107] Please refer toFigure 5 , the flexible substrate 10 at least includes a substrate material and film layers such as an organic layer and an inorganic layer formed on the substrate material. The trace 11 can be led out from between multiple different inorganic layers, and the manufacturing method of the display panel 100 provided in the embodiments of the present application does not limit this.

[0108] Please refer to Figure 6 , the pad assembly 20 is formed on one side of the flexible substrate 10, and is a grid pattern with relatively dense spacing and wide line width relative to the trace 11, having better connectivity and conductivity, being conducive to installation and forming an electrical connection with a chip or other components.

[0109] Please refer to Figure 7 , in the spacer 30 between the two first bonding parts 2, a through groove 31 penetrating the flexible substrate 10 is directly opened. The through groove 31 penetrates all film layers such as the substrate material, the organic layer, and the inorganic layer. The spacer 30 further includes a trace gap 32 between the through grooves 31.

[0110] Please refer to Figure 8 and Figure 9 , thirdly, the embodiments of the present application further provide a display module 1000, including any display panel 100 provided in the embodiments of the first aspect and a second bonding member 4, and the display panel 100 and the second bonding member 4 are bonded and connected.

[0111] For the display module 1000 provided in the embodiments of the present application, since it includes the display panel 100 provided in the above embodiments of the first aspect, the display module 1000 provided in the embodiments of the third aspect of the present application has the beneficial effects of the display panel 100 in the embodiments of the first aspect, which will not be elaborated here.

[0112] In some embodiments, the second bonding member 4 includes a chip 40. The chip 40 includes a chip body 41 and a second bonding part 42 connected to the chip body 41, and the display panel 100 and the second bonding member 4 are bonded and connected through the second bonding part 42.

[0113] In these embodiments, the chip body 41 is directly connected to the display panel 100 through the second bonding part 42 to form a COP bonding.

[0114] The texture of the chip 40 is harder than that of the flexible substrate 10 of the display panel 100 and is not easily deformed relative to the display panel 100. The chip 40 can be regarded as a rigid body, and in the connection step of thermocompression bonding, the deformation amount generated by the chip 40 can be ignored.

[0115] In some alternative embodiments, the second bonding part 42 includes a bump 421, and the bump 421 is connected to the chip body 41 along the thickness direction Z of the chip body 41.

[0116] In these alternative embodiments, the chip body 41 is electrically connected to the display panel 100 by bumps 421, which has a high connection density and strong reliability.

[0117] The bump 421 is a connection technology for connecting the chip 40 to other external devices. The bump 421 is usually a tiny columnar structure made of a conductive material, which is disposed on one side surface of the chip body 41 and has good integration.

[0118] The conductive materials used for the bump 421 include but are not limited to tin, copper, gold, and other alloy materials, which can provide good electrical conductivity.

[0119] In the thermocompression bonding technology, the bump 421 and the display panel 100 are press-fitted correspondingly under appropriate temperature and pressure to form an electrical connection.

[0120] Although the present application has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0121] It should also be noted that the exemplary embodiments mentioned in the present application are some methods or systems described based on a series of steps or devices. However, the present application is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, or different from the order in the embodiments, or several steps can be executed simultaneously.

Claims

1. A display panel, characterized in that: include: Flexible substrates, including traces; A pad assembly is arranged on one side of the flexible substrate, the pad assembly includes two or more first binding parts arranged at intervals along a first direction, a spacing area is arranged between two first binding parts adjacent to each other along the first direction, the first binding part includes a pad, and the pad is connected to the trace; The spacing area is provided with a through slot, and the through slot passes through the flexible substrate. The spacing area is also provided with a wiring gap, and each of the wirings is connected to each of the pads via the wiring gap.

2. The display panel according to claim 1, characterized in that: The through slot includes a first through slot located on one side of each of the pads in the first direction, the wiring gap is arranged on at least one side of the first through slot in the second direction, and the first direction intersects with the second direction; Preferably, more than two of the pads are spaced apart along the second direction, the first through grooves corresponding to adjacent pads are spaced apart, the routing gaps corresponding to each of the pads are arranged between the first through grooves, and the routing connected to each of the pads connects each of the pads via the corresponding routing gaps.

3. The display panel according to claim 2, characterized in that: The pads of two or more of the first binding parts are aligned along the first direction, and the first through groove is arranged between two adjacent pads along the first direction; Preferably, a size of one of the two first through grooves corresponding to two adjacent solder pads spaced apart along the second direction is larger than a size of the other one.

4. The display panel according to claim 2, characterized in that: The through-slot further includes a second through-slot disposed on one side of the pad in the second direction, and the wiring gap is disposed on a side of the second through-slot away from the pad in the second direction.

5. The display panel according to claim 4, characterized in that: The second through groove includes at least two second sub-grooves, and the wiring gap is arranged between one of the second sub-grooves of one of the pads and one of the second sub-grooves of another adjacent pad arranged at intervals along the second direction; Preferably, the second through groove is connected to the first through groove; Preferably, the second sub-groove is communicated with the first through-groove.

6. The display panel according to claim 5, characterized in that: One of the two second sub-grooves arranged on both sides of the same wiring gap has a size larger than the other; Preferably, two second through-grooves arranged corresponding to the pads arranged on two adjacent binding portions are connected to the first through-grooves along the first direction, and a size of one of the two second through-grooves is larger than a size of the other; Preferably, a size of one of the two second sub-grooves located at one side of the first through-groove along the first direction and connected to the same first through-groove is larger than a size of the other.

7. The display panel according to claim 2, characterized in that: The routing wires are connected to the pads via a plurality of routing gaps aligned along the first direction; Preferably, the distances from the wiring to the first through slots on both sides are kept consistent.

8. A method for preparing a display panel, characterized in that: include: preparing traces within a flexible substrate; A pad assembly is prepared on one side of the flexible substrate, wherein the pad assembly includes two or more first binding parts spaced apart along a first direction, a spacing area is provided between two first binding parts adjacent to each other along the first direction, the first binding part includes a pad, and the pad is connected to the trace; A through slot is provided in the spacing area, and the through slot passes through the flexible substrate. The spacing area also includes a wiring gap, and each wiring is connected to each pad via the wiring gap.

9. A display module, characterized in that: include: The display panel according to any one of claims 1 to 7; second binding member; The display panel is bound and connected to the second binding member.

10. The display module according to claim 9, characterized in that: The second binding member includes a chip, the chip includes a chip body and a second binding portion connected to the chip body, and the display panel is bound and connected to the second binding member via the second binding portion; Preferably, the second binding portion comprises a bump, and the bump is connected to the chip body along a thickness direction of the chip body.

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