Circuit board, antenna package and display device

Abstract

The present invention relates to a circuit board, an antenna package, and a display device. The circuit board according to one embodiment includes a core layer including a first region and a second region, and an antenna feed line disposed on the core layer across the first region and the second region, wherein the antenna feed line includes a first portion extending in a first direction over the first region, a second portion extending in a second direction over the first region, and a third portion extending in the first direction over the second region, and a distance between adjacent second portions of the antenna feed line may be three times or less the distance between adjacent third portions of the antenna feed line.

Description

[Technical Field]

[0001] The present invention relates to a circuit board, an antenna package, and a display device. [Background technology]

[0002] In recent years, with the development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth (registered trademark) have been combined with display devices, for example, in the form of smartphones, in which an antenna is coupled to the display device to perform communication functions.

[0003] Recently, with the advancement of mobile communication technology, it has become necessary to couple an antenna for communication in high frequency or ultra-high frequency bands, for example, corresponding to 3G to 5G, to a display device.

[0004] To drive the antenna to radiate, a circuit board can be connected to the antenna for power supply, transmission of control signals, etc. The circuit board can be bent, for example, to connect to the antenna drive circuit, and in this case, damage to the wiring on the circuit board and poor bonding with the antenna due to bending stress can occur.

[0005] Meanwhile, the thickness of display devices to which antennas are coupled is decreasing, and the bezel area of display devices is also decreasing. Therefore, it is necessary to design a circuit board and antenna package that can couple an antenna even with a small bezel area, while maintaining or improving the radiation characteristics of the antenna and ensuring the reliability of circuit board bonding and circuit connection. Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention aims to provide a circuit board, an antenna package, and a display device. [Means for solving the problem]

[0007] 1. A circuit board comprising: a core layer including a first region and a second region; and an antenna feed wiring arranged on the core layer across the first region and the second region, wherein the antenna feed wiring comprises a first portion extending in a first direction on the first region, a second portion extending in a second direction on the first region, and a third portion extending in the first direction on the second region, and wherein the spacing between adjacent second portions of the antenna feed wiring is three times or less the spacing between adjacent third portions of the antenna feed wiring.

[0008] 2. The circuit board according to item 1, wherein the distance between adjacent second portions of the antenna feed wiring is 0.5 times or more the distance between adjacent third portions of the antenna feed wiring.

[0009] 3. The circuit board according to item 1, wherein the distance between adjacent third portions of the antenna feed wiring is 0.05 mm or more and 1 mm or less.

[0010] 4. The circuit board according to item 1, wherein the distance between adjacent third portions of the antenna feed wiring is 0.1 mm or more and 0.7 mm or less.

[0011] 5. A circuit board according to item 1, wherein the first area includes an antenna area where an antenna unit and the antenna power supply wiring are connected, and the second area includes an antenna driving part area where an antenna driving part and the antenna power supply wiring are connected.

[0012] 6. The circuit board according to item 1, wherein the antenna feed lines are formed to have substantially the same length.

[0013] 7. In the circuit board according to item 6, the antenna feed wiring is formed so that the gain deviation of the antenna unit connected to the antenna feed wiring is within 1 dBi, or so that the phase delay difference of the antenna feed wiring is within 10 degrees.

[0014] 8. An antenna package including a circuit board according to any one of the preceding embodiments and an antenna unit connected to the antenna power supply wiring of the circuit board.

[0015] 9. A display device including the antenna package according to item 8. [Effects of the Invention]

[0016] According to one embodiment, the circuit board may include a core layer including a first region and a second region, and antenna feed lines disposed on the core layer across the first region and the second region, wherein the antenna feed lines may be formed such that the spacing in the first direction in the first region is within a predetermined multiple of the spacing in the second direction in the second region.

[0017] This allows the independence of electrical signals applied to each antenna unit to be maintained, preventing signal interference between the antenna power supply wirings, and shortening the length of the first region of the circuit board in the first direction, making it possible to easily couple the antenna package including the circuit board to the display device even if the area of the light shielding portion or bezel portion formed on the front surface of the display device is small. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a schematic plan view showing an antenna package according to an embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view showing an antenna package according to an embodiment. [Figure 3] FIG. 3 is a schematic plan view showing an antenna package according to another embodiment. [Figure 4] FIG. 4 is a schematic plan view showing a display device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the drawings attached to this specification are intended to illustrate preferred embodiments of the present invention and, together with the detailed description of the invention, serve to further understand the technical concept of the present invention, and therefore the present invention should not be interpreted as being limited to only the matters depicted in the drawings.

[0020] Terms such as "first," "second," etc., are used to describe multiple components, but are only used to distinguish one component from another. A singular expression includes a plural expression unless the context clearly indicates otherwise. Terms such as "comprise" or "have" indicate the presence of a stated feature, number, step, operation, component, part, or combination thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0021] Additionally, directional terms such as "one side," "other side," "upper side," "lower side," "top side," "bottom side," "first direction," "second direction," etc. are used in relation to the orientation of the disclosed figures. Because components of embodiments of the present invention can be positioned in a variety of orientations, directional terms are used for illustrative purposes and not as a limitation.

[0022] FIG. 1 is a schematic plan view showing an antenna package according to an embodiment, and FIG. 2 is a schematic cross-sectional view showing an antenna package according to an embodiment.

[0023] 1 and 2, an antenna package according to one embodiment may include an antenna element 100 and a circuit board 200.

[0024] The antenna element 100 may include an antenna dielectric layer 110 and an antenna unit 120 .

[0025] The antenna dielectric layer 110 may include an insulating material having a predetermined dielectric constant. According to an embodiment, the antenna dielectric layer 110 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, or metal oxide, or an organic insulating material such as epoxy resin, acrylic resin, or imide resin. The antenna dielectric layer 110 may function as a film substrate of the antenna element 100 on which the antenna unit 120 is formed.

[0026] According to an embodiment, the antenna dielectric layer 110 may include thermoplastic resins such as polyester-based resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose-based resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resins; acrylic-based resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene-based resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin-based resins such as polyethylene, polypropylene, polyolefins having a cyclo- or norbornene structure, and ethylene-propylene copolymers; vinyl chloride-based resins; amide-based resins such as nylon and aromatic polyamides; imide-based resins; polyethersulfone-based resins; sulfone-based resins; polyetheretherketone-based resins; polyphenylene sulfide-based resins; vinyl alcohol-based resins; vinylidene chloride-based resins; vinyl butyral-based resins; arylate-based resins; polyoxymethylene-based resins; and epoxy-based resins. These may be used alone or in combination. Also, a transparent film made of a thermosetting resin or an ultraviolet curable resin such as a (meth)acrylic, urethane, acrylic urethane, epoxy, or silicone resin can be used as the antenna dielectric layer 110 .

[0027] According to an embodiment, the antenna dielectric layer 110 may include an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0028] According to an embodiment, the antenna dielectric layer 110 may be formed substantially as a single layer, or may be formed as a multi-layer structure of at least two layers.

[0029] The antenna dielectric layer 110 forms capacitance or inductance, which can adjust the frequency band in which the antenna element 100 can be driven or sensed. If the dielectric constant of the antenna dielectric layer 110 exceeds about 12, the driving frequency may be too low to achieve driving in a desired high frequency band. Therefore, according to one embodiment, the dielectric constant of the antenna dielectric layer 110 may be adjusted to a range of about 1.5 to 12, preferably a range of about 2 to 12.

[0030] The antenna unit 120 may be formed on the upper surface of the antenna dielectric layer 110. For example, a plurality of antenna units 120 may be linearly or non-linearly arranged on the upper surface of the antenna dielectric layer 110 to form an array antenna.

[0031] The antenna unit 120 may include a low-resistivity metal such as silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), or calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination. For example, the antenna unit 120 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy) to achieve low resistance. As another example, the antenna unit 120 may include copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) to achieve low resistance and enable fine linewidth patterning.

[0032] According to one embodiment, the antenna unit 120 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx), or copper oxide (CuO).

[0033] According to one embodiment, the antenna unit 120 may include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the metal layer can improve flexibility and reduce resistance to improve signal transmission speed, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0034] According to an exemplary embodiment, the antenna unit 120 may include a blackening treatment, which reduces the reflectivity on the surface of the antenna unit 120 and reduces the visibility of the pattern due to light reflection.

[0035] According to one embodiment, a blackened layer may be formed by converting the surface of a metal layer included in the antenna unit 120 into a metal oxide or metal sulfide. According to one embodiment, a blackened layer such as a black material coating layer or plating layer may be formed on the antenna unit 120 or the metal layer. Here, the black material or plating layer may include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or an oxide, sulfide, alloy, etc. containing at least one of these elements.

[0036] The composition and thickness of the blackening layer can be adjusted taking into consideration the effect of reducing reflectance and the radiation characteristics of the antenna.

[0037] The antenna unit 120 may include a radiator 122 and a transmission line 124 .

[0038] The radiator 122 may be formed in a mesh structure, which increases the transmittance of the radiator 122 and improves the flexibility of the antenna element 100. Therefore, the antenna element 100 can be effectively applied to a flexible display device.

[0039] The size of the radiator 122 can be determined by the desired resonant frequency, radiation resistance, and gain. For example, the antenna unit 120 or radiator 122 can be implemented to transmit and receive signals in a resonant frequency band that enables high frequency or ultra-high frequency (e.g., 3G, 4G, 5G or higher) mobile communications, Wi-Fi, Bluetooth, NFC, GPS, etc.

[0040] The radiator 122 may be rectangular as shown in Fig. 1. However, this is merely one embodiment, and there is no particular limitation on the shape of the radiator 122. That is, the radiator 122 may be embodied in the shape of a polygonal plate having various shapes such as a diamond shape, a circle, etc.

[0041] A transmission line 124 may be formed extending from the radiator 122 .

[0042] According to one embodiment, the transmission line 124 may be integrally connected to the radiator 122 and formed from a substantially single member, or may be formed from a separate member from the radiator 122 .

[0043] According to one embodiment, the transmission line 124 may be formed as a mesh structure having substantially the same shape as the radiator 122 (e.g., the same line width, the same spacing, etc.), but is not limited thereto, and may also be formed as a mesh structure having a shape substantially different from that of the radiator 122.

[0044] The antenna unit 120 may further include a signal pad 126 .

[0045] The signal pad 126 may be connected to an end of the transmission line 124 and electrically connected to the radiator 122 via the transmission line 124. According to one embodiment, the signal pad 126 may be formed as a substantially single member integrally connected to the transmission line 124, or may be formed as a member separate from the transmission line 124. For example, the signal pad 126 may be formed as a member substantially integral with the transmission line 124, with the termination of the transmission line 124 being provided at the signal pad 126.

[0046] According to one embodiment, ground pads 128 may be arranged around the signal pad 126. For example, a pair of ground pads 128 may be arranged facing each other across the signal pad 126. The ground pads 128 may be electrically and physically separated from the signal pad 126 and the transmission line 124 around the signal pad 126.

[0047] According to one embodiment, the signal pad 126 and the ground pad 128 may be formed as a solid structure made of the aforementioned metals or alloys, taking into consideration reduction of power supply resistance, noise absorption efficiency, etc.

[0048] Meanwhile, according to one embodiment, a dummy pattern (not shown) may be formed around the radiator 122 and the transmission line 124. The dummy pattern may include the same metal as the radiator 122 and / or the transmission line 124, and may be formed in a mesh structure having a shape that is substantially the same as or different from that of the radiator 122 and / or the transmission line 124.

[0049] According to an embodiment, the antenna element 100 may further include an antenna ground layer 130 formed on the bottom surface of the antenna dielectric layer 110. The antenna ground layer 130 may include the above-mentioned metals or alloys. By including the antenna ground layer 130 in the antenna element 100, vertical radiation characteristics may be achieved.

[0050] The antenna ground layer 130 may at least partially overlap the antenna unit 120. For example, the antenna ground layer 130 may entirely overlap the radiator 122, but not overlap the transmission line 124, the signal pad 126, and the ground pad 128. As another example, the antenna ground layer 130 may entirely overlap the radiator 122 and the transmission line 124, but not overlap the signal pad 126 and the ground pad 128. As yet another example, the antenna ground layer 130 may entirely overlap the radiator 122, the transmission line 124, the signal pad 126, and the ground pad 128.

[0051] According to an embodiment, a conductive member of a display device or a display panel on which the antenna package is mounted may be provided by the antenna ground layer 130. For example, the conductive member may include electrodes or wiring such as a gate electrode, source / drain electrode, pixel electrode, common electrode, data line, scan line, etc. of a thin film transistor (TFT) included in the display panel, as well as a stainless steel (SUS) plate, a heat dissipation sheet, a digitizer, an electromagnetic wave shielding layer, a pressure sensor, and a fingerprint sensor of the display device.

[0052] The circuit board 200 may include a core layer 210 and an antenna feed wiring 220. According to one embodiment, the circuit board 200 may be a flexible printed circuit board (FPCB).

[0053] The core layer 210 may include, for example, a flexible resin such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc. The core layer 210 may include an internal insulating layer included in the circuit board 200.

[0054] The core layer 210 can include a first region 210a and a second region 210b. The first region 210a can include an antenna region 211 to which the antenna element 100 is connected, and the second region 210b can include an antenna driver region 212 to which the antenna driver 300 is connected. The pads 126 and 128 of the antenna element 100 can be bonded to the core layer 210 via the antenna region 211, and the antenna unit 120 can be connected to the antenna feed wiring 220. Furthermore, as shown in FIG. 1 , the antenna driver 300 can be mounted on the core layer 210 via the antenna driver region 212, and the antenna driver 300 can be connected to the antenna feed wiring 220. This allows the antenna driver 300 to feed power and apply a drive signal to the antenna unit 120 via the antenna feed wiring 220. Meanwhile, according to one embodiment, unlike Fig. 1, a connector for connecting circuit board 200 to another circuit board on which an antenna driver is mounted can be mounted in antenna driver region 212. In this case, the connector can connect antenna power supply wiring 220 to an antenna driver mounted on the other circuit board. Also, according to one embodiment, antenna driver region 212 can be formed in a form that can be fastened to a connector of another circuit board on which an antenna driver is mounted (for example, an FFC (Flexible Flat Cable) or an FFC connector (ZIF (Zero Insertion Force) type and Non-ZIF type)) without mounting antenna driver 300 and a connector.

[0055] According to an embodiment, the first region 210a and the second region 210b may have different widths. For example, the first region 210a may be wider than the second region 210b. The relatively wider first region 210a may ensure sufficient bonding stability with the antenna element 100. The relatively narrower second region 210b may improve the flexibility and circuit connection characteristics of the antenna package. For example, the circuit board 200 may be folded at the boundary between the first region 210a and the second region 210b. As a result, the antenna element 100 and the first region 210a may be disposed on the front side of the display device, and the antenna driver 300 and the second region 210b may be disposed on the side or rear side of the display device.

[0056] The antenna feed line 220 may be disposed on one surface of the core layer 210. For example, the circuit board 220 may further include a coverlay film formed on one surface of the core layer 210 and covering the antenna feed line 220. In this case, the coverlay film of the circuit board 200 may be partially removed to expose one end of the antenna feed line 220, and the exposed end of the antenna feed line 220 may be bonded to the signal pad 126. More specifically, after a conductive intermediary structure 150 such as an anisotropic conductive film (ACF) is attached to the signal pad 126 and the ground pad 128, the antenna region 211 of the circuit board 200, where the exposed end of the antenna feed line 220 is located, may be disposed on the conductive intermediary structure 150. Thereafter, the antenna region 211 of the circuit board 200 may be attached to the antenna element 100 by a heat treatment / pressure process, and the antenna feed line 220 may be electrically connected to each signal pad 126. Furthermore, by arranging the ground pads 128 around the signal pads 126, the adhesive strength with the anisotropic conductive film (ACF) increases, improving bonding stability.

[0057] The antenna feed wiring 220 can be connected individually and independently to each of the antenna units 120. This allows for independent power supply / drive control for each of the antenna units 120. For example, the antenna feed wiring 220 connected to each of the antenna units 120 can apply phase signals different from each other to each of the antenna units 120.

[0058] The antenna feed wiring 220 can be formed across the first region 210a and the second region 210b. For example, the antenna feed wiring 220 can be formed extending from the antenna region 211 toward the antenna driver region 212.

[0059] The antenna feed lines 220 may be formed to have substantially the same length. Here, "substantially the same length" refers not only to the case where the lengths are completely the same, but also to the case where the lengths are not completely the same due to process issues but satisfy a predetermined condition. In this case, the predetermined condition may be that the gain deviation of the antenna unit 120 connected to the antenna feed line 220 is within 1 dBi and / or that the phase delay difference of the antenna feed line 220 is within 10 degrees.

[0060] The antenna feed wiring 220 may be bent one or more times in the first region 210a. This allows the antenna feed wiring 220 to be arranged in a limited region with substantially the same length. For example, the antenna feed wiring 220 may include one or more first portions 220a extending from the first region 210a in a first direction (e.g., the y direction in FIG. 1), one or more second portions 220b extending from the first region 210a in a second direction (e.g., the x direction in FIG. 1), and a third portion 220c extending from the second region 210b in the first direction (e.g., the y direction in FIG. 1).

[0061] According to one embodiment, the distance a between adjacent second portions 220b of the antenna feed line 220 may be 0.5 to 3 times the distance b between adjacent third portions 220c of the antenna feed line 220. In this case, the distance b between adjacent third portions 220c of the antenna feed line 220 may be 0.05 to 1 mm, preferably 0.1 to 0.7 mm. By setting the distance a between adjacent second portions 220b of the antenna feed line 220 to be 0.5 to 3 times the distance b between adjacent third portions 220c of the antenna feed line 220, the independence of the electrical signals applied to each antenna unit 120 can be maintained, signal interference between the antenna feed lines 220 can be prevented, and the length of the first region 210a in the first direction (e.g., the y direction in FIG. 1 ) can be shortened. This makes it possible to arrange the first region 210a in the light-shielding portion or bezel portion of the display device even if the area of the light-shielding portion or bezel portion formed on the front surface of the display device is small.

[0062] According to one embodiment, a ground layer 230 may be disposed on the other side of the core layer 210 .

[0063] The ground layer 230 can overlap with the antenna feed line 220. The ground layer 230 can absorb or shield noise and signal interference around the antenna feed line 220. Furthermore, the ground layer 230 can promote the generation of an electric field from the antenna feed line 220, thereby improving signal transmission efficiency.

[0064] Meanwhile, according to an embodiment, the antenna feed line 220 and the ground layer 230 may include the metals or alloys mentioned above.

[0065] 3 is a schematic plan view showing an antenna package according to another embodiment. Referring to FIG. 3, a circuit board 200 may include a bonding pad 225 formed around an antenna feed wiring 220. The bonding pad 225 may be included in an antenna region 211 of the circuit board 200.

[0066] The bonding pads 225 can be formed on one surface of the core layer 210 together with the antenna feed line 220. For example, a pair of bonding pads 225 can be arranged with one antenna feed line 220 sandwiched between them.

[0067] The bonding pad 225 is electrically and physically separated from the antenna feed wiring 220 and can be bonded to the ground pad 128 of the antenna element 100 via a conductive intermediary structure 150 (see FIG. 2). By including the bonding pad 225 in the antenna region 211 of the circuit board 200, the bonding stability between the antenna element 100 and the circuit board 200 can be further improved.

[0068] 4 is a schematic plan view of a display device according to an embodiment, more specifically, a front or window surface of the display device.

[0069] 4, the front surface of the display device 400 may include a display area 410 and a peripheral area 420. The display area 410 refers to an area where visual information is displayed, and the peripheral area 420 may refer to opaque areas disposed on both sides and / or both ends of the display area 410. For example, the peripheral area 420 may correspond to a light-shielding portion or a bezel portion of the display device 400.

[0070] The antenna element 100 described above may be positioned towards the front of the display device 400, for example, on the display panel. In one embodiment, the radiator 122 and / or the transmission line 124 may at least partially overlap the display area 410.

[0071] In this case, the radiator 122 and / or the transmission line 124 can form a mesh structure, which can prevent a decrease in transmittance due to the radiator 122 and / or the transmission line 124.

[0072] The circuit board 200 may be disposed in the peripheral region 420 to prevent degradation of image quality in the display region 410. According to one embodiment, the circuit board 200 may be folded at the boundary between the first region 210a and the second region 210b. As a result, the first region 210a may be disposed in the peripheral region 420 of the display device, and the antenna driver 300 and the second region 210b may be disposed on the side or rear of the display device.

[0073] As described above, by forming the spacing in the first direction in first region 210a of antenna feed wiring 220 to be within a predetermined multiple of the spacing in the second direction in second region 210b, it is possible to maintain the independence of the electrical signals applied to each antenna unit 120, prevent signal interference between antenna feed wirings 220, and shorten the length in the first direction of first region 210a. This makes it possible to arrange first region 210a in the shading portion or bezel portion of the display device even if the area of the shading portion or bezel portion formed on the front surface of the display device is small.

[0074] The present invention has been described above with a focus on preferred embodiments. Those skilled in the art will understand that the present invention can be realized in various modified forms without departing from the essential characteristics of the invention. Therefore, the scope of the present invention is not limited to the above-described embodiments, and various embodiments within the scope of the claims should be construed as being included in the present invention.

[0075] [Experimental example: Evaluation of the signal transmission rate of an antenna feed line based on the ratio of the distance a between adjacent second sections to the distance b between adjacent third sections in the antenna feed line] An antenna package was formed as shown in Fig. 1. The signal transmission rate of the antenna feed line was evaluated while adjusting the ratio of the distance a between adjacent second portions 220b of the antenna feed line 220 to the distance b between adjacent third portions 220c of the antenna feed line 220.

[0076] [Table 1]

[0077] Referring to Table 1, it can be seen that the ratio of the spacing a between adjacent second portions 220b of the antenna feed line 220 to the spacing b between adjacent third portions 220c of the antenna feed line 220 is 0.2 and 3.5 in the comparative examples, but is 0.5 to 3 in the examples, which show excellent signal transmission rates in the antenna feed line.

Claims

1. a core layer including a first region and a second region; an antenna feeder wiring disposed on the core layer across the first region and the second region, the antenna feed wiring includes a first portion extending in a first direction on the first region, a second portion extending in a second direction perpendicular to the first direction on the first region, and a third portion extending in the first direction on the second region, a distance between adjacent second portions of the antenna feed wiring that is three times or less the distance between adjacent third portions of the antenna feed wiring.

2. 2. The circuit board according to claim 1, wherein the distance between the adjacent second portions of the antenna feed wiring is at least 0.5 times the distance between the adjacent third portions of the antenna feed wiring.

3. The circuit board according to claim 1 , wherein the distance between adjacent third portions of the antenna feed wiring is not less than 0.05 mm and not more than 1 mm.

4. 2. The circuit board according to claim 1, wherein the distance between adjacent third portions of the antenna feed wiring is 0.1 mm or more and 0.7 mm or less.

5. the first area includes an antenna area to which an antenna unit and the antenna feed wiring are connected, The circuit board according to claim 1 , wherein the second area includes an antenna driving section area where an antenna driving section and the antenna power supply wiring are connected.

6. The circuit board according to claim 1 , wherein the antenna feed lines are formed to have substantially the same length.

7. 7. The circuit board according to claim 6, wherein the antenna feed wiring is formed so that a gain deviation of an antenna unit connected to the antenna feed wiring is within 1 dBi or a phase delay difference of the antenna feed wiring is within 10 degrees.

8. The circuit board according to claim 1; an antenna unit connected to the antenna power supply wiring of the circuit board;

9. A display device comprising the antenna package of claim 8.

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