Electric conduction structure of circuit board in flexible substrate

Abstract

To provide an electric conduction structure of a circuit board in a flexible substrate.SOLUTION: An electric conduction structure of a circuit board in a flexible substrate according to the present invention includes a flexible substrate, a circuit layer, and at least a welding structure and an electric connection structure. The flexible substrate includes a first surface, a second surface, one side surface, and a plurality of grooves. The first surface and the second surface are disposed opposite to each other and the side surface connects the first surface and the second surface. On the side surface, the grooves are formed and connect the first surface and the second surface. The circuit layer is formed on the first surface, and the circuit layer forms at least one conductive structure near the side surface of the flexible substrate. The welding structure is disposed on the second surface of the flexible substrate. The electric connection structure connects the conductive structure and the welding structure, and the electric connection structure extends from the first surface to the second surface of the flexible substrate.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to the technical field of circuit board structures, particularly to the electrical conduction structure of circuit boards on flexible substrates. [Background technology]

[0002] The current design trend for electronic products is to slim down, which means that multiple electronic modules must be installed in a very limited space, requiring the electronic modules to be connected by flexible circuit boards and cables. The circuit layers of existing flexible circuit boards are located on one side of the surface, making them inapplicable to designs that require circuit layers and solder structures on two sides. Therefore, how to form circuit layers and solder structures on both surfaces of a flexible board is an important development direction for circuit boards on flexible boards. Summary of the Invention [Problem to be solved by the invention]

[0003] In view of this, the object of the present invention is to provide an electrical conduction structure for a circuit board on a flexible substrate, thereby solving the problem of how to conduct circuits on both sides of a circuit board on a flexible substrate. [Means for solving the problem]

[0004] One embodiment of an electrically conductive structure for a circuit board in a flexible substrate of the present invention comprises a flexible substrate, a circuit layer, and at least a welding structure and an electrical connection structure. The flexible substrate has a first surface, a second surface, a side surface, and a plurality of grooves, the first surface and the second surface being arranged relative to each other, the side surface connecting the first surface and the second surface, and the grooves formed in the side surface connecting the first surface and the second surface. The circuit layer is formed on the first surface, and the circuit layer forms at least one conductive structure near the side surface of the flexible substrate. The welding structure is disposed on the second surface of the flexible substrate. The electrical connection structure connects the conductive structure and the welding structure, and the electrical connection structure extends from the first surface to the second surface of the flexible substrate.

[0005] In another embodiment, the electrical connection structure includes at least one conductor layer, the conductor layer being formed on a groove wall of the groove, the conductor layer being connected to the conductive structure and the welding structure.

[0006] In another embodiment, the flexible substrate includes at least one through hole, the through hole penetrating the flexible substrate and connecting the first surface and the second surface, the electrical connection structure including a conductor layer formed on the hole wall of the through hole, and the conductor layer connected to the conductive structure and the welding structure.

[0007] In another embodiment, the electrical connection structure includes a plurality of conductor layers, the conductor layers being formed on a groove wall of at least one groove.

[0008] In another embodiment, the flexible substrate includes at least one accommodating recess, the accommodating recess is formed in the first surface, the conductive structure is disposed in the accommodating recess, and the conductive structure is flush with the first surface.

[0009] In another embodiment, the conductive structures are metal bumps disposed on the first surface.

[0010] In another embodiment, the weld structure is a metal bump disposed on the second surface.

[0011] In another embodiment, the conductive structures are conductive nodes disposed on the first surface.

[0012] The electrically conductive structure of the circuit board in the flexible substrate of the present invention is formed by forming a groove on the side surface of the flexible substrate and / or by forming a through hole in the flexible substrate, and an electrical connection structure that connects the circuit layer and the welding structure is formed in this groove and / or through hole, thereby connecting the circuit layers and the welding structure arranged on the two surfaces of the flexible substrate. [Effects of the Invention]

[0013] The electrically conductive structure of the circuit board in the flexible substrate of the present invention can obtain a conductive structure that conducts electricity between the circuit layer and the welding structure through a simple process, and does not require the use of relatively complicated process parts such as flexible wire arrangements (FFC), making it applicable to thin electronic devices. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a three-dimensional schematic diagram of a first embodiment of an electrical conduction structure of a circuit board in a flexible substrate of the present invention; [Figure 2] 2 is a three-dimensional view of the electrical conduction structure of the circuit board in the flexible substrate of FIG. 1, seen from another perspective. [Figure 3] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Figure 4] 4 is a cross-sectional view of a second embodiment of the electrical conduction structure of a circuit board in a flexible substrate of the present invention. FIG. [Figure 5] 10 is a cross-sectional view of a third embodiment of the electrical conduction structure of a circuit board in a flexible substrate of the present invention. FIG. [Figure 6] 10 is a cross-sectional view of a fourth embodiment of the electrical conduction structure of a circuit board in a flexible substrate of the present invention. FIG. [Figure 7] 10 is a cross-sectional view of a fourth embodiment of the electrical conduction structure of a circuit board in a flexible substrate of the present invention. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0015] Please refer to Figures 1, 2, and 3, which show a first embodiment of an electrically conductive structure of a circuit board in a flexible substrate of the present invention. The electrically conductive structure of a circuit board in a flexible substrate in this embodiment includes a flexible substrate 10, a circuit layer 20, at least one welding structure 30, and an electrical connection structure 40. The flexible substrate 10 includes a first surface 11, a second surface 12, a side surface 13, and a plurality of grooves 14. The first surface 11 and the second surface 12 are arranged opposite each other, and the side surface 13 connects the first surface 11 and the second surface 12. The side surface 13 has a plurality of grooves 14 formed therein, connecting the first surface 11 and the second surface 12, with the groove walls of the grooves 14 forming arcs. The grooves 14 can be formed by first drilling a plurality of circular holes in the flexible substrate 10, and then cutting the flexible substrate 10 along straight lines passing through the centers of the circular holes, i.e., by cutting the grooves 14 to form the shapes of half holes, commonly known as stamp holes.

[0016] The circuit layer 20 is formed on the first surface 11, and the circuit layer 20 forms a conductive structure 21 near the position of the side surface 13 of the flexible substrate 10. The flexible substrate 10 of this embodiment further includes a plurality of accommodating recesses 15, which are formed on the first surface 11. The accommodating recesses 15 of this embodiment are rectangular and connected to the grooves 14, and the conductive structures 21 are disposed in the accommodating recesses 15, and the conductive structures 21 are flush with the first surface 11. In another embodiment, the conductive structures 21 may be metal bumps formed on the first surface 11.

[0017] A weld structure 30 is disposed on the second surface 12 of the flexible substrate 10 . The welding structure 30 in this embodiment is a metal bump formed on the second surface 12, and the welding structure 30 is connected to the groove 14. The electrical connection structure 40 connects the conductive structure 21 and the welding structure 30, and the electrical connection structure 40 in this embodiment includes a conductor layer 41, which is formed on the groove wall of the groove 14 and extends from the first surface 11 to the second surface 12 of the flexible substrate 10, and the conductor layer 41 is connected to the conductive structure 21 and the welding structure 30, so that the conductive structure 21 and the welding structure 30 form an electrical connection.

[0018] In this embodiment, the circuit layer 20, the welding structure 30, and the electrical connection structure 40 are formed on the flexible substrate 10 by an electroplating process. The circuit layer 20, the welding structure 30, and the electrical connection structure 40 can be made of copper.

[0019] Please refer to FIG. 4, which shows a second embodiment of the electrical conduction structure of a circuit board on a flexible substrate of the present invention. Since this embodiment has the same structure as the first embodiment, the same components are designated by the same symbols and their description will be omitted. The differences between this embodiment and the first embodiment are that the side surface 13 of the flexible substrate 10 of this embodiment does not have a groove 14, and the flexible substrate 10 of this embodiment has a through hole 16. The conductor layer 41 of the electrical connection structure 40 of this embodiment is formed on the hole wall of this through hole 16. The conductor layer 41 connects the conductive structure 21 and the welding structure 30, thereby forming an electrical connection between the conductive structure 21 and the welding structure 30. In this embodiment, the circuit layer 20, the welding structure 30, and the electrical connection structure 40 are formed on the flexible substrate 10 by electroplating. The circuit layer 20, the welding structure 30, and the electrical connection structure 40 can be made of copper.

[0020] Please refer to FIG. 5 , which illustrates a third embodiment of an electrical conduction structure for a circuit board in a flexible substrate of the present invention. Since this embodiment has the same structure as the first embodiment, the same components are designated by the same reference numerals and their description will be omitted. The flexible substrate 10 of this embodiment differs from the first embodiment in that it has a groove 14 on its side surface 13 and also has a through hole 16. The conductor layer 41 of the electrical connection structure 40 of this embodiment is formed on the groove wall of the groove 14 and the hole wall of the through hole 16. The conductor layer 41 is connected to the conductive structure 21 and the welding structure 30, thereby forming an electrical connection between the conductive structure 21 and the welding structure 30. The circuit layer 20, welding structure 30, and electrical connection structure 40 of this embodiment are formed on the flexible substrate 10 by electroplating. The circuit layer 20, welding structure 30, and electrical connection structure 40 may be made of copper.

[0021] Please refer to Figure 6, which shows a fourth embodiment of the electrical conduction structure of a circuit board on a flexible substrate of the present invention. Since this embodiment has a partially identical structure to the first embodiment, the same components are given the same symbols and their description will be omitted. The difference between this embodiment and the first embodiment is that the conductive structure 21 of this embodiment is formed at the conductive junction of the first surface 11, the conductor layer 41 of the electrical connection structure 40 is formed on the groove wall of the groove 14, and the conductor layer 41 is connected to the conductive structure 21 and the welding structure 30, thereby forming an electrical connection between the conductive structure 21 and the welding structure 30.

[0022] Please refer to Figure 6, which shows a fifth embodiment of the electrical conductive structure of a circuit board on a flexible substrate of the present invention. This embodiment has a partially identical structure to the second embodiment, so the same components are given the same symbols and their descriptions are omitted. The difference between this embodiment and the second embodiment is that the conductive structure 21 of this embodiment is formed at the conductive junction of the first surface 11, and the conductor layer 41 of the electrical connection structure 40 is formed on the groove wall of the groove 14. The conductor layer 41 connects the conductive structure 21 and the welded structure 30, thereby forming an electrical connection between the conductive structure 21 and the welded structure 30.

[0023] The electrically conductive structure of the circuit board in the flexible substrate of the present invention is formed by forming grooves on the side surface of the flexible substrate and / or through holes in the flexible substrate to form an electrical connection structure connecting the grooves and / or through holes, thereby connecting the circuit layers arranged on the two surfaces of the flexible substrate to the welding structure. The electrically conductive structure of the circuit board in the flexible substrate of the present invention can obtain a conductive structure that conducts electricity between the circuit layers and the welding structure through a simple process, and does not require the use of relatively complicated process parts such as flexible wire arrangements (FFC), making it applicable to thin electronic devices.

[0024] However, the above are merely preferred embodiments of the present invention and cannot limit the scope of the embodiments of the present invention. In other words, all simple equivalent changes and modifications made according to the scope of the patent application and the description of the new model of the present invention still fall within the scope of the patent of the present invention. Furthermore, any embodiment of the present invention or the scope of the patent application may not achieve all of the objectives, advantages, or features disclosed in the present invention. In addition, the abstract and title are used only to assist in searching patent documents and do not limit the scope of the invention rights. Furthermore, the terms "first" and "second" mentioned in this specification or the scope of the patent application are used only to name components (elements) or to distinguish different embodiments or scopes, and are not used to limit the upper or lower limits on the number of components. [Explanation of symbols]

[0025] 10 Flexible substrate 11 1st surface 12 Second surface 13 Side 14 groove 15 Recessed storage area 16 through holes 20 circuit layers 21 Conductive structure 30 Welded Structure 40 Electrical connection structure 41 Conductor layer

Claims

1. An electrical conduction structure of a circuit board on a flexible substrate, comprising: a flexible substrate, a circuit layer, at least one welding structure, and an electrical connection structure; the flexible substrate includes a first surface, a second surface, a side surface, and a plurality of grooves, the first surface and the second surface are disposed opposite to each other, the side surface is connected to the first surface and the second surface, the grooves are formed on the side surface, and the first surface and the second surface are connected; the circuit layer is formed on the first surface, the circuit layer forming at least one conductive structure at a position proximate the side of the flexible substrate; the at least one welded structure is disposed on the second surface of the flexible substrate; An electrically conductive structure of a circuit board on a flexible substrate, characterized in that the electrical connection structure connects the at least one conductive structure and the at least one welding structure, and the electrical connection structure extends from the first surface to the second surface through the groove.

2. 2. The electrically conductive structure of a circuit board on a flexible substrate according to claim 1, wherein the flexible substrate further includes at least one through hole, the at least one through hole penetrating the flexible substrate and communicating with the first surface and the second surface, the electrical connection structure being formed on the hole wall of at least one of the through holes and connected to the at least one conductive structure and the at least one welding structure.

3. 2. The electrically conductive structure of a circuit board in a flexible substrate according to claim 1, characterized in that the electrical connection structure includes at least one conductor layer, the at least one conductor layer being formed on a groove wall of at least one of the grooves, and the at least one conductor layer being connected to the at least one conductive structure and the at least one welding structure.

4. The electrical conduction structure of a circuit board in a flexible substrate according to claim 3 , characterized in that the electrical connection structure includes a plurality of conductor layers, and the plurality of conductor layers are further formed on a groove wall of at least one of the grooves.

5. 2. The electrically conductive structure of a circuit board in a flexible substrate according to claim 1, characterized in that the flexible substrate further comprises at least one accommodating recess, the at least one accommodating recess is formed in the first surface, the at least one conductive structure is disposed inside the at least one accommodating recess, and the at least one conductive structure is flush with the first surface.

6. The electrically conductive structure of a circuit board on a flexible substrate according to claim 1 , wherein the at least one conductive structure is a metal bump disposed on the first surface.

7. The electrically conductive structure of a circuit board on a flexible substrate according to claim 1 , wherein the at least one welding structure is a metal bump disposed on the second surface.

8. The electrically conductive structure of a circuit board on a flexible substrate according to claim 1 , wherein the at least one conductive structure is a conductive node disposed on the first surface.

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