Display panel, preparation method of display panel and display module

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display module, and the display panel comprises a flexible substrate which comprises wires; a reinforcing part; the bonding pad assembly comprises more than two first binding parts which are arranged at intervals in the first direction, a spacer region is arranged between the two first binding parts, each first binding part comprises a bonding pad, and the bonding pads are connected with the wires; wherein the spacer region comprises at least one channel region, the wire is connected with each bonding pad through the channel region, and the orthographic projection of the channel region and the orthographic projection of the reinforcing part on the flexible substrate are at least partially overlapped. According to the display panel provided by the embodiment of the invention, the wire is connected with each bonding pad through the channel region, and the reinforcing part is arranged to cover at least part of the channel region so as to solve the problem of deformation of the flexible substrate in the channel region; the problem that the flexible substrate is extruded and accumulated in the interval area due to the deformation amount of the flexible substrate and the displacement amount of the bonding pad in the bonding process of the bonding pad of the first bonding part is solved, and therefore the problem that the flexible substrate cracks, and wires are broken is solved.

Description

Technical Field

[0001] This application relates to the technical field of electronic products, and particularly relates to a display panel, a preparation method of the display panel, and a display module. Background Art

[0002] Currently, the electrical connection between a display panel and a chip is mainly achieved through a bonding process. In the Chip On Pi (COP) technology where the chip is directly bonded to the flexible substrate, the display panel is directly bonded to the chip. Due to the bonding pressure, the bonding area of the display panel will deform, which easily causes problems such as breakage of the array lines in the display panel. Summary of the Invention

[0003] Embodiments of this application provide a display panel, a preparation method of the display panel, and a display module, which can avoid the problem that the flexible substrate of the display panel cracks and causes the wiring to break.

[0004] In a first aspect, according to an embodiment of this application, a display panel is provided, including: a flexible substrate including wiring; a reinforcing part provided on one side of the flexible substrate; a pad assembly provided on one side of the flexible substrate, the pad assembly including two or more first bonding parts arranged at intervals in a first direction, an interval area is provided between two adjacent first bonding parts arranged in the first direction, the first bonding part includes a pad, and the pad is connected to the wiring; wherein, the interval area includes at least one channel area, the wiring is connected to each pad via the channel area, and at least part of the orthographic projection of the channel area and the reinforcing part on the flexible substrate overlaps.

[0005] According to an aspect of an embodiment of this application, the reinforcing part includes a first sub-part covering between two adjacent first bonding parts.

[0006] According to an aspect of an embodiment of this application, two or more pads are arranged at intervals in a second direction, the second direction intersects the first direction, and the reinforcing part further includes a second sub-part provided between two pads arranged at intervals in the second direction.

[0007] According to an aspect of an embodiment of this application, the reinforcing part covers at least part of the first bonding part, the reinforcing part further includes a plurality of hollow holes, at least part of the orthographic projection of the pad on the flexible substrate overlaps with the orthographic projection of the hollow hole on the flexible substrate, and the pad is exposed through the hollow hole.

[0008] According to an aspect of an embodiment of this application, the flexible substrate further includes a groove located in the interval area, the groove is provided on one side of each pad in the first direction, and the channel area is provided on at least one side of the groove in the second direction.

[0009] According to one aspect of the embodiments of the present application, two or more pads are arranged at intervals in the second direction, the grooves corresponding to adjacent pads are arranged at intervals, the channel regions corresponding to the respective pads are arranged between the grooves, and the traces connected to the respective pads are connected to the respective pads via their corresponding channel regions.

[0010] According to one aspect of the embodiments of the present application, the pads of two or more first bonding portions are arranged in alignment in the first direction, and the grooves are arranged between two adjacent pads along the first direction.

[0011] In a second aspect, according to the embodiments of the present application, another display panel is provided. The display panel includes: a bonding region, the bonding region includes a flexible substrate, a bonding layer, and a reinforcing layer that are sequentially arranged along the thickness direction of the display panel, and the reinforcing layer includes at least one layer of rigid material; the bonding layer includes at least two groups of pads, the flexible substrate includes traces, and the pads and the traces are connected to each other; the flexible substrate further includes at least one groove, the reinforcing layer includes at least one reinforcing portion, the reinforcing portion and the groove are arranged between the two groups of pads, and at least a part of the orthographic projection of the reinforcing portion on the flexible substrate covers a part of the flexible substrate between the grooves.

[0012] According to one aspect of the embodiments of the present application, the flexible substrate further includes a first insulating layer and a second insulating layer, the first insulating layer includes at least one layer of inorganic layer, the second insulating layer includes at least one layer of organic layer, the inorganic layer includes through holes, the organic layer includes recessed portions arranged in the through holes, and the through holes and the recessed portions form grooves.

[0013] In a third aspect, according to the embodiments of the present application, a method for manufacturing a display panel is provided, including:

[0014] Preparing traces in the flexible substrate;

[0015] Preparing a pad assembly on one side of the flexible substrate, the pad assembly includes two or more first bonding portions arranged at intervals in the first direction, a spacer region is arranged between two adjacent first bonding portions along the first direction, the first bonding portion includes a pad, the pad and the trace are connected to each other, the spacer region includes at least one channel region, and the trace is connected to each pad via the channel region;

[0016] Preparing a reinforcing portion on one side of the flexible substrate, and at least a part of the orthographic projection of the reinforcing portion on the flexible substrate overlaps with the channel region.

[0017] According to one aspect of the embodiments of the present application, the step of preparing traces in the substrate further includes:

[0018] Preparing a first insulating layer, the first insulating layer includes at least one layer of inorganic layer;

[0019] Opening through holes in the inorganic layer;

[0020] Form a second insulating layer, the second insulating layer includes at least one organic layer, the organic layer includes a recessed portion disposed within a via hole, the via hole and the recessed portion form a groove, and a channel region is disposed on at least one side of the groove in a second direction.

[0021] In a fourth aspect, a display module according to an embodiment of the present application includes: a display panel as described in any one of the preceding items; a second bonding member; and the display panel and the second bonding member are bonded and connected.

[0022] According to one aspect of an embodiment of the present application, the second bonding member includes a chip, the chip includes a chip body and a second bonding portion connected to the chip body, and the display panel and the second bonding member are bonded and connected through the second bonding portion.

[0023] According to one aspect of an embodiment of the present application, the second bonding portion includes a bump, and the bump is connected to the chip body along the thickness direction of the chip body.

[0024] According to one aspect of an embodiment of the present application, the thickness of the reinforcing portion does not exceed the sum of the thickness of the bump and the thickness of the pad.

[0025] The display panel, the manufacturing method of the display panel, and the display module provided by the embodiments of the present application, the wiring is connected to each pad via the channel region, and a reinforcing portion is provided to cover at least a part of the channel region to improve the problem of deformation of the flexible substrate in the channel region, and to improve the problem of the amount of deformation of the flexible substrate and the displacement amount of the pad in the bonding process of the pads of the first bonding portion causing the flexible substrate in the spacer region to be squeezed and accumulated, thereby improving the problem that the flexible substrate has cracks and causes the wiring to break. Description of the Drawings

[0026] The features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the drawings.

[0027] Figure 1 is a top view structural schematic diagram of a display panel provided by an embodiment of the present application;

[0028] Figure 2 is Figure 1 an enlarged structural schematic diagram of region A in the embodiment;

[0029] Figure 3 is Figure 2 a cross-sectional structural schematic diagram taken along the B-B direction in;

[0030] Figure 4 is a flowchart schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application;

[0031] Figure 5 is a flowchart schematic diagram of another manufacturing method of a display panel provided by an embodiment of the present application;

[0032] Figures 6 to 11 It is a schematic diagram of the process steps of a method for manufacturing a display panel provided by an embodiment of the present application;

[0033] Figure 12 It is a top view structural schematic diagram of a display module provided by an embodiment of the present application;

[0034] Figure 13 is Figure 12 A schematic cross-sectional structure diagram along the C-C direction in the embodiment.

[0035] Wherein:

[0036] 10 - Flexible substrate; 11 - Circuit trace; 12 - First insulating layer; 13 - Second insulating layer; 121 - Inorganic layer; 1211 - Through hole; 131 - Organic layer; 1311 - Recessed portion;

[0037] 20 - Pad assembly; 2 - First bonding portion; 21 - Pad;

[0038] 30 - Spacer; 31 - Channel region; 32 - Groove;

[0039] 40 - Reinforcing portion; 41 - First sub-portion; 42 - Second sub-portion; 43 - Hollow hole;

[0040] 50 - Bonding region; 51 - Bonding layer; 52 - Reinforcing layer;

[0041] 6 - Second bonding member; 60 - Chip; 61 - Chip body; 62 - Second bonding portion; 621 - Bump;

[0042] 100 - Display panel; 1000 - Display module;

[0043] X - First direction; Y - Second direction; Z - Thickness direction.

[0044] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale. Detailed implementation manners

[0045] Aspects of the present application and exemplary embodiments thereof will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely provided to better understand the present application by way of illustration of examples of the present application. In the accompanying drawings and the following description, at least some of the well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the present application; and, for clarity, the dimensions of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0046] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising... " does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0047] The orientation terms used in the following description are all the directions shown in the figures, and do not limit the specific structure of the display panel and display module of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "arranged" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present application may be understood according to specific circumstances.

[0048] Without departing from the spirit or scope of the present application, various modifications and variations can be made to the present application, which will be apparent to those skilled in the art. Therefore, the present application is intended to cover modifications and variations of the present invention that fall within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in the embodiments of the present application can be combined with each other without conflict.

[0049] Currently, the display screen needs to adopt a bonding process to achieve the electrical connection between the display screen and the chip. In the bonding process, COP bonding is the most mainstream solution among the bonding processes adopted in the current related technologies. The main implementation solution of COP bonding is to directly install the chip on the flexible display screen. When finally completing the encapsulation of the display screen, the COP bonding solution is to directly bend a part of the flexible display screen together with the chip to the backlight side of the display screen to complete the final encapsulation step. By adopting COP encapsulation, while achieving a thinner encapsulation thickness, the border width on the side where the display screen is connected to the chip can be further narrowed, realizing a higher screen-to-body ratio.

[0050] In the COP bonding process, the bonding connection between the pins of the chip and the connection components of the flexible display screen needs to be completed by using a thermocompression bonding connection technology.

[0051] Thermocompression bonding technology is a connection method for bonding and electrically connecting a chip or other components to a substrate or a base. The two are combined through high temperature and appropriate pressure is applied during the bonding process to ensure close contact between their surfaces, and finally a connection relationship with good strength is formed.

[0052] Since the connection components on the flexible display screen usually include multiple rows of regularly arranged sub-connection components, the area between the multiple rows of sub-connection components is not only used to space the multiple rows of sub-connection components, but also arranged with array lines connecting each sub-connection component. When electrically connecting the chip to the flexible display screen in the thermocompression bonding step, the flexible material polyimide (PI) of the flexible substrate for making the flexible substrate in the spacing area between the multiple rows of sub-connection components will undergo large deformation due to thermocompression, and the sub-connection components will also have a certain displacement amount, causing the flexible substrate in the spacing area to be prone to cracks, resulting in the fracture of the array lines arranged in this area and causing problems such as abnormal display effects.

[0053] Based on the consideration and technical needs of solving the above problems, the present application proposes a display panel, a preparation method of the display panel, and a display module.

[0054] Please refer to Figures 1 to 3 , an embodiment of the present application provides a display panel, including a flexible substrate 10, a reinforcing part 40, and a pad component 20.

[0055] The flexible substrate 10 includes traces 11.

[0056] The pad component 20 is disposed on one side of the flexible substrate 10. The pad component 20 includes two or more first bonding parts 2 spaced along a first direction X. A spacing area 30 is provided between two adjacent first bonding parts 2 along the first direction X. The first bonding part 2 includes pads 21, and the pads 21 are connected to the traces 11.

[0057] Among them, the spacer 30 includes at least one channel area 31. The trace 11 is connected to each pad 21 via the channel area 31, and the channel area 31 and the reinforcing portion 40 at least partially overlap in the orthographic projection of the flexible substrate 10.

[0058] In the display panel provided by the embodiment of the present application, the trace 11 is connected to each pad 21 via the channel area 31, and the reinforcing portion 40 is provided to cover at least part of the channel area 31 to improve the problem of deformation of the flexible substrate 10 in the channel area 31, and to improve the problem of extrusion accumulation of the flexible substrate 10 in the spacer 30 caused by the deformation amount of the flexible substrate 10 and the displacement amount of the pad 21 during the bonding process of the pad 21 of the first bonding portion 2, thereby improving the problem that the flexible substrate 10 cracks and causes the trace 11 to break.

[0059] The flexible substrate 10 should be understood here to include a substrate material and film layers such as an organic layer 131 and an inorganic layer 121 prepared on the substrate material for arranging array lines and encapsulation. The material of the substrate material can be polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone or polyethylene naphthalate; the inorganic layer 121 can specifically be a film layer such as silicon nitride, silicon oxide, silicon oxynitride, etc., and the material of the organic layer 131 can be hexamethyldisiloxane, epoxy resin or polyimide (PI), and can also be other silicon-based adhesive materials with a light transmittance of more than 90%, or other organic adhesive materials with a slightly lower light transmittance (greater than 80%) and a slightly higher flexural strength. In this regard, the embodiment of the present application does not make any restrictions.

[0060] Optionally, the trace 11 is disposed between film layers such as the inorganic layer 121 and the organic layer 131 in the flexible substrate 10. While the multiple traces 11 are insulated and spaced by the inorganic layer 121, part of the inorganic layer 121 and the organic layer 131 realize the encapsulation of the entire display panel. The trace 11 can be led out from the display area of the display panel to the non-display area of the display panel between various different inorganic layers 121 to achieve electrical connection with an external chip or other components. The embodiment of the present application does not make any restrictions on the setting of the specific position where the trace 11 is led out from the flexible substrate 10.

[0061] The reinforcing portion 40 can be set as a rigid material, including glass, stainless steel material, etc. The attachment means between the reinforcing portion 40 and the flexible substrate 10 can adopt an adhesive bonding scheme.

[0062] Optionally, before the connection step of thermocompression bonding the pad assembly 20 with other bonding components, an anisotropic conductive film (ACF) is also provided between the pad assembly 20 and other bonding components. The main components in the ACF adhesive layer are mainly an adhesive made of resin material and conductive particles distributed in the adhesive. When the ACF adhesive layer is attached between the pad assembly 20 and other bonding components, the conductive particles are crushed through heating and pressing during thermocompression bonding to form stable mechanical and electrical connections penetrating the ACF adhesive layer.

[0063] When an ACF adhesive layer is provided between the pad assembly 20 and other bonding components, the attachment of the reinforcing portion 40 can share the ACF adhesive layer with the pad assembly 20, and the reinforcing portion is adhered to the flexible substrate 10 using the ACF adhesive layer.

[0064] Optionally, a new adhesive layer is provided for the reinforcing portion 40 to adhere to the flexible substrate 10.

[0065] Optionally, both the pad assembly 20 and the trace 11 are electrically conductive connecting components and are both arranged in a patterned manner. The trace 11 is a pattern with a wider pitch and a thinner line width; the pad assembly 20 is a pattern with a denser pitch and a thicker line width. The pad assembly 20 having a pattern with a denser pitch and a thicker line width can ensure better connectivity and conductivity when the display panel is connected to a chip or other components, such as a flexible printed circuit (FPC), facilitating installation and reducing the probability of faults.

[0066] The pad assembly 20 is provided with a plurality of first bonding portions 2 at intervals along the first direction X, and a plurality of pads 21 are further provided within the first bonding portions 2. In the embodiment of the present application, the pad assembly 20 divides the pads 21 into a plurality of first bonding portions 2 arranged at intervals in sequence along the first direction X.

[0067] Since the trace 11 needs to form electrical connections with each pad 21 in the pad assembly 20, at least one trace 11 in the structural setting of the display panel needs to pass through a spacer 30 provided between two first bonding portions 2 to achieve the mutual connection between the pad 21 and the trace 11.

[0068] The spacer 30 is provided between the first bonding portions 2. When the display panel is electrically connected to a chip or other components using thermocompression bonding technology, the spacer 30 will undergo large deformation due to thermocompression, and at the same time, the first bonding portions 2 on both sides of the spacer 30 will also have a displacement amount towards the spacer 30.

[0069] While the spacer 30 is provided with a channel area 31 through which the trace 11 passes, the reinforcing portion 40 at least partially covers the channel area 31, so that the reinforcing portion 40 can improve the problem that the flexible substrate 10 in the channel area 31 deforms and cracks, resulting in the breakage of the trace 11.

[0070] In some embodiments, the reinforcing portion 40 includes a first sub-portion 41 covering between two adjacent first bonding portions 2.

[0071] In these embodiments, the first sub-portion 41 in the reinforcing portion 40 covers the area between the two first bonding portions 2, further improving the problem that the flexible substrate 10 in the spacer 30 deforms and cracks, resulting in the breakage of the trace 11.

[0072] In the related art, during the thermal compression bonding connection step, the displacement amount of the pad 21 at the position between the two first bonding portions 2 is larger, resulting in cracks appearing in the flexible substrate 10 in the spacer 30 between the two first bonding portions 2 first.

[0073] Optionally, in the related art, when the pads 21 in the two first bonding portions 2 are aligned along the first direction X, during the thermal compression bonding connection step, the material of the flexible substrate 10 in the spacer 30 between the two pads 21 first generates cracks, and since multiple pads 21 in one first bonding portion 2 can be spaced along the second direction Y, the cracks generated between the pads 21 in the two first bonding portions 2 that are aligned along the first direction X can extend along the second direction Y, and multiple cracks extend and connect into a crack that penetrates the entire spacer 30 along the second direction Y, causing the problem that multiple traces 11 in the spacer 30 are all broken.

[0074] In the embodiment of the present application, by covering the first sub-portion 41 in the reinforcing portion 40 between the two first bonding portions 2, the problem of deformation can be improved to prevent cracks from appearing, extending, and penetrating the entire spacer 30.

[0075] In some alternative embodiments, more than two pads 21 are spaced along the second direction Y, the second direction Y intersects with the first direction X, and the reinforcing portion 40 further includes a second sub-portion 42 provided between the two pads 21 spaced along the second direction Y.

[0076] In these alternative embodiments, the second sub-portion 42 is provided between the two pads 21 spaced along the second direction Y, which can further improve the problem of the displacement amount generated by the pads 21 along the second direction Y and the deformation amount of the flexible substrate 10 between the two pads 21, and improve the problem that the flexible substrate 10 in the area covered by the second sub-portion 42 deforms and cracks, resulting in the breakage of the trace 11.

[0077] In the related art, during the connection step of thermocompression bonding, the pad 21 also undergoes partial displacement on one side in the second direction Y, and the flexible substrate 10 between the two pads 21 also undergoes partial deformation, resulting in cracks easily occurring in the flexible substrate 10 within the spacer region 30 on the second direction Y side of the pad 21.

[0078] In the embodiment of the present application, the second sub - part 42 is arranged between two pads 21 spaced apart in the second direction Y, which can improve the problem of deformation, thereby reducing the risk of cracks in the flexible substrate 10.

[0079] Optionally, for the sake of clear illustration, the first direction X and the second direction Y are perpendicular to each other.

[0080] The directions defined as the first direction X and the second direction Y are only for the convenience of description. The specific settings of the first direction X and the second direction Y in the embodiment of the present application are not limited, as long as it is ensured that the first direction X and the second direction Y intersect and are not the same or opposite directions.

[0081] In some embodiments, the strengthening part 40 covers at least part of the first bonding part 2. The strengthening part 40 further includes a plurality of hollow holes 43. The orthographic projection of the pad 21 on the flexible substrate 10 and the orthographic projection of the hollow holes 43 on the flexible substrate 10 at least partially overlap, and the pad 21 is exposed through the hollow holes 43.

[0082] In these embodiments, the strengthening part 40 further extends to cover the first bonding part 2. While the pad 21 is exposed through the hollow holes 43 for convenient subsequent connection, the role of the strengthening part 40 in improving the deformation problem of the flexible substrate 10 is further enhanced.

[0083] In some embodiments, the flexible substrate 10 further includes a groove 32 located in the spacer region 30. The groove 32 is arranged on one side of each pad 21 in the first direction X, and the channel region 31 is arranged on at least one side of the groove 32 in the second direction Y.

[0084] In these embodiments, the groove 32 is arranged on one side of the pad 21 in the first direction X, which can absorb the displacement amount of the pad 21 along the first direction X, further improving the problem of extrusion accumulation of the flexible substrate 10 within the spacer region 30 and the problem of cracks occurring in the flexible substrate 10 resulting in the disconnection of the trace 11.

[0085] In the related art, during the connection step of thermocompression bonding, the displacement amount of the pad 21 on one side in the first direction X is larger, resulting in cracks first occurring in the flexible substrate 10 within the spacer region 30 on the first direction X side of the pad 21.

[0086] In the embodiment of the present application, the groove 32 is arranged on one side of the pad 21 in the first direction X, which can better improve the problem of extrusion accumulation of the flexible substrate 10 in the spacer region 30 and reduce the risk of cracks in the flexible substrate 10.

[0087] Meanwhile, the channel region 31 is disposed on at least one side of the groove 32 in the second direction Y, which can prevent the trace 11 from passing through between the groove 32 and the pad 21, and further reduce the risk of the trace 11 breaking.

[0088] In some alternative embodiments, more than two pads 21 are arranged at intervals in the second direction Y, the grooves 32 corresponding to adjacent pads 21 are arranged at intervals, the channel regions 31 corresponding to the respective pads 21 are disposed between the grooves 32, and the traces 11 connected to the respective pads 21 are connected to the respective pads 21 via the corresponding channel regions 31.

[0089] In these alternative embodiments, the grooves 32 are arranged at intervals, and the channel regions 31 are disposed between the grooves 32. While ensuring that the grooves 32 are correspondingly arranged on one side of each pad 21 in the first direction X, the space between the grooves 32 is reasonably utilized to dispose the channel regions 31, so as to realize the reasonable arrangement of the traces 11.

[0090] In some alternative embodiments, the pads 21 of more than two first bonding portions 2 are arranged in alignment in the first direction X, and the grooves 32 are disposed between two adjacent pads 21 in the first direction X.

[0091] In these alternative embodiments, the grooves 32 are disposed between two adjacent pads 21 in the first direction X, which can further absorb the displacement amount of the two side pads 21 in the first direction X, and further improve the problem that the flexible substrate 10 in the spacer region 30 is squeezed and accumulated, resulting in cracks and causing the traces 11 to break.

[0092] In the related art, when the pads 21 in the two first bonding portions 2 are arranged in alignment in the first direction X, in the connection step of thermocompression bonding of the pads 21, cracks are first generated in the flexible substrate 10 material in the spacer region 30 between the two pads 21. And since the multiple pads 21 in one first bonding portion 2 can be arranged at intervals in the second direction Y, the cracks generated between the two pads 21 that are arranged in alignment in the first direction X and belong to the two first bonding portions 2 can extend in the second direction Y, and multiple cracks extend and are connected into a crack that penetrates the entire spacer region 30 in the second direction Y, resulting in the problem that multiple traces 11 in the spacer region 30 are all broken.

[0093] In the embodiment of the present application, however, grooves 32 are disposed between the pads 21 that are oppositely arranged in the first direction X and belong to the two first bonding portions 2, so that the displacement amount of the two pads 21 and the deformation amount of the flexible substrate 10 material between the two pads 21 are both absorbed by the grooves 32, which can better improve the problem of extrusion accumulation of the flexible substrate 10 in the spacer region 30 and reduce the risk of cracks in the flexible substrate 10.

[0094] Please refer toFigure 1 and Figure 3 Second, an embodiment of the present application further provides a display panel, including a bonding area 50.

[0095] The bonding area 50 includes a flexible substrate 10, a bonding layer 51, and a reinforcing layer 52 that are sequentially arranged along the thickness direction Z of the display panel. The reinforcing layer 52 includes at least one layer of rigid material.

[0096] The bonding layer 51 includes at least two groups of pads 21, and the flexible substrate 10 includes traces 11. The pads 21 are connected to the traces 11.

[0097] The flexible substrate 10 further includes at least one groove 32, and the reinforcing layer 52 includes at least one reinforcing portion 40. The reinforcing portion 40 and the groove 32 are disposed between two groups of pads 21. The orthographic projection of the reinforcing portion 40 on the flexible substrate 10 at least partially covers a portion of the flexible substrate 10 between the grooves 32.

[0098] In the display panel provided by the embodiment of the present application, by providing the reinforcing layer 52 including at least one layer of rigid material, and the reinforcing portion 40 in the reinforcing layer 52 covering a portion of the flexible substrate 10 between the grooves 32, the deformation of the flexible substrate 10 can be prevented, and the problem of extrusion accumulation of the flexible substrate 10 between the two groups of pads 21 caused by the deformation amount of the flexible substrate 10 and the displacement amount of the pads 21 during the bonding process of the bonding layer 51 can be improved, thereby improving the problem that the flexible substrate 10 cracks and causes the traces 11 to break.

[0099] In some embodiments, the flexible substrate 10 further includes a first insulating layer 12 and a second insulating layer 13. The first insulating layer 12 includes at least one inorganic layer 121, the second insulating layer 13 includes at least one organic layer 131, the inorganic layer 121 includes a through hole 1211, and the organic layer 131 includes a recessed portion 1311 disposed in the through hole 1211. The through hole 1211 and the recessed portion 1311 form the groove 32.

[0100] In these embodiments, by opening the through hole 1211 in the inorganic layer 121 of the first insulating layer 12, and the organic layer 131 in the second insulating layer 13 sinks into the through hole 1211 of the inorganic layer 121 to form the recessed portion 1311, the through hole 1211 of the inorganic layer 121 and the recessed portion 1311 of the organic layer 131 jointly form the groove 32. The through hole 1211 is opened in the inorganic layer 121 with poor anti-deformation ability, so that the deformation of the inorganic layer 121 is absorbed by the through hole 1211, and cracks are not easily generated.

[0101] The inorganic layer 121 in the first insulating layer 12 mainly includes an insulating layer that serves to insulate the traces 11 in the flexible substrate 10 at intervals, and at least includes a chemical vapor deposition layer (CVD), a gate insulator layer (GI), a color insulator layer (CI), etc. The main components of these inorganic layers 121 are silicon, nitrogen, oxygen, and their combinations.

[0102] The organic layer 131 is mainly an encapsulation film layer provided for encapsulation purposes, and at least includes organic layers 131 such as a planarizer layer (PLN) and an ink jet printed layer (IJP).

[0103] The inorganic layer 121 has poor anti-deformation ability during the thermocompression bonding process and is prone to cracking. Therefore, through holes 1211 are formed in the inorganic layer 121, and the deformation amount of the inorganic layer 121 is absorbed through the through holes 1211 to further prevent the generation of cracks. At the same time, the organic layer 131 sinks into the through holes 1211 to form recessed portions 1311, and the through holes 1211 and the recessed portions 1311 together form a groove 32 on the flexible substrate 10.

[0104] Please refer to Figure 4 , in the third aspect, the embodiment of the present application further provides a method for manufacturing a display panel, including:

[0105] Step S10, please refer to Figure 6 , and prepare traces 11 in the flexible substrate 10.

[0106] Step S20, please refer to Figure 7 , prepare a pad assembly 20 on one side of the flexible substrate 10. The pad assembly 20 includes two or more first bonding parts 2 arranged at intervals along the first direction X. There is a spacer 30 between two adjacent first bonding parts 2 along the first direction X. The first bonding part 2 includes a pad 21, and the pad 21 is connected to the trace 11. The spacer 30 includes at least one channel area 31, and the trace 11 is connected to each pad 21 via the channel area 31.

[0107] Step S30, please refer to Figure 8 , prepare a reinforcing part 40 on one side of the flexible substrate 10, and the projection of the reinforcing part 40 on the flexible substrate 10 at least partially overlaps with the channel area 31.

[0108] In the method for manufacturing a display panel provided by the embodiment of the present application, the reinforcing part 40 is covered after the traces 11 and the pad assembly 20 in the flexible substrate 10 are prepared, and the process steps are simple.

[0109] Please refer to Figure 6, the flexible substrate 10 at least includes a substrate material and film layers such as an organic layer 131 and an inorganic layer 121 prepared on the substrate material. The trace 11 can be led out from between various different inorganic layers 121, and the preparation method of the display panel provided by the embodiments of the present application does not limit this.

[0110] Please refer to Figure 7 , the pad assembly 20 is formed on one side of the flexible substrate 10, and is a pattern with relatively dense spacing and wide line width relative to the trace 11, having better connectivity and conductivity, being beneficial to installation and forming an electrical connection with a chip or other components.

[0111] Please refer to Figure 8 , the reinforcing part 40 is specifically set as a rigid material, including glass, stainless steel material, etc. The attachment means between the reinforcing part 40 and the flexible substrate 10 mainly adopts an adhesive scheme.

[0112] Please refer to Figure 5 , in some embodiments, step S10 further includes:

[0113] Step S11, please refer to Figure 9 , prepare a first insulating layer 12, and the first insulating layer 12 includes at least one inorganic layer 121.

[0114] Step S12, please refer to Figure 10 , open a through hole 1211 in the inorganic layer 121.

[0115] Step S13, please refer to Figure 11 , prepare a second insulating layer 13, and the second insulating layer 13 includes at least one organic layer 131. The organic layer 131 includes a recessed portion 1311 disposed in the through hole 1211. The through hole 1211 and the recessed portion 1311 form a groove 32, and the channel region 31 is disposed on at least one side of the groove 32 in the second direction Y.

[0116] In these embodiments, while preparing the inorganic layer 121, a through hole 1211 is opened in the inorganic layer 121, so that the deformation of the inorganic layer 121 with poor anti-deformation ability is absorbed by the through hole 1211, and cracks are not easily generated.

[0117] Optionally, after step 20 is completed, the through holes 1211 in the inorganic layer are disposed on one side of each pad 21 of the pad assembly 20 in the first direction X, so that the groove 32 is also disposed on one side of each pad 21 of the pad assembly 20 in the first direction X.

[0118] Please refer to Figure 9 , in step S11, prepare a first insulating layer 12;

[0119] Please refer to Figure 10, in step S12, after the inorganic layer 121 is prepared, vias 1211 are etched on the inorganic layer 121 by means of coating, exposure, development, etc.;

[0120] Please refer to Figure 11 , in step S13, an organic layer 131 is prepared as a whole layer on the inorganic layer 121, and a part of the organic layer 131 sinks into the vias 1211 of the inorganic layer 121 to form recessed portions 1311, and the vias 1211 and the recessed portions 1311 form a groove 32.

[0121] Please refer to Figure 12 and Figure 13 , in a fourth aspect, an embodiment of the present application further provides a display module 1000, including a display panel and a second bonding member 6 provided in any one of the first aspect embodiment and the second aspect embodiment as described above.

[0122] The display panel is bonded and connected to the second bonding member 6.

[0123] For the display module 1000 provided by the embodiment of the present application, since it includes the display panel provided by the first aspect embodiment and the second aspect embodiment as described above, the display module 1000 provided by the third aspect embodiment of the present application has the beneficial effects of the display panel in the first aspect embodiment, which will not be elaborated here.

[0124] In some embodiments, the second bonding member 6 includes a chip 60, and the chip 60 includes a chip body 61 and a second bonding portion 62 connected to the chip body 61, and the display panel is bonded and connected to the second bonding member 6 through the second bonding portion 62.

[0125] In these embodiments, the chip body 61 is directly connected to the display panel through the second bonding portion 62 to form a COP bonding.

[0126] The texture of the chip 60 is harder than the flexible substrate 10 of the display panel and is not prone to deformation relative to the display panel. The chip 60 can be regarded as a rigid body, and in the connection step of thermocompression bonding, the deformation amount generated by the chip 60 can be ignored.

[0127] In some alternative embodiments, the second bonding portion 62 includes bumps 621, and the bumps 621 are connected to the chip body 61 along the thickness direction Z of the chip body 61.

[0128] In these alternative embodiments, the chip body 61 uses the bumps 621 to perform electrical connection with the display panel, with high connection density and strong reliability.

[0129] The bumps 621 are a connection technology for connecting the chip 60 to other external devices. The bumps 621 are usually tiny columnar structures made of conductive materials, provided on one side surface of the chip body 61, and have good integration.

[0130] The conductive material used for the bump 621 includes, but is not limited to, tin, copper, gold, and other alloy materials, which can provide good electrical conductivity.

[0131] In the thermocompression bonding technology, the bump 621 and the pad 21 of the display panel are press-fitted corresponding to each other under appropriate temperature and pressure to form an electrical connection.

[0132] Optionally, the thickness direction of the chip 60 and the thickness direction Z of the display panel are in the same direction.

[0133] In some alternative embodiments, the thickness of the reinforcing portion 40 does not exceed the sum of the thickness of the bump 621 and the thickness of the pad 21.

[0134] In these alternative embodiments, by adjusting the thicknesses of the bump 621 and the pad 21, it is ensured that the sum of their thicknesses is less than the thickness of the reinforcing portion 40, so that the space between the bump 621 and the pad 21 after connection can accommodate the reinforcing portion 40, ensuring that the setting of the reinforcing portion 40 does not interfere with the normal electrical connection between the bump 621 and the pad 21.

[0135] Although the present application has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: Flexible substrates, including traces; A reinforcing portion, disposed on one side of the flexible substrate; A pad assembly is arranged on one side of the flexible substrate, the pad assembly includes two or more first binding parts arranged at intervals along a first direction, a spacing area is arranged between two first binding parts adjacent to each other along the first direction, the first binding part includes a pad, and the pad is connected to the trace; The spacing area includes at least one channel area, the routing line connects the pads via the channel area, and the orthographic projection of the channel area and the reinforcing portion on the flexible substrate at least partially overlaps.

2. The display panel according to claim 1, characterized in that: The reinforcing portion includes a first sub-portion covering between two adjacent first binding portions; Preferably, more than two of the pads are spaced apart along a second direction, the second direction intersects the first direction, and the reinforcing portion further comprises a second sub-portion disposed between two of the pads spaced apart along the second direction.

3. The display panel according to claim 2, characterized in that: The reinforcing portion covers at least a portion of the first binding portion, and the reinforcing portion further includes a plurality of hollow holes. The orthographic projection of the pad on the flexible substrate overlaps at least partially with the orthographic projection of the hollow holes on the flexible substrate, and the pad is exposed from the hollow holes.

4. The display panel according to claim 1, characterized in that: The flexible substrate further comprises a groove located in the spacer area, the groove is arranged on one side of each of the pads in the first direction, and the channel area is arranged on at least one side of the groove in the second direction; Preferably, more than two pads are arranged at intervals along the second direction, the grooves corresponding to adjacent pads are arranged at intervals, the channel area corresponding to each pad is arranged between the grooves, and the wiring connected to each pad connects each pad via the corresponding channel area; Preferably, the pads of two or more of the first binding parts are aligned along the first direction, and the groove is provided between two adjacent pads along the first direction.

5. A display panel, characterized in that: include: A binding area, the binding area comprising a flexible substrate, a binding layer and a reinforcement layer sequentially arranged along a thickness direction of the display panel, the reinforcement layer comprising at least one layer of rigid material; The binding layer includes at least two groups of pads, the flexible substrate includes traces, and the pads and the traces are connected to each other; The flexible substrate further includes at least one groove, the reinforcement layer includes at least one reinforcement portion, the reinforcement portion and the groove are arranged between two groups of the pads, and the reinforcement portion at least partially covers a portion of the flexible substrate between the grooves in an orthographic projection of the flexible substrate.

6. The display panel according to claim 5, characterized in that: The flexible substrate further includes a first insulating layer and a second insulating layer, the first insulating layer includes at least one inorganic layer, the second insulating layer includes at least one organic layer, the inorganic layer includes a through hole, the organic layer includes a recessed portion arranged in the through hole, and the through hole and the recessed portion form the groove.

7. A method for preparing a display panel, characterized in that: include: preparing traces within a flexible substrate; A pad assembly is prepared on one side of the flexible substrate, wherein the pad assembly includes two or more first binding portions spaced apart along a first direction, a spacing area is provided between two first binding portions adjacent to each other along the first direction, the first binding portion includes a pad, the pad is connected to the wiring, the spacing area includes at least one channel area, and the wiring is connected to each pad via the channel area; A reinforcing portion is prepared on one side of the flexible substrate, and the reinforcing portion at least partially overlaps with an orthographic projection of the channel area on the flexible substrate.

8. The method for preparing a display panel according to claim 7, characterized in that: The step of preparing the wiring in the substrate also includes: preparing a first insulating layer, wherein the first insulating layer comprises at least one inorganic layer; Opening a through hole in the inorganic layer; A second insulating layer is prepared, wherein the second insulating layer includes at least one organic layer, the organic layer includes a recessed portion disposed in the through hole, the through hole and the recessed portion form a groove, and the channel region is disposed on at least one side of the groove in the second direction.

9. A display module, characterized in that: include: The display panel according to any one of claims 1 to 8; Second binding member; The display panel is bound and connected to the second binding member.

10. The display module according to claim 9, characterized in that: The second binding member includes a chip, the chip includes a chip body and a second binding portion connected to the chip body, and the display panel is bound and connected to the second binding member via the second binding portion; Preferably, the second binding portion comprises a bump, and the bump is connected to the chip body along the thickness direction of the chip body; Preferably, the thickness of the reinforcing portion does not exceed the sum of the thickness of the bump and the thickness of the pad.

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