Fin radiating structure, manufacturing method thereof and radiator

Abstract

The invention provides a fin heat dissipation structure, a manufacturing method thereof and a radiator. The fin heat dissipation structure comprises a heat conduction carrier plate and a fin backflow pipe set. A refrigerant cavity is formed in the heat conduction carrier plate; the fin backflow pipe set comprises at least two condensation fin-shaped pipes, and each condensation fin-shaped pipe is obliquely arranged outside the heat conduction carrier plate. The position of a refrigerant gas inlet of each condensation fin-shaped pipe is higher than the position of a refrigerant liquid outlet of the corresponding condensation fin-shaped pipe, and the refrigerant gas inlets communicate with the refrigerant cavity, so that gaseous refrigerants formed by evaporation in the refrigerant cavity can be dispersed into the condensation fin-shaped pipes through the refrigerant gas inlets. Independent heat dissipation is realized through each ventilation gap formed between the adjacent condensation fin-shaped pipes; and the refrigerant liquid outlet is communicated with the refrigerant cavity, so that the gaseous refrigerant in each condensation fin-shaped pipe can be cooled and condensed to form a liquid refrigerant, and the liquid refrigerant can quickly flow back to the position, close to the electronic element, in the refrigerant cavity under the action of gravity to maintain gas-liquid phase change circulation.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation of electronic components, and particularly to a fin heat dissipation structure, a manufacturing method thereof, and a radiator. Background Art

[0002] Since high-power electronic components such as GTO, MCT, and IGBT generate a large amount of heat during operation, if the heat on the surface of the high-power electronic components continues to accumulate, it is likely to cause a decline in the performance of the high-power electronic components. In order to improve the heat dissipation efficiency of high-power electronic components, some manufacturers use radiator structures such as those disclosed in Chinese Patent Document CN216161725U to cool the electronic components. However, due to the structural design of the above radiator structure, when there is persistent high temperature on the surface layer of the high-power electronic components, a large amount of refrigerant will vaporize and pour into the serpentine tube, so that more bends need to be designed on the serpentine tube to extend the condensation path. As the number of bends increases, the resistance of the refrigerant at the bends of the serpentine tube will be greater and the flow rate will slow down, making it difficult for the refrigerant to return to the position of the electronic components in time for the gas-liquid phase change cycle, ultimately resulting in a decline in the overall heat dissipation performance of the high-power electronic components. Summary of the Invention

[0003] An object of the present disclosure is to overcome the deficiencies in the prior art and provide a fin heat dissipation structure, a manufacturing method thereof, and a radiator with stable gas-liquid phase change, smooth gas-liquid circulation, and good condensation effect on electronic components.

[0004] The object of the present disclosure is achieved through the following technical solutions:

[0005] A fin heat dissipation structure includes:

[0006] A heat-conducting carrier plate, a refrigerant cavity is formed inside the heat-conducting carrier plate, and the outside of the heat-conducting carrier plate is used for installing electronic components; the heat-conducting carrier plate is used to conduct the heat energy of the electronic components to the refrigerant in the refrigerant cavity, so that the liquid refrigerant evaporates to form gaseous refrigerant;

[0007] The fin heat dissipation structure includes a fin return pipe group;

[0008] The fin return pipe group includes at least two condensation fin-type pipes, each of the condensation fin-type pipes is inclined and arranged outside the heat-conducting carrier plate, and a ventilation gap is formed between two adjacent condensation fin-type pipes; the position of the refrigerant gas inlet of each condensation fin-type pipe is higher than the position of the refrigerant liquid outlet of the corresponding condensation fin-type pipe, and the refrigerant gas inlet is communicated with the refrigerant cavity to guide the gaseous refrigerant into the condensation fin-type pipe for condensation to form liquid refrigerant; the refrigerant liquid outlet is communicated with the refrigerant cavity to guide the liquid refrigerant into the refrigerant cavity to exchange heat with the electronic components.

[0009] In some of these embodiments, each of the condensing finned tubes forms the refrigerant gas inlet at a position higher than the electronic component; each of the condensing finned tubes is inclined downward and forms a refrigerant liquid outlet at a position close to the electronic component to guide the liquid refrigerant to flow back to the position of the electronic component.

[0010] In some of these embodiments, at least two of the condensing finned tubes are arranged in parallel in a direction perpendicular to the heat-conducting carrier plate and form a condensing combined row; a ventilation gap is formed between two adjacent condensing finned tubes in the same condensing combined row.

[0011] In some of these embodiments, the fin heat dissipation structure further includes a cooling fan, and the cooling fan is arranged close to the condensing combined row; the air outlet of the cooling fan faces the heat-conducting carrier plate and communicates with each of the ventilation gaps to form a convection air duct.

[0012] In some of these embodiments, the fin return pipe group further includes a gas collecting tower base and a liquid collecting tower base; both the gas collecting tower base and the liquid collecting tower base are vertically installed on the heat-conducting carrier plate and are respectively communicated with the refrigerant cavity; the gas collecting tower base is communicated with the refrigerant gas inlets of each of the condensing finned tubes, and the liquid collecting tower base is communicated with the refrigerant liquid outlets of each of the condensing finned tubes.

[0013] In some of these embodiments, the fin return pipe group further includes a liquid guiding outlet pipe; the first end of the liquid guiding outlet pipe is communicated with the liquid collecting tower base; the second end of the liquid guiding outlet pipe is communicated with the refrigerant cavity and is arranged opposite to the position of one of the electronic components.

[0014] In some of these embodiments, the fin return pipe group further includes a plurality of gas trapping ducts; the first ends of the plurality of gas trapping ducts are dispersedly arranged on the heat-conducting carrier plate and at a position higher than the electronic component; the first end of each of the gas trapping ducts is respectively communicated with the refrigerant cavity, and the second end of each of the gas trapping ducts is communicated with the gas collecting tower base.

[0015] In some of these embodiments, the fin heat dissipation structure further includes a plurality of heat dissipation fins; the plurality of heat dissipation fins are arranged on the heat-conducting carrier plate and correspond to the position of the electronic component; and / or,

[0016] The heat-conducting carrier plate includes a copper plate body and an aluminum plate composite body which are attached to each other, and the refrigerant cavity is formed in the aluminum plate composite body; the outer surface of the copper plate layer is used for installing the electronic component.

[0017] A method for manufacturing a fin heat dissipation structure, which is applied to manufacture the fin heat dissipation structure in any of the above embodiments, includes:

[0018] Obtaining a carrier plate substrate group and a return pipe material group;

[0019] After performing a refrigerant cavity milling and assembly operation on the carrier board substrate group, a heat-conducting carrier board is obtained;

[0020] After performing a slitting and roll-pressing assembly operation on the reflux pipe group, a finned reflux pipe group is obtained;

[0021] After assembling and brazing the heat-conducting carrier board and the finned reflux pipe group, the refrigerant cavity of the heat-conducting carrier board is communicated with the finned reflux pipe group to form a refrigerant phase change loop;

[0022] After performing a vacuum injection of refrigerant and sealing operation on the refrigerant phase change loop, the finned heat dissipation structure is obtained.

[0023] A radiator includes the finned heat dissipation structure of any one of the above embodiments.

[0024] Compared with the prior art, the present disclosure has at least the following advantages:

[0025] For the above-mentioned finned heat dissipation structure, since the electronic components are installed outside the heat-conducting carrier board, the liquid refrigerant in the refrigerant cavity can absorb the heat generated by the electronic components and evaporate thermally to form gaseous refrigerant. The gaseous refrigerant will gather at a higher position in the refrigerant cavity because its density is lower than that of the liquid refrigerant. Also, since at least two condensation finned tubes are inclined and arranged outside the heat-conducting carrier board, and the refrigerant gas inlet of each condensation finned tube is communicated with the refrigerant cavity, the gaseous refrigerant formed by evaporation in the refrigerant cavity can be dispersed into each condensation finned tube through each refrigerant gas inlet and independently dissipate heat through the ventilation gaps formed between adjacent condensation finned tubes to adapt to the situation of simultaneous condensation of a large amount of gaseous refrigerant. Then, through the refrigerant liquid outlet arranged below the refrigerant gas inlet on each condensation finned tube and communicated with the refrigerant cavity, the gaseous refrigerant in each condensation finned tube can dissipate heat and condense to form liquid refrigerant, and the liquid refrigerant can quickly flow back to the position near the electronic components in the refrigerant cavity under the action of gravity to maintain the gas-liquid phase change cycle, ultimately enabling the high-power electronic components to dissipate heat stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present disclosure, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0027] Figure 1 It is a schematic structural diagram of a finned heat dissipation structure according to an embodiment of the present disclosure;

[0028] Figure 2 is Figure 1 a cross-sectional view of the finned heat dissipation structure shown;

[0029] Figure 3 Schematic structural diagram of the fin heat dissipation structure according to another embodiment of the present disclosure;

[0030] Figure 4 Cross-sectional view of the fin heat dissipation structure according to still another embodiment of the present disclosure;

[0031] Figure 5 is Figure 4 Partial enlarged view shown at A in

[0032] Figure 6 Schematic flow chart of the manufacturing method of the fin heat dissipation structure according to another embodiment of the present disclosure;

[0033] Figure 7 Physical diagram of the fin heat dissipation structure according to still another embodiment of the present disclosure.

[0034] Reference numerals:

[0035] 10, electronic component;

[0036] 100, heat-conducting carrier plate; 110, copper plate body; 120, aluminum plate composite body; 101, refrigerant cavity;

[0037] 200, fin return pipe group; 210, condensation combination row; 211, condensation finned tube; 2110, condensation main pipe; 2111, lower liquid collection chamber; 211a, capillary diversion groove; 2120, end pipe; 2130, capillary air capture mesh sheet; 2131, capillary condensate reset spring wire; 213a, liquid collection tip; 220, gas collection tower base; 2210, arc-shaped limiting chute; 230, liquid accumulation tower base; 240, liquid guiding outlet pipe; 250, air capture conduit; 201, ventilation gap;

[0038] 300, heat dissipation fan;

[0039] 400, heat dissipation fin. Detailed implementation manners

[0040] To facilitate the understanding of the present disclosure, the present disclosure will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure content of the present disclosure more thorough and comprehensive.

[0041] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this disclosure belongs. The terms used in the specification of this disclosure herein are for the purpose of describing specific implementations only and are not intended to limit this disclosure. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0043] To better understand the technical solutions and beneficial effects of this disclosure, the following further describes this disclosure in detail with specific embodiments:

[0044] Please refer to Figure 1 and Figure 2 , a fin heat dissipation structure of an embodiment includes a heat-conducting carrier plate 100 and a fin return pipe group 200; a refrigerant cavity 101 is formed inside the heat-conducting carrier plate 100, and the outside of the heat-conducting carrier plate 100 is used for installing electronic components 10; the heat-conducting carrier plate 100 is used to conduct the heat energy of the electronic components 10 to the refrigerant in the refrigerant cavity 101, so that the liquid refrigerant evaporates to form a gaseous refrigerant; the fin return pipe group 200 includes at least two condensing fin-type pipes 211, each condensing fin-type pipe 211 is obliquely arranged outside the heat-conducting carrier plate 100, and a ventilation gap 201 is formed between two adjacent condensing fin-type pipes 211; the position of the refrigerant gas inlet of each condensing fin-type pipe 211 is respectively higher than the position of the refrigerant liquid outlet of the corresponding condensing fin-type pipe 211, and the refrigerant gas inlet is communicated with the refrigerant cavity 101 to guide the gaseous refrigerant into the condensing fin-type pipe 211 to condense into a liquid refrigerant; the refrigerant liquid outlet is communicated with the refrigerant cavity 101 to guide the liquid refrigerant into the refrigerant cavity 101 to exchange heat with the electronic components 10. In one embodiment, the condensing fin-type pipe 211 extends in a straight line, enabling the gaseous refrigerant to flow in a straight line to accelerate the heat dissipation and condensation of the gaseous refrigerant into a liquid refrigerant.

[0045] It can be understood that since the electronic component 10 is installed outside the heat-conducting carrier plate 100, the liquid refrigerant in the refrigerant cavity 101 can absorb the heat generated by the electronic component 10 and evaporate into gaseous refrigerant by heat. The gaseous refrigerant, due to its density being less than that of the liquid refrigerant, will gather at a higher position in the refrigerant cavity 101. Also, since at least two condensing finned tubes 211 are all inclined and arranged outside the heat-conducting carrier plate 100, and the refrigerant gas inlet of each condensing finned tube 211 communicates with the refrigerant cavity 101, the gaseous refrigerant evaporated in the refrigerant cavity 101 can be dispersed into each condensing finned tube 211 through each refrigerant gas inlet, and independently dissipate heat through each ventilation gap 201 formed between adjacent condensing finned tubes 211 to adapt to the situation of simultaneous condensation of a large amount of gaseous refrigerant. Then, through the refrigerant liquid outlet arranged below the refrigerant gas inlet on each condensing finned tube 211, it communicates with the refrigerant cavity 101, so that the gaseous refrigerant in each condensing finned tube 211 can dissipate heat and condense into liquid refrigerant, and the liquid refrigerant can quickly flow back to the position near the electronic component 10 in the refrigerant cavity 101 under the action of gravity to maintain the gas-liquid phase change cycle, and finally the high-power electronic component 10 can dissipate heat stably.

[0046] Please refer to Figure 2 As shown, in some embodiments, the extending direction of each condensing finned tube 211 is inclined to the horizontal direction. It can be understood that since the extending direction of each condensing finned tube 211 is inclined to the horizontal direction, that is, each condensing finned tube 211 presents a situation where one end is high and the other end is low in the gravity plane. Specifically, each condensing finned tube 211 is inclined from the corresponding refrigerant gas inlet to the corresponding refrigerant liquid outlet direction, so that the gaseous refrigerant in each condensing finned tube 211 can move from the refrigerant gas inlet to the refrigerant liquid outlet along the inclined direction under the action of gravity. During this process, the gaseous refrigerant dissipates heat and condenses into liquid refrigerant, and the resistance to the direct flow of the liquid refrigerant is small, and the liquid refrigerant can quickly flow back to the refrigerant cavity 101 through the refrigerant liquid outlet to cool the electronic component 10.

[0047] Please refer to Figure 3 , in some embodiments, the fin heat dissipation structure further includes a heat dissipation fan 300, and the heat dissipation fan 300 is arranged close to the condensing combination row 210; the air outlet of the heat dissipation fan 300 faces the heat-conducting carrier plate 100 and communicates with each ventilation gap 201 to form a convection air duct. It can be understood that since the air outlet of the heat dissipation fan 300 is arranged facing the heat-conducting carrier plate 100, the air blown out from the air outlet of the heat dissipation fan 300 can dissipate heat from the heat-conducting carrier plate 100, and the air can further carry away the heat in each ventilation gap 201 through the convection air duct to accelerate the condensation of the gaseous refrigerant in the condensing finned tube 211.

[0048] Please refer to together Figure 2 With Figure 3, in some embodiments, the fin reflux tube group 200 further includes a gas collecting tower base 220 and a liquid accumulation tower base 230; both the gas collecting tower base 220 and the liquid accumulation tower base 230 are vertically installed on the heat conducting carrier plate 100 and are respectively communicated with the refrigerant cavity 101; the gas collecting tower base 220 is communicated with the refrigerant gas inlet of each condensing fin tube 211, and the liquid accumulation tower base 230 is communicated with the refrigerant liquid outlet of each condensing fin tube 211. It can be understood that since the gas collecting tower base 220 vertically installed on the heat conducting carrier plate 100 is communicated with the refrigerant cavity 101, the gaseous refrigerant generated in the refrigerant cavity 101 can be uniformly collected through the gas collecting tower base 220, and the gaseous refrigerant can be evenly distributed to each condensing fin tube 211 through the connection between the gas collecting tower base 220 and the refrigerant gas inlet of each condensing fin tube 211. Also, since the liquid accumulation tower base 230 vertically installed on the heat conducting carrier plate 100 is communicated with the refrigerant cavity 101, and the liquid accumulation tower base 230 is communicated with the refrigerant liquid outlet of each condensing fin tube 211, the liquid refrigerant condensed in each condensing fin tube 211 can be concentrated in the liquid accumulation tower base 230 and then enter the refrigerant cavity 101 to ensure the consistency of the refrigerant quality flowing back into the refrigerant cavity 101.

[0049] Please refer to Figure 1 , in some embodiments, each condensing fin tube 211 is a flat straight tube, and the width direction of each condensing fin tube 211 is consistent with the direction of gravity. It can be understood that since the width direction of each condensing fin tube 211 is consistent with the direction of gravity, the density of the gaseous refrigerant in each condensing fin tube 211 is less than that of the liquid refrigerant, that is, the gaseous refrigerant will float on the upper layer in the condensing fin tube 211, while the liquid refrigerant will sink to the lower layer in the condensing fin tube 211, thereby separating the gaseous refrigerant from the liquid refrigerant to reduce the heat exchange or obstruction between the gaseous refrigerant and the liquid refrigerant, which can not only improve the condensation efficiency of the gaseous refrigerant but also accelerate the reflux speed of the liquid refrigerant.

[0050] Generally, since the gaseous refrigerant will float on the upper part in the condensing fin tube 211, and the flow rate of the gaseous refrigerant is often greater than that of the liquid refrigerant, it is easy for the uncondensed gaseous refrigerant to enter the position near the electronic component 10 in the refrigerant cavity 101 prior to the liquid refrigerant formed by condensation, resulting in the generation of bubbles at the position near the electronic component 10 in the refrigerant cavity 101. The bubbles occupy the contact area between the liquid refrigerant and the electronic component 10, thereby reducing the heat exchange efficiency of the electronic component 10.

[0051] To reduce the influence of the bubbles on the electronic component 10, please refer to Figure 4 together with Figure 5, in one embodiment, the condensing finned tube 211 includes a condensing main pipe 2110, two end pipes 2120 and a capillary gas-trapping mesh sheet 2130; the inner diameter of the condensing main pipe 2110 gradually decreases along the gravity direction, and a lower liquid collecting chamber 2111 is formed at the bottom of the condensing main pipe 2110; one end pipe 2120 is fixedly arranged at the first side end of the lower liquid collecting chamber 2111 and is rotatably connected to the gas collecting tower base 220; the other end pipe 2120 is fixedly arranged at the second side end of the lower liquid collecting chamber 2111 and is rotatably connected to the liquid collecting tower base 230; the gas collecting tower base 220 and the liquid collecting tower base 230 are respectively communicated with the lower liquid collecting chamber 2111 through the corresponding end pipes 2120; the capillary gas-trapping mesh sheet 2130 is vertically arranged in the condensing main pipe 2110 and is rotatably connected to the inner wall of the lower liquid collecting chamber 2111; a ventilation gap 201 is formed between the condensing main pipes 2110 of two adjacent condensing finned tubes 211. It can be understood that since the end pipe 2120 fixedly arranged at the first side end of the lower liquid collecting chamber 2111 is rotatably connected to the gas collecting tower base 220, and the end pipe 2120 fixedly arranged at the second side end of the lower liquid collecting chamber 2111 is rotatably connected to the liquid collecting tower base 230, the condensing main pipe 2110 remains rotatable between the gas collecting tower base 220 and the liquid collecting tower base 230. Also, since the inner diameter of the condensing main pipe 2110 gradually decreases along the gravity direction, the liquid refrigerant will accumulate downward along the inner wall of the condensing main pipe 2110 to the lower liquid collecting chamber 2111. At this time, the center of gravity of the condensing main pipe 2110 will move and then rotate and tilt. The air outlet of the cooling fan 300 is communicated with the ventilation gap 201 between two adjacent condensing main pipes 2110 to form a convection air duct. The wind energy of the cooling fan 300 blows and shakes the condensing main pipe 2110. In this way, the capillary gas-trapping mesh sheet 2130 rotatably connected to the inner wall of the lower liquid collecting chamber 2111 shakes synchronously to capture more gaseous refrigerant floating in the condensing main pipe 2110. After being interfered by the capillary gas-trapping mesh sheet 2130, the gaseous refrigerant not only has a slower flow speed but also can be condensed into liquid refrigerant through the capillary gas-trapping mesh sheet 2130. The liquid refrigerant can accumulate faster in the lower liquid collecting chamber 2111 under the combined action of swinging and gravity, and then enters the refrigerant cavity 101 through the liquid collecting tower base 230, thereby reducing the situation of gaseous refrigerant entering the condensing main pipe 2110. Please refer to Figure 5 , in some embodiments, the bottom of the capillary gas-trapping mesh sheet 2130 extends downward into the lower liquid collecting chamber 2111 and forms a liquid collecting tip 213a to accelerate the aggregation of the liquid refrigerant dispersed on the capillary gas-trapping mesh sheet 2130 into large liquid droplets through the liquid collecting tip 213a, and finally be quickly collected into the lower liquid collecting chamber 2111.

[0052] Furthermore, due to the relatively large width of the capillary gas-trapping mesh sheet 2130, if the air outlet intensity of the cooling fan 300 is weak, the capillary gas-trapping mesh sheet 2130 will be stationary after tilting and falling. To solve the above problems, please refer to Figure 5, in one embodiment, both sides of the capillary air-catching mesh sheet 2130 are respectively connected to the inner wall of the condensation main pipe 2110 through a number of capillary condensation reset elastic wires 2131. When the capillary air-catching mesh sheet 2130 is tilted and fallen, if the air outlet intensity of the heat dissipation fan 300 is weak, the capillary condensation reset elastic wires 2131 are compressed to form a reset elastic force so that the capillary air-catching mesh sheet 2130 can continuously swing back and forth. At the same time, the capillary condensation reset elastic wires 2131 can also obstruct the gaseous refrigerant to accelerate the condensation of the gaseous refrigerant. Specifically, a number of capillary condensation reset elastic wires 2131 are vertically and spacedly distributed along the capillary air-catching mesh sheet 2130.

[0053] Furthermore, due to the diameter limitation of the end pipe 2120 and the increase in the condensation efficiency of the gaseous refrigerant, the liquid refrigerant formed by condensation may accumulate in the lower liquid collecting chamber 2111. Please refer to Figure 5 , so in some embodiments, a capillary diversion groove 211a is provided at the bottom of the lower liquid collecting chamber 2111. The capillary diversion groove 211a extends from the air collecting tower base 220 to the liquid accumulation tower base 230, so that the liquid refrigerant in the lower liquid collecting chamber 2111 can flow towards the liquid accumulation tower base 230 along the capillary diversion groove 211a by capillary action.

[0054] Generally, when the liquid refrigerant accumulated in the condensation main pipe 2110 increases, the condensation main pipe 2110 is more likely to fall to one side due to uneven force. The liquid refrigerant in the fallen condensation main pipe 2110 is likely to separate from the lower liquid collecting chamber 2111, thereby further slowing down the discharge efficiency of the liquid refrigerant. Therefore, please refer to Figure 5 , in one embodiment, an arc-shaped limiting sliding groove 2210 is opened on the outer wall of the air collecting tower base 220 at a position higher than the lower liquid collecting chamber 2111. A clamping column protrudes from the outer wall of the condensation main pipe 2110 into the arc-shaped limiting sliding groove 2210. The clamping column is movably accommodated in the arc-shaped limiting sliding groove 2210, so that the condensation main pipe 2110 can only swing within the central angle range corresponding to the arc-shaped limiting sliding groove 2210 and will not fall, ultimately avoiding the situation where the liquid refrigerant separates from the lower liquid collecting chamber 2111.

[0055] Generally, when the air outlet intensity of the heat dissipation fan 300 is strong, the air flow in the ventilation gap 201 will convect rapidly. Although the heat dissipation efficiency is high in this way, the contact heat exchange time between the wind and the condensation finned tube 211 is also short, which will cause waste of the power of the heat dissipation fan 300.

[0056] Please refer to Figure 4 and Figure 5, in one embodiment, the number of the condensing finned tubes 211 is multiple, and the multiple condensing finned tubes 211 are divided into two condensing combined rows 210; the two condensing combined rows 210 are hierarchically arranged in the gravity direction, and the condensing finned tubes 211 in the two condensing combined rows 210 are arranged in a staggered manner; the heat dissipation fan 300 is close to the condensing combined row 210 located at the bottom layer. It can be understood that since the condensing finned tubes 211 in the two condensing combined rows 210 are arranged in a staggered manner, and the heat dissipation fan 300 is close to the condensing combined row 210 located at the bottom layer, when the heat dissipation fan 300 is turned on, the air blown by the heat dissipation fan 300 will first act on the condensing combined row 210 located at the bottom layer, and the air will change its direction due to the turbulent flow effect caused by the swinging of the condensing main tube 2110 in the condensing combined row 210 located at the bottom layer. When it acts on the condensing main tube 2110 in the condensing combined row 210 located at the top layer, it will be turbulently flowed again, so as to prolong the contact heat exchange time between the air and the condensing finned tubes 211, thereby reducing the waste of the power of the heat dissipation fan 300.

[0057] Please refer to Figure 3 , in some embodiments, each condensing finned tube 211 forms a refrigerant gas inlet at a position higher than the electronic component 10; each condensing finned tube 211 is inclined downward and forms a refrigerant liquid outlet at a position close to the electronic component 10 to guide the liquid refrigerant to flow back to the position of the electronic component 10. It can be understood that since the refrigerant in the refrigerant cavity 101 will evaporate to form gaseous refrigerant after absorbing the heat of the electronic component 10, the gaseous refrigerant will be enriched at a position higher than the electronic component 10 in the refrigerant cavity 101. By forming a refrigerant gas inlet at a position higher than the electronic component 10 on each condensing finned tube 211, the enriched gaseous refrigerant can be guided into the condensing finned tube 211 to be condensed into liquid refrigerant to improve the guiding efficiency of the gaseous refrigerant. Also, since the refrigerant liquid outlet is formed at a position of the condensing finned tube 211 close to the electronic component 10, the liquid refrigerant can flow back to the position close to the electronic component 10 more quickly to accelerate the heat dissipation of the electronic component 10.

[0058] Please refer to Figure 1 , in some embodiments, at least two condensing finned tubes 211 are arranged in parallel along a direction perpendicular to the heat conduction carrier plate 100 and form a condensing combined row 210; a ventilation gap 201 is formed between two adjacent condensing finned tubes 211 in the same condensing combined row 210. It can be understood that since at least two condensing finned tubes 211 are arranged in parallel along a direction perpendicular to the heat conduction carrier plate 100 to form a condensing combined row 210, the condensing combined row 210 can make the structure of the fin return tube group 200 more compact and reliable and save design space, and the independent heat dissipation of the gaseous refrigerant dispersed in the corresponding condensing finned tube 211 can be carried out through each ventilation gap 201 formed between two adjacent condensing finned tubes 211 to accelerate the heat dissipation efficiency of the gaseous refrigerant.

[0059] Please refer to Figure 2 and Figure 3 In some embodiments, the fin return pipe group 200 further includes a liquid guide outlet pipe 240; the first end of the liquid guide outlet pipe 240 communicates with the liquid accumulation tower base 230; the second end of the liquid guide outlet pipe 240 communicates with the refrigerant cavity 101 and is disposed opposite to the position of an electronic component 10. It can be understood that since the first end of the liquid guide outlet pipe 240 communicates with the liquid accumulation tower base 230, and the second end of the liquid guide outlet pipe 240 communicating with the refrigerant cavity 101 is disposed opposite to the position of an electronic component 10, the liquid refrigerant in the liquid accumulation tower base 230 can approach the position of an electronic component 10 through the liquid guide outlet pipe 240 specifically, thereby accelerating the heat dissipation of each electronic component 10.

[0060] Please refer to Figure 3 In some embodiments, the fin return pipe group 200 further includes a plurality of gas capture ducts 250; the first ends of the plurality of gas capture ducts 250 are dispersedly disposed on the heat conducting carrier plate 100 and are higher than the position of the electronic component 10; the first end of each gas capture duct 250 communicates with the refrigerant cavity 101 respectively, and the second end of each gas capture duct 250 communicates with the liquid accumulation tower base 230. It can be understood that since the first ends of the plurality of gas capture ducts 250 are dispersedly disposed on the heat conducting carrier plate 100 at a position higher than the electronic component 10 and are in communication with the refrigerant cavity 101, the gaseous refrigerant dispersed in the refrigerant cavity 101 at a position higher than the electronic component 10 can be captured jointly by the plurality of gas capture ducts 250, thereby accelerating the entry of the gaseous refrigerant into the gas collecting tower base 220 and improving the condensation efficiency of the fin return pipe group 200 for the gaseous refrigerant.

[0061] Please refer to Figure 2 As shown, in some embodiments, the fin heat dissipation structure further includes a plurality of heat dissipation fins 400; the plurality of heat dissipation fins 400 are arranged on the heat conducting carrier plate 100 and correspond to the position of the electronic component 10. It can be understood that since the plurality of heat dissipation fins 400 are arranged on the heat conducting carrier plate 100 at a position corresponding to the electronic component 10, the heat dissipation at the position of the electronic component 10 on the heat conducting carrier plate 100 can be accelerated through the heat dissipation fins 400, thereby reducing the temperature enrichment at the electronic component 10.

[0062] In some of these embodiments, the heat-conducting carrier plate 100 includes a copper plate body 110 and an aluminum plate composite body 120 disposed in a fitting manner, and a refrigerant cavity 101 is formed in the aluminum plate composite body 120; the outer surface of the copper plate layer is used to mount the electronic component 10. It can be understood that since the refrigerant cavity 101 is formed in the aluminum plate composite body 120, the aluminum plate composite body 120 forms a dense oxide film on the cavity wall of the refrigerant cavity 101, thereby reducing the reaction with refrigerants such as tetrafluoroethane in the refrigerant cavity 101 and enhancing the service life of the heat-conducting carrier plate 100. By mounting the electronic component 10 on the outer surface of the copper plate layer, heat can be accelerated to be conducted to the refrigerant cavity 101 in the aluminum plate composite body 120 through the copper plate layer. In this embodiment, the copper plate layer is a copper sheet, the aluminum plate composite body 120 is a structure formed by brazing at least two aluminum sheets in a fitting manner, the refrigerant cavity 101 is formed between two adjacent aluminum sheets, and each condensation finned tube 211 is inclinedly mounted on the outside of the aluminum plate composite body 120, and the refrigerant gas inlet and the refrigerant liquid outlet of each condensation finned tube 211 are both communicated with the refrigerant cavity 101.

[0063] Please refer to Figure 6 and Figure 7 As shown, the present disclosure also provides a method for manufacturing a fin heat dissipation structure, which is applied to manufacturing the fin heat dissipation structure of any of the above embodiments, and includes some or all of the following steps:

[0064] Obtain a carrier plate substrate group and a reflux pipe material group;

[0065] In this embodiment, the carrier plate substrate group includes a copper-aluminum composite bottom plate and an aluminum cover plate, and the reflux pipe material group is all aluminum pipes. The reflux pipe material group includes a gas collecting pipe material, a liquid accumulating pipe material, and a condensation pipe material.

[0066] Perform a refrigerant cavity milling and assembly operation on the carrier plate substrate group to obtain a heat-conducting carrier plate;

[0067] Please refer to Figure 1 As shown, in this embodiment, the refrigerant cavity milling and assembly operation includes: using a numerical control machine tool to perform a milling operation on the aluminum plate layer of the copper-aluminum composite bottom plate to form a refrigerant groove on the aluminum plate layer; using a numerical control machine tool to perform a milling operation on the aluminum cover plate to make the aluminum cover plate match the copper-aluminum composite bottom plate; performing a degreasing operation on the milled copper-aluminum composite bottom plate and aluminum cover plate to remove the residues of the cutting fluid and lubricating oil coated before milling of the copper-aluminum composite bottom plate and aluminum cover plate, so as to reduce welding defects caused by the residues, such as uneven plating, blistering or peeling, etc.; assembling the aluminum cover plate and the aluminum plate layer of the copper-aluminum composite bottom plate to make the refrigerant groove closed to form the refrigerant cavity 101, and obtaining the heat-conducting carrier plate 100. Specifically, perform an explosion welding operation on the mutually fitting copper plate layer and aluminum plate layer to obtain a copper-aluminum composite bottom plate. The shock wave generated during the explosion can quickly remove the oxide film on the surface of the aluminum plate layer, and further make the copper plate layer and the aluminum plate layer firmly welded together.

[0068] Perform slitting, rolling and then assembling operations on the reflux pipe group to obtain the finned reflux pipe group;

[0069] Please refer to Figure 3 As shown, in this embodiment, the slitting, rolling and then assembling operations include: using a numerical control machine tool to perform milling operations on the gas collecting pipe material to obtain the gas collecting tower base 220; using a numerical control machine tool to perform milling operations on the liquid accumulation pipe material to obtain the liquid accumulation tower base 230; performing degreasing operations on the gas collecting tower base 220 and the liquid accumulation tower base 230 to remove the residues of the cutting fluid and lubricating oil coated before milling on the gas collecting tower base 220 and the liquid accumulation tower base 230, so as to reduce the subsequent welding defects caused by the residues, such as uneven plating, blistering or peeling, etc.; performing equal-length cutting operations on the condensation pipe material to obtain at least two condensation straight pipes of equal length; performing rolling operations on each condensation straight pipe to obtain at least two condensation finned pipes 211; wherein, the condensation finned pipes 211 are all flat straight pipes; assembling the gas collecting tower base 220, the liquid accumulation tower base 230 and the condensation finned pipes 211 to obtain the finned reflux pipe group 200.

[0070] Perform post-assembly brazing operations on the heat-conducting carrier plate and the finned reflux pipe group to connect the refrigerant cavity of the heat-conducting carrier plate to the finned reflux pipe group to form a refrigerant phase change loop;

[0071] In this embodiment, the post-assembly brazing operations include: assembling the heat-conducting carrier plate 100 and the finned reflux pipe group 200 so that the refrigerant cavity 101 is connected to the finned reflux pipe group 200 to form a refrigerant phase change loop; performing integral brazing on the heat-conducting carrier plate 100 and the finned reflux pipe group 200 to connect the heat-conducting carrier plate 100 and the finned reflux pipe group 200 into one body.

[0072] Perform vacuum injection of refrigerant and then sealing operations on the refrigerant phase change loop to obtain the finned heat dissipation structure.

[0073] In this embodiment, the vacuum injection of refrigerant and then sealing operations include: performing a vacuum pumping operation on the refrigerant phase change loop to create a negative pressure environment inside the refrigerant phase change loop. The refrigerant has a lower boiling point in the negative pressure environment and is more likely to evaporate and circulate at low temperatures. For example, the refrigerant evaporates for internal circulation at 35°C to 40°C; slowly injecting refrigerant through the low-pressure side of the refrigerant phase change loop. When the refrigerant phase change loop is in a negative pressure state, the air and moisture inside the refrigerant phase change loop will be emptied to maintain the vacuum degree, which not only facilitates the injection of refrigerant but also effectively ensures the normal operation of the refrigerant phase change cycle; performing a sealing operation on the refrigerant phase change loop to obtain the finned heat dissipation structure. By sealing the connection position between the heat-conducting carrier plate 100 and the finned reflux pipe group 200, the airtightness of the refrigerant phase change loop can be improved, the vacuum degree of the refrigerant phase change loop can be stabilized, and finally the service life of the finned heat dissipation structure can be extended.

[0074] It can be understood that after the refrigerant cavity milling and assembly operation on the carrier substrate group, a refrigerant cavity 101 can be formed in the heat-conducting carrier plate 100. By performing the slitting and roll-pressing and assembly operation on the reflux pipe group, the gas-collecting tower base 220, the liquid-accumulating tower base 230 and at least two condensation finned tubes 211 formed from the components in the reflux pipe group can be assembled into the finned reflux pipe group 200. Then, through the assembly and brazing operation on the heat-conducting carrier plate 100 and the finned reflux pipe group 200, the heat-conducting carrier plate 100 and the finned reflux pipe group 200 can be tightly connected, so that the refrigerant cavity 101 communicates with the finned reflux pipe group 200 to form a refrigerant phase change loop. Finally, through the vacuum injection of refrigerant and sealing operation on the refrigerant phase change loop, not only can the vacuum degree of the refrigerant phase change loop be kept stable, but also the boiling point of the refrigerant can be reduced to improve the evaporation cycle heat exchange efficiency. In this way, the finned heat dissipation structure prepared by the finned heat dissipation structure manufacturing method can dissipate heat from the gaseous refrigerant separately through at least two condensation finned tubes 211 and guide the liquid refrigerant to quickly flow back to the refrigerant cavity 101 to dissipate heat from the electronic component 10.

[0075] The present disclosure also provides a radiator, including the finned heat dissipation structure of any one of the above embodiments. By applying the finned heat dissipation structure of the present disclosure to the radiator, since the electronic component 10 is installed outside the heat-conducting carrier plate 100, the liquid refrigerant in the refrigerant cavity 101 can absorb the heat generated by the electronic component 10 and evaporate to form a gaseous refrigerant. The gaseous refrigerant will gather at a higher position in the refrigerant cavity 101 because its density is lower than that of the liquid refrigerant. Also, since at least two condensation finned tubes 211 are all inclined and arranged outside the heat-conducting carrier plate 100, and the refrigerant gas inlet of each condensation finned tube 211 communicates with the refrigerant cavity 101, the gaseous refrigerant formed by evaporation in the refrigerant cavity 101 can be dispersed into each condensation finned tube 211 through each refrigerant gas inlet and dissipate heat independently through each ventilation gap 201 formed between adjacent condensation finned tubes 211 to adapt to the situation of simultaneous condensation of a large amount of gaseous refrigerant. Then, through the refrigerant liquid outlet arranged below the refrigerant gas inlet on each condensation finned tube 211 communicating with the refrigerant cavity 101, the gaseous refrigerant in each condensation finned tube 211 can dissipate heat and condense to form a liquid refrigerant, and the liquid refrigerant can quickly flow back to the position close to the electronic component 10 in the refrigerant cavity 101 under the action of gravity to maintain the gas-liquid phase change cycle, and finally the high-power electronic component 10 can dissipate heat stably.

[0076] Compared with the prior art, the present disclosure has at least the following advantages:

[0077] In the above fin heat dissipation structure, since the electronic component 10 is installed outside the heat-conducting carrier plate 100, the liquid refrigerant in the refrigerant cavity 101 can absorb the heat generated by the electronic component 10 and evaporate thermally to form a gaseous refrigerant. The gaseous refrigerant, due to its density being less than that of the liquid refrigerant, will gather at a higher position in the refrigerant cavity 101. Also, since at least two condensation fin-type tubes 211 are all inclined and arranged outside the heat-conducting carrier plate 100, and the refrigerant gas inlet of each condensation fin-type tube 211 is communicated with the refrigerant cavity 101, the gaseous refrigerant formed by evaporation in the refrigerant cavity 101 can be dispersed into each condensation fin-type tube 211 through each refrigerant gas inlet, and independently dissipate heat through each ventilation gap 201 formed between adjacent condensation fin-type tubes 211 to adapt to the situation of simultaneous condensation of a large amount of gaseous refrigerant. Then, through the refrigerant liquid outlet arranged below the refrigerant gas inlet on each condensation fin-type tube 211 being communicated with the refrigerant cavity 101, the gaseous refrigerant in each condensation fin-type tube 211 can dissipate heat and condense to form a liquid refrigerant, and the liquid refrigerant can quickly flow back by gravity to a position in the refrigerant cavity 101 close to the electronic component 10 to maintain the gas-liquid phase change cycle, ultimately enabling the high-power electronic component 10 to dissipate heat stably.

[0078] The above-described embodiments merely represent several implementation manners of the present disclosure. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present disclosure, several modifications and improvements can still be made, and these all fall within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent shall be subject to the appended claims.

Claims

1. A fin heat dissipation structure, comprising: A heat-conducting carrier, wherein a refrigerant cavity is formed inside the heat-conducting carrier, and the outside of the heat-conducting carrier is used to install electronic components; the heat-conducting carrier is used to conduct heat energy of the electronic components to the refrigerant in the refrigerant cavity, so that the liquid refrigerant evaporates to form a gaseous refrigerant; Characterized in that the fin heat dissipation structure comprises a fin return pipe group; The fin reflux tube group includes at least two condensing fin tubes, each of which is obliquely arranged on the outside of the heat-conducting carrier plate, and a ventilation gap is formed between two adjacent condensing fin tubes; the position of the refrigerant gas inlet of each of the condensing fin tubes is higher than the position of the refrigerant liquid outlet of the corresponding condensing fin tube, and the refrigerant gas inlet is connected to the refrigerant cavity to guide the gaseous refrigerant to enter the condensing fin tube for condensation to form liquid refrigerant; the refrigerant liquid outlet is connected to the refrigerant cavity to guide the liquid refrigerant to enter the refrigerant cavity for heat exchange with the electronic components.

2. The fin heat dissipation structure according to claim 1, characterized in that: Each of the condensing fin-type tubes forms the refrigerant gas inlet at a position higher than the electronic component; each of the condensing fin-type tubes is inclined downward and forms a refrigerant liquid outlet at a position close to the electronic component to guide the liquid refrigerant to flow back to the position of the electronic component.

3. The fin heat dissipation structure according to claim 1, characterized in that: At least two of the condensing fin-shaped tubes are arranged in parallel along a direction perpendicular to the heat-conducting carrier plate to form a condensing combination row; and the ventilation gap is formed between two adjacent condensing fin-shaped tubes in the same condensing combination row.

4. The fin heat dissipation structure according to claim 3, characterized in that: The fin heat dissipation structure also includes a heat dissipation fan, which is arranged close to the condensing combination row; the air outlet of the heat dissipation fan faces the heat-conducting carrier plate and is connected with each of the ventilation gaps to form a convection air duct.

5. The fin heat dissipation structure according to claim 1, characterized in that: The fin reflux tube group also includes an air gathering tower base and a liquid accumulation tower base; the air gathering tower base and the liquid accumulation tower base are both vertically mounted on the heat conductive carrier plate and are respectively connected to the refrigerant cavity; the air gathering tower base is connected to the refrigerant gas inlet of each of the condensing fin-type tubes, and the liquid accumulation tower base is connected to the refrigerant liquid outlet of each of the condensing fin-type tubes.

6. The fin heat dissipation structure according to claim 5, characterized in that: The fin return pipe group also includes a liquid outlet pipe; the first end of the liquid outlet pipe is connected to the liquid accumulation tower base; the second end of the liquid outlet pipe is connected to the refrigerant cavity and is arranged opposite to the position of one of the electronic components.

7. The fin heat dissipation structure according to claim 5, characterized in that: The fin return tube group also includes a plurality of air-catching ducts; the first ends of the plurality of air-catching ducts are dispersedly arranged on the heat-conducting carrier plate and are higher than the positions of the electronic components; the first end of each of the air-catching ducts is respectively connected to the refrigerant cavity, and the second end of each of the air-catching ducts is connected to the air collecting tower base.

8. The fin heat dissipation structure according to claim 1, characterized in that: The fin heat dissipation structure further includes a plurality of heat dissipation fins; the plurality of heat dissipation fins are arranged on the heat-conducting carrier and correspond to the positions of the electronic components; and / or, The heat-conducting carrier plate comprises a copper plate body and an aluminum plate composite body which are bonded together, wherein the refrigerant cavity is formed in the aluminum plate composite body; the outer surface of the copper plate layer is used to mount the electronic components; and / or, The condensing fin-type tube extends along a straight line.

9. A method for manufacturing a fin heat dissipation structure, applied to manufacturing the fin heat dissipation structure according to any one of claims 1 to 8, characterized in that: include: Obtain a carrier substrate assembly and a reflux tube assembly; Performing refrigerant cavity milling and pinning on the carrier substrate group and then assembling operations to obtain a heat-conducting carrier; The reflux pipe group is subjected to slitting, rolling and assembly operations to obtain a fin reflux pipe group; Assembling and brazing the heat-conducting carrier plate and the fin return tube group, so that the refrigerant cavity of the heat-conducting carrier plate is connected to the fin return tube group to form a refrigerant phase change circuit; The refrigerant phase change circuit is vacuum injected with refrigerant and then sealed to obtain the fin heat dissipation structure.

10. A radiator, characterized in that: The invention comprises the fin heat dissipation structure according to any one of claims 1 to 8.

Images