A liquid cooling plate assembly and a coolant delivery device

By designing a continuous S-shaped flow channel and a transfer plate with increasing thermal conductivity in the liquid-cooled plate assembly, the local overheating problem caused by the increase in the coolant temperature is solved, and the heat transfer of coolant in different areas is achieved, which improves the heat exchange efficiency and equipment performance.

CN120076281BActive Publication Date: 2025-08-01GUANGDONG HUACHUANG THERMAL CONTROL TECH CO LTD
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Patent Information

Application Number
CN202510552538.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-04-29
Publication Date
2025-08-01
Estimated Expiration
2045-04-29

AI Technical Summary

Technical Problem

The local overheating problem caused by the increase in the coolant temperature during use of the liquid-cooled plate assembly affects the overall performance of the electronic equipment.

Method used

A liquid-cooled plate assembly is designed, including a continuous S-shaped flow channel in the substrate. The flow channel is divided into a third, second and first zones with decreasing cross-sections in turn, and a transfer plate and control system with increasing thermal conductivity are provided to avoid local overheating by controlling the coolant flow rate and temperature gradient.

Benefits of technology

It effectively avoids local overheating caused by the decrease in the heat absorption effect of the coolant, ensures that the performance of electronic equipment is not affected, and improves heat exchange efficiency and equipment service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a liquid cooling plate assembly and a coolant delivery device, including a substrate. A plurality of partition plates are arranged inside the substrate, and the plurality of partition plates are staggered on the inner wall of the substrate; a continuous S-shaped flow channel located inside the substrate is formed between the plurality of partition plates. A third zone, a second zone and a first zone that are sequentially communicated are formed in the flow channel along the flow direction, and the cross-sections of the third zone, the second zone and the first zone gradually decrease along the flow direction of the flow channel; a water outlet pipe is arranged on the substrate corresponding to the first zone, and the water outlet pipe is communicated with the first zone, and a water inlet pipe is arranged on the substrate corresponding to the third zone, and the water inlet pipe is communicated with the third zone. By arranging a continuous S-shaped flow channel inside the substrate to form a third zone, a second zone and a first zone with gradually decreasing cross-sections, the present invention enables the flow rate of the coolant to increase sequentially during circulation, thereby avoiding the influence of the increased temperature of the coolant after heat absorption on subsequent heat absorption and preventing the occurrence of local overheating.
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Description

Technical Field

[0001] The present invention relates to the field of liquid cooling systems, and particularly to a liquid cooling plate assembly and a coolant delivery device. Background Art

[0002] With the rapid development of electronic devices, especially in the fields of high-performance computing, data centers, and electric vehicles, the demand for thermal management technology is increasing day by day. As an efficient heat dissipation solution, liquid cooling technology has been widely used due to its good thermal conductivity and high heat capacity. The liquid cooling plate assembly is a key part of the liquid cooling system, and its main function is to effectively transfer heat from heat sources (such as CPUs, GPUs, etc.) to the coolant to achieve rapid cooling.

[0003] In the prior art, the liquid cooling plate assembly often faces the problem of the temperature rise of the coolant after heat absorption during use. Specifically, when the coolant enters the liquid cooling plate assembly, it absorbs heat from the heat source, resulting in a gradual increase in the coolant temperature. As the coolant temperature rises, its heat exchange capacity gradually decreases. When the heated coolant flows through the non-heat-absorbing area, the heat absorption effect of the heated coolant on this area decreases, and local overheating occurs, thereby affecting the overall performance of the electronic device.

[0004] Therefore, a liquid cooling plate assembly and a coolant delivery device are proposed to solve the problem of local overheating that occurs after the liquid cooling plate assembly works. Summary of the Invention

[0005] The purpose of the present invention is to provide a liquid cooling plate assembly and a coolant delivery device to solve the problem of local overheating that occurs after the liquid cooling plate assembly works.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A liquid cooling plate assembly includes a substrate, and a plurality of partition plates are arranged inside the substrate, and the plurality of partition plates are staggered on the inner wall of the substrate;

[0008] A continuous S-shaped flow channel located inside the substrate is formed between the plurality of partition plates. In the flow channel, a third zone, a second zone, and a first zone that are sequentially connected are formed along the flow direction, and the cross-sections of the third zone, the second zone, and the first zone gradually decrease along the flow direction of the flow channel;

[0009] An outlet pipe is arranged on the substrate corresponding to the first zone, and the outlet pipe is communicated with the first zone. An inlet pipe is arranged on the substrate corresponding to the third zone, and the inlet pipe is communicated with the third zone.

[0010] Preferably, the distances between the sides of the plurality of partition plates away from their fixed surfaces and the inner side wall of the substrate gradually decrease along the flow direction of the flow channel.

[0011] Preferably, two grooves are formed in the side surface of the partition along its length direction. The two grooves are symmetrically distributed along the central axis of the partition, face the flow passage direction, and communicate with the flow passage.

[0012] Preferably, the two inner side walls of the groove corresponding to the flow passage are inclined surfaces inclined towards it. A transfer plate is vertically fixed in the groove, and a gap is formed between the transfer plate and the inclined surface. A plurality of openings are formed at equal intervals on the transfer plate. One end of the opening communicates with the groove, and the other end communicates with the flow passage.

[0013] Preferably, the transfer plate is made of a heat-conducting material, and the heat-conducting coefficients of the plurality of transfer plates increase sequentially along the flow direction of the flow passage.

[0014] Preferably, the substrate includes a bottom plate and a sealing plate. The partition is fixed on the inner side wall of the sealing plate. The bottom surface of the partition is connected to the top surface of the bottom plate. The bottom plate is arranged corresponding to the heating unit, and the bottom plate is made of a heat-conducting material.

[0015] A coolant delivery device is applied to the liquid cooling plate assembly described above. The device includes a control system and branch pipes. The control system is connected to the branch pipes, and the control system is connected to the water inlet pipe. The branch pipes are arranged on the substrate corresponding to the first area and communicate with the first area. The diameter of the branch pipes is smaller than the diameter of the water inlet pipe.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. For the liquid cooling plate assembly and the coolant delivery device, by arranging a continuous S-shaped flow passage in the substrate and dividing the flow passage into a third area, a second area, and a first area with gradually decreasing cross-sections in the flow direction, the flow rate of the coolant increases sequentially during flow, thereby avoiding the influence of the increased temperature of the coolant after heat absorption on subsequent heat absorption and preventing local overheating.

[0018] 2. For the liquid cooling plate assembly and the coolant delivery device, by arranging transfer plates with sequentially increasing heat-conducting coefficients along the flow direction of the flow passage on the partition, after the coolant is heated, the heat absorbed in the first area is approximately the same as the heat in the second area and the third area, avoiding affecting the heat transfer effect and local overheating.

[0019] 3. For the liquid cooling plate assembly and the coolant delivery device, through the arranged control system and branch pipes, after the heated coolant enters the first area, a small amount of coolant can be delivered again to neutralize the temperature of the coolant entering the first area, so as to avoid the influence on the heat absorption of the coolant in the first area. Description of the Drawings

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0021] The structures, proportions, sizes, etc. shown in the accompanying drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of the present invention. Therefore, they do not have substantial technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed by the present invention.

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the internal structure of the substrate in the present invention;

[0024] Figure 3 It is a schematic diagram of the disassembled structure of the sealing plate and the bottom plate in the present invention;

[0025] Figure 4 It is a schematic diagram of the connection structure between the transfer plate and the groove in the present invention;

[0026] Figure 5 It is a schematic diagram of the disassembled structure of the partition plate and the transfer plate in the present invention;

[0027] Figure 6 It is a schematic diagram of the connection structure between the substrate and the branch pipe in the present invention;

[0028] Figure 7 It is a schematic diagram of the upward view of the branch pipe in the present invention;

[0029] Figure 8 It is a schematic diagram of the top view of the heat transfer plate in the present invention;

[0030] Figure 9 It is a schematic diagram of the cross-sectional view of the heat transfer plate in the present invention.

[0031] Illustration: 1. Substrate; 11. Sealing plate; 12. Bottom plate; 2. Flow channel; 21. First area; 22. Second area; 23. Third area; 3. Partition plate; 31. Groove; 32. Transfer plate; 33. Opening; 34. Inclined surface; 4. Water inlet pipe; 5. Water outlet pipe; 6. Branch pipe; 7. Control system; 8. Heat transfer plate; 81. First section; 82. Second section; 83. Third section; 84. Exchange port. Detailed implementation manners

[0032] In order to make the object, features, and advantages of the present invention more obvious and understandable, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the following described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be an intermediate component present at the same time.

[0034] The following further illustrates the technical solutions of the present invention with reference to the accompanying drawings and through specific embodiments.

[0035] Please refer to Figures 1 - 7 : The embodiment of the present invention provides a liquid cooling plate assembly, including a substrate 1, and a plurality of partition plates 3 are arranged inside the substrate 1, and the plurality of partition plates 3 are arranged alternately on the inner wall of the substrate 1;

[0036] A continuous S-shaped flow channel 2 located inside the substrate 1 is formed between the plurality of partition plates 3. A third zone 23, a second zone 22, and a first zone 21 that are sequentially connected are formed in the flow channel 2 along the flow direction, and the cross-sections of the third zone 23, the second zone 22, and the first zone 21 decrease sequentially along the flow direction of the flow channel 2.

[0037] A water outlet pipe 5 is arranged on the substrate 1 corresponding to the first zone 21, and the water outlet pipe 5 is communicated with the first zone 21. A water inlet pipe 4 is arranged on the substrate 1 corresponding to the third zone 23, and the water inlet pipe 4 is communicated with the third zone 23.

[0038] The distance between one side of the plurality of partition plates 3 away from their fixed surfaces and the inner side wall of the substrate 1 decreases sequentially along the flow direction of the flow channel 2.

[0039] Two grooves 31 are formed on the side surface of the partition plate 3 along its length direction. The two grooves 31 are symmetrically distributed along the central axis of the partition plate 3, and the grooves 31 face the direction of the flow channel 2 and are communicated with the flow channel 2.

[0040] The groove 31 is provided with inclined surfaces 34 on the two inner sidewalls corresponding to the flow passage 2, which are inclined towards it. A transfer plate 32 is vertically fixed in the groove 31, and a gap is formed between the transfer plate 32 and the inclined surface 34. A plurality of openings 33 are equidistantly arranged on the transfer plate 32. One end of the opening 33 communicates with the groove 31, and the other end communicates with the flow passage 2.

[0041] The transfer plate 32 is made of a heat-conducting material, and the heat-conducting coefficients of the plurality of transfer plates 32 increase in sequence along the flow direction of the flow passage 2.

[0042] The substrate 1 includes a bottom plate 12 and a sealing plate 11. The partition 3 is fixed on the inner sidewall of the sealing plate 11, and the bottom surface of the partition 3 is connected to the top surface of the bottom plate 12. The bottom plate 12 is arranged corresponding to the heating unit, and the bottom plate 12 is made of a heat-conducting material.

[0043] A coolant delivery device, which includes a control system 7 and a branch pipe 6. The control system 7 is connected to the branch pipe 6, the control system 7 is connected to the water inlet pipe 4. The branch pipe 6 is arranged on the substrate 1 corresponding to the first area 21 and communicates with the first area 21. The diameter of the branch pipe 6 is smaller than the diameter of the water inlet pipe 4.

[0044] The supplementary technical features of the present invention are as follows:

[0045] In the present invention, the sealing plate 11 is a cuboid with a hollow interior and a missing bottom surface;

[0046] In the present invention, the length of the partition 3 in the second area 22 is greater than the length of the partition 3 in the first area 21 and less than the length of the partition 3 in the third area 23.

[0047] Embodiment 1:

[0048] [[ID=Z4]]Please refer to Figures 1 - 5 , a liquid cooling plate assembly in this embodiment includes a substrate 1. A plurality of partitions 3 are arranged inside the substrate 1, and the plurality of partitions 3 are staggered on the inner wall of the substrate 1; a continuous S-shaped flow passage 2 is formed between the plurality of partitions 3 inside the substrate 1. The third area 23, the second area 22 and the first area 21 that are sequentially communicated are formed in the flow passage 2 along the flow direction. The cross-sections of the third area 23, the second area 22 and the first area 21 decrease in sequence along the flow direction of the flow passage 2; a water outlet pipe 5 is arranged on the substrate 1 corresponding to the first area 21, and the water outlet pipe 5 communicates with the first area 21. A water inlet pipe 4 is arranged on the substrate 1 corresponding to the third area 23, and the water inlet pipe 4 communicates with the third area 23.

[0049] Specifically, the distances between the sides of the plurality of partitions 3 away from their fixed surfaces and the inner sidewall of the substrate 1 decrease in sequence along the flow direction of the flow passage 2.

[0050] During application, the coolant is introduced into the substrate 1 above the heat source through the inlet pipe 4 and flows in the flow channel 2. When the coolant enters the third zone 23, it absorbs the heat generated by the heat source, thereby reducing the temperature of the corresponding part of the heat source and increasing the temperature of the coolant. Subsequently, the heated coolant flows through the second zone 22 and the first zone 21 in sequence and is finally discharged through the outlet pipe 5. After the coolant flows through the third zone 23 and enters the second zone 22, since the cross-section of the second zone 22 is smaller than that of the third zone 23, the flow rate of the coolant will gradually increase when it flows in the second zone 22. Similarly, after passing through the second zone 22, the coolant enters the first zone 21 and the flow rate increases again. This design of gradually decreasing cross-sections makes the flow rate of the coolant in the third zone 23, the second zone 22 and the first zone 21 show a gradually increasing trend. By circulating the coolant in the above-mentioned manner, the flow rate of the coolant flowing in the flow channel 2 gradually increases. Although the temperature of the coolant continuously rises during the flow process, the heat absorbed by the coolant in the third zone 23, the second zone 22 and the first zone 21 is approximately the same, thus avoiding the situation of local overheating caused by the decrease in the heat absorption effect of the coolant and ensuring that the performance of the electronic device is not affected.

[0051] It should be noted that the S-shaped flow channel 2 increases the length of the path for the coolant to flow, allowing the coolant to absorb more heat, thereby improving the heat exchange efficiency.

[0052] Embodiment 2:

[0053] The basic content is the same as that of Embodiment 1, except that:

[0054] Please refer to Figures 3 - 5 , in this embodiment, two grooves 31 are formed on the side surface of the partition 3 along its length direction. The two grooves 31 are symmetrically distributed along the central axis of the partition 3, and the grooves 31 face the direction of the flow channel 2 and communicate with the flow channel 2; the two inner side walls of the grooves 31 corresponding to the flow channel 2 are inclined surfaces 34 inclined towards it. A transfer plate 32 is vertically fixed in the grooves 31, and a gap is formed between the transfer plate 32 and the inclined surface 34. A plurality of openings 33 are equidistantly formed on the transfer plate 32. One end of the openings 33 communicates with the grooves 31, and the other end communicates with the flow channel 2.

[0055] During application, when the coolant flows in the flow channel 2, the coolant will also enter the grooves 31 and flow in the grooves 31. During the flow of the coolant, the coolant also contacts the transfer plate 32 and absorbs the heat on the transfer plate 32. At the same time, the coolant entering the grooves 31 will also converge with the coolant in the flow channel 2 through the openings 33. By providing the transfer plate 32 and the openings 33, the coolant can absorb the maximum amount of heat during the flow process, improving the heat absorption effect.

[0056] Further, the transfer plate 32 is made of a heat-conducting material, and the heat-conductivity coefficients of several transfer plates 32 increase successively along the flow direction of the flow channel 2. After the coolant flows through the flow channel 2, it will come into contact with the transfer plates 32 in the third zone 23, the second zone 22, and the first zone 21 in sequence. However, the heat-conductivity coefficients of the transfer plates 32 in the first zone 21, the transfer plates 32 in the second zone 22, and the transfer plates 32 in the third zone 23 decrease successively. Therefore, when the coolant flows through, due to the different heat-conductivity coefficients of the transfer plates 32 and the different flow velocities of the coolant during flow, the heat absorption and heat transfer efficiency of the coolant in the third zone 23, the second zone 22, and the first zone 21 are made roughly the same.

[0057] It should be noted that the coolant flows in the flow channel 2 and gradually increases its flow velocity. At the same time, through the transfer plate 32 in the groove 31, the coolant can perform additional heat exchange to ensure that more heat is transferred to the coolant. Moreover, the heat-conductivity coefficients of several transfer plates 32 corresponding to the flow channel 2 increase along the flow direction, enabling the coolant with an increased temperature entering the first zone 21 to come into contact with the transfer plate 32 having a high heat-conductivity coefficient. Thus, when the coolant with an increased temperature entering the first zone 21 absorbs heat in the first zone 21, it is roughly the same as that in the second zone 22 and the third zone 23, further preventing the occurrence of local overheating.

[0058] Embodiment 3:

[0059] The basic content is the same as that of Embodiment 1, except that:

[0060] Please refer to Figure 3 , in this embodiment, the substrate 1 includes a bottom plate 12 and a sealing plate 11. The partition plate 3 is fixed on the inner side wall of the sealing plate 11, and the bottom surface of the partition plate 3 is connected to the top surface of the bottom plate 12. The bottom plate 12 is provided corresponding to the heating unit, and the bottom plate 12 is made of a heat-conducting material.

[0061] During application, the bottom plate 12 is arranged on the heat source. The bottom plate 12 made of a heat-conducting material can effectively transfer the heat on the heat source into the sealing plate 11, so that the coolant can better absorb heat and cool down during flow.

[0062] In summary, the working principle of this liquid cooling plate assembly is as follows:

[0063] After the coolant is introduced into the flow channel 2 in the substrate 1 through the water inlet pipe 4, it will flow through the third zone 23, the second zone 22, and the first zone 21 in sequence. Since the cross-sectional areas of the third zone 2, the second zone 22, and the first zone 21 decrease successively, when the coolant flows through the third zone 23, the second zone 22, and the first zone 21, its flow velocity will also increase successively, thus avoiding the situation of uneven heat absorption of the coolant in the flow channel 2 due to the same flow velocity of the coolant during flow and continuous temperature rise, resulting in local overheating.

[0064] Embodiment 4:

[0065] The basic content of Example 1 is different in that:

[0066] Please refer to Figures 6 - 7 , a coolant delivery device in this embodiment is applied to the liquid cooling plate assembly of Example 1. The device includes a control system 7 and a branch pipe 6. The control system 7 is connected to the branch pipe 6 and the water inlet pipe 4. The branch pipe 6 is arranged on the substrate 1 corresponding to the first area 21 and communicates with the first area 21. The diameter of the branch pipe 6 is smaller than that of the water inlet pipe 4.

[0067] During application, the control system 7 operates, and the coolant is introduced into the flow channel 2 through the water inlet pipe 4. After the coolant enters the flow channel 2, the coolant will successively pass through the third area 23, the second area 22 and the first area 21. After the coolant passes through the third area 23 and enters the second area 22, the temperature of the coolant will increase because it absorbs the heat at the third area 23. When the coolant enters the first area 21 from the second area 22, the heat absorption effect of the coolant will decrease. At this time, the control system 7 also introduces the unabsorbed coolant into the first area 21 through the branch pipe 6 to neutralize the original heated coolant, so as to ensure the heat absorption effect of the coolant in the first area 21 and avoid local overheating.

[0068] Specifically, a temperature sensor is arranged on the substrate 1 corresponding to the first area 21. The control system 7 includes a control unit and two independent delivery units. The two independent delivery units are respectively connected to the water inlet pipe 4 and the branch pipe 6. The control unit is signal-connected to the temperature sensor; preferably, the delivery unit is a pump body, and the pump body delivers the coolant; the control connection of the temperature sensor, the control unit and the delivery unit can be obtained by those skilled in the art, so no more details will be described here; during application, the control unit controls the delivery unit corresponding to the water inlet pipe 4 to input the coolant into the substrate 1 through the water inlet pipe 4. When the temperature sensor monitors that the temperature of the coolant in the first area 21 increases, the control system 7 then inputs a small amount of unabsorbed coolant into the first area 21 of the substrate 1 through the delivery unit corresponding to the branch pipe 6 to neutralize the temperature of the heated coolant and ensure the heat transfer efficiency of the coolant in the first area 21. [[ID=ID=15]]

[0069] In summary, the working principle of this coolant delivery device is as follows:

[0070] After the control system 7 introduces the coolant into the flow channel 2 in the substrate 1 through the water inlet pipe 4, the coolant flows through the third zone 23, the second zone 22, and the first zone 21 in sequence and starts to absorb heat. After the coolant flows to the first zone 21, the temperature of the coolant rises after absorbing heat. At this time, when the temperature sensor monitors that the temperature in the first zone 21 is too high, the temperature sensor transmits a signal to the control system 7. The control system 7 inputs the coolant into the first zone 21 through the branch pipe 6. At this time, the non-heat-absorbed coolant input by the branch pipe 6 will neutralize the heat-absorbed coolant, so as to ensure that when the coolant entering the first zone 21 absorbs heat inside it, it absorbs heat approximately the same as the coolant in the third zone 23 and the second zone 22, so as to avoid the occurrence of local overheating.

[0071] Embodiment 5:

[0072] The basic content is the same as that of Embodiment 1, except that:

[0073] Please refer to Figures 3 - 7 , in this embodiment, two grooves 31 are provided on the side surface of the partition plate 3 along its length direction. The two grooves 31 are symmetrically distributed along the central axis of the partition plate 3, and the grooves 31 face the flow channel 2 and are communicated with the flow channel 2; the two inner side walls of the grooves 31 corresponding to the flow channel 2 are inclined surfaces 34 inclined towards it. A transfer plate 32 is vertically fixed in the grooves 31, and a gap is formed between the transfer plate 32 and the inclined surface 34. A plurality of openings 33 are equidistantly provided on the transfer plate 32. One end of the openings 33 is communicated with the grooves 31, and the other end is communicated with the flow channel 2.

[0074] In a specific embodiment, please refer to Figures 6 - 7 : A coolant delivery device is applied to the liquid cooling plate assembly of Embodiment 1. The device includes a control system 7 and a branch pipe 6. The control system 7 is connected to the branch pipe 6. The control system 7 is connected to the water inlet pipe 4. The branch pipe 6 is arranged on the substrate 1 corresponding to the first zone 21 and is communicated with the first zone 21. The diameter of the branch pipe 6 is smaller than the diameter of the water inlet pipe 4.

[0075] During application, as the coolant flows through the flow channel 2, the flow rate of the coolant gradually increases. At the same time, in cooperation with the transfer plate 32 whose thermal conductivity increases along the flow direction of the flow channel 2, it can make the heat absorbed by the coolant in the third zone 23, the second zone 22 and the first zone 21 approximately the same, avoiding local overheating. At the same time, after the coolant enters the first zone 21, it absorbs the heat of the third zone 23 and the second zone 22. In order to ensure that the heated coolant can absorb the same amount of heat as the third zone 23 and the second zone 22 in the first zone 21, when the control system 7 inputs the coolant into the flow channel 2 through the water inlet pipe 4, it will also input a small amount of unabsorbed coolant into the first zone 21 through the branch pipe 6 to mix with the heated coolant entering the first zone 21. At this time, the overall temperature of the mixed coolant drops, and the coolant with a lower temperature after mixing absorbs heat from the first zone 21, further ensuring that the coolant can absorb approximately the same amount of heat in the first zone 21, the second zone 22 and the third zone 23, avoiding local overheating; the above method realizes that the heat absorbed by the coolant in each area is approximately the same when the coolant flows through the flow channel 2 by allowing the coolant with a lower temperature to contact the transfer plate 32 with a lower thermal conductivity, the coolant with a higher temperature to contact the transfer plate 32 with a higher thermal conductivity, and neutralizing the temperature of the coolant with a higher temperature.

[0076] It should be noted that a small amount of coolant is introduced into the first zone 21 through the branch pipe 6, causing a pressure drop at the first zone 21, so that the coolant transported by the second zone 22 and the coolant input by the branch pipe 6 combine to form a vortex or a turbulent flow at the input of the branch pipe 6. The formation of the vortex or the turbulent flow increases the opportunity for heat transfer between the coolant and the transfer plate 32. Under this perturbation, the heat exchange efficiency of the coolant in the first zone 21 is improved. At the same time, with the coolant introduced by the branch pipe 6, the problem of pressure fluctuation at the coolant outlet is reduced, the stable operation of the liquid cooling system is maintained, and the problem of too low heat absorption efficiency of the coolant in the high-temperature area is also avoided.

[0077] It can be seen that under the action of the above solution, the temperature gradient in the substrate 1 is made uniform and the thermal shock is reduced, reducing the loss of the liquid cooling plate assembly material caused by thermal stress and extending the service life of the equipment.

[0078] In a specific embodiment, please refer to Figures 7 - 9 : A heat transfer plate 8 is arranged in the substrate 1 along the flow direction in the flow channel 2, and the heat transfer plate 8 is located at the middle part of the flow channel 2. The heat transfer plate 8 includes a first section 81, a second section 82, and a third section 83 in sequence along the flow direction of the flow channel 2. The first section 81, the second section 82, and the third section 83 are respectively arranged in the flow channel 2 corresponding to the third zone 23, the second zone 22, and the first zone 21. The thermal conductivities of the first section 81, the second section 82, and the third section 83 increase in sequence, the thickness of the heat transfer plate 8 decreases in sequence along the flow direction of the flow channel 2, and exchange ports 84 are equally spaced inside the heat transfer plate 8.

[0079] During application, the coolant flows in the flow passage 2, contacts the heat transfer plate 8, and continuously passes through the exchange ports 84. At the same time, during the flowing process, the coolant contacts the first section 81, the second section 82, and the third section 83 in sequence. Since the thermal conductivities of the first section 81, the second section 82, and the third section 83 increase in sequence, after the coolant contacts the heat transfer plate 8, the heat absorption of the coolant increases in sequence, so that the heat absorbed by the coolant in the third zone 23, the second zone 22, and the first zone 21 is approximately the same, avoiding local overheating. At the same time, with the cooperation of the heat transfer plate 8 and the transfer plate 32, the heat exchange efficiency of the coolant in the flow passage 2 is improved; since the flow passage 2 is a continuous S shape, when the coolant flows in the flow passage 2, the frictional force between the coolant and the partition 3 will reduce the flow rate of the coolant close to the partition 3, thereby forming laminar flow and turbulent flow in the flow passage 2, reducing the heat exchange efficiency of the coolant. However, the heat transfer plate 8 located in the flow passage 2 can contact the coolant with a faster flow rate, enabling the coolant to effectively perform the heat exchange work.

[0080] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid cooling plate assembly, characterized in that, It includes a substrate (1), and several partition plates (3) are arranged inside the substrate (1). The several partition plates (3) are staggered and arranged on the inner wall of the substrate (1); A continuous S-shaped flow channel (2) located inside the substrate (1) is formed between the several partition plates (3). In the flow channel (2), a third zone (23), a second zone (22), and a first zone (21) that are sequentially connected are formed along the flow direction. The cross-sections of the third zone (23), the second zone (22), and the first zone (21) gradually decrease along the flow direction of the flow channel (2); A water outlet pipe (5) is arranged on the substrate (1) corresponding to the first zone (21), and the water outlet pipe (5) is communicated with the first zone (21). A water inlet pipe (4) is arranged on the substrate (1) corresponding to the third zone (23), and the water inlet pipe (4) is communicated with the third zone (23); Two grooves (31) are formed on the side surface of the partition plate (3) along its length direction. The two grooves (31) are symmetrically distributed along the central axis of the partition plate (3), and the grooves (31) face the flow channel (2) and are communicated with the flow channel (2). A transfer plate (32) is vertically fixed in the grooves (31). The transfer plate (32) is made of a heat-conducting material, and the heat-conducting coefficients of the several transfer plates (32) gradually increase along the flow direction of the flow channel (2).

2. The liquid cooling plate assembly according to claim 1, wherein The distances between the several partition plates (3) and the inner side wall of the substrate (1) on the side away from their fixed surfaces gradually decrease along the flow direction of the flow channel (2).

3. The liquid cooling plate assembly according to claim 1, characterized in that, The two inner side walls of the groove (31) corresponding to the flow channel (2) are inclined surfaces inclined towards it. A gap is formed between the transfer plate (32) and the inclined surface. Several openings (33) are equally spaced on the transfer plate (32). One end of the opening (33) is communicated with the groove (31), and the other end is communicated with the flow channel (2).

4. The liquid cooling plate assembly according to claim 1, characterized in that, The substrate (1) includes a bottom plate (12) and a sealing plate (11). The partition plate (3) is fixed on the inner side wall of the sealing plate (11). The bottom surface of the partition plate (3) is connected to the top surface of the bottom plate (12). The bottom plate (12) is arranged corresponding to the heating unit, and the bottom plate (12) is made of a heat-conducting material.

5. A coolant delivery device, characterized in that, This device is applied to the liquid cooling plate assembly described in any one of claims 1-4. This device includes a control system (7) and a branch pipe (6). The control system (7) is connected to the branch pipe (6). The control system (7) is connected to the water inlet pipe (4). The branch pipe (6) is arranged on the substrate (1) corresponding to the first zone (21) and is communicated with the first zone (21). The diameter of the branch pipe (6) is smaller than the diameter of the water inlet pipe (4).

Citation Information

Patent Citations

  • Liquid cooling plate and battery pack

    CN209088029U