Spliced infrared detector packaging structure

Abstract

The invention discloses a spliced infrared detector packaging structure which comprises a packaging bottom plate, a packaging shell and a packaging cover plate, a mounting groove is formed in the inner bottom of the packaging bottom plate, and an infrared chip is mounted in the mounting groove through conductive paste. The invention relates to the technical field of semiconductor packaging. A lifting rod is pulled, a lifting plate located on the lifting rod drives an insertion rod to be far away from a positioning hole of a packaging bottom plate, a person rotates a rotating ring to enable a metal bonding pad on the rotating ring to be located at the optimal position of an infrared chip, use of binding wires is effectively reduced, and meanwhile when the metal bonding pad is damaged, the metal bonding pad is prevented from being damaged. The position of the metal bonding pad can be conveniently adjusted by rotating the rotating ring, the damage to the infrared chip and the influence on the working performance of the infrared chip are effectively avoided, the packaging bottom plate, the packaging shell and the packaging cover plate are conveniently disassembled and assembled by using the fixing assembly, and the convenience of the packaging structure during disassembly and assembly is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and specifically to a spliced infrared detector packaging structure. Background Art

[0002] An infrared detector is a photosensitive element capable of detecting infrared rays. It can convert infrared rays into electrical signals, thereby realizing functions such as infrared detection, temperature measurement, distance measurement, and image detection. Among them, the infrared detector packaging structure refers to the process of packaging an infrared detector in a housing to protect the detector, fix its position, and connect external circuits.

[0003] In the prior art, a Chinese patent with the publication number "CN113611753A" discloses an infrared detector packaging structure and a packaging method. By setting a sunken metal groove on a substrate for chip mounting and controlling the size of the metal groove so that the maximum distance between the groove wall of the metal groove and the side wall of the chip does not exceed the maximum allowable offset of the chip, the offset range of the chip can be effectively controlled. The quality of the offset can be judged with the naked eye and a common magnifying glass, which improves production efficiency and reduces detection costs, and solves the problem that conductive silver paste is likely to overflow and cause short circuits in the existing spliced infrared detector packaging structure.

[0004] However, there are still significant deficiencies in the prior art, such as: In the above-described solution, multiple metal pads are fixed on the outer side of the packaging housing, and bonding wires are used to connect the infrared chip to the metal pads. Due to the fixed position of the metal pads and the length limitation of the bonding wires, when one of the metal pads is damaged, the length and angle of the bonding wires need to be adjusted or replaced to ensure a reliable connection between the infrared chip and the metal pads. However, it takes a long time to replace the bonding wires, and the current packaging housing consists of a packaging outer shell and a packaging cover plate, which are disassembled and assembled by means of threads or snaps. When disassembling and assembling using the thread method, when the thread is damaged, the packaging outer shell cannot be removed. Therefore, the present invention proposes a spliced infrared detector packaging structure to solve the above-mentioned problems. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides a spliced infrared detector packaging structure, which solves the problems that the position of the metal pads cannot be adjusted in the existing packaging structure, and the packaging outer shell and the packaging cover plate cannot be removed when the thread is damaged due to thread disassembly and assembly.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: A splicing infrared detector packaging structure, including a packaging bottom plate, a packaging outer shell and a packaging cover plate. An installation groove is opened at the inner bottom of the packaging bottom plate. An infrared chip is mounted on the inner bottom of the installation groove through conductive paste. A rotating ring is fixedly installed on the inner bottom of the packaging bottom plate and outside the installation groove. A positioning component is arranged on the rotating ring to fix the position of the rotating ring through the positioning component; A plurality of metal pads are fixedly connected to the rotating ring, and the infrared chip is connected to the metal pads through bonding wires; A fixing component is arranged on the packaging cover plate, and the packaging cover plate is connected to the packaging outer shell through the fixing component; External threads are opened on the outer side surface of the packaging bottom plate, an installation ring is arranged at the inner bottom of the packaging cover plate, and internal threads are arranged on the inner side surface of the installation ring.

[0007] Preferably, the positioning component includes a lifting groove and a plurality of positioning holes. The lifting groove is arranged inside the rotating ring. A lifting plate is slidably installed inside the lifting groove. A lifting rod is fixedly connected to the upper end surface of the lifting plate. A first spring is fixedly connected to the upper end surface of the lifting plate and outside the lifting rod. One end of the first spring away from the lifting plate is fixedly connected to the inner top of the lifting groove.

[0008] Preferably, a plurality of the positioning holes are annularly arranged on the upper end surface of the packaging bottom plate. A plug rod is fixedly connected to the lower end surface of the lifting plate. One end of the plug rod away from the lifting plate penetrates through the rotating ring and is inlaid with the positioning hole. One end of the lifting rod away from the lifting plate penetrates through the rotating ring and is fixedly connected with a handle.

[0009] Preferably, the fixing component includes a rotating groove, which is arranged on the side end surface of the packaging cover plate. A rotating plate is rotatably connected inside the rotating groove. A tensioning component is arranged on the rotating plate. An L-shaped plate is arranged on the tensioning component, and an annular block is fixedly connected to the L-shaped plate.

[0010] Preferably, the tensioning component includes a pulling groove. A pulling plate is slidably installed inside the pulling groove. A pulling rod is fixedly connected to the lower end surface of the pulling plate. One end of the pulling rod away from the pulling plate penetrates through the rotating plate and is fixedly connected to the L-shaped plate.

[0011] Preferably, a second spring is fixedly connected to the lower end surface of the pulling plate and outside the pulling rod. One end of the second spring away from the pulling plate is fixedly connected to the inner bottom of the pulling groove.

[0012] Preferably, a limiting block is fixedly connected to the inner bottom of the rotating ring, and a limiting ring groove is opened on the upper end surface of the packaging bottom plate. The limiting block is slidably connected with the limiting ring groove.

[0013] Preferably, an annular groove is formed on the lower end surface of the encapsulation bottom plate, and the annular block is slidably connected to the annular groove.

[0014] Preferably, a plurality of pins are fixedly connected to the lower end surface of the encapsulation bottom plate and inside the annular groove, and the infrared chip is electrically connected to the outside through metal pads and pins.

[0015] Preferably, a card slot is formed between the encapsulation bottom plate and the encapsulation housing, the mounting ring is located inside the card slot, and the mounting ring is slidably connected to the card slot.

[0016] Advantageous Effects The present invention provides a splicing infrared detector packaging structure. Compared with the prior art, it has the following advantageous effects: 1. In the present invention, by pulling the lifting rod, the lifting plate on the lifting rod will drive the insertion rod away from the positioning hole of the encapsulation bottom plate. The user rotates the rotating ring to make the metal pad on the rotating ring in the optimal position for the infrared chip, effectively reducing the use of bonding wires. At the same time, when the metal pad is damaged, it is convenient to adjust the position of the metal pad by rotating the rotating ring, effectively avoiding the damage of the infrared chip and affecting its working performance; 2. In the present invention, adjust the rotating plate to make it in an inclined state. By pulling the L-shaped plate, the L-shaped plate drives the pulling plate in the pulling groove to press down the second spring. Then turn the inclined rotating plate to a vertical state and slowly release the L-shaped plate. Using the resilience of the second spring, the annular block on the L-shaped plate is located inside the annular groove. Through the fitting of the L-shaped plate and the limitation of the annular block, the encapsulation housing is located between the L-shaped plate and the encapsulation bottom plate, improving the firmness of the encapsulation bottom plate and the encapsulation housing; 3. In the present invention, when the internal thread on the mounting ring and the external thread on the encapsulation bottom plate are damaged and the encapsulation cover cannot be removed from the encapsulation bottom plate and the encapsulation housing, pull the L-shaped plate to move the annular block out of the annular groove, rotate the vertical L-shaped plate by a certain angle, and the encapsulation housing on the encapsulation bottom plate will directly fall off, thus completing the disassembly of the entire structure, improving the convenience of disassembly and assembly of the packaging structure. Description of the Drawings

[0017] Figure 1 is an exploded view of the present invention; Figure 2 is a schematic diagram of the overall structure of the present invention Figure 1 ; Figure 3 is a schematic diagram of the overall structure of the present invention Figure 2 ; Figure 4 is a schematic diagram of the overall structure in the present invention Figure 3 ; Figure 5 is a schematic diagram of the structure of the encapsulation bottom plate in the present invention; Figure 6 It is a cross-sectional view of the encapsulation bottom plate in the present invention; Figure 7 is Figure 6 an enlarged view of part A in; Figure 8 It is a cross-sectional view of the rotating plate in the present invention.

[0018] In the figure: 1, encapsulation bottom plate; 2, encapsulation shell; 3, encapsulation cover plate; 4, installation groove; 5, rotating ring; 6, metal pad; 7, bonding wire; 8, external thread; 9, installation ring; 10, internal thread; 11, lifting groove; 12, positioning hole; 13, lifting plate; 14, lifting rod; 15, first spring; 16, insertion rod; 17, handle; 18, rotating groove; 19, rotating plate; 20, L-shaped plate; 21, annular block; 22, pulling groove; 23, pulling plate; 24, pulling rod; 25, second spring; 26, limiting block; 27, limiting ring groove; 28, annular groove; 29, pin; 30, card slot; 31, infrared chip. Specific embodiments

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] Embodiment 1: Please refer to Figure 1-8 , the present invention is a splicing infrared detector packaging structure, including an encapsulation bottom plate 1, an encapsulation shell 2 and an encapsulation cover plate 3. An installation groove 4 is opened at the inner bottom of the encapsulation bottom plate 1. An infrared chip 31 is mounted on the inner bottom of the installation groove 4 through conductive paste. A rotating ring 5 is fixedly installed on the inner bottom of the encapsulation bottom plate 1 and outside the installation groove 4. A positioning component is provided on the rotating ring 5 to fix the position of the rotating ring 5 through the positioning component; A plurality of metal pads 6 are fixedly connected to the rotating ring 5. The infrared chip 31 is connected to the metal pads 6 through bonding wires 7. A plurality of pins 29 are fixedly connected to the lower end surface of the encapsulation bottom plate 1 and inside the annular groove 28. The infrared chip 31 is electrically connected to the outside through the metal pads 6 and the pins 29; An external thread 8 is opened on the outer side surface of the encapsulation bottom plate 1. An installation ring 9 is provided at the inner bottom of the encapsulation cover plate 3. An internal thread 10 is provided on the inner side surface of the installation ring 9. A card slot 30 is formed between the encapsulation bottom plate 1 and the encapsulation shell 2. The position of the installation ring 9 is inside the card slot 30, and the installation ring 9 is slidably connected to the card slot 30. The encapsulation bottom plate 1 and the encapsulation shell 2 are connected together through the external thread 8 and the internal thread 10.

[0021] The encapsulation cover plate 3 is provided with a fixing component. The encapsulation cover plate 3 is connected to the encapsulation housing 2 through the fixing component. The positioning component includes a lifting groove 11 and a plurality of positioning holes 12. The lifting groove 11 is arranged inside the rotating ring 5. A lifting plate 13 is slidably installed inside the lifting groove 11. The upper end surface of the lifting plate 13 is fixedly connected to a lifting rod 14. A first spring 15 is fixedly connected to the upper end surface of the lifting plate 13 and on the outer side of the lifting rod 14. One end of the first spring 15 away from the lifting plate 13 is fixedly connected to the inner top of the lifting groove 11.

[0022] The plurality of positioning holes 12 are annularly arranged on the upper end surface of the encapsulation bottom plate 1. A plug rod 16 is fixedly connected to the lower end surface of the lifting plate 13. One end of the plug rod 16 away from the lifting plate 13 penetrates through the rotating ring 5 and is inlaid with the positioning hole 12. The bottom end of the plug rod 16 is below the rotating ring 5. One end of the lifting rod 14 away from the lifting plate 13 penetrates through the rotating ring 5 and is fixedly connected to a handle 17. The top end of the lifting rod 14 is above the lifting plate 13.

[0023] In this embodiment, by pulling the lifting rod 14, the lifting plate 13 on the lifting rod 14 will drive the plug rod 16 away from the positioning hole 12 of the encapsulation bottom plate 1. The operator rotates the rotating ring 5 to make the metal pad 6 on the rotating ring 5 in the best position of the infrared chip 31, effectively reducing the use of the bonding wire 7. At the same time, when the metal pad 6 is damaged, by rotating the rotating ring 5, it is convenient to adjust the position of the metal pad 6, effectively avoiding the damage of the infrared chip 31 and affecting its working performance.

[0024] Embodiment 2: Please refer to Figure 1-8 , on the basis of Embodiment 1, the fixing component includes a rotating groove 18. The rotating groove 18 is arranged on the side end surface of the encapsulation cover plate 3. A rotating plate 19 is rotatably connected inside the rotating groove 18. A tensioning component is arranged on the rotating plate 19. An L-shaped plate 20 is arranged on the tensioning component. An annular block 21 is fixedly connected to the L-shaped plate 20. An annular groove 28 is opened on the lower end surface of the encapsulation bottom plate 1. The annular block 21 is slidably connected to the annular groove 28.

[0025] The tensioning component includes a pulling groove 22. A pulling plate 23 is slidably installed inside the pulling groove 22. A pulling rod 24 is fixedly connected to the lower end surface of the pulling plate 23. One end of the pulling rod 24 away from the pulling plate 23 penetrates through the rotating plate 19 and is fixedly connected to the L-shaped plate 20. A second spring 25 is fixedly connected to the lower end surface of the pulling plate 23 and on the outer side of the pulling rod 24. One end of the second spring 25 away from the pulling plate 23 is fixedly connected to the inner bottom of the pulling groove 22. A limiting block 26 is fixedly connected to the inner bottom of the rotating ring 5. A limiting ring groove 27 is opened on the upper end surface of the encapsulation bottom plate 1. The limiting block 26 is slidably connected to the limiting ring groove 27. In this embodiment, the rotating plate 19 is adjusted to be in an inclined state. By pulling the L-shaped plate 20, the L-shaped plate 20 drives the pulling plate 23 in the pulling groove 22 to press down the second spring 25. Then, the inclined rotating plate 19 is rotated to the vertical state, and the L-shaped plate 20 is slowly released. The elastic force of the second spring 25 is used to make the annular block 21 on the L-shaped plate 20 be inside the annular groove 28. Through the fitting of the L-shaped plate 20 and the limitation of the annular block 21, the encapsulation housing 2 is positioned between the L-shaped plate 20 and the encapsulation bottom plate 1, improving the firmness of the encapsulation bottom plate 1 and the encapsulation housing 2. When the internal thread 10 on the mounting ring 9 and the external thread 8 on the encapsulation bottom plate 1 are damaged and the encapsulation cover plate 3 cannot be removed from the encapsulation bottom plate 1 and the encapsulation housing 2, the L-shaped plate 20 is pulled to move the annular block 21 out of the annular groove 28, and the vertically placed L-shaped plate 20 is rotated by a certain angle, and the encapsulation housing 2 on the encapsulation bottom plate 1 will directly fall off, thus completing the disassembly of the entire structure and improving the practicality of the encapsulation.

[0026] Working principle: During use, by pulling the lifting rod 14, the lifting plate 13 on the lifting rod 14 will drive the insertion rod 16 away from the positioning hole 12 on the encapsulation bottom plate 1. The user rotates the rotating ring 5 to make the metal pad 6 on the rotating ring 5 be in the best position of the infrared chip 31, effectively reducing the use of the bonding wire 7. At the same time, when the metal pad 6 is damaged, by rotating the rotating ring 5, it is convenient to adjust the position of the metal pad 6, and then the lifting rod 14 is released. The lifting rod 14 will be reinserted into the positioning hole 12 by the elastic force of the first spring 15, effectively avoiding the damage of the infrared chip 31 and affecting its working performance. When the encapsulation bottom plate 1, the encapsulation housing 2, and the encapsulation cover plate 3 need to be assembled, the encapsulation housing 2 is sleeved on the outside of the encapsulation bottom plate 1 to form a card slot 30 between the encapsulation housing 2 and the encapsulation bottom plate 1. Then, the mounting ring 9 on the encapsulation cover plate 3 is sleeved on the encapsulation bottom plate 1. At this time, the mounting ring 9 is located inside the card slot 30. Then, the internal thread 10 on the mounting ring 9 and the external thread 8 on the encapsulation bottom plate 1 are used to fix the encapsulation cover plate 3 and the encapsulation bottom plate 1 together. Then, the rotating plate 19 on the encapsulation cover plate 3 is in an inclined state. At this time, the rotating plate 19 is outside the encapsulation housing 2. By pulling the L-shaped plate 20, the L-shaped plate 20 drives the pulling plate 23 in the pulling groove 22 to press down the second spring 25. The inclined rotating plate 19 is rotated to the vertical state, and the L-shaped plate 20 is slowly released. The elastic force of the second spring 25 is used to make the annular block 21 on the L-shaped plate 20 be inside the annular groove 28. Through the fitting of the L-shaped plate 20 and the limitation of the annular block 21, the encapsulation housing 2 is positioned between the L-shaped plate 20 and the encapsulation bottom plate 1, improving the firmness of the encapsulation bottom plate 1 and the encapsulation housing 2. When the internal thread 10 on the mounting ring 9 and the external thread 8 on the encapsulation bottom plate 1 are damaged and the encapsulation cover plate 3 cannot be removed from the encapsulation bottom plate 1 and the encapsulation housing 2, pull the L-shaped plate 20 to move the annular block 21 in the annular groove 28 out, rotate the L-shaped plate 20 in the vertical state by a certain angle, and the encapsulation housing 2 on the encapsulation bottom plate 1 will directly fall off.

[0027] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0028] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A spliced ​​infrared detector packaging structure, comprising a packaging base plate (1), a packaging shell (2) and a packaging cover plate (3), characterized in that: The inner bottom of the package base plate (1) is provided with a mounting groove (4), the inner bottom of the mounting groove (4) being mounted with an infrared chip (31) via conductive paste, a rotating ring (5) being fixedly mounted on the inner bottom of the package base plate (1) and outside the mounting groove (4), the rotating ring being provided with a positioning component, and the rotating ring (5) being fixed in position via the positioning component; A plurality of metal pads (6) are fixedly connected to the rotating ring (5), and the infrared chip (31) is connected to the metal pads (6) via binding wires (7); A fixing component is provided on the packaging cover plate (3), and the packaging cover plate (3) is connected to the packaging shell (2) via the fixing component; The outer side surface of the packaging bottom plate (1) is provided with an external thread (8), the inner bottom of the packaging cover plate (3) is provided with a mounting ring (9), and the inner side surface of the mounting ring (9) is provided with an internal thread (10).

2. The spliced ​​infrared detector packaging structure according to claim 1, characterized in that: The positioning assembly comprises a lifting groove (11) and a plurality of positioning holes (12); the lifting groove (11) is arranged inside the rotating ring (5); a lifting plate (13) is slidably mounted inside the lifting groove (11); a lifting rod (14) is fixedly connected to the upper end surface of the lifting plate (13); a spring 1 (15) is fixedly connected to the upper end surface of the lifting plate (13) and located outside the lifting rod (14); an end of the spring 1 (15) away from the lifting plate (13) is fixedly connected to the inner top of the lifting groove (11).

3. The spliced ​​infrared detector packaging structure according to claim 2, characterized in that: A plurality of positioning holes (12) are arranged in a ring shape on the upper end surface of the packaging base plate (1); a lower end surface of the lifting plate (13) is fixedly connected to an insertion rod (16); an end of the insertion rod (16) away from the lifting plate (13) passes through the rotating ring (5) and is embedded in the positioning hole (12); an end of the lifting rod (14) away from the lifting plate (13) passes through the rotating ring (5) and is fixedly connected to a handle (17).

4. The spliced ​​infrared detector packaging structure according to claim 1, characterized in that: The fixing assembly comprises a rotation groove (18), the rotation groove (18) being arranged on a side end surface of the packaging cover plate (3), a rotation plate (19) being rotationally connected inside the rotation groove (18), a tensioning assembly being arranged on the rotation plate (19), an L-shaped plate (20) being arranged on the tensioning assembly, and an annular block (21) being fixedly connected to the L-shaped plate (20).

5. The spliced ​​infrared detector packaging structure according to claim 4, characterized in that: The tensioning assembly comprises a pulling groove (22), a pulling plate (23) is slidably mounted inside the pulling groove (22), a pulling rod (24) is fixedly connected to the lower end surface of the pulling plate (23), and an end of the pulling rod (24) away from the pulling plate (23) passes through the rotating plate (19) and is fixedly connected to the L-shaped plate (20).

6. The spliced ​​infrared detector packaging structure according to claim 5, characterized in that: A second spring (25) is fixedly connected to the lower end surface of the pulling plate (23) and located outside the pulling rod (24); one end of the second spring (25) away from the pulling plate (23) is fixedly connected to the inner bottom of the pulling groove (22).

7. The spliced ​​infrared detector packaging structure according to claim 1, characterized in that: The inner bottom of the rotating ring (5) is fixedly connected to a limiting block (26), the upper end surface of the packaging bottom plate (1) is provided with a limiting ring groove (27), and the limiting block (26) is slidably connected to the limiting ring groove (27).

8. The spliced ​​infrared detector packaging structure according to claim 4, characterized in that: An annular groove (28) is provided on the lower end surface of the packaging bottom plate (1), and the annular block (21) is slidably connected to the annular groove (28).

9. The spliced ​​infrared detector packaging structure according to claim 8, characterized in that: A plurality of pins (29) are fixedly connected to the lower end surface of the packaging base plate (1) and located inside the annular groove (28), and the infrared chip (31) is electrically connected to the outside via the metal pad (6) and the pins (29).

10. The spliced ​​infrared detector packaging structure according to claim 4, characterized in that: The packaging base plate (1) and the packaging shell (2) form a slot (30), the mounting ring (9) is located inside the slot (30), and the mounting ring (9) is slidably connected to the slot (30).

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