Display panel and manufacturing method thereof

Abstract

The invention discloses a display panel and a manufacturing method thereof, the display panel is provided with a through hole penetrating through the display panel, the display panel comprises a substrate, the substrate is provided with a display area and a through hole packaging area located in the display area, and the through hole packaging area is arranged around the through hole; the inorganic layer is located in the display area of the substrate; the at least one first isolation column is located in the through hole packaging area and arranged around the through hole; the first isolation column is arranged on the inorganic layer, the first isolation column comprises a first sub-inorganic layer, a second sub-inorganic layer and a third sub-inorganic layer which are stacked in the thickness direction, and the second sub-inorganic layer retracts relative to the first sub-inorganic layer and the third sub-inorganic layer, so that a first groove surrounding the through hole is formed in the side wall of the first isolation column; the light-emitting layer is located on the side, away from the substrate, of the inorganic layer; the cathode layer is positioned on one side, far away from the substrate, of the light-emitting layer; the light-emitting layer and the cathode layer are disconnected at the position of the first groove.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and particularly to a display panel and a manufacturing method thereof. Background Art

[0002] Active-Matrix Organic Light-Emitting Diode (AMOLED) has the advantages of self-luminescence, wide color gamut, high contrast ratio, flexibility, high response and flexibility, etc., and has broad application prospects.

[0003] With the rapid development of AMOLED display products, the requirements of customers for product quality and the urgency of manufacturers to improve the yield have both increased sharply. For AMOLED display products with holes (i.e., AA holes) on the screen, components such as a front camera and a light sensor can be arranged in the holes, thereby increasing the screen-to-body ratio.

[0004] However, in the production process of manufacturing AMOLED display products, since the light-emitting layer and the cathode are formed by full-surface evaporation, when water vapor invades the cut of the opening area, the water vapor easily invades the display area through the light-emitting layer, cathode, etc. exposed at the cut position, resulting in product failure. Summary of the Invention

[0005] Embodiments of the present disclosure provide a display panel and a manufacturing method thereof to solve the above technical problems existing in the prior art.

[0006] In a first aspect, to solve the above technical problems, embodiments of the present disclosure provide a display panel having a through hole penetrating the display panel, the display panel including:

[0007] A substrate, the substrate having a display area and a through hole encapsulation area located in the display area, the through hole encapsulation area surrounding the through hole;

[0008] An inorganic layer, located in the display area of the substrate;

[0009] At least one first isolation pillar, located in the through hole encapsulation area and surrounding the through hole; the first isolation pillar is disposed on the inorganic layer, and the first isolation pillar includes a first sub-inorganic layer, a second sub-inorganic layer, and a third sub-inorganic layer stacked along the thickness direction, and the second sub-inorganic layer is indented relative to the first sub-inorganic layer and the third sub-inorganic layer, so that a first groove surrounding the through hole is formed on the side wall of the first isolation pillar;

[0010] A light-emitting layer, located on a side of the inorganic layer away from the substrate;

[0011] The cathode layer is located on the side of the light-emitting layer away from the substrate

[0012] Both the light-emitting layer and the cathode layer are disconnected at the position of the first groove.

[0013] In a possible implementation, the isolation pillar further includes:

[0014] The fourth sub-inorganic layer is located on the side of the third sub-inorganic layer away from the substrate

[0015] On the side where the first groove is located, the fourth sub-inorganic layer is indented relative to the third sub-inorganic layer; or, on the side where the first groove is located, the side wall of the fourth sub-inorganic layer and the side wall of the third sub-inorganic layer form a continuous surface.

[0016] In a possible implementation, the display panel further includes:

[0017] The second isolation pillar is located on the side of the first isolation pillar away from the substrate and surrounds the through hole in the through hole encapsulation area. The light-emitting layer and the cathode layer are disconnected at the side wall of the second isolation pillar.

[0018] In a possible implementation, the second side wall has a second groove, and the light-emitting layer and the cathode layer are disconnected at the second groove.

[0019] In a possible implementation, the display panel further includes: a source-drain metal layer, a passivation layer, and a planarization layer stacked between the inorganic layer and the light-emitting layer in the display area;

[0020] The second isolation pillar includes: a first heightening structure and a protection structure. The first heightening structure is located on the side of the first isolation pillar away from the substrate, and the protection structure is located on the side of the first heightening structure away from the substrate and covers the first heightening structure; wherein, the first heightening structure is set with the same layer and the same material as the source-drain metal layer, the protection structure is set with the same layer and the same material as at least one of the passivation layer and the planarization layer, and the second groove is provided on the side wall of the first heightening structure.

[0021] In a possible implementation, the longitudinal section of the second isolation pillar is an inverted trapezoid.

[0022] In a possible implementation, the display panel further includes:

[0023] The pixel defining layer is located on the side of the light-emitting layer close to the substrate

[0024] The second isolation pillar is set with the same layer and the same material as the pixel defining layer.

[0025] A possible implementation manner, the display panel includes a plurality of first isolation pillars, and the display panel further includes:

[0026] Support pillars, located on the side of the pixel defining layer close to the light emitting layer in the display area;

[0027] A third isolation structure, provided on the same layer and made of the same material as the support pillars, covering at least the gaps between adjacent two first isolation pillars.

[0028] A possible implementation manner, the display panel further includes:

[0029] A gate metal layer, located between the second sub-inorganic layer and the third sub-inorganic layer corresponding to the inorganic layer in the display area;

[0030] A shielding metal layer, located between the inorganic layer and the substrate in the display area;

[0031] A second heightening structure, provided on the same layer and made of the same material as at least one of the gate metal layer and the shielding metal layer, and the second sub-inorganic layer covers the second heightening structure.

[0032] A possible implementation manner, the etching rate of the second sub-inorganic layer is greater than the etching rates of the first sub-inorganic layer and the third sub-inorganic layer

[0033] A possible implementation manner, the materials used for the first sub-inorganic layer and the third sub-inorganic layer include silicon oxide;

[0034] The material used for the second sub-inorganic layer includes silicon nitride.

[0035] In a second aspect, an embodiment of the present disclosure provides a method for manufacturing a display panel, the display panel having a through hole penetrating the display panel, and wherein, the method includes:

[0036] Providing a substrate, the substrate having a display area and a through hole encapsulation area located in the display area, and the through hole encapsulation area surrounding the area corresponding to the through hole;

[0037] Forming an inorganic material layer on one side of the substrate, patterning the inorganic material layer, forming an inorganic layer in the display area, and forming at least one first isolation pillar transition pattern in the through hole encapsulation area; wherein, the first isolation pillar transition pattern includes a first pattern of the third sub-inorganic layer;

[0038] Etch the first sub-inorganic layer, the second sub-inorganic layer, and the third sub-inorganic layer in the via encapsulation region to obtain a third through-via penetrating the third sub-inorganic layer, a second through-via penetrating the second sub-inorganic material layer, and a first through-via penetrating the first inorganic material layer. The first through-via, the second through-via, and the third through-via all surround the region corresponding to the via. The first through-via and the third through-via are retracted relative to the second through-via, so as to form a first groove surrounding the via on the first sidewall of the first isolation pillar. Wherein, the etching rate of the second sub-inorganic material layer is greater than the etching rates of the first sub-inorganic material layer and the third sub-inorganic material layer;

[0039] On the side of the inorganic layer away from the substrate, a light-emitting layer and a cathode layer are sequentially formed. Wherein, both the light-emitting layer and the cathode layer are disconnected at the position of the groove.

[0040] In a possible implementation manner, the first isolation pillar further includes a fourth sub-inorganic layer on the side of the third sub-inorganic layer away from the first sub-inorganic layer;

[0041] Etching the first sub-inorganic layer, the second sub-inorganic layer, and the third sub-inorganic layer in the via encapsulation region to obtain a third through-via penetrating the third sub-inorganic layer, a second through-via penetrating the second sub-inorganic material layer, and a first through-via penetrating the first inorganic material layer includes:

[0042] Synchronously etch the fourth sub-inorganic layer and the third sub-inorganic material layer in the via encapsulation region based on the first pattern to obtain a fourth through-via penetrating the fourth through-via and a third through-via penetrating the third inorganic layer. Wherein, the etching rate of the fourth sub-inorganic layer is greater than the etching rate of the third sub-inorganic layer;

[0043] Synchronously etch the second sub-inorganic material layer and the first sub-inorganic material layer in the via encapsulation region based on the second pattern of the first sub-inorganic layer to obtain a second through-via penetrating the second sub-inorganic material layer and a first through-via penetrating the first inorganic material layer.

[0044] In a possible implementation manner, the diameter of the figure corresponding to the third groove in the first pattern is greater than the diameter of the figure corresponding to the first groove in the second pattern;

[0045] Or, the diameter of the figure corresponding to the third groove in the first pattern is less than the diameter of the figure corresponding to the first groove in the second pattern. Description of the Drawings

[0046] Figure 1 It is a partial top view of a display panel provided by an embodiment of the present disclosure;

[0047] Figure 2 The sectional view in the AA' direction provided by the embodiment of the present disclosure; Figure 1 in the

[0048] Figure 3 and Figure 4 Another structural schematic diagram of the first isolation column provided by the embodiment of the present disclosure;

[0049] Figure 5 and Figure 6 Another structural schematic diagram of the first isolation column provided by the embodiment of the present disclosure;

[0050] Figure 7 The Figure 5 top view of the first isolation column in the provided by the embodiment of the present disclosure;

[0051] Figure 8 is Figure 5 the top view of the first isolation column with the first heightening structure superimposed thereon in the provided by the embodiment of the present disclosure;

[0052] Figure 9 The Figure 6 top view of the first isolation column in the provided by the embodiment of the present disclosure;

[0053] Figure 10 is Figure 6 the top view of the first isolation column with the first heightening structure superimposed thereon in the provided by the embodiment of the present disclosure;

[0054] Figure 11 Another structural schematic diagram of the display panel provided by the embodiment of the present disclosure;

[0055] Figure 12 Another structural schematic diagram of the display panel provided by the embodiment of the present disclosure;

[0056] Figure 13 Another structural schematic diagram of the display panel provided by the embodiment of the present disclosure;

[0057] Figure 14 Another structural schematic diagram of the display panel provided by the embodiment of the present disclosure;

[0058] Figure 15 Another structural schematic diagram of the display panel provided by the embodiment of the present disclosure;

[0059] Figure 16 A manufacturing schematic diagram of the display panel provided by the embodiment of the present disclosure;

[0060] Figure 17 and Figure 18 A manufacturing method of the first isolation column provided by the embodiment of the present disclosure.

[0061] Reference numerals:

[0062] Substrate 1, first isolation pillar 2, through hole H, display area AA, through hole packaging area F, first groove 2M, first sub-inorganic layer 21, second sub-inorganic layer 22, third sub-inorganic layer 23, thickness direction Y, stacked structure 4', first heightening structure 41, protection structure 42, second isolation pillar 4, second groove 4M, first sub-protection structure 421, second sub-protection structure 422, first metal layer 411, second metal layer 412, third metal layer 413, third isolation pillar 5, second heightening structure 6. Detailed implementation manners

[0063] Embodiments of the present disclosure provide a display panel and a manufacturing method thereof to solve the above-mentioned technical problems existing in the prior art.

[0064] It should be understood that the specific structures and functional details disclosed in the embodiments of the present disclosure are only representative and are for the purpose of describing the exemplary embodiments of the present disclosure. However, the present disclosure can be specifically implemented in many alternative forms or combinations and should not be construed as being limited only to the embodiments set forth herein.

[0065] In the description of the present disclosure, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present disclosure, unless otherwise stated, the meaning of "a plurality" is two or more. Additionally, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion.

[0066] The terms used in the present disclosure are only for the purpose of describing specific embodiments and do not intend to limit the exemplary embodiments. Unless the context clearly indicates otherwise, the singular forms "a" and "an" used herein also intend to include the plural. It should also be understood that the terms "comprising" and / or "including" herein specify the presence of the stated features, integers, steps, operations, units, and / or components, and do not preclude the presence or addition of one or more other features, integers, steps, operations, units, components, and / or combinations thereof.

[0067] The term "and / or" in the embodiments of the present disclosure is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0068] To make the above objects, features, and advantages of the present disclosure more apparent and understandable, the present disclosure will be further described below in conjunction with the accompanying drawings and embodiments. However, the exemplary embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; on the contrary, these embodiments are provided to make the present disclosure more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings represent the same or similar structures, and thus repeated descriptions thereof will be omitted. The words expressing positions and directions described in the present disclosure are illustrative with reference to the accompanying drawings, but can be changed as needed, and all such changes are included within the scope of protection of the present disclosure. The accompanying drawings of the present disclosure are only used to illustrate the relative positional relationship and do not represent the actual scale.

[0069] It should be noted that specific details are set forth in the following description to facilitate a thorough understanding of the present disclosure. However, the present disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present disclosure. Therefore, the present disclosure is not limited by the specific embodiments disclosed below. The subsequent description of the specification is a preferred embodiment for implementing the present disclosure, but the description is for the purpose of explaining the general principles of the present disclosure and is not intended to limit the scope of the present disclosure. The scope of protection of the present disclosure shall be determined by the scope defined by the appended claims.

[0070] Next, a display panel and a manufacturing method thereof provided by an embodiment of the present disclosure will be specifically described in conjunction with the accompanying drawings.

[0071] Please refer to Figure 1 and Figure 2 , Figure 1 which is a partial top view of a display panel provided by an embodiment of the present disclosure, Figure 2 and Figure 1 is a cross-sectional view in the AA' direction of

[0072] The display panel has a through hole H penetrating the display panel, and the display panel includes:

[0073] A substrate 1, the substrate 1 has a display area AA and a through hole encapsulation area F located in the display area AA, and the through hole encapsulation area F is disposed around the through hole H; a camera, a receiver, etc. can be disposed in the through hole H; Figure 1 Only the film layer structure of the first isolation column 2 is shown in

[0074] At least one first isolation column 2 is located in the through-hole packaging area F and is arranged around the through-hole H; the first isolation column 2 is arranged in the inorganic layer, and the first isolation column 2 includes a first sub-inorganic layer 21, a second sub-inorganic layer 22, and a third sub-inorganic layer 23 that are stacked in the thickness direction Y. The second sub-inorganic layer 22 is indented relative to the first sub-inorganic layer 21 and the third sub-inorganic layer 23, so that a first groove 2M surrounding the through-hole H is formed on the side wall of the first isolation column 2;

[0075] The light-emitting layer is located on the side of the inorganic layer away from the substrate 1;

[0076] The cathode layer is located on the side of the light-emitting layer away from the substrate 1;

[0077] Both the light-emitting layer and the cathode layer are disconnected at the position of the first groove 2M.

[0078] The first isolation column 2 can be an isolation column with two first grooves 2M as shown in Figure 1 or can have only one first groove 2M, and there is no specific limitation. When the display panel has multiple first isolation columns 2, the multiple second isolation columns 2 are all arranged around the through-hole H and the sizes of the multiple second isolation columns 2 are different. For example, assuming that the through-hole H is circular, the multiple second isolation columns 2 are concentric circles with the center of the through-hole H as the center, and in the radial direction of the through-hole H, the radii of the multiple second isolation columns 2 gradually increase.

[0079] Since the first isolation column 2 surrounds the through-hole H and the first side wall of the first isolation column 2 has the first groove 2M surrounding the through-hole H, when the light-emitting layer and the cathode layer are evaporated over the entire surface, the materials of the light-emitting layer and the cathode layer are blocked by the side wall and will not enter the first groove 2M. Thus, the light-emitting layer and the cathode layer can be effectively disconnected at the position of the first groove 2M. And because the first isolation column 2 is arranged on the same layer and made of the same material as the inorganic layer, and the inorganic layer usually has good electrical insulation and mechanical strength and is usually located at the bottom of the entire display panel, the first isolation column 2 arranged on the same layer and made of the same material as the inorganic layer is not easily scratched even if it covers the metal structure, and even if it is scratched, it is not easily scratched through the film layer, which can effectively prevent the metal structure covered by the first isolation column 2 from being connected to the light-emitting layer and the cathode layer, thereby improving the power-off ability of the first isolation column 2 and effectively preventing water and oxygen from invading and causing product failure.

[0080] In some embodiments, the etching rate of the second sub-inorganic layer 22 is greater than the etching rates of the first sub-inorganic layer 21 and the third sub-inorganic layer 23, which is convenient for forming the first groove 2M through at least one etching, so as to form the first isolation column 2 without adding a mask.

[0081] In some embodiments, the materials used for the first sub-inorganic layer 21 and the third sub-inorganic layer 23 include silicon oxide (SiOx), and the material used for the second sub-inorganic layer 22 includes silicon nitride (SiNx). In the driving circuit of the display panel, there are usually at least one interlayer dielectric layer and two gate insulating layers, both of which can be composed of silicon oxide or silicon nitride. For example, one of the two gate insulating layers uses silicon oxide and the other uses silicon nitride, and the interlayer insulating layer uses silicon oxide to form the film layer structure required for the first isolation column 2. Therefore, the first isolation column 2 can be formed by using the original interlayer dielectric layer and gate insulating layer in the display panel without adding additional film layers.

[0082] Please refer to Figure 3 and Figure 4 FIG. is a schematic structural diagram of another first isolation column provided by an embodiment of the present disclosure. The first isolation column 2 further includes:

[0083] A fourth sub-inorganic layer 24, located on the side of the third sub-inorganic layer 23 away from the substrate 1;

[0084] As Figure 2 shown, on the side where the first groove 2M is located, the fourth sub-inorganic layer 24 is indented relative to the third sub-inorganic layer 23; or, on the side where the first groove 2M is located, the side wall of the fourth sub-inorganic layer 24 and the side wall of the third sub-inorganic layer 23 form a continuous surface.

[0085] The fourth sub-inorganic layer 24 uses the same material as the second sub-inorganic layer 22. For example, they can both be silicon nitride or silicon oxide, and there is no specific limitation.

[0086] For example, the display panel may include two stacked gate insulating layers and two interlayer dielectric layers, and they can be stacked in the order of silicon oxide layer - silicon nitride layer - silicon oxide layer - silicon nitride layer. In this way, the pattern of the first isolation column 2 can be formed by using the masks of the gate insulating layer and the interlayer dielectric layer without adding additional masks and etching processes.

[0087] Please refer to Figure 5 and Figure 6 FIG. is a schematic structural diagram of another first isolation column provided by an embodiment of the present disclosure. The display panel further includes:

[0088] A stacked structure 4', located on the side of the first isolation column 2 away from the substrate 1; on the side where the first groove 2M is located, the stacked structure 4' can be indented relative to the edge of the side of the first isolation column 2 away from the substrate 1;

[0089] The stacked structure 4' includes a first heightening structure 41 and a protection structure 42. The first heightening structure 41 can be connected to the source-drain metal layer of the display area AA ( Figure 3(not shown) are arranged with the same material on the same layer. The protection structure 42 can be arranged with the same material on the same layer as the organic layer in the display area AA. The organic layer can be, for example, an organic insulating layer, a pixel defining layer, etc. Please refer to Figures 7 - 10 , Figure 7 provided by an embodiment of the present disclosure Figure 5 is a top view of the first isolation pillar in Figure 8 and Figure 5 is a top view of the first isolation pillar with the first heightening structure stacked thereon in Figure 9 provided by an embodiment of the present disclosure Figure 6 is a top view of the first isolation pillar in Figure 10 and Figure 6 is a top view of the first isolation pillar with the first heightening structure stacked thereon in

[0090] By providing a stacked structure 4' on the side of the first isolation pillar 2 away from the substrate 1, and on the side where the first groove 2M is located, making the stacked structure 4' indent relative to the edge of the side of the first isolation pillar 2 away from the substrate 1, the stacked structure 4' can be formed using the film layer on the side of the first isolation pillar 2 away from the substrate 1, so that the film thickness at the position of the first isolation pillar 2 in the display panel is kept the same as that in other regions, thereby improving the support performance at the position of the first isolation pillar 2.

[0091] Please refer to Figure 11 which is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure. The display panel further includes:

[0092] A second isolation pillar 4, in the through-hole encapsulation area F, the second isolation pillar 4 is located on the side of the first isolation pillar 2 away from the substrate 1 and surrounds the through-hole H. The light-emitting layer (not shown) and the cathode layer (not shown) are disconnected on the sidewall of the second isolation pillar 4.

[0093] Please continue to refer to Figure 11 , the longitudinal section of the second isolation pillar 4 is an inverted trapezoid. By setting the longitudinal section of the second isolation pillar 4 as an inverted trapezoid, the light-emitting layer and the cathode layer can be disconnected on the sidewall of the second isolation pillar 4.

[0094] In some embodiments, the display panel further includes a pixel defining layer ( Figure 11 not shown), located on the side of the light-emitting layer close to the substrate 1. The second isolation pillar 4 is arranged with the same material on the same layer as the pixel defining layer. By arranging the second isolation pillar 4 with the same material on the same layer as the pixel defining layer, the pattern of the second isolation pillar 4 can be formed using the mask of the pixel defining layer, so that no additional mask is required, which is beneficial to improving work efficiency and reducing production costs.

[0095] Please refer to Figure 12A schematic structural diagram of another display panel provided by an embodiment of the present disclosure. The second sidewall has a second groove 4M, and the light-emitting layer and the cathode layer are disconnected in the second groove 4M.

[0096] By providing a second groove 4M on the second sidewall of the second isolation column 4, the light-emitting layer and the cathode layer can be disconnected in the second groove 4M, thereby further improving the technical efficiency of the display panel in isolating the intrusion of moisture.

[0097] In the embodiment provided by the present disclosure, by providing a second isolation column 4 surrounding the through hole H on the side of the first isolation column 2 away from the substrate 1, the light-emitting layer and the cathode layer are disconnected on the sidewall of the second isolation column 4, and the double isolation columns can be used in the thickness direction Y of the display panel to isolate the intrusion of moisture and achieve a complete power-off, thereby achieving a better isolation effect.

[0098] Please continue to refer to Figure 12 , the display panel further includes: a source-drain metal layer (not shown, refer to the first heightening structure 41), a passivation layer (not shown, refer to the protection structure 42), and a planarization layer (not shown, refer to the protection structure 42) which are stacked between the inorganic layer and the light-emitting layer in the display area AA;

[0099] The second isolation column 4 includes: a first heightening structure 41 and a protection structure 42. The first heightening structure 41 is located on the side of the first isolation column 2 away from the substrate 1, and the protection structure 42 is located on the side of the first heightening structure 41 away from the substrate 1 and covers the first heightening structure 41. Among them, the first heightening structure 41 is set with the same layer and the same material as the source-drain metal layer, and the protection structure 42 is set with the same layer and the same material as at least one of the passivation layer and the planarization layer. The second groove 4M is provided on the sidewall of the first heightening structure 41.

[0100] The source-drain metal layer can adopt a sandwich structure, such as being composed of Ti-Al-Ti. Correspondingly, the first heightening structure 41 can also adopt a sandwich structure. Please refer to Figure 13 A schematic structural diagram of another display panel provided by an embodiment of the present disclosure. The first heightening structure 41 includes a first metal layer 411 (such as the material used is Ti), a second metal layer 412 (such as the material used is Al), and a third metal layer 413 (such as the material used is Ti) which are stacked. If the protection structure 42 is set with the same layer and the same material as the passivation layer and the first planarization layer, such as Figure 11 shown, the protection structure 42 can include a first sub-protection structure 421 set with the same layer and the same material as the passivation layer, and a second sub-protection structure 422 set with the same layer and the same material as the planarization layer. The source-drain metal layer can be the metal layer where the data line is located.

[0101] In the display panel, it may include multiple layers of source-drain metal layers and multiple layers of planarization layers. The first elevation structure 41 may be composed of at least one layer of source-drain metal layer, and the protection structure 42 may include at least one layer of planarization layer.

[0102] By setting the first elevation structure 41 to be of the same layer and the same material as the source-drain layer, and setting the protection structure 42 to be of the same layer and the same material as at least one of the passivation layer and the planarization layer, and arranging the second groove 4M on the sidewall of the first elevation structure 41, the dry etching process can be used to over-etch the first elevation structure 41 to form the second groove 4M. The entire processing process only needs to delay the etching time of the second elevation structure 6, without the need to add a new mask, and there is no new process flow, which can reduce costs and improve production capacity.

[0103] Please refer to Figure 14 which is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure. The display panel includes multiple first isolation pillars 2, and the display panel further includes:

[0104] Support pillars (not shown), located on the side of the pixel defining layer (not shown) close to the light-emitting layer (not shown) in the display area AA;

[0105] The third isolation pillar 5, which is of the same layer and the same material as the support pillar, covers at least the gap between two adjacent first isolation pillars 2.

[0106] The third isolation pillar 5 can be Figure 12 combined with a structure in which a stacked structure 4' is provided on the side of the first isolation pillar 2 away from the substrate 1. Correspondingly, the first isolation pillar 2 also needs to cover the gap between two adjacent second isolation pillars 4; the third isolation pillar 5 can also be combined with a structure having the first isolation pillar 2 and the second isolation pillar 4 in addition to covering. The specific setting method of the third isolation pillar 5 can refer to Figure 14 , which will not be elaborated here.

[0107] In the embodiment provided by the present disclosure, by setting the third isolation pillar 5 of the same layer and the same material as the support pillar in the display panel, and making the third isolation pillar 5 cover at least the gap between two adjacent first isolation pillars 2, the third isolation pillar 5 can be used to achieve lateral power-off, and without adding a mask, it can be realized to use the first isolation pillar 2 to achieve longitudinal power-off and use the third isolation pillar 5 to achieve lateral power-off, thereby further improving the ability of the display surface to prevent water vapor intrusion.

[0108] Please refer to Figure 15 which is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure. The display panel further includes:

[0109] A gate metal layer (not shown), which is located between the second sub-inorganic layer 22 and the third sub-inorganic layer 23 corresponding to the inorganic layer in the display area AA; or between the first sub-inorganic layer 21 and the second sub-inorganic layer 22;

[0110] A shielding metal layer (not shown), which is located between the inorganic layer and the substrate 1 in the display area AA;

[0111] A second heightening structure 6, which is arranged on the same layer as at least one of the gate metal layer and the shielding metal layer, and the second sub-inorganic layer 22 covers the second heightening structure 6.

[0112] The display panel may include multiple layers of gate metal layers, and the second heightening structure 6 may be arranged on the same layer as at least one layer of gate metal layers.

[0113] The above-mentioned second heightening structure 6 may be arranged in the display panel including the stacked structure 4', the second isolation column 4, and the third isolation column 5, which will not be elaborated here one by one.

[0114] By arranging the second heightening structure 6 on the same layer and with the same material as at least one of the metal layer and the shielding metal layer, and covering the second heightening structure 6 with the second sub-inorganic layer 22, the height of the first isolation column 2 can be effectively increased.

[0115] Based on the same inventive concept, an embodiment of the present disclosure provides a method for manufacturing a display panel. Please refer to Figure 16 which is a schematic diagram of manufacturing a display panel provided by an embodiment of the present disclosure. The manufacturing method includes:

[0116] S11: Provide a substrate 1. As Figure 1 shown, the substrate 1 has a display area AA and a through-hole encapsulation area F located within the display area AA. The through-hole encapsulation area F surrounds the area corresponding to the through-hole H;

[0117] S12: Form an inorganic material layer on one side of the substrate 1, pattern the inorganic material layer, form an inorganic layer in the display area AA, and form at least one first isolation column 2 transition pattern in the through-hole encapsulation area F; wherein, the first isolation column 2 transition pattern includes a first pattern of the third sub-inorganic layer 23; etch the first sub-inorganic layer 21, the second sub-inorganic layer 22, and the third sub-inorganic layer 23 in the through-hole encapsulation area F to obtain a third through-hole penetrating the third sub-inorganic layer 23, a second through-hole penetrating the second sub-inorganic material layer, and a first through-hole penetrating the first inorganic material layer. The first through-hole, the second through-hole, and the third through-hole all surround the area corresponding to the through-hole H. The first through-hole and the third through-hole are retracted relative to the second through-hole, so that a first groove 2M surrounding the through-hole H is formed on the first sidewall of the first isolation column 2; wherein, the etching rate of the second sub-inorganic material layer is greater than the etching rates of the first sub-inorganic material layer and the third sub-inorganic material layer;

[0118] On a side of the inorganic layer away from the substrate 1, a light-emitting layer and a cathode layer (not shown) are sequentially formed; wherein, both the light-emitting layer and the cathode layer are disconnected at the position of the groove.

[0119] Figure 16 In the first isolation pillar 2, it is composed of a first sub-inorganic layer 21, a second sub-inorganic layer 22, and a third sub-inorganic layer 23. Therefore, the shape of the transition pattern of the first isolation pillar 2 is the same as the shape of the first sub-inorganic layer 21. By synchronously etching the first sub-inorganic layer 21, the second sub-inorganic layer 22, and the third sub-inorganic layer 23, since the etching rate of the second sub-inorganic material layer is greater than the etching rates of the first sub-inorganic material layer and the third sub-inorganic material layer, the etching amount of the second sub-inorganic layer 22 can be relatively larger than the etching amounts of the first sub-inorganic layer 21 and the second sub-inorganic layer 22. Furthermore, a first groove 2M is formed on the sidewall of the first isolation pillar 2. Thus, the first isolation pillar 2 can be formed by using the third sub-inorganic layer 23 as a mask for etching, without the need to additionally increase masks and process flows, and can better block the light-emitting layer and the cathode layer.

[0120] Please refer to Figure 17 and Figure 18 A method for manufacturing a first isolation pillar provided by an embodiment of the present disclosure. The first isolation pillar 2 further includes a fourth sub-inorganic layer 24 located on a side of the third sub-inorganic layer 23 away from the first sub-inorganic layer 21;

[0121] Etch the first sub-inorganic layer 21, the second sub-inorganic layer 22, and the third sub-inorganic layer 23 in the through-hole encapsulation area F to obtain a third through-hole penetrating the third sub-inorganic layer 23, a second through-hole penetrating the second sub-inorganic material layer, and a first through-hole penetrating the first inorganic material layer. This can be achieved through the following methods:

[0122] S21: Based on the first pattern, synchronously etch the fourth sub-inorganic layer 24 and the third sub-inorganic material layer in the through-hole encapsulation area F to obtain a fourth through-hole penetrating the fourth through-hole and a third through-hole penetrating the third sub-inorganic layer 23; wherein, the etching rate of the fourth sub-inorganic layer 24 is greater than the etching rate of the third sub-inorganic layer 23;

[0123] S22: Based on the second pattern, synchronously etch the second sub-inorganic material layer and the first sub-inorganic material layer in the through-hole encapsulation area F to obtain a second through-hole penetrating the second sub-inorganic material layer and a first through-hole penetrating the first inorganic material layer.

[0124] As Figure 17 shown, the diameter of the corresponding pattern of the third groove in the first pattern is greater than the diameter of the corresponding pattern of the first groove 2M in the second pattern;

[0125] As Figure 18 shown, the diameter of the corresponding pattern of the third groove in the first pattern is less than the diameter of the corresponding pattern of the first groove 2M in the second pattern.

[0126] It should be noted that Figures 16 - 18 the black rectangular block shown can be regarded as the mask used in the corresponding step.

[0127] The display panel can be: an Organic Light Emitting Diode (OLED) display panel, a Quantum Dot Light Emitting Diodes (QLED) display panel, a Micro Light Emitting Diodes (Micro LED) display panel, etc. The present disclosure does not make specific limitations thereto.

[0128] Although the preferred embodiments of the present disclosure have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present disclosure.

[0129] Obviously, those skilled in the art can make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure also intends to include these modifications and variations therein.

Claims

1. A display panel, the display panel having a through hole penetrating the display panel, wherein: The display panel comprises: A base substrate, the base substrate having a display area and a through-hole packaging area located in the display area, the through-hole packaging area is arranged around the through-hole; An inorganic layer, located in the display area of ​​the base substrate; At least one first isolation column is located in the through-hole packaging area and is arranged around the through-hole; the first isolation column is arranged in the inorganic layer, the first isolation column comprises a first sub-inorganic layer, a second sub-inorganic layer and a third sub-inorganic layer stacked in the thickness direction, the second sub-inorganic layer is indented relative to the first sub-inorganic layer and the third sub-inorganic layer, so that a first groove surrounding the through-hole is formed on the side wall of the first isolation column; A light-emitting layer is located on a side of the inorganic layer away from the substrate; A cathode layer, located on a side of the light-emitting layer away from the substrate; The light emitting layer and the cathode layer are both disconnected at the position of the first groove.

2. The display panel according to claim 1, wherein: The isolation column also includes: a fourth inorganic sub-layer, located on a side of the third inorganic sub-layer away from the substrate; On the side where the first groove is located, the fourth sub-inorganic layer is set back relative to the third sub-inorganic layer; or, on the side where the first groove is located, the sidewall of the fourth sub-inorganic layer and the sidewall of the third sub-inorganic layer form a continuous surface.

3. The display panel according to claim 1 or 2, wherein: The display panel further includes: A second isolation column is provided in the through hole packaging area. The second isolation column is located on a side of the first isolation column away from the base substrate and surrounds the through hole. The light emitting layer and the cathode layer are disconnected at a side wall of the second isolation column.

4. The display panel according to claim 3, wherein: The second side wall has a second groove, and the light emitting layer and the cathode layer are disconnected in the second groove.

5. The display panel according to claim 4, wherein: The display panel further comprises: a source-drain metal layer, a passivation layer and a planarization layer stacked and arranged in the display area and between the inorganic layer and the light-emitting layer; The second isolation column includes: a first padding structure and a protective structure, the first padding structure is located on a side of the first isolation column away from the base substrate, and the protective structure is located on a side of the first padding structure away from the base substrate and covers the first padding structure; wherein the first padding structure is arranged on the same layer and material as the source and drain metal layer, the protective structure is arranged on the same layer and material as at least one of the passivation layer and the planarizing layer, and the second groove is arranged on the side wall of the first padding structure.

6. The display panel according to claim 3, wherein: The longitudinal section of the second isolation column is an inverted trapezoid.

7. The display panel according to claim 6, wherein: The display panel further includes: A pixel defining layer, located on a side of the light emitting layer close to the base substrate; The second isolation column and the pixel defining layer are provided in the same layer and with the same material.

8. The display panel according to any one of claims 1 to 7, wherein: The display panel includes a plurality of first isolation columns, and the display panel further includes: A support column, located on a side of the pixel defining layer close to the light emitting layer in the display area; The third isolation structure is provided at the same layer and with the same material as the support column, and at least covers the gap between two adjacent first isolation columns.

9. The display panel according to any one of claims 1 to 8, wherein: The display panel further includes: a gate metal layer, located between the second sub-inorganic layer and the third sub-inorganic layer corresponding to the inorganic layer in the display area; a shielding metal layer, located between the inorganic layer and the base substrate in the display area; The second padding structure is provided at the same layer and with the same material as at least one of the gate metal layer and the shielding metal layer, and the second sub-inorganic layer covers the second padding structure.

10. The display panel according to any one of claims 1 to 9, wherein: The etching rate of the second sub-inorganic layer is greater than the etching rates of the first sub-inorganic layer and the third sub-inorganic layer.

11. The display panel according to any one of claims 1 to 10, wherein: The materials used for the first inorganic sub-layer and the third inorganic sub-layer include silicon oxide; The material used for the second inorganic sub-layer includes silicon nitride.

12. A method for manufacturing a display panel, wherein the display panel has a through hole penetrating the display panel, wherein: include: Providing a base substrate, the base substrate having a display area and a through-hole packaging area located in the display area, the through-hole packaging area surrounding an area corresponding to the through-hole; An inorganic material layer is formed on one side of the base substrate, and the inorganic material layer is patterned to form an inorganic layer in the display area and at least one first isolation column transition pattern is formed in the through-hole packaging area; wherein the first isolation column transition pattern includes a first pattern of the third sub-inorganic layer; The first sub-inorganic layer, the second sub-inorganic layer and the third sub-inorganic layer are etched in the through-hole encapsulation area to obtain a third through-groove penetrating the third sub-inorganic layer, a second through-groove penetrating the second sub-inorganic material layer and a first through-groove penetrating the first inorganic material layer, wherein the first through-groove, the second through-groove and the third through-groove all surround the area corresponding to the through-hole, and the first through-groove and the third through-groove are retracted relative to the second through-groove, so that a first groove surrounding the through-hole is formed on the first side wall of the first isolation column; wherein the etching rate of the second sub-inorganic material layer is greater than the etching rates of the first sub-inorganic material layer and the third sub-inorganic material layer; A light-emitting layer and a cathode layer are sequentially formed on a side of the inorganic layer away from the base substrate; wherein the light-emitting layer and the cathode layer are both disconnected at the position of the groove.

13. The method according to claim 12, wherein: The first isolation column further includes a fourth sub-inorganic layer located on a side of the third sub-inorganic layer away from the first sub-inorganic layer; The first sub-inorganic layer, the second sub-inorganic layer and the third sub-inorganic layer are etched in the through-hole encapsulation area to obtain a third through-groove penetrating the third sub-inorganic layer, a second through-groove penetrating the second sub-inorganic material layer and a first through-groove penetrating the first inorganic material layer, including: Based on the first pattern, the fourth sub-inorganic layer and the third sub-inorganic material layer are synchronously etched in the through-hole packaging area to obtain a fourth through-groove penetrating the fourth through-groove and a third through-groove penetrating the third inorganic layer; wherein the etching rate of the fourth sub-inorganic layer is greater than the etching rate of the third sub-inorganic layer; Based on the second pattern of the first sub-inorganic layer, the second sub-inorganic material layer and the first sub-inorganic material layer are synchronously etched in the through-hole packaging area to obtain a second through-groove penetrating the second sub-inorganic material layer and a first through-groove penetrating the first inorganic material layer.

14. The method of claim 13, wherein: The diameter of the figure corresponding to the third groove in the first figure is greater than the diameter of the figure corresponding to the first groove in the second figure; Alternatively, the diameter of a figure corresponding to the third groove in the first figure is smaller than the diameter of a figure corresponding to the first groove in the second figure.

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