Discharge cartridge for ozone generation and ozone gas generation device

Abstract

The resistance value of a first flow path (F1) between the first ground section (8A) and the high-voltage-side cooling flow path (HP2) closest to the first ground section (8A) is greater than the resistance value of a second flow path (F2) between the first ground section (8A) and the low-voltage-side cooling flow path (LP2) closest to the first ground section (8A). The resistance value of a third flow path (F3) between the second ground section (8B) and the high-voltage-side cooling flow path (HP2) closest to the second ground section (8B) is greater than the resistance value of a fourth flow path (F4) between the second ground section (8B) and the low-voltage-side cooling flow path (LP2) closest to the second ground section (8B).

Description

Technical Field

[0001] The present disclosure relates to a discharge box for ozone generation. Background Art

[0002] Patent Document 1 discloses a discharge box for ozone generation. The discharge box includes a discharge part having a high-voltage electrode module and a low-voltage electrode module, and a cooling flow path for cooling the discharge part. A discharge space is formed between the high-voltage electrode module and the low-voltage electrode module in the discharge part. By applying a high voltage to the high-voltage electrode of the high-voltage electrode module, barrier discharge is generated in the discharge space to generate ozone gas. When heat is generated along with the discharge, the temperature of the discharge space rises, and the generated ozone is thermally decomposed. Therefore, by using the heat medium of the cooling flow path to cool the discharge part, the thermal decomposition of ozone is suppressed.

[0003] Patent Document 1: Japanese Patent Laid-Open Publication No. 2012-167009 Summary of the Invention

[0004] -Technical Problem to be Solved by the Invention-

[0005] In the discharge box disclosed in Patent Document 1, when a voltage is applied to the high-voltage electrode of the discharge part, the current on the high-voltage electrode side sometimes flows into the cooling flow path. As a result, the power consumption of the discharge box increases because the current flows through the cooling flow path.

[0006] An object of the present disclosure is to suppress an increase in power consumption due to leakage of current from the high-voltage electrode side to the cooling flow path.

[0007] -Technical Solution for Solving the Technical Problem-

[0008] The invention of the present application is directed to a discharge box for an ozone generation device.

[0009] The heat medium flow path P of the present invention includes an inflow path 33, a high-pressure side flow path HP, a low-pressure side flow path LP, and an outflow path 34. The heat medium flows into the inflow path 33, and the high-pressure side flow path HP and the low-pressure side flow path LP branch out from the outflow end of the inflow path 33. The outflow ends of the high-pressure side flow path HP and the low-pressure side flow path LP are respectively connected to the outflow path 34. The high-pressure side flow path HP includes a plurality of high-pressure side cooling flow paths HP2, and the plurality of high-pressure side cooling flow paths HP2 are connected in parallel with each other in a manner adjacent to the high-voltage electrode modules 62 of the respective discharge parts 60. The low-pressure side flow path LP includes a plurality of low-pressure side cooling flow paths LP2, and the plurality of low-pressure side cooling flow paths LP2 are connected in parallel with each other in a manner adjacent to the low-voltage electrode modules 61 of the respective discharge parts 60. It should be noted that the "plurality of high-pressure side cooling flow paths HP2 connected in parallel" mentioned here means that the high-pressure side cooling flow paths HP2 are connected in parallel as flow paths, rather than being arranged side by side in terms of structure. Similarly, the "plurality of low-pressure side cooling flow paths LP2 connected in parallel" mentioned here means that the low-pressure side cooling flow paths LP2 are connected in parallel as flow paths, rather than being arranged side by side in terms of structure.

[0010] A first grounding portion 8A is provided on the heat medium flow path P, and the first grounding portion 8A is provided between the high-pressure side cooling flow path HP2 closest to the outflow end of the inflow path 33 and the low-pressure side cooling flow path LP2 closest to the outflow end of the inflow path 33. The resistance value of the first flow path F1 between the first grounding portion 8A and the high-pressure side cooling flow path HP2 closest to the first grounding portion 8A is greater than the resistance value of the second flow path F2 between the first grounding portion 8A and the low-pressure side cooling flow path LP2 closest to the first grounding portion 8A. As a result, it is possible to suppress current from flowing from the high-pressure side cooling flow path HP2 to the first grounding portion 8A due to a voltage being applied between the high-voltage electrode 62c and the low-voltage electrode 61c.

[0011] A second grounding portion 8B is provided on the heat medium flow path P, and the second grounding portion 8B is provided between the high-pressure side cooling flow path HP2 closest to the inflow end of the outflow path 34 and the low-pressure side cooling flow path LP2 closest to the inflow end of the outflow path 34. The resistance value of the third flow path F3 between the second grounding portion 8B and the high-pressure side cooling flow path HP2 closest to the second grounding portion 8B is greater than the resistance value of the fourth flow path F4 between the second grounding portion 8B and the low-pressure side cooling flow path LP2 closest to the second grounding portion 8B. As a result, it is possible to suppress current from flowing from the high-pressure side cooling flow path HP2 to the second grounding portion 8B due to a voltage being applied to the high-voltage electrode 62c.

[0012] Preferably, the high-voltage electrode modules 62 of adjacent discharge parts 60 face each other across the high-voltage side cooling flow path HP2, and the low-voltage electrode modules 61 of adjacent discharge parts 60 face each other across the low-voltage side cooling flow path LP2.

[0013] If the high-voltage electrode module 62 of one of the adjacent discharge parts 60 faces the low-voltage electrode module 61 of the other, current may leak from the high-voltage electrode module 62 to the low-voltage electrode module 61. In contrast, in the adjacent discharge parts 60, the high-voltage electrode modules 62 face each other, and the low-voltage electrode modules 61 face each other, so that leakage of current between such electrodes can be suppressed.

[0014] Preferably, the flow path length of the first flow path F1 is greater than that of the second flow path F2, and the flow path length of the third flow path F3 is greater than that of the fourth flow path F4. According to this configuration, the resistance value of the first flow path F1 can be made greater than that of the second flow path F2, and the resistance value of the third flow path F3 can be made greater than that of the fourth flow path F4.

[0015] Preferably, the heat medium flow path P includes an inflow high-voltage side main path 91, an inflow low-voltage side main path 93, an outflow high-voltage side main path 92, and an outflow low-voltage side main path 94. The inflow high-voltage side main path 91 is the main path between the outflow end of the inflow path 33 and the nearest high-voltage side cooling flow path HP2 to the outflow end of the inflow path 33. The inflow low-voltage side main path 93 is the main path between the outflow end of the inflow path 33 and the nearest low-voltage side cooling flow path LP2 to the outflow end of the inflow path 33. The outflow high-voltage side main path 92 is the main path between the inflow end of the outflow path 34 and the nearest high-voltage side cooling flow path HP2 to the inflow end of the outflow path 34. The outflow low-voltage side main path 94 is the main path between the inflow end of the outflow path 34 and the nearest low-voltage side cooling flow path LP2 to the inflow end of the outflow path 34. The first grounding part 8A is provided at the outflow end of the inflow path 33, and the second grounding part 8B is provided at the inflow end of the outflow path 34. The resistance value of the inflow high-voltage side main path 91 is greater than that of the inflow low-voltage side main path 93, and the resistance value of the outflow high-voltage side main path 92 is greater than that of the outflow low-voltage side main path 94.

[0016] According to this configuration, the resistance value of the first flow path F1 can be made greater than that of the second flow path F2, and the resistance value of the third flow path F3 can be made greater than that of the fourth flow path F4. As a result, it is possible to suppress current from flowing from the high-voltage side cooling flow path HP2 to the first grounding part 8A or from the high-voltage side cooling flow path HP2 to the second grounding part 8B due to voltage being applied to the high-voltage electrode 62c.

[0017] Preferably, the flow path length of the inflow to the high-pressure side main path 91 is greater than the flow path length of the inflow to the low-pressure side main path 93, and the flow path length of the outflow from the high-pressure side main path 92 is greater than the flow path length of the outflow from the low-pressure side main path 94.

[0018] According to this configuration, the resistance value of the inflow to the high-pressure side main path 91 can be made greater than the resistance value of the inflow to the low-pressure side main path 93, and the resistance value of the outflow from the high-pressure side main path 92 can be made greater than the resistance value of the outflow from the low-pressure side main path 94.

[0019] Preferably, the resistance value of the inflow to the high-pressure side main path 91 is equal to the resistance value of the outflow from the high-pressure side main path 92. In particular, preferably, the flow path length of the inflow to the high-pressure side main path 91 is equal to the flow path length of the outflow from the high-pressure side main path 92.

[0020] In this way, the flow path lengths of the inflow to the high-pressure side main path 91 and the outflow from the high-pressure side main path 92 can be suppressed to the minimum necessary.

[0021] Preferably, one of the inflow to the high-pressure side main path 91 and the outflow from the high-pressure side main path 92 includes bent portions 95, 96 where the flow path is bent, or both the inflow to the high-pressure side main path 91 and the outflow from the high-pressure side main path 92 include bent portions 95, 96 where the flow path is bent.

[0022] In this way, the flow path lengths of the inflow to the high-pressure side main path 91 and the outflow from the high-pressure side main path 92 can be easily increased.

[0023] Preferably, the ozone generation device includes the above-described discharge box 20 and a supply unit 4 that supplies water having a specific resistance value of 15 [Ω·m] or more to the inflow path 33.

[0024] In the discharge box 20 of the present invention, by making the specific resistance value of the water flowing in the heat medium flow path P 15 [Ω·m] or more, it is possible to particularly suppress the current from flowing from the high-voltage electrode module 62 to the low-pressure side flow path LP, and thus reduce the power consumption loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a simplified perspective view showing the appearance of the ozone generation device;

[0026] Figure 2 is a structural diagram schematically showing the discharge box and the flow paths connected to the discharge box;

[0027] Figure 3 is a perspective view showing the overall structure of the discharge box;

[0028] Figure 4 is a perspective view showing the discharge box after being disassembled into each unit;

[0029] Figure 5A perspective view showing the manifold unit disassembled by substrate;

[0030] Figure 6 A perspective view showing the low-pressure side cooling unit disassembled by substrate;

[0031] Figure 7 A perspective view showing the discharge unit disassembled by substrate;

[0032] Figure 8 A cross-sectional view seen by cutting the main part of the discharge unit along the front-rear direction;

[0033] Figure 9 A perspective view showing the high-pressure side cooling unit disassembled by substrate;

[0034] Figure 10 A schematic view showing the upstream side of the heat medium flow path in the discharge box;

[0035] Figure 11 A schematic view showing the downstream side of the heat medium flow path in the discharge box;

[0036] Figure 12 A schematic view of the heat medium flow path in the discharge box of the comparative example;

[0037] Figure 13 A graph showing the relationship between the specific resistance value of the heat medium and the power consumption loss of the heat medium flow path in the present embodiment and the comparative example. Detailed Embodiments

[0038] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that the present disclosure is not limited to the embodiments shown below, and various modifications can be made without departing from the technical idea of the present disclosure. Each drawing is used to conceptually illustrate the present disclosure, and for ease of understanding, the dimensions, ratios, or quantities may be exaggerated or simplified as required.

[0039] (1) Overall Structure of Ozone Generation Device

[0040] The discharge cell 20 of the present disclosure is applied to the ozone generation device 1. The ozone generation device 1 is applied to, for example, semiconductor manufacturing equipment. The ozone generation device 1 generates ozone gas. The ozone generation device 1 uses high-purity oxygen supplied from the outside as a raw material to generate ozone gas. In semiconductor manufacturing equipment, ozone water is generated by dissolving the ozone gas generated by the ozone generation device 1 in water. This ozone water is used, for example, for cleaning silicon wafers. Alternatively, the generated ozone gas is used for film formation on a substrate.

[0041] As Figure 1As shown, the ozone generation device 1 includes a housing 10, a discharge box 20, and a power supply unit 11. The housing 10 is formed in a hollow box shape. The discharge box 20 and the power supply unit 11 are housed inside the housing 10. The power supply unit 11 includes a high-voltage power supply. The power supply unit 11 supplies power to the discharge box 20. The discharge box 20 generates ozone gas by being applied with a high voltage from the power supply unit 11. An operation unit 12 is provided on the front side surface of the housing 10. The operation unit 12 includes a switch, a display, an indicator light, etc.

[0042] As Figure 2 Schematically shown, the ozone generation device 1 includes an oxygen supply unit 2, an ozone gas supply unit 3, a heat medium supply unit 4, and a heat medium discharge unit 5.

[0043] The oxygen supply unit 2 supplies high-purity oxygen to the discharge box 20. The oxygen supply unit 2 includes: an oxygen source 6 for storing oxygen, and an oxygen supply path 2a connecting the oxygen source 6 and the discharge box 20.

[0044] The ozone gas supply unit 3 conveys the ozone gas generated in the discharge box 20 to a specified object. The ozone gas supply unit 3 includes an ozone gas supply path 3a for conveying ozone gas from the discharge box 20 to the object.

[0045] The heat medium supply unit 4 supplies a heat medium for cooling the discharge box 20 to the discharge box 20. The heat medium supply unit 4 includes a heat medium supply path 4a for conveying cooling water as the heat medium to the discharge box 20.

[0046] The heat medium discharge unit 5 discharges the cooling water for cooling the discharge box 20. The heat medium discharge unit 5 includes a heat medium discharge path 5a for conveying the cooling water flowing out from the discharge box 20 to a specified flow path.

[0047] It should be noted that the heat medium flowing out from the heat medium discharge path 5a can also be conveyed to the heat medium supply path 4a to circulate the heat medium. In this configuration, the heat medium supply unit 4 has a conveying unit such as a pump for conveying the heat medium and a cooling device for cooling the heat medium. The heat medium supply unit 4 includes a tank for storing the heat medium, a valve for opening and closing the heat medium supply path 4a, and a faucet of a water pipe connected to the heat medium supply path 4a. A filter for capturing impurities in the heat medium or the above various devices can also be provided in the heat medium supply path 4a.

[0048] (2) Discharge box

[0049] Refer to Figures 3 to 13 Describe the structure of the discharge box 20. It should be noted that in the following description, "up", "down", "left", "right", "front", "rear" all refer toFigure 3 The directions shown. As Figure 3 shown, the "first direction" described below corresponds to the left - right direction, the "second direction" corresponds to the "front - back direction", and the third direction corresponds to the "up - down direction". In the following description, "right" and "left" refer to the directions when observing the discharge box 20 from the front side.

[0050] As Figure 3 shown, the outer shape of the discharge box 20 is formed in a rectangular parallelepiped shape or a prismatic shape. The discharge box 20 is constituted by stacking a plurality of substrates S in the up - down direction. Strictly speaking, the plurality of substrates S are stacked via a glass - like bonding layer. The plurality of substrates S are composed of a variety of substrates with different structures and functions. These substrates S are composed of flat plates that are rectangular when viewed from above (when observing the upper surface). The plurality of substrates are formed of, for example, alumina material.

[0051] The discharge box 20 has six faces. The six faces are composed of an upper surface 20a formed on the upper side of the discharge box 20, a lower surface 20b formed on the lower side of the discharge box 20, and four side faces. The four side faces include: a front side face 20c formed on the front side of the discharge box 20, a rear side face 20d formed on the rear side of the discharge box 20, a right side face 20e formed on the right side of the discharge box 20, and a left side face 20f formed on the left side of the discharge box 20.

[0052] As Figure 4 shown, the discharge box 20 of the present embodiment successively has, in order from top to bottom: a header unit HU, a first cooling unit CU1, a first discharge unit DU1, a second cooling unit CU2, a second discharge unit DU2, a third cooling unit CU3, a third discharge unit DU3, a fourth cooling unit CU4, and an end plate E. The structures of the first discharge unit DU1, the second discharge unit DU2, and the third discharge unit DU3 are basically the same. For the convenience of description, the first discharge unit DU1, the second discharge unit DU2, and the third discharge unit DU3 are sometimes referred to as "discharge unit DU". However, the vertical positional relationship between the low - voltage electrode module 61 and the high - voltage electrode module 62 of the two discharge units, namely the first discharge unit DU1 and the third discharge unit DU3, is opposite to that of the second discharge unit DU2.

[0053] The structures of the first cooling unit CU1 and the third cooling unit CU3 are substantially the same. The first cooling unit CU1 and the third cooling unit CU3 constitute the low-pressure side cooling unit 50 located on the side of the low-voltage electrode module 61 of the discharge box 20. The structures of the second cooling unit CU2 and the fourth cooling unit CU4 are substantially the same. The second cooling unit CU2 and the fourth cooling unit CU4 constitute the high-pressure side cooling unit 70 located on the side of the high-voltage electrode module 62 of the discharge box 20. For ease of explanation, the first cooling unit CU1, the second cooling unit CU2, the third cooling unit CU3, and the fourth cooling unit CU4 are sometimes referred to as "cooling unit CU".

[0054] In the discharge box 20, the discharge units DU and the cooling units CU are stacked alternately in the vertical direction.

[0055] (2 - 1) Manifold unit

[0056] The manifold unit HU has the functions of introducing oxygen into the discharge box 20 and allowing the generated ozone gas to flow out of the discharge box 20. The manifold unit HU has the functions of introducing cooling water into the discharge box 20 and allowing the cooling water to flow out of the discharge box 20. The manifold unit HU has the function of splitting the cooling water to the low-voltage electrode module 61 side and the high-voltage electrode module 62 side. The manifold unit HU has the function of combining the cooling water split to the low-voltage electrode module 61 side and the high-voltage electrode module 62 side.

[0057] As Figure 5 shown, the manifold unit HU successively has a first manifold plate 30A, a second manifold plate 30B, and a third manifold plate 30C in the order from top to bottom.

[0058] (2 - 2 - 1) First manifold plate

[0059] On the first manifold plate 30A, a gas inlet 31, a gas outlet 32, a heat medium inflow path 33, and a heat medium outflow path 34 are formed. These holes are round holes that penetrate the first manifold plate 30A in the third direction. These holes can be elongated holes. The gas inlet 31 is connected to the outflow end of the oxygen supply path 2a. The gas outlet 32 is connected to the inflow end of the ozone gas supply path 3a. The heat medium inflow path 33 is connected to the outflow end of the heat medium supply path 4a. The heat medium outflow path 34 is connected to the inflow end of the heat medium discharge path 5a. In the discharge box 20, a heat medium flow path P for the cooling water as the heat medium to flow is formed from the heat medium inflow path 33 to the heat medium outflow path 34 (refer to Figure 10 and Figure 11 ).

[0060] The gas inlet 31 is formed at a position along the right side surface 20e of the discharge box 20. The gas inlet 31 is located at the middle position in the front - rear direction on the right side of the first header plate 30A. The gas outlet 32 is formed at a position along the left side surface 20f of the discharge box 20. The gas outlet 32 is located at the middle position in the front - rear direction on the left side of the first header plate 30A.

[0061] The heat medium inlet path 33 is formed at a position in front of the front side surface 20c and the left side surface 20f with respect to the center of the discharge box 20. The heat medium outlet path 34 is formed at a position in front of the front side surface 20c and the right side surface 20e with respect to the center of the discharge box 20.

[0062] (2 - 2 - 2) The second header plate

[0063] A first gas inlet relay path 35 and a first gas outlet relay path 36 are formed on the second header plate 30B. The first gas inlet relay path 35 and the first gas outlet relay path 36 are circular holes that penetrate the second header plate 30B in the third direction. These holes can be elongated holes. The first gas inlet relay path 35 is located at a position overlapping with the gas inlet 31 in the third direction. The first gas outlet relay path 36 is located at a position overlapping with the gas outlet 32 in the third direction.

[0064] A low - pressure side inlet relay path 37, a low - pressure side outlet relay path 38, a high - pressure side inlet relay path 39, and a high - pressure side outlet relay path 40 are formed on the second header plate 30B. These relay paths penetrate the second header plate 30B in the third direction.

[0065] The low - pressure side inlet relay path 37 is formed at a position along the front side surface 20c of the discharge box 20. The low - pressure side inlet relay path 37 is located at the left - front position of the second header plate 30B. The low - pressure side inlet relay path 37 is formed in a substantially rectangular shape extending from the middle position in the left - right direction of the second header plate 30B to the vicinity of the left side surface 20f of the discharge box 20.

[0066] The low - pressure side outlet relay path 38 is formed at a position along the front side surface 20c of the discharge box 20. The low - pressure side outlet relay path 38 is located at the right - front position of the second header plate 30B. The low - pressure side outlet relay path 38 is formed in a substantially rectangular shape extending from the middle position in the left - right direction of the second header plate 30B to the vicinity of the right side surface 20e of the discharge box 20.

[0067] The high - pressure side inlet relay path 39 is formed at a position along the rear side surface 20d of the discharge box 20. The high - pressure side inlet relay path 39 is located at the left - rear position of the second header plate 30B. The high - pressure side inlet relay path 39 is formed in a substantially rectangular shape extending from the middle position in the left - right direction of the second header plate 30B to the vicinity of the left side surface 20f of the discharge box 20.

[0068] The high-voltage side outflow relay path 40 is formed along the rear side surface 20d of the discharge box 20. The high-voltage side outflow relay path 40 is located at the rear right side of the second header plate 30B. The high-voltage side outflow relay path 40 is formed in a substantially rectangular shape extending from the middle portion of the second header plate 30B in the left-right direction to the vicinity of the right side surface 20e of the discharge box 20.

[0069] The second header plate 30B is provided with a low-pressure side inflow branch path 41, a low-pressure side outflow branch path 42, a high-pressure side inflow branch path 43, and a high-pressure side outflow branch path 44. These branch paths penetrate the second header plate 30B in the third direction. The upper sides of these branch paths are closed by the first header plate 30A, and the lower sides thereof are closed by the third header plate 30C.

[0070] The inflow end of the low-pressure side inflow branch path 41 is connected to the heat medium inflow path 33, and the outflow end of the low-pressure side inflow branch path 41 is connected to the low-pressure side inflow relay path 37. The low-pressure side inflow branch path 41 includes a portion extending from the heat medium inflow path 33 to the corner between the front side and the left side of the second header plate 30B, and a portion further extending forward from the portion and connected to the low-pressure side inflow relay path 37.

[0071] The outflow end of the low-pressure side outflow branch path 42 is connected to the heat medium outflow path 34, and the inflow end of the low-pressure side outflow branch path 42 is connected to the low-pressure side outflow relay path 38. The low-pressure side outflow branch path 42 includes a portion extending from the heat medium outflow path 34 to the corner between the front side and the right side of the second header plate 30B, and a portion further extending forward from the portion and connected to the low-pressure side outflow relay path 38.

[0072] The inflow end of the high-pressure side inflow branch path 43 is connected to the heat medium inflow path 33, and the outflow end of the high-pressure side inflow branch path 43 is connected to the high-pressure side inflow relay path 39. The high-pressure side inflow branch path 43 includes a portion extending from the heat medium inflow path 33 toward the center of the second header plate 30B, a portion further extending rearward from the portion, a portion extending from the portion toward the corner between the rear side and the left side of the second header plate 30B, and a portion further extending rearward from the portion and connected to the high-pressure side inflow relay path 39.

[0073] Thus, the high-pressure side inflow branch path 43 is bent. The flow path length of the high-pressure side inflow branch path 43 is greater than the flow path length of the low-pressure side inflow branch path 41 .

[0074] The outflow end of the high-pressure side outflow branch path 44 is connected to the heat medium outflow path 34, and the inflow end of the high-pressure side outflow branch path 44 is connected to the high-pressure side outflow relay path 40. The high-pressure side outflow branch path 44 has a portion extending from the heat medium outflow path 34 to the center of the second header plate 30B, a portion further extending rearward from the portion, a portion extending from the portion to the corner between the rear side and the right side of the second header plate 30B, and a portion further extending rearward from the portion and connected to the high-pressure side outflow relay path 40.

[0075] Thus, the high-pressure side outflow branch path 44 is bent. The flow path length of the high-pressure side outflow branch path 44 is greater than the flow path length of the low-pressure side outflow branch path 42 .

[0076] (2-2-3) Third tube sheet

[0077] The third header plate 30C is provided with a second gas inflow relay path 45 and a second gas outflow relay path 46. The second gas inflow relay path 45 and the second gas outflow relay path 46 are circular holes penetrating the third header plate 30C in the third direction. These holes may be long holes. The second gas inflow relay path 45 is located at a position overlapping with the first gas inflow relay path 35 in the third direction, and the second gas outflow relay path 46 is located at a position overlapping with the first gas outflow relay path 36 in the third direction.

[0078] The third header plate 30C is provided with a low-pressure side inflow opening O1, a low-pressure side outflow opening O2, a high-pressure side inflow opening O3, and a high-pressure side outflow opening O4. These openings penetrate the third header plate 30C in the third direction. These openings are also formed on several other substrates S described in detail later. Hereinafter, these openings formed on the third header plate 30C will be described in detail as a representative.

[0079] The low-pressure side inflow opening O1 is formed at a position along the front side surface 20c of the discharge box 20. The low-pressure side inflow opening O1 is located at a position on the left side of the front side of the third header plate 30C. The low-pressure side inflow opening O1 is formed in a substantially rectangular shape extending from the middle portion of the third header plate 30C in the left-right direction to the vicinity of the left side surface 20f of the discharge box 20. The low-pressure side inflow opening O1 is located at a position overlapping the low-pressure side inflow relay path 37 in the third direction.

[0080] The low-pressure side outflow opening O2 is formed at a position along the front side surface 20c of the discharge box 20. The low-pressure side outflow opening O2 is located at a front right position of the second header plate 30B. The low-pressure side outflow opening O2 is formed in a substantially rectangular shape extending from the middle portion of the second header plate 30B in the left-right direction to the vicinity of the right side surface 20e of the discharge box 20. The low-pressure side outflow opening O2 is located at a position overlapping with the low-pressure side outflow relay path 38 in the third direction.

[0081] The high-voltage side inflow opening O3 is formed at a position along the rear side surface 20d of the discharge box 20. The high-voltage side inflow opening O3 is located at a position on the left side of the rear side of the second header plate 30B. The high-voltage side inflow opening O3 is formed in a substantially rectangular shape extending from the middle portion of the second header plate 30B in the left-right direction to the vicinity of the left side surface 20f of the discharge box 20. The high-voltage side inflow opening O3 is located at a position overlapping with the high-voltage side inflow relay path 39 in the third direction.

[0082] The high-voltage side outflow opening O4 is formed along the rear side surface 20d of the discharge box 20. The high-voltage side outflow opening O4 is located at the rear right side of the second header plate 30B. The high-voltage side outflow opening O4 is formed in a substantially rectangular shape extending from the middle portion of the second header plate 30B in the left-right direction to the vicinity of the right side surface 20e of the discharge box 20. The high-voltage side outflow opening O4 is located at a position overlapping with the high-voltage side outflow relay path 40 in the third direction.

[0083] (2-3) Low-pressure side cooling unit

[0084] The low-pressure side cooling unit 50 is arranged adjacent to the low-pressure electrode module 61 of the discharge unit DU. Figure 6 As shown, the low-pressure side cooling unit 50 includes, in order from top to bottom, a first upper partition plate 50A, a first upper flow path plate 50B, a first middle plate 50C, a first lower flow path plate 50D, and a first lower partition plate 50E.

[0085] (2-3-1) First upper partition

[0086] The first upper baffle plate 50A is provided with a gas inlet opening O5 and a gas outlet opening O6. These openings penetrate the first upper baffle plate 50A in the third direction. These openings are also formed on several other substrates described in detail later. Hereinafter, these openings formed on the first upper baffle plate 50A are described in detail as representatives.

[0087] The gas inlet opening O5 is formed along the right side surface 20e of the discharge box 20. The gas inlet opening O5 extends in the front-rear direction along the right side of the first upper partition plate 50A. The gas inlet opening O5 overlaps the second gas inlet relay path 45 in the third direction.

[0088] The gas outflow opening O6 is formed along the left side surface 20f of the discharge box 20. The gas outflow opening O6 extends in the front-rear direction along the left side of the first upper partition plate 50A. The gas outflow opening O6 is located at a position overlapping the second gas outflow relay path 46 in the third direction.

[0089] On the first upper partition plate 50A, a low-pressure side inflow opening O1, a low-pressure side outflow opening O2, a high-pressure side inflow opening O3, and a high-pressure side outflow opening O4 are formed. These openings penetrate the first upper partition plate 50A in the third direction.

[0090] (2-3-2) First upper flow path plate

[0091] On the first upper flow path plate 50B, a gas inflow opening O5, a gas outflow opening O6, a high-pressure side inflow opening O3, and a high-pressure side outflow opening O4 are formed. These openings penetrate the first upper flow path plate 50B in the third direction.

[0092] On the first upper flow path plate 50B, a first upper upstream flow path 51 and a first upper downstream flow path 52 are formed. These flow paths penetrate the first upper flow path plate 50B in the third direction. In the first upper flow path plate 50B of the present embodiment, four first upper upstream flow paths 51 and four first upper downstream flow paths 52 are formed.

[0093] The first upper upstream flow path 51 is formed in a rectangular shape extending along the second direction, i.e., the front-rear direction. The first upper upstream flow path 51 may also be trapezoidal. The first upper upstream flow path 51 extends from near the front side surface 20c of the discharge box 20 to near the high-pressure side inflow opening O3. A plurality of first upper upstream flow paths 51 are arranged in parallel with each other at equal intervals in the left-right direction. A plurality of first upper upstream flow paths 51 may also be arranged at different intervals in the left-right direction. The front end (inflow end) of each first upper upstream flow path 51 is located in the third direction at a position overlapping the low-pressure side inflow opening O1.

[0094] The first upper downstream flow path 52 is formed in a rectangular shape extending along the second direction, i.e., the front-rear direction. The first upper downstream flow path 52 may also be trapezoidal. The first upper downstream flow path 52 extends from near the front side surface 20c of the discharge box 20 to near the high-pressure side outflow opening O4. A plurality of first upper downstream flow paths 52 are arranged in parallel with each other at equal intervals in the left-right direction. The front end (outflow end) of each first upper downstream flow path 52 is located in the third direction at a position overlapping the low-pressure side outflow opening O2.

[0095] The upper side of the first upper upstream flow path 51 is closed by the first upper partition plate 50A, except for its inflow end (front end). The lower side of the first upper upstream flow path 51 is closed by the first intermediate plate 50C, except for its inflow end (front end) and outflow end (rear end). The upper side of the first upper downstream flow path 52 is closed by the first upper partition plate 50A, except for its outflow end (front end). The lower side of the first upper downstream flow path 52 is closed by the first intermediate plate 50C, except for its inflow end (rear end) and outflow end (front end).

[0096] (2-3-3) First intermediate plate

[0097] A gas inflow opening O5, a gas outflow opening O6, a low-pressure side inflow opening O1, a low-pressure side outflow opening O2, a high-pressure side inflow opening O3, and a high-pressure side outflow opening O4 are formed in the first intermediate plate 50C. These openings penetrate the first intermediate plate 50C in the third direction.

[0098] A first intermediate flow path 53 is formed in the first intermediate plate 50C. The first intermediate flow path 53 extends in the first direction, i.e., the left-right direction, along the rear side surface 20d of the discharge box 20. Specifically, the first intermediate flow path 53 extends from near the gas inflow opening O5 to near the gas outflow opening O6. The upstream side portion of the first intermediate flow path 53 is adjacent to the high-pressure side inflow opening O3, and the downstream side portion of the first intermediate flow path 53 is adjacent to the high-pressure side outflow opening O4. The upstream side portion of the first intermediate flow path 53 is located at a position overlapping the rear end (outflow end) of each first upper side upstream flow path 51 in the third direction. The downstream side portion of the first intermediate flow path 53 is located at a position overlapping the rear end (inflow end) of each first upper side downstream flow path 52 in the third direction.

[0099] (2-3-4) First lower side flow path plate

[0100] The structure of the first lower side flow path plate 50D is substantially the same as the structure of the first upper side flow path plate 50B. A gas inflow opening O5, a gas outflow opening O6, a high-pressure side inflow opening O3, and a high-pressure side outflow opening O4 are formed in the first lower side flow path plate 50D. These openings penetrate the first lower side flow path plate 50D in the third direction.

[0101] A first lower side upstream flow path 54 and a first lower side downstream flow path 55 are formed in the first lower side flow path plate 50D. These flow paths penetrate the first lower side flow path plate 50D in the third direction. Four first lower side upstream flow paths 54 and four first lower side downstream flow paths 55 are formed in the first lower side flow path plate 50D of the present embodiment.

[0102] The first lower side upstream flow path 54 extends along the second direction, i.e., the front-rear direction. The first lower side upstream flow path 54 extends from near the front side surface 20c of the discharge box 20 to near the high-pressure side inflow opening O3. A plurality of first lower side upstream flow paths 54 are arranged in parallel with each other at equal intervals in the left-right direction. The front end (inflow end) of each first lower side upstream flow path 54 is located at a position overlapping the low-pressure side inflow opening O1 in the third direction.

[0103] The first lower-side downstream flow path 55 extends along the second direction, i.e., the front-rear direction. The first lower-side downstream flow path 55 extends from near the front side surface 20c of the discharge box 20 to near the high-pressure side outflow opening O4. A plurality of first lower-side downstream flow paths 55 are arranged in parallel with each other at equal intervals in the left-right direction. The front end (outflow end) of each first lower-side downstream flow path 55 is located at a position overlapping the low-pressure side outflow opening O2 in the third direction.

[0104] The upper side of the first lower-side upstream flow path 54 is closed by the first intermediate plate 50C, except for its inflow end (front end) and outflow end (rear end). The lower side of the first lower-side upstream flow path 54 is closed by the first lower-side partition plate 50E, except for its inflow end (front end). The upper side of the first lower-side downstream flow path 55 is closed by the first intermediate plate 50C, except for its outflow end (front end) and inflow end (rear end). The lower side of the first lower-side downstream flow path 55 is closed by the first lower-side partition plate 50E, except for its outflow end (front end).

[0105] (2-3-5) First lower-side partition plate

[0106] A gas inflow opening O5, a gas outflow opening O6, a low-pressure side inflow opening O1, a low-pressure side outflow opening O2, a high-pressure side inflow opening O3, and a high-pressure side outflow opening O4 are formed in the first lower-side partition plate 50E. These openings penetrate the first lower-side partition plate 50E in the third direction.

[0107] (2-4) Discharge unit

[0108] As Figure 7 and Figure 8 shown, the discharge unit DU has a discharge portion 60. The discharge portion 60 has a low-pressure electrode module 61 and a high-pressure electrode module 62 that face each other. In the first discharge unit DU1 and the third discharge unit DU3, the low-pressure electrode module 61 is located on the upper side, and the high-pressure electrode module 62 is located on the lower side. In the second discharge unit DU2, the high-pressure electrode module 62 is located on the upper side, and the low-pressure electrode module 61 is located on the lower side. In the discharge portion 60, a discharge space 63 is formed between the low-pressure electrode module 61 and the high-pressure electrode module 62.

[0109] In the discharge box 20, the high-pressure electrode modules 62 of the discharge units DU adjacent to each other in the third direction face each other, and the low-pressure electrode modules 61 face each other (refer to Figure 10 and Figure 11 ).

[0110] The low-voltage electrode module 61 has a first base portion 61a and a plurality of first convex portions 61b that project from the first base portion 61a toward the high-voltage electrode module 62. The first base portion 61a constitutes the main body of the substrate S. The first base portion 61a is formed of a flat plate having a rectangular parallelepiped shape when viewed from above. The first base portion 61a constitutes the low-voltage side dielectric. A low-voltage electrode 61c is formed on the back surface (upper surface) of the first base portion 61a. The low-voltage electrode 61c is electrically connected to the low-voltage side (ground side) of the power supply unit 11. The low-voltage electrode 61c is formed of a metal film, but may also be a plate-shaped electrode. The first convex portions 61b are formed in a rod shape having a relatively long lateral length in the left-right direction. The plurality of first convex portions 61b are arranged in parallel with each other at equal intervals in the front-rear direction.

[0111] The high-voltage electrode module 62 has a second base portion 62a and a plurality of second convex portions 62b that project from the second base portion 62a toward the low-voltage electrode module 61. The second base portion 62a constitutes the main body of the substrate S. The second base portion 62a is formed of a flat plate having a rectangular shape when viewed from above. The second base portion 62a constitutes the high-voltage side dielectric. A high-voltage electrode 62c is formed on the back surface (lower surface) of the second base portion 62a. The high-voltage electrode 62c is electrically connected to the high-voltage side of the power supply unit 11. The high-voltage electrode 62c is formed of a metal film, but may also be a plate-shaped electrode. The second convex portions 62b are formed in a rod shape having a relatively long lateral length in the left-right direction. The plurality of second convex portions 62b are arranged in parallel with each other at equal intervals in the front-rear direction.

[0112] Between the first convex portion 61b and the second convex portion 62b, a glass bonding layer 64 is formed between the lower end of the first convex portion 61b and the upper end of the second convex portion 62b in the third direction. The bonding layer 64 constitutes an insulator.

[0113] A plurality of discharge spaces 63 are formed between the first base portion 61a, the first convex portions 61b, the second base portion 62a, and the second convex portions 62b. These discharge spaces 63 are spaces having a relatively long lateral length extending in the left-right direction. When a voltage is applied to the high-voltage electrode 62c, discharge (strictly speaking, barrier discharge) occurs in the discharge spaces 63. In the discharge spaces 63, gas (oxygen and ozone gas) flows in the first direction, i.e., the left-right direction.

[0114] A first discharge-side inflow path 65 and a first discharge-side outflow path 66 are formed on the first base portion 61a. The first discharge-side inflow path 65 and the first discharge-side outflow path 66 penetrate the first base portion 61a in the third direction. The first discharge-side inflow path 65 communicates with the gas inflow opening O5 of the first lower partition 50E, and the second discharge-side outflow path 68 communicates with the gas outflow opening O6 of the first lower partition 50E.

[0115] The first discharge-side inflow path 65 is formed at a position along the right side surface 20e of the discharge box 20. The first discharge-side inflow path 65 extends in the front-rear direction along the right side of the first base portion 61a. The first discharge-side inflow path 65 communicates with the inflow ends of the plurality of discharge spaces 63. The first discharge-side outflow path 66 is formed at a position along the left side surface 20f of the discharge box 20. The first discharge-side outflow path 66 extends in the front-rear direction along the left side of the first base portion 61a. The first discharge-side outflow path 66 communicates with the outflow ends of the plurality of discharge spaces 63.

[0116] A second discharge-side inflow path 67 and a second discharge-side outflow path 68 are formed on the second base portion 62a. The second discharge-side inflow path 67 and the second discharge-side outflow path 68 penetrate the second base portion 62a in the third direction. The second discharge-side inflow path 67 is formed at a position along the right side surface 20e of the discharge box 20. The second discharge-side inflow path 67 extends in the front-rear direction along the right side of the second base portion 62a. The second discharge-side inflow path 67 communicates with the inflow ends of the plurality of discharge spaces 63. The second discharge-side inflow path 67 communicates with the first discharge-side inflow path 65 of the first base portion 61a. The second discharge-side outflow path 68 is formed at a position along the left side surface 20f of the discharge box 20. The second discharge-side outflow path 68 extends in the front-rear direction along the left side of the second base portion 62a. The second discharge-side outflow path 68 communicates with the outflow ends of the plurality of discharge spaces 63. The second discharge-side outflow path 68 communicates with the first discharge-side outflow path 66 of the first base portion 61a.

[0117] A low-pressure side inflow opening O1, a low-pressure side outflow opening O2, a high-pressure side inflow opening O3, and a high-pressure side outflow opening O4 are respectively formed on the first base portion 61a and the second base portion 62a.

[0118] (2-5) High-pressure side cooling unit

[0119] The high-pressure side cooling unit 70 is disposed adjacent to the high-voltage electrode module 62 of the discharge unit DU. As Figure 9 shown, the high-pressure side cooling unit 70 sequentially has a second upper side partition 70A, a second upper side flow path plate 70B, a second intermediate plate 70C, a second lower side flow path plate 70D, and a second lower side partition 70E in the order from top to bottom. The structures of the second upper side partition 70A and the second lower side partition 70E are the same as those of the above-mentioned first upper side partition 50A and first lower side partition 50E, so detailed description is omitted.

[0120] (2-5-1) Second upper side flow path plate

[0121] A gas inflow opening O5, a gas outflow opening O6, a low-pressure side inflow opening O1, and a low-pressure side outflow opening O2 are formed on the second upper side flow path plate 70B. These openings penetrate the second upper side flow path plate 70B in the third direction.

[0122] On the second upper flow path plate 70B, a second upper upstream flow path 71 and a second upper downstream flow path 72 are formed. These flow paths penetrate the second upper flow path plate 70B in the third direction. On the second upper flow path plate 70B of the present embodiment, four second upper upstream flow paths 71 and four second upper downstream flow paths 72 are formed.

[0123] The second upper upstream flow path 71 extends along the second direction, i.e., the front-rear direction. The second upper upstream flow path 71 extends from near the low-pressure side inflow opening O1 to near the rear side surface 20d of the discharge box 20. A plurality of second upper upstream flow paths 71 are arranged in parallel with each other at equal intervals in the left-right direction. The rear end (inflow end) of each second upper upstream flow path 71 is located at a position overlapping the high-pressure side inflow opening O3 in the third direction.

[0124] The second upper downstream flow path 72 extends along the second direction, i.e., the front-rear direction. The second upper downstream flow path 72 extends from near the low-pressure side outflow opening O2 to near the rear side surface 20d of the discharge box 20. A plurality of second upper downstream flow paths 72 are arranged in parallel with each other at equal intervals in the left-right direction. The rear end (outflow end) of each second upper downstream flow path 72 is located at a position overlapping the high-pressure side outflow opening O4 in the third direction.

[0125] The upper side of the second upper upstream flow path 71 is closed by the second upper partition plate 70A, except for its inflow end (rear end). The lower side of the second upper upstream flow path 71 is closed by the second intermediate plate 70C, except for its inflow end (rear end) and outflow end (front end). The upper side of the second upper downstream flow path 72 is closed by the second upper partition plate 70A, except for its outflow end (rear end). The lower side of the second upper downstream flow path 72 is closed by the first intermediate plate 50C, except for its inflow end (front end) and outflow end (rear end).

[0126] (2-5-2) Second Intermediate Plate

[0127] On the second intermediate plate 70C, a gas inflow opening O5, a gas outflow opening O6, a low-pressure side inflow opening O1, a low-pressure side outflow opening O2, a high-pressure side inflow opening O3, and a high-pressure side outflow opening O4 are formed. These openings penetrate the second intermediate plate 70C in the third direction.

[0128] A second intermediate flow path 73 is formed on the second intermediate plate 70C. The second intermediate flow path 73 extends in the first direction, i.e., the left - right direction, along the front side surface 20c of the discharge box 20. Specifically, the second intermediate flow path 73 extends from near the gas inflow opening O5 to near the gas outflow opening O6. The upstream side portion of the second intermediate flow path 73 is adjacent to the low - pressure side inflow opening O1, and the downstream side portion of the second intermediate flow path 73 is adjacent to the low - pressure side outflow opening O2. The upstream side portion of the second intermediate flow path 73 is located at a position overlapping the front end (outflow end) of each second upper - side upstream flow path 71 in the third direction. The downstream side portion of the second intermediate flow path 73 is located at a position overlapping the front end (inflow end) of each second upper - side downstream flow path 72 in the third direction.

[0129] (2 - 5 - 3) Second lower - side flow path plate

[0130] The structure of the second lower - side flow path plate 70D is substantially the same as that of the second upper - side flow path plate 70B. A gas inflow opening O5, a gas outflow opening O6, a low - pressure side inflow opening O1, and a low - pressure side outflow opening O2 are formed on the second lower - side flow path plate 70D. These openings penetrate the second lower - side flow path plate 70D in the third direction.

[0131] A second lower - side upstream flow path 74 and a second lower - side downstream flow path 75 are formed on the second lower - side flow path plate 70D. These flow paths penetrate the second lower - side flow path plate 70D in the third direction. Four second lower - side upstream flow paths 74 and four second lower - side downstream flow paths 75 are formed on the second lower - side flow path plate 70D of the present embodiment.

[0132] The second lower - side upstream flow path 74 extends along the second direction, i.e., the front - rear direction. The second lower - side upstream flow path 74 extends from near the low - pressure side inflow opening O1 to near the rear side surface 20d of the discharge box 20. A plurality of second lower - side upstream flow paths 74 are arranged parallel to each other at equal intervals in the left - right direction. The rear end (inflow end) of each second lower - side upstream flow path 74 is located at a position overlapping the high - pressure side inflow opening O3 in the third direction.

[0133] The second lower - side downstream flow path 75 extends along the second direction, i.e., the front - rear direction. The second lower - side downstream flow path 75 extends from near the low - pressure side outflow opening O2 to near the rear side surface 20d of the discharge box 20. A plurality of second lower - side downstream flow paths 75 are arranged parallel to each other at equal intervals in the left - right direction. The rear end (outflow end) of each second lower - side downstream flow path 75 is located at a position overlapping the high - pressure side outflow opening O4 in the third direction.

[0134] The upper side of the second lower upstream flow path 74 is closed by the second intermediate plate 70C, except for its inflow end (rear end) and outflow end (front end). The lower side of the second lower upstream flow path 74 is closed by the second lower partition plate 70E, except for its inflow end (rear end). The upper side of the second lower downstream flow path 75 is closed by the second intermediate plate 70C, except for its inflow end (front end) and outflow end (rear end). The lower side of the second lower downstream flow path 75 is closed by the second lower partition plate 70E, except for its outflow end (rear end).

[0135] (2 - 6) End plate

[0136] As Figure 4 shown, the end plate E is the substrate located at the lowermost side of the discharge box 20. No opening is formed in the end plate E. The end plate E closes the gas inflow opening O5, gas outflow opening O6, low-pressure side inflow opening O1, low-pressure side outflow opening O2, high-pressure side inflow opening O3, and high-pressure side outflow opening O4 of the adjacent substrate S.

[0137] (3) Heat medium flow path

[0138] In the discharge box 20, a heat medium flow path P for cooling water to flow is formed. The heat medium flow path P will be described in detail mainly with reference to Figure 10 and Figure 11 . Figure 10 represents the upstream side flow path of the heat medium flow path P, Figure 11 represents the downstream side flow path of the heat medium flow path P.

[0139] The heat medium flow path P has a high-pressure side flow path HP corresponding to the high-pressure electrode module 62 and a low-pressure side flow path LP corresponding to the low-pressure electrode module 61. The high-pressure side flow path HP and the low-pressure side flow path LP branch out from the outflow end of the heat medium inflow path 33 (refer to Figure 10 ). The outflow end of the cooling water inlet is a branch portion 86 that diverts the heat medium to the high-pressure side flow path HP and the low-pressure side flow path LP. The outflow ends of the high-pressure side flow path HP and the low-pressure side flow path LP are connected to the inflow end of the heat medium outflow path 34 (refer to Figure 11 ). The inflow end of the heat medium outflow path 34 is a confluence portion 87 where the heat medium from the high-pressure side flow path HP and the low-pressure side flow path LP converges.

[0140] (3 - 1) High-pressure side flow path

[0141] The high-pressure side flow path HP includes a high-pressure side inflow branch path 43, a high-pressure side inflow relay path 39, a high-pressure side inflow path HP1, a high-pressure side cooling flow path HP2, a high-pressure side outflow path HP3, a high-pressure side outflow relay path 40, and a high-pressure side outflow branch path 44.

[0142] The high-pressure side inflow path HP1 is a path for allowing cooling water, which is a heat medium, to flow into the high-pressure side cooling flow path HP2. The high-pressure side inflow path HP1 is formed in the cooling unit CU and the discharge unit DU, respectively. In the cooling unit CU and the discharge unit DU, the high-pressure side inflow path HP1 is formed by connecting in the vertical direction through a plurality of high-pressure side inflow openings O3. The high-pressure side inflow path HP1 is formed at a position along the third surface of the discharge box 20, that is, the rear surface 20d.

[0143] The high-pressure side cooling flow path HP2 is a cooling flow path through which the heat medium for cooling the high-voltage electrode module 62 flows. The high-pressure side cooling flow path HP2 is formed adjacent to the high-voltage electrode module 62. In the present embodiment, the high-pressure side cooling flow path HP2 is formed in the second cooling unit CU2 and the fourth cooling unit CU4. The high-pressure side cooling flow path HP2 is composed of a second upper-side upstream flow path 71, a second lower-side upstream flow path 74, a second intermediate flow path 73, a second upper-side downstream flow path 72, and a second lower-side downstream flow path 75. The second upper-side upstream flow path 71 and the second lower-side upstream flow path 74 respectively constitute the first cooling flow path 81; the second upper-side downstream flow path 72 and the second lower-side downstream flow path 75 respectively constitute the second cooling flow path 82; the second intermediate flow path 73 constitutes the intermediate flow path 83.

[0144] The high-pressure side outflow path HP3 is a path for allowing the heat medium from the high-pressure side cooling flow path HP2 to flow out. The high-pressure side outflow path HP3 is formed in the cooling unit CU and the discharge unit DU, respectively. In the cooling unit CU and the discharge unit DU, the high-pressure side outflow path HP3 is formed by connecting in the vertical direction through a plurality of high-pressure side outflow openings O4. The high-pressure side outflow path HP3 is formed at a position along the third surface of the discharge box 20, that is, the rear surface 20d.

[0145] In the high-pressure side flow path HP, the flow path between the outflow end of the heat medium inflow path 33, that is, the shunt portion 86, and the inflow end of the high-pressure side cooling flow path HP2 closest to the shunt portion 86 constitutes the inflow high-pressure side main path 91. In the high-pressure side flow path HP, the flow path between the inflow end of the heat medium outflow path 34, that is, the confluence portion 87, and the outflow end of the high-pressure side cooling flow path HP2 closest to the confluence portion 87 constitutes the outflow high-pressure side main path 92. The inflow high-pressure side main path 91 is Figure 10 the flow path between point a and point b. The outflow high-pressure side main path 92 is Figure 11 the flow path between point d and point e.

[0146] In the discharge box 20, the high-pressure side inflow paths HP1 of the plurality of discharge units DU and the plurality of cooling units CU communicate with each other in the vertical direction. In the discharge box 20, the high-pressure side outflow paths HP3 of the plurality of discharge units DU and the plurality of cooling units CU communicate with each other in the vertical direction. In this way, in the discharge box 20, a plurality of high-pressure side cooling flow paths HP2 are formed to be parallel to each other.

[0147] (3-2) Low-pressure side flow path

[0148] The low-pressure side flow path LP includes a low-pressure side inflow branch path 41, a low-pressure side inflow relay path 37, a low-pressure side inflow path LP1, a low-pressure side cooling flow path LP2, a low-pressure side outflow path LP3, a low-pressure side outflow relay path 38, and a low-pressure side outflow branch path 42.

[0149] The low-pressure side inflow path LP1 is a flow path for allowing cooling water as a heat medium to flow into the low-pressure side cooling flow path LP2. The low-pressure side inflow path LP1 is formed in the cooling unit CU and the discharge unit DU respectively. In the cooling unit CU and the discharge unit DU, the low-pressure side inflow path LP1 is formed by connecting a plurality of low-pressure side inflow openings O1 in the vertical direction. The low-pressure side inflow path LP1 is formed at a position along the fourth surface, i.e., the front surface 20c, of the discharge box 20.

[0150] The low-pressure side cooling flow path LP2 is a cooling flow path for allowing the heat medium for cooling the low-pressure electrode module 61 to flow. The low-pressure side cooling flow path LP2 is formed adjacent to the low-pressure electrode module 61. In the present embodiment, the low-pressure side cooling flow path LP2 is formed in the first cooling unit CU1 and the third cooling unit CU3. The low-pressure side cooling flow path LP2 is composed of a first upper side upstream flow path 51, a first lower side upstream flow path 54, a first intermediate flow path 53, a first upper side downstream flow path 52, and a first lower side downstream flow path 55. The first upper side upstream flow path 51 and the first lower side upstream flow path 54 respectively constitute the first cooling flow path 81; the first upper side downstream flow path 52 and the first lower side downstream flow path 55 respectively constitute the second cooling flow path 82; the first intermediate flow path 53 constitutes the intermediate flow path 83.

[0151] The low-pressure side outflow path LP3 is a flow path for allowing the heat medium from the low-pressure side cooling flow path LP2 to flow out. The low-pressure side outflow path LP3 is formed in the cooling unit CU and the discharge unit DU respectively. In the cooling unit CU and the discharge unit DU, the low-pressure side outflow path LP3 is formed by connecting a plurality of low-pressure side outflow openings O2 in the vertical direction. The low-pressure side outflow path LP3 is formed at a position along the fourth surface, i.e., the front surface 20c, of the discharge box 20.

[0152] In the low-pressure side flow path LP, the flow path between the outflow end of the heat medium inflow path 33, i.e., the shunt portion 86, and the inflow end of the low-pressure side cooling flow path LP2 closest to the shunt portion 86 constitutes the inflow low-pressure side main path 93. In the low-pressure side flow path LP, the flow path between the inflow end of the heat medium outflow path 34, i.e., the confluence portion 87, and the inflow end of the low-pressure side cooling flow path LP2 closest to the confluence portion 87 constitutes the outflow low-pressure side main path 94. The inflow low-pressure side main path 93 is Figure 10 the flow path between point a and point c. The outflow low-pressure side main path 94 is Figure 11The flow path between point d and point f.

[0153] In the discharge box 20, the low-pressure side inflow paths LP1 of the plurality of discharge units DU and the plurality of cooling units CU communicate with each other in the vertical direction. In the discharge box 20, the low-pressure side outflow paths LP3 of the plurality of discharge units DU and the plurality of cooling units CU communicate with each other in the vertical direction. Therefore, in the discharge box 20, a plurality of low-pressure side cooling flow paths LP2 are arranged parallel to each other.

[0154] (3-3) Grounding portion

[0155] Grounding portions 8A and 8B are connected to the heat medium flow path P. The grounding portions 8A and 8B are grounded. The grounding portions 8A and 8B have the function of releasing the current flowing in the heat medium flow path P due to the discharge of the discharge portion 60 to the ground. As Figure 10 and Figure 11 shown, the grounding portions 8A and 8B are composed of a first grounding portion 8A and a second grounding portion 8B. The first grounding portion 8A and the second grounding portion 8B are provided on the header unit HU.

[0156] The first grounding portion 8A is provided on the inflow side of the heat medium flow path P and on the flow path where the heat medium is branched. Specifically, the first grounding portion 8A is provided between the high-pressure side cooling flow path HP2 closest to the branch portion 86 and the low-pressure side cooling flow path LP2 closest to the branch portion 86. The first grounding portion 8A of the present embodiment is provided at the branch portion 86. The first grounding portion 8A is formed, for example, by grounding a stainless steel joint.

[0157] The flow path between the first grounding portion 8A and the high-pressure side cooling flow path HP2 closest to the first grounding portion 8A forms a first flow path F1. That is, the first flow path F1 is the flow path from the first grounding portion 8A to point b. The flow path between the first grounding portion 8A and the low-pressure side cooling flow path LP2 closest to the first grounding portion 8A forms a second flow path F2. That is, the second flow path F2 is the flow path from the first grounding portion 8A to point c. The first grounding portion 8A of the present embodiment is provided at the branch portion 86. Therefore, the first flow path F1 of the present embodiment substantially forms the inflow high-pressure side main path 91. The second flow path F2 of the present embodiment substantially forms the inflow low-pressure side main path 93.

[0158] The second grounding portion 8B is provided on the outflow side of the heat medium flow path P and on the flow path where the heat medium is merged. Specifically, the second grounding portion 8B is provided between the high-pressure side cooling flow path HP2 closest to the merging portion 87 and the low-pressure side cooling flow path LP2 closest to the merging portion 87. The second grounding portion 8B of the present embodiment is provided at the merging portion 87. The second grounding portion 8B is formed, for example, by grounding a stainless steel joint.

[0159] The flow path between the second grounding portion 8B and the high-voltage side cooling flow path HP2 closest to the second grounding portion 8B forms a third flow path F3. That is to say, the third flow path F3 is the flow path from the second grounding portion 8B to point e. The flow path between the second grounding portion 8B and the low-voltage side cooling flow path LP2 closest to the second grounding portion 8B forms a fourth flow path F4. That is to say, the fourth flow path F4 is the flow path from the second grounding portion 8B to point f. The second grounding portion 8B of the present embodiment is provided at the confluence portion 87. Therefore, the third flow path F3 of the present embodiment substantially forms the high-voltage side main path 92 for outflow. The fourth flow path F4 of the present embodiment substantially forms the low-voltage side main path 94 for outflow.

[0160] (4) Gas inflow path and gas outflow path

[0161] Gas inflow paths GP1 are respectively formed in the cooling unit CU and the discharge unit DU. In the cooling unit CU, the gas inflow path GP1 is formed by connecting a plurality of gas inflow openings O5 in the vertical direction. In the discharge unit DU, the gas inflow path GP1 is formed by connecting the first discharge side inflow path 65 and the second discharge side inflow path 67 in the vertical direction. The gas inflow path GP1 is formed at a position along the first surface of the discharge box 20, i.e., the right side surface 20e.

[0162] Gas outflow paths GP2 are respectively formed in the cooling unit CU and the discharge unit DU. In the cooling unit CU, the gas outflow path GP2 is formed by connecting a plurality of gas outflow openings O6 in the vertical direction. In the discharge unit DU, the gas outflow path GP2 is formed by connecting the first discharge side outflow path 66 and the second discharge side outflow path 68 in the vertical direction. The gas outflow path GP2 is formed at a position along the second surface of the discharge box 20, i.e., the left side surface 20f.

[0163] (5) Operating work

[0164] The basic operating work of the ozone generation device 1 will be described. When the ozone generation device 1 operates, a high voltage is applied between the high-voltage electrode 62c and the low-voltage electrode 61c of the discharge portion 60 from the power supply unit 11. The oxygen supply unit 2 supplies oxygen to the discharge box 20. The heat medium supply unit 4 supplies cooling water to the discharge box 20.

[0165] Oxygen flows successively through the gas inlet 31, the first gas inlet relay path 35, the second gas inlet relay path 45, and then through the gas inlet path GP1. The oxygen is branched from the gas inlet path GP1 into the discharge spaces 63 of the respective discharge units DU. In the discharge space 63, barrier discharge occurs between the high-voltage electrode module 62 and the low-voltage electrode module 61. As a result, ozone gas is generated from oxygen in the discharge space 63. In the discharge space 63, the ozone gas concentration gradually increases from its upstream side to its downstream side, specifically, from the right side to the left side in the first direction.

[0166] The gas containing ozone gas flowing out from each discharge space 63 converges in the gas outlet path GP2, successively flows through the second gas outlet relay path 46, the first gas outlet relay path 36, and the gas outlet 32, and then flows out to the outside of the discharge box 20. This gas is supplied from the ozone generating device 1 to a specified object.

[0167] The cooling water flows through the heat medium inlet path 33 and then is branched into the high-voltage side flow path HP and the low-voltage side flow path LP.

[0168] The cooling water flowing into the high-voltage side flow path HP successively flows through the high-voltage side inlet branch path 43 and the high-voltage side inlet relay path 39, and then through the high-voltage side inlet path HP1. The cooling water is branched from the high-voltage side inlet path HP1 into a plurality of high-voltage side cooling flow paths HP2. The cooling water flowing into the high-voltage side cooling flow paths HP2 is mainly used to cool the high-voltage electrode module 62. The cooling water flowing out from each high-voltage side cooling flow path HP2 converges in the high-voltage side outlet path HP3 and successively flows through the high-voltage side outlet relay path 40 and the high-voltage side outlet branch path 44.

[0169] The cooling water flowing into the low-voltage side flow path LP successively flows through the low-voltage side inlet branch path 41 and the low-voltage side inlet relay path 37, and then through the low-voltage side inlet path LP1. The cooling water is branched from the low-voltage side inlet path LP1 into a plurality of low-voltage side cooling flow paths LP2. The cooling water flowing into the low-voltage side cooling flow paths LP2 is mainly used to cool the low-voltage electrode module 61. The cooling water flowing out from each low-voltage side cooling flow path LP2 converges in the low-voltage side outlet path LP3 and successively flows through the low-voltage side outlet relay path 38 and the low-voltage side outlet branch path 42.

[0170] The cooling water from the high-voltage side outlet branch path 44 and the low-voltage side outlet branch path 42 converges in the heat medium outlet path 34 and is then discharged to the outside of the discharge box 20.

[0171] (6) Measures for power consumption loss

[0172] (6 - 1) Problem

[0173] When a high voltage is applied from the power supply unit 11 to the high-voltage electrode 62c, current sometimes flows from the high-voltage electrode module 62 through the cooling flow paths HP2 and LP2 in its vicinity to the grounding portions 8A and 8B. This will cause unnecessary power consumption during the discharge process. As a result, the ozone generation amount of the discharge cartridge 20 decreases, and in order to increase the ozone generation amount of the discharge cartridge 20, it is necessary to make the discharge cartridge 20 larger. Therefore, in the present embodiment, in order to reduce such power consumption loss, the following measures are taken.

[0174] (6-2) Structure of the heat medium flow path

[0175] As Figure 10 shown, in the heat medium flow path P, the high-pressure side flow path HP and the low-pressure side flow path LP branch from the branch portion 86 of the heat medium inflow path 33. The high-pressure side flow path HP and the low-pressure side flow path LP are connected to the confluence portion 87 of the heat medium outflow path 34. In the high-pressure side flow path HP, a plurality of high-pressure side cooling flow paths HP2 are connected in parallel. In the low-pressure side flow path LP, a plurality of low-pressure side cooling flow paths LP2 are connected in parallel.

[0176] Here, let the resistance value of the first flow path F1 be R1. Let the resistance value of the second flow path F2 be R2. Let the resistance value of the third flow path F3 be R3. Let the resistance value of the fourth flow path F4 be R4.

[0177] In the heat medium flow path P of the present embodiment, the flow path length L1 of the first flow path F1 is greater than the flow path length L2 of the second flow path F2. Here, other parameters (such as the flow path width, the resistance value of the material of the components around the flow path, etc.) that affect the resistance values of these flow paths for the first flow path F1 and the second flow path F2 are equal to each other. Therefore, when L1 is greater than L2, the resistance value R1 of the first flow path F1 is greater than the resistance value R2 of the second flow path F2. In other words, in the present embodiment, the flow path length of the inflow to the high-pressure side main path 91 is greater than the flow path length of the inflow to the low-pressure side main path 93. The resistance value of the inflow to the high-pressure side main path 91 is greater than the resistance value of the inflow to the low-pressure side main path 93.

[0178] According to this configuration, it is difficult for current to flow from the high-pressure side cooling flow path HP2 through the first flow path F1 (that is, the inflow to the high-pressure side main path 91) to the first grounding portion 8A, and power consumption loss can be reduced. Here, in the present embodiment, as Figure 5 shown, a first bending portion 95 is formed on the high-pressure side inflow branch path 43. The first bending portion 95 has a shape that bulges toward the center side of the second header plate 30B. According to this configuration, it is possible to easily increase the flow path length L1 of the inflow to the high-pressure side main path 91 or the first flow path F1.

[0179] In the hot medium flow path P, the flow path length L3 of the third flow path F3 is greater than the flow path length L4 of the fourth flow path F4. Here, other parameters (such as the flow path width, the resistance value of the material of the components around the flow path, etc.) that affect the resistance values of these flow paths for the third flow path F3 and the fourth flow path F4 are equal to each other. Therefore, when L3 is greater than L4, the resistance value R3 of the third flow path F3 is greater than the resistance value R4 of the fourth flow path F4. In other words, in the present embodiment, the flow path length of the high-pressure side main path 92 flowing out is greater than the flow path length of the low-pressure side main path 94 flowing out. The resistance value of the high-pressure side main path 92 flowing out is greater than the resistance value of the low-pressure side main path 94 flowing out.

[0180] According to this configuration method, it is difficult for current to flow from the high-pressure side cooling flow path HP2 to the second grounding portion 8B via the third flow path (that is, the high-pressure side main path 92 flowing out), and power consumption loss can be reduced. Here, in the present embodiment, as Figure 5 shown, a second bending portion 96 is formed on the high-pressure side outflow branch path 44. The second bending portion 96 has a shape bulging toward the center side of the second header plate 30B. According to this configuration method, it is possible to easily increase the flow path length L3 of the high-pressure side main path 92 flowing out.

[0181] In the hot medium flow path P, the flow path length of the high-pressure side main path 91 flowing in is substantially equal to the flow path length of the high-pressure side main path 92 flowing out. Therefore, the resistance value of the high-pressure side main path 91 flowing in is substantially equal to the resistance value of the high-pressure side main path 92 flowing out. In the case where the flow path length of the high-pressure side main path 91 flowing in and the flow path length of the high-pressure side main path 92 flowing out are of different sizes, the flow path resistance value of the flow path with the shorter flow path length among the two plays a leading role in reducing power consumption loss. Therefore, the flow path resistance value of the flow path with the longer flow path length among the two does not contribute to reducing power consumption loss. In contrast, by making the flow path length of the high-pressure side main path 91 flowing in equal to the flow path length of the high-pressure side main path 92 flowing out, the flow path lengths of the high-pressure side main path 91 flowing in and the high-pressure side main path 92 flowing out can be suppressed to the minimum necessary. Therefore, miniaturization of the header unit HU and further the discharge box 20 can be achieved.

[0182] (6 - 3) Arrangement relationship of discharge units

[0183] In the present embodiment, as Figure 10 and Figure 11As shown, the high-voltage electrode modules 62 of the discharge units 60 adjacent in the third direction face each other across the high-voltage side cooling flow path HP2. Specifically, the high-voltage electrode module 62 of the first discharge unit DU1 and the high-voltage electrode module 62 of the second discharge unit DU2 face each other across the high-voltage side cooling flow path HP2 of the second cooling unit CU2. The low-voltage electrode modules 61 of the discharge units 60 adjacent in the third direction face each other across the low-voltage side cooling flow path LP2. Specifically, the low-voltage electrode module 61 of the second discharge unit DU2 and the low-voltage electrode module 61 of the third discharge unit DU3 face each other across the low-voltage side cooling flow path LP2 of the third cooling unit CU3.

[0184] For example, in Figure 12 In the comparative example shown, since the high-voltage electrode module and the low-voltage electrode module of adjacent discharge units face each other, current may leak from the high-voltage electrode module to the low-voltage electrode module side via the cooling flow path. In contrast, in the structure of the present embodiment, the high-voltage electrode module 62 and the low-voltage electrode module 61 do not face each other via the cooling flow paths HP2 and LP2, so such current leakage can be suppressed. Therefore, power consumption loss can be further reduced.

[0185] (7) Specific resistance value of the cooling water

[0186] In the present embodiment, the heat medium supply unit 4 as the supply unit supplies cooling water with a specific resistance value of 15 [Ω·m] or more to the heat medium inflow path 33. The cooling water is tap water. By flowing water with a specific resistance value of 15 [Ω·m] or more in the heat medium flow path P, the effect of reducing power consumption loss can be sufficiently obtained by the structure of the discharge cartridge 20 of the present embodiment. Figure 13 The verification results showing this are presented. It should be noted that in this verification, for the discharge cartridge 20 according to the present embodiment and the discharge cartridge according to the comparative example (refer to Figure 12 ), the relationship between the specific resistance value of the heat medium (cooling water) and the power consumption loss in the heat medium flow path P was estimated. Here, the power supply condition was an AC high-voltage power supply with an applied voltage of 2.85 [kV].

[0187] As a result of the verification, in the present embodiment, the greater the specific resistance value of the heat medium, the more the power consumption loss can be reduced. Specifically, when the specific resistance value is 15 [Ω·m] or more, the power consumption loss of the present embodiment is less than that of the comparative example. Therefore, the specific resistance value of the heat medium is preferably 15 [Ω·m] or more.

[0188] Furthermore, when the specific resistance value of the heat medium is 1000 [Ω·m] or more, almost no power consumption loss occurs, and when the specific resistance value of the heat medium is 1000 [Ω·m] or more, the power consumption loss is almost zero. Therefore, the specific resistance value of the heat medium is more preferably 1000 [Ω·m] or more.

[0189] (8) Other embodiments

[0190] The above embodiments may also adopt the following structure.

[0191] As long as the first grounding portion 8A is provided between the high-voltage side cooling flow path HP2 closest to the outflow end of the inflow path 33 and the low-voltage side cooling flow path LP2 closest to the outflow end of the inflow path 33, the first grounding portion 8A does not necessarily have to be provided at the outflow end of the inflow path 33. In this case, the first grounding portion 8A is preferably provided on the inflow low-voltage side main path 93. In this case, the lengths of the inflow high-voltage side main path 91 and the inflow low-voltage side main path 93 may be equal.

[0192] As long as the second grounding portion 8B is provided between the high-voltage side cooling flow path HP2 closest to the inflow end of the outflow path 34 and the low-voltage side cooling flow path LP2 closest to the inflow end of the outflow path 34, the second grounding portion 8B does not necessarily have to be provided at the inflow end of the outflow path 34. In this case, the second grounding portion 8B is preferably provided on the outflow low-voltage side main path 94. In this case, the lengths of the outflow high-voltage side main path 92 and the outflow low-voltage side main path 94 may also be equal.

[0193] In this configuration, by making the high-voltage electrode modules 62 of adjacent discharge portions 60 face each other, and making the low-voltage electrode modules 61 of adjacent discharge portions 60 face each other, power consumption loss can also be reduced.

[0194] The first flow path F1, the second flow path F2, the third flow path F3, and the fourth flow path F4 may also set the resistance value using parameters other than the flow path length. As this parameter, for example, the flow path width, the resistance value of the material of the components around the flow path, etc. can be cited. That is, as described above, as long as the relationship of R1>R2 and R3>R4 is satisfied, it is also possible that the relationship of L1>L2 and L3>L4 is not satisfied, and it may also be the relationship of L1≤L2, L3≤L4.

[0195] The first convex portion 61b and the second convex portion 62b of the discharge portion 60 may also be columnar protrusions.

[0196] The heat medium in the heat medium flow path P may not be water, but a liquid such as a refrigerant or brine. The water may be pure water or tap water. Since the resistance value of each flow path varies according to the type of heat medium, it will affect the reduction effect of the above power consumption loss.

[0197] The number of discharge units DU is not limited to the above embodiments. When the number of discharge units DU is increased, the number of cooling units CU is also increased accordingly.

[0198] The shape of the discharge box 20 observed from a third direction may also be a shape other than a rectangle, for example, it may also be a circle.

[0199] In the cooling unit CU, a first cooling flow path 81 and a second cooling flow path 82 may also be formed. In this case, for example, in the cooling unit CU, the first upper flow path plate 50B and the second lower flow path plate 70D may be omitted. The cooling unit CU may be arranged adjacent to the upper side of the uppermost discharge unit DU, or adjacent to the lower side of the lowermost discharge unit DU, for example.

[0200] In the discharge unit DU of the above-described embodiment, dielectrics are provided on both the high-voltage electrode module 62 and the low-voltage electrode module 61, but a dielectric may be provided only on one of them. That is, the discharge unit DU may not be a so-called double-sided barrier type, but may be a single-sided barrier type.

[0201] As described above, the embodiments and modification examples have been described, but various changes in the embodiments or details can be made without departing from the gist and scope of the patent application. The elements of the above embodiments, modification examples, and other embodiments can also be appropriately combined or replaced.

[0202] The descriptions of "first", "second", "third",... as described above are used to distinguish the phrases to which these descriptions are given, and do not limit the number or order of these phrases.

[0203] -Industrial Applicability-

[0204] As described above, the present disclosure is useful for a discharge box and an ozone generating device.

[0205] -Symbol Explanation-

[0206] 1 Ozone generating device

[0207] 8A First grounding portion

[0208] 8B Second grounding portion

[0209] 33 Heat medium inflow path (inflow path)

[0210] 34 Heat medium outflow path (outflow path)

[0211] 60 Discharge portion

[0212] 61 Low-voltage electrode module

[0213] 61a First base portion (dielectric on the low-voltage side)

[0214] 61c Low-voltage electrode

[0215] 62 High-voltage electrode module

[0216] 62a Second base (dielectric on the high-voltage side)

[0217] 62c High-voltage electrode

[0218] 91 Inflow to the high-voltage side main path

[0219] 92 Outflow from the high-voltage side main path

[0220] 93 Inflow to the low-voltage side main path

[0221] 94 Outflow from the low-voltage side main path

[0222] 95 First bending part

[0223] 96 Second bending part

[0224] F1 First flow path

[0225] F2 Second flow path

[0226] F3 Third flow path

[0227] F4 Fourth flow path

[0228] HP High-voltage side flow path

[0229] HP2 High-voltage side cooling flow path

[0230] LP Low-voltage side flow path

[0231] LP2 Low-voltage side cooling flow path

[0232] P Heat medium flow path.

Claims

1. A discharge box for an ozone generating device, characterized in that: it includes a plurality of discharge parts (60), a heat medium flow path (P), and a grounding part (8A, 8B). Each of the discharge parts (60) has a high-voltage electrode module (62) including a high-voltage electrode (62c) and a low-voltage electrode module (61) including a low-voltage electrode (61c), and a dielectric (61a, 62a) is provided on at least one of the high-voltage electrode module (62) and the low-voltage electrode module (61), the heat medium flow path (P) allows a heat medium for cooling the discharge part (60) to flow, the grounding part (8A, 8B) is connected to the heat medium flow path (P), the heat medium flow path (P) includes an inflow path (33), a high-voltage side flow path (HP), a low-voltage side flow path (LP), and an outflow path (34), the heat medium flows into the inflow path (33), the high-voltage side flow path (HP) and the low-voltage side flow path (LP) branch out from the outflow end of the inflow path (33), the outflow ends of the high-voltage side flow path (HP) and the low-voltage side flow path (LP) are respectively connected to the outflow path (34), the high-voltage side flow path (HP) includes a plurality of high-voltage side cooling flow paths (HP2), and the plurality of high-voltage side cooling flow paths (HP2) are connected in parallel with each other in a manner adjacent to the high-voltage electrode modules (62) of the respective discharge parts (60), the low-voltage side flow path (LP) includes a plurality of low-voltage side cooling flow paths (LP2), and the plurality of low-voltage side cooling flow paths (LP2) are connected in parallel with each other in a manner adjacent to the low-voltage electrode modules (61) of the respective discharge parts (60), the grounding part (8A, 8B) is composed of a first grounding part (8A) and a second grounding part (8B), the first grounding part (8A) is provided between the high-voltage side cooling flow path (HP2) closest to the outflow end of the inflow path (33) and the low-voltage side cooling flow path (LP2) closest to the outflow end of the inflow path (33), the second grounding part (8B) is provided between the high-voltage side cooling flow path (HP2) closest to the inflow end of the outflow path (34) and the low-voltage side cooling flow path (LP2) closest to the inflow end of the outflow path (34), the resistance value of the first flow path (F1) between the first grounding part (8A) and the high-voltage side cooling flow path (HP2) closest to the first grounding part (8A) is greater than the resistance value of the second flow path (F2) between the first grounding part (8A) and the low-voltage side cooling flow path (LP2) closest to the first grounding part (8A), the resistance value of the third flow path (F3) between the second grounding part (8B) and the high-voltage side cooling flow path (HP2) closest to the second grounding part (8B) is greater than the resistance value of the fourth flow path (F4) between the second grounding part (8B) and the low-voltage side cooling flow path (LP2) closest to the second grounding part (8B).

2. The discharge box for an ozone generating device according to claim 1, characterized in that: The high-voltage electrode modules (62) of the adjacent discharge parts (60) face each other across the high-voltage side cooling flow path (HP2). The low-voltage electrode modules (61) of the adjacent discharge parts (60) face each other across the low-voltage side cooling flow path (LP2).

3. The discharge cartridge for an ozone generating device according to claim 1, characterized in that: The flow path length of the first flow path (F1) is greater than the flow path length of the second flow path (F2), The flow path length of the third flow path (F3) is greater than the flow path length of the fourth flow path (F4).

4. The discharge cartridge for an ozone generating device according to claim 1, characterized in that: The heat medium flow path (P) includes an inflow high-voltage side main path (91), an inflow low-voltage side main path (93), an outflow high-voltage side main path (92), and an outflow low-voltage side main path (94), The inflow high-voltage side main path (91) is the main path between the outflow end of the inflow path (33) and the high-voltage side cooling flow path (HP2) closest to the outflow end of the inflow path (33), The inflow low-voltage side main path (93) is the main path between the outflow end of the inflow path (33) and the low-voltage side cooling flow path (LP2) closest to the outflow end of the inflow path (33), The outflow high-voltage side main path (92) is the main path between the inflow end of the outflow path (34) and the high-voltage side cooling flow path (HP2) closest to the inflow end of the outflow path (34), The outflow low-voltage side main path (94) is the main path between the inflow end of the outflow path (34) and the low-voltage side cooling flow path (LP2) closest to the inflow end of the outflow path (34), The first grounding part (8A) is arranged at the outflow end of the inflow path (33), The second grounding part (8B) is arranged at the inflow end of the outflow path (34), The resistance value of the inflow high-voltage side main path (91) is greater than the resistance value of the inflow low-voltage side main path (93), The resistance value of the outflow high-voltage side main path (92) is greater than the resistance value of the outflow low-voltage side main path (94).

5. The discharge cartridge for an ozone generating device according to claim 4, characterized in that: The flow path length of the inflow high-voltage side main path (91) is greater than the flow path length of the inflow low-voltage side main path (93), The flow path length of the outflow high-voltage side main path (92) is greater than the flow path length of the outflow low-voltage side main path (94).

6. The discharge cartridge for an ozone generating device according to claim 5, characterized in that: The resistance value of the inflow high-voltage side main path (91) is equal to the resistance value of the outflow high-voltage side main path (92).

7. The discharge cartridge for an ozone generating device according to claim 6, characterized in that: The flow path length of the inflow high-voltage side main path (91) is equal to the flow path length of the outflow high-voltage side main path (92).

8. The discharge cartridge for an ozone generating device according to claim 5, characterized in that: Either the inflow high-pressure side main path (91) or the outflow high-pressure side main path (92) includes a bent portion (95, 96) where the flow path is bent, or both the inflow high-pressure side main path (91) and the outflow high-pressure side main path (92) include bent portions (95, 96) where the flow path is bent.

9. An ozone generation device, characterized in that: it includes a discharge box (20) for an ozone generation device according to any one of claims 1 to 8, and a supply unit (4) that supplies water having a specific resistance value of 15 [Ω·m] or more to the inflow path (33).

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