Heat transfer plate in electrochemical cell system and method for producing same

Abstract

Embodiments described herein relate to a heat transfer plate having recesses for removing heat from an electrochemical cell system. In some aspects, an electrochemical cell system may include a first electrochemical cell; a second electrochemical cell; a first planar sheet in contact with the first electrochemical cell, the first planar sheet comprising a first plurality of recesses; and a second planar sheet in contact with the second electrochemical cell, the second planar sheet extending parallel to the first planar sheet, the second planar sheet being spaced apart from the first planar sheet by a separation distance, the second planar sheet comprising a second plurality of recesses; wherein the first plurality of recesses and the second plurality of recesses are each configured to induce turbulence in an airflow flowing parallel to the first planar sheet and the second planar sheet.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 416,774, filed on October 17, 2022, entitled "Heat Transfer Plates in Electrochemical Cell Systems, and Methods of Producing the Same", the content of which is incorporated herein by reference in its entirety. Technical Field

[0003] The embodiments described herein relate to heat transfer in electrochemical cell systems. Background Art

[0004] Heat generation in electrochemical cells is a safety concern that can have dangerous consequences. Heat dissipation can lead to ignition and thermal decomposition of electrochemical cell materials. Heat can be removed from an electrochemical cell along its surface by an air or other gas flow, similar to how a fan is applied to a processor in a computer. However, in the case where the gas flows in a laminar state, heat transfer is limited. Turbulizing the gas flow can improve the heat transfer performance of the gas. Summary of the Invention

[0005] The embodiments described herein relate to a heat transfer plate having recesses for removing heat from an electrochemical cell system. In some aspects, an electrochemical cell system can include a first electrochemical cell; a second electrochemical cell; a first planar sheet in contact with the first electrochemical cell, the first planar sheet including a first plurality of recesses; and a second planar sheet in contact with the second electrochemical cell, the second planar sheet extending parallel to the first planar sheet, the second planar sheet being spaced apart from the first planar sheet by a separation distance, the second planar sheet including a second plurality of recesses; wherein the first plurality of recesses and the second plurality of recesses are both configured to cause turbulence in an air flow flowing parallel to the first planar sheet and the second planar sheet. Brief Description of the Drawings

[0006] Figure 1 is a block diagram of an electrochemical cell system according to an embodiment.

[0007] Figures 2A - 2H Shows an illustration of an electrochemical cell system according to an embodiment and its various components.

[0008] Figures 3A - 3CShows a heat transfer plate according to an embodiment.

[0009] Figures 4A - 4D Shows a heat transfer plate according to an embodiment.

[0010] Figure 5 Is a heat transfer coefficient diagram of the air flow in the presence of a heat transfer plate with diamond-shaped recesses.

[0011] Figure 6 Is a heat transfer coefficient diagram of the air flow in the presence of a heat transfer plate with a wavy outer shape recess.

[0012] Figures 7A - 7B Shows the negative space between heat transfer plates with teardrop-shaped recesses and the associated heat transfer coefficient diagram of the air flow in the presence of the heat transfer plates.

[0013] Figures 8A - 8B Shows the negative space between heat transfer plates with circular tetrahedral-shaped recesses and the associated grid, and the heat transfer coefficient diagram of the air flow in the presence of the heat transfer plates.

[0014] Figures 9A - 9B Shows the negative space between heat transfer plates with circular tetrahedral-shaped recesses and the associated grid, and the heat transfer coefficient diagram of the air flow in the presence of the heat transfer plates. Detailed Description

[0015] The embodiments described herein relate to an electrochemical cell unit system having a heat transfer mechanism and a method for producing the same. Systems and arrays of electrochemical cell units may have channels or passages for the flow of gas (e.g., air) or any other form of fluid flow disposed between the electrochemical cell units. The gas flows through the array of electrochemical cell units and carries away heat from the electrochemical cell units, thereby maintaining the temperature within the electrochemical cell unit system and preventing heat dissipation. Unless a large amount of energy is applied to distribute the air flow, the air flow flows in a laminar state between the electrochemical cell units. Heat transfer is directly related to the Reynolds number. Therefore, if the gas flow becomes turbulent, the amount of heat transferred from the electrochemical cell units and into the gas increases. Adding a plate with recesses near the electrochemical cell units helps to make the gas flow turbulent and improve heat transfer.

[0016] The recesses described herein can improve the heat exchange performance of the electrochemical cell unit system. These recesses can rotate the gas flow at high speed along the x, y, and / or z axes in the local coordinates of the system. The recesses are geometrically designed to generate high 3D turbulence. The recess shape can be in the form of a tetrahedron such that the base triangle and the top triangle have different areas, causing all the side edges to be inclined and at different inclination angles. The shape of the recesses can maximize the heat transfer film coefficient.

[0017] The recesses described herein can be implemented in very thick and large battery cells (VT battery cells), batteries, battery packs, cold plates, energy storage systems, and / or mobile power grids (MPGs). The recesses described herein can be designed to be integrated with flow equalizer technology (FRE) for systems as small as individual electrochemical battery cells. The MPG can also implement turbulence enhancer technology and FRE for battery cells, modules, batteries, battery pack racks, high voltage units, and energy storage systems.

[0018] In some embodiments, the electrodes described herein can include conventional solid electrodes. In some embodiments, the solid electrodes can include binders. In some embodiments, the electrodes described herein can include semi-solid electrodes. The semi-solid electrodes described herein can be made to be: (i) thicker (e.g., greater than 100 μm - up to 2,000 μm or even greater) due to the reduced tortuosity and higher conductivity of the semi-solid electrodes, (ii) have a higher active material loading, and (iii) have a simplified manufacturing process that utilizes less equipment. These relatively thick semi-solid electrodes reduce the volume, mass, and cost contributions of the inactive components relative to the active components, thereby enhancing the commercial attractiveness of the batteries made from the semi-solid electrodes. In some embodiments, the semi-solid electrodes described herein are binder-free and / or do not use the binders used in conventional battery manufacturing. Instead, the electrode volume that is typically occupied by the binder in a conventional electrode is now occupied by: 1) an electrolyte, which has the effect of reducing tortuosity and increasing the total salt available for ion diffusion, thereby offsetting the typical salt loss effect of thick conventional electrodes when used at high rates, 2) an active material, which has the effect of increasing the charge capacity of the battery, or 3) a conductive additive, which has the effect of increasing the conductivity of the electrode, thereby offsetting the high internal resistance of thick conventional electrodes. The reduced tortuosity and higher electronic conductivity of the semi-solid electrodes described herein result in excellent rate performance and charge capacity of the electrochemical battery cells formed from the semi-solid electrodes. Since the semi-solid electrodes described herein can be made much thicker than conventional electrodes, the ratio of active material (i.e., semi-solid cathode and / or anode) to inactive material (i.e., current collector and separator) in the batteries formed from stacks of electrochemical battery cells including semi-solid electrodes can be much higher than in similar batteries formed from stacks of electrochemical battery cells including conventional electrodes. This significantly increases the total charge capacity and energy density of the batteries including the semi-solid electrodes described herein.

[0019] In some embodiments, the electrode materials described herein can be flowable semi-solid or gelled liquid compositions. In some embodiments, the electrode materials described herein can be binder-free or substantially binder-free. A flowable semi-solid electrode can include a suspension of electrochemically active materials (anode or cathode particles or microparticles) and optionally an electronically conductive material (e.g., carbon) in a non-aqueous liquid electrolyte. In other words, the active electrode particles and the conductive particles are co-suspended in the electrolyte to produce a semi-solid electrode. Examples of battery architectures utilizing semi-solid suspensions are described in International Patent Publication No. WO 2012 / 024499, entitled "Stationary, Fluid Redox Electrode," and International Patent Publication No. WO 2012 / 088442, entitled "Semi-Solid Filled Battery and Method of Manufacture," the entire disclosures of which are hereby incorporated by reference.

[0020] As used in this specification, unless the context clearly indicates otherwise, the singular forms "a / an" and "the" include plural referents. Thus, for example, the term "member" is intended to mean a single member or a combination of members, and the term "material" is intended to mean one or more materials or combinations thereof.

[0021] When used in connection with "cylindrical," "linear," and / or other geometric relationships, the term "substantially" is intended to convey that the structure so qualified is nominally cylindrical, linear, etc. As an example, a portion of a support member described as "substantially linear" is intended to convey that while linearity of the portion is desired, some non-linearity may be present in the "substantially linear" portion. Such non-linearity can be produced by manufacturing tolerances or other practical considerations such as, for example, pressure or force applied to the support member. Thus, a geometric structure modified by the term "substantially" includes such geometric properties within a tolerance range of plus or minus 5% of the geometric structure. For example, a "substantially linear" portion is a portion where the linearity error defining the axis or centerline is within plus or minus 5%.

[0022] As used herein, the terms "group" and "plurality" can refer to multiple features or a single feature having multiple parts. For example, when referring to a group of electrodes, the group of electrodes can be considered as one electrode having multiple parts, or the group of electrodes can be considered as multiple different electrodes. Additionally, for example, when referring to a plurality of electrochemical cell units, the plurality of electrochemical cell units can be considered as multiple different electrochemical cell units or as one electrochemical cell unit having multiple parts. Thus, a group of parts or a plurality of parts can include multiple parts that are contiguous or non-contiguous with each other. A plurality of particles or a plurality of materials can also be made from multiple articles that are produced separately and subsequently joined together (e.g., via mixing, adhesives, or any suitable method).

[0023] As used herein, the term "semi-solid" refers to a material that is a mixture of a liquid phase and a solid phase, e.g., a particulate suspension, a slurry, a colloidal suspension, an emulsion, a gel, or a micelle.

[0024] Figure 1 is a block diagram of an electrochemical cell unit system 100 according to an embodiment. As shown, the electrochemical cell unit system 100 includes a first electrochemical cell unit 110a, a second electrochemical cell unit 110b (collectively referred to as electrochemical cell units 110), a heat transfer plate 120a coupled to the electrochemical cell unit 110a, and a heat transfer plate 120b coupled to the electrochemical system 110b. In some embodiments, the electrochemical cell unit system 100 may further include a housing for encapsulating the assembly (i.e., the electrochemical cell units 110, the heat transfer plates 120a, 120b). The heat transfer plate 120a includes recesses 122a-i and 122a-ii, while the heat transfer plate 120b includes recesses 122b-i and 122b-ii.

[0025] In some embodiments, the electrochemical cell unit 110 may be the same as or substantially similar to the electrochemical cell unit described in U.S. Patent No. 10,181,587 ('587 patent') titled "Single Pouch Battery Cells and Methods of Manufacture" filed on June 17, 2016, the disclosure of which is hereby incorporated by reference in its entirety. Each electrochemical cell unit in the electrochemical cell unit 110 may include an anode material disposed on an anode current collector, a cathode material disposed on a cathode current collector, and a separator disposed between the anode material and the cathode material. The separator may be large enough such that a portion of the separator extends beyond the outer edges of the anode material and the cathode material. The electrochemical cell unit 110 may further include a pouch material that at least partially encapsulates the anode material, the anode current collector, the cathode material, the cathode current collector, and the separator. In some embodiments, the pouch material may contact the anode current collector, the cathode current collector, and / or the separator. The pouch material may be large enough such that a portion of the pouch material extends beyond the outer boundary of the separator. To minimize the unused space in the electrochemical cell unit module, the pouch material and the separator may be folded relative to the anode material and the cathode material rather than extending outward from the anode material and the cathode material.

[0026] Figures 2A - 2H FIG. shows an illustration of an electrochemical cell unit system 200 and its various components according to an embodiment. Figure 2A FIG. shows an application of a cross-section of the electrochemical system 200, which includes an array of electrochemical cell units 210a, 210b, 210c, 210d, 210e, 210f, 210g, 210h, 210i, 210j (collectively referred to as electrochemical cell units 210), and heat transfer plates 220a and 220b each including recesses 222a and 222b on the surfaces of the heat transfer plates 220a and 220b. In some embodiments, the electrochemical cell units 210, the heat transfer plates 220a, 220b, and the recesses 222a, 222b may be the same as or substantially similar to the electrochemical cell units 110, the heat transfer plates 120a, 120b, and the recesses 122a-i, 122a-ii, 122b-i, 122b-ii described above with reference to Figure 1 Those described. Accordingly, certain aspects of the electrochemical cell units 210, the heat transfer plates 220a, 220b, and the recesses 222a, 222b are not described in detail herein.

[0027] The heat transfer plates 220a are coupled to an array of electrochemical cell units 210a, 210b, 210c, 210d, 210e, while the heat transfer plates 220b are coupled to an array of electrochemical cell units 210f, 210g, 210h, 210i, 210j. Heat generated during operation of the electrochemical cell units 210a, 210b, 210c, 210d, 210e and 210f, 210g, 210h, 210i, 210j is transferred to the heat transfer plates 220a and 220b by conduction, convection and / or radiation respectively. The heat transfer plates 220a and 220b are placed closely adjacent to each other facing each other such that a channel is formed therebetween. In some embodiments, air can flow through the channel between the heat transfer plates 220a, 220b to dissipate heat. In some embodiments, the heat transfer plates can dissipate heat by convection, radiation or a combination thereof.

[0028] As shown, the heat transfer plates 220a and 220b are separated by a distance d. In some embodiments, d can be at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 2 cm, at least about 3 cm, at least about 4 cm, at least about 5 cm, at least about 6 cm, at least about 7 cm, at least about 8 cm, or at least about 9 cm. In some embodiments, d can be no more than about 10 cm, no more than about 9 cm, no more than about 8 cm, no more than about 7 cm, no more than about 6 cm, no more than about 5 cm, no more than about 4 cm, no more than about 3 cm, no more than about 2 cm, no more than about 1 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, no more than about 2 mm, no more than about 1 mm, no more than about 900 μm, no more than about 800 μm, no more than about 700 μm, no more than about 600 μm, no more than about 500 μm, no more than about 400 μm, no more than about 300 μm, no more than about 200 μm. Combinations of the d values mentioned above are also possible (e.g., at least about 100 μm and no more than about 10 cm or at least about 1 mm and no more than about 1 cm), including all values and ranges therebetween. In some embodiments, d can be about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 2 cm, about 3 cm, about 4 cm, about 5 cm, about 6 cm, about 7 cm, about 8 cm, about 9 cm, or about 10 cm.

[0029] In some embodiments, the electrochemical cell unit 210 can be oriented such that the anode and cathode extend parallel or substantially parallel to the heat transfer plates 220a, 220b. In some embodiments, the electrochemical cell unit 210 can be oriented such that the anode and cathode extend perpendicular to the heat transfer plates 220a, 220b. In some embodiments, the thickness of the heat transfer plates 220a, 220b can be at least about 50 μm, at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, or at least about 9 mm. In some embodiments, the thickness of the heat transfer plates 220a, 220b can be no more than about 10 mm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, no more than about 2 mm, no more than about 1 mm, no more than about 900 μm, no more than about 800 μm, no more than about 700 μm, no more than about 600 μm, no more than about 500 μm, no more than about 400 μm, no more than about 300 μm, or no more than about 200 μm. Combinations of the above-mentioned thicknesses of the heat transfer plates 220a, 220b are also possible (e.g., at least about 100 μm and no more than about 10 mm or at least about 500 μm and no more than about 5 mm), including all values and ranges therebetween. In some embodiments, the thickness of the heat transfer plates 220a, 220b can be about 50 μm, about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, or about 10 mm.

[0030] In some embodiments, heat dissipation from the heat transfer plates 220a and 220b can occur through a heat transfer fluid other than air. In some embodiments, the heat transfer fluid can include a liquid. In some embodiments, the heat transfer fluid can include an inert gas. In some embodiments, the heat transfer fluid can include air, nitrogen, argon, helium, or any combination thereof. In some embodiments, the heat transfer fluid can include an organic liquid. In some embodiments, the heat transfer fluid can include a liquid that does not react with lithium.

[0031] In some embodiments, the volumetric flow rate of fluid flow in the channel between heat transfer plates 220a, 220b can be at least about 0.01 cubic centimeters per minute, at least about 0.05 cubic centimeters per minute, at least about 0.1 cubic centimeters per minute, at least about 0.5 cubic centimeters per minute, at least about 1 cubic centimeters per minute, at least about 5 cubic centimeters per minute, at least about 10 cubic centimeters per minute, at least about 50 cubic centimeters per minute, at least about 100 cubic centimeters per minute, at least about 500 cubic centimeters per minute, at least about 1,000 cubic centimeters per minute, at least about 5,000 cubic centimeters per minute, at least about 10,000 cubic centimeters per minute, at least about 50,000 cubic centimeters per minute, at least about 100,000 cubic centimeters per minute, at least about 500,000 cubic centimeters per minute, at least about 1,000,000 cubic centimeters per minute, at least about 5,000,000 cubic centimeters per minute, at least about 10,000,000 cubic centimeters per minute, at least about 50,000,000 cubic centimeters per minute or at least about 60,000,000 cubic centimeters per minute. In some embodiments, the volumetric flow rate of fluid flow in the channel between heat transfer plates 220a, 220b can be no more than about 60,000,000 cubic centimeters per minute, no more than about 10,000 cubic centimeters per minute, no more than about 5,000 cubic centimeters per minute, no more than about 1,000 cubic centimeters per minute, no more than about 500 cubic centimeters per minute, no more than about 100 cubic centimeters per minute, no more than about 50 cubic centimeters per minute, no more than about 10 cubic centimeters per minute, no more than about 5 cubic centimeters per minute, no more than about 1 cubic centimeters per minute, no more than about 0.5 cubic centimeters per minute, no more than about 0.1 cubic centimeters per minute or no more than about 0.05 cubic centimeters per minute. Combinations of the volumetric flow rates mentioned above are also possible (e.g., at least about 0.01 cubic centimeters per minute and no more than about 10,000 cubic centimeters per minute or at least about 1 cubic centimeters per minute and no more than about 500 cubic centimeters per minute), including all values and ranges therebetween.In some embodiments, the volumetric flow rate of the fluid flowing in the channel between the heat transfer plates 220a, 220b can be about 0.01 cubic centimeters per minute, about 0.05 cubic centimeters per minute, about 0.1 cubic centimeters per minute, about 0.5 cubic centimeters per minute, about 1 cubic centimeter per minute, about 5 cubic centimeters per minute, about 10 cubic centimeters per minute, about 50 cubic centimeters per minute, about 100 cubic centimeters per minute, about 500 cubic centimeters per minute, about 1,000 cubic centimeters per minute, about 5,000 cubic centimeters per minute, about 10,000 cubic centimeters per minute, about 50,000 cubic centimeters per minute, about 100,000 cubic centimeters per minute, about 500,000 cubic centimeters per minute, about 1,000,000 cubic centimeters per minute, about 5,000,000 cubic centimeters per minute, about 10,000,000 cubic centimeters per minute, about 50,000,000 cubic centimeters per minute or about 60,000,000 cubic centimeters per minute.

[0032] In some embodiments, the electrochemical cell units 210 can be arranged in rows and columns on either side of the channel. In some embodiments, the electrochemical cell units can be arranged in an array of p rows by q columns, where the channel extends between each column, and the heat transfer plates are positioned on either side of each channel. In some embodiments, p and / or q can be about 2, about 3, about 4, about 5, about 6, about 7, about 8, about 9, about 10, about 11, about 12, about 13, about 14, about 15, about 16, about 17, about 18, about 19, about 20, about 25, about 30, about 35, about 40, about 45, about 50, about 55, about 60, about 65, about 70, about 75, about 80, about 85, about 90, about 95 or about 100, including all values and ranges therebetween. In some embodiments, the electrochemical cell unit system 200 can include an array of separators (not shown) that separate the flow of the heat transfer fluid between different groups of the electrochemical cell units 210. The separators can be positioned such that an equal or approximately equal amount of the heat transfer fluid flows through each channel.

[0033] In some embodiments, the average velocity of fluid flow in the channel between heat transfer plates 220a, 220b can be at least about 0.1 m / s, at least about 0.2 m / s, at least about 0.3 m / s, at least about 0.4 m / s, at least about 0.5 m / s, at least about 0.6 m / s, at least about 0.7 m / s, at least about 0.8 m / s, at least about 0.9 m / s, at least about 1 m / s, at least about 2 m / s, at least about 3 m / s, at least about 4 m / s, at least about 5 m / s, at least about 6 m / s, at least about 7 m / s, at least about 8 m / s, at least about 9 m / s, at least about 10 m / s, at least about 20 m / s, at least about 30 m / s, at least about 40 m / s, at least about 50 m / s, at least about 60 m / s, at least about 70 m / s, at least about 80 m / s, or at least about 90 m / s. In some embodiments, the average velocity of fluid flow in the channel between heat transfer plates 220a, 220b can be no more than about 100 m / s, no more than about 90 m / s, no more than about 80 m / s, no more than about 70 m / s, no more than about 60 m / s, no more than about 50 m / s, no more than about 40 m / s, no more than about 30 m / s, no more than about 20 m / s, no more than about 10 m / s, no more than about 9 m / s, no more than about 8 m / s, no more than about 7 m / s, no more than about 6 m / s, no more than about 5 m / s, no more than about 4 m / s, no more than about 3 m / s, no more than about 2 m / s, no more than about 1 m / s, no more than about 0.9 m / s, no more than about 0.8 m / s, no more than about 0.7 m / s, no more than about 0.6 m / s, no more than about 0.5 m / s, no more than about 0.4 m / s, no more than about 0.3 m / s, or no more than about 0.2 m / s. Combinations of the average velocities mentioned above are also possible (e.g., at least about 0.1 m / s and no more than about 100 m / s or at least about 1 m / s and no more than about 10 m / s), including all values and ranges therebetween. In some embodiments, the average velocity of fluid flow in the channel between heat transfer plates 220a, 220b can be about 0.1 m / s, about 0.2 m / s, about 0.3 m / s, about 0.4 m / s, about 0.5 m / s, about 0.6 m / s, about 0.7 m / s, about 0.8 m / s, about 0.9 m / s, about 1 m / s, about 2 m / s, about 3 m / s, about 4 m / s, about 5 m / s, about 6 m / s, about 7 m / s, about 8 m / s, about 9 m / s, about 10 m / s, about 20 m / s, about 30 m / s, about 40 m / s, about 50 m / s, about 60 m / s, about 70 m / s, about 80 m / s, about 90 m / s, or about 100 m / s.

[0034] The heat transfer plates 220a, 220b include an array of recesses 222a, 222b (collectively referred to as recesses 222) on their surfaces. In some embodiments, when viewed from the channels between the electrochemical cell units 210a, 210b, 210c, 210d, 210e, the recesses 222 may appear as protrusions, and when viewed from the electrochemical cell units 210a, 210b, 210c, 210d, 210e, they may appear as depressions (or hollow portions). In some embodiments, when viewed from the channels between the electrochemical cell units 210f, 210g, 210h, 210i, 210j, the recesses 222 may appear as protrusions, and when viewed from the electrochemical cell units 210f, 210g, 210h, 210i, 210j, they may appear as depressions. In some embodiments, the recesses 222 may appear as protrusions on surfaces that are substantially flat and face the fluid flow channels and the array of the electrochemical cell units 210a, 210b, 210c, 210d, 210e or the array of the electrochemical cell units 210f, 210g, 210h, 210i, 210j, respectively. In some embodiments, the recess 222a may contact the heat transfer plate 220b. In some embodiments, the recess 222b may contact the heat transfer plate 220a.

[0035] In some embodiments, the recesses 222 may provide a larger surface area to enhance heat transfer between the heat transfer plates 220a, 220b (collectively referred to as heat transfer plates 220) and the heat transfer fluid, and / or impede or enhance the rate of fluid flowing through the channels between the heat transfer plates 220a, 220b. In some embodiments, the recesses 222 on the surface of the heat transfer plate 220 facing the fluid flow channels cause turbulence in the fluid flow through the channels. In some embodiments, the turbulence in the fluid flow enhances the heat transfer rate between the heat transfer plate 220 and the heat transfer fluid.

[0036] In some embodiments, the recesses 222 may be arranged uniformly and symmetrically on the heat transfer plates 220a, 220b. In some embodiments, the recesses 222 may be arranged randomly on the heat transfer plates 220a, 220b. In some embodiments, the recesses 222 may have various shapes, heights / depths, and the spacing therebetween, as described below. In some embodiments, the recesses 222 on the surface of the heat transfer plate 220 may be aligned or staggered to achieve the desired impedance and / or turbulence in the fluid flow path. In some embodiments, the arrays of the recesses 222 on the surfaces of the heat transfer plates 220a and 220b may be aligned or offset relative to each other to achieve the desired impedance and / or turbulence in the fluid flow path, and thus achieve the desired heat transfer rate.

[0037] Figure 2B Shown is from the heat transfer plate 220b( Figure 2Bthe overlap and spatial orientation of the recess 222b (not shown in []) with the heat transfer plate 220a ( Figure 2A not shown in []). In other words, Figure 2B the spacing between the recesses 222a, 222b is shown, while the heat transfer plates 220 including the recesses 222a, 222b are not shown. As shown, the recess 222a has a triangular base and is arranged in 9 rows and 6 columns, while the recess 222b has a triangular base and is arranged in 8 rows and 5 columns. Adjacent rows are offset by half of the spacing distance between two adjacent columns. As shown, the exemplary plate size is 160 unit widths and 240 unit lengths. The spacing between adjacent columns of the protrusions is 25 units, and the offset distance between adjacent rows is equal to 12.5 units. One unit in this example is equal to 25.4 microns.

[0038] When the heat transfer fluid passes through the recesses 222, the recesses 222 can induce turbulence in the heat transfer fluid. The recesses 222 can generate local eddies whose velocities are the following multiples of the overall velocity of the heat transfer fluid: at least about 1.5 times, at least about 2 times, at least about 2.5 times, at least about 3 times, at least about 3.5 times, at least about 4 times, at least about 4.5 times, at least about 5 times, at least about 6 times, at least about 7 times, at least about 8 times, at least about 9 times, at least about 10 times, at least about 11 times, at least about 12 times, at least about 13 times, at least about 14 times, at least about 15 times, at least about 16 times, at least about 17 times, at least about 18 times, at least about 19 times, or at least about 20 times, including all values and ranges therebetween.

[0039] Figure 2C A 3D rendering of the heat transfer plate 220a with a rectangular array of recesses 222a is shown. This particular exemplary embodiment depicts a total of 54 recesses in the protrusions of a 9x6 rectangular array, with no offset between rows or columns. Figure 2D is an exemplary 3D rendering of the second heat transfer plate 220b with a rectangular array of recesses 222b placed in front of the first heat transfer plate 220a. This particular exemplary embodiment depicts a total of 40 protrusions in the protrusions of an 8x5 rectangular array, with no offset between rows or columns. As a combination, two exemplary embodiments of the first heat transfer plate 220a and the second heat transfer plate 220b show an exemplary embodiment where the recesses on the two plates are not mirror images of each other. This lack of mirroring can help couple these heat transfer plates 220 together and can induce turbulence in the airflow through the channel between the two heat transfer plates 220. In other words, if the recess 222a is not aligned with the recess 222b, when the heat transfer plates 220 are brought together, the recess 222a can fit into the space between the recesses 222b (and vice versa).

[0040] In some embodiments, the recesses 222 may be arranged in an m x n array of recesses 222 on each of the transfer plates in the transfer plate. In some embodiments, m and / or n may be about 2, about 3, about 4, about 5, about 6, about 7, about 8, about 9, about 10, about 11, about 12, about 13, about 14, about 15, about 16, about 17, about 18, about 19, about 20, about 21, about 22, about 23, about 24, about 25, about 26, about 27, about 28, about 29, about 30, about 31, about 32, about 33, about 34, about 35, about 36, about 37, about 38, about 39, about 40, about 41, about 42, about 43, about 44, about 45, about 46, about 47, about 48, about 49, or about 50, including all values and ranges therebetween.

[0041] In some embodiments, the horizontal distance dh between the recesses 222 on their respective heat transfer plates 220 may be at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 1.5 cm, at least about 2 cm, at least about 2.5 cm, or at least about 3 cm. In some embodiments, the horizontal distance dh between the recesses 222 on their respective heat transfer plates 220 may not exceed about 3 cm, not exceed about 2.5 cm, not exceed about 2 cm, not exceed about 1.5 cm, not exceed about 1 cm, not exceed about 9 mm, not exceed about 8 mm, not exceed about 7 mm, not exceed about 6 mm, not exceed about 5 mm, not exceed about 4 mm, not exceed about 3 mm, not exceed about 2 mm, not exceed about 1 mm, not exceed about 900 μm, not exceed about 800 μm, not exceed about 700 μm, not exceed about 600 μm, not exceed about 500 μm, not exceed about 400 μm, not exceed about 300 μm, or not exceed about 200 μm. Combinations of the distances mentioned above are also possible (e.g., at least about 100 μm and not exceed about 3 cm or at least about 500 μm and not exceed about 5 mm), including all values and ranges therebetween. In some embodiments, the horizontal distance dh between the recesses 222 on their respective heat transfer plates 220 may be about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 1.5 cm, about 2 cm, about 2.5 cm, about 3 cm.

[0042] In some embodiments, the vertical distance dv between the recesses 222 on their respective heat transfer plates 220 can be at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 1.5 cm, at least about 2 cm, at least about 2.5 cm, or at least about 3 cm. In some embodiments, the vertical distance dv between the recesses 222 on their respective heat transfer plates 220 can be no more than about 3 cm, no more than about 2.5 cm, no more than about 2 cm, no more than about 1.5 cm, no more than about 1 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, no more than about 2 mm, no more than about 1 mm, no more than about 900 μm, no more than about 800 μm, no more than about 700 μm, no more than about 600 μm, no more than about 500 μm, no more than about 400 μm, no more than about 300 μm, or no more than about 200 μm. Combinations of the distances mentioned above are also possible (e.g., at least about 100 μm and no more than about 3 cm or at least about 500 μm and no more than about 5 mm), including all values and ranges therebetween. In some embodiments, the vertical distance dv between the recesses 222 on their respective heat transfer plates 220 can be about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 1.5 cm, about 2 cm, about 2.5 cm, or about 3 cm.

[0043] In some embodiments, the material of the heat transfer plate 220 can be metal, alloy, ceramic, composite material, polymer, or a combination thereof. In some embodiments, the material of the heat transfer plate 220 can include metal matrix composite material, cermet composite material, or carbon composite material. In some embodiments, the material of the heat transfer plate can include carbon steel, copper, nickel, copper-nickel alloy (90 / 10 copper-nickel alloy, 80 / 20 copper-nickel alloy, 70 / 30 copper-nickel alloy), Inconel, Incoloy, Admiralty Brass, stainless steel (304 / L stainless steel, 316 / L stainless steel, 317 / L stainless steel, 321 / L stainless steel), duplex steel, Alloy 20 (nickel-chromium-molybdenum), Monel 400, Hastelloy B, Hastelloy C, titanium, aluminum, Nickel 200, Al-6XN Superaustenitic Stainless Steel, brass (70Cu-30 Zn), aluminum brass (76Cu-22Zn-2Al), red brass (85Cu-15Zn), carbon molybdenum (0.5Mo), chrome molybdenum steel, lead, zinc, tungsten, silicon carbide, aluminum nitride, graphite, polypropylene, or a combination thereof.

[0044] In some embodiments, the thermal conductivity of the material of the heat transfer plate 220 can be at least about 0.1 W / m-K, at least about 0.5 W / m-K, 1 W / m-K, at least about 5 W / m-K, 10 W / m-K, at least about 50 W / m-K, 100 W / m-K, at least about 500 W / m-K, at least about 1,000 W / m-K, or at least about 2,500 W / m-K. In some embodiments, the thermal conductivity of the material of the heat transfer plate 220 can be no more than about 5,000 W / m-K, no more than about 2,500 W / m-K, no more than about 1,000 W / m-K, no more than about 500 W / m-K, no more than about 100 W / m-K, no more than about 50 W / m-K, no more than about 10 W / m-K, no more than about 5 W / m-K, no more than about 1 W / m-K, or no more than about 0.5 W / m-K.

[0045] In some embodiments, the recesses 222 on the surface of the heat transfer plate 220 can be made of a material with a thermal conductivity different from the rest of the heat transfer plate 220. In some embodiments, the material of the heat transfer plate 220 is resistant to corrosion that may be caused by any potential leakage of compounds from the electrochemical cell unit 210 or the heat transfer fluid. In some embodiments, the material of the heat transfer plate 220 is resistant to wear that may be caused by the flow of the heat transfer fluid. In some embodiments, the heat transfer plate 220 can have a coating with a thermal conductivity different from the rest of the heat transfer plate 220.

[0046] Figure 2EIt is a diagram of a single concave portion 222a in the shape of a polyhedron. The polyhedron shape defining the concave portion 222a is defined by: a base shape coplanar with the plane of the heat transfer plate, a height defining the perpendicular distance from the farthest tip of the polyhedron to the base of the polyhedron, a specified number of edges, the angle of the edges relative to the base, the shape of the polyhedron edges, the shape of the polyhedron edges, and the shape of the polyhedron corners. As shown, the polyhedron has a triangular distal surface and three rectangular surfaces that adjoin the triangular surface to the surface of the heat transfer plate 220a. In some embodiments, each of the corners of the polyhedron may protrude the same or approximately the same distance from the surface of the heat transfer plate 220a. In some embodiments, each of the corners of the polyhedron may protrude different distances from the surface of the heat transfer plate 220a.

[0047] In some embodiments, the base of the polyhedron defining the concave portion 222a may be triangular, square, rectangular, parallelogram, rhomboid, rhombus, or other polygon. In some embodiments, the base of the polyhedron may be a polygon having a plurality of sides (e.g., about 3, about 4, about 5, about 6, about 7, about 8, about 9, about 10, about 11, about 12, about 13, about 14, about 15, about 16, about 17, about 18, about 19, or about 20, including all values and ranges therebetween). In some embodiments, the base of the polyhedron may be a regular polygon or an irregular polygon. In some embodiments, the base of the concave portion 222a may have a circular, oval, ovoid, semi-circular, semi-elliptical, pointed ovoid, or other circular shape.

[0048] In some embodiments, the height of the polyhedron defining the concave portion 222a may be in the range between about 10 μm and about 10 mm. In some embodiments, each of the concave portions 222 may have the same height. In some embodiments, the concave portions 222 may have varying or inconsistent heights.

[0049] In some embodiments, the polyhedron defining the recess 222a can have at least about 4 surfaces including a base. In some embodiments, the polyhedron can have more than 4 surfaces. In some embodiments, the polyhedron has a plurality of surfaces between 3 and 20. In some embodiments, different recesses 222 in the array have different numbers of surfaces. In some embodiments, the polyhedron defining the recess 222a can be an irregular polyhedron. In some embodiments, the angles between the surfaces of the polyhedron can be acute angles. In some embodiments, the angles between the surfaces of the polyhedron can be obtuse angles. In some embodiments, the surfaces of the polyhedron can be arranged in an "inclined" manner such that at least one of the surfaces of the polyhedron is accessible to the air flow in the channel between the two heat transfer plates 220. In other words, one or more surfaces of the polyhedron can be seen from the x-y plane, the x-z plane, and the y-z plane. In some embodiments, the surfaces of the polyhedron can be at an acute angle relative to the base of the polyhedron. In some embodiments, at least one of the edges of the polyhedron can be at an obtuse angle relative to the base of the polyhedron. In some embodiments, the surfaces of the polyhedron are distorted or curved relative to each other. In some embodiments, at least one of the edges of the polyhedron can be non-planar. In some embodiments, the shape and height of the polyhedron are designed to cause maximum turbulence in the flow of the heat transfer fluid in the channel between the heat transfer plates 220.

[0050] In some embodiments, the edges of the polyhedron surface can be sharp edges. In some embodiments, at least one of the edges of the polyhedron surface can be rounded. In some embodiments, at least one of the edges of the polyhedron surface can be chamfered. In some embodiments, at least one of the edges of the polyhedron surface can be circular. In some embodiments, the corners of the polyhedron can be sharp corners. In some embodiments, at least one of the corners of the polyhedron can be rounded. In some embodiments, at least one of the corners of the polyhedron can be chamfered. In some embodiments, at least one of the corners of the polyhedron can be circular. In some embodiments, the edges of the polyhedron can be shaped to cause maximum turbulence in the air flow through the channel between the two heat transfer plates.

[0051] Figure 2F An example embodiment of a 3-D rendering of the polyhedral recess 222a is shown. As shown, one of the faces of the polyhedron is an inclined face. Figure 2E Rounded edges and corners are also shown. Figure 2F The underside of a 3-D rendering of the polyhedron defining the recess 222a is shown such that the recess 222a looks like a depression.

[0052] Figure 2GAn example embodiment showing a 3-D rendering of a concave portion 222b in the shape of a polyhedron is presented. As shown, the polyhedron has three edges, one of which is a bevel edge. The edges of different sides of the polyhedron are shown as s1 and s2, and the thicknesses are shown as t1, t2, and t3. As seen from Figure 2G what is seen, for a particular side of the polyhedron, the lengths of the opposing edges s1 and s2 may not be equal. Similarly, the lengths of the opposing edges may have different thicknesses t1 and t2.

[0053] In some embodiments, t1, t2, and / or t3 may be at least about 10 μm, at least about 20 μm, at least about 30 μm, at least about 40 μm, at least about 50 μm, at least about 60 μm, at least about 70 μm, at least about 80 μm, at least about 90 μm, at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, or at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 7 mm, at least about 9 mm, or at least about 10 mm. In some embodiments, t1, t2, and / or t3 may not exceed about 10 mm, not exceed about 9 mm, not exceed about 8 mm, not exceed about 7 mm, not exceed about 6 mm, not exceed about 5 mm, not exceed about 4 mm, not exceed about 3 mm, not exceed about 2 mm, not exceed about 1 mm, not exceed about 900 μm, not exceed about 800 μm, not exceed about 700 μm, not exceed about 600 μm, not exceed about 500 μm, not exceed about 400 μm, not exceed about 300 μm, not exceed about 200 μm, not exceed about 100 μm, not exceed about 90 μm, not exceed about 80 μm, not exceed about 70 μm, not exceed about 60 μm, not exceed about 50 μm, not exceed about 40 μm, not exceed about 30 μm, or not exceed about 20 μm. Combinations of the lengths of t1, t2, and / or t3 mentioned above are also possible (e.g., at least about 10 μm and not exceeding about 10 mm or at least about 100 μm and not exceeding about 1 mm), including all values and ranges therebetween. In some embodiments, t1, t2, and / or t3 may be about 10 μm, about 20 μm, about 30 μm, about 40 μm, about 50 μm, about 60 μm, about 70 μm, about 80 μm, about 90 μm, about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 10 mm.

[0054] In some embodiments, s1 and / or s2 can be at least about 50 μm, at least about 60 μm, at least about 70 μm, at least about 80 μm, at least about 90 μm, at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 1.5 cm, at least about 2 cm, at least about 2.5 cm, or at least about 3 cm. In some embodiments, s1 and / or s2 can be no more than about 3 cm, no more than about 2.5 cm, no more than about 2 cm, no more than about 1.5 cm, no more than about 1 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, no more than about 2 mm, no more than about 1 mm, no more than about 900 μm, no more than about 800 μm, no more than about 700 μm, no more than about 600 μm, no more than about 500 μm, no more than about 400 μm, no more than about 300 μm, no more than about 200 μm, no more than about 100 μm, no more than about 90 μm, no more than about 80 μm, no more than about 70 μm, or no more than about 60 μm. Combinations of the lengths of s1 and / or s2 mentioned above are also possible (e.g., at least about 50 μm and no more than about 3 cm or at least about 1 mm and no more than about 5 mm), including all values and ranges therebetween. In some embodiments, s1 and / or s2 can be about 50 μm, about 60 μm, about 70 μm, about 80 μm, about 90 μm, about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 1.5 cm, about 2 cm, about 2.5 cm, or about 3 cm.

[0055] As shown in Figure 2G the edges between two sides of the polyhedron are rounded, and the corners of the polyhedron are circular. Figure 2H Different views of a 3-D rendering of the polyhedron defining the protrusion 222b are shown. As can be seen in the figure, rounded edges, rounded corners, and chamfers are present in the protrusion.

[0056] Figures 3A - 3BAn example embodiment of a heat transfer plate 320 having an array of recesses 322 arranged in a rectangular shape is shown. As shown, the base of the polyhedron defining the recesses 322 is rhombic. The 10x10 rectangular array has a different horizontal pitch compared to the vertical pitch and there is no offset between adjacent rows or columns. Figure 3A A top view of the heat transfer plate 320 is shown, and Figure 3B a side view of an example embodiment of the heat transfer plate 320 is shown. As seen in Figures 3A - 3B the protrusion has a vertical height relative to the heat transfer plate.

[0057] Figures 4A - 4D An example embodiment of a heat transfer plate 420 including a recess 422 and a nozzle 423 is shown. In some embodiments, the heat transfer plate 420 and the recess 422 may be the same as or substantially similar to the heat transfer plate 220 and the recess 222, as described above with reference to Figures 2A - 2H Accordingly, certain aspects of the heat transfer plate 420 and the recess 422 are not described in detail herein.

[0058] Figure 4A An auxiliary view of the heat transfer plate 420 is shown, in which the nozzle 423 is inserted into a hole of the heat transfer plate 420. Figure 4A The side of the heat transfer plate 420 shown in Figure 4B contacts an electrochemical cell unit (not shown). Figure 4A The heat transfer plate 420 is shown from the side opposite to Figure 4B where the recess 422 is visible. The side of the heat transfer plate 420 shown in

[0059] Figures 4C - 4D is adjacent to a channel formed between adjacent heat transfer plates through which a heat transfer fluid flows. In use, the heat transfer fluid flows into the nozzle 423 and into the channel between adjacent heat transfer plates 420. The heat transfer fluid then interacts with the recess 422 to become disturbed and / or turbulent, thereby enhancing heat transfer in the electrochemical cell unit. Figure 4C A plan view of the recess 422 is shown, while Figure 4DA side view of the recess 422 is shown. As shown, the recess 422 has a polyhedral shape, where the base has a triangular shape and the top surface has a smaller triangular shape. The top surface is connected to the base by a first side surface, a second side surface, and a third side surface. The first side surface and the second side surface are substantially perpendicular to the surface of the heat transfer plate 420, and the third side surface forms an angle of approximately 45° with the surface of the heat transfer plate 420. In some embodiments, the third side surface may form an angle of about 20°, about 25°, about 30°, about 35°, about 40°, about 45°, about 50°, about 55°, about 60°, about 65°, or about 70° with the surface of the heat transfer plate 420, including all values and ranges therebetween.

[0060] Figure 5 An exemplary embodiment of a heat transfer plate with diamond-shaped protrusions for simulating heat transfer coefficients under operating conditions is shown. As shown, the heat transfer coefficient values in different regions of the heat transfer plate range from approximately 30 W / m 2 -K to approximately 70 W / m 2 -K. Higher heat transfer coefficient values are achieved in the region around the protrusions. This may be due to an increase in the turbulence of the air flow in the region around the protrusions, resulting in better heat transfer.

[0061] Figure 6 An exemplary embodiment of a heat transfer plate with tetrahedron-shaped protrusions having a triangular base for simulating heat transfer coefficients under operating conditions is shown. Here, the protrusions are arranged in such a way that the distance between the protrusions in adjacent rows is equal to half of the pitch between two adjacent columns. As shown, the heat transfer coefficient values in different regions of the heat transfer plate range from approximately 45 W / m 2 -K to approximately 150 W / m 2 -K. Higher heat transfer coefficient values (from approximately 100 W / m 2 -K to approximately 150 W / m 2 -K) are achieved in the region between two columns in the substantially columnar band. Without being bound by any theory, the increase in the heat transfer coefficient in the columnar band can be attributed to an increase in the turbulence of the air flow in these regions.

[0062] Figure 7A The negative space between two adjacent heat transfer plates with teardrop-shaped recesses is shown. The larger-looking recesses come from the adjacent heat transfer plates, and the smaller-looking recesses come from the opposite heat transfer plates. In other words, the base of the recess is larger than the top surface of the recess. Figure 7B The simulated heat transfer coefficients of the heat transfer plate under operating conditions are shown. As shown, the heat transfer coefficient values in different regions of the heat transfer plate range from approximately 50 W / m 2 -K to approximately 120 W / m 2 -K. The heat transfer is highest in the region between the recesses.

[0063] Figure 8A Shows the negative space between two adjacent heat transfer plates having circular tetrahedral recesses. The recess has a wide triangular base and circular sides and tapers towards the top surface. Figure 8B Shows the simulated heat transfer coefficients of the heat transfer plates under operating conditions. As shown, the heat transfer coefficient values in different regions of the heat transfer plates range between approximately 45 W / m 2 -K and approximately 90 W / m 2 -K. The heat transfer is highest in the region between the recesses and, compared to Figures 5 - 7B in Figures 8A - 8B the heat transfer coefficient is more uniform across the entire heat transfer plate.

[0064] Figure 9A Shows the negative space between two adjacent heat transfer plates having circular tetrahedral recesses. The recess has a triangular base with circular sides and a slightly smaller top surface. Figure 9B Shows the simulated heat transfer coefficients of the heat transfer plates under operating conditions. As shown, the heat transfer coefficient values in different regions of the heat transfer plates range between approximately 70 W / m 2 -K and approximately 130 W / m 2 -K. The heat transfer is highest in the region between the recesses on the right side of the figure (i.e., behind the flow path of the heat transfer fluid).

[0065] Various concepts can be implemented as one or more methods, of which at least one example is provided. The actions performed as part of the method can be ordered in any suitable way. Thus, embodiments can be constructed in which the actions are performed in an order different from the order shown, which can include performing some actions simultaneously, even if the actions are shown as sequential actions in the illustrative embodiments. In other words, it should be understood that such features are not necessarily limited to a particular order of execution, but can be executed in any number of threads, processes, services, servers, and / or etc. serially, asynchronously, concurrently, in parallel, simultaneously, synchronously, and / or etc. in a manner consistent with the present disclosure. Thus, some of these features may be mutually contradictory because these features cannot exist in a single embodiment simultaneously. Similarly, some features apply to one aspect of the innovation and not to other aspects.

[0066] In addition, the present disclosure may include other innovations not currently described. The applicant reserves all rights to such innovations, including the right to embody such innovations, file additional applications, continuations, continuation-partials, divisional applications, and / or equivalents. Accordingly, it should be understood that the advantages, embodiments, examples, functions, features, logics, operations, organizations, structures, topologies, and / or other aspects of the present disclosure should not be considered as limitations to the present disclosure as defined by the embodiments or to the equivalents of the embodiments. Depending on the specific expectations and / or characteristics of individual and / or enterprise users, database configurations and / or relational models, data types, data transmissions, and / or network architectures, syntactic structures, and / or the like, various embodiments of the technologies disclosed herein can be implemented in a large number of flexible and customizable ways as described herein.

[0067] All definitions defined and used herein should be understood to control dictionary definitions, definitions in incorporated-by-reference documents, and / or the ordinary meaning of defined terms.

[0068] As used herein, in a particular embodiment, the term "about" or "approximately" when preceding a numerical value means a range of the stated value plus or minus 10%. Where a range of values is provided, it is understood that each intermediate value (to one-tenth of the unit of the lower limit) between the upper and lower limits of the stated range, as well as any other stated value or intermediate value within the stated range, is encompassed within the present disclosure, unless the context clearly dictates otherwise. The upper and lower limits of these smaller ranges can independently be included in a smaller range and are also encompassed within the present disclosure, subject to any specific exclusion limitations within the stated range. Where the range includes one or both of the limit values, ranges excluding either or both of the included limit values are also included in the present disclosure.

[0069] The phrase "and / or" as used herein in the specification and examples should be understood to mean "either or both" of the elements so combined, i.e., elements that coexist in some cases and separate in other cases. Multiple elements listed with "and / or" should be understood in the same way, i.e., "one or more" of the elements so combined. Other elements may optionally exist in addition to the elements specifically identified by the "and / or" clause, whether related or unrelated to the specifically identified elements. Thus, as a non-limiting example, in one embodiment, when used in conjunction with open-ended language such as "comprising," a reference to "A and / or B" may refer only to A (optionally including elements other than B); in another embodiment, only to B (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); and so on.

[0070] As used herein in the specification and in the examples, "or" shall be understood to have the same meaning as "and / or" as defined above. For example, when separating items in a list, "or" or "and / or" shall be interpreted as inclusive, i.e., including at least one of the elements or list of elements, but also including more than one element, and optionally additional unlisted items. Only expressly stated contrary terms such as "only one of... " or "exactly one of... " or when used in the examples, "consisting of... " will refer to including exactly one of the many elements or list of elements. In general, when preceded by exclusive terms such as "any one of", "one of... ", "only one of... ", or "exactly one of... ", the term "or" as used herein shall be interpreted only as indicating exclusive alternatives (i.e., "one or the other, but not both"). When used in the examples, "consisting essentially of... " shall have the ordinary meaning as used in the field of patent law.

[0071] As used herein in the specification and in the examples, the phrase "at least one" with respect to a list of one or more elements shall be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each specifically listed element within the list of elements, and not excluding any combinations of elements in the list of elements. This definition also allows for the possibility that, optionally, elements may exist in addition to those specifically identified within the list of elements referred to by the phrase "at least one", whether related or unrelated to those specifically identified elements. Thus, as a non-limiting example, in one embodiment, "at least one of A and B" (or equivalently, "at least one of A or B", or equivalently "at least one of A and / or B") can refer to at least one that optionally includes more than one A, no B (and optionally includes elements other than B); in another embodiment, it can refer to at least one that optionally includes more than one B, no A (and optionally includes elements other than A); in yet another embodiment, it can refer to at least one that optionally includes more than one A, and optionally includes more than one B (and optionally includes other elements); and so on.

[0072] In the examples and in the above specification, all transitional phrases such as "comprising", "including", "carrying", "having", "containing", "involving", "holding", "constituting", etc. shall be understood to be open-ended, i.e., meaning including but not limited to. As stated in Section 2111.03 of the United States Patent and Trademark Office's Manual of Patent Examining Procedure, only the transitional phrases "consisting of... " and "consisting essentially of... " should be closed or semi-closed transitional phrases, respectively.

[0073] While specific embodiments of the present disclosure have been outlined above, many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, the embodiments set forth herein are intended to be illustrative and not limiting. Various changes may be made without departing from the spirit and scope of the present disclosure. In cases where the above methods and steps indicate specific events occurring in a particular order, those of ordinary skill in the art benefiting from the present disclosure will recognize that the order of the specific steps may be modified, and such modifications are variations in accordance with the invention. Additionally, as described above, where possible, some of the steps may be carried out simultaneously in parallel processes and sequentially. The embodiments have been specifically shown and described, but it should be understood that various changes in form and detail may be made.

Claims

1. An electrochemical cell unit system, comprising: A first electrochemical cell unit; A second electrochemical cell unit; A first planar sheet in contact with the first electrochemical cell unit, the first planar sheet including a first plurality of recesses; And A second planar sheet in contact with the second electrochemical cell unit, the second planar sheet extending parallel to the first planar sheet, the second planar sheet being spaced apart from the first planar sheet by a separation distance, the second planar sheet including a second plurality of recesses; Wherein the first plurality of recesses and the second plurality of recesses are both configured to cause turbulence in an air flow flowing parallel to the first planar sheet and the second planar sheet.

2. The electrochemical cell unit system according to claim 1, further comprising: A first additional plurality of electrochemical cell units in contact with the first planar sheet; and A second additional plurality of electrochemical cell units in contact with the second planar sheet.

3. The electrochemical cell unit system according to any one of the preceding claims, wherein the first plurality of recesses project outwardly from the first planar sheet, and the second plurality of recesses project outwardly from the second planar sheet.

4. The electrochemical cell unit system according to claim 3, wherein a distal surface of the first plurality of recesses has a triangular shape.

5. The electrochemical cell unit system according to claim 4, wherein each distal surface among the distal surfaces abuts three adjacent surfaces that contact a base portion of the first planar sheet.

6. The electrochemical cell unit system according to claim 5, wherein each of the three adjacent surfaces has a rectangular shape.

7. The electrochemical cell unit system according to claim 6, wherein the abutment between the distal surface and the three adjacent surfaces includes a rounded surface.

8. The electrochemical cell unit system according to claim 6 or claim 7, wherein at least one of the three adjacent surfaces is an inclined surface.

9. The electrochemical cell unit system according to any one of the preceding claims, wherein the second plurality of recesses are configured to contact the first planar sheet in a space between the first plurality of recesses.

10. The electrochemical cell unit system according to claim 4, wherein each distal surface among the distal surfaces has a first corner projecting a first distance from the first planar sheet, a second corner projecting a second distance from the first planar sheet, and a third corner projecting a third distance from the first planar sheet, the first distance, the second distance, and the third distance being different from each other.

11. A planar sheet configured to be placed between electrochemical cell units to improve heat dissipation from the electrochemical cell units, the planar sheet Comprising: A base surface; And A plurality of recesses projecting outwardly from the base surface, each of the plurality of recesses including: a distal surface having a triangular shape; three adjacent surfaces adjacent to the base surface and the distal surface; and a rounded corner joint adjacent to the adjacent surfaces and the distal surface.

12. The planar sheet according to claim 11, wherein the plurality of recesses includes a hollow area opposite the distal surface.

13. The planar sheet according to claim 11 or claim 12, wherein at least one of the three adjacent surfaces is an inclined surface.

14. The planar sheet according to any one of claims 11 to 13, wherein the plurality of recesses are configured to cause turbulence in the air flow flowing along the planar sheet, thereby generating a local eddy current having a speed of at least about 5 times the overall speed of the air flow.

15. The planar sheet according to any one of claims 11 to 14, wherein the plurality of recesses are configured to cause turbulence in the air flow flowing along the planar sheet, thereby generating a local eddy current having a speed of at least about 10 times the overall speed of the air flow.

16. An apparatus comprising: a first planar sheet including a first base surface and a first plurality of recesses extending from the first base surface; and a second planar sheet including a second base surface and a second plurality of recesses extending from the second base surface, wherein the first planar sheet and the second planar sheet are configured to be placed together such that the second plurality of recesses occupy the void area between the first plurality of recesses while the first base surface faces the second base surface.

17. The apparatus according to claim 16, wherein each recess of the first plurality of recesses comprises: a distal surface having a triangular shape; three adjacent surfaces adjacent to the first base surface and the distal surface; and a rounded corner joint adjacent to the adjacent surfaces and the distal surface.

18. The planar sheet according to claim 16 or claim 17, wherein at least one of the three adjacent surfaces is an inclined surface.

19. The electrochemical cell unit system according to any one of claims 16 to 18, wherein the adjacency between the distal surface and the three adjacent surfaces includes a rounded surface.

20. The apparatus according to any one of claims 16 to 19, further comprising: a first electrochemical cell unit disposed on the first planar sheet opposite the first base surface; and a second electrochemical cell unit disposed on the second planar sheet opposite the second base surface.

21. The apparatus according to any one of claims 16 to 20, wherein the first plurality of recesses are configured to cause turbulence in the air flow flowing along the first planar sheet, thereby generating a local eddy current having a speed of at least about 5 times the overall speed of the air flow.

22. The apparatus according to any one of claims 16 to 21, wherein the first plurality of recesses are configured to cause turbulence in the airflow flowing along the first planar sheet, thereby generating local vortices having a velocity that is at least about 10 times the overall velocity of the airflow.

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